CN115458472A - Semiconductor supporting device - Google Patents
Semiconductor supporting device Download PDFInfo
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- CN115458472A CN115458472A CN202211410048.0A CN202211410048A CN115458472A CN 115458472 A CN115458472 A CN 115458472A CN 202211410048 A CN202211410048 A CN 202211410048A CN 115458472 A CN115458472 A CN 115458472A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 51
- 230000007246 mechanism Effects 0.000 claims description 21
- 230000008878 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 claims description 4
- 230000001360 synchronised effect Effects 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 abstract description 13
- 230000003749 cleanliness Effects 0.000 abstract description 10
- 235000012431 wafers Nutrition 0.000 description 102
- 238000000034 method Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 11
- 230000006872 improvement Effects 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000004308 accommodation Effects 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a semiconductor supporting device, which comprises: the device comprises a supporting pipe provided with a first supporting part, a lifting component and a driving device connected with the lifting component; the lifting assembly comprises: one end of the lifting rod, which is close to the first bearing part, is provided with a second bearing part; the lifting rod is connected to the driving device, and the driving device drives the lifting rod to drive the second bearing portion to lift along the longitudinal direction so as to alternately bear the wafer by the first bearing portion and the second bearing portion. Through arranging the first bearing part on the supporting pipe and the second bearing part on the lifting rod, when the driving device drives the lifting rod to drive the second bearing part to lift along the longitudinal direction, the first bearing part and the second bearing part can be alternately supported on the wafer, so that the technical problem that the wafer after being cleaned is polluted again is solved, and the cleaning cleanliness of the wafer is improved and guaranteed.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a semiconductor supporting device.
Background
The semiconductor is a material with conductivity between a conductor and an insulator at normal temperature. In a semiconductor (e.g., wafer) manufacturing process, a wafer needs to be carried to facilitate the manufacturing process of the wafer, such as: and cleaning and soaking the wafer. Therefore, when the wafer is subjected to the process manufacturing, the wafer needs to be supported by using the supporting device.
Chinese patent publication No. CN109701930A discloses a wafer cleaning and supporting apparatus for reducing scratches and water marks, which comprises a supporter, a water flow internal arrangement structure, a bottom frame, and an operating handle, wherein the bottom frame is a hollow rectangular frame, the operating handle is arranged in the middle of two long sides of the bottom frame, the operating handle is symmetrical with respect to the center of the bottom frame, and the operating handle is movably matched with the bottom frame.
However, in the wafer supporting device in the prior art, the wafer is supported by the same annular built-in plate before and after being cleaned, so that the cleaned wafer has the technical problem of being polluted again, and the cleanliness of the wafer is reduced.
In view of the above, there is a need for an improved semiconductor support apparatus of the prior art to solve the above problems.
Disclosure of Invention
The invention aims to disclose a semiconductor supporting device, which is used for solving various defects of a semiconductor supporting device in the prior art, in particular to solve the technical problem that a wafer after being cleaned is polluted again because the same supporting device is used for supporting the wafer before and after the wafer is cleaned, so as to achieve the purpose of improving the cleanliness of the wafer after being cleaned.
In order to achieve the above object, the present invention provides a semiconductor supporting apparatus, comprising:
the device comprises a supporting pipe provided with a first supporting part, a lifting component and a driving device connected with the lifting component;
the lifting assembly comprises:
one end of the lifting rod, which is close to the first bearing part, is provided with a second bearing part;
the lifting rod is connected to the driving device, and the driving device drives the lifting rod to drive the second bearing part to lift along the longitudinal direction so as to alternately bear the wafer by the first bearing part and the second bearing part.
As a further improvement of the present invention, when the driving device is connected to the lifting rod, the driving device drives the lifting rod to drive the second supporting portion to lift along the longitudinal direction, when the center of circle of the second supporting portion is higher than the center of circle of the first supporting portion, the second supporting portion supports the semiconductor, and when the center of circle of the second supporting portion is lower than the center of circle of the first supporting portion, the first supporting portion supports the semiconductor.
As a further improvement of the present invention, the semiconductor support apparatus further comprises:
the rotary tube is pivotally connected with the mounting part, and a fixed component and a driving mechanism are respectively arranged at the end parts of two ends of the rotary tube;
wherein, the lifter overlaps from inside to outside in proper order along longitudinal direction and establishes rotatory pipe and stay tube, the stay tube through first coupling assembling with fixed subassembly pivot connection, fixed subassembly is kept away from actuating mechanism one end with first bearing portion connects, the lifter is close to actuating mechanism one end is passed through third coupling assembling and drive arrangement pivot connection, the lifter is kept away from actuating mechanism one end pass through second coupling assembling with second bearing portion connects, drives first bearing portion rotates in a rotation plane, with synchronous drive second bearing portion is in rotate the in-plane rotation.
As a further improvement of the present invention, the first supporting portion is configured with a pivot, the second supporting portion forms a strip-shaped hole for the pivot to pass through, and the strip-shaped hole guides the pivot to apply a rotational tangential force to the second supporting portion, so that the first supporting portion drives the pivot to rotate in the rotation plane, and the second supporting portion is synchronously driven to rotate in the rotation plane.
As a further improvement of the present invention, the first bearing portion includes:
the supporting block is arranged on one side of the fixed plate, which is opposite to the supporting tube, and the pivot joint piece is arranged on the fixed plate;
the second bearing portion includes:
the lifting support plate is connected to the second connecting assembly, the bearing block is arranged on the lifting support plate and arranged on one side, back to the supporting pipe, of the lifting support plate, and the strip-shaped holes are arranged in the lifting support plate.
As a further improvement of the present invention, the first connection assembly includes:
a fixed shaft sleeve connected to the support tube, and a first bearing embedded in the fixed shaft sleeve;
the fixing assembly comprises:
the short pipe is connected to the fixed plate, the fastener penetrates through the first bearing and is in pivot connection with the fixed shaft sleeve, and the end parts of the two ends of the fastener are respectively connected to the short pipe and the rotating pipe;
the fastener is close to one end of the short pipe to form an annular structure which is expanded outwards and connected with the short pipe, and the annular structure extends to the fixed shaft sleeve and covers the fixed shaft sleeve close to one end of the short pipe so as to form a gap between the fixed shaft sleeve and the fastener.
As a further improvement of the present invention, the second connecting assembly includes:
the lifting support plate is arranged on the short pipe and is provided with a lifting support plate, a top plate connected to the lifting rod, a lifting column arranged on the top plate and facing one side of the lifting support plate, a mounting seat arranged on the short pipe and close to one end of the fixing plate, and a linear bearing arranged on the mounting seat;
wherein the lifting column penetrates through the linear bearing and is connected to the lifting support plate.
As a further improvement of the present invention, the third connecting assembly includes:
the sleeve joint is arranged at one end of the driving device, which is close to the lifting rod, and a second bearing and a lifting pin are embedded in the sleeve joint;
the lifting pin penetrates through the second bearing and extends into the sleeve joint, and one end, far away from the driving device, of the lifting pin is connected with the lifting rod.
As a further improvement of the present invention, the drive mechanism includes:
the driving device, the driving wheel, the driven wheel and the conveyor belt are in transmission connection with the driving wheel and the driven wheel;
the rotating pipe is close to one end of the driven wheel, a connecting shaft is embedded in the rotating pipe, and the driven wheel forms a rotating shaft connected with the connecting shaft.
As a further improvement of the present invention, the semiconductor support apparatus further comprises:
a base, a moving device connected to the base and reciprocating in a transverse direction, the moving device being provided with a lifting device, the support tube being connected to the lifting device.
Compared with the prior art, the invention has the beneficial effects that:
when the driving device drives the lifting rod to drive the second bearing part to lift along the longitudinal direction, the second bearing part can bear the wafer when the circle center of the second bearing part is higher than that of the first bearing part, and the first bearing part can bear the wafer when the circle center of the second bearing part is lower than that of the first bearing part. Therefore, different bearing parts can be adopted to bear the wafer before and after the wafer is cleaned, so that the technical problem that the cleaned wafer is polluted again is solved, and the cleaning cleanliness of the wafer is improved and guaranteed.
Drawings
FIG. 1 is a perspective view of a semiconductor support apparatus of the present invention;
FIG. 2 is a perspective view of a carrier assembly of a semiconductor support apparatus of the present invention;
FIG. 3 is a schematic view illustrating the first supporting portion supporting the wafer when the center n of the first supporting portion is higher than the center m of the second supporting portion;
FIG. 4 is a view showing when the center n of the first supporting portion is lower than the center m of the second supporting portion ， When the wafer is placed on the second supporting part, the wafer is supported by the second supporting part;
FIG. 5 is a cross-sectional view of the load bearing assembly of FIG. 2;
FIG. 6 is an enlarged view of FIG. 5 at dashed line box A;
FIG. 7 is an enlarged view of FIG. 5 at dashed line box B;
FIG. 8 is a perspective view of the first receiver of FIG. 2;
fig. 9 is a top view of the second bearing in fig. 2.
Detailed Description
The present invention is described in detail with reference to the embodiments shown in the drawings, but it should be understood that these embodiments are not intended to limit the present invention, and those skilled in the art should understand that functional, methodological, or structural equivalents or substitutions made by these embodiments are within the scope of the present invention.
It should be understood that in the present application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be considered as limiting the present disclosure.
In particular, in the following embodiments, the term "longitudinal direction b" refers to a direction parallel to the support tube 20. The term "transverse direction c" refers to a direction perpendicular to the longitudinal direction b.
One embodiment of a semiconductor support apparatus is disclosed with reference to figures 1 through 9. A semiconductor holding apparatus comprising: a base 4, a moving device 3 connected to the base 4 and reciprocating in a transverse direction, the moving device 3 being provided with a lifting device 2, and a mounting portion 10 connected to the lifting device 2, the mounting portion 10 being provided with a holding member 1. A holding device as described herein for holding a semiconductor. The semiconductor is placed into the semiconductor supporting device through the loading and unloading mechanical handle, then the semiconductor is moved to a working area through the cooperation of the moving device 3 and the lifting device 2, after the corresponding working procedure of the semiconductor is completed, the semiconductor before and after the process is alternately supported through the first supporting part 23 and the second supporting part 33 which are arranged on the supporting assembly 1, the semiconductor after the process is ensured not to be polluted, and then the semiconductor is taken back through the loading and unloading mechanical handle. The semiconductor supporting apparatus described in this embodiment is used for supporting a wafer, and it should be noted that, in this embodiment, the wafer cleaning process is taken as an example, but the invention is not limited to the wafer cleaning process, and can also be applied to the semiconductor technology field, such as: metal part processing, spraying and other technical fields. Of course, the supporting apparatus in this embodiment is not limited to the wafer cleaning process, and may also include some other processes such as wafer soaking.
Referring to fig. 1 to 9, in the present embodiment, a semiconductor wafer holding apparatus includes a holding member 1 including: a support pipe 20 provided with a first supporting part 23, a lifting assembly 30, and a driving device 34 connected with the lifting assembly 30, wherein the driving device 34 can adopt a cylinder; the lifting assembly 30 includes: a lifting rod 31, wherein a second supporting part 33 is arranged at one end of the lifting rod 31 close to the first supporting part 23; the lifting rod 31 is connected to the driving device 34, and the driving device 34 drives the lifting rod 31 to drive the second supporting portion 33 to lift along the longitudinal direction, so as to alternately support the wafer by the first supporting portion 23 and the second supporting portion 33.
When a conventional semiconductor supporting device in the prior art supports a wafer, the same supporting device is used for supporting the wafer before and after the wafer is cleaned, so that the wafer after being cleaned is polluted again, the cleaning cleanliness of the wafer is reduced, and the cleanliness of the wafer after being cleaned cannot be guaranteed.
However, in the semiconductor supporting apparatus of the present embodiment, when supporting the wafer, as shown in fig. 3, when the driving device 34 drives the lifting rod 31 to drive the second supporting portion 33 to move downward (i.e. along the direction indicated by the arrow p in fig. 3) along the longitudinal direction (i.e. the direction b in fig. 2), the supporting arc of the first supporting portion 23 is used to draw a circle d in fig. 3, the supporting arc of the second supporting portion 33 is used to draw a circle f in fig. 3, and the height of the center n of the circle d in the longitudinal direction is greater than the height of the center m of the circle f, the wafer is supported by the first supporting portion 23. When the driving device 34 drives the lifting rod 31 to drive the second supporting part 33 to move upwards (i.e. in the direction of arrow h in fig. 4) along the longitudinal direction (i.e. in the direction of b in fig. 2), the first supporting part is usedThe support arc line of 23 is rounded as a circle k in fig. 4, and the support arc line of the second support portion 33 is rounded as a circle g in fig. 4. When the center m of the circle g ， Is higher than the height of the center n of the circle k, the second supporting part 33 supports the circle k. Therefore, the wafer can be supported by the first supporting part 23 before the wafer is cleaned, the wafer can be supported by the second supporting part 33 after the wafer is cleaned, or the wafer can be supported by the second supporting part 33 before the wafer is cleaned, the wafer can be supported by the first supporting part 23 after the wafer is cleaned, and the wafer can be supported by different supporting parts before the wafer is cleaned and after the wafer is cleaned, so that the technical problem that the wafer after the wafer is cleaned is polluted again is solved, and the cleanliness of the wafer after the wafer is cleaned can be improved and ensured.
Illustratively, the driving device 34 may also be fixedly connected to the support tube 20, the driving device 34 may drive the support tube 20 to drive the first supporting portion 23 to lift in the longitudinal direction, when the height of the center of the first supporting portion 23 is greater than the height of the center of the second supporting portion 33, the first supporting portion 23 supports the wafer, and when the height of the center of the first supporting portion 23 is less than the height of the center of the second supporting portion 33, the second supporting portion 33 supports the wafer, which may also realize the alternate support of the first supporting portion 23 and the second supporting portion 33 to the wafer, so that different supporting portion wafers are used before and after the wafer is cleaned, so as to solve the technical problem of contamination of the wafer after the cleaning, and improve and ensure the cleanliness of the cleaned wafer.
For example, when the wafer is cleaned, the wafer may also be alternately supported and cleaned by the first supporting portion 23 and the second supporting portion 33, so as to avoid a portion that cannot be cleaned when the wafer is cleaned, and further improve the cleanliness of the wafer cleaning.
Preferably, as shown in figures 2, 6 and 7, the semiconductor holding apparatus further comprises: a mounting part 10 connected to the support pipe 20, a rotary pipe 40 pivotally connected to the mounting part 10, a fixed component 24 and a driving mechanism 50 respectively arranged at two end parts of the rotary pipe 40; the rotating pipe 40 and the support pipe 20 are sequentially sleeved on the lifting rod 31 from inside to outside along the longitudinal direction, the support pipe 20 is pivotally connected with the fixing component 24 through the first connecting component 21, one end of the fixing component 24 far away from the driving mechanism 50 is fixedly connected with the first supporting part 23, one end of the lifting rod 31 close to the driving mechanism 50 is pivotally connected with the driving device 34 through the third connecting component 32, one end of the lifting rod 31 far away from the driving mechanism 50 is fixedly connected with the second supporting part 33 through the second connecting component 22, and the first supporting part 23 is driven to rotate in a rotating plane 55 so as to synchronously drive the second supporting part 33 to rotate in the rotating plane 55. The mounting portion 10 includes: a frame 12 fixedly connected to the lifting device 2, and a fixing ring 11 arranged on the side of the frame 12 facing the support tube 20, the fixing ring 11 being fixedly connected to the support tube 20, and the rotary tube 40 being pivotally connected to the fixing ring 11. The wafer support apparatus disclosed in this embodiment can support 50 wafers. The specific process of loading and unloading the wafer by the supporting device is described by taking the first supporting part 23 as an example in the present embodiment. When the first supporting part 23 is close to the working table (not shown), the loading and unloading robot grips 25 wafers and loads them into one side of the first supporting part 23, then the driving mechanism 50 drives the rotating tube 40 to drive the first supporting part 23 and the second supporting part 33 to synchronously rotate 180 degrees, and the loading and unloading robot grips 25 wafers again and loads them into the other side of the first supporting part 23. In the present embodiment, since the standard of wafer clamping in the prior art is 25 wafers in one group, the loading robot loads 50 wafers into the first supporting part 23 twice when the supporting device supports the wafers. Of course, 50 wafers may be loaded into the second susceptor 33 in the same manner. When 50 wafers are loaded into the semiconductor supporting device, the moving device 3 drives the lifting device 2 to reciprocate along the transverse direction (i.e. the direction c in fig. 1), the lifting device 2 is matched with the supporting component 1 to reciprocate along the longitudinal direction, the wafer supported by the first supporting part 23 is moved to a working area, after the wafer cleaning process is completed, the driving device 34 drives the lifting rod 31 to drive the second connecting component 22 and the second supporting part 33 to move upwards until the circle center of the second supporting part 33 is higher than that of the first supporting part 23, the cleaned wafer is supported by the second supporting part 33, and finally the cleaned wafer is taken back by the loading and unloading manipulator. The wafer is supported by different supporting parts before and after being cleaned, so that the technical problem that the cleaned wafer is polluted again is solved, and the cleanliness of the cleaned wafer can be improved and guaranteed. It should be noted that the moving device 3, the lifting device 2 and the loading/unloading manipulator belong to the prior art, and the moving device 3, the lifting device 2 and the loading/unloading manipulator do not belong to the invention of the present application, so the description thereof is omitted in this embodiment. It should be noted that the angle of rotation of the first and second receivers 23, 33 controlled by the driving mechanism 50 is described below.
Preferably, referring to fig. 8 and 9, the first supporting portion 23 is configured with a pivot 233, the second supporting portion 33 is formed with a strip-shaped hole 333 and a through hole 334 through which the pivot 233 passes, and the strip-shaped hole 333 guides the pivot 233 to apply a tangential force to the second supporting portion 33, so that the first supporting portion 23 drives the pivot 233 to rotate in the rotation plane 55, so as to synchronously drive the second supporting portion 33 to rotate in the rotation plane 55. When the driving mechanism 50 drives the rotating tube 40 to drive the fixing component 24 and the first supporting portion 23 to rotate, the pivot member 233 can be driven to rotate, and the strip-shaped hole 333 guides the pivot member 233 to apply a rotating tangential force to the first supporting portion 23 to drive the second supporting portion 33 to rotate synchronously, so that the positions of the first supporting portion 23 and the second supporting portion 33 can be kept relatively unchanged, and the first supporting portion 23 and the second supporting portion 33 can be alternately supported before and after the wafer is cleaned, thereby preventing the wafer from being polluted again after the wafer is cleaned.
Preferably, as shown in fig. 8 and 9, the first bearing portion 23 includes: a fixing plate 231 fixedly connected with the fixing component 24, and a supporting block 232 disposed on the fixing plate 231 and opposite to the supporting tube 20, wherein the pivot member 233 is disposed on the fixing plate 231; the second bearing portion 33 includes: a lifting pallet 331 fixedly connected to the second connecting member 22, and a support block 332 disposed on the lifting pallet 331 and disposed opposite to the support tube 20, wherein a slot 333 is disposed on the lifting pallet 331. The support blocks 232 include a first support block 2321, a second support block 2322 and a third support block 2323. The heights of the first, second and third supporting blocks 2321, 2322 and 2323 in the longitudinal direction are different, and the cross-section of the first supporting surface 234 of the first, second and third supporting blocks 2321, 2322 and 2323 in the longitudinal direction is configured into an arc structure (not shown), so that a partial arc included in the circle d is formed at the first supporting portion 23. The three first supporting surfaces 234 can respectively form a plurality of tooth-shaped structures (not marked), and two adjacent tooth-shaped structures on each first supporting surface 234 form a first accommodating groove (not marked) for accommodating a wafer, so that the movement of the wafer can be limited from two side surfaces of the wafer by the two adjacent tooth-shaped structures, and the wafer is further ensured not to easily fall off in the cleaning or moving process.
Similarly, the holder block 332 includes a first holder block 3321, a second holder block 3322 and a third holder block 3323. First bearing blocks 3321, second bearing blocks 3322 and third bearing blocks 3323 have different heights in the longitudinal direction, and a cross section of second bearing surfaces 335 of first bearing blocks 3321, second bearing blocks 3322 and third bearing blocks 3323 in the longitudinal direction is configured in an arc structure (not shown), thereby forming a partial arc included in circle f in second bearing portion 33. A plurality of tooth-shaped structures (not shown) may be respectively formed on the three second supporting surfaces 335, and a second accommodating groove (not shown) for accommodating the wafer is formed by two adjacent tooth-shaped structures on each second supporting surface 335, so that the movement of the wafer may be limited by the two adjacent tooth-shaped structures from the two side surfaces of the wafer, and the wafer is further ensured not to easily drop during the cleaning or moving process.
In addition, taking the example of the semiconductor wafer holding apparatus holding 50 wafers at a time, 50 first accommodation grooves are provided in the first holding part 23, and 50 second accommodation grooves are provided in the second holding part 33 in order to alternately hold the wafers by the first holding part 23 and the second holding part 33. However, the semiconductor holding device is not limited to holding 50 wafers, and the number of the first receiving container and the second receiving container may be adjusted according to the actual situation of the semiconductor production.
Preferably, as shown in fig. 5 and 6, the first connection assembly 21 includes: a fixed boss 211 fixedly coupled to the support pipe 20, and a first bearing 212 disposed in the fixed boss 211. The fixing assembly 24 includes: a short pipe 242 fixedly connected to the fixing plate 231, and a fastening member 241 penetrating the first bearing 212 and pivotally connected to the fixing boss 211, both end portions of the fastening member 241 being connected to the short pipe 242 and the rotary pipe 40, respectively; wherein, the outer ring of the first bearing 212 is fixedly connected with the fixed shaft sleeve 211, and the fastening element 241 penetrates through the first bearing 212 and is fixedly connected with the inner ring of the first bearing 212. The fastening member 241 forms an annular structure (not shown) that is flared and connected to the short tube 242 near one end of the short tube 242, and the annular structure extends to the fixed boss 211 and covers the fixed boss 211 near the end of the short tube 242 to form a gap between the fixed boss 211 and the fastening member 241. The fastening member 241 is rotatably coupled to the fixed boss 211 through the first bearing 212. Meanwhile, the fastening member 241 is fixedly connected with the short pipe 242 to realize the rotary connection of the short pipe 242 with the fixed sleeve 211. When the driving mechanism 50 drives the rotating tube 40 to rotate around the central axis a, the rotating tube 40 drives the fastening member 241 and the short tube 242 to rotate, and since the short tube 242 is rotatably connected with the fixed shaft sleeve 211, the supporting tube 20 can be prevented from rotating synchronously with the rotating tube 40, and the supporting strength of the semiconductor supporting device can be increased. A gap is formed between the fixing boss 211 and the fastening member 241 in the longitudinal direction to prevent friction from being generated between the fastening member 241 and the fixing boss 211 when rotating. Illustratively, in the present embodiment, the fastening member 241 is a raised flange in the prior art.
Preferably, as shown in fig. 6, the second connecting assembly 22 includes: a top plate 221 fixedly connected to the lifting rod 31, a lifting column 222 disposed on the top plate 221 and facing one side of the lifting support plate 331, a mounting seat 223 disposed on the short pipe 242 and near one end of the fixing plate 231, and a linear bearing 224 disposed on the mounting seat 223; the lifting column 222 penetrates through the linear bearing 224 and is connected to the lifting support plate 331. The mount 223 symmetrically forms a hole (not shown) through which the linear bearing 224 passes, and the linear bearing 224 is fixedly mounted into the hole. When the driving device 34 drives the lifting rod 31 to lift, since the two end portions of the top plate 221 are respectively and fixedly connected with the lifting rod 31 and the lifting column 222, the lifting column 222 can lift along with the lifting rod 31 when the first supporting portion 23 and the second supporting portion 33 alternately support the wafer. By providing the linear bearing 224, friction of the mount 223 with respect to the elevating column 222 during elevation can be reduced.
Preferably, as shown in fig. 5 and 7, the third connecting assembly 32 comprises: a socket joint 323 arranged at one end of the driving device 34 close to the lifting rod 31, a second bearing 322 embedded inside the socket joint 323, and a lifting pin 321; one end of the lifting pin 321 close to the driving device 34 penetrates through the second bearing 322 and extends into the socket joint 323, and one end of the lifting pin 321 far from the driving device 34 is fixedly connected with the lifting rod 31. When the driving mechanism 50 drives the rotating tube 40 to rotate the fastening member 241, the short tube 242 and the first supporting portion 23, the pivot 233 is driven to rotate, and the strip-shaped hole 333 guides the pivot 233 to apply a rotating tangential force to the second supporting portion 33, so that the second supporting portion 33 rotates synchronously. The second supporting part 33 drives the lifting rod 31 to rotate by pivotally connecting the lifting pin 321 with the sleeve joint 323. The lift pin 321 is rotatably connected to the socket joint 323 through the second bearing 322, and when the driving mechanism 50 drives the rotary tube 40 to rotate, the lift pin 31 is prevented from being affected, so that the first supporting portion 23 and the second supporting portion 33 alternately support the wafer.
Preferably, as shown in fig. 2 and 7, the driving mechanism 50 includes: the device comprises a driving device 51, a driving wheel 52, a driven wheel 53, and a conveyor belt 54 in transmission connection with the driving wheel 52 and the driven wheel 53; the rotating tube 40 is embedded with a connecting shaft 35 near one end of the driven wheel 53, the connecting shaft 35 is rotatably connected with the fixed ring 11 through a third bearing 13, and the driven wheel 53 forms a rotating shaft (not shown) connected with the connecting shaft 35. The drive device 51 employs a servo motor. The servo motor drives the driving wheel 52 to rotate, and drives the transmission belt 54 and the driven wheel 53 to rotate, so that the driven wheel 53 drives the connecting shaft 35 to rotate. Since the connecting shaft 35 is fixedly connected to the rotating pipe 40, the fastening member 241, the short pipe 242 and the first bearing portion 23 can rotate along with the rotating pipe 40, and simultaneously, the second bearing portion 33 and the first bearing portion 23 rotate synchronously. The servo motor controls the rotation angle of the first bearing part 23 and the second bearing part 33 so as to facilitate the loading and unloading of the wafer by the semiconductor bearing device.
The above-listed detailed description is merely a detailed description of possible embodiments of the present invention, and it is not intended to limit the scope of the invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention are intended to be included within the scope of the present invention.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (10)
1. A semiconductor support apparatus comprising:
the device comprises a supporting pipe provided with a first supporting part, a lifting component and a driving device connected with the lifting component;
the lifting assembly comprises:
the lifting rod is provided with a second supporting part at one end close to the first supporting part;
the lifting rod is connected to the driving device, and the driving device drives the lifting rod to drive the second bearing part to lift along the longitudinal direction, so that the first bearing part and the second bearing part can alternately bear the wafer.
2. The semiconductor supporting apparatus defined in claim 1 wherein the driving device drives the lifting rod to lift the second supporting member in the longitudinal direction when the driving device is connected to the lifting rod, the second supporting member supports the semiconductor when the center of the second supporting member is higher than the center of the first supporting member, and the first supporting member supports the semiconductor when the center of the second supporting member is lower than the center of the first supporting member.
3. The semiconductor support apparatus of claim 1 further comprising:
the rotary tube is pivotally connected with the mounting part, and a fixed component and a driving mechanism are respectively arranged at the end parts of two ends of the rotary tube;
wherein, the lifter overlaps from inside to outside in proper order along longitudinal direction and establishes rotatory pipe and stay tube, the stay tube through first coupling assembling with fixed subassembly pivot connection, fixed subassembly is kept away from actuating mechanism one end with first bearing portion connects, the lifter is close to actuating mechanism one end is passed through third coupling assembling and drive arrangement pivot connection, the lifter is kept away from actuating mechanism one end pass through second coupling assembling with second bearing portion connects, drives first bearing portion rotates in a rotation plane, with synchronous drive second bearing portion is in rotate the in-plane rotation.
4. The semiconductor support device of claim 3, wherein the first support part is configured with a pivot, the second support part is formed with a bar-shaped hole for the pivot to pass through, and the bar-shaped hole guides the pivot to apply a tangential force to the second support part, so that the first support part drives the pivot to rotate in the rotation plane, and the second support part is synchronously driven to rotate in the rotation plane.
5. The semiconductor support apparatus of claim 4 wherein the first support section comprises:
the supporting block is arranged on one side of the fixed plate, which is opposite to the supporting tube, and the pivot joint piece is arranged on the fixed plate;
the second bearing portion includes:
the lifting support plate is connected to the second connecting assembly, the bearing block is arranged on the lifting support plate and arranged on one side, back to the supporting pipe, of the lifting support plate, and the strip-shaped holes are arranged in the lifting support plate.
6. The semiconductor support apparatus of claim 5 wherein the first connecting means comprises:
a fixed shaft sleeve connected to the support tube, and a first bearing embedded in the fixed shaft sleeve;
the fixing assembly includes:
the short pipe is connected to the fixed plate, the fastener penetrates through the first bearing and is in pivot connection with the fixed shaft sleeve, and the end parts of the two ends of the fastener are respectively connected to the short pipe and the rotating pipe;
the fastener is close to one end of the short pipe to form an annular structure which is expanded outwards and connected with the short pipe, and the annular structure extends to the fixed shaft sleeve and covers the fixed shaft sleeve close to one end of the short pipe so as to form a gap between the fixed shaft sleeve and the fastener.
7. The semiconductor support apparatus of claim 6 wherein the second attachment assembly comprises:
the lifting support plate is arranged on the short pipe and is provided with a lifting support plate, a top plate connected to the lifting rod, a lifting column arranged on the top plate and facing one side of the lifting support plate, a mounting seat arranged on the short pipe and close to one end of the fixing plate, and a linear bearing arranged on the mounting seat;
wherein the lifting column penetrates through the linear bearing and is connected to the lifting support plate.
8. The semiconductor support apparatus of claim 7 wherein the third attachment assembly comprises:
the sleeve joint is arranged at one end of the driving device close to the lifting rod, and a second bearing and a lifting pin are embedded in the sleeve joint;
the lifting pin penetrates through the second bearing and extends into the sleeve joint, and one end, far away from the driving device, of the lifting pin is connected with the lifting rod.
9. The semiconductor support apparatus of claim 8 wherein the drive mechanism comprises:
the driving device, the driving wheel, the driven wheel and the conveyor belt are in transmission connection with the driving wheel and the driven wheel;
the rotating pipe is close to one end of the driven wheel, a connecting shaft is embedded in the rotating pipe, and the driven wheel forms a rotating shaft connected with the connecting shaft.
10. The semiconductor support apparatus of any one of claims 1-9 further comprising:
a base, a moving device connected to the base and reciprocating in a transverse direction, the moving device being provided with a lifting device, the support tube being connected to the lifting device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211410048.0A CN115458472A (en) | 2022-11-11 | 2022-11-11 | Semiconductor supporting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211410048.0A CN115458472A (en) | 2022-11-11 | 2022-11-11 | Semiconductor supporting device |
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| Publication Number | Publication Date |
|---|---|
| CN115458472A true CN115458472A (en) | 2022-12-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211410048.0A Pending CN115458472A (en) | 2022-11-11 | 2022-11-11 | Semiconductor supporting device |
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| Country | Link |
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| CN (1) | CN115458472A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117153765A (en) * | 2023-10-27 | 2023-12-01 | 深圳市星国华先进装备科技有限公司 | Wafer rotary spraying cleaning device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11233584A (en) * | 1998-02-18 | 1999-08-27 | Tokyo Electron Ltd | Substrate conveying processor |
| CN101673665B (en) * | 2008-09-12 | 2012-02-29 | 大日本网屏制造株式会社 | Substrate processing apparatus |
| CN103400790A (en) * | 2013-08-14 | 2013-11-20 | 上海华力微电子有限公司 | Transmission device in wet chemical cleaning equipment |
| CN216120257U (en) * | 2021-05-07 | 2022-03-22 | 上海大族富创得科技有限公司 | Wafer bearing device |
-
2022
- 2022-11-11 CN CN202211410048.0A patent/CN115458472A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11233584A (en) * | 1998-02-18 | 1999-08-27 | Tokyo Electron Ltd | Substrate conveying processor |
| CN101673665B (en) * | 2008-09-12 | 2012-02-29 | 大日本网屏制造株式会社 | Substrate processing apparatus |
| CN103400790A (en) * | 2013-08-14 | 2013-11-20 | 上海华力微电子有限公司 | Transmission device in wet chemical cleaning equipment |
| CN216120257U (en) * | 2021-05-07 | 2022-03-22 | 上海大族富创得科技有限公司 | Wafer bearing device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117153765A (en) * | 2023-10-27 | 2023-12-01 | 深圳市星国华先进装备科技有限公司 | Wafer rotary spraying cleaning device |
| CN117153765B (en) * | 2023-10-27 | 2024-02-06 | 深圳市星国华先进装备科技有限公司 | Wafer rotary spraying cleaning device |
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Application publication date: 20221209 |
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