CN115255536B

CN115255536B - Welding process of endoscope heat pipe assembly

Info

Publication number: CN115255536B
Application number: CN202210830377.4A
Authority: CN
Inventors: 邵齐; 俞振南
Original assignee: Minxin Semiconductor Jiaxing Co ltd
Current assignee: Minxin Semiconductor Jiaxing Co ltd
Priority date: 2022-07-13
Filing date: 2022-07-13
Publication date: 2023-09-19
Anticipated expiration: 2042-07-13
Also published as: CN115255536A

Abstract

The application provides a welding process of an endoscope heat pipe assembly, and belongs to the technical field of endoscope pipes. A welding process of an endoscope heat pipe assembly, comprising the steps of: s1, setting solder paste at the bottom of an inner groove of a heat sink in a scribing dispensing mode; s2, pressing the heat pipe to an inner groove of the heat sink; s3, maintaining the heat pipe and the heat sink to be relatively fixed by means of the jig, and then welding at a high temperature; s4, filling red copper powder in a cavity formed between two ends of the heat pipe and the heat sink, coating solder paste on the outer side of the cavity on the surface of the red copper powder, keeping the heat pipe and the heat sink relatively fixed by means of the jig, and then welding at a high temperature; s5, cooling the heat pipe assembly to normal temperature.

Description

Welding process of endoscope heat pipe assembly

Technical Field

The application belongs to the technical field of endoscope tubes, and particularly relates to a welding process of an endoscope heat pipe assembly.

Background

In the welding process of the existing endoscope heat pipe assembly, the risks of poor appearance or poor heat conduction efficiency of the assembly and oral burn caused by incomplete filling of a welding gap between a heat pipe and a heat sink, high void ratio and overflow of welding flux into an inner wall and an outer wall of the heat sink or a positioning hole exist.

Disclosure of Invention

The application aims to solve the problems in the prior art, provides a welding process of an endoscope heat pipe assembly, and solves the problems that the heat conduction efficiency of the assembly is poor and the risk of burning an oral cavity is easily caused.

The aim of the application can be achieved by the following technical scheme:

a welding process of an endoscope heat pipe assembly, comprising the steps of:

s1, setting solder paste at the bottom of an inner groove of a heat sink in a scribing dispensing mode;

s2, pressing the heat pipe to an inner groove of the heat sink;

s3, maintaining the heat pipe and the heat sink to be relatively fixed by means of the jig, and then welding at a high temperature;

s4, filling red copper powder in a cavity formed between two ends of the heat pipe and the heat sink, coating solder paste on the outer side of the cavity on the surface of the red copper powder, keeping the heat pipe and the heat sink relatively fixed by means of the jig, and then welding at a high temperature;

s5, cooling the heat pipe assembly to normal temperature.

In the welding process of the endoscope heat pipe assembly, the heat pipe is pressed to enable the surface of the heat pipe to be flush with the surface of the heat sink.

In the welding process of the endoscope heat pipe assembly, in step S2, solder paste overflowing between the heat pipe and the inner groove side wall is removed.

In the welding process of the endoscope heat pipe assembly, in step S2, it is required to uniformly and smoothly press the heat pipe to the heat sink inner groove.

In the above welding process of the endoscope heat pipe assembly, in step S2, the hollow portion between the heat pipe and the inner groove side portion is filled with solder paste.

In the above-described welding process of the endoscope heat pipe assembly, the solder paste needs to be kept continuous in step S1.

In the welding process of the endoscope heat pipe assembly, the high-temperature welding is performed by adopting reflow welding equipment, and the external environment temperature is controlled at 20-28 ℃ and the humidity is 60-80%.

In the welding process of the endoscope heat pipe assembly, the highest melting point of the solder paste is 260 ℃.

In the welding process of the endoscope heat pipe assembly, in step S3, after high-level welding, the head end and the tail end of the heat pipe form hollow parts with the side walls of the grooves respectively.

In the welding process of the endoscope heat pipe assembly, when the copper powder is filled, the copper powder is filled to be lower than the surface of the heat sink, and a dent is formed.

In the welding process of the endoscope heat pipe assembly, the outer layer is coated on the surface of the red copper powder by a dispensing mode of quantitatively dispensing the tin paste.

In the above welding process of the endoscope heat pipe assembly, in step S5, the filled extra copper powder and solder paste are removed.

Compared with the prior art, the application has the following advantages:

1. the welding method of the heat pipe assembly can further improve the yield and the attractiveness of welding assembly.

2. The solder paste is arranged in a scribing dispensing mode, so that after the heat pipe is pressed to the inner groove, gaps between the heat pipe and the heat sink are filled with enough solder paste, and the void ratio between the heat pipe and the heat sink is reduced in the first reflow soldering process.

3. Aiming at the cavity parts formed between the two ends of the heat pipe and the heat sink, the red copper powder is filled, the red copper powder is suitable for supporting, the fluidity of the molten tin paste is reduced, the flow of the tin paste is controlled, the molten tin paste is more smooth, no gap is reserved between the heat pipe and the heat sink, and the welding attractiveness is maintained.

Drawings

FIG. 1 is a schematic illustration of a heat pipe and heat sink separated structure in accordance with the present application;

FIG. 2 is a schematic diagram of a heat pipe and heat sink of the present application after high temperature welding;

FIG. 3 is a schematic diagram of two structures of red copper powder and solder paste filled in the hollow part of A-A in FIG. 2;

fig. 4 is a schematic cross-sectional view of B-B of fig. 2.

In the drawing the view of the figure,

2. a heat sink; 21. an inner tank; 3. a heat pipe; 4. a hollow portion; 5. copper powder; 6. and 7, solder paste.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

As shown in fig. 1 to 4, a in fig. 3 is that the solder paste 7 on the outer surface of the red copper powder is concave, and b is that the solder paste 7 on the outer surface of the red copper powder is approximately horizontal.

A welding process of an endoscope heat pipe assembly, comprising the steps of:

s1, setting solder paste 6 at the bottom of an inner groove 21 of a heat sink 2 in a scribing dispensing mode;

in the application, the solder paste 6 can be uniformly coated on the bottom of the inner groove 21 by a scribing dispensing mode, so that the subsequent cavity part 4 between the heat pipe 3 and the inner groove 21 is reduced.

S2, pressing the heat pipe 3 to the inner groove 21 of the heat sink 2;

in the application, when the heat pipe 3 is pressed to the inner groove 21 of the heat sink 2, and the solder paste 6 is extruded from between the heat pipe 3 and the side wall of the inner groove 21, the heat pipe 3 can be fully contacted with the side wall and the bottom wall of the inner groove 21 by the solder paste 6 better.

S3, maintaining the heat pipe 3 and the heat sink 2 to be relatively fixed by means of the jig, and then welding at a high temperature;

in the application, the heat pipe 3 and the heat sink 2 are kept fixed relatively by the jig, so that the influence on the position of the heat pipe 3 when the solder paste 6 is heated and flows in the subsequent high-temperature welding is reduced, and the possibility of the movement of the heat pipe 3 is reduced. In this embodiment, the fixture used can fix the heat pipe 3, the head and tail ends of the heat sink 2 and the middle section, and of course, other fixing modes can be adopted, and only the relative position of the heat pipe 3 and the heat sink 2 needs to be kept fixed.

S4, filling red copper powder 5 into a cavity part 4 formed between two ends of the heat pipe 3 and the heat sink 2, coating the outer side of the cavity part with tin paste 7 on the surface of the red copper powder 5, keeping the heat pipe 3 and the heat sink 2 relatively fixed by means of a jig, and then welding at a high temperature;

the reason for forming the hollow portion 4 is mainly that the heat pipe 3 is smaller in size, the heat pipe 3 is generally made of copper material, the texture of the copper material is softer, so that when the heat pipe 3 is processed, deviation between the size of the heat pipe 3 and the designed size is generated, a gap exists between the heat pipe 3 and the inner groove 21 after the heat pipe 3 is pressed into the inner groove 21, even if the gap is filled with solder paste 7 before step S3, after high-temperature welding, a part of the hollow portion 4 still can be formed due to slow filling of the gap caused by melting fluidity of the solder paste 7, but generally, the part mainly generating the hollow portion 4 is positioned at two ends of the heat pipe 3.

Filling the red copper powder 5, the red copper powder 5 is suitable for supporting, the fluidity of the molten tin paste 7 is reduced, the flow of the tin paste 7 is controlled, the molten tin paste is more smooth, no gap is reserved between the heat pipe 3 and the heat sink 2, and the welding attractiveness is maintained. The solder paste 7 on the surface can automatically melt and flow on the surface of the red copper powder 5 to form a relatively flat surface, so that the surface is more attractive.

If the simple addition of the solder paste 7 is performed, the solder paste 7 flows after melting after heating, so that the solder paste 7 and the solder paste 6 are connected together, and even if the cavity portion 4 is filled with the solder paste 7, the cavity portion cannot be filled due to the flow of the solder paste 7 after melting, so that it is necessary to fill the red copper powder 5 with a pad in the place of the cavity portion 4, and then fill the surface of the red copper powder 56 with the solder paste 7 again, so that the cavity portion 4 can be filled at one time.

S5, cooling the heat pipe assembly to normal temperature.

Specifically, the heat pipe 3 is pressed to make the surface of the heat pipe 3 flush with the surface of the heat sink 2. The design can facilitate the fixation of the heat pipe 3 and the heat sink 2.

Specifically, in step S2, the solder paste 6 overflowing between the heat pipe 3 and the side wall of the inner tub 21 is removed. The excess solder paste 6 is removed by a soft scraper.

Specifically, in step S2, it is required to uniformly and smoothly press the heat pipe 3 to the inner groove 21 of the heat sink 2. This middling pressure pipe mode can compress tightly to inside groove 21 at heat pipe 3, can make the solder paste 6 of bottom evenly complete distribution between inside groove 21 bottom and heat pipe 3, makes it have better radiating effect.

Specifically, in step S1, the solder paste 6 needs to be kept continuous. This design can reduce the possibility of voids between the bottom of the inner tank 21 and the heat pipe 3 after the heat pipe 3 is pressed into the inner tank 21.

Specifically, the high-temperature welding is performed by adopting reflow soldering equipment, the external environment temperature is controlled at 20-28 ℃, and the humidity is 60-80%.

Specifically, the highest melting point of the solder pastes 6, 7 is 260 ℃.

Specifically, when the copper powder 5 is filled, it is filled to a level lower than the surface of the heat sink 2, and a recess is formed. After the red copper powder 5 is sunken, the solder paste 7 can not flow everywhere after being melted, most of the solder paste 7 can automatically fill the sunken parts, and then a small part of the solder paste 7 and other solder pastes 6 outside the red copper powder 5 are connected together to form a whole, so that the surface of the solder paste is flat, the surface has good appearance, and meanwhile, the connection between the heat pipe 3 and the heat sink 2 can be ensured to be stable and reliable.

Specifically, the outer layer coats the solder paste 7 on the surface of the red copper powder 5 by a dispensing mode of quantitatively dispensing the solder paste 7, and the surface of the solder paste 7 is formed into a substantially plane or a concave shape. In this way, the amount of outgoing solder paste 7 can be controlled relatively stably.

Specifically, in step S5, the filled extra copper powder 5 and the solder paste 7 are removed. The filled and overflowed red copper powder 5 and the solder paste 7 are cleaned, so that the possibility of overflowing the solder paste can be effectively reduced.

It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.

Furthermore, the description of "first," "second," etc. in this disclosure is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. Meanwhile, the meaning of "and/or" appearing throughout the text is to include three schemes, taking "a and/or B" as an example, including a scheme, or B scheme, or a scheme that a and B satisfy simultaneously. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present application.

All the components are general standard components or components known to the person skilled in the art, and the structures and principles of the components are known to the person skilled in the art through technical manuals or through routine experimental methods.

The specific embodiments described herein are offered by way of example only to illustrate the spirit of the application. Those skilled in the art may make various modifications or additions to the described embodiments or substitutions thereof without departing from the spirit of the application or exceeding the scope of the application as defined in the accompanying claims.

Claims

1. A welding process of an endoscope heat pipe assembly, comprising the steps of:

s1, setting solder paste (6) at the bottom of an inner groove (21) of a heat sink (2) in a scribing dispensing mode;

s2, pressing the heat pipe (3) to an inner groove (21) of the heat sink (2);

s3, maintaining the heat pipe (3) and the heat sink (2) to be relatively fixed by means of the jig, and then welding at a high temperature;

s4, filling the red copper powder (5) in a cavity part (4) formed between the two ends of the heat pipe (3) and the heat sink (2), coating the outer side of the cavity part with the tin paste (7) on the surface of the red copper powder (5), keeping the heat pipe (3) and the heat sink (2) relatively fixed by means of a jig, and then welding at a high temperature;

s5, cooling the heat pipe (3) assembly to normal temperature.

2. The welding process of an endoscopic heat pipe assembly according to claim 1, characterized in that the heat pipe (3) is pressed to the level of the heat pipe (3) surface with the surface of the heat sink (2).

3. Welding process of an endoscopic heat pipe assembly according to claim 1, characterized in that in step S2, solder paste (6) overflowing between the heat pipe (3) and the side wall of the inner tank (21) is removed.

4. The welding process of an endoscopic heat pipe assembly according to claim 1, wherein in step S2, a uniform and smooth pressing of the heat pipe (3) to the inner groove (21) of the heat sink (2) is required.

5. The welding process of an endoscopic heat pipe assembly according to claim 1, wherein in step S1, the solder paste (6) needs to be kept continuous.

6. The welding process of the endoscope heat pipe assembly according to claim 1, wherein the high-temperature welding is performed by adopting reflow welding equipment, and the external environment temperature is controlled to be 20-28 ℃ and the humidity is controlled to be 60-80%.

7. A welding process of an endoscopic heat pipe assembly according to claim 1, characterized in that when filling with the copper powder (5), it fills to below the surface of the heat sink (2) and forms a recess.

8. The welding process of the endoscope heat pipe assembly according to claim 1, wherein the outer layer is coated on the surface of the red copper powder (5) by a dispensing mode of quantitatively dispensing the solder paste (7).