CN115472539A - Tray structure and rubber coating process thereof - Google Patents
Tray structure and rubber coating process thereof Download PDFInfo
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- CN115472539A CN115472539A CN202211068607.4A CN202211068607A CN115472539A CN 115472539 A CN115472539 A CN 115472539A CN 202211068607 A CN202211068607 A CN 202211068607A CN 115472539 A CN115472539 A CN 115472539A
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- frame
- silicone rubber
- tray body
- tray
- chip
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- 238000000034 method Methods 0.000 title claims abstract description 14
- 230000008569 process Effects 0.000 title claims abstract description 13
- 238000010073 coating (rubber) Methods 0.000 title abstract description 5
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 69
- 239000004945 silicone rubber Substances 0.000 claims abstract description 58
- 239000000463 material Substances 0.000 claims abstract description 23
- 239000003292 glue Substances 0.000 claims abstract description 15
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 239000000084 colloidal system Substances 0.000 claims description 8
- 239000004033 plastic Substances 0.000 claims description 7
- 229920003023 plastic Polymers 0.000 claims description 7
- -1 FPM Polymers 0.000 claims description 6
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 6
- 239000004944 Liquid Silicone Rubber Substances 0.000 claims description 4
- 239000002033 PVDF binder Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 4
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 4
- 229920002943 EPDM rubber Polymers 0.000 claims description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 3
- 230000003044 adaptive effect Effects 0.000 claims description 3
- 229920000457 chlorinated polyvinyl chloride Polymers 0.000 claims description 3
- 229920005560 fluorosilicone rubber Polymers 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- 229920001084 poly(chloroprene) Polymers 0.000 claims description 3
- 229920002857 polybutadiene Polymers 0.000 claims description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 3
- 229920002554 vinyl polymer Polymers 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 2
- 229920002050 silicone resin Polymers 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
- 230000007306 turnover Effects 0.000 abstract description 7
- 230000033001 locomotion Effects 0.000 abstract description 5
- 230000004308 accommodation Effects 0.000 abstract description 2
- 230000006978 adaptation Effects 0.000 abstract 1
- 238000005253 cladding Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 43
- 229920001971 elastomer Polymers 0.000 description 5
- 239000005060 rubber Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000007779 soft material Substances 0.000 description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229920003189 Nylon 4,6 Polymers 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004693 Polybenzimidazole Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 229920002873 Polyethylenimine Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical class N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003208 poly(ethylene sulfide) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920002480 polybenzimidazole Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
- H01L21/67336—Trays for chips characterized by a material, a roughness, a coating or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention relates to the field of chip loading and discloses a tray structure and a rubber coating process of the tray structure. The method comprises the following steps: the tray body is located the upper and lower two surfaces of tray body and is equipped with first frame respectively and with the second frame of first frame looks adaptation in order to form the accommodation cavity, cladding in the silastic-layer of first frame and second frame internal face and outer wall, the both ends on silastic-layer outwards extend, are located to be equipped with the glue film between first frame and second frame and the silastic-layer. The surface of the tray body, which is in contact with the chip, is provided with a flexible material, the flexible material has elasticity and can clamp the chip to fix the chip, and the flexible material is matched with a limited space and a limited structure to reduce relative motion between the tray body and the chip, so that the damage to the surface of the chip during transportation or turnover is reduced. The glue layer is arranged between the tray body and the silicone rubber layer, so that the surface cohesiveness between the tray body and the silicone rubber layer is increased, the tray body is well adhered together, and deformation and falling caused by different shrinkage rates are avoided.
Description
Technical Field
The invention relates to the field of chip loading, in particular to a tray structure and a rubber coating process of the tray structure.
Background
In recent years, with the development of the domestic electronic industry, china has become the first electronic country in the world, and the production quantity of chips is rapidly increased. The manufactured chip is a critical step in the transfer or transportation of the chip.
In the prior art, an automatic handling device is generally adopted to place a single chip into the accommodating space of the tray, then a large number of chips are transported to a required place through the stacking placement of the trays,
however, the present inventors found the following drawbacks in the examples: during the tray that bears the weight of the chip removes, has enough to meet the need or transports, makes the chip do relative motion in the accommodation space easily to damage the chip, influence the use, increase the defective rate. Meanwhile, part of the chips need to be put into an oven for baking, and the tray structure is difficult to maintain the original physical properties and mechanical structure at high temperature. In order to solve the above problems, the rigid material is usually coated with the soft material, but the surfaces of the rigid material and the soft material have low adhesion, and are difficult to adhere to the tray, especially in a high-temperature environment, the rigid material and the soft material are easy to deform each other due to the difference between the shrinkage rate and the shrinkage rate, the mechanical structure is unstable, the size is not up to standard, and even the rigid material and the soft material are separated from each other.
Disclosure of Invention
In order to solve the technical problems, the invention provides a tray structure and a packaging process of the tray structure, so that the surface of a chip is prevented from being damaged during turnover or transportation.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a tray structure comprising:
the tray body is stacked;
a first frame and a second frame which is matched with the first frame to form an accommodating cavity are respectively arranged on the upper surface and the lower surface of the tray body;
and the silicone rubber layer is coated on the inner wall surfaces and the outer wall surfaces of the first frame and the second frame, and two ends of the silicone rubber layer extend outwards.
As a preferable scheme of the present invention, a glue layer is disposed between the first frame and the silicone rubber layer.
As a preferable scheme of the invention, the glue layer is a one-liquid type silane coupling agent which is composed of lower alcohol, fat, organic silicon resin and a silane coupling agent.
As a preferred scheme of the invention, the silicone rubber layer is made of liquid silicone rubber, polybutadiene rubber, CSM, vinyl silicone rubber, low phenyl silicone rubber, room temperature vulcanized silicone rubber, EPDM, neoprene, FPM, fluorosilicone rubber, PE, PP, PVC-U, PVC-C, ABS, PVDF or AB rubber.
As a preferable scheme of the present invention, the first frame is surrounded by the upper frame, the middle frame and the lower frame to form a placement space for two products, and the placement space is arranged intermittently.
As a preferable scheme of the invention, chamfered edges are arranged at the corners of the inner sides of the upper frame, the middle frame and the lower frame.
As a preferable scheme of the present invention, the second frames are in a group of two and are arranged in a step shape; and a clamping groove clamped with the middle frame is arranged between the two second frames.
As a preferable aspect of the present invention, a corner of the second frame near the outer side abuts against the chamfered edge of the first frame.
As a preferable scheme of the present invention, the tray body is molded by using a heat-resistant plastic material.
As a preferable scheme of the present invention, through holes are provided at discontinuous middle sections of the first frame and the second frame on the tray body, and the silicone rubber layer is provided in the through holes to connect the silicone rubber layer on the first frame and the second frame.
As a preferable aspect of the present invention, a connection groove filled with silicon rubber is formed in the tray body, and both ends of the silicon rubber are respectively disposed between the silicon rubber layers on one of the first frame and the second frame and between the silicon rubber layers on the other of the first frame and the second frame.
As a preferable aspect of the present invention, the upper and lower surfaces of the tray body are provided with a baffle plate for separating the first frame from the second frame, and the baffle plate includes an upper limiting plate and a lower limiting plate, and is arranged in a staggered manner.
As a preferable aspect of the present invention, the tray body and the silicone rubber layer contain a conductive material.
A process for encapsulating a tray structure, comprising:
selecting high-temperature-resistant plastic materials and integrally forming a tray body through an injection molding process;
coating the colloid on the inner wall surfaces and the outer wall surfaces of the first frame and the second frame of the tray body through a coating machine to form glue layers, and then baking;
and putting the baked tray body into a forming groove of an adaptive mold, closing the mold, coating the silicone rubber on the part coated with the colloid by an injection process, and vulcanizing and shaping to tightly connect the colloid with the tray body.
In conclusion, the invention has the following beneficial effects:
the surface of the tray body, which is in contact with the chip, is provided with a flexible material which has elasticity and can clamp the chip to fix the chip, and the flexible material is matched with a limited space and a limited structure to reduce relative motion between the flexible material and the tray body, so that the damage to the surface of the chip during transportation or turnover is reduced.
The tray body and the silicone rubber layer are made of high-temperature-resistant materials, the performance and the structure of the tray body and the silicone rubber layer cannot be greatly changed along with the rise of temperature, and the stability is guaranteed.
The glue layer is arranged between the tray body and the silicone rubber layer, so that the surface cohesiveness between the tray body and the silicone rubber layer is increased, the tray body is well adhered together, and deformation and falling caused by different shrinkage rates are avoided.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic view of a conventional tray structure according to the present invention.
Fig. 2 is a schematic cross-sectional structural view of the pallet body with a silicone rubber layer according to the present invention.
FIG. 3 is a schematic cross-sectional view of the tray body with a glue layer according to the present invention.
FIG. 4 is an enlarged schematic view of FIG. 3A according to the present invention.
FIG. 5 is a schematic view of the upper and lower surfaces of the pallet body with silicone rubber layers according to the present invention.
Fig. 6 is a schematic view of the upper and lower surface structures of the tray body of the present invention.
The numbers and letters in the figures represent the respective part names:
1. a substrate; 10. a support frame; 11. a storage groove; 2. a tray body; 21. a first frame; 210. chamfering edges; 211. putting the frame on; 212. a middle frame; 213. a lower frame; 22. a second frame; 3. a glue layer; 4. a silicone rubber layer; 5. a baffle plate; 50. a lower limiting plate; 51. an upper limiting plate; 6. a through hole; 7. connecting grooves; 8. a clamping groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, a tray structure according to the prior art will be described with reference to a specific embodiment.
The substrate comprises a substrate 1 and object placing grooves 11 distributed in the substrate 1 at intervals, wherein the object placing grooves 11 are formed by surrounding support frames 10 in a surrounding mode.
The side end faces of the chips are abutted against the inner walls of the support frames 10, and the lower surfaces of the chips are in contact with the tray body 2, and the chips are transported or circulated through the stacked substrates 1.
The tray structure is in hard contact with the chip, so that the surface of the chip is easily damaged in the transportation or turnover process, and the protection of the chip is reduced.
In order to solve the problems, the technical scheme of the invention provides a tray structure and an encapsulation process of the tray structure, wherein a flexible material is arranged on the surface, which is in contact with a chip, of a tray body 2, the flexible material has elasticity and can clamp the chip to fix the chip, and the relative motion between the flexible material and the tray body 2 is reduced by matching with a limited space and a limited structure, so that the damage to the surface of the chip during transportation or turnover is reduced.
As shown in FIG. 2, the following is a specific embodiment of the present invention
The tray body 2 is formed by adopting a heat-resistant plastic material, the material can be made of CIPI, PEEK, PAI, PBI, PEI, PPS, nylon 46, PSU, PES, PTFE, PVDF and other plastic materials, the performance and the structure of the tray body cannot change greatly along with the rise of temperature, and the structural stability is ensured.
The upper and lower surfaces of the tray body 2 are respectively provided with a first frame 21 and a second frame 22 which is matched with the first frame 21 to form a containing cavity, and the position of the first frame 21 is changed along with different types and structures of chips.
And the silicone rubber layer 4 is coated on the inner wall surfaces and the outer wall surfaces of the first frame 21 and the second frame 22, and two ends of the silicone rubber layer 4 extend outwards.
Specifically, as shown in fig. 6, through holes 6 are provided at the intermittent middle sections of the first frame 21 and the second frame 22 on the tray body 2, and silicone rubber layers 4 are provided in the through holes 6 to connect the silicone rubber layers 4 on the first frame 21 and the second frame 22.
As shown in fig. 5 and 6, the tray body 2 is provided with a connecting groove 7 filled with silicone rubber, both ends of which are respectively provided between the silicone rubber layers 4 on one of the first frame 21 and the second frame 22 and between the silicone rubber layers 4 on the other of the first frame 21 and the second frame 22.
The through holes 6 and the connecting grooves 7 are arranged to integrally form the silicone rubber layers 4 on the first frame 21 and the second frame 22 and the silicone rubber layers 4 on each group of the first frame 21 and the second frame 22, so that the stability of the silicone rubber layers 4 is improved, the forming steps are reduced, and the silicone rubber layers 4 are made of the same material.
The upper and lower surfaces of the tray body 2 are provided with baffle plates 5 for separating the first frame 21 and the second frame 22, and the baffle plates 5 include upper and lower limiting plates 51 and 50, which are arranged in a staggered manner.
When two tray bodies 2 are stacked, the silicon rubber positioned in the connecting groove 7 is pressed and covered by the limitation of the upper limiting plate 51 and the lower limiting plate 50, the tilting deformation is avoided, and the overall performance of the silicon rubber layer 4 is prevented from being influenced.
The first frame 21 is enclosed by the upper frame 211, the middle frame 212 and the lower frame 213 to form a placement space for two product chips, and is disposed intermittently. After the chip is placed on the first frame 21, the ventilation on the surface of the chip during baking can be facilitated, the heat is prevented from being concentrated and not easy to radiate, and meanwhile, the chip is conveniently taken out from the frame.
The inner corners of the upper frame 211, the middle frame 212, and the lower frame 213 are provided with chamfered edges 210, so that the chip can be smoothly loaded, and the chip can be prevented from being placed unstably or being clamped on the inner wall surface of the first frame 21, so that the chamfered edges 210 have a guiding function.
The second frames 22 are in a group of two and are arranged in a step shape; a slot 8 engaged with the middle frame 212 is provided between the two second frames 22.
Make two tray body 2 pile up the location more accurate and firm, avoid in turnover or transportation, the tray offsets a section distance slightly, takes place the dislocation between two trays promptly, causes the tray to place unstably.
The corner of the second frame 22 near the outer side is abutted against the chamfered edge 210 of the first frame 21. The movement space of the chip is limited in the first frame 21, and the silicon rubber layers 4 are arranged on the peripheral wall surfaces in the space, so that the chip can be better protected, and the surface damage of the chip caused by the fact that the chip can be contacted with other surfaces in the frame except for a small part on the periphery is avoided.
In the above embodiment, the silicone rubber layer 4 is made of one or more of liquid silicone rubber, polybutadiene rubber, CSM, vinyl silicone rubber, low phenyl silicone rubber, room temperature vulcanized silicone rubber, EPDM, chloroprene rubber, FPM, fluorosilicone rubber, PE, PP, PVC-U, PVC-C, ABS, PVDF, or AB rubber. In the invention, the combination of the liquid silicone rubber and the A B rubber is selected, so that the silicone rubber has viscosity, and simultaneously has excellent tear resistance, rebound resilience, yellowing resistance, thermal stability and heat resistance and aging resistance, and can be combined with the surface of the frame of the tray body 2 and expand the application scene.
As shown in fig. 3 and 4, in order to make the above-mentioned silicone rubber layer 4 and the frame combined more firmly, a rubber layer 3 is provided between the silicone rubber layer 4 and the first frame 21 and the second frame 22. The adhesive layer 3 is a one-liquid type silane coupling agent, which is composed of lower alcohol, fat, organic silicone resin and silane coupling agent. Wherein, the mass fractions are respectively 43 percent, 49.6 percent, 6.4 percent and 1 percent.
The adhesive layer 3 increases the surface adhesion between the tray body 2 and the silicone rubber layer 4, so that the tray body and the silicone rubber layer are well adhered together, and the deformation and the falling off of the silicone rubber layer 4 caused by different shrinkage rates are avoided.
The tray body 2 and the silicone rubber layer 4 also contain conductive materials. The charge accumulation or discharge is prevented to reduce the damage to the chip, and the conductive material can be polypyrrole, polyphenylene sulfide, poly phthalocyanine compounds, polyaniline, polythiophene and the like.
Correspondingly, the invention also provides a rubber coating process of the tray structure, which comprises the following steps: the tray body 2 is integrally formed by selecting high-temperature resistant plastic materials and adopting an injection molding process.
Then, the glue is applied to the inner wall surfaces and the outer wall surfaces of the first frame 21 and the second frame 22 of the tray body 2 by the coating machine to form a glue layer, and then, baking is performed.
Wherein the colloid has required concentration, and is dried for 10-30min after being coated, or is baked in oven at temperature of at most 80 deg.C for 3-8min,
and (3) putting the baked tray body 2 into a forming groove of an adaptive mold, closing the mold, coating the silicone rubber on the part coated with the colloid by an injection process, and after vulcanization forming, tightly connecting the rubber and the tray body 2.
In the above process, the glue may be applied to the tray body 2 with or without using a coater according to actual needs.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (14)
1. A tray structure, comprising:
the tray body is stacked;
a first frame and a second frame which is matched with the first frame to form an accommodating cavity are respectively arranged on the upper surface and the lower surface of the tray body;
and the silicone rubber layer is coated on the inner wall surfaces and the outer wall surfaces of the first frame and the second frame, and two ends of the silicone rubber layer extend outwards.
2. The tray structure of claim 1 wherein a glue layer is disposed between the first and second frames and the silicone rubber layer.
3. The tray structure of claim 2 wherein the glue layer is a one-part silane coupling agent consisting of a lower alcohol, a fat, an organic silicone resin and a silane coupling agent.
4. The tray structure according to claim 1, wherein said silicone rubber layer is made of liquid silicone rubber, polybutadiene rubber, CSM, vinyl silicone rubber, low phenyl silicone rubber, room temperature vulcanized silicone rubber, EPDM, chloroprene rubber, FPM, fluorosilicone rubber, PE, PP, PVC-U, PVC-C, ABS, PVDF or AB glue.
5. The tray structure of claim 1, wherein the first frame is enclosed by the upper frame, the middle frame and the lower frame to form a space for placing two products, and the space is arranged intermittently.
6. The tray structure of claim 5, wherein the corners of the upper frame, the middle frame and the lower frame near the inner side are provided with chamfered edges.
7. The tray structure of claim 5 wherein the second frames are in groups of two and are stepped; and a clamping groove clamped with the middle frame is arranged between the two second frames.
8. The tray structure of claim 6 wherein the corners of the second frame near the outside abut the chamfered edges of the first frame.
9. The tray structure of claim 1 wherein the tray body is molded from a heat resistant plastic material.
10. The pallet structure of claim 1 wherein said pallet body is provided with through holes at intermittent midsections of said first and second frames, said through holes being provided with said silicone rubber layer for connecting said silicone rubber layer on said first and second frames.
11. The tray structure according to claim 1, wherein connecting grooves filled with silicone rubber are formed in said tray body, and both ends of said silicone rubber are respectively provided between said silicone rubber layers on one of said first and second frames and between said silicone rubber layers on the other of said first and second frames.
12. The tray structure according to claim 1, wherein the upper and lower surfaces of the tray body are provided with baffle plates for separating the first frame from the second frame, and the baffle plates comprise upper and lower limiting plates and are arranged in a staggered manner.
13. The tray structure of claim 1 wherein said tray body and silicone rubber layer comprise a conductive material.
14. A process for over-molding a pallet structure according to any of claims 1-13, comprising:
selecting high-temperature-resistant plastic materials and integrally forming a tray body through an injection molding process;
coating the colloid on the inner wall surfaces and the outer wall surfaces of the first frame and the second frame of the tray body through a coating machine to form glue layers, and then baking;
and putting the baked tray body into a forming groove of an adaptive mold, closing the mold, coating the silicone rubber on the part coated with the colloid by an injection process, and vulcanizing and shaping to tightly connect the colloid with the tray body.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211068607.4A CN115472539A (en) | 2022-09-07 | 2022-09-07 | Tray structure and rubber coating process thereof |
| PCT/CN2022/138941 WO2024051021A1 (en) | 2022-09-07 | 2022-12-14 | Tray structure and rubber coating process for tray structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211068607.4A CN115472539A (en) | 2022-09-07 | 2022-09-07 | Tray structure and rubber coating process thereof |
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| Publication Number | Publication Date |
|---|---|
| CN115472539A true CN115472539A (en) | 2022-12-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202211068607.4A Pending CN115472539A (en) | 2022-09-07 | 2022-09-07 | Tray structure and rubber coating process thereof |
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| CN (1) | CN115472539A (en) |
| WO (1) | WO2024051021A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024051021A1 (en) * | 2022-09-07 | 2024-03-14 | 苏州东昊塑胶五金有限公司 | Tray structure and rubber coating process for tray structure |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2024051021A1 (en) | 2024-03-14 |
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