CN115635031A - Manufacturing die and method for flat plate compression joint type IGBT multi-rack ceramic tube shell - Google Patents
Manufacturing die and method for flat plate compression joint type IGBT multi-rack ceramic tube shell Download PDFInfo
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Abstract
The invention discloses a manufacturing die and a manufacturing method of a flat plate compression joint type IGBT multi-rack ceramic tube shell, belonging to the technical field of power electronic product manufacturing, and comprising an IGBT multi-rack ceramic tube shell, wherein the IGBT multi-rack ceramic tube shell comprises an emitter disc and discrete emitter racks distributed at the top end of the emitter disc.
Description
Technical Field
The invention relates to the technical field of power electronic product manufacturing, in particular to a die and a method for manufacturing a plate compression joint type IGBT multi-rack ceramic tube shell.
Background
As a mainstream device of a novel power semiconductor device, the IGBT has been widely used in the conventional industrial fields of industry, 4C (communication, computer, consumer electronics, automotive electronics), aerospace, national defense, military industry, and the like, and in the strategic emerging industrial fields of rail transit, new energy, smart grid, new energy automobile, and the like. At present, the flat plate crimping type IGBT is widely applied to the high-voltage field with the voltage of 4500V and the current of 3000A after years of development, is mainly used for flexible high-voltage direct-current transmission, and the global annual demand reaches nearly 10 thousands of pieces per year. The industry needs to overcome the technical problem that the direction of overcoming the defects is converted into the main technical problem of high-efficiency mass production and finished product saving from the technical field of ensuring performance parameters.
The bottleneck of mass production capability of the existing flat plate compression joint type IGBT multi-rack ceramic tube shell is in machining, and the conventional process route is purchasing a copper rod → sawing material → vehicle machining → machining and adding a fine carving rack (machining center) → grinding → welding → electroplating → inspection. In the industry, the processing time of a multi-rack electrode (8 mm in depth) capable of mounting 44 chips is 60 minutes, and the only way for solving the capacity problem is to purchase more processing center equipment, which is contrary to the policies of energy conservation, emission reduction and efficiency improvement.
Therefore, the invention provides a die and a method for manufacturing a flat plate compression joint type IGBT multi-rack ceramic tube shell.
Disclosure of Invention
The invention is provided in view of the above and/or the problems existing in the existing die and method for manufacturing the flat-plate compression-joint type IGBT multi-rack ceramic tube shell.
Therefore, an object of the present invention is to provide a die and a method for manufacturing a ceramic package of a flat plate press-contact IGBT multi-stage frame, which can solve the above-mentioned problems.
To solve the above technical problem, according to an aspect of the present invention, the present invention provides the following technical solutions:
a mould for manufacturing a panel compression joint type IGBT multi-rack ceramic tube shell comprises: the IGBT multi-stand ceramic tube shell comprises an emitter disc, a discrete emitter stand distributed at the top end of the emitter disc, and a manufacturing mold for manufacturing the emitter disc and the discrete emitter stand distributed at the top end of the emitter disc;
the manufacturing mold includes:
the top end of the supporting plate is fixedly connected with a lower die;
the top plate is positioned above the supporting rod, and the bottom end of the top plate is fixedly connected with an upper die;
the top end of the lifting cylinder is fixedly connected with the bottom end of the top plate, and the bottom end of the lifting cylinder is fixedly connected with the top end of the supporting plate.
As a preferable scheme of the mold for manufacturing the flat plate compression joint type IGBT multi-rack ceramic tube shell, the mold comprises: the top middle end of the lower die is provided with a first forming groove, the bottom middle end of the upper die is provided with a second forming groove corresponding to the first forming groove, and the top end of the second forming groove is provided with a third forming groove used for shaping the vertical emitting electrode rack.
As a preferable scheme of the mold for manufacturing the flat plate compression joint type IGBT multi-rack ceramic tube shell, the mold comprises: and an installation groove is formed in the inner wall of the first forming groove of the upper die, and the installation groove is annular.
As a preferable scheme of the mold for manufacturing the flat plate compression joint type IGBT multi-rack ceramic tube shell, the mold comprises: and an annular groove is formed in the inner side of the bottom end of the upper die and is positioned on the outer side of the annular mounting groove.
As a preferable scheme of the mold for manufacturing the flat plate compression joint type IGBT multi-rack ceramic tube shell, the mold comprises: annular the annular heat-conducting plate is installed to the mounting groove inner wall, and the outside fixedly connected with heat conduction pole of annular heat-conducting plate, heat conduction pole keep away from heat-conducting plate one end and extend to fixedly connected with annular fin in the ring channel for increase heat radiating area improves cooling shaping efficiency.
As a preferable scheme of the mold for manufacturing the flat plate compression joint type IGBT multi-rack ceramic tube shell, the mold comprises: the both ends of ring channel have all been seted up the transmission and have been led to the groove, and one set of in two sets of transmission lead to the groove is cooling water input channel, and another group is cooling water output channel for pour into cooling water into and carry out the heat transfer with annular fin, improve the fashioned speed of cooling.
As a preferable scheme of the mold for manufacturing the flat plate compression joint type IGBT multi-rack ceramic tube shell, the mold comprises: a connecting channel is formed in the bottom end of the inner wall of the forming groove formed in the top end of the lower die, and an installation channel is formed in the supporting plate.
As a preferable scheme of the mold for manufacturing the flat plate compression joint type IGBT multi-stand ceramic tube shell, the mold comprises: the inner wall of the installation channel is connected with a second transmission pipe in a sliding mode, and the top of one end, close to the connecting channel, of the second transmission pipe is provided with an output end corresponding to the connecting channel.
As a preferable scheme of the mold for manufacturing the flat plate compression joint type IGBT multi-rack ceramic tube shell, the mold comprises: the inner wall of the connecting channel is provided with a first transmission pipe, the outer wall of the first transmission pipe is in threaded connection with the inner wall of the connecting channel, and the input end at the bottom of the first transmission pipe is in threaded connection and communicated with the inner wall of the output end of the second transmission pipe.
As a preferable aspect of the method for manufacturing a plate press-contact IGBT multi-shelf ceramic case according to the present invention, the method comprises: also comprises the following manufacturing steps:
s1: manufacturing an emitter disc and a discrete emitter rack, wherein the manufacturing method comprises the following two methods:
a1: the method comprises the following steps that a heated copper metal material is placed in a forming groove I at the top end of a lower die, meanwhile, a transmission channel for inputting cooling water is connected with a water pump, the water pump is connected with the output end of a refrigerating cooling water tank, and a second group of transmission channels for leading out the cooling water after heat exchange is connected with the input end of a cooling water recovery tank;
a2: 3000t hydraulic lifting air cylinders are controlled to drive the top plate and the upper die at the bottom end of the top plate to descend, the heated copper material is forged and pressed, a plurality of discrete emitting electrode racks on the electrode which consumes the most time during machining can be directly manufactured through the third forming groove, and machining efficiency is improved;
a3: the heat through the copper product of heating passes through annular heat-conducting plate and heat conduction pole with heat transmission to annular fin, the heat of annular fin and the cooling water heat transfer of circulation in the ring channel, avoids the copper product of heating to receive the forging and pressing to glue in shaping groove two, shaping groove three, improves subsequent drawing of patterns efficiency, after the forging and pressing, takes out fashioned projecting pole disc, discrete projecting pole rack:
b1: inserting the outer wall of the transmission pipe along the inner wall of the installation channel, and inserting the first transmission pipe through the connection channel after the output end corresponds to the connection channel, wherein the input end at the bottom end of the first transmission pipe is in threaded connection and communication with the inner wall of the output end of the second transmission pipe;
b2: controlling the lifting cylinder to drive the top plate and the upper die to descend, so that the bottom end of the upper die is attached to the bottom end of the lower die, and the forming groove I, the forming groove II and the forming groove III form a closed space;
b3: connecting a transmission channel for inputting cooling water with a water pump, connecting the water pump with the output end of a refrigerating cooling water tank, and connecting a second group of transmission channels for leading out the cooling water after heat exchange with the input end of a cooling water recovery tank;
b4: molten liquid copper metal is guided in through the second transmission pipe and then is transmitted into a closed space formed by the first forming groove, the second forming groove and the third forming groove through the first transmission pipe, heat is transmitted to the annular radiating fins through the annular heat conducting plate and the heat conducting rods, heat of the annular radiating fins is exchanged with cooling water circulating in the annular grooves, the forming speed of the liquid copper metal is increased, after the liquid copper metal is formed, the lifting air cylinder is controlled to drive the top plate and the upper die to ascend, and the formed emitting electrode disc and the split emitting electrode rack are taken out.
S2: annealing is carried out on a rack formed by the emitter disc and the discrete emitter rack which are taken out, the purpose of annealing is to release the processing stress generated by forging and pressing, the material is softened, the requirement that the planeness is less than 0.008mm is easily realized by subsequent machining, the softening of the material can be realized only by the temperature of 500 ℃ for TU1 oxygen-free copper material, and the annealing process parameters are as follows: keeping the temperature for 20 minutes under hydrogen-nitrogen mixed protective gas at 500 ℃;
s3: machining, machining needs 2 processes, the diameter and the rack height of locating hole face, the locating hole, the plane degree and other sizes are completed by the first machining, the second machining carries out size finishing with the first surface as a reference face to the forged rack, finishing of the bottom of the rack and finishing of other sizes, the second machining has the difficulty that the rack is positioned, a plurality of rack positioning devices need to be assisted, the size finishing can be realized by positioning the position of the forged rack, after annealing in the front process, the stress of materials is released, the machining allowance is small, machining stress is hardly generated, and the requirement of the plane degree of 0.008mm can be realized by the machining, and grinding is replaced.
Compared with the prior art:
the forming of a plurality of discrete emitter racks on an emitter circle is completed by forging and pressing by replacing time-consuming machining electrode machining through forging and pressing or pouring, the machining only needs simple cutting to complete the precision of the size, meanwhile, the machining replaces grinding, the process is simplified, the consumable materials are saved, the use of grinding sand is reduced, the generation of solid waste is also reduced, the process route is purchasing copper rods → sawing materials → forging and pressing \ pouring → annealing → machining and finishing size → welding → electroplating → inspection, the volume of materials used for forging and pressing is 2/3 of that of common turning, the material cost is saved, and the machining efficiency is improved.
Drawings
FIG. 1 is a front view of a plate-crimped IGBT multi-stage ceramic tube shell according to the present invention;
FIG. 2 is a cross-sectional view of a plate-pressed IGBT multi-stage ceramic tube case of the present invention;
FIG. 3 is a front view of an emitter disk, discrete emitter stand, of the present invention;
FIG. 4 is a top view of FIG. 3 of the present invention;
FIG. 5 is a front view of the manufacturing tool of the present invention;
FIG. 6 is a front view of the upper mold of the present invention;
FIG. 7 is a front view of the lower mold of the present invention;
FIG. 8 is a front view of FIG. 6 of the present invention;
FIG. 9 is a front view of the invention of FIG. 7;
FIG. 10 is a cross-sectional view taken at area C-C of FIG. 9 in accordance with the present invention;
FIG. 11 is a cross-sectional view of the invention of FIG. 8;
FIG. 12 is a front view of the heat-conducting plate, heat-conducting rod, and annular heat sink in accordance with the present invention.
In the figure: the emitter flange 1, the grid leading-out end 2, the emitter disc 3, the discrete emitter rack 4, the ceramic ring 5, the ceramic base 6, the upper cover 7, the collector flange disc 8, the supporting plate 9, the top plate 10, the upper die 11, the lower die 12, the lifting cylinder 13, the first forming groove 14, the second forming groove 15, the third forming groove 16, the annular mounting groove 17, the heat conducting plate 18, the heat conducting rod 19, the annular cooling fin 20, the annular groove 21, the transmission channel 22, the connecting channel 23, the mounting channel 24, the first transmission pipe 25 and the second transmission pipe 26.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
The first embodiment is as follows:
the invention provides a die and a method for manufacturing a ceramic tube shell of a flat plate compression joint type IGBT multi-stand, which have the advantages of improving the processing efficiency and saving the material cost, please refer to fig. 1-12, comprising the die for manufacturing the ceramic tube shell of the flat plate compression joint type IGBT multi-stand, which comprises the following steps: the IGBT multi-stand ceramic tube shell comprises an emitter disc 3, a discrete emitter stand 4 distributed at the top end of the emitter disc 3, and a manufacturing mold for manufacturing the emitter disc 3 and the discrete emitter stand 4 distributed at the top end of the emitter disc 3;
the manufacturing mold includes: the top end of the supporting plate 9 is fixedly connected with a lower die 12; the top plate 10 is positioned above the supporting rod 9, and the bottom end of the top plate 10 is fixedly connected with an upper die 11; and the top end of the lifting cylinder 13 is fixedly connected with the bottom end of the top plate 10, and the bottom end of the lifting cylinder 13 is fixedly connected with the top end of the supporting plate 9.
The middle end of the top of the lower die 12 is provided with a first forming groove 14, the middle end of the bottom of the upper die 11 is provided with a second forming groove 15 corresponding to the first forming groove 14, and the top end of the second forming groove 15 is provided with a third forming groove 16 for shaping the vertical emitting electrode rack 4.
Go up the inner wall of one 14 of the shaping groove of mould 11 and seted up mounting groove 17, mounting groove 17 establishes to the annular, ring channel 21 has been seted up to the bottom inboard of going up mould 11, and be located the outside of annular mounting groove 17, annular heat-conducting plate 18 is installed to annular mounting groove 17 inner wall, annular heat-conducting plate 18's outside fixedly connected with heat-conducting rod 19, heat-conducting rod 19 keeps away from heat-conducting plate 18 one end and extends to ring channel 21 internal fixedly connected with annular fin 20, be used for increasing heat radiating area, improve cooling shaping efficiency, the logical groove 22 of transmission has all been seted up at ring channel 21's both ends, a set of cooling water input channel that is in two sets of transmission logical groove 22, another set of cooling water output channel, be used for pouring into the cooling water and carry out the heat transfer with annular fin 20, improve cooling shaping's speed.
In particular use:
s1: manufacturing an emitter disc 3 and a discrete emitter rack 4, wherein the manufacturing method comprises the following steps:
a1: the heated copper metal material is placed in a first forming groove 14 at the top end of the lower die 12, meanwhile, a transmission through groove 22 for inputting cooling water is connected with a water pump, the water pump is connected with the output end of a refrigerating cooling water tank, and a second group of transmission channels 22 for leading out the cooling water after heat exchange are connected with the input end of a cooling water recovery tank;
a2: the 300t hydraulic lifting cylinder 13 is controlled to drive the top plate 10 and the upper die 11 at the bottom end of the top plate 10 to descend, the heated copper material is forged, the plurality of discrete emitting electrode racks 4 on the electrode which consumes the most time during machining can be directly manufactured through the third forming groove 16, and the machining efficiency is improved;
a3: the heat of the heated copper material is transmitted to the annular radiating fin 20 through the annular heat conducting plate 18 and the heat conducting rod 19, the heat of the annular radiating fin 20 exchanges heat with cooling water circulating in the annular groove 21, the heated copper material is prevented from being adhered to the second forming groove 15 and the third forming groove 16 by forging and pressing, the subsequent demolding efficiency is improved, and after the forging and pressing are finished, the formed emitting electrode disc 3 and the discrete emitting electrode stand 4 are taken out;
s2: annealing is carried out to the rack that the emitter disc 3, the discrete emitter rack 4 taken out formed, and the purpose of annealing is for releasing the machining stress that forging and pressing produced, and is the material softening, and the requirement that the subsequent machining of being convenient for realized the plane degree more easily and < 0.008mm, just need 500 ℃ to realize the softening of material to TU1 oxygen-free copper material, annealing process parameter: keeping the temperature for 20 minutes under hydrogen-nitrogen mixed protective gas at 500 ℃;
s3: machining, machining needs 2 processes, the diameter and the rack height of locating hole face, the locating hole, the plane degree and other sizes are completed by the first machining, the second machining carries out size finishing with the first surface as a reference face to the forged rack, finishing of the bottom of the rack and finishing of other sizes, the second machining has the difficulty that the rack is positioned, a plurality of rack positioning devices need to be assisted, the size finishing can be realized by positioning the position of the forged rack, after annealing in the front process, the stress of materials is released, the machining allowance is small, machining stress is hardly generated, and the requirement of the plane degree of 0.008mm can be realized by the machining, and grinding is replaced.
And a rack consisting of the manufactured emitter disc 3 and the discrete emitter rack 4 is combined and welded with the emitter flange 1, the grid leading-out end 2, the ceramic ring 5, the ceramic base 6, the upper cover 7 and the collector flange disc 8 to manufacture the flat plate compression joint type IGBT multi-rack ceramic tube shell.
The second embodiment:
the bottom end of the inner wall of a first forming groove 14 formed in the top end of the lower die 12 is provided with a connecting channel 23, the supporting plate 9 is provided with a mounting channel 24, the inner wall of the mounting channel 24 is connected with a second transmission pipe 26 in a sliding mode, the top of one end, close to the connecting channel 23, of the second transmission pipe 26 is provided with an output end corresponding to the connecting channel 23, the inner wall of the connecting channel 23 is provided with a first transmission pipe 25, the outer wall of the first transmission pipe 25 is in threaded connection with the inner wall of the connecting channel 23, and the bottom input end of the first transmission pipe 25 is in threaded connection with and communicated with the inner wall of the output end of the second transmission pipe 26.
In the specific use case, the coating agent is,
s1: manufacturing the emitter disc 3 and the discrete emitter rack 4, wherein the manufacturing method comprises the following steps:
b1: inserting the outer wall of the second transmission pipe 26 along the inner wall of the installation channel 24, enabling the output end to correspond to the connecting channel 23, inserting the first transmission pipe 25 through the connecting channel 23, and enabling the input end at the bottom end of the first transmission pipe to be in threaded connection and communication with the inner wall of the output end of the second transmission pipe 26;
b2: controlling a lifting cylinder 13 to drive a top plate 10 and an upper die 11 to descend, so that the bottom end of the upper die 11 is attached to the bottom end of a lower die 12, and a closed space is formed by a first forming groove 14, a second forming groove 15 and a third forming groove 16;
b3: connecting a transmission through groove 22 for inputting cooling water with a water pump, connecting the water pump with the output end of a refrigerating cooling water tank, and connecting a second group of transmission channels 22 for leading out the cooling water after heat exchange with the input end of a cooling water recovery tank;
b4: molten liquid copper metal is guided in through a second transmission pipe 26 and then is transmitted to a closed space formed by a first forming groove 14, a second forming groove 15 and a third forming groove 16 through a first transmission pipe 25, heat is transmitted to an annular cooling fin 20 through an annular heat conduction plate 18 and a heat conduction rod 19, the heat of the annular cooling fin 20 exchanges heat with cooling water circulating in an annular groove 21, the forming speed of the solidified liquid copper metal is increased, after the liquid copper metal is formed, a lifting cylinder 13 is controlled to drive a top plate 10 and an upper die 11 to ascend, and the formed emitter disc 3 and the discrete emitter rack 4 are taken out.
While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, the various features of the disclosed embodiments of this invention can be used in any combination as long as there is no structural conflict, and the combination is not exhaustively described in this specification merely for the sake of brevity and resource savings. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (10)
1. The utility model provides a dull and stereotyped crimping formula IGBT multistation frame ceramic tube makes mould, includes IGBT multistation frame ceramic tube, IGBT multistation frame ceramic tube includes projecting pole disc (3) and distributes in discrete projecting pole frame (4) on projecting pole disc (3) top, its characterized in that: the manufacturing mould is used for manufacturing the emitter disc (3) and the discrete emitter rack (4) distributed at the top end of the emitter disc (3);
the manufacturing mold includes:
the top end of the supporting plate (9) is fixedly connected with a lower die (12);
the top plate (10) is positioned above the supporting rod (9), and the bottom end of the top plate (10) is fixedly connected with an upper die (11); and
the top end of the lifting cylinder (13) is fixedly connected with the bottom end of the top plate (10), and the bottom end of the lifting cylinder (13) is fixedly connected with the top end of the supporting plate (9).
2. The mold for manufacturing the ceramic tube shell of the flat-plate press-contact type IGBT multi-bench according to claim 1, characterized in that the middle end of the top of the lower mold (12) is provided with a first molding groove (14), the middle end of the bottom of the upper mold (11) is provided with a second molding groove (15) corresponding to the first molding groove (14), and the top end of the second molding groove (15) is provided with a third molding groove (16) for molding the split type emitter bench (4).
3. The mold for manufacturing a ceramic package of a flat plate press-contact type IGBT multi-rack as claimed in claim 2, wherein the inner wall of the first forming groove (14) of the upper mold (11) is provided with a mounting groove (17), and the mounting groove (17) is annular.
4. The mold for manufacturing the ceramic tube case of the flat-plate press-contact type IGBT multi-rack according to claim 3, characterized in that the inner side of the bottom end of the upper mold (11) is provided with an annular groove (21) and is positioned at the outer side of the annular mounting groove (17).
5. The mold for manufacturing the ceramic tube shell of the flat compression joint type IGBT multi-rack as claimed in claim 3, wherein the annular heat conducting plate (18) is installed on the inner wall of the annular installation groove (17), the outer side of the annular heat conducting plate (18) is fixedly connected with the heat conducting rod (19), and one end of the heat conducting rod (19) far away from the heat conducting plate (18) extends to the annular groove (21) to be fixedly connected with the annular heat sink (20) for increasing the heat dissipation area and improving the cooling forming efficiency.
6. The mold for manufacturing the ceramic tube shell of the flat-plate compression-joint type IGBT multi-rack as claimed in claim 5, wherein the two ends of the annular groove (21) are both provided with the transmission through grooves (22), one of the two groups of the transmission through grooves (22) is a cooling water input channel, and the other group is a cooling water output channel, and is used for injecting cooling water to exchange heat with the annular cooling fins (20) so as to improve the cooling forming speed.
7. The mold for manufacturing a ceramic tube case of a flat plate press-contact type IGBT multi-rack as claimed in claim 2, wherein the bottom end of the inner wall of the forming groove I (14) formed at the top end of the lower mold (12) is provided with a connecting channel (23), and the supporting plate (9) is provided with a mounting channel (24).
8. The mold for manufacturing the ceramic tube shell of the flat-plate compression-type IGBT multi-rack as claimed in claim 7, wherein the inner wall of the installation channel (24) is connected with a second transmission pipe (26) in a sliding manner, and the top of one end of the second transmission pipe (26) close to the connection channel (23) is provided with an output end corresponding to the connection channel (23).
9. The mold for manufacturing the ceramic tube shell of the flat-plate compression-type IGBT multi-rack according to claim 8, wherein the inner wall of the connecting channel (23) is provided with a first transmission pipe (25), the outer wall of the first transmission pipe (25) is in threaded connection with the inner wall of the connecting channel (23), and the input end at the bottom of the first transmission pipe (25) is in threaded connection and communicated with the inner wall of the output end of the second transmission pipe (26).
10. A method for manufacturing a ceramic tube shell of a flat plate compression joint type IGBT multi-rack is characterized by further comprising the following manufacturing steps:
s1: manufacturing an emitter disc (3) and a discrete emitter rack (4) by two manufacturing methods A and B:
a1: the method comprises the following steps that a heated copper metal material is placed in a forming groove I (14) at the top end of a lower die (12), a transmission through groove (22) for inputting cooling water is connected with a water pump, the water pump is connected with the output end of a refrigerating cooling water tank, and a second group of transmission channels (22) for leading out the cooling water after heat exchange are connected with the input end of a cooling water recovery tank;
a2: a 3000t hydraulic lifting cylinder (13) is controlled to drive the top plate (10) and an upper die (11) at the bottom end of the top plate (10) to descend, heated copper materials are forged and pressed, a plurality of discrete emitting electrode racks (4) on electrodes which are machined most time can be directly manufactured through a third forming groove (16), and machining efficiency is improved;
a3: the heat through the copper product of heating passes through annular heat-conducting plate (18) and heat conduction pole (19) with heat transmission to annular fin (20), the heat of annular fin (20) and the cooling water heat transfer of circulation in ring channel (21), avoid the copper product of heating to receive the forging and pressing to glue in shaping groove two (15), in shaping groove three (16), improve subsequent drawing of patterns efficiency, after the forging, with fashioned projecting pole disc (3), discrete projecting pole rack (4) take out:
b1: inserting the outer wall of the second transmission pipe (26) along the inner wall of the installation channel (24), enabling the output end to correspond to the connecting channel (23), inserting the first transmission pipe (25) through the connecting channel (23), and enabling the input end at the bottom end of the first transmission pipe to be in threaded connection and communication with the inner wall of the output end of the second transmission pipe (26);
b2: controlling a lifting cylinder (13) to drive a top plate (10) and an upper die (11) to descend, so that the bottom end of the upper die (11) is attached to the bottom end of a lower die (12), and a closed space is formed by a first forming groove (14), a second forming groove (15) and a third forming groove (16);
b3: a transmission through groove (22) for inputting cooling water is connected with a water pump, the water pump is connected with the output end of a refrigerating cooling water tank, and a second group of transmission channels (22) for leading out the cooling water after heat exchange are connected with the input end of a cooling water recovery tank;
b4: molten liquid copper metal is guided in through a second transmission pipe (26), and then is transmitted to a closed space formed by a first forming groove (14), a second forming groove (15) and a third forming groove (16) through a first transmission pipe (25), heat is transmitted to an annular radiating fin (20) through an annular heat conducting plate (18) and a heat conducting rod (19), the heat of the annular radiating fin (20) exchanges heat with cooling water circulating in an annular groove (21), the forming speed of the solidification of the liquid copper metal is improved, after the forming of the liquid copper metal, a lifting cylinder (13) is controlled to drive a top plate (10) and an upper die (11) to ascend, and the formed emitter disc (3) and the discrete emitter rack (4) are taken out.
S2: annealing is carried out on a rack formed by the emitter disc (3) and the discrete emitter rack (4), wherein the annealing aims to release the processing stress generated by forging and pressing, the material is softened, the subsequent machining is convenient to realize the requirement that the planeness is less than 0.008mm, and the softening of the material can be realized only by the temperature of 500 ℃ for the TU1 oxygen-free copper material, and the annealing process parameters are as follows: keeping the temperature for 20 minutes under hydrogen-nitrogen mixed protective gas at 500 ℃;
s3: machining, machining needs 2 processes, the diameter and the rack height of locating hole face, the locating hole, the size such as plane degree are accomplished to first machine interpolation, the second machine carries out size truing with the first face as the benchmark face to the rack of forging out, the truing of rack bottom and the completion of other sizes, the difficult point that the second machine interpolation lies in the location of rack, need supplementary many rack positioner, with the rack position location of forging shaping, just can realize size truing, after the annealing through the front road, the stress of material has reached the release, and the cutting allowance that the machine interpolation is little again, hardly produce the processing stress, consequently, just can realize the requirement of plane degree 0.008mm through the machine interpolation, replace the grinding.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115894047A (en) * | 2022-12-28 | 2023-04-04 | 福建华清电子材料科技有限公司 | Preparation method of tube shell for Mos packaging |
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| CN201682727U (en) * | 2010-04-29 | 2010-12-22 | 创宇科技工业股份有限公司 | Radiator and forming die thereof |
| CN103402669A (en) * | 2011-03-03 | 2013-11-20 | 昭和电工株式会社 | Forging method |
| CN109483806A (en) * | 2018-10-30 | 2019-03-19 | 浙江亚鼎科技有限公司 | Electronic component shell forming device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201682727U (en) * | 2010-04-29 | 2010-12-22 | 创宇科技工业股份有限公司 | Radiator and forming die thereof |
| CN103402669A (en) * | 2011-03-03 | 2013-11-20 | 昭和电工株式会社 | Forging method |
| CN109483806A (en) * | 2018-10-30 | 2019-03-19 | 浙江亚鼎科技有限公司 | Electronic component shell forming device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115894047A (en) * | 2022-12-28 | 2023-04-04 | 福建华清电子材料科技有限公司 | Preparation method of tube shell for Mos packaging |
| CN115894047B (en) * | 2022-12-28 | 2024-03-22 | 福建华清电子材料科技有限公司 | Preparation method of tube shell for Mos packaging |
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