CN115213568A

CN115213568A - Composite laser processing system and processing method

Info

Publication number: CN115213568A
Application number: CN202110347126.6A
Authority: CN
Inventors: 张文武; 张天润; 赵文凌
Original assignee: Ningbo Iii Lasers Technology Co ltd
Current assignee: Ningbo Iii Lasers Technology Co ltd
Priority date: 2021-03-31
Filing date: 2021-03-31
Publication date: 2022-10-21

Abstract

The invention discloses a composite laser processing system and a processing method, belongs to the technical field of laser processing, and can solve the problem that the conventional laser processing system is difficult to simultaneously meet the comprehensive requirements on processing efficiency, processing precision and processing quality. The system comprises: the detection unit is used for detecting the positioning characteristic points of the workpiece and acquiring the spatial position information of the workpiece; the high-power laser processing unit is used for cutting the workpiece according to a first preset track by using high-power laser; the short pulse laser processing unit is used for processing and trimming the workpiece according to a second preset track by using short pulse laser; the motion unit is used for adjusting the processing positions and the processing angles of the high-power laser processing unit and the short-pulse laser processing unit; the gas supply unit is used for supplying high-pressure auxiliary gas to the high-power laser processing unit; the control unit is used for generating control information according to the processing information and the spatial position information of the workpiece; and controls each unit to work according to the control information. The laser processing device is used for laser processing of workpieces.

Description

Composite laser processing system and processing method

Technical Field

The invention relates to a composite laser processing system and a processing method, and belongs to the technical field of laser processing.

Background

Laser cutting utilizes high power density laser to irradiate a workpiece, so that materials are rapidly melted, vaporized or ablated, and generally, the workpiece is cut by means of high-speed gas coaxial with a light beam. Laser cutting generally uses a high-power laser, and is widely used for cutting various plates, especially metals. Along with the increase of the power of the laser, the thickness of a workpiece which is suitable for cutting is expanded to 30-100 mm from within 10mm, the cutting speed is high, and the cutting taper is small. Although a laser that operates continuously can be changed to a laser having a pulse width of microseconds to milliseconds, such a laser processing is not suitable for three-dimensional precision processing due to problems such as a heat affected zone and insufficient resolution in the thickness direction caused by the laser processing. Three-dimensional precision machining requires resolution within 100 μm, even < 10 μm, in all X, Y, and Z directions.

On the other hand, the laser used in the existing laser precision processing is generally a short pulse (< 1 μ S) laser, including a nanosecond laser, a picosecond laser, a femtosecond laser, and the like. The laser has the advantages of high brightness, small heat influence and the like, is generally matched with a high-speed scanning system, can realize complex pattern processing and simultaneously avoid heat accumulation effect, and is applied to the precision processing of a plurality of materials such as ceramics, metals, composite materials and the like, including punching, surface microtexture preparation, laser etching, microgroove preparation, three-dimensional engraving, cleaning and the like. Although the short pulse laser can process a precise structure, has high processing resolution and small heat influence and is suitable for processing a thin-layer material, when a large-depth structure is processed, the processing efficiency is seriously reduced along with the increase of the depth, and the problem of taper needs special treatment.

In the field of machining, it is common to perform both rapid removal of a workpiece and local precision machining of the workpiece. In addition, some machined parts are composed of a variety of materials, such as metal parts including brittle material parts. At present, different machine tools are used for solving the problems, and workpieces are clamped and positioned for multiple times, so that the machining efficiency and the machining precision are adversely affected. The existing laser processing system is difficult to simultaneously meet the comprehensive requirements of processing efficiency, processing precision and processing quality.

Disclosure of Invention

The invention provides a composite laser processing system and a processing method, which can solve the problem that the existing laser processing system is difficult to simultaneously meet the comprehensive requirements of processing efficiency, processing precision and processing quality.

In one aspect, the present invention provides a composite laser processing system, the system comprising: the device comprises a control unit, a detection unit, a high-power laser processing unit, a short pulse laser processing unit, a movement unit and an air supply unit, wherein the detection unit, the high-power laser processing unit, the short pulse laser processing unit, the movement unit and the air supply unit are all connected with the control unit; the detection unit is used for detecting the positioning characteristic points of the workpiece and acquiring the spatial position information of the workpiece; the high-power laser processing unit is used for cutting a workpiece according to a first preset track by using high-power laser; the short pulse laser processing unit is used for processing and trimming the workpiece according to a second preset track by using short pulse laser; the motion unit is used for adjusting the processing positions and the processing angles of the high-power laser processing unit and the short-pulse laser processing unit; the gas supply unit is used for supplying high-pressure auxiliary gas to the high-power laser processing unit so as to blow away slag in the joint of the workpiece and cool the high-power laser processing unit; the control unit is used for generating control information according to the processing information of the workpiece and the spatial position information; and controlling the high-power laser processing unit, the short-pulse laser processing unit, the motion unit and the air supply unit to work according to the control information.

Optionally, the high-power laser processing unit includes a high-power laser, a first optical transmission structure and a laser cutting head; the high-power laser is used for emitting high-power laser; the first optical transmission structure is used for transmitting the high-power laser into the laser cutting head; the laser cutting head is used for cutting a workpiece according to a first preset track by using the high-power laser.

Optionally, the first optical transmission structure is an optical fiber or a light pipe.

Optionally, the high-power laser is a fiber laser and CO ₂ Any one of a laser and a solid-state laser.

Optionally, the short-pulse laser processing unit includes a short-pulse laser, a second optical transmission structure and an optical scanning structure; the short pulse laser is used for emitting short pulse laser; the second optical transmission structure is used for transmitting the short pulse laser to the optical scanning structure; the optical scanning structure is used for scanning a workpiece at a high speed according to a second preset track by using the short pulse laser so as to process and trim the workpiece.

Optionally, the short pulse laser is a fiber laser or a solid laser.

Optionally, the short pulse laser is any one of a nanosecond laser, a picosecond laser, and a femtosecond laser.

Optionally, the second optical transmission structure is any one of an optical fiber, a light pipe and a mirror plate.

Optionally, the optical scanning structure is a scanning galvanometer or an optical scanning structure based on rotation of an optical device.

Optionally, the detection unit includes an imaging structure and a ranging structure; the imaging structure is used for carrying out image recognition on the workpiece, detecting the positioning characteristic points of the workpiece and acquiring the position data of the workpiece; the distance measuring structure is used for acquiring the real-time processing heights of the laser cutting head, the optical scanning structure and the workpiece respectively; the position data of the workpiece and the real-time machining height of the workpiece constitute spatial position information of the workpiece.

Optionally, the imaging structure is a CCD image sensor.

Optionally, the distance measuring structure is any one of an ultrasonic distance measuring sensor, a laser distance measuring sensor and an electromagnetic induction sensor.

Optionally, the movement unit includes a base, two horizontal guide rails, a dynamic swing head, a cross beam, two vertical guide rails, a cutting head mounting seat, a scanning structure mounting seat, and a driving motor; the two horizontal guide rails are arranged on two sides of the upper surface of the base; the power swing head is arranged on the upper surface of the base and positioned between the two horizontal guide rails, and is used for clamping the workpiece and driving the workpiece to swing freely in two degrees of freedom; the cross beam is connected on the two horizontal guide rails in a crossing manner; the two vertical guide rails are connected to the cross beam; the cutting head mounting seat and the scanning structure mounting seat are respectively connected to the two vertical guide rails; the cutting head mounting seat is used for placing the laser cutting head, and the scanning structure mounting seat is used for placing the optical scanning structure; the driving motor is used for driving the power swing head, the cutting head mounting seat and the scanning structure mounting seat to move.

Optionally, the system further comprises a dust removal unit, wherein the dust removal unit is used for collecting the waste gas, the smoke dust or the waste residue after the workpiece is processed.

In another aspect, the present invention provides a composite laser processing method applied to any one of the composite laser processing systems described above, the method including: s1, clamping a workpiece, and inputting an original workpiece model into a control unit; s2, detecting the workpiece, selecting a positioning feature point of the workpiece, adjusting an original workpiece coordinate into a new workpiece coordinate according to the positioning feature point, and generating a processing file according to the new workpiece coordinate; s3, cutting and processing the workpiece by using high-power laser according to the processing file; s4, according to the processing file, performing precision processing on the workpiece by using short pulse laser, and performing precision finishing on a high-power laser processing area of the workpiece; s5, detecting the workpiece, and finishing machining if the machining requirement is met; and if the machining requirements are not met, repeatedly executing S2 to S5 until the machining requirements are met, and finishing machining.

Optionally, the precision machining is any one of surface cleaning, microtexture machining, three-dimensional machining and punching machining.

Optionally, step S2 specifically includes: 3 or more than 3 positioning feature points are arranged on the workpiece; measuring the height of the workpiece and the normal of the curved surface through the imaging structure and the distance measuring structure, and transmitting the measured information to the control unit; and the control unit compares the positioning characteristic points of the workpiece CAD model according to the measured positioning characteristic points, adjusts the coordinates in the original workpiece CAD model into the actual coordinates of the workpiece in the current machine tool coordinate system, and generates a new processing file according to the adjusted workpiece coordinates.

Optionally, step S3 specifically includes: adjusting the processing parameters of the high-power laser processing according to the generated new processing file; and opening the high-power laser and the gas supply unit, respectively providing high-power laser and high-pressure auxiliary gas, carrying out laser processing on the workpiece along a first preset track, and quickly cutting through the workpiece.

Optionally, step S4 specifically includes: according to the generated new processing file, processing parameters of the short pulse laser processing are adjusted aiming at different materials; and opening the short pulse laser, controlling the optical scanning structure to finish the precision machining of the workpiece, and performing precision finishing on the high-power laser machining area of the workpiece.

The invention can produce the beneficial effects that:

the composite laser processing system provided by the invention uses the high-power laser, and firstly, rapidly cuts a workpiece under the protection of gas; then, a short pulse laser and an optical scanning structure under the same precise motion system are utilized to precisely process the workpiece with the assistance of an intelligent control system; furthermore, the two parts are provided for processing the same area in an interactive mode, the cutting efficiency is guaranteed through high-power cutting, and the quality of a cut seam is improved through short pulse laser trimming. The two laser processing modes are mutually matched, so that the comprehensive requirements of the processing efficiency, the processing thickness and the processing quality of the workpiece are met. Compared with the prior art, the invention organically combines the traditional high-power laser processing technology and the precision laser processing technology, and the control system takes the two technologies into account, thereby having the deep fusion characteristic rather than the simple superposition organization. Just because of the fusion of two laser processing technologies, the engineering problems that workpieces can be comprehensively processed by multi-thickness special-shaped materials at high efficiency under the condition of one-time clamping of the same system are effectively solved.

Drawings

Fig. 1 is a block diagram of a composite laser processing system according to an embodiment of the present invention;

FIG. 2 is a flow chart of a hybrid laser processing method according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of a composite laser processing system according to an embodiment of the present invention;

FIG. 4 is a workpiece-showing diagram of a hybrid laser processing system processing embodiment 1 provided by an embodiment of the present invention;

FIG. 5 is a workpiece illustration of a composite laser processing system processing embodiment 2 provided by an embodiment of the present invention;

fig. 6 is a workpiece illustration of a composite laser processing system processing embodiment 3 in accordance with an embodiment of the present invention.

List of parts and reference numerals:

1. a control unit; 2. a detection unit; 3. a high power laser processing unit; 4. a high power laser; 5. a first optical transmission structure; 6. a laser cutting head; 7. an air supply unit; 8. a motion unit; 9. a short pulse laser; 10. a second optical transmission structure; 11. an optical scanning structure; 12. a workpiece; 13. a dust removal unit; 14. a short pulse laser processing unit; 15. a base; 16. a cross beam; 17. a vertical guide rail; 18. dynamic head swinging; 19. a first cable; 20. a second cable; 21. a first air pipe; 22. a second air pipe.

Detailed Description

The present invention will be described in detail with reference to examples, but the present invention is not limited to these examples.

An embodiment of the present invention provides a composite laser processing system, as shown in fig. 1 to 6, the system including: the device comprises a control unit 1, a detection unit 2, a high-power laser processing unit 3, a short-pulse laser processing unit 14, a movement unit 8 and an air supply unit 7 which are all connected with the control unit 1; the detection unit 2 is used for detecting the positioning characteristic points of the workpiece 12 and acquiring the spatial position information of the workpiece 12; the high-power laser processing unit 3 is used for cutting the workpiece 12 according to a first preset track by using high-power laser; the short-pulse laser processing unit 14 is used for processing and trimming the workpiece 12 according to a second preset track by using short-pulse laser; the moving unit 8 is used for adjusting the processing positions and the processing angles of the high-power laser processing unit 3 and the short-pulse laser processing unit 14; the gas supply unit 7 is used for supplying high-pressure auxiliary gas to the high-power laser processing unit 3 so as to blow away slag in the cutting seams of the workpiece 12 and cool the high-power laser processing unit 3; the control unit 1 is used for generating control information according to the processing information and the spatial position information of the workpiece 12; and controls the high-power laser processing unit 3, the short-pulse laser processing unit 14, the moving unit 8 and the gas supply unit 7 to operate according to the control information.

Specifically, the high-power laser processing unit 3 comprises a high-power laser 4, a first optical transmission structure 5 and a laser cutting head 6; the high-power laser 4 is used for emitting high-power laser; the first optical transmission structure 5 is used for transmitting high-power laser light into the laser cutting head 6; the laser cutting head 6 is used for cutting the workpiece 12 according to a first preset track by using high-power laser; preferably, the first optical transmission structure 5 is an optical fiber or a light pipe.

The high power laser 4 is suitable for rapid cutting of workpieces 12 of various thicknesses, preferably high power high quality kilowatt-level and kilowatt-level lasers, including but not limited to fiber lasers, CO ₂ Lasers, solid state lasers, and the like, with fiber lasers that facilitate flexible transmission being particularly preferred.

A first optical transmission structure 5 is located between the high power laser 4 and the laser cutting head 6 for transmitting the high power laser light into the laser cutting head 6, including but not limited to optical fibers, light pipes.

The laser cutting head 6 is attached to the cutting head mount of the movement unit 8.

Further, the short pulse laser processing unit 14 includes a short pulse laser 9, a second optical transmission structure 10, and an optical scanning structure 11; the short pulse laser 9 is used for emitting short pulse laser; the second optical transmission structure 10 is used for transmitting the short pulse laser light into the optical scanning structure 11; the optical scanning mechanism 11 is used for scanning the workpiece 12 at a high speed by using short pulse laser according to a second preset track so as to precisely machine and precisely trim the workpiece 12, thereby improving the cutting quality. The precision machining includes but is not limited to surface cleaning, micro-texture machining, three-dimensional machining, punching machining and other fine machining. The short pulse laser 9 includes, but is not limited to, a fiber laser, a solid laser, etc.; laser pulse widths < 1 mus, including but not limited to nanosecond lasers, picosecond lasers, femtosecond lasers, and the like.

A second optical transmission structure 10 is located between the short pulse laser 9 and the optical scanning structure 11 for transmitting the short pulse laser light into the optical scanning structure 11, including but not limited to optical fibers, light pipes, mirrors.

The optical scanning structure 11 is disposed on the scanning structure mounting seat of the moving unit 8, and is used for realizing high-speed scanning of short pulse laser, including but not limited to various high-speed scanning based on galvanometer and optical rotation type high-speed scanning based on optical device rotation, and preferably uses a scanning galvanometer, including but not limited to two-axis and three-axis scanning galvanometer, for controlling laser movement in two directions of X and Y or controlling laser movement in three directions of X, Y and Z. The scanning speed is generally > 100mm/s, preferably > 1000mm/s, more preferably > 10m/s.

The control unit 1 is an industrial control computer, an embedded industrial control system or a remote control system communicated through a network, is used for controlling and completing the rapid machining of the workpiece 12 by the composite laser machining system, is respectively and electrically connected with the detection unit 2, the high-power laser 4, the gas supply unit 7, the movement unit 8, the short-pulse laser 9, the optical scanning structure 11 and the dust removal unit 13, is used for controlling the detection unit 2, the high-power laser 4, the auxiliary gas supply unit 7, the movement unit 8, the short-pulse laser 9, the optical scanning structure 11 and the dust removal unit 13 to work according to preset control information, and is coordinated and matched with each other to complete the rapid machining of the workpiece 12 by the composite laser machining system.

The detection unit 2 is used for detecting the positioning feature points of the workpiece 12, automatically acquiring the spatial position information of the workpiece 12, and transmitting the acquired spatial position information of the workpiece 12 to the control unit 1. The detection unit 2 at least comprises an imaging structure and a distance measuring structure, and is closely connected with the laser cutting head 6 and the optical scanning structure 11. The imaging structure is used for carrying out image recognition on the workpiece 12, detecting the positioning characteristic points of the workpiece 12 and acquiring the position data of the workpiece 12; the distance measuring structure is used for acquiring the real-time processing heights of the laser cutting head 6, the optical scanning structure 11 and the workpiece 12 respectively; the position data of the workpiece 12 and the real-time machining height of the workpiece 12 constitute spatial position information of the workpiece 12; the imaging structure is preferably a CCD image sensor for image recognition, edge alignment and positioning of the workpiece 12. The positioning includes automatic positioning or manual positioning. Ranging structures include, but are not limited to, the use of ultrasonic ranging sensors, laser ranging sensors, electromagnetic induction sensors, and the like.

The auxiliary gas supply unit 7 is used for generating high-pressure auxiliary gas, and the generated high-pressure auxiliary gas is input into the laser cutting head 6 and used for blowing away slag in the cutting seams, cooling the focusing lens and preventing smoke dust from entering the lens seat. The use of the assist gas is generally selected based on the material of the workpiece 12.

The moving unit 8 is used for adjusting the moving position and the processing angle of the laser cutting head 6 according to the control information of the control unit 1, so as to realize the accurate processing of the workpiece 12. The motion unit 8 includes two-axis, three-axis, and three-axis or more machining systems.

Referring to fig. 3, the moving unit 8 is composed of a moving shaft, a driving motor, and the like, and includes a horizontal guide rail, a beam 16, a vertical guide rail 17, a power head 18, a cutting head mounting seat, a scanning structure mounting seat, a base 15, and the like. Preferably, the above structure forms a gantry structure, and is driven by a multi-axis motor to cooperate with the laser cutting head 6 and the optical scanning structure 11, so as to complete the rapid processing of the workpiece 12 by the composite laser processing system. Two horizontal guide rails of the gantry structure are arranged and are arranged on two sides of the upper surface of the base 15 in parallel; the cross beam 16 spans the tops of the two horizontal guide rails; the vertical guide rail 17 is connected above the cross beam 16; the cutting head mounting seat and the scanning structure mounting seat are respectively connected to the vertical guide rail 17; the cutting head mounting seat is used for placing a laser cutting head 6; the scanning structure mounting base is used for placing the optical scanning structure 11; the power swing head 18 is arranged on the upper surface of the base 15 and is positioned between the two horizontal guide rails; the power swing head 18 is used for clamping the workpiece 12 and can drive the workpiece 12 to swing freely in two degrees of freedom, namely A and C, so that the composite laser processing system can process the workpiece 12 quickly.

Two vertical guide rails 17 are provided and are respectively connected to the front and the rear surfaces of the beam 16, the vertical guide rail 17 in front of the beam 16 is used for placing the laser cutting head 6, and the vertical guide rail 17 behind the beam 16 is used for placing the optical scanning structure 11.

In order to protect the environment and the health of the operator, the dust removal unit 13 is used for collecting waste gas, smoke, waste residues and the like after the workpiece 12 is processed.

Referring to fig. 2, another embodiment of the present invention provides a composite laser processing method applied to the composite laser processing system of any one of the above, the method including:

s1, clamping a workpiece 12, and inputting an original workpiece model into a control unit 1;

s2, detecting the workpiece 12, selecting a positioning feature point of the workpiece 12, adjusting an original workpiece coordinate into a new workpiece coordinate according to the positioning feature point, and generating a processing file according to the new workpiece coordinate;

s3, cutting the workpiece 12 by using high-power laser according to the processing file;

s4, according to the processing file, performing precision processing on the workpiece 12 by using short pulse laser, and performing precision finishing on a high-power laser processing area of the workpiece 12;

s5, detecting the workpiece 12, and finishing machining if the machining requirement is met; and if the machining requirement is not met, repeatedly executing S2 to S5 until the machining requirement is met, and finishing machining.

The invention relates to a specific method for composite laser processing of a multi-thickness special-shaped material workpiece 12, which comprises the following steps:

step 1: the workpiece 12 is clamped on the power swing head 18 of the base 15 and the original CAD model of the workpiece 12 is then input into the control unit 1.

Step 2: 3 or more than three positioning characteristic points are arranged on the workpiece 12, the height and the surface normal of the workpiece 12 are measured through a CCD image sensor and a distance measuring sensor, and the measurement information is transmitted to the control unit 1 through a first cable 19. And comparing the positioning characteristic points of the CAD model of the workpiece 12 according to the measured positioning characteristic points, adjusting the coordinates in the CAD model of the original workpiece 12 into the actual coordinates of the workpiece 12 in the current machine tool coordinate system, and generating a new processing file according to the adjusted workpiece coordinates.

And 3, step 3: and (3) adjusting the processing parameters of the high-power laser processing according to the processing file generated in the step (2), opening the high-power laser 4 and the gas supply unit 7, and respectively providing the high-power laser and the auxiliary gas for the high-power laser processing. High-power laser is input into the laser cutting head 6 through the first optical transmission structure 5; the auxiliary gas is fed into the laser cutting head 6 through the first gas pipe 21 and/or the second gas pipe 22, laser-processes the workpiece 12 along a first predetermined trajectory, and rapidly cuts through the workpiece 12.

And 4, step 4: according to the processing file generated in the step 2, the processing parameters of the short pulse laser processing are adjusted according to different materials, the short pulse laser 9 is opened, the optical scanning structure 11 is controlled to finish the precision processing of the workpiece 12, and meanwhile, the short pulse laser can also be used for carrying out precision finishing on the high-power laser processing area of the workpiece 12 so as to further improve the quality of the cutting seam, or a three-dimensional precision structure is applied to the cutting seam, such as chamfering at a certain angle and the like.

And 5: after the workpiece 12 is machined, the detected real-time machining information of the workpiece 12 is transmitted to the control unit 1 through the second cable 20 by using the detection unit 2, and is compared with the original part CAD model, and if the machining requirement is met, the machining is finished; and if the machining requirements are not met, repeating the steps 2 to 5 until the machining is completed.

The first embodiment is as follows:

referring to fig. 4, fig. 4 is an illustration of a composite laser processing system processing example 1 workpiece 12. The middle part of the workpiece 12 is provided with a cutting seam penetrating through the workpiece 12, the upper part of the cutting seam is provided with a row of grooves similar to a quincunx pattern, and the bottoms of the grooves and the side walls of the grooves form a certain taper. Although the workpiece 12 can be cut through rapidly by conventional laser cutting, when the quincunx groove on the surface of the workpiece 12 is machined, the side wall of the groove is easily damaged thermally, and the machining quality is affected. Although the existing precision laser processing can precisely process the plum blossom-shaped groove on the surface of the workpiece 12, the high-efficiency completion of the large-thickness laser cutting at the lower part of the plum blossom-shaped groove is difficult. The problems can be solved well by using the composite laser processing system of the present invention to process such parts. Under the same system, the machining requirements of fast cutting through and precision machining of the plum blossom-shaped groove of the part can be met only by once clamping, the machining efficiency is improved, and the machining precision and the material integrity can be better ensured.

The second embodiment:

referring to fig. 5, fig. 5 is a composite laser machining system for machining a workpiece 12 of example 2. When a traditional laser cuts a material with large thickness (more than 2 mm), high-speed cutting can be carried out, but when a very thin material is cut, the workpiece 12 is easy to deform thermally, and the processing quality is reduced. In the case of heat-sensitive materials, such as ceramic materials and composite materials, the conventional laser cutting process is not suitable. Therefore, in order to avoid thermal deformation or control various kinds of damage, it is appropriate to cut a material within 0.5mm or less using precision laser processing. The workpiece 12 of FIG. 5 is a multi-thickness plate having a thickness varying from 0.3mm to 30 mm. When the plate with multiple thicknesses is machined by the traditional method, the traditional laser cutting process and the precision laser machining process are required to be respectively used, and clamping and positioning are carried out for multiple times, so that the machining efficiency is low, the machining cost is high, the machining steps are complicated, and the economy is poor. The composite laser processing system can effectively solve the problem of cutting of multi-thickness materials. According to the invention, a unified processing program is given by control software according to CAD information of the workpiece 12, the workpiece 12 is clamped in place at one time, the high-power laser 4 is coordinated to carry out laser cutting on a large-thickness part, the short-pulse laser 9 is matched with a high-speed optical scanning unit to rapidly carry out laser cutting on an ultrathin part or carry out three-dimensional processing on other workpiece 12 parts, and meanwhile, the short-pulse laser can be used for carrying out precise trimming on a previous high-power laser processing area, thereby improving the processing quality. Therefore, high-end processing of parts with multiple thicknesses and multiple materials can be finished efficiently and high-quality by one-time clamping.

Example three:

referring to fig. 6, fig. 6 is a display of a composite laser machining system processing example 3 parts. As can be seen from fig. 6, the component is a box structure, and the box material is stainless steel. The thickness of this box is not equal at 1.5mm ~ 80mm, and there is an inclined plane on the upper portion of box, and it has recess and rectangle incision to open on the inclined plane, and the cuboid that the material is SiC is embedded to the groove, needs relative box structure on the cuboid, and the precision finishing chamfer is 45 blind holes and the chamfer is 30 through-holes. In the conventional method, parts made of different materials are required to be processed step by step and then assembled, so that the process is complicated. By using the invention, the SiC cuboid can be arranged in the groove of the box body in advance, and then the notch of the box body and the in-situ precise positioning and punching of the SiC cuboid are uniformly carried out, so that the positioning precision of the hole on the SiC cuboid relative to other parts of the component is ensured. The invention is used for processing the parts, thereby not only meeting the processing requirements, but also ensuring the relative positioning precision of the holes and improving the processing efficiency.

Although the present application has been described with reference to a few embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the application as defined by the appended claims.

Claims

1. A composite laser machining system, the system comprising: the device comprises a control unit, and a detection unit, a high-power laser processing unit, a short pulse laser processing unit, a movement unit and an air supply unit which are all connected with the control unit;

the detection unit is used for detecting the positioning characteristic points of the workpiece and acquiring the spatial position information of the workpiece;

the high-power laser processing unit is used for cutting a workpiece according to a first preset track by using high-power laser;

the short pulse laser processing unit is used for processing and trimming the workpiece according to a second preset track by using short pulse laser;

the motion unit is used for adjusting the processing positions and the processing angles of the high-power laser processing unit and the short-pulse laser processing unit;

the gas supply unit is used for supplying high-pressure auxiliary gas to the high-power laser processing unit so as to blow away slag in the cutting seam of the workpiece and cool the high-power laser processing unit;

the control unit is used for generating control information according to the processing information of the workpiece and the spatial position information; and controlling the high-power laser processing unit, the short-pulse laser processing unit, the motion unit and the air supply unit to work according to the control information.

2. The system of claim 1, wherein the high power laser processing unit comprises a high power laser, a first optical transmission structure, and a laser cutting head;

the high-power laser is used for emitting high-power laser;

the first optical transmission structure is used for transmitting the high-power laser into the laser cutting head;

the laser cutting head is used for cutting a workpiece according to a first preset track by using the high-power laser;

preferably, the first optical transmission structure is an optical fiber or a light pipe;

preferably, the high-power laser is a fiber laser and CO ₂ Any one of a laser and a solid-state laser.

3. The system of claim 2, wherein the short pulse laser processing unit comprises a short pulse laser, a second optical transmission structure, and an optical scanning structure;

the short pulse laser is used for emitting short pulse laser;

the second optical transmission structure is used for transmitting the short pulse laser to the optical scanning structure;

the optical scanning structure is used for scanning a workpiece at a high speed according to a second preset track by using the short pulse laser so as to process and trim the workpiece;

preferably, the short pulse laser is a fiber laser or a solid laser;

preferably, the short pulse laser is any one of a nanosecond laser, a picosecond laser and a femtosecond laser;

preferably, the second optical transmission structure is any one of an optical fiber, a light pipe and a reflector;

preferably, the optical scanning structure is a scanning galvanometer or an optical type scanning structure based on rotation of an optical device.

4. The system of claim 3, wherein the detection unit comprises an imaging structure and a ranging structure;

the imaging structure is used for carrying out image recognition on the workpiece, detecting the positioning characteristic points of the workpiece and acquiring the position data of the workpiece;

the distance measuring structure is used for acquiring the real-time processing heights of the laser cutting head, the optical scanning structure and the workpiece respectively;

the position data of the workpiece and the real-time machining height of the workpiece form spatial position information of the workpiece;

preferably, the imaging structure is a CCD image sensor;

preferably, the distance measuring structure is any one of an ultrasonic distance measuring sensor, a laser distance measuring sensor and an electromagnetic induction sensor.

5. The system of claim 3, wherein the motion unit comprises a base, two horizontal guide rails, a powered pendulum head, a cross beam, two vertical guide rails, a cutting head mount and a scan structure mount, and a drive motor;

the two horizontal guide rails are arranged on two sides of the upper surface of the base; the power swing head is arranged on the upper surface of the base and positioned between the two horizontal guide rails, and is used for clamping the workpiece and driving the workpiece to swing freely on two degrees of freedom;

the cross beam is connected to the two horizontal guide rails in a crossing manner; the two vertical guide rails are connected to the cross beam; the cutting head mounting seat and the scanning structure mounting seat are respectively connected to the two vertical guide rails; the cutting head mounting seat is used for placing the laser cutting head, and the scanning structure mounting seat is used for placing the optical scanning structure;

the driving motor is used for driving the power swing head, the cutting head mounting seat and the scanning structure mounting seat to move.

6. The system of claim 1, further comprising a dust removal unit for collecting exhaust gas, soot, or waste residue from the processing of the workpiece.

7. A composite laser processing method applied to the composite laser processing system according to any one of claims 1 to 6, characterized by comprising:

s1, clamping a workpiece, and inputting an original workpiece model into a control unit;

s2, detecting the workpiece, selecting a positioning feature point of the workpiece, adjusting an original workpiece coordinate into a new workpiece coordinate according to the positioning feature point, and generating a processing file according to the new workpiece coordinate;

s3, cutting and processing the workpiece by using high-power laser according to the processing file;

s4, according to the processing file, performing precision processing on the workpiece by using short pulse laser, and performing precision finishing on a high-power laser processing area of the workpiece;

s5, detecting the workpiece, and finishing machining if the machining requirement is met; if the machining requirements are not met, repeatedly executing S2 to S5 until the machining requirements are met, and finishing machining;

preferably, the precision machining is any one of surface cleaning, micro-texture machining, three-dimensional machining, and punching machining.

8. The method according to claim 7, wherein the step S2 is specifically:

3 or more than 3 positioning feature points are arranged on the workpiece;

the height of the workpiece and the normal of the curved surface are measured through the imaging structure and the distance measuring structure, and the measured information is transmitted to the control unit;

and the control unit compares the positioning characteristic points of the workpiece CAD model according to the measured positioning characteristic points, adjusts the coordinates in the original workpiece CAD model into the actual coordinates of the workpiece in the current machine tool coordinate system, and generates a new processing file according to the adjusted workpiece coordinates.

9. The method according to claim 8, wherein the step S3 is specifically:

adjusting the processing parameters of the high-power laser processing according to the generated new processing file;

and opening the high-power laser and the gas supply unit, respectively providing high-power laser and high-pressure auxiliary gas, carrying out laser processing on the workpiece along a first preset track, and quickly cutting through the workpiece.

10. The method according to claim 8, wherein step S4 is specifically:

according to the generated new processing file, processing parameters of the short pulse laser processing are adjusted aiming at different materials;

and opening the short pulse laser, controlling the optical scanning structure to finish the precision machining of the workpiece, and performing precision finishing on the high-power laser machining area of the workpiece.