CN115319566A - Polishing and cleaning equipment for wafer - Google Patents
Polishing and cleaning equipment for wafer Download PDFInfo
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- CN115319566A CN115319566A CN202211257273.5A CN202211257273A CN115319566A CN 115319566 A CN115319566 A CN 115319566A CN 202211257273 A CN202211257273 A CN 202211257273A CN 115319566 A CN115319566 A CN 115319566A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 38
- 238000005498 polishing Methods 0.000 title claims abstract description 35
- 230000001681 protective effect Effects 0.000 claims abstract description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 88
- 238000009826 distribution Methods 0.000 claims description 11
- 238000005192 partition Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims 3
- 235000017491 Bambusa tulda Nutrition 0.000 claims 3
- 241001330002 Bambuseae Species 0.000 claims 3
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims 3
- 239000011425 bamboo Substances 0.000 claims 3
- 230000006978 adaptation Effects 0.000 claims 2
- 238000000926 separation method Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 33
- 238000003825 pressing Methods 0.000 description 14
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 206010053615 Thermal burn Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/226—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain in which the tool is supported by the workpiece
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses a wafer polishing and cleaning device, and particularly relates to the technical field of polishing and cleaning devices, which comprises a device body, wherein the top of the outer surface of the device body is fixedly connected with a mounting plate, the top of the outer surface of the mounting plate is provided with a hydraulic telescopic rod, the output end of the hydraulic telescopic rod is fixedly connected with a connecting separation block, and two sides of the outer surface of the connecting separation block are respectively provided with a convenient cleaning device and a protective polishing device.
Description
Technical Field
The invention relates to the technical field of polishing and cleaning equipment, in particular to polishing and cleaning equipment for a wafer.
Background
The wafer is one of the main raw materials of the LED, is the luminous component of the LED, the most core part of the LED, the quality of the wafer directly determines the performance of the LED, the wafer is composed of III and V group compound semiconductor substances, when the LED is packaged, the wafer supplied materials are arranged on the wafer film in order, in the production of the wafer, the requirements on the processing precision and the surface quality of the wafer are more and more strict, therefore, the wafer needs to be polished and cleaned by a polishing and cleaning device, and along with the development of science and technology, a polishing and cleaning integrated machine is developed on the market at present.
In actual use, belt cleaning device when wasing the wafer, often needs the shower nozzle of brush and water spray to be separately the operation for the shower nozzle is when spraying water to the wafer, and the brush mid portion is difficult moist, and then influences the clean effect of brush, and at the in-process of polishing, has a large amount of pieces to splash to ground, and then increases the clearance cost.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides polishing and cleaning equipment for a wafer, and the technical problems to be solved by the invention are as follows: in actual use, belt cleaning device when wasing the wafer, often need the shower nozzle of brush and water spray to be the detached operation for the shower nozzle is when spraying water to the wafer, and the brush mid portion is difficult moist, and then influences the clean effect of brush, and at the in-process of polishing, has a large amount of pieces to splash to ground, and then increases the problem of clearance cost.
In order to achieve the purpose, the invention provides the following technical scheme: polishing and cleaning equipment for wafers comprises an equipment body, the surface top fixedly connected with mounting panel of equipment body, the surface top of mounting panel is provided with hydraulic telescoping rod, hydraulic telescoping rod's output fixedly connected with connects the partition block, the surface both sides of connecting the partition block are provided with convenient belt cleaning device and protection grinding device respectively, one side of equipment body is provided with convenient blevile of push, the auxiliary tank has been seted up to the opposite side of equipment body, the inner wall of auxiliary tank is provided with supplementary ejecting device, convenient belt cleaning device includes first rectangular plate and water tank, the surface of first rectangular plate and the surface fixed connection who connects the partition block, the surface top fixed mounting of first rectangular plate has first motor, the first through-hole cylinder of output fixedly connected with of first motor, a plurality of circular through-hole has been seted up to the surface of first through-hole cylinder, the bottom fixedly connected with of first through-hole divides the water frame, the bottom delivery port intercommunication of dividing the water frame has first hollow tube, the bottom of first hollow tube is provided with the water diversion frame, the bottom intercommunication of dividing the water diversion frame has the connection ring, the bottom fixedly connected with the circular through-hole cylinder of second through-hole, the surface of a plurality of circular through-hole is connected with the brush hair department that the circular through-hole connects the circular through-hole cylinder, the circular through-hole circle body is connected with the brush hair of the brush hair.
As a further scheme of the invention, the bottom of the outer surface of the first rectangular plate is fixedly connected with a second hollow pipe, the bottom of the second hollow pipe is rotatably connected with the top of the water diversion frame, and the first through hole cylinder is arranged in the second hollow pipe.
As a further scheme of the invention, the outer surface of the water tank is fixedly connected with the outer surface of the mounting plate, the outer surface of the water tank is fixedly provided with a water pump, a water inlet and a water outlet of the water pump are respectively communicated with a water inlet pipe and a water outlet pipe, one end of the water inlet pipe, far away from the water pump, is communicated with the water tank, and one end of the water outlet pipe, far away from the water pump, is communicated with the second hollow pipe.
As a further scheme of the invention, the protective polishing device comprises a second rectangular plate, the outer surface of the second rectangular plate is fixedly connected with the outer surface of the connecting partition block, a second motor is fixedly mounted at the top of the outer surface of the second rectangular plate, the output end of the second motor is fixedly connected with a rotating rod, the bottom end of the rotating rod is fixedly connected with a polishing disk, the bottom of the outer surface of the second rectangular plate is fixedly connected with a ring pipe, the bottom of the ring pipe is fixedly connected with a circular hole rectangular plate, and the rotating rod is arranged inside the ring pipe and the circular hole rectangular plate.
As a further scheme of the invention, the bottom of the outer surface of the round hole rectangular plate is fixedly connected with a dovetail slide rod, the bottom end of the dovetail slide rod is connected with a slide cylinder in a sliding manner, the bottom of the outer surface of the slide cylinder is fixedly connected with a protective shell, the bottom of the protective shell is fixedly connected with a press block, the outer surface of the dovetail slide rod is sleeved with a return spring, and two ends of the return spring are respectively fixedly connected with the bottom of the outer surface of the round hole rectangular plate and the top of the outer surface of the slide cylinder.
As a further scheme of the invention, the top of the outer surface of the equipment body is fixedly connected with an operation table, the top of the outer surface of the operation table is symmetrically provided with limiting grooves, a slide rail groove is arranged between the two limiting grooves, one side of one of the limiting grooves is provided with a pressing groove, and the size and the shape of the outer surface of the pressing block are matched with the size and the shape of the inner wall of the pressing groove.
As a further scheme of the invention, the convenient material pushing device comprises an L-shaped plate, the outer surface of the L-shaped plate is fixedly connected with the outer surface of the equipment body, a third motor is fixedly mounted on one side of the outer surface of the L-shaped plate, the output end of the third motor is fixedly connected with a first threaded rod, one end of the first threaded rod is fixedly connected with a stop block, the outer surface of the first threaded rod is in threaded connection with a threaded hole plate, one side of the outer surface of the threaded hole plate is fixedly connected with a limiting rod, both sides of the outer surface of the L-shaped plate are fixedly connected with auxiliary plates, and the limiting rod is arranged on the inner walls of the auxiliary plates.
As a further scheme of the invention, one end of the limiting rod, which is far away from the threaded plate, is fixedly connected with a first push plate, one side of the outer surface of the first push plate is symmetrically and fixedly connected with a connecting plate, and one side of the outer surface of the connecting plate is fixedly connected with a second push plate.
As a further scheme of the invention, the auxiliary ejection device comprises a third rectangular plate, the outer surface of the third rectangular plate is fixedly connected with one side of the inner wall of the auxiliary groove, a fourth motor is fixedly installed at the bottom of the outer surface of the third rectangular plate, the output end of the fourth motor is fixedly connected with a second threaded rod, the outer surface of the second threaded rod is in threaded connection with a screw hole long plate, an ejection rod is arranged at the top of the outer surface of the screw hole long plate, and an ejection block is fixedly connected to the top end of the ejection rod.
As a further scheme of the invention, the inner wall of the limit groove is provided with an ejection groove, the size and the shape of the inner wall of the ejection groove are matched with the size and the shape of the outer surface of the ejection block, the bottom of the inner wall of the ejection groove is provided with a circular through hole, and the ejection rod is arranged on the inner wall of the circular through hole.
The invention has the beneficial effects that:
1. according to the invention, through arranging the convenient cleaning device and the protective polishing device, under the action of the first through hole cylinder and the first hollow pipe, when the water distribution frame rotates, the water outlet pipe cannot rotate along with the water distribution frame, and the ring and the second through hole cylinder are connected in a matched manner, so that water can flow out from the bristles, and then single bristles are wetted, and further water outlet and bristles are carried out simultaneously, so that the bristles can flush when cleaning the outer surface of a wafer conveniently, the cleaning effect of the bristles is improved, under the action of the protective shell and the pressing block, the protective shell can protect a polishing area by matching with the pressing groove, and chips are prevented from splashing to the ground, so that the cost is increased, the dovetail slide rod and the slide cylinder can match with the reset spring, so that the protective shell is tightly attached to the limiting groove, and further, gaps between the dovetail slide rod and the limiting groove are reduced.
2. According to the invention, through arranging the convenient material pushing device, the first threaded rod can drive the threaded hole plate to move under the action of the first threaded rod, so that the limiting rod, the first push plate and the second push plate can be driven to move, and then the wafers in the two limiting grooves on the operation table can be simultaneously pushed, so that the polished wafers can move to the position below the convenient cleaning device, and the cleaned wafers can be pushed down from the operation table, thereby avoiding the problems that the outer surface temperature of the polished wafers is high, and the polished wafers are easy to scald when being manually taken.
3. According to the invention, the auxiliary ejection device is arranged, and under the action of driving the screw hole long plate to move by the second threaded rod, the ejection rod and the ejection block can be driven to move upwards, so that the ejection block can eject the wafer from the limiting groove, and the first push plate and the second push plate are matched to play a role.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic perspective view of the console of the present invention;
FIG. 3 is a schematic perspective view of the water tank of the present invention;
FIG. 4 is a schematic three-dimensional structure of a first through-hole cylinder according to the present invention;
FIG. 5 is a perspective view of the bristle of the present invention;
FIG. 6 is a perspective structural view of the protective housing of the present invention;
fig. 7 is a perspective structural view of a first threaded rod of the present invention;
FIG. 8 is a perspective view of the screw hole long plate according to the present invention;
in the figure: 1. an apparatus body; 2. mounting a plate; 3. a hydraulic telescopic rod; 4. connecting the separation blocks; 5. a convenient cleaning device; 51. a first rectangular plate; 52. a water tank; 53. a first motor; 54. a first through-hole cylinder; 55. a water diversion frame; 56. a second hollow tube; 57. a water pump; 58. a water inlet pipe; 59. a water outlet pipe; 510. a first hollow tube; 511. a water diversion plate frame; 512. connecting the circular rings; 513. a second through-hole cylinder; 514. brushing; 6. a protective polishing device; 61. a second rectangular plate; 62. a second motor; 63. rotating the rod; 64. grinding disc; 65. a ring pipe; 66. a circular hole rectangular plate; 67. a dovetail slide bar; 68. a sliding cylinder; 69. a return spring; 610. a protective housing; 611. briquetting; 612. pressing a groove; 7. a convenient material pushing device; 71. an L-shaped plate; 72. a third motor; 73. a first threaded rod; 74. a stopper; 75. a screw hole plate; 76. a limiting rod; 77. an auxiliary plate; 78. a first push plate; 79. a connecting plate; 710. a second push plate; 8. an auxiliary ejection device; 81. a third rectangular plate; 82. a fourth motor; 83. a second threaded rod; 84. a screw hole long plate; 85. ejecting the rod; 86. ejecting a block; 87. a circular through hole; 88. ejecting the groove; 9. an operation table; 10. a limiting groove; 11. a slide rail groove; 12. an auxiliary groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in figures 1-8, the invention provides polishing and cleaning equipment for wafers, which comprises an equipment body 1, wherein the top of the outer surface of the equipment body 1 is fixedly connected with a mounting plate 2, the top of the outer surface of the mounting plate 2 is provided with a hydraulic telescopic rod 3, the output end of the hydraulic telescopic rod 3 is fixedly connected with a connecting and separating block 4, two sides of the outer surface of the connecting and separating block 4 are respectively provided with a convenient cleaning device 5 and a protective polishing device 6, the convenient cleaning device 5 and the protective polishing device 6 are arranged, so that when bristles 514 are cleaned, water flow can flow out from a second through hole cylinder 513 to moisten the bristles 514 and improve the cleaning effect, one side of the equipment body 1 is provided with a convenient pushing device 7, the wafers in a limiting groove 10 can be pushed to a designated position by arranging the convenient pushing device 7, the other side of the equipment body 1 is provided with an auxiliary groove 12, the inner wall of the auxiliary groove 12 is provided with an auxiliary ejection device 8, the wafer can be ejected out of the limiting groove 10 by arranging the auxiliary ejection device 8, the first push plate 78 and the second push plate 710 can push materials conveniently, the convenient cleaning device 5 comprises a first rectangular plate 51 and a water tank 52, the outer surface of the first rectangular plate 51 is fixedly connected with the outer surface of the connecting and separating block 4, the top of the outer surface of the first rectangular plate 51 is fixedly provided with a first motor 53, the output end of the first motor 53 is fixedly connected with a first through hole cylinder 54, the outer surface of the first through hole cylinder 54 is provided with a plurality of circular through holes, the bottom end of the first through hole cylinder 54 is fixedly connected with a water distribution frame 55, the bottom water outlet of the water distribution frame 55 is communicated with a first hollow tube 510, the bottom of the first hollow tube 510 is provided with a water distribution frame 511, and by arranging the first through hole 54 and the first hollow tube 510, make water can follow brush hair 514 outflow, divide water plate frame 511's bottom delivery port intercommunication to have the connection ring 512, the bottom of connecting ring 512 is provided with second through-hole cylinder 513, a plurality of circular through-hole has been seted up to the surface of second through-hole cylinder 513, the surface bottom fixedly connected with a plurality of brush hair 514 of connection ring 512, through setting up second through-hole cylinder 513, make brush hair 514 when abluent, rivers can follow second through-hole cylinder 513 and flow out and wet brush hair 514, divide water plate frame 511 to set up the center department at brush hair 514.
As shown in fig. 3, 4 and 5, a second hollow pipe 56 is fixedly connected to the bottom of the outer surface of the first rectangular plate 51, the bottom of the second hollow pipe 56 is rotatably connected to the top of the water diversion frame 55, a first through hole cylinder 54 is arranged inside the second hollow pipe 56, the outer surface of the water tank 52 is fixedly connected to the outer surface of the mounting plate 2, a water pump 57 is fixedly mounted on the outer surface of the water tank 52, a water inlet and a water outlet of the water pump 57 are respectively communicated with a water inlet pipe 58 and a water outlet pipe 59, the water of the water tank 52 can be pumped to the second hollow pipe 56 by matching with the water inlet pipe 58 and the water outlet pipe 59 through the arrangement of the water pump 57, one end of the water inlet pipe 58, which is far away from the water pump 57, is communicated with the water tank 52, and one end of the water outlet pipe 59, which is far away from the water pump 57, is communicated with the second hollow pipe 56.
As shown in fig. 2 and 6, the protective polishing device 6 includes a second rectangular plate 61, the outer surface of the second rectangular plate 61 is fixedly connected to the outer surface of the connecting partition block 4, a second motor 62 is fixedly mounted on the top of the outer surface of the second rectangular plate 61, an output end of the second motor 62 is fixedly connected to a rotating rod 63, a polishing disk 64 is fixedly connected to the bottom end of the rotating rod 63, the polishing disk 64 can be driven to rotate by setting the rotating rod 63, a circular ring 65 is fixedly connected to the bottom of the outer surface of the second rectangular plate 61, a circular hole rectangular plate 66 is fixedly connected to the bottom of the circular ring 65, the protective housing 610 can be fixedly connected by setting the circular hole rectangular plate 66 and the circular ring 65, the rotating rod 63 is disposed inside the circular ring 65 and the circular hole rectangular plate 66, a dovetail slide bar 67 is fixedly connected to the bottom of the outer surface of the circular hole rectangular plate 66, and a slide tube 68 is slidably connected to the bottom end of the dovetail slide bar 67, the bottom of the outer surface of the sliding cylinder 68 is fixedly connected with a protective shell 610, the protective shell 610 can be tightly attached to the limiting groove 10 by being provided with a dovetail slide rod 67 and the sliding cylinder 68 and can be matched with a reset spring 69, the bottom of the protective shell 610 is fixedly connected with a pressing block 611, the outer surface of the dovetail slide rod 67 is sleeved with the reset spring 69, two ends of the reset spring 69 are respectively and fixedly connected with the bottom of the outer surface of the round hole rectangular plate 66 and the top of the outer surface of the sliding cylinder 68, the top of the outer surface of the equipment body 1 is fixedly connected with an operating platform 9, the top of the outer surface of the operating platform 9 is symmetrically provided with the limiting groove 10, a slide rail groove 11 is arranged between the two limiting grooves 10, a wafer can slide into the limiting groove 10 below the convenient cleaning device 5 through the slide rail groove 11, one side of one limiting groove 10 is provided with a pressing groove 612, the size and the shape of the outer surface of the pressing block 611 are matched with the size and the shape of the inner wall of the pressure groove 612, and the pressing block 611 can be matched with the pressure groove 612 to fix the wafer.
As shown in fig. 7, the convenient pushing device 7 includes an L-shaped plate 71, an outer surface of the L-shaped plate 71 is fixedly connected with an outer surface of the device body 1, a third motor 72 is fixedly installed on one side of the outer surface of the L-shaped plate 71, an output end of the third motor 72 is fixedly connected with a first threaded rod 73, one end of the first threaded rod 73 is fixedly connected with a stopper 74, an outer surface of the first threaded rod 73 is connected with a threaded plate 75 in a threaded manner, the first threaded rod 73 can drive the threaded plate 75 to move by arranging the first threaded rod 73 and the threaded plate 75, and further cooperate with other components to play a role, a limiting rod 76 is fixedly connected to one side of the outer surface of the threaded plate 75, auxiliary plates 77 are fixedly connected to two sides of the outer surface of the L-shaped plate 71, the limiting rod 76 is arranged on an inner wall of the auxiliary plate 77, one end of the limiting rod 76 far away from the threaded plate 75 is fixedly connected with the first push plate 78, the limiting rod 76 can drive the first push plate 78 to move while limiting the threaded plate 75, one side of the outer surface of the first push plate 78 is symmetrically and fixedly connected with a second push plate 79, and one side of the outer surface of the second push plate 710 is fixedly connected with the connecting plate 79.
As shown in fig. 2 and 8, the auxiliary ejection device 8 includes a third rectangular plate 81, an outer surface of the third rectangular plate 81 is fixedly connected to one side of an inner wall of the auxiliary groove 12, a fourth motor 82 is fixedly installed at a bottom portion of the outer surface of the third rectangular plate 81, an output end of the fourth motor 82 is fixedly connected to a second threaded rod 83, a threaded hole long plate 84 is connected to an outer surface thread of the second threaded rod 83, the second threaded rod 83 and the threaded hole long plate 84 are arranged so that the second threaded rod 83 can drive the threaded hole long plate 84 to move and further cooperate with other components to function, an ejection rod 85 is arranged at a top portion of the outer surface of the threaded hole long plate 84, an ejection block 86 is fixedly connected to a top end of the ejection rod 85, an ejection groove 88 is formed in an inner wall of the limiting groove 10, a circular through hole 87 is formed in a bottom portion of the inner wall of the ejection groove 88, and the ejection rod 85 is arranged on an inner wall of the circular through hole 87.
The working principle of the invention is as follows:
s1, when a wafer needs to be polished and cleaned, the hydraulic telescopic rod 3 is started at the moment, the connecting and separating block 4 can drive the first rectangular plate 51 and the second rectangular plate 61 to move downwards, when the protective shell 610 is in contact with the limiting groove 10, the pressing block 611 can be clamped into the pressing groove 612, the protective shell 610 can provide a reverse force for the sliding cylinder 68 at the moment, the sliding cylinder 68 can slide on the outer surface of the dovetail sliding rod 67, the reset spring 69 can be deformed, the pressing block 611 is tightly attached to the pressing groove 612 under the reverse force, the protective shell 610 is tightly attached to the limiting groove 10, the second motor 62 is started at the moment, the rotating rod 63 can drive the polishing disc 64 to rotate, the wafer is polished, meanwhile, when the second rectangular plate 61 moves to a proper position, the water pump 57 is started at the moment, water flows from the water tank 52 to the water inlet pipe 58 and the water pump 57, flows to the water outlet pipe 59 and the second hollow pipe 56 through the water pump 57, flows to the water distribution frame 55 through the circular through hole 54, the water distribution frame 510 further flows to the water distribution frame 514, the bristles 53 and then flow out through the first through hole 511 and the first through the rotating motor 53, the rotating brush bristles can rotate the first through hole 511 and the second through the first through hole 54;
s2, starting the fourth motor 82, enabling the fourth motor 82 to drive the second threaded rod 83 to rotate, further driving the screw hole long plate 84 to move, further driving the ejector rod 85 and the ejector block 86 to move, further ejecting the wafer out of the limiting groove 10, and starting the third motor 72 at the moment to enable the third motor 72 to drive the first threaded rod 73 to rotate;
s3, the first threaded rod 73 rotates to drive the threaded hole plate 75 to move, and then the limiting rod 76 can be driven to slide on the inner wall of the auxiliary plate 77, and then the first push plate 78 can be driven to move, the first push plate 78 can drive the connecting plate 79 to move, and then the second push plate 710 is driven to move, so that the wafers in the left limiting groove 10 are pushed to the limiting groove 10 on the right side through the slide rail groove 11 and the first push plate 78, and the wafers on the right side are pushed to the appointed accommodating part through the second push plate 710.
The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," "connecting," and "connecting" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be directly connected, and "upper," "lower," "left," and "right" are only used to indicate relative positional relationships, and when the absolute position of the object to be described is changed, the relative positional relationships may be changed;
secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the invention, only the structures related to the disclosed embodiments are referred to, other structures can refer to common designs, and the same embodiment and different embodiments of the invention can be combined with each other without conflict;
and finally: the above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that are within the spirit and principle of the present invention are intended to be included in the scope of the present invention.
Claims (10)
1. The utility model provides a cleaning equipment that polishes of wafer, includes equipment body (1), its characterized in that: the device comprises an equipment body (1), wherein a mounting plate (2) is fixedly connected to the top of the outer surface of the equipment body (1), a hydraulic telescopic rod (3) is arranged at the top of the outer surface of the mounting plate (2), an output end of the hydraulic telescopic rod (3) is fixedly connected with a connecting partition block (4), convenient cleaning devices (5) and protective polishing devices (6) are respectively arranged on two sides of the outer surface of the connecting partition block (4), a convenient material pushing device (7) is arranged on one side of the equipment body (1), an auxiliary groove (12) is formed in the other side of the equipment body (1), an auxiliary ejection device (8) is arranged on the inner wall of the auxiliary groove (12), each convenient cleaning device (5) comprises a first rectangular plate (51) and a water tank (52), the outer surface of the first rectangular plate (51) is fixedly connected with the outer surface of the connecting partition block (4), a first motor (53) is fixedly installed on the top of the outer surface of the first rectangular plate (51), a first through hole (54) is fixedly connected with a first through hole (54), a plurality of circular through holes are formed in the outer surface of the first through hole (54), a water distribution frame (510) is communicated with a water distribution frame (510), and a water distribution frame (510) of the hollow tube frame (510), the bottom delivery port intercommunication of dividing water sheet frame (511) has connection ring (512), the bottom of connecting ring (512) is provided with second through-hole cylinder (513), a plurality of circular through-hole has been seted up to the surface of second through-hole cylinder (513), the surface bottom fixedly connected with a plurality of brush hair (514) of connecting ring (512), divide water sheet frame (511) to set up the center department at brush hair (514).
2. The wafer polishing and cleaning apparatus as set forth in claim 1, wherein: the bottom of the outer surface of the first rectangular plate (51) is fixedly connected with a second hollow pipe (56), the bottom of the second hollow pipe (56) is rotatably connected with the top of the water diversion frame (55), and the first through hole cylinder body (54) is arranged inside the second hollow pipe (56).
3. The wafer polishing and cleaning apparatus as set forth in claim 2, wherein: the surface of water tank (52) is connected with the fixed surface of mounting panel (2), the fixed surface of water tank (52) installs water pump (57), the water inlet and the delivery port of water pump (57) communicate respectively inlet tube (58) and outlet pipe (59), the one end that water pump (57) were kept away from in inlet tube (58) is linked together with water tank (52), the one end that water pump (57) were kept away from in outlet pipe (59) is linked together with second hollow tube (56).
4. The wafer polishing and cleaning apparatus as set forth in claim 1, wherein: protection grinding device (6) include second rectangular plate (61), the surface of second rectangular plate (61) and the fixed surface who is connected divider block (4) are connected, the fixed surface top fixed mounting of second rectangular plate (61) has second motor (62), the output fixedly connected with dwang (63) of second motor (62), the bottom fixedly connected with who dwang (63) beats mill dish (64), the outer surface bottom fixedly connected with ring canal (65) of second rectangular plate (61), the bottom fixedly connected with round hole rectangular plate (66) of ring canal (65), dwang (63) set up the inside at ring canal (65) and rectangular hole plate (66).
5. The wafer polishing and cleaning apparatus as set forth in claim 4, wherein: the utility model discloses a dovetail slide bar's structure, including round hole rectangular plate (66), the surface bottom fixedly connected with forked tail slide bar (67) of round hole rectangular plate (66), the bottom sliding connection of forked tail slide bar (67) has a slip section of thick bamboo (68), the surface bottom fixedly connected with protective housing (610) of a slip section of thick bamboo (68), the bottom fixedly connected with briquetting (611) of protective housing (610), the surface cover of forked tail slide bar (67) is equipped with reset spring (69), reset spring (69)'s both ends respectively with the surface bottom of round hole rectangular plate (66) and the surface top fixed connection of a slip section of thick bamboo (68).
6. The wafer polishing and cleaning apparatus as set forth in claim 5, wherein: the outer surface top fixedly connected with operation panel (9) of equipment body (1), spacing groove (10) have been seted up to the outer surface top symmetry of operation panel (9), two slide rail groove (11) have been seted up between spacing groove (10), and indent (612) have been seted up to one of them one side of spacing groove (10), the outer surface size and the shape of briquetting (611) and the inner wall size and the shape looks adaptation of indent (612).
7. The wafer polishing and cleaning apparatus as set forth in claim 1, wherein: the convenient material pushing device (7) comprises an L-shaped plate (71), the outer surface of the L-shaped plate (71) is fixedly connected with the outer surface of the equipment body (1), a third motor (72) is fixedly mounted on one side of the outer surface of the L-shaped plate (71), a first threaded rod (73) is fixedly connected with the output end of the third motor (72), a stop block (74) is fixedly connected with one end of the first threaded rod (73), a threaded plate (75) is connected with the outer surface of the first threaded rod (73), a limiting rod (76) is fixedly connected on one side of the outer surface of the threaded plate (75), auxiliary plates (77) are fixedly connected to the two sides of the outer surface of the L-shaped plate (71), and the limiting rod (76) is arranged on the inner wall of the auxiliary plates (77).
8. The wafer polishing and cleaning apparatus as set forth in claim 7, wherein: the screw plate is characterized in that one end of the limiting rod (76) far away from the screw plate (75) is fixedly connected with a first push plate (78), one side of the outer surface of the first push plate (78) is symmetrically and fixedly connected with a connecting plate (79), and one side of the outer surface of the connecting plate (79) is fixedly connected with a second push plate (710).
9. The wafer polishing and cleaning apparatus as set forth in claim 1, wherein: supplementary ejecting device (8) include third rectangular plate (81), the surface of third rectangular plate (81) and the inner wall one side fixed connection of supplementary groove (12), the surface bottom fixed mounting of third rectangular plate (81) has fourth motor (82), the output fixedly connected with second threaded rod (83) of fourth motor (82), the surface threaded connection of second threaded rod (83) has screw long slab (84), the surface top of screw long slab (84) is provided with ejector beam (85), the ejecting piece (86) of the top fixedly connected with of ejector beam (85).
10. The wafer polishing and cleaning apparatus as set forth in claim 6, wherein: the inner wall of spacing groove (10) has seted up ejecting groove (88), the inner wall size and the shape of ejecting groove (88) and the surface size and the shape looks adaptation of ejecting piece (86), round through-hole (87) have been seted up to the inner wall bottom of ejecting groove (88), ejector rod (85) set up the inner wall at round through-hole (87).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211257273.5A CN115319566B (en) | 2022-10-14 | 2022-10-14 | Wafer polishing and cleaning equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211257273.5A CN115319566B (en) | 2022-10-14 | 2022-10-14 | Wafer polishing and cleaning equipment |
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| CN115319566A true CN115319566A (en) | 2022-11-11 |
| CN115319566B CN115319566B (en) | 2023-03-28 |
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| CN116673745A (en) * | 2023-07-19 | 2023-09-01 | 沧州奥力电气有限公司 | Label marking machine for finished product of distribution box |
| CN119057600A (en) * | 2024-09-04 | 2024-12-03 | 无锡晶名光电科技有限公司 | A polishing device for surface processing of gallium antimonide wafer |
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|---|---|
| CN115319566B (en) | 2023-03-28 |
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