CN115508954A - Optical transceiver module - Google Patents
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- CN115508954A CN115508954A CN202110696439.2A CN202110696439A CN115508954A CN 115508954 A CN115508954 A CN 115508954A CN 202110696439 A CN202110696439 A CN 202110696439A CN 115508954 A CN115508954 A CN 115508954A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4287—Optical modules with tapping or launching means through the surface of the waveguide
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
- G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/14—Mode converters
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/28—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/426—Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
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Abstract
The application relates to the technical field of optical communication, in particular to an optical transceiving component which is simple and convenient in structure and easy to package. The optical transceiving component comprises an optical transmitter, a bidirectional wave separator and an optical receiver; the bidirectional wave splitter is coupled with the optical transmitter through a first optical waveguide port, coupled with the optical receiver through a second optical waveguide port and coupled with an optical fiber through a third optical waveguide port; the bidirectional wave separator is prepared on the basis of an optical waveguide chip; the optical transmitter is used for generating an uplink optical signal and injecting the uplink optical signal into the bidirectional wave splitter; the bidirectional wave splitter is used for transmitting the uplink optical signal into the optical fiber; receiving a downlink optical signal from the optical fiber and transmitting the downlink optical signal to the optical receiver; the optical receiver is configured to receive the downlink optical signal.
Description
Technical Field
The application relates to the technical field of optical communication, in particular to an optical transceiving component.
Background
In a Passive Optical Network (PON), an Optical Network Terminal (ONT) belongs to a device on a user side, can provide a service interface for a user, has an electro-optical conversion function, and implements signal exchange between the user and an access network.
Currently, the ONT generally uses a bi-directional optical sub-assembly (BOSA) structure to transmit and receive optical signals. The BOSA is a structure commonly used in an optical communication system, and functions to implement integrated optical signal transmission and reception. However, the BOSA structure includes many components, and the packaging process is complex, for example, precise positioning and fixing of the components during coupling are difficult, so that the BOSA structure has the defects of high integration difficulty and high cost.
Therefore, it is of research significance to design an optical transceiver module with low integration difficulty and low cost in the ONT.
Disclosure of Invention
The embodiment of the application provides an optical transceiver module, which is used for designing an optical transceiver module with low integration difficulty and low cost in an ONT.
In a first aspect, an optical transceiver module is provided, comprising: the system comprises an optical transmitter, a bidirectional branching filter and an optical receiver; the bidirectional wave splitter is coupled with the optical transmitter through a first optical waveguide port, coupled with the optical receiver through a second optical waveguide port and coupled with an optical fiber through a third optical waveguide port; the bidirectional wave separator is prepared on the basis of an optical waveguide chip; the optical transmitter is used for generating an uplink optical signal and injecting the uplink optical signal into the bidirectional wave splitter; the bidirectional wave splitter is used for transmitting the uplink optical signal into the optical fiber; receiving a downlink optical signal from the optical fiber and transmitting the downlink optical signal to the optical receiver; the optical receiver is configured to receive the downlink optical signal.
Through the optical transceiving component provided by the application, the bidirectional wave separator prepared by the optical waveguide chip can realize the optical signal transceiving function realized by the BOSA structure adopted in the prior art. Moreover, the optical transceiving component of the bidirectional wave splitter based on the optical waveguide chip preparation, which is provided by the application, has the advantages of small integration difficulty and low cost compared with a BOSA structure. Therefore, the present application provides an optical transceiver module that can be realized in a simple manner, so that the cost of the optical transceiver module can be reduced.
In one possible design, the optical transmitter is end-coupled to the first optical waveguide port of the bidirectional splitter using a flip-chip bonding process. Through the design, the coupling between the optical transmitter and the bidirectional wave splitter can be realized by adopting a simple packaging mode, and the transmission power of the optical signal can be ensured through the flip-chip bonding process.
In a possible design, the second optical waveguide port is designed as an inclined total reflection surface adopting a grinding and polishing process, and the optical receiver is used for receiving a downlink optical signal after being transmitted through the inclined total emission surface. Through the design, the optical receiver patch can be arranged on the output side of the second optical waveguide port of the two-way wave splitter after being reflected by the inclined total reflection surface, so that the optical receiver can effectively receive downlink optical signals.
In one possible design, a signal amplifier is also included; and the input end of the signal amplifier is connected with the output end of the optical receiver and is used for amplifying the downlink optical signal received by the optical receiver. Through the design, the signal amplifier is adopted to amplify the received downlink optical signal, so that the signal gain of the downlink optical signal can be improved, and the accuracy in processing according to the downlink optical signal is guaranteed.
In one possible design, a first spot size converter is also included; the input end of the first spot size converter is connected with the light emitter, the output end of the first spot size converter is connected with the first optical waveguide port of the bidirectional wave splitter, and the first spot size converter is used for converting the spot size of the uplink optical signal output by the light emitter into the spot size of the uplink optical signal received by the bidirectional wave splitter through the first optical waveguide port.
Through the design, the loss of the uplink optical signal in the transmission process can be reduced by adopting the spot size converter, so that the transmission power of the uplink optical signal is ensured.
In one possible design, the first spot size converter may be, but is not limited to, a tapered spot size converter, an inverted tapered spot size converter, or a grating-type spot size converter. Through the design, the spot size converter with a proper shape can be selected according to the actual requirement of the optical transceiving component, so that the coupling ratio between the two optical elements can be improved, and the power in the optical signal transmission process can be guaranteed.
In one possible design, a second spot size converter is also included; the input end of the second spot size converter is connected with a third optical waveguide port of the bidirectional wave splitter, and the output end of the second spot size converter is connected with the optical fiber and is used for converting the spot size of the uplink optical signal output by the bidirectional wave splitter through the third optical waveguide port into the spot size of the uplink optical signal received by the optical fiber.
Through the design, the loss of the downlink optical signal in the transmission process can be reduced by adopting the spot size converter, so that the transmission power of the downlink optical signal can be ensured.
In one possible design, the second spot size converter may also be, but is not limited to, a tapered spot size converter, an inverted tapered spot size converter, or a grating-type spot size converter. Through the design, the spot size converter with a proper shape can be selected according to the actual requirement of the optical transceiving component. Therefore, the coupling ratio between the two optical elements can be improved, and the power in the optical signal transmission process is guaranteed.
In one possible design, the optical waveguide chip may be a planar optical waveguide chip. The planar optical waveguide chip is adopted to realize the bidirectional wave separator, so that the realization process of the optical transceiving component can be simplified, and the cost of the optical transceiving component can be reduced.
In one possible design, the bidirectional splitter includes an optical waveguide and a silica cladding; the optical waveguide may be designed by using a Directional Coupler (DC) structure, a mach-zehnder interferometer (MZI) structure, or an Arrayed Waveguide Grating (AWG) structure.
Through the design, the optical waveguide with a certain structural design is adopted to realize the light direction branching filter, and further through the coupling among different optical waveguide ports, the light transmitter, the light receiver and the optical fiber, the realization of the light transmitting and receiving component is simplified on the basis of realizing the transmitting and receiving of the light signals, and the cost of forming the light transmitting and receiving component is reduced.
In a second aspect, the present application further provides an optical device, which may include the optical transceiver module, the processor, and the optical control chip as described in the first aspect or any one of the possible designs of the first aspect. The processor may be configured to encode data, encapsulate the encoded data into a data packet conforming to an optical transmission protocol, and send the data packet to the optical control chip. The optical control chip may receive the data packet sent by the processor, and convert the data packet into an optical driving signal (analog signal) to drive an optical transmitter included in the optical transceiver component to generate an uplink optical signal.
Since the optical device in the second aspect includes the optical transceiver module designed in each of the first aspects, the optical device also has technical effects that can be brought by each of the designs in the first aspect, and details are not repeated here.
Drawings
FIG. 1 is a schematic view of a scenario of an optical communication system;
fig. 2 is a schematic structural diagram of an optical transceiver module according to an embodiment of the present disclosure;
fig. 3a is a schematic structural diagram of an optical transceiver module adopting a DC structure according to an embodiment of the present application;
fig. 3b is a schematic signal transmission diagram of an optical transceiver module using a DC structure according to an embodiment of the present application;
fig. 3c is a schematic structural diagram of an optical transceiver module using an MZI structure according to an embodiment of the present disclosure;
fig. 3d is a schematic structural diagram of an optical transceiver module using an AWG structure according to an embodiment of the present application;
fig. 4 is a second schematic structural diagram of an optical transceiver module according to a second embodiment of the present disclosure;
fig. 5 is a third schematic structural diagram of an optical transceiver module according to an embodiment of the present disclosure;
fig. 6 is a fourth schematic structural diagram of an optical transceiver module according to an embodiment of the present disclosure;
fig. 7a is a diagram of optical signal transmission at a second optical waveguide port according to an embodiment of the present application;
fig. 7b is a second diagram of optical signal transmission at the second optical waveguide port according to the embodiment of the present application.
Detailed Description
The optical transceiver module provided by the embodiment of the present application may be applied to an optical communication system, and the optical communication system may be, for example, a PON system. A PON system is a technology based on a point-to-multipoint (point 2 multiple point, p2 mp) topology. "passive" means that the optical network does not contain any electronic devices and electronic power sources, and all the optical network is composed of passive devices, and does not need expensive active electronic equipment. For example, the PON system may be an Ethernet Passive Optical Network (EPON) system, a gigabit-capable PON (GPON) system, a wavelength division multiplexing (WDM PON) system, an asynchronous transfer mode (asynchronous transfer mode) system, or the like.
As an example of an application scenario, an optical communication system may include at least a plurality of ONTs and an optical splitter, where the plurality of ONTs may implement communication with an upper access device through the optical splitter, and the upper access device may be, for example, an Optical Line Terminal (OLT). For example, fig. 1 is a schematic diagram of a partial scenario of an optical communication system. In fig. 1, the optical communication system may include a plurality of ONTs, which may be ONT1, ONT2, \8230;, ONTn, respectively. Each ONT may be connected to multiple subscribers, e.g., ONT1 may connect subscriber 1 and subscriber 2; or the ONT may be connected to a subscriber, e.g. ONT1 may be connected to subscriber 3 and ontn may be connected to ONTm. Thus, the ONT can be used as terminal equipment of a user side in the optical communication system, can provide a service interface for the user, and has an electro-optical conversion function so as to realize a signal conversion process between the user and an access network.
At present, ONTs included in optical communication systems in the prior art generally use BOSA structure to implement signal transceiving. The BOSA can realize integrated transmission and reception of optical signals. However, since the BOSA requires a Laser Diode (LD), a trans-impedance amplifier (TIA), a WDM, a ceramic sleeve, a ferrule assembly, and the like to be packaged as a coaxial module. The precise positioning and fixing of the coupling of each component are difficult to realize in the packaging process, and the defects of high integration difficulty and high cost exist.
In view of this, embodiments of the present disclosure provide an optical transceiver module, so as to obtain the optical transceiver module in a simple manner, so as to satisfy the optical signal transceiving function that can be implemented by using a BOSA structure in the prior art. Therefore, the optical transceiver module provided by the embodiment of the application can be used for replacing a BOSA structure with complex packaging in the prior art, so that the integration cost of the optical transceiver module can be reduced.
The technical solutions in the embodiments of the present application will be described in detail below with reference to the drawings in the embodiments of the present application.
It should be noted that the terms "system" and "network" in the embodiments of the present application may be used interchangeably. The plural in the present application means two or more. In addition, it is to be understood that the terms first, second, etc. in the description of the present application are used for distinguishing between the descriptions and not necessarily for describing a sequential or chronological order. "and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" generally indicates that the preceding and following related objects are in an "or" relationship, unless otherwise specified.
Fig. 2 is a schematic diagram of an optical transceiver module 200 according to an embodiment of the present disclosure. The optical transceiver module 200 may be used for transceiving optical signals by optical devices in an optical communication system, for example, the optical devices may be ONTs. The optical transceiver component 200 may include at least:
1) The optical transmitter 201 may be, for example, a laser, and specifically may be a passive patch type laser. The laser can be implemented by a Laser Diode (LD). The optical transmitter 201 is configured to emit light according to the optical driving signal, that is, generate an uplink optical signal, and inject the uplink optical signal into the bidirectional demultiplexer 202.
For example, the data carried by the uplink optical signal may be represented as data transmitted to other devices when the optical device where the optical transceiver component is located is used as a transmitting end. The optical transmitter 201 may transmit data to be transmitted of the optical device where the optical transceiver component is located to an access device on an upper layer based on an optical fiber in the form of an uplink optical signal, and then transmit the data to a core network.
2) The bidirectional demultiplexer 202 is configured to perform bidirectional wavelength division multiplexing processing on the uplink optical signal and the downlink optical signal according to wavelength, and may be referred to as a Wavelength Division Multiplexing (WDM) + bidirectional (BiDi) structure. In an optical communication system, the wavelength of the upstream optical signal may be 1270nm and/or 1310nm, and the wavelength of the downstream optical signal may be 1490nm and/or 1577nm. In practice, the bidirectional splitter 202 may be configured to receive an upstream optical signal and transmit the upstream optical signal into an optical fiber. And the bidirectional splitter 202 may be further configured to receive a downlink optical signal from the optical fiber and transmit the downlink optical signal to the optical receiver 203.
The data carried by the downlink optical signal may be represented as data sent by other devices when the optical device where the optical transceiver component is located is used as a receiving end. The downlink optical signal subjected to the wavelength division processing by the bidirectional wavelength divider 202 may be received by the optical receiver 203, and subjected to photoelectric conversion to obtain carried data.
Illustratively, the bidirectional splitter 202 may be fabricated on the basis of an optical waveguide chip, and the transmission of the optical signal is realized through an optical waveguide. Also, the bidirectional splitter 202 may be coupled to the optical transmitter 201 through a first optical waveguide port, to the optical receiver 203 through a second optical waveguide port, and to the optical fiber through a third optical waveguide port. Therefore, through the optical transceiving component provided by the application, the bidirectional wave splitter prepared by the optical waveguide chip can realize the optical signal transceiving function realized by the BOSA structure adopted in the prior art. In addition, compared with a BOSA structure, the optical transceiving component of the bidirectional wave splitter prepared based on the optical waveguide chip has the advantages of small integration difficulty and low cost.
Optionally, the optical waveguide chip may be a planar light wave circuit (PLC) chip, or may be understood as a chip integrated based on a PLC technology; or alternatively a silicon-based chip, etc. It should be noted that PLC is a technology for realizing optical waveguide transmission. The chip integrated by the PLC technology can be realized based on various materials, the silicon dioxide material is most widely adopted in the current market application, namely the chip integrated by the PLC technology can be used as a cladding based on the silicon dioxide material with the characteristic of low refractive index, and an optical waveguide with the refractive index higher than that of the silicon dioxide cladding is wrapped in the inner layer. Thus, overflow of the optical signal transmitted through the optical waveguide can be avoided by the silica cladding, so that loss of energy of the optical signal can be avoided.
It is understood that the bidirectional splitter 202 may include an optical waveguide and a silica cladding. The silica cladding has the characteristic of low refractive index, so that transmission of optical signals can be guaranteed, and power loss of the optical signals is reduced. The optical waveguide may be designed by using a Directional Coupler (DC) structure, a Mach Zehnder Interferometer (MZI) structure, an Arrayed Waveguide Grating (AWG) structure, or the like. The operation principle of the bidirectional splitter 202 using optical waveguides with different structures will be described with reference to fig. 3a to 3 d.
Referring to fig. 3a, a schematic structural diagram of an optical transceiver module 200 adopting a DC structure according to an embodiment of the present application is shown. In general a DC architecture may contain two input ports and two output ports. In the implementation of the present application, one of the two input ports of the DC structure is used as a port for injecting an uplink optical signal into the optical transceiver component 200 by the optical transmitter 201, that is, the first optical waveguide port shown in fig. 3a, and is assumed to be an a port; the other input port is assumed to be a port D as a port through which the optical transceiver module 200 receives a downlink optical signal from an optical fiber, i.e., the third optical waveguide port shown in fig. 3 a. And, one of the two output ports of the DC structure is used as a port for receiving the downlink optical signal from the optical transceiver component 200 by the optical receiver 203, that is, the second optical waveguide port shown in fig. 3a, which is assumed to be a port C; the other output port may be a spare port, may wait for a new function to be mined, etc., assuming B port.
Referring to fig. 3b, a signal transmission diagram of an optical transceiver module 200 adopting a DC structure according to an embodiment of the present application is provided based on the optical transceiver module 200 adopting a DC structure shown in fig. 3 a. According to the example of (a) in fig. 3b, assuming that the wavelength of the uplink optical signal is 1270nm, the uplink optical signal injected from the a port to the bidirectional splitter 202 by the optical transmitter 201 may be transmitted into the optical fiber through the D port after passing through the optical waveguide of the DC structure. According to the example of (b) in fig. 3b, assuming that the wavelength of the downlink optical signal is 1577nm, after the downlink optical signal transmitted from the optical fiber at the d port passes through the optical waveguide of the DC structure, the downlink optical signal can be transmitted to the optical receiver 203 through the C port for reception.
It should be noted that, in the implementation of the present application, the optical waveguide of the DC structure can implement transmission of an optical signal of 1270nm from the upper waveguide to the lower waveguide, and can implement transmission of an optical signal of 1577nm from the lower waveguide to the upper waveguide to the lower waveguide, so that the length of the DC structure can be designed to be an optical waveguide in a specified length range, and the optical waveguide in the specified length range can implement an optical signal transmission path as shown in fig. 3 b. In this way, the uplink optical signal and the downlink optical signal can be respectively processed according to different wavelength characteristics by the DC structure, and thus, the optical signal transceiving function of the optical transceiving module 200 can be realized.
Fig. 3c is a schematic structural diagram of an optical transceiver module 200 using an MZI structure according to an embodiment of the present disclosure. The principle of the MZI structure is mainly that optical waveguides with different lengths are constructed, so that optical signals are mutually interfered after being transmitted through different optical paths, and finally, the optical signals with different wavelengths can be respectively output from two different ports. For example, the MZI structure shown in FIG. 3c comprises two lengths of optical waveguide. The downlink optical signal and the uplink optical signal can be respectively transmitted through two optical waveguides with different lengths in the MZI structure, so that the downlink optical signal and the uplink optical signal can be output from different ports, the wavelength division processing of the optical transceiving module on the downlink optical signal and the uplink optical signal is guaranteed, and the optical transceiving module 200 can be guaranteed to realize the optical signal transceiving function.
Referring to fig. 3d, a schematic structural diagram of an optical transceiver device 200 using an AWG structure according to an embodiment of the present application is shown. The AWG structure can be divided into a waveguide array and a plurality of ports on two sides of the waveguide array, and optical signals can generate a certain phase difference after passing through the waveguide array, so that the optical signals with different wavelengths can be transmitted out from different specified ports. Based on this, as shown in fig. 3d, in the implementation of the present application, the AWG structure may be adopted to input an uplink optical signal from one port on the left side of the waveguide array (i.e., the first optical waveguide port described in the foregoing embodiment), and output an uplink optical signal from a designated port on the right side of the waveguide array (i.e., the third optical waveguide port described in the foregoing embodiment); and it can also be realized that a downlink optical signal is input from one port on the right side of the waveguide array (i.e. the third optical waveguide port described in the foregoing embodiment), and a downlink optical signal is output from a designated port on the left side of the waveguide array (i.e. the second optical waveguide port described in the foregoing embodiment).
It should be noted that the designated port on the right side of the waveguide array for outputting the uplink optical signal may be the same as the port for inputting the downlink optical signal, and may be understood as a third optical waveguide port; the port of the left side of the waveguide array for inputting the uplink optical signal is different from the port for outputting the downlink optical signal, and can be understood as a first optical waveguide port and a second optical waveguide port. Therefore, the downlink optical signal can be received from a transmission port different from the uplink optical signal, so that the uplink optical signal and the downlink optical signal can be respectively processed according to different characteristics of wavelengths.
3) The light receiver 203 may be, for example, a detector. The detector may be implemented generally as an Avalanche Photodiode (APD). The optical receiver 203 may be configured to detect and receive the downlink optical signal.
4) An optical fiber port for connecting the optical transceiver module 200 to an optical fiber, such as the third optical waveguide port shown in fig. 2. Illustratively, the optical transceiver module 200 may implement optical signal transmission with an optical device such as the optical splitter 100 shown in fig. 1 through a connected optical fiber.
In another possible example, the optical transceiver module 200 provided herein may further include a signal amplifier 204. Fig. 4 is a schematic structural diagram of another optical transceiver module 200 according to an embodiment of the present disclosure. An input of the signal amplifier 204 may be connected to an output of the optical receiver 203. The signal amplifier 204, which may be generally implemented by a Trans Impedance Amplifier (TIA), may be configured to amplify the downlink optical signal received by the optical receiver 203, so as to ensure a signal gain of the received downlink optical signal.
In addition, in order to realize the operation of the optical transceiver module 200, a processor and an optical control chip may be further included in the optical device including the optical transceiver module 200. The processor may be, for example, a CPU (central processing unit), and a general implementation form may be a PON Media Access Control (MAC) chip, which is used to encode application data, encapsulate the application data into a data packet conforming to an optical transmission protocol, and send the data packet to an optical control chip. The optical control chip, i.e. the driving chip, may receive the data packet sent by the processor, and convert the data packet into an optical driving signal (analog signal) to drive the optical transmitter 201 to generate an uplink optical signal.
In order to improve the transmission efficiency of the optical transceiving module 200 during transceiving optical signals and ensure the transmission power of the optical signals, in the application, a mode spot converter may also be used to implement coupling at the optical waveguide port where the bidirectional splitter 202 is connected to the optical transmitter 201 and/or the optical fiber, that is, the first optical waveguide port and/or the third optical waveguide port described in the foregoing embodiment. Therefore, matching of optical signals transmitted between ports with different spot sizes can be achieved through the spot size converter, so that more accurate coupling between the ports of the two optical devices can be achieved, and loss in the optical signal transmission process is reduced.
Taking a DC structure as an example of the bidirectional splitter 202, referring to fig. 5, a schematic structural diagram of another optical transceiver module 200 according to an embodiment of the present application is provided.
At the first optical waveguide port, the coupling may be implemented by a first Spot Size Converter (SSC) 1, an input end of the SSC1 may be connected to the optical transmitter 201, and an output end may be connected to the bidirectional splitter 202.SSC1 may be configured to convert a spot size of an uplink optical signal output by the optical transmitter 201 into a spot size of an uplink optical signal received by the bidirectional splitter 202 through the first optical waveguide port. Illustratively, the spot-size converter may be tapered or inverse tapered. Alternatively, SSC1 may be tapered if the optical spot size of the uplink optical signal output by the optical transmitter 201 is larger than the optical spot size of the uplink optical signal received by the bidirectional splitter 202 through the first optical waveguide port. SSC1 may be in a reverse taper shape if the spot size of the uplink optical signal output by the optical transmitter 201 is smaller than the spot size of the uplink optical signal received by the bidirectional splitter 202 through the first optical waveguide port.
Moreover, at the port of the first optical waveguide, the end face coupling can be performed by adopting a flip-chip bonding process, so that the transmission power of the optical signal can be ensured in a simple packaging manner.
Similarly, at the third optical waveguide port, a second spot size converter SSC2 may be similarly arranged to realize coupling, and the input end of SSC2 may be connected to the output end of the bidirectional splitter 202, and the output end of SSC2 is connected to the optical fiber. SSC2 may be used to convert the spot size of the uplink optical signal output by the bidirectional splitter 202 through the third optical waveguide port into the spot size of the uplink optical signal that the optical fiber may receive. Alternatively, the SSC2 may be further configured to convert a light spot size of a downlink optical signal transmitted by an optical fiber into a light spot size of a downlink optical signal that can be received by the bidirectional optical splitter 202. Like SSC1, SSC2 can also be conical or inverted conical, and the specific shape can be designed according to actual requirements.
It should be noted that the first spot size converter and/or the second spot size converter may also be in other shapes, and may be designed according to the practical application scenario of the optical transceiver module. Taking SSC2 as an example, SSC2 may also be a grating SSC or the like, so that more efficient coupling between the optical fiber and the optical waveguide included in the bidirectional splitter 202 can be achieved. In which, by the processing of the grating type SSC, assuming that the size of an input spot is 4 μm × 4 μm in size, after entering the grating type SSC, it can be converted stepwise to 4 μm × 10 μm and then further to 10 μm × 10 μm. Thus, the spot conversion processing of the grating SSC can convert the spot size of 4 μm × 4 μm at the input end into the spot size of 10 μm × 10 μm at the output end, thereby ensuring the power of the optical signal.
Fig. 6 is a schematic structural diagram of an optical transceiver module according to an embodiment of the present disclosure. In this example, at the third optical waveguide port, the grating-type SSC can be designed to implement the conversion of the spot size of the uplink optical signal output from the bidirectional splitter 202 into the spot size of the uplink optical signal that can be received in the optical fiber.
Moreover, at the second optical waveguide port where the optical receiver 203 is coupled with the bidirectional splitter 202, an inclined total reflection surface can be designed by adopting a polishing process, so that the optical receiver 203 can effectively detect and receive the downlink optical signal. Referring to fig. 7a, a diagram of optical signal transmission at a second optical waveguide port according to an embodiment of the present application is shown. At the second optical waveguide port, the optical receiver 203 may be tiled above the diplexer 202, and the downstream optical signal may be efficiently received by the optical receiver 203 after being reflected by the inclined total reflection surface at the second optical waveguide port.
Alternatively, referring to fig. 7b, another optical signal transmission diagram at the second optical waveguide port is provided in the embodiment of the present application. The optical receiver 203 may also be disposed between a Printed Circuit Board (PCB) board and the bidirectional splitter 202, wherein the PCB board and the bidirectional splitter 202 may be supported by a pad to have a space in which the optical receiver 203 is disposed. As shown in fig. 7b, the downstream optical signal can be effectively received by the optical receiver 203 after being reflected by the inclined total reflection surface at the second optical waveguide port.
The embodiment of the present application further provides an optical device, which may include the optical transceiver module, the processor and the optical control chip as described in the foregoing embodiments. The processor may be configured to encode the application data, encapsulate the application data into a data packet conforming to an optical transmission protocol, and send the data packet to the optical control chip. The optical control chip may receive the data packet sent by the processor, and convert the data packet into an optical driving signal (analog signal) to drive an optical transmitter included in the optical transceiver component to generate an uplink optical signal. Since the optical device proposed herein includes the optical transceiver module described in the above embodiments, the optical device also has the technical effects of the optical transceiver module.
In the embodiments of the present application, unless otherwise specified or conflicting with respect to logic, the terms and/or descriptions in different embodiments have consistency and may be mutually cited, and technical features in different embodiments may be combined to form a new embodiment according to their inherent logic relationship.
In this application, the word "exemplary" is used to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments or designs. Or it may be appreciated that the use of the word exemplary is intended to present concepts in a concrete fashion, and is not intended to limit the scope of the present application. The power of the optical signal may also be referred to as optical power in this application.
It is to be understood that the various numerical designations referred to in this application are merely for convenience of description and are not intended to limit the scope of the embodiments of the present application. The sequence numbers of the above-mentioned processes do not mean the execution sequence, and the execution sequence of the processes should be determined by their functions and inherent logic. Furthermore, the terms "comprises" and "comprising," as well as any variations thereof, are intended to cover a non-exclusive inclusion, such as a list of steps or elements. The methods, systems, articles, or apparatus need not be limited to the explicitly listed steps or elements, but may include other steps or elements not expressly listed or inherent to such processes, methods, articles, or apparatus.
Although the present application has been described in conjunction with specific features and embodiments thereof, it will be evident that various modifications and combinations can be made thereto without departing from the spirit and scope of the application. Accordingly, the specification and drawings are merely illustrative of the solution defined by the appended claims and are intended to cover any and all modifications, variations, combinations, or equivalents within the scope of the application.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the embodiments of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to encompass such modifications and variations.
Claims (10)
1. An optical transceiver module, comprising: the optical transmitter, the bidirectional wave separator and the optical receiver;
the bidirectional wave splitter is coupled with the optical transmitter through a first optical waveguide port, coupled with the optical receiver through a second optical waveguide port and coupled with an optical fiber through a third optical waveguide port; the bidirectional wave separator is prepared on the basis of an optical waveguide chip;
the optical transmitter is used for generating an uplink optical signal and injecting the uplink optical signal into the bidirectional wave splitter;
the bidirectional wave splitter is used for transmitting the uplink optical signal into the optical fiber; receiving a downlink optical signal from the optical fiber and transmitting the downlink optical signal to the optical receiver;
the optical receiver is configured to receive the downlink optical signal.
2. The optical transceiver component of claim 1, wherein the optical transmitter is end-coupled to the first optical waveguide port of the diplexer using a flip-chip bonding process.
3. The optical transceiver component of claim 1, wherein the second optical waveguide port is designed as an inclined total reflection surface using a polishing process, and the optical receiver is configured to receive a downlink optical signal after being transmitted through the inclined total reflection surface.
4. The optical transceiver module of any one of claims 1 to 3, further comprising a signal amplifier; and the input end of the signal amplifier is connected with the output end of the optical receiver and is used for amplifying the downlink optical signal received by the optical receiver.
5. The optical transceiver module of any one of claims 1-4, further comprising a first spot size converter; the input end of the first spot size converter is connected with the optical transmitter, the output end of the first spot size converter is connected with the first optical waveguide port of the bidirectional wave splitter, and the first spot size converter is used for converting the spot size of the uplink optical signal output by the optical transmitter into the spot size of the uplink optical signal received by the bidirectional wave splitter through the first optical waveguide port.
6. The optical transceiver component of claim 5, wherein the first spot size converter is a tapered spot size converter, an inverted tapered spot size converter, or a grating spot size converter.
7. The optical transceiver module of any one of claims 1-4, further comprising a second spot size converter; the input end of the second spot size converter is connected with a third optical waveguide port of the bidirectional wave splitter, and the output end of the second spot size converter is connected with the optical fiber and used for converting the spot size of the uplink optical signal output by the bidirectional wave splitter through the third optical waveguide port into the spot size of the uplink optical signal received by the optical fiber.
8. The optical transceiver component of claim 7, wherein the second spot size converter is a tapered spot size converter, an inverted tapered spot size converter, or a grating spot size converter.
9. The optical transceiver component of any one of claims 1-8, wherein the optical waveguide chip is a planar optical waveguide chip.
10. The optical transceiver component of any one of claims 1 to 9, wherein the bidirectional splitter comprises an optical waveguide and a silica cladding; the optical waveguide is designed by adopting a directional coupler DC structure, a Mach-Zehnder interferometer MZI structure or an arrayed waveguide grating AWG structure.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110696439.2A CN115508954A (en) | 2021-06-23 | 2021-06-23 | Optical transceiver module |
| PCT/CN2022/100516 WO2022268131A1 (en) | 2021-06-23 | 2022-06-22 | Optical transceiving assembly |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110696439.2A CN115508954A (en) | 2021-06-23 | 2021-06-23 | Optical transceiver module |
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| CN115508954A true CN115508954A (en) | 2022-12-23 |
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| CN202110696439.2A Pending CN115508954A (en) | 2021-06-23 | 2021-06-23 | Optical transceiver module |
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| WO (1) | WO2022268131A1 (en) |
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| CN115865206A (en) * | 2023-02-23 | 2023-03-28 | 深圳市力子光电科技有限公司 | Optical transceiver module, combined optical module and optical network equipment |
| WO2024199417A1 (en) * | 2023-03-31 | 2024-10-03 | 华为技术有限公司 | Optical transceiving asssembly, optical module, and communication device |
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Also Published As
| Publication number | Publication date |
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| WO2022268131A1 (en) | 2022-12-29 |
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