CN115297612A - PCB columnar crystal slicing method and PCB - Google Patents
PCB columnar crystal slicing method and PCB Download PDFInfo
- Publication number
- CN115297612A CN115297612A CN202210861606.9A CN202210861606A CN115297612A CN 115297612 A CN115297612 A CN 115297612A CN 202210861606 A CN202210861606 A CN 202210861606A CN 115297612 A CN115297612 A CN 115297612A
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- columnar crystal
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- standard hole
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- 239000013078 crystal Substances 0.000 title claims abstract description 68
- 238000000034 method Methods 0.000 title claims abstract description 38
- 238000012360 testing method Methods 0.000 claims abstract description 49
- 238000004519 manufacturing process Methods 0.000 claims abstract description 10
- 238000009713 electroplating Methods 0.000 claims abstract description 8
- 238000003801 milling Methods 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000011148 porous material Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/16—Perforating by tool or tools of the drill type
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The application relates to the technical field of PCB boards, and particularly discloses a PCB columnar crystal testing method and a PCB board, wherein the method comprises the steps of arranging a columnar crystal slice testing bar part on a process edge of a production board; electroplating the opening of the columnar crystal slice test strip part; milling the columnar crystal slice test strip part by a small milling machine, and slicing to test whether the columnar crystal meets the requirement; the columnar crystal slice test strip part comprises a first standard hole, a secondary small hole, a minimum small hole and a second standard hole which are sequentially arranged along the same straight line at intervals; the diameters of the first standard hole and the second standard hole are the same, and the diameters of the first standard hole, the secondary small hole and the minimum small hole are sequentially reduced. This application is being done the in-process of column crystal section, has simplified and has got section flow, raise the efficiency, practice thrift the cost to it scraps to reduce the in-process plate.
Description
Technical Field
The application relates to the technical field of PCB (printed circuit board) manufacturing, in particular to a PCB columnar crystal slicing method for a PCB board.
Background
The section is got to market PCB board at present, is after accomplishing electroplating, takes off the section through the manual impact of small punch press, perhaps through the position that needs the observation in the miniature gong machine gong down PCB inboard, detects and electroplates back with the layer crystal whether for the column crystalline substance, whether satisfy the quality requirement. Get the section through small-size punch press or small-size gong machine, all need destroy the board, produce additionally to scrap, influence the qualification rate, increased the cost.
Disclosure of Invention
The application provides a PCB columnar crystal slicing method and a PCB, which can avoid damaging the PCB due to slicing so as to reduce extra scrap.
In a first aspect, the present application provides a method for slicing a PCB columnar crystal, comprising:
arranging a columnar crystal slice test strip part on the process edge of the production plate;
electroplating the opening of the columnar crystal slice test strip part;
milling the columnar crystal slice test strip part through a small milling machine, and slicing to test whether the columnar crystal meets the requirement;
the test strip part of the columnar crystal slice comprises a first standard hole, a second standard hole, a minimum hole and a second standard hole which are sequentially arranged along the same straight line at intervals; the diameters of the first standard hole and the second standard hole are the same, and the diameters of the first standard hole, the secondary small hole and the minimum small hole are sequentially reduced.
Further, the first standard hole and the second standard hole have a diameter of 1.0mm.
Furthermore, the inner PAD of the secondary pore and the minimum pore is designed according to the minimum loop width compensation of the independent position in the unit, and the inner PAD is connected with the pore.
Further, the minimum ring width of the first standard hole and the second standard is 1.0mm; and performing copper drawing treatment on the inner layer PAD of the first standard hole and the second standard hole, wherein the distance between the hole edge and the ring is 4mil.
Furthermore, the size of the columnar crystal section test strip portion is 8 x 13mm, routing vacancies with the width of 2mm are arranged around the columnar crystal section, and a 3mm connecting position is reserved on the columnar crystal section test strip portion.
Further, the distance between the straight line of the first standard hole, the second standard hole, the minimum hole and the second standard hole and the slice edge is 1.3mm.
Further, the first standard hole, the secondary small hole, the minimum small hole and the second standard hole are all PTH holes
In a second aspect, the PCB board used in the PCB columnar crystal slicing method of the present application includes a processing edge, the processing edge includes a columnar crystal slice test strip portion, and the columnar crystal slice test strip portion includes a first standard hole, a second standard hole, a minimum hole and a second standard hole, which are sequentially arranged along a same straight line at intervals; the diameters of the first standard hole and the second standard hole are the same, and the diameters of the first standard hole, the secondary small hole and the minimum small hole are sequentially reduced.
The application discloses a PCB columnar crystal slicing method and a PCB used for the same, wherein in the process of making columnar crystal slices, the slicing flow is simplified, the efficiency is improved, the cost is saved, and the scrappage of plates in the process is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic flow chart of a PCB columnar crystal testing method provided by an embodiment of the present application;
FIG. 2 is a schematic front view of a columnar wafer test strip portion provided in accordance with an embodiment of the present application;
fig. 3 is a schematic cross-sectional view of a columnar-shaped sliced wafer test strip portion provided in an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The flow diagrams depicted in the figures are merely illustrative and do not necessarily include all of the elements and operations/steps, nor do they necessarily have to be performed in the order depicted. For example, some operations/steps may be decomposed, combined or partially combined, so that the actual execution sequence may be changed according to the actual situation.
Referring to fig. 1, the present application relates to a method for slicing a PCB columnar crystal, which includes steps S101-S103.
S101, arranging a columnar crystal slice test strip part on the process edge of the production plate;
specifically, as shown in fig. 2, the method of the present application requires that a columnar test strip portion 10 of the crystal section is arranged on the technical edge of the production plate, and the columnar test strip portion of the crystal section comprises a first standard hole 11, a secondary small hole 12, a minimum hole 13 and a second standard hole 14 which are sequentially arranged along the same straight line at intervals; the first standard hole 11 and the second standard hole 14 have the same diameter, and the diameters of the first standard hole, the secondary small hole, and the smallest hole are sequentially decreased.
S102, electroplating the openings of the columnar crystal slice test strip portion.
Specifically, the electroplating in this step is the same as the electroplating of the holes in the production board, and the specific electroplating method is the prior art and is not described herein.
S102, milling a columnar crystal slice test strip part through a small milling machine, and slicing to test whether the columnar crystal meets the requirement;
according to the method, the columnar crystal slice test strip portion is arranged on the process edge of the production board, the effective board of the production board is not required to be damaged in subsequent slicing, and the columnar crystal slice test strip portion on the process strip is only required to be milled out, so that the columnar crystal quality can be tested, extra scrapping is reduced, the qualification rate is improved, and the cost is reduced. Because the first standard hole, inferior aperture, the aperture of minimum hole and second standard hole on the columnar crystal section test strip portion is inequality, and all be on a straight line, after cutting off columnar crystal section test strip, can grind a side, can grind out the cross-section of the test hole of different diameters simultaneously, detect with the columnar crystal to the test hole department of different diameters, thereby whether the columnar crystal in the inference production board effective plate is qualified, user operation is facilitated, simplify and get the section flow, and the efficiency is improved, and the cost is saved, and reduce in-process plate and scrap.
In an alternative embodiment, the first and second calibrated holes are each 1.0mm in diameter.
In an alternative embodiment, as shown in FIG. 3, the inner layer PAD121 of the secondary aperture, the inner layer PAD131 of the smallest aperture are arranged with independent minimum loop width offsets within the cell, and both inner layer PADs are connected to the aperture. The minimum ring width of the first standard hole and the second standard hole is 1.0mm (namely the first standard hole and the second standard hole are designed according to the minimum ring width of more than or equal to 1.0mm in a unit), copper drawing processing is carried out on the inner layer PAD111 of the first standard hole and the second standard hole, and the distance between the hole edge and the ring is 4 mils.
In this embodiment, the size of the columnar crystal section test strip portion is 8 × 13mm, a gong vacancy with a width of 2mm is arranged around the columnar crystal section, and a 3mm connecting position 15 is reserved on the columnar crystal section test strip portion. The routing data is added to the position of the routing data corresponding to the inner layer testing strip, 3 x 2mm routing residues are reserved for the routing data, routing and cutting are convenient to fix, and a dry film roller is prevented from being scratched at a notch after the cutting is dropped.
In this embodiment, the distance from the straight line where the first standard hole, the second standard hole, the minimum hole and the second standard hole are located to the slice edge is 1.3mm.
Specifically, the distance between the straight line where the hole is located and one side edge of the columnar crystal section test strip portion is 1.3mm, that is, the first standard hole, the second standard hole, the minimum hole and the second standard hole are arranged on one side edge of the columnar crystal section test strip portion (as in the embodiment shown in fig. 2, the first standard hole, the second standard hole, the minimum hole and the second standard hole are arranged close to the lower side of the columnar crystal section test strip portion).
The first standard hole, the secondary small hole, the minimum hole, and the second standard hole are all PTH holes. The positive of the dry film is all PTH hole design, the negative test PAD ring width is 10mil, PTH hole design.
The application also relates to a PCB which can adopt the PCB columnar crystal slicing method to slice and test columnar crystals. The PCB comprises a process edge, wherein the process edge comprises a columnar crystal section test strip part 10 (shown in figures 2 and 3), and the columnar crystal section test strip part comprises a first standard hole 11, a secondary small hole 12, a minimum hole 13 and a second standard hole 14 which are sequentially arranged along the same straight line at intervals; the diameters of the first standard hole and the second standard hole are the same, and the diameters of the first standard hole, the secondary small hole and the minimum small hole are sequentially reduced.
The PCB has the columnar crystal slice testing strip portion, simplifies the slicing process, improves the efficiency, saves the cost and reduces the scrapping of plates in the process when the columnar crystal slices are made.
While the invention has been described with reference to specific embodiments, the scope of the invention is not limited thereto, and those skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the invention. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (8)
1. A method for slicing columnar crystal of PCB is characterized in that,
arranging a columnar crystal slice test strip part on the process edge of the production plate;
electroplating the opening of the columnar crystal slice test strip part;
milling the columnar crystal slice test strip part by a small milling machine, and slicing to test whether the columnar crystal meets the requirement;
the test strip part of the columnar crystal slice comprises a first standard hole, a second standard hole, a minimum hole and a second standard hole which are sequentially arranged along the same straight line at intervals; the diameters of the first standard hole and the second standard hole are the same, and the diameters of the first standard hole, the secondary small hole and the minimum small hole are sequentially reduced.
2. The PCB columnar dicing method according to claim 1, wherein the first standard hole and the second standard hole each have a diameter of 1.0mm.
3. The method for slicing cylindrical crystal of PCB as recited in claim 1, wherein the inner PAD of the sub-small holes and the minimum small holes are designed according to minimum loop width compensation of independent position in unit, and the inner PAD is connected with the holes.
4. The PCB columnar dicing method according to claim 2, wherein a minimum ring width of the first standard hole and the second standard is 1.0mm; and copper drawing treatment is carried out on the inner layer PAD of the first standard hole and the second standard hole, and the distance between the hole edge and the ring is 4mil.
5. The PCB columnar crystal slicing method as recited in claim 1, wherein the size of the columnar crystal slice test strip is 8 x 13mm, a gong vacancy with a width of 2mm is arranged around the columnar crystal slice, and a 3mm connection site is reserved on the columnar crystal slice test strip.
6. The method for slicing cylindrical crystal of PCB as recited in claim 4, wherein the straight line of the first standard hole, the second standard hole, the minimum hole and the second standard hole is 1.3mm away from the slicing edge.
7. The PCB columnar crystal slicing method of claim 1, wherein the first standard hole, the secondary small hole, the minimum small hole and the second standard hole are all PTH holes.
8. A PCB used for the PCB columnar crystal slicing method according to any one of the claims 1 to 7, comprising a process edge, wherein the process edge comprises a columnar crystal slice test strip part which comprises a first standard hole, a secondary small hole, a minimum small hole and a second standard hole which are sequentially arranged along the same straight line at intervals; the diameters of the first standard hole and the second standard hole are the same, and the diameters of the first standard hole, the secondary small hole and the minimum small hole are sequentially reduced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210861606.9A CN115297612A (en) | 2022-07-22 | 2022-07-22 | PCB columnar crystal slicing method and PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210861606.9A CN115297612A (en) | 2022-07-22 | 2022-07-22 | PCB columnar crystal slicing method and PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115297612A true CN115297612A (en) | 2022-11-04 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210861606.9A Pending CN115297612A (en) | 2022-07-22 | 2022-07-22 | PCB columnar crystal slicing method and PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115297612A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4510446A (en) * | 1982-11-03 | 1985-04-09 | Burroughs Corporation | Test coupons for determining the registration of subsurface layers in a multilayer printed circuit board |
| CN201499372U (en) * | 2009-10-19 | 2010-06-02 | 惠州中京电子科技股份有限公司 | Pcb |
| CN207560434U (en) * | 2017-08-15 | 2018-06-29 | 惠州中京电子科技有限公司 | Convenient for the pcb board of Quality Detection |
-
2022
- 2022-07-22 CN CN202210861606.9A patent/CN115297612A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4510446A (en) * | 1982-11-03 | 1985-04-09 | Burroughs Corporation | Test coupons for determining the registration of subsurface layers in a multilayer printed circuit board |
| CN201499372U (en) * | 2009-10-19 | 2010-06-02 | 惠州中京电子科技股份有限公司 | Pcb |
| CN207560434U (en) * | 2017-08-15 | 2018-06-29 | 惠州中京电子科技有限公司 | Convenient for the pcb board of Quality Detection |
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