CN115243538B - Patch method, disc transfer mechanism, device, equipment and readable storage medium - Google Patents
Patch method, disc transfer mechanism, device, equipment and readable storage medium Download PDFInfo
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- CN115243538B CN115243538B CN202211161481.5A CN202211161481A CN115243538B CN 115243538 B CN115243538 B CN 115243538B CN 202211161481 A CN202211161481 A CN 202211161481A CN 115243538 B CN115243538 B CN 115243538B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
- H05K13/0419—Feeding with belts or tapes tape feeders
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
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Abstract
The application discloses a chip mounting method, a disc transfer mechanism, a device, equipment and a readable storage medium, wherein the method comprises the following steps: controlling a crystal taking mechanism arranged on the chip mounting device to suck and move the electronic element to a die head of a disc rotary-mounting mechanism arranged on the chip mounting device; acquiring first image information of the electronic element sucked by the die head; and controlling the disc transfer mechanism to paste the electronic element to a dispensing area of the substrate based on the first image information. This application changes through disc type and pastes mechanism and carry out the paster to electronic component, has shortened step-by-step distance, and disc type changes and pastes the mechanism and can hold a plurality of die heads, when adopting a plurality of die heads, can circulate the paster, has shortened paster latency. Therefore, the electronic element patch efficiency is improved.
Description
Technical Field
The present application relates to the field of RFID, and in particular, to a method, a mechanism, an apparatus, a device, and a readable storage medium for attaching a patch.
Background
At present, the electronic component placement device in the RFID industry is usually in a step-and-step continuous type, and the electronic component needs to be flipped and transferred up and down to the substrate.
However, the mounting efficiency of the electronic component is affected by the step distance, and when the electronic component is mounted by using the step-and-continue apparatus, the step distance of the step-and-continue apparatus is long, and the mounting time of the electronic component is long, which results in low mounting efficiency of the electronic component.
Disclosure of Invention
In view of the above, the present application provides a mounting method, a disc transfer mechanism, an apparatus, a device and a readable storage medium, which are used to improve the mounting efficiency of electronic components.
In order to achieve the above object, the present application provides a mounting method applied to a mounting device, the method including:
controlling a crystal taking mechanism arranged on the chip mounting device to suck and move the electronic element to a die head of a disc rotary-mounting mechanism arranged on the chip mounting device;
acquiring first image information of the electronic element sucked by the die head;
and controlling the disc transfer mechanism to paste the electronic element to a dispensing area of the substrate based on the first image information.
Illustratively, the controlling the rotary disc pasting mechanism to paste the electronic component to the dispensing area of the substrate based on the first image information comprises:
determining first position information and a deflection angle of the electronic element based on the first image information;
controlling a correction assembly arranged on the disc transfer mechanism to correct the electronic element to a first preset position and a preset angle based on the first position information and the deflection angle;
and after the electronic element is corrected, controlling the disc rotary-pasting mechanism to paste the electronic element to a dispensing area of the substrate.
For example, after the electronic component is corrected, the controlling the rotary disc pasting mechanism to paste the electronic component to the dispensing area of the substrate includes:
controlling the disc transfer mechanism to move the electronic element to a second preset position above the substrate;
acquiring second image information of the dispensing area;
calculating the offset information of the dispensing area and a preset dispensing area based on the second image information;
determining compensation information for pasting the electronic element from the second preset position to the dispensing area based on the offset information;
and controlling the disc transfer mechanism to paste the electronic element to the dispensing area of the base material based on the compensation information.
For example, before controlling the carousel mechanism to attach the electronic component to the dispensing area of the substrate based on the first image information, the method includes:
after the dispensing mechanism finishes dispensing the first row of base materials, controlling a moving mechanism arranged on the surface mounting device to move the material belt for a preset distance so as to enable the second row of base materials to reach a third preset position;
and after the second row of base materials reach the third preset position, controlling the glue dispensing mechanism to dispense glue on the second row of base materials.
For example, after controlling the carousel mechanism to paste the electronic component to the dispensing area of the substrate based on the first image information, the method includes:
acquiring third image information of the product after the paster is attached;
determining whether the product is a qualified product based on the third image information;
if not, the unqualified product is calibrated and the patch is re-mounted.
Illustratively, the controlling the crystal taking mechanism arranged in the chip device to suck and move the electronic element to the front of the die head arranged in the disc transfer mechanism of the chip device comprises:
acquiring fourth image information of the electronic element in the wafer disc;
determining whether the electronic component is a qualified product based on the fourth image information, and determining fourth position information of the electronic component;
if yes, moving a suction nozzle in the crystal taking mechanism to a suction position with a preset height in the vertical direction of the qualified electronic component based on the fourth position information.
Illustratively, to achieve the above object, the present application further provides a disc transfer mechanism, wherein the disc transfer mechanism comprises: the device comprises a dispersing end, a balance stabilizer bar, a correction adjusting platform and an angle corrector;
the tail end of the dispersing end is provided with a die head;
the balance stabilizer bar is connected with adjacent radiating ends and is connected end to end;
the correction adjusting platform is arranged at the tail end of the diffusing end and is used for adjusting the position of the die head;
the angle corrector is arranged at the tail end of the divergent end and is used for adjusting the rotation angle of the die head.
Illustratively, to achieve the above object, the present application also provides a patch device including:
the first control module is used for controlling a crystal taking mechanism arranged on the chip mounting device to suck and move the electronic element to a die head of a disc rotary-mounting mechanism arranged on the chip mounting device;
the first acquisition module is used for acquiring first image information of the electronic element sucked by the die head;
and the second control module is used for controlling the disc transfer mechanism to paste the electronic element to the dispensing area of the base material based on the first image information.
Illustratively, to achieve the above object, the present application further provides a patch device including a memory, a processor, and a patch program stored on the memory and operable on the processor, the patch program implementing the steps of the patch method as described above when executed by the processor.
Illustratively, to achieve the above object, the present application further provides a computer-readable storage medium having stored thereon a tile program, which when executed by a processor, implements the steps of the tile method as described above.
Compared with the prior art, the electronic element is pasted by the stepping continuous device, and the efficiency of pasting the electronic element is low due to the long stepping distance and the long time of pasting the electronic element. The method comprises the steps of controlling a crystal taking mechanism arranged on a chip mounting device to suck and move an electronic element to a die head of a disc rotary-mounting mechanism arranged on the chip mounting device; acquiring first image information of the electronic element sucked by the die head; and controlling the disc transfer mechanism to paste the electronic element to a dispensing area of the substrate based on the first image information. This application changes to paste the mechanism through the disc type and carries out the paster to electronic component, has shortened step-by-step distance, and the disc type changes to paste the mechanism and can hold a plurality of die heads, when adopting a plurality of die heads, can circulate the paster, has shortened paster latency. Therefore, the electronic element chip mounting efficiency is improved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art to obtain other drawings without inventive exercise.
FIG. 1 is a schematic flow chart of a first embodiment of the application of the patch method;
fig. 2 is a schematic view of the electronic component mounting method according to the first embodiment of the present application;
FIG. 3 is a schematic view of a 6-point disk and a 10-point disk of the first embodiment of the present application;
FIG. 4 is a schematic view of an electronic component according to a first embodiment of the present application;
FIG. 5 is a schematic view of a single disc multi-row patch of the first embodiment of the patch method of the present application;
FIG. 6 is a schematic view of a multi-disc multi-column patch of the first embodiment of the patch method of the present application;
fig. 7 is a schematic structural diagram of a hardware operating environment according to an embodiment of the present application.
The implementation, functional features and advantages of the objectives of the present application will be further explained with reference to the accompanying drawings.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The present application provides a patch method, and referring to fig. 1, fig. 1 is a schematic flow diagram of a first embodiment of the patch method of the present application.
Embodiments of the patch method are provided herein, and it is noted that although a logical order is shown in the flow diagrams, in some cases, the steps shown or described may be performed in an order different than here. For convenience of description, the following omits to perform various steps of the subject description patch method including:
and S10, controlling a crystal taking mechanism arranged on the chip mounting device to suck and move the electronic element to a die head of a disc rotary-mounting mechanism arranged on the chip mounting device.
And S20, acquiring first image information of the electronic element sucked by the die head.
And step S30, controlling the disc transfer mechanism to paste the electronic element to a dispensing area of the base material based on the first image information.
The method comprises the following specific steps:
and S10, controlling a crystal taking mechanism arranged on the chip mounting device to suck and move the electronic element to a die head of a disc rotary-mounting mechanism arranged on the chip mounting device.
In this embodiment, the chip mounting device includes a chip-taking mechanism and a disc transfer mechanism, and the disc transfer mechanism includes a plurality of dies. The crystal taking mechanism is used for sucking the electronic elements in the crystal disc, turning over and moving to the die head of the disc rotary pasting mechanism. As shown in fig. 2, 201 is a disk transfer mechanism, 202 is a die head, 203 is a disk boss and a patch suction nozzle (not shown) on the die head, and 204 is a crystal taking mechanism and an inverted crystal taking mechanism. Wherein the crystal taking mechanism comprises a suction nozzle and a vacuum (not shown in the figure).
Specifically, because the product is packaged in an inverted manner, the product needs to be turned over after the crystal taking mechanism absorbs the electronic component and then moves to the die head of the disc rotating and pasting mechanism, and the chip suction nozzle in the die head absorbs the electronic component to the die head.
Illustratively, the disc transfer mechanism comprises one or more dies, e.g., as shown in fig. 3, the discs comprise 6-point discs, 10-point discs, 3-point discs (not shown), 4-point discs (not shown), etc. The number of dots is the number of dies contained in the disk, for example, 6 dies contained in a 6-dot disk.
In production, any die head can be selected for pasting according to the requirements of production capacity and the like. For example, as shown in fig. 3, die # 1 in a 6-point disk may be selected for the tiling, or die # 1 and die # 5 in a 6-point disk may be selected for the tiling, or all of the dies may be selected for the tiling. The chip mounting efficiency of the electronic element is in direct proportion to the number of the selected chip mounting die heads, namely, if the number of the die heads for chip mounting is more, the chip mounting efficiency of the electronic element is higher; the smaller the number of dies used for mounting, the lower the mounting efficiency of the electronic component.
Illustratively, the controlling the crystal taking mechanism arranged in the chip device to suck and move the electronic element to the front of the die head arranged in the disc transfer mechanism of the chip device comprises:
step a, obtaining fourth image information of the electronic element in the wafer disc.
In this embodiment, the fourth image information is image information of the wafer disk acquired by a vision camera in the electronic component positioning area of the wafer disk, the image includes image information of a plurality of electronic components, and the image is subjected to multi-point positioning inspection to determine the position information of the electronic components in the wafer disk.
And b, determining whether the electronic component is qualified or not based on the fourth image information, and determining fourth position information of the electronic component.
Specifically, as shown in fig. 4, 401 is an electronic component wafer, 402 is an electronic component, 403 is a picking mechanism (including a suction nozzle and vacuum), 404 is an inverted electronic component, and 405 is a vision system. After the visual system is aligned and opened, the visual system is automatically positioned to the position of the electronic component A which needs to be mounted by a paster at present, and the actual deviation value of the electronic component is fed back in real time, wherein X is +0.000mm, Y is: +0.000mm to ensure proper alignment of the wafer disk's electronic components. On the basis, the electronic components are subjected to multi-point positioning inspection, namely, the position information and the defect information of the verification wafer of the adjacent electronic components are inspected by taking the electronic component A as the center. For example, a 9-point positioning inspection method is used to detect the position information of 8 adjacent electronic components of the electronic component a while positioning the electronic component a in the middle region, and to feed back the actual deviation value of the electronic component. This application carries out electronic component's location through the multiple spot location inspection method, compares in once fixing a position, and multiple spot location inspection can improve each electronic component's among the brilliant disc positioning accuracy, further improves the success rate that the suction nozzle was absorb, reduces the offset after the electronic component upset, avoids the die head can't absorb electronic component.
Wherein the defect types include: lack of electronic components, electronic component breakage, etc. Specifically, whether the electronic component is absent is determined by the area lightness, chromaticity, and the like of the image, and whether the electronic component is broken is determined by the electronic component size. If the electronic element has defects, the defective electronic element is calibrated, and the crystal taking mechanism skips the defective electronic element. This application is through rejecting unqualified electronic component, has avoided the suction nozzle to inhale promptly, also avoids unqualified electronic component to install to the substrate on lead to failures such as unable switch on, has further improved the installation effectiveness and has improved the qualification rate of product.
And c, if so, moving a suction nozzle in the crystal taking mechanism to a suction position with a preset height in the vertical direction of the qualified electronic component based on the fourth position information.
In this embodiment, when the crystal taking mechanism sucks a qualified electronic component, the qualified electronic component to be sucked is positioned by combining a visual camera with a multipoint positioning method, the XY-axis coordinates of the electronic component are determined, and the height of the suction nozzle sucking the electronic wafer is preset, wherein the preset height is set as required, which is not specifically limited in this embodiment. The height of the suction nozzle is preset, the electronic components are sucked one by one at the same height, each electronic component can be ensured to be in the same coordinate system when being sucked, the repeated positioning precision of the pickup is guaranteed to reach the grade of +/-0.01 mm, and the pickup precision is less than or equal to +/-0.035 mm.
The crystal taking mechanism adopts a C-shaped or arch-shaped mode, so that the optical alignment is convenient after the installation of visual positioning, the position and the offset angle after the turnover are ensured to be in a calculation and monitoring range through a visual system, and the turnover receiving mode can be changed as required, including the rotation direction and the rotation angle.
And S20, acquiring first image information of the electronic element sucked by the die head.
In this embodiment, as shown in fig. 2, 205 the vision camera in the reverse alignment collects the first image information through the vision camera in the reverse alignment area, where the first image information is an image when the electronic component is reversed and moved to the die by the crystal taking mechanism. The first image information includes current position information and a deflection angle of the electronic component.
And step S30, controlling the disc rotary-pasting mechanism to paste the electronic element to a dispensing area of the base material based on the first image information.
In this embodiment, as shown in fig. 2, 206 is a tape, 207 is a dispensing area, and 208 is a finished product of the substrate after being mounted with a patch, the position and the deflection angle of the electronic component are adjusted according to the first image information, and the disc rotating and mounting mechanism is controlled to rotate to drive the electronic component to move to the dispensing area of the substrate for mounting the patch.
Illustratively, the controlling the rotary disc pasting mechanism to paste the electronic component to the dispensing area of the substrate based on the first image information comprises:
step S31, determining first position information and a deflection angle of the electronic component based on the first image information.
In the present embodiment, the coordinate point (x) of the electronic component on the die is determined by the first image information 1 ,y 1 ,z 1 ) And a deflection angle theta.
And step S32, controlling a correction assembly arranged on the disc transfer mechanism to correct the electronic element to a first preset position and a preset angle based on the first position information and the deflection angle.
In this embodiment, the disc transfer mechanism is provided with a correction assembly, and the correction assembly includes: a correcting adjusting stage and an angle corrector (210 in fig. 2), wherein the correcting adjusting stage can adjust the coordinate value of the electronic component to a first preset position, and the angle corrector can adjust the deflection angle of the electronic component to a preset angle. Outputting the transfer coordinates (x) of the electronic component after finishing the correction 2 ,y 2 ,z 2 ) And corrected angle theta 1 。
For example, the first preset position coordinate is set as needed, and this embodiment is not particularly limited. For example, the coordinates of the first preset position are (1,1,1).
For example, the preset angle is set according to needs, and the embodiment is not particularly limited. For example, the preset angle is 5 °.
In this embodiment, the coordinate values of the electronic elements are adjusted by correcting the adjusting table, so that the levelness of the electronic elements at the point position of each die head can be guaranteed to be consistent, the deflection angle of the electronic elements is compensated by the angle corrector, and the pasting angle of each electronic element is guaranteed to reach the standard. This application is through changeing the position and the deflection angle of pasting each die head department electronic component of mechanism to the disc and compensating, precision when having improved the paster avoids electronic component deviant too big and the paster failure, has further improved the paster effect and the qualification rate of product.
And step S33, after the electronic element is corrected, controlling the disc transfer mechanism to transfer the electronic element to a dispensing area of the substrate.
In this embodiment, as shown in fig. 2, 209 is a visual camera of the dispensing area, the position of which is calibrated before dispensing, and the coordinate thereof is determined to be (x) 3 ,y 3 ,z 3 ). Because the position of the electronic element in the substrate is fixed, the distance between the preset dispensing position and the second preset position of the electronic element above the substrate is fixed. Therefore, the actual dispensing area is determined through the visual camera of the dispensing area, the offset information between the actual dispensing area and the preset dispensing area is calculated, and the position of the electronic element is compensated on the basis, so that the electronic element is mounted on the dispensing area.
For example, after the electronic component is corrected, the controlling the rotary disc pasting mechanism to paste the electronic component to the dispensing area of the substrate includes:
step S331, controlling the disc transferring mechanism to move the electronic component to a second predetermined position above the substrate.
In this embodiment, each die head of the disc transfer mechanism sucking the electronic components performs the mounting while moving to the second predetermined position above the substrate. The second preset position is set as required, and this embodiment is not particularly limited. For example, the coordinates of the vision camera of the dispensing area are (0,2,2), and the coordinates of the second preset position are (1,1,1).
Step S332, acquiring second image information of the dispensing area.
In this embodiment, when it is detected that the electronic component moves to the second preset position, the visual camera of the dispensing area collects second image information of the dispensing area.
The detection method for the electronic component moving to the second preset position can be that an image of the electronic component is collected through a visual camera, and coordinates are determined; and when the disc transfer mechanism reaches the preset rotation angle, determining that the electronic element moves to a second preset position. The preset rotation angle is set as required, and this embodiment is not specifically limited. For example, after the die head in the 6-point disc sucks the electronic component, the die head rotates 135 degrees to reach the second preset position.
Step S333, based on the second image information, calculating offset information between the dispensing area and a preset dispensing area.
In this embodiment, the position information of the dispensing area is determined according to the image of the dispensing area acquired by the visual camera. And calculating offset information according to the position information of the actual dispensing area and the position information of the preset dispensing area, wherein the offset information comprises an XYZ axial offset value, an offset angle and the like.
Step S334, determining compensation information for attaching the electronic component from the second preset position to the dispensing area based on the offset information;
step S335, based on the compensation information, controlling the disc rotating and pasting mechanism to paste the electronic component to the dispensing area of the substrate.
In this embodiment, the compensation information is distance information and angle information of movement of a die head for attaching the electronic component to the actual dispensing area, and the distance between the second preset position of the electronic component and the preset dispensing area is fixed, and the compensation information is determined according to the position information of the actual dispensing area and the offset information between the preset dispensing areas. For example, the second preset position of the electronic component is (2,2,2), the preset dispensing region is (0,0,0), and the actual dispensing region is (1,1,0), then the electronic component needs to be moved by 2 unit lengths along the XYZ axial direction, and the electronic component is moved by 1,1,2 unit lengths along the XYZ axial direction after comparing the positions of the preset dispensing region and the actual dispensing region and compensating.
Compared with the prior art, the electronic element is pasted by the stepping continuous device, and the efficiency of pasting the electronic element is low due to the long stepping distance and the long time of pasting the electronic element. The method comprises the steps of controlling a crystal taking mechanism arranged on a chip mounting device to suck and move an electronic element to a die head of a disc rotary-mounting mechanism arranged on the chip mounting device; acquiring first image information of the electronic element sucked by the die head; and controlling the disc transfer mechanism to paste the electronic element to a dispensing area of the substrate based on the first image information. This application changes to paste the mechanism through the disc type and carries out the paster to electronic component, has shortened step-by-step distance, and the disc type changes to paste the mechanism and can hold a plurality of die heads, when adopting a plurality of die heads, can circulate the paster, has shortened paster latency. Therefore, the electronic element patch efficiency is improved.
Illustratively, based on the first embodiment of the patch method of the present application, a second embodiment is provided, where the method further includes:
and S40, after the dispensing mechanism finishes dispensing the first row of base materials, controlling a moving mechanism arranged on the chip mounting device to move the material belt for a preset distance so as to enable the second row of base materials to reach a third preset position.
In this embodiment, the material tape includes one or more rows of substrates, and when it is detected that the first row of substrates is subjected to dispensing and mounting, the moving mechanism is controlled to move the material tape by a preset distance along the Y-axis direction, so that the second row of substrates is moved to a third preset position and coincides with the first row of substrates at the position where the substrate is subjected to dispensing and mounting, thereby ensuring the mounting accuracy.
And S50, controlling the glue dispensing mechanism to dispense glue to the second row of base materials after the second row of base materials reach the third preset position.
In this embodiment, after the second row of substrates reaches the third predetermined position, the dispensing mechanism dispenses the second row of substrates. If the third row of base materials exist, after the second row of base materials are subjected to adhesive dispensing and patching, the third row of base materials are moved to a third preset position.
Specifically, when the patch is carried out through the disc rotating and pasting mechanism, multi-column type patch mounting can be carried out. For example, as shown in fig. 5, 501 is die 1, 502 is die 2, 503 is the first row of substrates, and 504 is the second row of substrates. The material belt comprises two rows of base materials, and after the first row of base materials are dispensed, the die head 1 carries out surface mounting. After the die head 1 finishes the paster, the material belt is moved upwards along the Y axis, so that the current position of the second row of base materials is superposed with the glue dispensing position of the first row of base materials, at the moment, glue dispensing is carried out on the second row of base materials, and the die head 2 is adopted for paster. And after the second row of base materials are pasted with the patches, moving the material belt downwards, pasting the patches on the first row of base materials, and repeating the steps.
Furthermore, multiple rows of substrates on the same material belt can be pasted through a plurality of disc rotating and pasting mechanisms. For example, 2 10-point disks are used to attach 4 rows of substrates, and the disks and the number of rows of substrates are numbered sequentially from top to bottom as shown in FIG. 6. When 2 discs are adopted, 2 rows of substrates in the material belt can be simultaneously pasted, for example, 1,3 rows of substrates can be simultaneously pasted.
The utility model provides a floated carousel of multimode head changes pastes mechanism can guarantee that each row of substrate has sufficient Y axial offset distance in the material area, satisfies the point and glues the paster demand, realizes that Y axle multiseriate formula point glues the paster. And this structure satisfies multiseriate paster and does not stop, has improved electronic component's paster efficiency.
Illustratively, based on the second embodiment of the patch method of the present application, a third embodiment is provided, where the method further includes:
and S60, acquiring third image information of the product after the patch is attached.
In this embodiment, after the step of mounting the patch, the material tape can move along the X axis in a stepping manner, and the third image information of the product after the patch is collected by the vision system to be inspected.
And step S70, determining whether the product is a qualified product or not based on the third image information.
In this embodiment, the collected third image information after the patch is attached is inspected to determine whether the product is a qualified product. The types of rejects include: the offset angle is greater than the preset angle, the electronic element deviates from the preset patch area, and the like. Wherein, predetermine the angle and predetermine the paster regional setting according to the production demand, for example, predetermine the angle and be 3.
And S80, if not, calibrating the unqualified product and re-mounting the sheet.
In this embodiment, if the product is an unqualified product, the unqualified product is calibrated, so that the unqualified product is re-attached later. If the product is qualified, hot-pressing and curing are carried out by adopting a plurality of groups of equipment, the surface is simultaneously contacted with a hot-pressing plane up and down, the hot-pressing effect is ensured to be completely cured, meanwhile, the step can be completed at 100-200 ℃ for 5-10s by adopting low-temperature high-speed mode hot pressing, and the product is ensured to be bound and well-functioning after curing. And in order to ensure the step interval of the hot pressing section of 5-10s, a buffer memory is arranged, the buffer memory can realize effective circulation with the detection function, and the detection is ensured to be not interrupted.
This application is examined the product behind the paster, rejects the defective work to carry out paster again to the defective work, improved the qualification rate of product.
The method adopts a mode of coordinating a plurality of groups of vision systems to carry out surface mounting, coordinates and consistence of electronic element positioning vision, overturning alignment vision, dispensing positioning vision, surface mounting post-inspection vision and the like, judges and compensates each other, and can effectively control the precision of each link. Compared with the traditional patch integrated algorithm, the integrated algorithm is split into a plurality of independent algorithms such as positioning, transferring and patch mounting after the disc transfer mechanism is added for receiving and transferring, so that the stacking calculated amount is reduced, and the downtime is reduced. And the algorithm separation can improve the patch efficiency of the electronic element. Specifically, when the positioning vision is used for positioning and absorbing the electronic element, the electronic element on the die head is compensated by the overturning alignment vision at the same time, and the adhesive dispensing positioning vision can synchronously dispense adhesive patches, so that the patch dispensing efficiency of the electronic element is greatly improved.
Illustratively, to achieve the above object, the present application further provides a disc transfer mechanism, wherein the disc transfer mechanism comprises: the device comprises a dispersing end, a balance stabilizer bar, a correction adjusting platform and an angle corrector;
the tail end of the dispersing end is provided with a die head;
the balance stabilizer bar is connected with adjacent radiating ends and is connected end to end;
the correction adjusting platform is arranged at the tail end of the dispersing end and is used for adjusting the position of the die head;
the angle corrector is arranged at the tail end of the divergent end and is used for adjusting the rotation angle of the die head.
Specifically, the disc rotating and pasting mechanism comprises at least two dispersing ends, the tail end of each dispersing end is provided with a die head, as shown in fig. 2, 211 is a balance stabilizer bar, the adjacent dispersing ends are connected stably through the balance stabilizer bar, the whole disc is ensured to rotate and stabilize on a plane, the central shaking of each point position can be effectively reduced, and the positioning precision is improved. And an angle correction mechanism and a correction adjusting platform are connected between the die head and the divergent end to adjust the position and the rotation angle of the die head. Compare in traditional marching type paster device, effective correction angle is wideer also rapider, has further promoted the precision and the efficiency of electronic component paster. Compared with a stepping type surface mounting device, the walking mode of the disc type surface mounting structure is changed from a material belt stepping mode to a disc multipoint continuous alignment deviation rectifying mode, stepping length can be shortened, the size of the device is smaller, and occupied space is smaller.
Illustratively, the present application also provides a patch device comprising:
the first control module is used for controlling a crystal taking mechanism arranged on the chip mounting device to suck and move the electronic element to a die head of a disc rotary-mounting mechanism arranged on the chip mounting device;
the first acquisition module is used for acquiring first image information of the electronic element sucked by the die head;
and the second control module is used for controlling the disc transfer mechanism to paste the electronic element to the dispensing area of the base material based on the first image information.
Illustratively, the second control module includes:
a determination submodule configured to determine first position information and a deflection angle of the electronic component based on the first image information;
the first control submodule is used for controlling a correction assembly arranged on the disc transfer mechanism to correct the electronic element to a first preset position and a preset angle based on the first position information and the deflection angle;
and the second control submodule is used for controlling the disc transfer mechanism to paste the electronic element to a dispensing area of the base material after the electronic element is corrected.
Illustratively, the second control sub-module includes:
the control unit is used for controlling the disc rotary-pasting mechanism to move the electronic element to a second preset position above the base material;
the acquisition unit is used for acquiring second image information of the dispensing area;
the calculation unit is used for calculating the offset information of the dispensing area and a preset dispensing area based on the second image information;
a determining unit, configured to determine compensation information for attaching the electronic component from the second preset position to the dispensing area based on the offset information;
and the control unit is used for controlling the disc transfer mechanism to paste the electronic element to the dispensing area of the base material based on the compensation information.
Illustratively, the patch device further comprises:
the third control module is used for controlling the moving mechanism arranged on the surface mounting device to move the material belt for a preset distance after the dispensing mechanism finishes dispensing the first row of base materials so as to enable the second row of base materials to reach a third preset position;
the fourth control module is used for controlling the glue dispensing mechanism to dispense glue to the second row of base materials after the second row of base materials reach the third preset position;
illustratively, the patch device further comprises:
the second acquisition module is used for acquiring third image information of the product after the patch is attached;
a first determining module for determining whether the product is qualified based on the third image information;
and the calibration module is used for calibrating unqualified products and re-attaching the chips if the unqualified products are not qualified.
Illustratively, the patch device further includes:
the third acquisition module is used for acquiring fourth image information of the electronic element in the wafer disc;
a second determination module configured to determine whether the electronic component is a good based on the fourth image information, and determine fourth position information of the electronic component;
and the moving module is used for moving the suction nozzle in the crystal taking mechanism to a suction position with a preset height in the vertical direction of the qualified electronic element based on the fourth position information if the position information is positive.
The specific implementation of the patch device of the present application is substantially the same as the embodiments of the patch method described above, and is not described herein again.
In addition, this application still provides a paster equipment. As shown in fig. 7, fig. 7 is a schematic structural diagram of a hardware operating environment according to an embodiment of the present application.
For example, fig. 7 is a schematic structural diagram of a hardware operating environment of the patch device.
As shown in fig. 7, the patch device may include a processor 701, a communication interface 702, a memory 703 and a communication bus 704, wherein the processor 701, the communication interface 702 and the memory 703 complete communication with each other through the communication bus 704, and the memory 703 is used for storing a computer program; the processor 701 is configured to implement the steps of the tile method when executing the program stored in the memory 703.
The communication bus 704 mentioned in the above patch device may be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. The communication bus 704 may be divided into an address bus, a data bus, a control bus, and the like. For ease of illustration, only one thick line is shown, but this does not mean that there is only one bus or one type of bus.
The communication interface 702 is used for communication between the patch device and other devices as described above.
The Memory 703 may include a Random Access Memory (RMD) or a Non-Volatile Memory (NM), such as at least one disk Memory. Optionally, the memory 703 may also be at least one memory device located remotely from the processor 701.
The Processor 701 may be a general-purpose Processor, including a Central Processing Unit (CPU), a Network Processor (NP), and the like; but also Digital Signal Processors (DSPs), application Specific Integrated Circuits (ASICs), field Programmable Gate Arrays (FPGAs) or other Programmable logic devices, discrete Gate or transistor logic devices, discrete hardware components.
The specific implementation of the patch device of the present application is substantially the same as the embodiments of the patch method described above, and is not described herein again.
Furthermore, an embodiment of the present application also provides a computer-readable storage medium, on which a tile program is stored, and the tile program, when executed by a processor, implements the steps of the tile method as described above.
The specific implementation of the computer-readable storage medium of the present application is substantially the same as the embodiments of the above-mentioned tile method, and is not described herein again.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a … …" does not exclude the presence of another identical element in a process, method, article, or apparatus that comprises the element.
The above-mentioned serial numbers of the embodiments of the present application are merely for description and do not represent the merits of the embodiments.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present application or portions thereof that contribute to the prior art may be embodied in the form of a software product, where the computer software product is stored in a storage medium (such as a ROM/RAM, a magnetic disk, and an optical disk), and includes several instructions for enabling a terminal device (which may be a mobile phone, a computer, a server, a device, or a network device) to execute the method described in the embodiments of the present application.
The above description is only a preferred embodiment of the present application, and not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application, or which are directly or indirectly applied to other related technical fields, are included in the scope of the present application.
Claims (8)
1. A method of patching, applied to a patching device, the method comprising:
acquiring fourth image information of electronic elements in the wafer disc, wherein the fourth image information comprises image information of a plurality of electronic elements;
carrying out multi-point positioning inspection on the fourth image information, and determining the position information of the electronic element in the wafer disc;
determining whether the electronic component is a qualified product based on the fourth image information, and determining fourth position information of the electronic component;
wherein the step of performing a multi-point localization check on the fourth image information comprises:
inspecting neighboring electronic components of the electronic component centering on the electronic component to verify position information and defect information of the electronic component;
if the electronic component is determined to be qualified, moving a suction nozzle in the crystal taking mechanism to a suction position with a preset height in the vertical direction of the qualified electronic component based on the fourth position information;
wherein, the crystal taking mechanism adopts a C-shaped or bow-shaped mode;
controlling a crystal taking mechanism arranged on a chip mounting device to absorb and move an electronic element to a die head of a disc rotary-mounting mechanism arranged on the chip mounting device;
wherein the disc transfer mechanism comprises one or more dies;
acquiring first image information of the electronic component sucked by the die head;
and controlling the disc transfer mechanism to paste the electronic element to a dispensing area of the substrate based on the first image information.
2. The method of claim 1, wherein controlling the carousel mechanism to apply the electronic component to the dispensing area of the substrate based on the first image information comprises:
determining first position information and a deflection angle of the electronic element based on the first image information;
controlling a correction assembly arranged on the disc transfer mechanism to correct the electronic element to a first preset position and a preset angle based on the first position information and the deflection angle;
and after the electronic element is corrected, controlling the disc transfer mechanism to paste the electronic element to a dispensing area of the base material.
3. The method as claimed in claim 2, wherein said controlling said carousel mechanism to apply said electronic component to a dispensing area of a substrate after said electronic component is modified comprises:
controlling the disc rotary pasting mechanism to move the electronic element to a second preset position above the base material: acquiring second image information of the dispensing area;
based on the second image information, calculating the offset information of the dispensing area and a preset dispensing area:
determining compensation information for pasting the electronic element from the second preset position to the dispensing area based on the offset information;
and controlling the disc rotary-pasting mechanism to paste the electronic element to the dispensing area of the base material based on the compensation information.
4. The method as claimed in claim 1, wherein before controlling the carousel mechanism to apply the electronic component to the dispensing area of the substrate based on the first image information, the method comprises:
after the dispensing mechanism finishes dispensing the first row of base materials, controlling a moving mechanism arranged on the surface mounting device to move the material belt for a preset distance so as to enable the second row of base materials to reach a third preset position;
and after the second row of base materials reach the third preset position, controlling the glue dispensing mechanism to dispense glue on the second row of base materials.
5. The method as claimed in claim 1, wherein said controlling said carousel mechanism to apply said electronic component to a dispensing area of a substrate based on said first image information comprises:
acquiring third image information of the product after the paster is attached;
determining whether the product is a qualified product based on the third image information;
if not, the unqualified product is calibrated and the patch is re-mounted.
6. A patch device, the device comprising:
the first acquisition module is used for acquiring fourth image information of the electronic elements in the wafer disc, wherein the fourth image information comprises image information of a plurality of electronic elements;
the inspection module is used for carrying out multi-point positioning inspection on the fourth image information and determining the position information of the electronic element in the wafer disc;
a judging module, configured to determine whether the electronic component is a qualified product based on the fourth image information, and determine fourth position information of the electronic component;
wherein the step of performing a multi-point localization check on the fourth image information comprises:
an inspection module for inspecting neighboring electronic components of the electronic component centering on the electronic component to verify position information and defect information of the electronic component;
the moving module is used for moving a suction nozzle in the crystal taking mechanism to a suction position with a preset height in the vertical direction of the qualified electronic component based on the fourth position information if the electronic component is determined to be qualified;
the first control module is used for controlling a crystal taking mechanism arranged on the chip mounting device to suck and move the electronic element to a die head of a disc rotary-mounting mechanism arranged on the chip mounting device;
wherein, the crystal taking mechanism adopts a C-shaped or bow-shaped mode;
wherein the disc transfer mechanism comprises one or more dies;
the second acquisition module is used for acquiring first image information of the electronic element sucked by the die head;
and the second control module is used for controlling the disc transfer mechanism to paste the electronic element to the dispensing area of the base material based on the first image information.
7. A patch device characterized in that it comprises a memory, a processor and a patch program stored on said memory and executable on said processor, said patch program implementing the steps of the patch method according to any one of claims 1 to 5 when executed by said processor.
8. A computer-readable storage medium, having stored thereon a tile program which, when executed by a processor, implements the steps of the tile method of any one of claims 1 to 5.
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