CN115513230A

CN115513230A - Image sensor and manufacturing method thereof

Info

Publication number: CN115513230A
Application number: CN202110693368.0A
Authority: CN
Inventors: 石文杰; 王婉晴
Original assignee: SmartSens Technology Shanghai Co Ltd
Current assignee: SmartSens Technology Shanghai Co Ltd
Priority date: 2021-06-22
Filing date: 2021-06-22
Publication date: 2022-12-23

Abstract

The invention discloses an image sensor and a manufacturing method thereof, wherein the image sensor comprises a circuit connecting layer, an optical structure layer and a semiconductor structure layer, a plurality of photosensitive pixel regions and a groove isolation structure which separates the photosensitive pixel regions and penetrates through the semiconductor structure layer are arranged in the semiconductor structure layer, the groove isolation structure comprises a reflection structure and a light absorption structure which correspond to each other, one end of the reflection structure, which is close to the optical structure layer, is used for reflecting light, one end of the light absorption structure, which is close to the circuit connecting layer, is used for absorbing light, and one end, which faces the circuit connecting layer, of the light absorption structure extends into the circuit connecting layer and is electrically connected with the circuit connecting layer. The reflective structure can increase the receiving performance of photosensitive element to light, and the near light near the circuit connection layer can be absorbed to the light absorption structure to avoid or reduce light and cross talk near the circuit connection layer, light absorption structure and circuit connection layer electric connection moreover, thereby can exert negative voltage on the light absorption structure, with the reduction dark current.

Description

Image sensor and manufacturing method thereof

Technical Field

The invention relates to the technical field of image sensors, in particular to an image sensor and a manufacturing method thereof.

Background

An image sensor refers to a device that converts an optical signal into an electrical signal, and generally, image sensor chips for large-scale commercial use include two major types, a Charge Coupled Device (CCD) and a Complementary Metal Oxide Semiconductor (CMOS) image sensor chip.

Compared with the traditional CCD sensor, the CMOS image sensor has the characteristics of low power consumption, low cost, compatibility with the CMOS process and the like, so that the CMOS image sensor is more and more widely applied. CMOS image sensors are now widely used not only in the consumer electronics field, such as digital compact cameras (DSCs), cell phone cameras, video cameras and digital single-lens reflex (DSLR), but also in automotive electronics, surveillance, biotechnology and medicine.

The pixel unit of the CMOS image sensor is a core device for realizing sensitization of the image sensor. The most common pixel cell is an active pixel structure comprising one photodiode and a plurality of transistors. The photodiode in these devices is a photosensitive unit to realize light collection and photoelectric conversion, and other MOS transistors are control units to mainly realize selection, reset, signal amplification and readout of the photodiode.

The CMOS image sensor can be divided into a front-illuminated image sensor in which incident light enters the photodiode from a side close to the circuit connection layer and a back-illuminated image sensor in which incident light enters the photodiode from a side far from the circuit connection layer, according to the difference in the path of the incident light entering the photodiode.

In order to increase the area of a photodiode in a CMOS image sensor and reduce the loss of a dielectric layer to incident light, a back-illuminated CMOS image sensor process can be used, that is, incident light enters the photodiode from the back of a silicon wafer, so that the loss of the dielectric layer to the incident light is reduced, and the sensitivity of a pixel unit is increased.

The absorption coefficient of the silicon material for incident light decreases with increasing wavelength. Conventional pixel cells typically use filter layers of the three primary colors red, green, and blue. With red light being the deepest absorption site in the silicon and blue light being the shallowest. Blue light is absorbed at the position closest to the surface of the silicon wafer, and the absorption coefficient of the blue light is highest; the red light enters the silicon chip deepest, and the absorption coefficient of the red light is lowest; the absorption coefficient of green light is between that of blue and red light, while absorption of near-infrared light requires an absorption thickness of more than 2.3 microns. Therefore, the conventional back-illuminated CMOS image sensor has poor performance in receiving red light and near-infrared light, resulting in poor light capturing capability and imaging capability of dark field effect.

In order to increase the receiving performance of the existing back-illuminated CMOS image sensor for receiving red light and near-infrared light, light is generally dispersed on the back-illuminated CMOS image sensor by thickening the thickness of the photosensitive element or adding a micro-structure on the photosensitive element, although this enhances the receiving performance of the back-illuminated CMOS image sensor for receiving red light and near-infrared light, optical crosstalk is also increased, which affects imaging.

Further, in the pixel of the conventional back-illuminated CMOS image sensor, dark current is easily generated at a place where the photoelectric conversion unit (photodiode) and the dielectric material have an interface, which is an important factor affecting the signal-to-noise ratio and the image quality of the image sensor. The first one is to dope the semiconductor material P-type at the interface, so that the charges generated at the interface can be compounded with the P-type doping impurities, and the interface dark current is not easy to generate. The second is to prepare a negatively charged dielectric layer, such as Al2O3, at the semiconductor interface, which induces a P-type layer near the semiconductor interface, also serving to suppress dark current. The third is to apply a negative potential at the semiconductor interface to induce a P-type layer near the semiconductor interface to suppress dark current.

However, in the current back-illuminated CMOS image sensor, there is no scheme that can prevent optical crosstalk and suppress dark current, but the conventional scheme for suppressing dark current is complicated, and the manufacturing cost is greatly increased. Therefore, there is an urgent need for a CMOS image sensor that can prevent optical crosstalk and suppress dark current.

Disclosure of Invention

In order to overcome the disadvantages and shortcomings of the prior art, an object of the present invention is to provide an image sensor and a method for fabricating the same, so as to solve the problems of optical crosstalk and dark current of the CMOS image sensor in the prior art.

The purpose of the invention is realized by the following technical scheme:

the invention provides an image sensor which comprises a circuit connecting layer, an optical structure layer and a semiconductor structure layer positioned between the circuit connecting layer and the optical structure layer, wherein a plurality of photosensitive pixel areas distributed in an array mode and a groove isolation structure for separating the photosensitive pixel areas and penetrating through the semiconductor structure layer are arranged in the semiconductor structure layer, photosensitive elements are arranged in the photosensitive pixel areas, the groove isolation structure comprises a reflecting structure and a light absorption structure which correspond to each other, the reflecting structure is positioned at one end, close to the optical structure layer, of the groove isolation structure and used for reflecting light, the light absorption structure is positioned at one end, close to the circuit connecting layer, of the groove isolation structure and used for absorbing light, one end, facing the circuit connecting layer, of the light absorption structure extends into the circuit connecting layer and is electrically connected with the circuit connecting layer, and when the image sensor is in a working state, the circuit connecting layer applies negative voltage to the light absorption structure.

Furthermore, the circuit connection layer comprises an insulating layer, and a first conductive circuit and a second conductive circuit which are arranged in the insulating layer, the first conductive circuit is connected with the grid layer, and one end of the light absorption structure, which faces the circuit connection layer, extends into the insulating layer and is electrically connected with the second conductive circuit.

Further, the reflective structure is made of a material having a refractive index lower than that of the semiconductor structure layer.

Furthermore, a reflecting layer is arranged on one side, facing the optical structure layer, of the semiconductor structure layer, and the reflecting layer can transmit light rays on one side of the optical structure layer and reflect light rays on one side of the semiconductor structure layer.

Further, the reflecting layer and the reflecting structure are made of the same material, and the refractive index of the reflecting layer and the refractive index of the reflecting structure are lower than that of the semiconductor structure layer.

Further, the trench isolation structure further comprises a protection layer structure, wherein the protection layer structure is located in the semiconductor structure layer and covers the surfaces of the reflection structure and the light absorption structure.

Further, the reflective structure and the protective layer structure are made of the same material, and the refractive indexes of the reflective structure and the protective layer structure are lower than that of the semiconductor structure layer.

The present invention also provides a method for manufacturing an image sensor, the method being used for manufacturing the image sensor, the method comprising:

forming a first groove on a first surface of a semiconductor substrate;

forming a first insulating layer on the first surface;

manufacturing a gate layer and a second insulating layer covering the gate layer on the first insulating layer;

etching the second insulating layer and the first insulating layer to form a first contact hole corresponding to the trench isolation structure and a second contact hole corresponding to the gate layer, wherein the first contact hole extends into the first trench;

filling a light absorption material in the first contact hole to form a light absorption structure, and filling a conductive material in the second contact hole to form a first conductive column layer;

forming a connection circuit in conductive connection with the light absorbing structure and the first conductive pillar layer on the second insulating layer;

and manufacturing an optical structure layer on a second surface of the semiconductor substrate far away from the circuit connection layer.

Further, the depth of the first trench is equal to the height of the light absorbing structure at the semiconductor substrate part, a first dielectric protection layer is filled in the first trench before the first insulating layer is covered, and the first contact hole extends into the first dielectric protection layer;

before the optical structure layer is manufactured, the method further comprises the following steps: forming a second groove corresponding to the first groove on a second surface of the semiconductor substrate far away from the circuit connecting layer; and forming a second dielectric protection layer in the second groove.

Further, the second dielectric protection layer is etched, the second dielectric protection layer on the inner wall of the second groove is reserved, a reflective material is filled in the second groove, and a reflective structure is formed, wherein the refractive index of the reflective material is lower than that of the semiconductor substrate.

Further, the refractive index of the second dielectric protection layer is lower than that of the semiconductor substrate, and the second dielectric protection layer serves as a reflection structure.

Further, the depth of the first trench is equal to the sum of the height of the light absorption structure at the semiconductor substrate part and the height of the reflection structure, a first dielectric protection layer is filled in the first trench before the first insulating layer is covered, and the first contact hole extends into the first dielectric protection layer.

Further, the first dielectric protection layer is etched from the second surface of the semiconductor substrate, the first dielectric protection layer on the inner wall of the first groove is reserved, a reflective material is filled in the first groove, and a reflective structure is formed, wherein the refractive index of the reflective material is lower than that of the semiconductor substrate.

Further, the refractive index of the first dielectric protection layer is lower than that of the semiconductor substrate, and the first dielectric protection layer serves as a reflection structure.

Further, a reflection layer is formed between the semiconductor substrate and the optical structure layer, and the reflection layer can transmit light on one side of the optical structure layer and reflect light on one side of the semiconductor structure layer.

The invention has the beneficial effects that: the groove isolation structure is arranged in the semiconductor structure layer, and one end of the groove isolation structure, which is close to the optical structure layer, is a reflection structure with a light reflection function, so that the light receiving performance is improved, and the optical crosstalk generated by the light close to the optical structure layer can be avoided or reduced; the one end that trench isolation structure is close to the circuit connection layer is for having the extinction structure of absorbed light, and the extinction structure can absorb the light of kicking into near the circuit connection layer to avoid or reduce light and connect near the layer to take place to crosstalk at the circuit connection, and extinction structure and circuit connection layer electric connection, thereby can apply negative voltage to the extinction structure on, and make around the extinction structure and semiconductor structure layer formation P type district, in order to reduce dark current.

Drawings

Fig. 1 is a schematic longitudinal sectional structure diagram of an image sensor according to a first embodiment of the invention;

FIG. 2 is a schematic cross-sectional view of an image sensor according to a first embodiment of the present invention;

FIGS. 3a-3j are structural flow charts illustrating a method for fabricating an image sensor according to one embodiment of the present invention;

FIG. 4 is a schematic cross-sectional view of an image sensor according to a second embodiment of the present invention;

5a-5h are structure flow diagrams of a method for fabricating an image sensor according to a second embodiment of the present invention;

FIG. 6 is a schematic cross-sectional view of an image sensor according to a third embodiment of the present invention;

FIG. 7 is a schematic diagram of a longitudinal cross-sectional structure of an image sensor according to a fourth embodiment of the present invention;

fig. 8a to 8j are flow charts illustrating the structure of a method for fabricating an image sensor according to an embodiment of the present invention.

Detailed Description

To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description of the embodiments, structures, features and effects of the image sensor and the manufacturing method thereof according to the present invention will be made with reference to the accompanying drawings and preferred embodiments:

[ example one ]

Fig. 1 is a schematic diagram of a longitudinal sectional structure of an image sensor according to a first embodiment of the present invention, fig. 2 is a schematic diagram of a cross-sectional structure of an image sensor according to a first embodiment of the present invention, and fig. 3a to 3j are structural flow charts of a manufacturing method of an image sensor according to a first embodiment of the present invention.

As shown in fig. 1 to fig. 2, an image sensor according to an embodiment of the present invention includes a circuit connection layer 10, an optical structure layer 30, and a semiconductor structure layer 20 located between the circuit connection layer 10 and the optical structure layer 30, the semiconductor structure layer 20 has a plurality of photosensitive pixel regions 21 distributed in an array, and a trench isolation structure 22 separating the plurality of photosensitive pixel regions 21 and penetrating through the semiconductor structure layer 20, and photosensitive elements (photodiodes) are disposed in the photosensitive pixel regions 21. The trench isolation structure 22 includes a reflection structure 221 and a light absorption structure 222 corresponding to each other, the reflection structure 221 is located at one end of the trench isolation structure 22 close to the optical structure layer 30 and is used for reflecting light, the light absorption structure 222 is located at one end of the trench isolation structure 22 close to the circuit connection layer 10 and is used for absorbing light, the light absorption structure 222 extends into the circuit connection layer 10 towards one end of the circuit connection layer 10 and is electrically connected with the circuit connection layer 10, in an operating state, the circuit connection layer 10 applies a negative voltage to the light absorption structure 222, that is, the trench isolation structure 22 is divided into two parts, the part close to the optical structure layer 30 is the reflection structure 221, the part close to the circuit connection layer 10 is the light absorption structure 222, and in the operating state, the light absorption structure 222 is applied with a negative voltage.

Wherein the circuit connection layer 10 and the semiconductor structure layer 20 form a transfer transistor (M) in each photosensitive pixel region 21 _TX ) Reset transistor (M) _RS ) And an amplifying transistor (M) _RD ) And the specific structure thereof can refer to the prior art, and is not described in detail herein. However, in the embodiment, the circuit connection layer 10 additionally provides a line for supplying power to the light absorption structure 222, and preferably, the circuit connection layer 10 applies a negative voltage to the light absorption structure 222 to form a P-type region in the semiconductor structure layer 20 around the light absorption structure 222, so as to reduce dark current.

The invention increases the receiving performance of light rays and can also avoid or reduce optical crosstalk generated by the light rays near the optical structure layer 30 by arranging the groove isolation structure 22 in the semiconductor structure layer 20 and arranging the reflection structure 221 with the function of reflecting the light rays at one end of the groove isolation structure 22 near the optical structure layer 30; the trench isolation structure 22 has a light absorption structure 222 at an end thereof close to the circuit connection layer 10 for absorbing light, the light absorption structure 222 can absorb light entering the vicinity of the circuit connection layer 10, thereby preventing or reducing crosstalk of light in the vicinity of the circuit connection layer 10, and the light absorption structure 222 is electrically connected to the circuit connection layer 10, thereby applying a negative voltage to the light absorption structure 222, and forming a P-type region around the light absorption structure 222 and the semiconductor structure layer 20 in the vicinity thereof, thereby reducing dark current.

Wherein the image sensor is a Backside illumination (BSI) image sensor, and the circuit connection layer 10 is used for processing and transmitting information of the light sensing element and for applying an electrical signal to the light absorption structure 222. The optical structure layer 30 includes a color filter layer 31 and a microlens array structure 32, the color filter layer 31 includes three color filter layers of red (R), green (G), and blue (B), the plurality of color filter layers 31 are distributed in an array, and each color filter layer 31 corresponds to one pixel unit. The micro-lens array structure 32 has a light-gathering function, so that light is gathered on the photosensitive element, and the light receiving performance of the photosensitive element is improved. Each pixel unit may include one pixel or may include a plurality of shared pixels. For a more detailed description of the backside illuminated image sensor, please refer to the prior art, which is not described herein.

In this embodiment, the circuit connection layer 10 includes an insulating layer 11, and a first conductive trace 12 and a second conductive trace 13 disposed in the insulating layer 11, the light-absorbing structure 222 extends into the insulating layer 11 toward one end of the circuit connection layer 10 and is electrically connected to the second conductive trace 13 to receive a negative voltage through the second conductive trace 13, the first conductive trace 12 is connected to the gate layer 121 to enable each transistor corresponding to the gate layer 121 to obtain a working voltage, the first conductive trace 12 and the second conductive trace 13 are independent circuit structures, and metal layers corresponding to the first conductive trace 12 and the second conductive trace 13 are located in the same layer and are manufactured by the same process. The insulating layer 11 is formed by a multiple-stacking process, as shown in fig. 3f, the insulating layer 11 includes a first insulating layer 111, a second insulating layer 112, a third insulating layer 113, and a fourth insulating layer 114, although in the actual manufacturing process, the insulating layer 11 may also include more layers stacked, which is not specifically stated herein. The circuit connection layer 10 includes a gate layer 121, a first conductive pillar layer 122, a first metal layer 123, a second conductive pillar layer 124 and a second metal layer 125, although in practice, the circuit connection layer 10 may include other structures to form a pass transistor (M) _TX ) Reset transistor (M) _RS ) Amplifying transistor (M) _RD ) And other circuits, etc., that are not specifically set forth herein. In the present embodiment, electricityThe circuit connection layer 10 is electrically connected to the light absorption structure 222 through the first metal layer 123, the second conductive pillar layer 124 and the second metal layer 125, so as to connect the light absorption structure 222 with an external circuit, thereby applying an electrical signal to the light absorption structure 222. Of course, the connection structure between the circuit connection layer 10 and the light absorption structure 222 may be adjusted according to actual conditions, and is not limited thereto.

Further, the trench isolation structure 22 further includes a protection layer structure 223, wherein the protection layer structure 223 is located in the semiconductor structure layer 20 and covers the surfaces of the reflection structure 221 and the light absorption structure 222, that is, the reflection structure 221, the light absorption structure 222 and the semiconductor structure layer 20 are separated by the protection layer structure 223.

In the present embodiment, the reflective structure 221 is made of a dielectric material having a refractive index lower than that of the semiconductor structure layer 20. The light absorbing structure 222 is made of tungsten (W) or titanium nitride (TiN). Preferably, the refractive index n of the reflective structure 221 is less than 2.5, so that total reflection is formed between the reflective structure 221 and the semiconductor structure layer 20, and the reflective structure 221 may be made of Oxide (OX), silicon nitride (SiN), a high dielectric material, or air. Of course, other light absorbing materials may be used for the light absorbing structure 222. The protection layer structure 223 may be made of the same material as the reflective structure 221, so that the reflective structure 221 and the protection layer structure 223 may be manufactured by the same process, thereby reducing the complexity of the manufacturing process. Of course, the protection layer structure 223 may be made of a different material from the reflective structure 221, and the protection layer structure 223 and the reflective structure 221 are made by a single process.

Further, the height of the reflective structure 221 is greater than one-half of the height of the trench isolation structure 22, and the portion of the light absorbing structure 222 located in the semiconductor structure layer 20 is less than one-half of the height of the trench isolation structure 22. In this embodiment, the thickness of the semiconductor structure layer 20 and the height of the trench isolation structure 22 are both 2 to 15um, and the width of the trench isolation structure 22 is 0.1 to 0.3um.

As shown in fig. 2, in the present embodiment, the cross section of the light absorbing structure 222 is a continuous structure, that is, the cross section of the light absorbing structure 222 is a plurality of strip-shaped structures intersecting with each other, and there is no gap on the light absorbing structure 222 around each pixel unit.

Further, a first dielectric layer may be disposed between the circuit connection layer 10 and the semiconductor structure layer 20 to increase the flatness of the contact surface between the circuit connection layer 10 and the semiconductor structure layer 20. A second dielectric layer may be further disposed between the semiconductor structure layer 20 and the optical structure layer 30 to increase the flatness of the contact surface between the semiconductor structure layer 20 and the optical structure layer 30.

As shown in fig. 3a to 3j, the present embodiment further provides a method for manufacturing an image sensor, the method for manufacturing an image sensor is used for manufacturing the image sensor, and the method for manufacturing an image sensor includes:

as shown in fig. 3a, a first trench 201 is formed in a first surface of a semiconductor substrate 20a, and specifically, the semiconductor substrate 20a has a first surface and a second surface opposite to the first surface, wherein the second surface is usually formed by turning over, then performing chemical mechanical polishing to thin the semiconductor substrate 20a, and forming the second surface of the semiconductor substrate 20 a. First, a first trench 201 is etched and formed in a first surface of the semiconductor substrate 20a, and a plan view shape of the first trench 201 is the same as a plan view shape of the trench isolation structure 22.

As shown in fig. 3b, the first trench 201 is filled with the first dielectric protection layer 223a. Specifically, the semiconductor substrate 20a is covered with an insulating film covering the first surface of the semiconductor substrate 20a and the first trench 201, and then the insulating film covering the first surface of the semiconductor substrate 20a is removed, the insulating film in the first trench 201 is left, and the first dielectric protection layer 223a is formed.

Further, a first insulating layer 111 is provided over the first surface of the semiconductor substrate 20 a. In this embodiment, the first insulating layer 111 covers the first dielectric passivation layer 223a. Of course, in other embodiments, the same material may be used for the first insulating layer 111 and the first dielectric protection layer 223a, so that the first insulating layer 111 and the first dielectric protection layer 223a may be manufactured by the same process, and the insulating film covering the first surface does not need to be removed, which simplifies the manufacturing process.

As shown in fig. 3c, a gate layer 121 and a second insulating layer 112 covering the gate layer 121 are formed on the first insulating layer 111. Specifically, a polysilicon or metal film is covered on the first insulating layer 111 and etched to form a patterned gate layer 121, and then the second insulating layer 112 covering the gate layer 121 is formed. The first insulating layer 111 may be a gate oxide layer and is formed by a deposition process or an oxidation process.

As shown in fig. 3d, the second insulating layer 112 and the first insulating layer 111 are etched to form a first contact hole 101 corresponding to the trench isolation structure 22 and a second contact hole 102 corresponding to the gate layer 121, wherein the first contact hole 101 extends into the first trench 201, i.e. when the first contact hole 101 is etched, a portion of the first dielectric protection layer 223a needs to be etched, and the first dielectric protection layer 223a on the inner wall of the first trench 201 is remained. Since the gate layer 121 corresponding to the second contact hole 102 can block etching, the first contact hole 101 and the second contact hole 102 can be formed by a single etching process.

As shown in fig. 3e, the light absorbing structure 222 is formed by filling the light absorbing material 222a in the first contact hole 101, and the first conductive pillar layer 122 is formed by filling the conductive material in the second contact hole 102. Specifically, the light absorbing structure 222 and the first conductive pillar layer 122 may be made of the same material, that is, the light absorbing structure 222 and the first conductive pillar layer 122 are made of a material having both light absorbing property and good conductive property, so that the light absorbing structure 222 and the first conductive pillar layer 122 may be made by one process. Of course, the light absorbing structure 222 and the first conductive pillar layer 122 can be made of different materials and manufactured by two processes respectively.

Further, a connection circuit electrically connected to the light absorbing structure 222 and the first conductive post layer 122 is formed on the second insulating layer 112. The connecting circuit is composed of a conductive column and a metal conducting wire layer. Specifically, as shown in fig. 3f, the second insulating layer 112 covers the patterned first metal layer 123 and is electrically connected to the light absorbing structure 222 and the first conductive pillar layer 122, respectively. The light absorbing structure 222 and the first conductive pillar layer 122 are made of the same material by the same process, and then the third insulating layer 113 is formed on the second insulating layer 112 and covers the first metal layer 123, the third insulating layer 113 is etched, and a contact hole is formed at a position corresponding to the first metal layer 123. The second conductive pillar layer 124 and the second metal layer 125 may be made of the same conductive material, a metal film is formed on the third insulating layer 113 to cover the contact hole in the third insulating layer 113, and the metal film is etched to form the second conductive pillar layer 124 and the second metal layer 125. Of course, the second conductive pillar layer 124 and the second metal layer 125 can also be made of different conductive materials, and the second conductive pillar layer 124 and the second metal layer 125 are manufactured by two processes.

As shown in fig. 3g, in the present embodiment, the depth of the first trench 201 is equal to the height of the light absorbing structure 222 at the portion of the semiconductor substrate 20a, i.e., the first trench 201 is used for the subsequent fabrication of the light absorbing structure 222. A second trench 202 corresponding to the first trench 201 is formed on a second surface of the semiconductor substrate 20a away from the circuit connection layer 10. Specifically, the second trench 202 is etched and formed in the second surface of the semiconductor substrate 20a, and the plan view shape of the second trench 202 is the same as the plan view shape of the trench isolation structure 22. Of course, in other embodiments, the depth of the first trench 201 may be equal to the sum of the height of the light absorbing structure 222 at the portion of the semiconductor substrate 20a and the height of the reflective structure 221, i.e. the first trench 201 is used for the subsequent fabrication of the reflective structure 221 and the light absorbing structure 222, so that the second trench 202 and the second dielectric protection layer 223b do not need to be etched, as shown in fig. 5a to 5g in the second embodiment.

As shown in fig. 3h, a second dielectric protection layer 223b is formed within the second trench 202. In this embodiment, the second dielectric protection layer 223b and the reflective structure 221 are made of different materials, the second dielectric protection layer 223b is etched, the second dielectric protection layer 223b covering the second surface of the semiconductor substrate 20a is removed, the second dielectric protection layer 223b on the inner wall of the second trench 202 is remained, and the first dielectric protection layer 223a and the second dielectric protection layer 223b together form the protection layer structure 223. Of course, in other embodiments, the same material may be used for the second dielectric protection layer 223b and the reflective structure 221, and the refractive indexes of the second dielectric protection layer 223b and the reflective structure 221 are lower than that of the semiconductor substrate 20a, so that the second dielectric protection layer 223b and the reflective structure 221 may be manufactured through one process, and the second dielectric protection layer 223b in the second trench 202 does not need to be etched, and the second dielectric protection layer 223b directly serves as the reflective structure 221, which simplifies the manufacturing process and can be referred to fig. 5 g-5 h in the second embodiment.

As shown in fig. 3i, the second trench 202 is filled with a light reflecting material 221a and a reflective structure 221 is formed, the refractive index of the light reflecting material 221a is lower than that of the semiconductor substrate 20a, and the reflective structure 221 and the light absorbing structure 222 in the semiconductor structure layer 20 together form a central structure of the trench isolation structure 22. Specifically, the second surface of the semiconductor substrate 20a is covered with a layer of light-reflecting material 221a, then the light-reflecting material 221a covered on the second surface of the semiconductor substrate 20a is removed, the light-reflecting material 221a in the second trench 202 is remained, and the light-reflecting material 221a is separated from the inner wall of the second trench 202 by the second dielectric protection layer 223b.

As shown in fig. 3j, an optical structure layer 30 is formed on a second surface of the semiconductor substrate 20a away from the circuit connection layer 10. The optical structure layer 30 includes a color filter layer 31, a microlens array structure 32, and the like, the color filter layer 31 includes three color filter layers of red (R), green (G), and blue (B), the plurality of color filter layers 31 are distributed in an array, and each color filter layer 31 corresponds to one pixel unit. The micro-lens array structure 32 has a light-gathering function, so that light is gathered on the photosensitive element, and the light receiving performance of the photosensitive element is improved. The specific manufacturing method of the optical structure layer 30 can refer to the prior art, and is not described herein.

[ example two ]

Fig. 4 is a schematic cross-sectional structure diagram of an image sensor in the second embodiment of the present invention. As shown in fig. 4, an image sensor according to a second embodiment of the present invention is substantially the same as the image sensor according to the first embodiment (fig. 1 to 2), except that in the present embodiment, the reflective structure 221 and the protective layer structure 223 are made of the same material, and the refractive indexes of the reflective structure 221 and the protective layer structure 223 are lower than the refractive index of the semiconductor structure layer 20. Thus, the reflective structure 221 can be formed together with the protection layer structure 223, and the manufacturing process can be simplified.

As shown in fig. 5a to 5h, the present embodiment further provides a method for manufacturing an image sensor, the method for manufacturing an image sensor is used for manufacturing the image sensor, and the method for manufacturing an image sensor includes:

as shown in fig. 5a, a first trench 201 is formed in a first surface of a semiconductor substrate 20a, specifically, the semiconductor substrate 20a has a first surface and a second surface opposite to each other, the first trench 201 is etched and formed in the first surface of the semiconductor substrate 20a, and a plan view shape of the first trench 201 is the same as a plan view shape of the trench isolation structure 22. In this embodiment, the depth of the first trench 201 is equal to the sum of the height of the light absorbing structure 222 located on the semiconductor substrate 20a and the height of the reflective structure 221, i.e., the first trench 201 is used for the subsequent fabrication of the reflective structure 221 and the light absorbing structure 222, so that the second trench 202 does not need to be etched. However, the first trench 201 cannot etch through the semiconductor substrate 20a, which would otherwise leak material and activate the photosensitive pixel region 21.

As shown in fig. 5b, the first trench 201 is filled with a first dielectric protection layer 223a. Specifically, the semiconductor substrate 20a is covered with an insulating film, the insulating film covers the first surface of the semiconductor substrate 20a and the first trench 201, and then the insulating film covering the first surface of the semiconductor substrate 20a is removed, the insulating film in the first trench 201 is retained and the first dielectric protection layer 223a is formed, so that the second dielectric protection layer 223b does not need to be formed.

Further, the first surface of the semiconductor substrate 20a is covered with a first insulating layer 111. In this embodiment, the first insulating layer 111 covers the first dielectric passivation layer 223a. Of course, in other embodiments, the same material may be used for the first insulating layer 111 and the first dielectric protection layer 223a, so that the first insulating layer 111 and the first dielectric protection layer 223a may be manufactured by the same process, and the insulating film covering the first surface does not need to be removed, which simplifies the manufacturing process.

As shown in fig. 5c, a gate layer 121 and a second insulating layer 112 covering the gate layer 121 are formed on the first insulating layer 111. Specifically, a metal film is covered on the first insulating layer 111 and etched to form a patterned gate layer 121, and then the second insulating layer 112 covering the gate layer 121 is formed. The first insulating layer 111 may be a gate oxide layer and is formed by a deposition process or an oxidation process.

As shown in fig. 5d, the second insulating layer 112 and the first insulating layer 111 are etched to form a first contact hole 101 corresponding to the trench isolation structure 22 and a second contact hole 102 corresponding to the gate layer 121, wherein the first contact hole 101 extends into the first trench 201, i.e. when the first contact hole 101 is etched, a portion of the first dielectric protection layer 223a needs to be etched, and the first dielectric protection layer 223a on the inner wall of the first trench 201 and the first dielectric protection layer 223a near one end of the second surface are remained. The gate layer 121 corresponding to the second contact hole 102 can block etching, and the first contact hole 101 and the second contact hole 102 can be formed by a single etching process.

As shown in fig. 5e, the light absorbing structure 222 is formed by filling the light absorbing material 222a in the first contact hole 101, and the first conductive pillar layer 122 is formed by filling the conductive material in the second contact hole 102. Specifically, the light absorbing structure 222 and the first conductive pillar layer 122 may be made of the same material, that is, the light absorbing structure 222 and the first conductive pillar layer 122 are made of a material having both light absorbing property and good conductive property, so that the light absorbing structure 222 and the first conductive pillar layer 122 may be made by one process. Of course, the light absorbing structure 222 and the first conductive pillar layer 122 can also be made of different materials and made by two processes respectively. Alternatively, the part of the light absorbing structure 222 in the semiconductor structure layer 20 and the part of the light absorbing structure 222 in the circuit connection layer 10 are made of different materials, the part of the light absorbing structure 222 in the semiconductor structure layer 20 is made of a light absorbing dielectric material, and the part of the light absorbing structure 222 in the circuit connection layer 10 and the first conductive column layer 122 are made of materials with better conductivity.

Further, a connection circuit electrically connected to the light absorbing structure 222 and the first conductive post layer 122 is formed on the second insulating layer 112. The connecting circuit is composed of a conductive column and a metal conducting wire layer. Specifically, as shown in fig. 5f, the second insulating layer 112 covers the patterned first metal layer 123 and is electrically connected to the light absorbing structure 222 and the first conductive pillar layer 122, respectively. The light absorbing structure 222 and the first conductive pillar layer 122 may be made of the same material and by the same process as the first metal layer 123, that is, a metal film is formed on the second insulating layer 112 and covers the first contact hole 101 and the second contact hole 102, and then the metal film is etched, so that the light absorbing structure 222, the first conductive pillar layer 122, and the first metal layer 123 are formed at the same time. Then, the second insulating layer 112 forms a third insulating layer 113 covering the first metal layer 123, and the third insulating layer 113 is etched to form a contact hole at a position corresponding to the first metal layer 123. The second conductive pillar layer 124 and the second metal layer 125 may be made of the same conductive material, a metal film is formed on the third insulating layer 113 to cover the contact hole in the third insulating layer 113, and the metal film is etched to form the second conductive pillar layer 124 and the second metal layer 125. Of course, the second conductive pillar layer 124 and the second metal layer 125 can also be made of different conductive materials, and the second conductive pillar layer 124 and the second metal layer 125 are manufactured by two processes respectively.

As shown in fig. 5g, the semiconductor substrate 20a with the manufactured semiconductor structure layer 20 is turned over, and after the turning over, chemical mechanical polishing is performed to expose the first trench 201 and the first dielectric protection layer 223a, so that the second surface of the semiconductor substrate 20a appears, but it is not necessary to etch the second trench 202 on the second surface of the semiconductor substrate 20a and cover the second dielectric protection layer 223b.

In this embodiment, the first dielectric protection layer 223a and the reflective structure 221 are made of the same material, and the refractive indexes of the first dielectric protection layer 223a and the reflective structure 221 are lower than that of the semiconductor substrate 20a, so that the first dielectric protection layer 223a and the reflective structure 221 can be manufactured through one process, the first dielectric protection layer 223a of the first trench 201 close to the second surface does not need to be etched, and the first dielectric protection layer 223a directly serves as the reflective structure 221, thereby simplifying the manufacturing process. Of course, in other embodiments, the first dielectric protection layer 223a and the reflective structure 221 may also be made of different materials, and the first dielectric protection layer 223a is etched on the second surface, so as to leave the first dielectric protection layer 223a on the inner wall of the first trench 201. Then, a light reflecting material 221a is filled into the first trench 201 from the second surface, and a reflective structure 221 is formed, wherein the refractive index of the light reflecting material 221a is lower than that of the semiconductor substrate 20a, and the reflective structure 221 and the light absorbing structure 222 in the semiconductor structure layer 20 together form a central structure of the trench isolation structure 22. Specifically, a layer of light reflecting material 221a is covered on the second surface of the semiconductor substrate 20a, then the light reflecting material 221a covered on the second surface of the semiconductor substrate 20a is removed, the light reflecting material 221a in the first trench 201 is remained, and the light reflecting material 221a is separated from the inner wall of the first trench 201 by the first dielectric protection layer 223a.

As shown in fig. 5h, an optical structure layer 30 is formed on a second surface of the semiconductor substrate 20a away from the circuit connection layer 10. The optical structure layer 30 includes a color filter layer 31, a microlens array structure 32, and the like, the color filter layer 31 includes three color filter layers of red (R), green (G), and blue (B), the plurality of color filter layers 31 are distributed in an array, and each color filter layer 31 corresponds to one pixel unit. The micro-lens array structure 32 has a light-gathering function, so that light is gathered on the photosensitive element, and the light receiving performance of the photosensitive element is improved. The specific manufacturing method of the optical structure layer 30 can refer to the prior art, and is not described herein.

Compared with the manufacturing method in the embodiment, the depth of the first trench 201 in the embodiment is equal to the thickness of the semiconductor substrate 20a, and the dielectric protection layer 223 and the reflective material 221a are made of the same material, so that the manufacturing process can be greatly simplified, the manufacturing effect can be improved, and the manufacturing cost can be reduced.

It should be understood by those skilled in the art that the rest of the structure and the operation principle of the present embodiment are the same as those of the first embodiment, and are not described herein again.

[ third example ]

Fig. 6 is a schematic cross-sectional structure diagram of an image sensor in the third embodiment of the present invention. As shown in fig. 6, an image sensor provided by a third embodiment of the present invention is substantially the same as the first embodiment (the image sensor in fig. 1 to 3j, except that, in the present embodiment, the cross section of the light absorbing structure 222 is a segmented structure, a plurality of gaps are provided on the light absorbing structure 222, that is, the cross section of the light absorbing structure 222 is a plurality of segment-shaped structures spaced apart from each other, and the light absorbing structure 222 around each pixel unit is formed by a plurality of independent columnar structures spaced apart from each other.

[ example four ]

Fig. 7 is a schematic longitudinal sectional structure diagram of an image sensor in the fourth embodiment of the present invention. As shown in fig. 7, an image sensor according to a fourth embodiment of the present invention is substantially the same as the first embodiment (the image sensor in fig. 1, except that in the present embodiment, a reflective layer 23 is disposed on a side of the semiconductor structure layer 20 facing the optical structure layer 30, and the reflective layer 23 is capable of transmitting light from the side of the optical structure layer 30 and reflecting light from the side of the semiconductor structure layer 20. Specifically, the reflective layer 23 is made of a material having a lower refractive index than the semiconductor structure layer 20, so that light from the side of the optical structure layer 30 can enter the semiconductor structure layer 20, and light from the side of the semiconductor structure layer 20 is reflected by the reflective layer 23, thereby increasing the light receiving performance of the photosensitive element.

Further, the reflective layer 23 and the reflective structure 221 are made of the same material, and the refractive index of the reflective layer 23 and the reflective structure 221 is lower than that of the semiconductor structure layer 20, so that the manufacturing process can be simplified. Of course, the reflective layer 23 and the reflective structure 221 may be made of different materials, but the reflective layer 23 and the reflective structure 221 need to be formed by one process.

As shown in fig. 8a to 8j, the present embodiment further provides a method for manufacturing an image sensor, the method for manufacturing an image sensor being as described above, the method comprising:

as shown in fig. 8a, a first trench 201 is formed in a first surface of a semiconductor substrate 20a, specifically, the semiconductor substrate 20a has a first surface and a second surface opposite to the first surface, wherein the second surface is formed by performing chemical mechanical polishing to thin the semiconductor substrate 20a, and forming a second surface of the semiconductor substrate 20 a. First, a first trench 201 is etched and formed in a first surface of the semiconductor substrate 20a, and a plan view shape of the first trench 201 is the same as a plan view shape of the trench isolation structure 22.

As shown in fig. 8b, the first trench 201 is filled with the first dielectric protection layer 223a. Specifically, the semiconductor substrate 20a is covered with an insulating film covering the first surface of the semiconductor substrate 20a and the first trench 201, and then the insulating film covering the first surface of the semiconductor substrate 20a is removed, the insulating film in the first trench 201 is left, and the first dielectric protection layer 223a is formed.

As shown in fig. 8c, a gate layer 121 and a second insulating layer 112 covering the gate layer 121 are formed on the first insulating layer 111. Specifically, a polysilicon or metal film is covered on the first insulating layer 111 and etched to form a patterned gate layer 121, and then the second insulating layer 112 covering the gate layer 121 is formed. The first insulating layer 111 may be a gate oxide layer and is formed by a deposition process or an oxidation process.

As shown in fig. 8d, the second insulating layer 112 and the first insulating layer 111 are etched to form a first contact hole 101 corresponding to the trench isolation structure 22 and a second contact hole 102 corresponding to the gate layer 121, wherein the first contact hole 101 extends into the first trench 201, i.e. when the first contact hole 101 is etched, a portion of the first dielectric protection layer 223a needs to be etched, and the first dielectric protection layer 223a on the inner wall of the first trench 201 is remained. The gate layer 121 corresponding to the second contact hole 102 can block etching, and the first contact hole 101 and the second contact hole 102 can be formed by a single etching process.

As shown in fig. 8e, the light absorbing structure 222 is formed by filling the light absorbing material 222a in the first contact hole 101, and the first conductive pillar layer 122 is formed by filling the conductive material in the second contact hole 102. Specifically, the light absorbing structure 222 and the first conductive pillar layer 122 may be made of the same material, that is, the light absorbing structure 222 and the first conductive pillar layer 122 are made of a material having both light absorbing property and good conductive property, so that the light absorbing structure 222 and the first conductive pillar layer 122 may be made by one process. Of course, the light absorbing structure 222 and the first conductive pillar layer 122 can be made of different materials and manufactured by two processes respectively. Alternatively, the light absorbing structure 222 is made of different conductive materials for the portion in the semiconductor structure layer 20 and the portion in the circuit connection layer 10.

Further, a connection circuit electrically connected to the light absorbing structure 222 and the first conductive post layer 122 is formed on the second insulating layer 112. The connecting circuit is composed of a conductive column and a metal conducting wire layer. Specifically, as shown in fig. 8f, the second insulating layer 112 covers the patterned first metal layer 123 and is electrically connected to the light absorbing structure 222 and the first conductive pillar layer 122, respectively. The light absorbing structure 222 and the first conductive pillar layer 122 are made of the same material and by the same process. Then, a third insulating layer 113 is formed on the second insulating layer 112 and covers the first metal layer 123, and the third insulating layer 113 is etched to form a contact hole at a position corresponding to the first metal layer 123. The second conductive pillar layer 124 and the second metal layer 125 may be made of the same conductive material, a metal film is formed on the third insulating layer 113 to cover the contact hole in the third insulating layer 113, and the metal film is etched to form the second conductive pillar layer 124 and the second metal layer 125. Of course, the second conductive pillar layer 124 and the second metal layer 125 can also be made of different conductive materials, and the second conductive pillar layer 124 and the second metal layer 125 are manufactured by two processes.

As shown in fig. 8g, in the present embodiment, the depth of the first trench 201 is equal to the height of the light absorbing structure 222 at the portion of the semiconductor substrate 20a, i.e., the first trench 201 is used for the subsequent fabrication of the light absorbing structure 222. A second trench 202 corresponding to the first trench 201 is formed on a second surface of the semiconductor substrate 20a away from the circuit connection layer 10. Specifically, a second trench 202 is etched and formed in the second surface of the semiconductor substrate 20a, and the plan view shape of the second trench 202 is the same as the plan view shape of the trench isolation structure 22. Of course, in other embodiments, the depth of the first trench 201 may be equal to the sum of the height of the light absorbing structure 222 at the portion of the semiconductor substrate 20a and the height of the reflective structure 221, i.e. the first trench 201 is used for the subsequent fabrication of the reflective structure 221 and the light absorbing structure 222, so that the second trench 202 and the second dielectric protection layer 223b do not need to be etched, as shown in fig. 5a to 5g in the second embodiment.

As shown in fig. 8h, a second dielectric protection layer 223b is formed within the second trench 202. In this embodiment, the second dielectric protection layer 223b and the reflective structure 221 are made of different materials, the second dielectric protection layer 223b is etched, the second dielectric protection layer 223b covering the second surface of the semiconductor substrate 20a is removed, the second dielectric protection layer 223b on the inner wall of the second trench 202 is remained, and the first dielectric protection layer 223a and the second dielectric protection layer 223b together form the protection layer structure 223. Of course, in other embodiments, the same material may be used for the second dielectric protection layer 223b and the reflective structure 221, and the refractive indexes of the second dielectric protection layer 223b and the reflective structure 221 are lower than that of the semiconductor substrate 20a, so that the second dielectric protection layer 223b and the reflective structure 221 may be manufactured through one process, and the second dielectric protection layer 223b in the second trench 202 does not need to be etched, and the second dielectric protection layer 223b directly serves as the reflective structure 221, which simplifies the manufacturing process and can be referred to fig. 5 g-5 h in the second embodiment.

As shown in fig. 8i, the second trench 202 is filled with a light reflecting material 221a and a reflective structure 221 is formed, the refractive index of the light reflecting material 221a is lower than that of the semiconductor substrate 20a, and the reflective structure 221 and the light absorbing structure 222 in the semiconductor structure layer 20 together form a central structure of the trench isolation structure 22. Specifically, the second surface of the semiconductor substrate 20a is covered with a layer of light-reflecting material 221a, then the light-reflecting material 221a covered on the second surface of the semiconductor substrate 20a is removed, the light-reflecting material 221a in the second trench 202 is remained, and the light-reflecting material 221a is separated from the inner wall of the second trench 202 by the second dielectric protection layer 223b.

Further, a whole reflection layer 23 is formed on the second surface of the semiconductor substrate 20a and covers the reflection structure 221, and the refractive index of the reflection layer 23 is lower than that of the semiconductor substrate 20 a. In this embodiment, the reflective layer 23 and the reflective material 221a are made of the same material and have a refractive index lower than that of the semiconductor substrate 20 a. Therefore, after the second surface of the semiconductor substrate 20a is covered with the light reflecting material 221a, the light reflecting material 221a does not need to be etched to remove the light reflecting material 221a on the second surface, and only the light reflecting material 221a in the second trench 202 remains, which can simplify the manufacturing process. Of course, in other embodiments, the reflective layer 23 and the reflective material 221a may not be made of the same material, but the refractive index of the reflective layer 23 and the reflective material 221a is required to be lower than that of the semiconductor substrate 20 a. Specifically, a layer of reflective material is coated on the second surface of the semiconductor substrate 20a, and then the reflective material coated on the second surface of the semiconductor substrate 20a is removed, leaving the reflective material in the second trench 202, and the reflective material is separated from the inner wall of the second trench 202 by the second dielectric protection layer 223b. And then covered with another layer of light reflecting material and formed into a reflective layer 23.

As shown in fig. 8j, an optical structure layer 30 is formed on a second surface of the semiconductor substrate 20a away from the circuit connection layer 10. The optical structure layer 30 includes a color filter layer 31, a microlens array structure 32, and the like, the color filter layer 31 includes three color filter layers of red (R), green (G), and blue (B), the plurality of color filter layers 31 are distributed in an array, and each color filter layer 31 corresponds to one pixel unit. The micro-lens array structure 32 has a light-gathering function, so that light is gathered on the photosensitive element, and the light receiving performance of the photosensitive element is improved. The specific manufacturing method of the optical structure layer 30 can refer to the prior art, and is not described herein.

In this document, the terms of upper, lower, left, right, front, rear and the like are used to define the positions of the structures in the drawings and the positions of the structures relative to each other, and are only used for the sake of clarity and convenience in technical solution. It is to be understood that the use of the directional terms should not be taken to limit the scope of the claims. It should also be understood that the terms "first," "second," and the like, as used herein, are used merely for descriptive purposes and not for limiting quantity or order.

Although the present invention has been described with reference to the preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. An image sensor, comprising a circuit connection layer (10), an optical structure layer (30), and a semiconductor structure layer (20) located between the circuit connection layer (10) and the optical structure layer (30), wherein the semiconductor structure layer (20) has a plurality of photosensitive pixel regions (21) distributed in an array and a trench isolation structure (22) separating the photosensitive pixel regions (21) and penetrating through the semiconductor structure layer (20), a photosensitive element is disposed in the photosensitive pixel region (21), the trench isolation structure (22) includes a reflective structure (221) and a light absorption structure (222) corresponding to each other, the reflective structure (221) is located at one end of the trench isolation structure (22) close to the optical structure layer (30) and is used for reflecting light, the light absorption structure (222) is located at one end of the trench isolation structure (22) close to the circuit connection layer (10) and is used for absorbing light, the light absorption structure (222) extends into the circuit connection layer (10) towards one end of the circuit connection layer (10) and is electrically connected with the circuit connection layer (10), and when the circuit connection layer (10) is in a negative voltage, the light absorption structure (222) is applied.

2. The image sensor according to claim 1, wherein the circuit connection layer (10) comprises an insulating layer (11) and a first conductive trace (12) and a second conductive trace (13) disposed in the insulating layer (11), the first conductive trace (12) is connected to a gate layer (121), and the light absorbing structure (222) extends into the insulating layer (11) towards one end of the circuit connection layer (10) and is electrically connected to the second conductive trace (13).

3. The image sensor according to claim 1, wherein the reflective structure (221) is made of a material having a refractive index lower than that of the semiconductor structure layer (20).

4. An image sensor as claimed in claim 1, characterized in that the semiconductor structure layer (20) is provided with a reflective layer (23) on a side facing the optical structure layer (30), the reflective layer (23) being capable of transmitting light on the optical structure layer (30) side and reflecting light on the semiconductor structure layer (20) side.

5. The image sensor according to claim 4, wherein the reflective layer (23) and the reflective structure (221) are made of the same material, and the refractive index of the reflective layer (23) and the reflective structure (221) is lower than that of the semiconductor structure layer (20).

6. The image sensor according to claim 1, wherein the trench isolation structure (22) further comprises a protection layer structure (223), the protection layer structure (223) is located in the semiconductor structure layer (20) and covers the surfaces of the reflection structure (221) and the light absorption structure (222).

7. The image sensor of claim 6, wherein the reflective structure (221) and the protective layer structure (223) are made of the same material, and the refractive index of the reflective structure (221) and the refractive index of the protective layer structure (223) are lower than the refractive index of the semiconductor structure layer (20).

8. A method for manufacturing an image sensor, the method being used for manufacturing the image sensor according to any one of claims 1 to 7, the method comprising:

forming a first trench (201) in a first surface of a semiconductor substrate (20 a);

forming a first insulating layer (111) on the first surface;

manufacturing a gate layer (121) on the first insulating layer (111) and a second insulating layer (112) covering the gate layer (121);

etching the second insulating layer (112) and the first insulating layer (111) and forming a first contact hole (101) corresponding to a trench isolation structure (22) and a second contact hole (102) corresponding to a gate layer (121), the first contact hole (101) extending into the first trench (201);

filling a light absorption material (222 a) in the first contact hole (101) and forming a light absorption structure (222), and filling a conductive material in the second contact hole (102) and forming a first conductive column layer (122);

forming a connection circuit on the second insulating layer (112) in electrically conductive connection with the light absorbing structure (222) and the first conductive pillar layer (122);

and manufacturing an optical structure layer (30) on a second surface of the semiconductor substrate (20 a) far away from the circuit connecting layer (10).

9. The method for fabricating an image sensor according to claim 8, wherein the depth of the first trench (201) is equal to the height of the light absorbing structure (222) at the portion of the semiconductor substrate (20 a), the step of covering the first insulating layer (111) further comprises filling a first dielectric protection layer (223 a) in the first trench (201), and the first contact hole (101) extends into the first dielectric protection layer (223 a);

before the optical structure layer (30) is manufactured, the method further comprises the following steps: forming a second trench (202) corresponding to the first trench (201) on a second surface of the semiconductor substrate (20 a) far away from the circuit connection layer (10); and forming a second dielectric protection layer (223 b) in the second groove (202).

10. The method of claim 9, wherein the second dielectric protection layer (223 b) is etched and the second dielectric protection layer (223 b) on the inner wall of the second trench (202) is remained, a reflective material (221 a) is filled in the second trench (202) and a reflective structure (221) is formed, and a refractive index of the reflective material (221 a) is lower than a refractive index of the semiconductor substrate (20 a).

11. The method of claim 9, wherein the second dielectric protection layer (223 b) has a refractive index lower than that of the semiconductor substrate (20 a), and the second dielectric protection layer (223 b) serves as a reflective structure (221).

12. The method of claim 8, wherein a depth of the first trench (201) is equal to a sum of a height of the light absorbing structure (222) on the portion of the semiconductor substrate (20 a) and a height of the reflective structure (221), and wherein the covering the first insulating layer (111) further comprises filling a first dielectric protection layer (223 a) in the first trench (201), and wherein the first contact hole (101) extends into the first dielectric protection layer (223 a).

13. The method of claim 12, wherein the first dielectric protection layer (223 a) is etched from the second surface of the semiconductor substrate (20 a) and remains on the first dielectric protection layer (223 a) on the inner wall of the first trench (201), a light reflecting material (221 a) is filled in the first trench (201) and a reflective structure (221) is formed, and the refractive index of the light reflecting material (221 a) is lower than that of the semiconductor substrate (20 a).

14. The method of claim 12, wherein the refractive index of the first dielectric protection layer (223 a) is lower than the refractive index of the semiconductor substrate (20 a), and the first dielectric protection layer (223 a) serves as a reflective structure (221).

15. The method of claim 8, wherein a reflective layer (23) is formed between the semiconductor substrate (20 a) and the optical structure layer (30), and the reflective layer (23) is capable of transmitting light on the side of the optical structure layer (30) and reflecting light on the side of the semiconductor structure layer (20).