CN115243520B - Radiator structure for piezoelectric fan system and fin arrangement method thereof - Google Patents
Radiator structure for piezoelectric fan system and fin arrangement method thereof Download PDFInfo
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- CN115243520B CN115243520B CN202210896100.1A CN202210896100A CN115243520B CN 115243520 B CN115243520 B CN 115243520B CN 202210896100 A CN202210896100 A CN 202210896100A CN 115243520 B CN115243520 B CN 115243520B
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- 238000000034 method Methods 0.000 title claims abstract description 31
- 230000017525 heat dissipation Effects 0.000 claims abstract description 28
- 238000011144 upstream manufacturing Methods 0.000 claims description 12
- 230000000694 effects Effects 0.000 claims description 9
- 238000009991 scouring Methods 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 230000005684 electric field Effects 0.000 claims description 3
- 241000276425 Xiphophorus maculatus Species 0.000 claims description 2
- 230000008859 change Effects 0.000 claims description 2
- 238000012545 processing Methods 0.000 claims description 2
- 238000001816 cooling Methods 0.000 abstract description 20
- 230000000737 periodic effect Effects 0.000 abstract description 5
- 238000011160 research Methods 0.000 abstract description 3
- 230000000052 comparative effect Effects 0.000 description 7
- 238000012546 transfer Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000013598 vector Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000112 cooling gas Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/70—Wind energy
- Y02E10/72—Wind turbines with rotation axis in wind direction
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a radiator structure for a piezoelectric fan system and a fin arrangement method thereof. According to the flow field characteristics generated by the vibration of the piezoelectric fan, fins with different shapes and densities are arranged at different positions of the flow field, so that the surface convection coefficient and the heat dissipation capacity of the radiator are improved. Compared with the common uniform fin arrangement method, the method fully considers the flow field distribution characteristics induced by the periodic resonance of the piezoelectric fan blades, can fully utilize the cooling airflow generated by the fan, can obtain higher heat dissipation efficiency under the condition of the same heat dissipation area, and provides a new idea for the subsequent research of the piezoelectric fan heat dissipation system and the engineering application of the radiator.
Description
Technical Field
The invention belongs to the technical field of heat dissipation of high-power density integrated circuits, and particularly relates to a radiator structure for a piezoelectric fan system and a fin arrangement method thereof.
Background
With the rapid development of microelectronic technology, the performance of various electronic devices is rapidly improved. Meanwhile, the energy consumption and the heating value of various electronic devices are also greatly improved. In addition, the current electronic equipment gradually tends to be miniaturized, so that the heat dissipation capacity in unit volume is increased sharply, and the working performance of the miniature electronic component is seriously influenced and even fails due to the fact that the temperature of the miniature electronic component is too high, so that an efficient and stable heat management mode is adopted for a heat source of the electronic component, and the reliability of the equipment is ensured. At present, a cooling scheme of microelectronic equipment is usually that a piezoelectric fan is matched with a fin type radiator, and stable cooling air flow is generated by periodic resonance of the piezoelectric fan, so that the heat convection function of the surface of the fin is enhanced. However, under the condition that the characteristic mechanisms of the flow field and the temperature field excited by the piezoelectric fan are not considered, the arrangement method of the radiator fins only adopts the equidistant parallel arrangement of the plate-shaped straight ribs or the uniform arrangement of the columnar needles, and the arrangement method is not in line with the characteristics of the flow field and the temperature field induced by the periodic vibration of the piezoelectric fan, and cannot fully utilize the heat dissipation capacity of fluid in the flow field, so that the heat dissipation efficiency is not high under the same heat dissipation area.
Chinese patent application CN201811306122.8 discloses a piezoelectric fan heat dissipation closed module, which comprises a piezoelectric fan array, heat dissipation fins and a heat source module. The heat source module transfers heat to the inside of the radiating fins through a heat conduction process, the piezoelectric fan is excited by periodic resonance movement to generate cooling airflow, the convection heat exchange effect of air and the surface of the radiator is enhanced, and then the heat source module is cooled. However, in the above scheme, for the adopted radiating fins, all the plate-shaped straight ribs are arranged in parallel at equal intervals, and the method cannot fully utilize the cooling air flow generated by the periodical vibration of the piezoelectric fan blade, and numerical studies show that the cooling air flow can only perform efficient cooling and heat dissipation on the front end of the radiator, and most of the cooling air flow cannot smoothly reach the tail of the radiator, so that higher heat dissipation efficiency cannot be achieved under the condition of the same heat dissipation area.
There is therefore a need in the art for a fin arrangement method that improves heat transfer efficiency of a heat sink under the same heat dissipation area conditions, enabling full use of cooling airflow induced by piezoelectric fan resonance to improve cooling efficiency for high power density integrated circuits.
Disclosure of Invention
The invention solves the technical problems that: a radiator structure for a piezoelectric fan system and a fin arrangement method thereof are provided, which can fully utilize cooling air flow generated by a fan and can obtain higher heat dissipation efficiency under the condition of the same heat dissipation area.
The technical scheme is as follows: in order to solve the technical problems, the invention adopts the following technical scheme:
A heat sink structure for a piezo fan system, comprising: the radiator comprises a radiator, wherein one side of the radiator is provided with fins and a piezoelectric fan, the other side of the radiator is provided with heat source modules, and a distribution area of the fins comprises a plate-shaped straight rib parallel arrangement area, a columnar pin rib combined structure arrangement area and a columnar pin rib local encryption arrangement area.
Preferably, the plate-shaped straight rib parallel arrangement area is positioned at an upstream laminar flow section of the radiator flow field, the columnar pin rib combined structure arrangement area is positioned at a midstream vortex section of the radiator flow field, and the columnar pin rib local encryption arrangement area is positioned at a downstream turbulence section of the radiator flow field.
Preferably, the heat source module is disposed on the bottom surface of the radiator, and conducts heat inside the heat source module to the fins of the radiator to cool and dissipate heat of the heat source module.
Preferably, the piezoelectric fan is arranged in a parallel arrangement area of the plate-shaped straight ribs, and the blade is driven to generate resonance by the driving of the alternating electric field by utilizing the inverse piezoelectric effect of the piezoelectric ceramic, and the airflow is output forwards from the blade end.
According to the flow field characteristics induced by vibration of the piezoelectric fan, fins with different shapes and densities are arranged at different positions of the flow field, so that the surface convection coefficient and the heat dissipation capacity of the radiator are improved.
Preferably, plate-shaped straight rib parallel fins are arranged on the flow field upstream laminar flow section of the radiator; a cross structure formed by columnar pin fin is arranged at a midstream vortex section of the flow field; and arranging columnar pin fin with different densities in a downstream turbulence section of the radiator flow field.
Preferably, the length of the plate-shaped straight rib parallel fin is not more than half of the length of the piezoelectric fan blade. The size and the distance of the columnar pin rib fins ensure that the blades cannot collide with the fins in the process of periodically vibrating the blades. And solving the vibration range of the blade by using a green integral formula according to a motion track equation of the piezoelectric fan blade in a first-order mode along with time, and ensuring the normal operation of the piezoelectric fan when the cross structure is positioned outside the vibration range.
Preferably, the motion trajectory equation of the piezoelectric fan blade over time in the first-order mode is:
Where l represents the length of the fan blade, x represents the abscissa of the point on the blade, and Y (x) represents the maximum displacement of that point.
Preferably, the flow field in the double-blade piezoelectric fan channel is in a state that the flow velocity of two sides is higher and the flow velocity of the middle is lower, the transverse distance between the columnar pin rib fins, which are close to the two side wall surfaces, of the downstream of the flow field is reduced for encryption, and the columnar pin rib fins in the middle are arranged in a staggered mode so as to improve the scouring effect of air flow on the rib.
The beneficial effects are that: compared with the prior art, the invention has the following advantages:
(1) Compared with the common fin uniform arrangement method, the radiator structure for the piezoelectric fan system and the fin arrangement method thereof fully consider the flow field distribution characteristics induced by periodic resonance of the piezoelectric fan blades, can fully utilize cooling airflow generated by the fan, can obtain higher radiating efficiency under the condition of the same radiating area, and provide a new thought for subsequent research of the piezoelectric fan radiating system and engineering application of the radiator.
(2) The invention combines two heat dissipation modes of the radiator and the piezoelectric fan, firstly, heat generated by a heating device or a module in the electronic product is conducted to the radiator fins, and the piezoelectric fan provides high-speed stable air flow to cool and dissipate heat of the radiator fins. The piezoelectric fan is used as a novel active cooling heat dissipation device, has low space occupation rate, low power consumption and high heat dissipation efficiency, and is very suitable for the development trend of high density and integration of the current electronic products.
(3) According to the invention, two factors of wind speed and wind direction are comprehensively considered, parallel platy straight ribs are arranged at an inlet section with parallel wind direction and uniform wind speed, and the phenomenon of local vortex exists in the range from the waist to the end of the blade, so that a columnar pin rib fin is adopted to form a cross structure, and the scouring effect of the surface of the fin and the airflow is enhanced; the columnar pin ribs are adopted in a downstream area with obvious wind direction change, partial encryption processing is adopted in a high-speed area, and a staggered arrangement method is adopted in a low-speed area. By arranging the radiator with the fin in special arrangement, the flow field induced by the vibration of the piezoelectric fan is fully utilized, higher heat dissipation intensity can be obtained under the condition of the same heat dissipation area, and the heat dissipation efficiency of the radiator is improved.
Drawings
FIG. 1 is a schematic diagram of a heat sink fin structure for a piezo fan system;
FIG. 2 is a schematic diagram of a heat sink structure and fin arrangement method for a piezo fan system;
FIG. 3 is a graph of flow field velocity vectors generated by piezoelectric fan vibration excitation;
FIG. 4 is a top view of a heat sink fin arrangement method according to an embodiment of the present invention;
FIG. 5 is a top view of a method of arranging heat dissipating fins with respect to a comparative example of the present invention;
fig. 6 is a graph of heat transfer coefficients for the heat sinks of the example and comparative example of the present invention.
Detailed Description
The invention will be further illustrated with reference to specific examples, which are carried out on the basis of the technical solutions of the invention, it being understood that these examples are only intended to illustrate the invention and are not intended to limit the scope thereof.
A radiator structure for a piezoelectric fan system comprises a radiator 7, fins, a heat source module 4 and a piezoelectric fan 5, wherein the fins and the piezoelectric fan 5 are arranged on one surface of the radiator 7, and the heat source module 4 is arranged on the other surface of the radiator 7. The heat source module 4 is disposed on the bottom surface of the heat sink 7, and conducts the heat inside the heat source module 4 to the fins of the heat sink 7 for cooling and dissipating the heat of the heat source module 4.
The fins on the radiator 7 comprise a plate-shaped straight rib parallel arrangement area 1 positioned at an upstream laminar flow section of the airflow channel, a columnar needle rib combined structure arrangement area 2 positioned at a downstream vortex flow section and a columnar needle rib local encryption arrangement area 3 positioned at a downstream turbulence flow section, wherein the plate-shaped straight rib parallel arrangement area 1 is positioned in an upstream range of a flow field, the columnar needle rib combined structure arrangement area 2 is positioned in a range from the waist to the end of a piezoelectric fan blade, and the columnar needle rib local encryption arrangement area 3 is positioned in a downstream range of the flow field.
The piezoelectric fan 5 is arranged near the plate-shaped straight rib parallel arrangement area 1, and directly drives the blades to generate resonance under the drive of an alternating electric field by utilizing the inverse piezoelectric effect of piezoelectric ceramics, and outputs high-speed and stable air flow forwards from the blade ends to directly cool the parts needing heat dissipation.
As shown in fig. 3, the velocity vector distribution diagram of the flow field generated by the vibration of the piezoelectric fan of the present invention shows that the airflow at the upstream part of the flow field flows in parallel and the flow velocity is low. The airflow speed is gradually increased after the excitation of the back and forth vibration of the piezoelectric fan. The airflow forms turbulent eddies from the waist to the end part of the blade, and the air flow velocity is obviously higher in the local range of the eddies. In the downstream portion of the flow field, the air flow continues to flow forward under the force of the fan vibration, and gradually exhibits a diffuse flow phenomenon in which the outside flow rate is high and the inside flow rate is low.
In the invention, the flow field is divided into three parts of an upstream range (namely an upstream laminar flow section), a fan waist-end range (namely a midstream vortex section) and a flow field downstream range (namely a downstream turbulence section) according to the flow field distribution characteristics, and different fin arrangement schemes are adopted for different parts.
The invention also discloses a radiator fin arrangement method for the piezoelectric fan system, which arranges fins with different shapes and densities at different positions of the airflow channel according to the flow field characteristics generated by vibration of the piezoelectric fan, thereby realizing the improvement of the convection coefficient and the heat radiation capability of the radiator surface.
S1: arranging plate-shaped straight rib parallel fins on the flow field upstream laminar flow section of the radiator;
The upstream range (upstream laminar flow section) of the flow field is an inlet section with parallel wind directions and uniform wind speed, and for the air flow of the inlet section, the plate-shaped straight ribs can be better attached to most of cooling air flow, and the flow loss generated by the air flow is smaller, so that more cooling air flow can be smoothly guided to the middle and downstream. The height and thickness of the plate-shaped straight rib fins can be set according to actual working conditions, the height of the plate-shaped straight rib fins is matched with the width of the blade of the piezoelectric fan, and the height of the straight rib is preferably not lower than the width of the blade; the length is not more than half of that of the piezoelectric fan, the spacing between the fins can be determined according to the situation, and the phenomenon that the flow field is unevenly distributed and local heat dissipation is deteriorated due to larger spacing is found in the range of 2-10 mm.
S2: arranging columnar pin fin to form a cross structure at a midstream vortex section of the flow field;
The midstream vortex section is a range from the waist to the end of the double blade in the present embodiment, and because of the phenomenon of local vortex, a combined structure composed of a plurality of pin fin 9 is adopted, and the cross section of the combined structure can be a cross structure, a rectangular structure or a circular structure.
The cross structure formed by the columnar pin rib fins 9 is designed according to the positioning and flow direction of local vortex, and can be well attached to cooling gas around the fins. The size and the interval of the columnar pin ribs in the structure can be determined according to the actual working condition, but in the engineering that the blades vibrate periodically, the blades cannot collide with the fins in the structure. According to a motion track equation of the piezoelectric fan blade along with time in a first-order mode:
Where l represents the length of the fan blade, x represents the abscissa of the point on the blade, and Y (x) represents the maximum displacement of that point. The vibration range of the blade can be obtained by utilizing the Green integral formula for the curve equation, and the normal operation of the piezoelectric fan can be ensured when the cross structure is positioned outside the vibration range.
S3: the downstream turbulence section of the radiator flow field is provided with columnar pin fin with different densities
In the downstream range of the flow field, the size and direction of the air flow downstream of the channel are changed drastically, so that the columnar pin fin 9 is adopted in the section area, local encryption treatment is adopted in the high-speed area, a staggered arrangement method is adopted in the low-speed area, the high-speed area is positioned on the left side and the right side of the section, and the low-speed area is positioned in the middle of the section. The numerical method researches show that the flow field in the double-blade piezoelectric fan channel is in a state that the flow velocity of two sides is higher and the middle is lower, so that the transverse distance between the columnar needle ribs, which are close to the two side wall surfaces, of the downstream of the channel is reduced for encryption, and the middle ribs can adopt a staggered arrangement method to improve the scouring effect of air flow on the ribs, so that the heat dissipation efficiency of the radiator is further improved. The size and the spacing of the columnar pin fin 9 can be set according to actual working conditions, and only the convection heat exchange area is required to be increased in a high-flow-rate area.
The structure and method of the present invention were verified by providing the comparative example shown in fig. 5 with respect to the present invention in which the radiator fins downstream of the flow field are all arranged 6 with plate-like straight ribs at equal intervals, characterized in that the total heat radiation area of the radiator remains equal to that of the example. Fig. 6 shows the values of the average heat transfer coefficient of the radiator surface, which is an index of the cooling capacity of the comparative example and the present invention.
Fig. 6 shows the value of the average heat transfer coefficient of the radiator surface, which is an index indicating the cooling capacity. In the comparative example, the radiator fins downstream of the channels all use plate-shaped straight ribs, and the air flow directly passes between the plates, so that the residence time is extremely short. In addition, since all the plate-shaped straight ribs are arranged in parallel at equal intervals, the distribution characteristics of the flow direction and the flow velocity in the flow field are not considered, and therefore it can be understood that the cooling capacity of the comparative example is lower than that of the piezoelectric fan radiator fin arrangement method of the present invention. As can be seen from fig. 6, the surface average heat transfer coefficient of the example can be improved by nearly one time compared with the comparative example, showing that the cooling capacity of the piezoelectric fan radiator fin arrangement method of the present invention is superior to that of the plate-like straight rib arrangement method.
The foregoing is merely a preferred embodiment of the present invention and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present invention, which are intended to be comprehended within the scope of the present invention.
Claims (7)
1. A heat sink structure for a piezo fan system, comprising: a fin and a piezoelectric fan (5) are arranged on one surface of a radiator (7), a distribution area of the fin comprises a plate-shaped straight rib parallel arrangement area (1), a columnar pin rib combined structure arrangement area (2) and a columnar pin rib local encryption arrangement area (3), the plate-shaped straight rib parallel arrangement area (1) is positioned at an upstream laminar flow section of a radiator flow field, the columnar pin rib combined structure arrangement area (2) is positioned at a midstream vortex section of the radiator flow field, and the columnar pin rib local encryption arrangement area (3) is positioned at a downstream turbulence section of the radiator flow field;
Parallel platy straight ribs are arranged at an inlet section with parallel wind directions and uniform wind speed, and a columnar pin rib fin is adopted to form a cross structure in the range from the waist to the end of the blade due to the phenomenon of local vortex, so that the scouring effect of the surface of the fin and the airflow is enhanced; the columnar pin ribs are adopted in a downstream area with more obvious wind direction change, partial encryption processing is adopted in a high-speed area, and staggered arrangement is adopted in a low-speed area.
2. The heat sink structure for a piezo fan system according to claim 1, wherein: the heat source module (4) is arranged on the bottom surface of the radiator (7), and conducts heat in the heat source module (4) to fins of the radiator (7) to cool and dissipate heat of the heat source module (4).
3. The heat sink structure for a piezo fan system according to claim 2, wherein: the piezoelectric fan (5) is arranged in the plate-shaped straight rib parallel arrangement area (1), and drives the blade to generate resonance under the driving of an alternating electric field by utilizing the inverse piezoelectric effect of piezoelectric ceramics, and the airflow is output forwards from the blade end.
4. A heat sink fin arrangement method for a piezo fan system, characterized by: according to the flow field characteristics generated by the vibration of the piezoelectric fan, fins with different shapes and densities are arranged at different positions of the flow field, so that the surface convection coefficient and the heat dissipation capacity of the radiator are improved;
Plate-shaped straight rib parallel fins (8) are arranged on the flow field upstream laminar flow section of the radiator (7); a cross structure formed by columnar pin fin (9) is arranged at the midstream vortex section of the flow field; arranging columnar pin fin (9) with different densities on a downstream turbulence section of a radiator flow field;
the flow field in the double-blade piezoelectric fan channel is in a state that the flow velocity at two sides is higher and the flow velocity at the middle is lower, the transverse distance between the columnar pin rib fins (9) which are close to the two side wall surfaces at the downstream of the flow field is reduced for encryption, and the columnar pin rib fins (9) at the middle are arranged in a staggered mode to improve the scouring effect of air flow on the ribs.
5. The heat sink fin arrangement method for a piezoelectric fan system according to claim 4, wherein: the length of the plate-shaped straight rib parallel fins (8) is not more than half of the length of the blade of the piezoelectric fan (5).
6. The heat sink fin arrangement method for a piezoelectric fan system according to claim 4, wherein: and solving the vibration range of the blade by using a green integral formula according to a motion track equation of the piezoelectric fan blade in a first-order mode along with time, and ensuring the normal operation of the piezoelectric fan when the cross structure is positioned outside the vibration range.
7. The heat sink fin arrangement method for a piezoelectric fan system according to claim 6, characterized in that:
the motion trail equation of the piezoelectric fan blade along with time in the first-order mode is as follows:
；
Where l represents the length of the fan blade, x represents the abscissa of the point on the blade, and Y （x） represents the maximum displacement of that point.
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| CN202210896100.1A CN115243520B (en) | 2022-07-27 | 2022-07-27 | Radiator structure for piezoelectric fan system and fin arrangement method thereof |
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| CN116230665A (en) * | 2023-03-24 | 2023-06-06 | 苏州浪潮智能科技有限公司 | A pin-fin radiator and a method for assembling it |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN206365202U (en) * | 2016-12-12 | 2017-07-28 | 中国航空工业集团公司西安航空计算技术研究所 | A kind of new high power electronic device air cooling equipment |
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| CN102620268B (en) * | 2012-03-14 | 2013-12-11 | 重庆邮电大学 | Non-uniformly distributed semiconductor illumination radiator |
| JP6678608B2 (en) * | 2016-07-26 | 2020-04-08 | 三菱電機株式会社 | Electronic equipment cooling device |
| CN109950218A (en) * | 2017-12-20 | 2019-06-28 | 广东工业大学 | A radiator and cooling system |
| CN109392291A (en) * | 2018-11-05 | 2019-02-26 | 四川九洲电器集团有限责任公司 | A kind of closed module of piezoelectric fan heat dissipation |
| CN213818423U (en) * | 2020-12-29 | 2021-07-27 | 北京经纬恒润科技股份有限公司 | Electronic equipment and heat dissipation device thereof |
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| CN206365202U (en) * | 2016-12-12 | 2017-07-28 | 中国航空工业集团公司西安航空计算技术研究所 | A kind of new high power electronic device air cooling equipment |
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