CN115213568A - A composite laser processing system and processing method - Google Patents

Abstract

The invention discloses a composite laser processing system and a processing method, belonging to the technical field of laser processing, and can solve the problem that the existing laser processing system is difficult to satisfy the comprehensive requirements of processing efficiency, processing accuracy and processing quality at the same time. The system includes: a detection unit is used to detect the positioning feature points of the workpiece and obtain the spatial position information of the workpiece; a high-power laser processing unit is used to cut the workpiece according to a first preset trajectory by using a high-power laser; the short-pulse laser processing unit is used to The short-pulse laser is used to process and trim the workpiece according to the second preset trajectory; the motion unit is used to adjust the processing position and processing angle of the high-power laser processing unit and the short-pulse laser processing unit; the air supply unit is used to provide the high-power laser processing unit. High-pressure auxiliary gas; the control unit is used to generate control information according to the processing information and spatial position information of the workpiece; and control the work of each unit according to the control information. The present invention is used for laser processing of workpieces.

Description

A composite laser processing system and processing method

technical field

The invention relates to a composite laser processing system and a processing method, belonging to the technical field of laser processing.

Background technique

Laser cutting uses a high-power density laser to irradiate the workpiece to rapidly melt, vaporize or ablate the material. Generally, the workpiece is cut with the help of high-speed gas coaxial with the beam. Laser cutting generally uses high-power lasers, which have been widely used in the cutting of various types of plates, especially metals. With the increase of laser power, the thickness of workpiece suitable for cutting has expanded from less than 10mm to 30-100mm, with high cutting speed and small slit taper. Although it is possible to turn a continuously operating laser into a laser with a pulse width of microseconds to milliseconds, the heat-affected zone and insufficient resolution in the thickness direction caused by such laser processing make it unsuitable for 3D precision machining. Three-dimensional precision machining requires resolution within 100 μm in X, Y, and Z directions, or even <10 μm resolution.

On the other hand, the lasers used in the existing laser precision machining are generally short-pulse (<1 μS) lasers, including nanosecond lasers, picosecond lasers, femtosecond lasers, and the like. This type of laser has the advantages of high brightness and small thermal impact. Generally, it is combined with a high-speed scanning system to achieve complex graphics processing while avoiding the heat accumulation effect. It has been used in the precision processing of ceramics, metals, composite materials and many other materials. Including punching, surface microtexture preparation, laser etching, microgroove preparation, three-dimensional engraving, cleaning, etc. Although short-pulse lasers can process precise structures with high processing resolution and small thermal effects, they are suitable for thin-layer material processing, but when processing large-depth structures, the processing efficiency decreases seriously with the increase of depth, and the taper problem requires special treatment.

In the field of machining, it is often necessary to perform both rapid cutting of the workpiece and local precision machining of the workpiece. In addition, some machined parts are composed of multiple materials, such as metal parts containing brittle material parts. At present, to solve such problems, different machine tools are often used to clamp and position the workpiece multiple times, which adversely affects the processing efficiency and processing accuracy. It is difficult for the existing laser processing systems to meet the comprehensive requirements of processing efficiency, processing accuracy and processing quality at the same time.

SUMMARY OF THE INVENTION

The invention provides a composite laser processing system and a processing method, which can solve the problem that the existing laser processing system is difficult to satisfy the comprehensive requirements of processing efficiency, processing precision and processing quality at the same time.

In one aspect, the present invention provides a compound laser processing system, the system comprising: a control unit, and a detection unit, a high-power laser processing unit, a short-pulse laser processing unit, a motion unit, and a supply unit all connected to the control unit. air unit; the detection unit is used to detect the positioning feature points of the workpiece, and obtain the spatial position information of the workpiece; the high-power laser processing unit is used to use the high-power laser to cut the workpiece according to the first preset trajectory; the The short-pulse laser processing unit is used for processing and trimming the workpiece according to the second preset trajectory by using the short-pulse laser; the motion unit is used for adjusting the processing positions of the high-power laser processing unit and the short-pulse laser processing unit and processing angle; the gas supply unit is used to provide high-pressure auxiliary gas to the high-power laser processing unit to blow away the slag in the workpiece slit and cool the high-power laser processing unit; the control The unit is configured to generate control information according to the processing information of the workpiece and the spatial position information; and control the high-power laser processing unit, the short-pulse laser processing unit, the motion unit and the The air supply unit works.

Optionally, the high-power laser processing unit includes a high-power laser, a first optical transmission structure, and a laser cutting head; the high-power laser is used to emit high-power laser light; the first optical transmission structure is used to The high-power laser is transmitted to the laser cutting head; the laser cutting head is used for cutting the workpiece according to the first preset trajectory by using the high-power laser.

Optionally, the first optical transmission structure is an optical fiber or a light pipe.

Optionally, the high-power laser is any one of a fiber laser, a CO ₂ laser, and a solid-state laser.

Optionally, the short-pulse laser processing unit includes a short-pulse laser, a second optical transmission structure, and an optical scanning structure; the short-pulse laser is used for emitting short-pulse laser light; the second optical transmission structure is used for The short-pulse laser is transmitted to the optical scanning structure; the optical scanning structure is used to scan the workpiece at high speed according to the second preset trajectory by using the short-pulse laser, so as to process and trim the workpiece.

Optionally, the short-pulse laser is a fiber laser or a solid-state laser.

Optionally, the short pulse laser is any one of a nanosecond laser, a picosecond laser and a femtosecond laser.

Optionally, the second optical transmission structure is any one of an optical fiber, a light pipe and a reflective mirror.

Optionally, the optical scanning structure is a scanning galvanometer or an optical rotation scanning structure based on the rotation of an optical device.

Optionally, the detection unit includes an imaging structure and a ranging structure; the imaging structure is used to perform image recognition on the workpiece, detect the positioning feature points of the workpiece, and obtain position data of the workpiece; the measurement The distance structure is used to collect the real-time processing heights of the laser cutting head, the optical scanning structure and the workpiece respectively; the position data of the workpiece and the real-time processing height of the workpiece constitute the spatial position information of the workpiece.

Optionally, the imaging structure is a CCD image sensor.

Optionally, the ranging structure is any one of an ultrasonic ranging sensor, a laser ranging sensor and an electromagnetic induction sensor.

Optionally, the motion unit includes a base, two horizontal guide rails, a power swing head, a beam, two vertical guide rails, a cutting head mounting seat, a scanning structure mounting seat, and a drive motor; the two horizontal guide rails are arranged at the Both sides of the upper surface of the base; the power swing head is installed on the upper surface of the base and located between the two horizontal guide rails, used to clamp the workpiece and drive the workpiece to move between the two horizontal guide rails. swing freely in the degree of freedom; the beam is connected across the two horizontal guide rails; the two vertical guide rails are both connected on the beam; the cutting head mounting seat and the scanning structure mounting seat are respectively connected on the two vertical guide rails; the cutting head mounting seat is used for placing the laser cutting head, the scanning structure mounting seat is used for placing the optical scanning structure; the driving motor is used for driving the The power swing head, the cutting head mount and the scan structure mount move.

Optionally, the system further includes a dedusting unit, and the dedusting unit is used to collect waste gas, smoke or waste residue after the workpiece is processed.

In another aspect, the present invention provides a composite laser processing method applied to any of the above-mentioned composite laser processing systems, the method comprising: S1, clamping a workpiece, and inputting an original workpiece model into a control unit; S2, detect the workpiece, select the positioning feature points of the workpiece, adjust the original workpiece coordinates to become new workpiece coordinates according to the positioning feature points, and generate a processing file according to the new workpiece coordinates; S3, according to the processing file, use high power Laser cutting and processing the workpiece; S4. According to the processing document, the workpiece is precisely processed with a short-pulse laser, and the high-power laser processing area of the workpiece is precisely trimmed; S5. The workpiece is detected, and if the processing requirements are met, the processing is completed. ; If the processing requirements are not met, repeat S2 to S5 until the processing requirements are met and the processing is completed.

Optionally, the precision machining is any one of surface cleaning, microtexturing, three-dimensional machining, and punching.

Optionally, the step S2 is specifically as follows: setting three or more positioning feature points on the workpiece; measuring the height of the workpiece and the surface normal through the imaging structure and the ranging structure, and transmitting the measured information. To the control unit; the control unit compares the positioning feature points of the workpiece CAD model according to the measured positioning feature points, adjusts the coordinates in the original workpiece CAD model to the actual coordinates of the workpiece in the current machine tool coordinate system, and then adjusts the coordinates of the workpiece according to the adjusted workpiece. The coordinates generate a new machining file.

Optionally, the step S3 is specifically: adjusting the processing parameters of the high-power laser processing according to the generated new processing file; turning on the high-power laser and the gas supply unit, respectively providing the high-power laser and the high-pressure auxiliary gas, to the workpiece. Laser processing is performed along the first preset trajectory, and the workpiece is quickly cut through.

Optionally, the step S4 is specifically as follows: according to the generated new processing file, adjusting the processing parameters of the short-pulse laser processing for different materials; turning on the short-pulse laser, controlling the optical scanning structure to complete the precision processing of the workpiece, and monitoring the workpiece. High-power laser processing area for precision trimming.

The beneficial effects that the present invention can produce include:

The compound laser processing system provided by the present invention uses a high-power laser, and under the protection of gas, the workpiece is firstly cut rapidly; then the short-pulse laser and the optical scanning structure under the same precise motion system are used, and under the assistance of the intelligent control system, Precise machining of the workpiece; further, provide the two to process the same area interactively, ensure the cutting efficiency with high-power cutting, and improve the quality of the kerf with short-pulse laser trimming. The two laser processing methods cooperate with each other to meet the comprehensive requirements of workpiece processing efficiency, processing thickness and processing quality. Compared with the prior art, the present invention organically combines the traditional high-power laser processing technology and the precision laser processing technology, and the control system takes into account the two processes, and has the characteristics of deep fusion, rather than a simple superimposed organization. It is precisely because of the fusion of the two laser processing technologies that the engineering problems such as the comprehensive processing of multi-thickness special-shaped materials can be efficiently completed under the same system and one clamping of the workpiece.

Description of drawings

1 is a structural block diagram of a compound laser processing system provided by an embodiment of the present invention;

2 is a flowchart of a composite laser processing method provided by an embodiment of the present invention;

3 is a schematic structural diagram of a composite laser processing system provided by an embodiment of the present invention;

FIG. 4 is a display diagram of a workpiece processed by the compound laser processing system provided in an embodiment of the present invention in Embodiment 1;

FIG. 5 is a display diagram of a workpiece processed by the compound laser processing system provided in an embodiment of the present invention in Embodiment 2;

FIG. 6 is a display diagram of a workpiece processed by the compound laser processing system provided in the embodiment of the present invention in Embodiment 3. FIG.

List of parts and reference numbers:

1. Control unit; 2. Detection unit; 3. High-power laser processing unit; 4. High-power laser; 5. First optical transmission structure; 6. Laser cutting head; 7. Air supply unit; 8. Movement unit; 9 10, the second optical transmission structure; 11, the optical scanning structure; 12, the workpiece; 13, the dust removal unit; 14, the short pulse laser processing unit; 15, the base; 16, the beam; 17, the vertical guide rail; 18. Power swing head; 19. First cable; 20. Second cable; 21. First trachea; 22. Second trachea.

Detailed ways

The present invention will be described in detail below with reference to the examples, but the present invention is not limited to these examples.

An embodiment of the present invention provides a compound laser processing system, as shown in FIG. 1 to FIG. 6 , the system includes: a control unit 1, a detection unit 2 connected to the control unit 1, a high-power laser processing unit 3, The short-pulse laser processing unit 14, the motion unit 8 and the gas supply unit 7; the detection unit 2 is used to detect the positioning feature points of the workpiece 12 and obtain the spatial position information of the workpiece 12; the high-power laser processing unit 3 is used to use the high-power laser The first preset trajectory cuts the workpiece 12; the short-pulse laser processing unit 14 is used to process and trim the workpiece 12 according to the second preset trajectory using the short-pulse laser; the motion unit 8 is used to adjust the high-power laser processing unit 3 and the short-pulse laser processing. The processing position and processing angle of the unit 14; the gas supply unit 7 is used to provide high-pressure auxiliary gas to the high-power laser processing unit 3 to blow away the slag in the slit of the workpiece 12 and cool the high-power laser processing unit 3; Control unit 1 is used to generate control information according to the processing information and spatial position information of the workpiece 12; and control the high-power laser processing unit 3, the short-pulse laser processing unit 14, the motion unit 8 and the gas supply unit 7 to work according to the control information.

Specifically, the high-power laser processing unit 3 includes a high-power laser 4, a first optical transmission structure 5 and a laser cutting head 6; the high-power laser 4 is used to emit high-power laser light; the first optical transmission structure 5 is used to transmit the high-power laser It is transmitted to the laser cutting head 6; the laser cutting head 6 is used for cutting the workpiece 12 according to the first preset trajectory using a high-power laser; preferably, the first optical transmission structure 5 is an optical fiber or a light pipe.

The high-power laser 4 is suitable for rapidly cutting workpieces 12 with various thicknesses, preferably high-power and high-quality kilowatt-level and above-kilowatt-level lasers, including but not limited to fiber lasers, CO ₂ lasers, solid-state lasers, etc., especially preferably for flexible transmission. fiber-optic laser.

The first optical transmission structure 5 is located between the high-power laser 4 and the laser cutting head 6, and is used to transmit the high-power laser to the laser cutting head 6, including but not limited to optical fibers and light pipes.

The laser cutting head 6 is connected to the cutting head mounting seat of the motion unit 8 .

Further, the short-pulse laser processing unit 14 includes a short-pulse laser 9, a second optical transmission structure 10 and an optical scanning structure 11; the short-pulse laser 9 is used to emit short-pulse laser light; the second optical transmission structure 10 is used to transmit the short-pulse laser light. It is transmitted to the optical scanning structure 11; the optical scanning structure 11 is used to scan the workpiece 12 at high speed according to the second preset trajectory by using a short pulse laser, so as to precisely process and precisely trim the workpiece 12 to improve the quality of the kerf. Among them, precision machining includes but is not limited to surface cleaning, micro-texturing, three-dimensional machining, drilling and other fine machining. The short-pulse laser 9 includes, but is not limited to, fiber lasers, solid-state lasers, etc.; laser pulse width <1 μS, including but not limited to nanosecond lasers, picosecond lasers, femtosecond lasers, and the like.

The second optical transmission structure 10 is located between the short-pulse laser 9 and the optical scanning structure 11, and is used for transmitting the short-pulse laser to the optical scanning structure 11, including but not limited to optical fibers, light pipes, and mirrors.

The optical scanning structure 11 is placed on the scanning structure mounting seat of the motion unit 8, and is used to realize high-speed scanning of short-pulse lasers, including but not limited to various types of high-speed scanning based on galvanometers and high-speed scanning based on optical device rotation. Scanning galvanometers, including but not limited to two-axis and three-axis scanning galvanometers, are used to control the movement of the laser in the two directions of X and Y or control the movement of the laser in the three directions of X, Y and Z. The scanning speed is generally > 100 mm/s, preferably > 1000 mm/s, more preferably > 10 m/s.

The control unit 1 is an industrial control computer, an embedded industrial control system or a remote control system connected through a network, which is used to control and complete the rapid processing of the workpiece 12 by the composite laser processing system, and is respectively connected with the detection unit 2, the high-power laser 4, the gas supply unit 7, and the motion. Unit 8, short pulse laser 9, optical scanning structure 11, and dust removal unit 13 are electrically connected to control detection unit 2, high-power laser 4, auxiliary gas supply unit 7, motion unit 8, short pulse laser 9, optical scanning Structure 11 and the dust removal unit 13 work according to the predetermined control information, and coordinate and cooperate with each other to complete the rapid processing of the workpiece 12 by the composite laser processing system.

The detection unit 2 is used for detecting the positioning feature points of the workpiece 12 , automatically acquiring the spatial position information of the workpiece 12 , and transmitting the collected spatial position information of the workpiece 12 to the control unit 1 . The detection unit 2 at least includes an imaging structure and a distance measuring structure, and is connected with the laser cutting head 6 and the optical scanning structure 11 in close proximity. The imaging structure is used to perform image recognition on the workpiece 12, detect the positioning feature points of the workpiece 12, and obtain the position data of the workpiece 12; the ranging structure is used to collect the real-time processing heights of the laser cutting head 6, the optical scanning structure 11 and the workpiece 12 respectively; The position data of the workpiece 12 and the real-time machining height of the workpiece 12 constitute the spatial position information of the workpiece 12 ; the imaging structure is preferably a CCD image sensor for image recognition, edge alignment and positioning of the workpiece 12 . The positioning includes automatic positioning or manual positioning. The ranging structure includes, but is not limited to, the use of ultrasonic ranging sensors, laser ranging sensors, electromagnetic induction sensors, and the like.

The auxiliary gas supply unit 7 is used to generate high-pressure auxiliary gas, and the generated high-pressure auxiliary gas is input into the laser cutting head 6 to blow away the slag in the slit, cool the focusing lens, and prevent smoke and dust from entering the lens holder. The use of the auxiliary gas is generally selected according to the material of the workpiece 12 .

The movement unit 8 is used to adjust the movement position and processing angle of the laser cutting head 6 according to the control information of the control unit 1 , so as to realize the precise processing of the workpiece 12 . The motion unit 8 includes two-axis, three-axis and more than three-axis processing systems.

Referring to FIG. 3 , the motion unit 8 is composed of a motion shaft and a driving motor, including a horizontal guide rail, a beam 16 , a vertical guide rail 17 , a power swing head 18 , a cutting head mounting seat, a scanning structure mounting seat, a base 15 and the like. Preferably, the above structure forms a gantry-type structure, which is driven by a multi-axis motor and cooperates with the laser cutting head 6 and the optical scanning structure 11 to complete the rapid processing of the workpiece 12 by the composite laser processing system. There are two horizontal guide rails of the gantry structure, which are placed in parallel on both sides of the upper surface of the base 15; the cross beam 16 spans the top of the two horizontal guide rails; the vertical guide rail 17 is connected on the cross beam 16; the cutting head mounting seat and The scanning structure mounting bases are respectively connected to the vertical guide rails 17; the cutting head mounting bases are used to place the laser cutting head 6; the scanning structure mounting bases are used to place the optical scanning structure 11; The power swing head 18 is used to clamp the workpiece 12, and can drive the workpiece 12 to complete any swing of the two degrees of freedom A and C, thereby realizing the rapid processing of the workpiece 12 by the composite laser processing system.

There are two vertical guide rails 17, which are respectively connected to the front and rear surfaces of the beam 16. The vertical guide rail 17 in front of the beam 16 is used for placing the laser cutting head 6, and the vertical guide rail 17 behind the beam 16 is used for placing the optical scanning structure 11. .

In order to protect the environment and the health of operators, the dust removal unit 13 is used to collect waste gas, smoke, waste residue and the like after the workpiece 12 is processed.

Referring to FIG. 2 , another embodiment of the present invention provides a composite laser processing method applied to any of the above-mentioned composite laser processing systems, and the method includes:

S1, clamping the workpiece 12, and inputting the original workpiece model into the control unit 1;

S2, detect the workpiece 12, select the positioning feature points of the workpiece 12, adjust the original workpiece coordinates to become new workpiece coordinates according to the positioning feature points, and generate a processing file according to the new workpiece coordinates;

S3. According to the processing document, use a high-power laser to cut the workpiece 12;

S4. According to the processing document, the short-pulse laser is used to precisely process the workpiece 12, and the high-power laser processing area of the workpiece 12 is precisely trimmed;

S5. Detect the workpiece 12. If the processing requirements are met, the processing is completed; if the processing requirements are not met, S2 to S5 are repeatedly executed until the processing requirements are met, and the processing is completed.

The specific method of the present invention for the composite laser processing of the multi-thickness special-shaped material workpiece 12 is as follows:

Step 1: Clamp the workpiece 12 on the power swing head 18 of the base 15 , and then input the original CAD model of the workpiece 12 into the control unit 1 .

Step 2: Set 3 or more positioning feature points on the workpiece 12, measure the height and surface normal of the workpiece 12 through the CCD image sensor and the distance measuring sensor, and pass the measurement information through the first cable 19 to the control unit 1. According to the measured positioning feature points, compare the positioning feature points of the workpiece 12 CAD model, adjust the coordinates in the original workpiece 12 CAD model to the actual coordinates of the workpiece 12 in the current machine tool coordinate system, and then generate a new workpiece according to the adjusted workpiece coordinates. processing files.

Step 3: According to the processing file generated in Step 2, adjust the processing parameters of high-power laser processing, turn on high-power laser 4 and gas supply unit 7, and provide high-power laser and auxiliary gas for high-power laser processing respectively. The high-power laser is input into the laser cutting head 6 through the first optical transmission structure 5; the auxiliary gas is input into the laser cutting head 6 through the first gas pipe 21 and/or the second gas pipe 22, and the workpiece 12 is carried out along the first preset track. Laser processing, and the workpiece 12 is quickly cut through.

Step 4: According to the processing file generated in Step 2, adjust the processing parameters of the short-pulse laser processing for different materials, turn on the short-pulse laser 9, and control the optical scanning structure 11 to complete the precision processing of the workpiece 12. The high-power laser processing area of the workpiece 12 is precisely trimmed to further improve the quality of the kerf, or to apply a three-dimensional precision structure to the kerf, such as chamfering at a certain angle and so on.

Step 5: After the workpiece 12 is processed, use the detection unit 2 to transmit the detected real-time processing information of the workpiece 12 to the control unit 1 through the second cable 20, and compare it with the CAD model of the original part. If the processing requirements are met, then Complete the processing; if the processing requirements are not met, repeat steps 2 to 5 until the processing is completed.

Example 1:

Referring to FIG. 4 , FIG. 4 is a display diagram of the workpiece 12 processed by the compound laser processing system in the first embodiment. The middle part of the workpiece 12 has a slit penetrating the workpiece 12, the upper part of the slit is designed with a row of grooves similar to plum blossoms, and the bottom of the groove and the side wall of the groove form a certain taper. Although traditional laser cutting can cut through the workpiece 12 quickly, when machining the quincunx groove on the surface of the workpiece 12, it is easy to cause thermal damage to the side wall of the groove, which affects the processing quality. Although the existing precision laser processing can precisely machine the quincunx grooves on the surface of the workpiece 12 , it is difficult to efficiently complete the laser cutting of the large thickness at the lower part of the quincunx grooves. Using the composite laser processing system of the present invention to process such parts can well solve the problem. Under the same system, it only needs one clamping to meet the processing requirements of rapid cutting through and precision machining of plum blossom grooves, which not only improves the processing efficiency, but also better guarantees the processing accuracy and material integrity.

Embodiment 2:

Referring to FIG. 5 , FIG. 5 shows the workpiece 12 of Example 2 processed by the compound laser processing system. When the traditional laser cuts a large thickness (>2mm) material, it can cut through at a high speed, but when cutting a very thin material, it is easy to cause thermal deformation of the workpiece 12 and reduce the processing quality. For heat-sensitive materials, such as ceramic materials and composite materials, the traditional laser cutting process is no longer suitable. Therefore, in order to avoid thermal deformation or control various damages, it is suitable to use precision laser processing to cut materials within 0.5mm or thinner. The workpiece 12 in FIG. 5 is a multi-thickness plate, and the thickness of the plate varies from 0.3 mm to 30 mm. When processing such multi-thickness plates by traditional methods, it is often necessary to use traditional laser cutting technology and precision laser processing technology, respectively, and multiple clamping and positioning, which not only has low processing efficiency, high processing cost, cumbersome processing steps, and poor economy. Using the composite laser processing system of the present invention can effectively solve the problem of multi-thickness material cutting. According to the CAD information of the workpiece 12, the control software provides a unified processing program, the workpiece 12 is clamped in place at one time, the high-power laser 4 is used in coordination to perform laser cutting on the large-thickness part, and the short-pulse laser 9 is used in conjunction with the high-speed optical scanning unit to quickly Laser cutting of ultra-thin parts or three-dimensional processing of other workpiece parts can also be performed, and at the same time, short-pulse laser can be used to precisely trim the previous high-power laser processing area, thereby improving the processing quality. In this way, high-end machining of multi-thickness and multi-material components can be completed with high efficiency and high quality in one clamping.

Embodiment three:

Referring to FIG. 6 , FIG. 6 is a display diagram of the components of Example 3 processed by the composite laser processing system. It can be seen from Figure 6 that the component is a box structure, and the box material is stainless steel. The thickness of the box varies from 1.5mm to 80mm. The upper part of the box has an inclined surface, and there are grooves and rectangular cuts on the inclined surface. A cuboid made of SiC is embedded in the groove. Blind holes with a chamfer of 45° and through holes with a chamfer of 30° are precisely machined. In the conventional method, when processing such parts, it is necessary to process parts of different materials step by step, and then assemble them, and the process is complicated. Using the present invention, the SiC cuboid can be installed in the groove of the box in advance, and then the incision of the box and the in-situ precise positioning and punching of the SiC cuboid can be uniformly performed, so as to ensure the positioning accuracy of the hole on the SiC cuboid relative to other parts of the component. Using the invention to process such components not only meets the processing requirements, but also ensures the relative positioning accuracy of the holes and improves the processing efficiency.

The above, only several embodiments of this application, are not limited to any form of this application. Although this application is revealed as above, it is not used to limit this application. Within the scope of the technical scheme of this application, some changes or modifications are made by the technical content revealed above, all of which are equivalent to equivalent implementation cases, all of which are within the scope of the technical solution.

Claims (10)

1. A composite laser machining system, the system comprising: the device comprises a control unit, and a detection unit, a high-power laser processing unit, a short pulse laser processing unit, a movement unit and an air supply unit which are all connected with the control unit;

the detection unit is used for detecting the positioning characteristic points of the workpiece and acquiring the spatial position information of the workpiece;

the high-power laser processing unit is used for cutting a workpiece according to a first preset track by using high-power laser;

the short pulse laser processing unit is used for processing and trimming the workpiece according to a second preset track by using short pulse laser;

the motion unit is used for adjusting the processing positions and the processing angles of the high-power laser processing unit and the short-pulse laser processing unit;

the gas supply unit is used for supplying high-pressure auxiliary gas to the high-power laser processing unit so as to blow away slag in the cutting seam of the workpiece and cool the high-power laser processing unit;

the control unit is used for generating control information according to the processing information of the workpiece and the spatial position information; and controlling the high-power laser processing unit, the short-pulse laser processing unit, the motion unit and the air supply unit to work according to the control information.

2. The system of claim 1, wherein the high power laser processing unit comprises a high power laser, a first optical transmission structure, and a laser cutting head;

the high-power laser is used for emitting high-power laser;

the first optical transmission structure is used for transmitting the high-power laser into the laser cutting head;

the laser cutting head is used for cutting a workpiece according to a first preset track by using the high-power laser;

preferably, the first optical transmission structure is an optical fiber or a light pipe;

preferably, the high-power laser is a fiber laser and CO ₂ Any one of a laser and a solid-state laser.

3. The system of claim 2, wherein the short pulse laser processing unit comprises a short pulse laser, a second optical transmission structure, and an optical scanning structure;

the short pulse laser is used for emitting short pulse laser;

the second optical transmission structure is used for transmitting the short pulse laser to the optical scanning structure;

the optical scanning structure is used for scanning a workpiece at a high speed according to a second preset track by using the short pulse laser so as to process and trim the workpiece;

preferably, the short pulse laser is a fiber laser or a solid laser;

preferably, the short pulse laser is any one of a nanosecond laser, a picosecond laser and a femtosecond laser;

preferably, the second optical transmission structure is any one of an optical fiber, a light pipe and a reflector;

preferably, the optical scanning structure is a scanning galvanometer or an optical type scanning structure based on rotation of an optical device.

4. The system of claim 3, wherein the detection unit comprises an imaging structure and a ranging structure;

the imaging structure is used for carrying out image recognition on the workpiece, detecting the positioning characteristic points of the workpiece and acquiring the position data of the workpiece;

the distance measuring structure is used for acquiring the real-time processing heights of the laser cutting head, the optical scanning structure and the workpiece respectively;

the position data of the workpiece and the real-time machining height of the workpiece form spatial position information of the workpiece;

preferably, the imaging structure is a CCD image sensor;

preferably, the distance measuring structure is any one of an ultrasonic distance measuring sensor, a laser distance measuring sensor and an electromagnetic induction sensor.

5. The system of claim 3, wherein the motion unit comprises a base, two horizontal guide rails, a powered pendulum head, a cross beam, two vertical guide rails, a cutting head mount and a scan structure mount, and a drive motor;

the two horizontal guide rails are arranged on two sides of the upper surface of the base; the power swing head is arranged on the upper surface of the base and positioned between the two horizontal guide rails, and is used for clamping the workpiece and driving the workpiece to swing freely on two degrees of freedom;

the cross beam is connected to the two horizontal guide rails in a crossing manner; the two vertical guide rails are connected to the cross beam; the cutting head mounting seat and the scanning structure mounting seat are respectively connected to the two vertical guide rails; the cutting head mounting seat is used for placing the laser cutting head, and the scanning structure mounting seat is used for placing the optical scanning structure;

the driving motor is used for driving the power swing head, the cutting head mounting seat and the scanning structure mounting seat to move.

6. The system of claim 1, further comprising a dust removal unit for collecting exhaust gas, soot, or waste residue from the processing of the workpiece.

7. A composite laser processing method applied to the composite laser processing system according to any one of claims 1 to 6, characterized by comprising:

s1, clamping a workpiece, and inputting an original workpiece model into a control unit;

s2, detecting the workpiece, selecting a positioning feature point of the workpiece, adjusting an original workpiece coordinate into a new workpiece coordinate according to the positioning feature point, and generating a processing file according to the new workpiece coordinate;

s3, cutting and processing the workpiece by using high-power laser according to the processing file;

s4, according to the processing file, performing precision processing on the workpiece by using short pulse laser, and performing precision finishing on a high-power laser processing area of the workpiece;

s5, detecting the workpiece, and finishing machining if the machining requirement is met; if the machining requirements are not met, repeatedly executing S2 to S5 until the machining requirements are met, and finishing machining;

preferably, the precision machining is any one of surface cleaning, micro-texture machining, three-dimensional machining, and punching machining.

8. The method according to claim 7, wherein the step S2 is specifically:

3 or more than 3 positioning feature points are arranged on the workpiece;

the height of the workpiece and the normal of the curved surface are measured through the imaging structure and the distance measuring structure, and the measured information is transmitted to the control unit;

and the control unit compares the positioning characteristic points of the workpiece CAD model according to the measured positioning characteristic points, adjusts the coordinates in the original workpiece CAD model into the actual coordinates of the workpiece in the current machine tool coordinate system, and generates a new processing file according to the adjusted workpiece coordinates.

9. The method according to claim 8, wherein the step S3 is specifically:

adjusting the processing parameters of the high-power laser processing according to the generated new processing file;

and opening the high-power laser and the gas supply unit, respectively providing high-power laser and high-pressure auxiliary gas, carrying out laser processing on the workpiece along a first preset track, and quickly cutting through the workpiece.

10. The method according to claim 8, wherein step S4 is specifically:

according to the generated new processing file, processing parameters of the short pulse laser processing are adjusted aiming at different materials;

and opening the short pulse laser, controlling the optical scanning structure to finish the precision machining of the workpiece, and performing precision finishing on the high-power laser machining area of the workpiece.

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