CN115218532A - Temperature control system of high-power optical fiber coupling semiconductor laser and use method thereof - Google Patents
Temperature control system of high-power optical fiber coupling semiconductor laser and use method thereof Download PDFInfo
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- CN115218532A CN115218532A CN202110398311.8A CN202110398311A CN115218532A CN 115218532 A CN115218532 A CN 115218532A CN 202110398311 A CN202110398311 A CN 202110398311A CN 115218532 A CN115218532 A CN 115218532A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000013307 optical fiber Substances 0.000 title claims abstract description 14
- 230000008878 coupling Effects 0.000 title claims abstract description 12
- 238000010168 coupling process Methods 0.000 title claims abstract description 12
- 238000005859 coupling reaction Methods 0.000 title claims abstract description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 49
- 239000002184 metal Substances 0.000 claims abstract description 42
- 238000001816 cooling Methods 0.000 claims abstract description 39
- 238000005057 refrigeration Methods 0.000 claims abstract description 32
- 238000004806 packaging method and process Methods 0.000 claims abstract description 9
- 238000012360 testing method Methods 0.000 claims abstract description 9
- 238000009434 installation Methods 0.000 claims description 15
- 239000000498 cooling water Substances 0.000 claims description 5
- 239000000835 fiber Substances 0.000 claims description 5
- 230000003595 spectral effect Effects 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention relates to a temperature control system of a high-power optical fiber coupling semiconductor laser and a using method thereof. The cooling system comprises a mounting base, a water-cooling metal plate, a water supply and return pipeline, a TEC refrigerating sheet and a temperature sensor, wherein the water-cooling metal plate is arranged below the mounting base, a laser mounting hole is formed in the surface of the water-cooling metal plate, a round hole is formed in the side wall of the water-cooling metal plate, and the temperature sensor is arranged in the round hole; a water supply and return pipeline is arranged in the water-cooled metal plate, and a TEC (thermoelectric cooler) refrigerating sheet is arranged between the mounting base and the water-cooled metal plate; the TEC refrigeration piece and the temperature sensor are respectively connected with the TEC temperature controller. The invention regulates and controls the temperature of the laser, and then the water-cooled metal plate helps the TEC refrigerating plate to dissipate heat, so that the temperature of the laser during packaging and testing can be effectively controlled, and the quality problem caused by the phenomenon of spectral temperature drift due to overlong wavelength of the laser caused by overhigh temperature is solved.
Description
Technical Field
The invention relates to a temperature control system of a high-power optical fiber coupling semiconductor laser and a using method thereof, belonging to the technical field of semiconductor laser sealing measurement.
Background
With the gradual maturity of semiconductor technology, semiconductor lasers are increasingly widely applied in the fields of scientific research, industry, military, medical treatment and the like due to the characteristics of high conversion efficiency, small volume, light weight, high reliability, direct modulation and the like, and revolutionary breakthroughs are caused in various fields, so that the market demand and the development potential are huge. Because the semiconductor laser self has certain characteristics, namely the wavelength changes along with the change of temperature, generally, the higher the temperature is, the longer the wavelength is, the spectrum temperature drift phenomenon is generated, and different working currents cause accumulated heat difference, so that the control of technological parameters in the packaging process is difficult, the product quality is even influenced, the key data of final performance test is inconsistent, and accurate benchmarking cannot be realized.
At present, in the field of semiconductor laser sealing and measuring, the high-power optical fiber coupling semiconductor laser sealing and measuring mainly relies on a single water cooling system to realize effective heat dissipation, for example, a water cooling plate, a laser and a laser system disclosed in chinese patent document CN 209844198U. This water-cooling plate includes: the water-cooling plate comprises a water-cooling plate main body, wherein a water flow channel and a separating body are arranged on the water-cooling plate main body, and the separating body separates the water flow channel into two water channel grooves in the water flow direction. Although the device can cool the laser to prevent the laser from being burnt out due to overhigh and over-limit working temperature, the temperature is uncontrollable and cannot be adjusted accurately, in addition, when the wavelength laser is locked, the wavelength is required to be stably output, and the adjustable temperature control system and the method with the closed-loop feedback function are particularly important.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a temperature control system of a high-power optical fiber coupling semiconductor laser and a using method thereof. The control that laser instrument operating temperature is effective accurate has been realized, seals to survey process temperature and knows adjustable, has improved the product uniformity. Meanwhile, the method has the condition of obtaining various key performance parameters within an allowable temperature range, so that the benchmarking becomes simpler.
The technical scheme of the invention is as follows:
a temperature control system of a high-power optical fiber coupling semiconductor laser comprises a cooling system and a TEC temperature controller, wherein the cooling system comprises an installation base, a water cooling metal plate, a water supply and return pipeline, a TEC refrigeration piece and a temperature sensor, the water cooling metal plate is arranged below the installation base, a laser installation hole is formed in the surface of the water cooling metal plate, a round hole is formed in the side wall of the water cooling metal plate, and the temperature sensor is arranged in the round hole; a water supply and return pipeline is arranged in the water-cooled metal plate, and a TEC refrigerating sheet is arranged between the mounting base and the water-cooled metal plate; the TEC refrigeration piece and the temperature sensor are respectively connected with the TEC temperature controller.
According to the invention, preferably, the number of the TEC refrigeration sheets is 3-6, and the TEC refrigeration sheets are connected in a series-parallel combination mode and then directly connected with the TEC temperature controller through cables; the temperature sensor is directly connected with the TEC temperature controller through a cable. The temperature sensor and the TEC refrigeration plate are mutually independent.
According to the invention, the mounting base and the water-cooling metal plate are rectangular and are matched in size.
According to the invention, preferably, four corners of the mounting base are respectively provided with a fixing hole, four corners of the water-cooling metal plate are respectively provided with a screw hole, and the mounting base, the TEC refrigeration piece and the water-cooling metal plate are fixedly connected through a fastening hole and the screw holes.
According to the present invention, the number of the laser mounting holes penetrating the mounting base is preferably 10 to 20. The number and the arrangement of the laser mounting holes are set according to the type of the laser, and the laser mounting holes can be compatible with the lasers with different types, and the front surface and the back surface of the mounting base can be universal due to the fact that the laser mounting holes are communicated.
According to the invention, the water supply and return pipeline is preferably provided with a water inlet and a water outlet, and the water inlet and the water outlet are connected to the water pipe through a water supply and return ball valve. The cooling of the water-cooling metal plate is realized by the flowing of cooling water in the water supply and return pipeline, and then the heat dissipation of the TEC refrigeration piece is completed.
According to the invention, the water supply and return pipeline is preferably continuously folded.
According to the invention, the type of the TEC refrigeration piece is TEC1212, the front side of the TEC refrigeration piece is used for refrigerating, the back side of the TEC refrigeration piece is used for heating, the back side of the TEC refrigeration piece is completely attached to the upper surface of the water-cooling metal plate, and the front side of the TEC refrigeration piece is completely attached to the lower surface of the installation base.
According to the optimization of the invention, the model of the TEC temperature controller is TEC2415F, and a PID algorithm module is arranged in the TEC temperature controller. The TEC temperature controller outputs voltage and current to the TEC refrigerating piece to enable the TEC refrigerating piece to work, and meanwhile receives an input signal detected by the temperature sensor to form a closed loop, and then the PID algorithm module effectively and accurately controls the temperature curves of the TEC refrigerating piece and the TEC refrigerating piece to be overlapped according to the curves of the set temperature and the actual temperature, so that the actual temperature of the laser is the set temperature, and the phenomenon that the laser generates spectrum temperature drift due to overhigh temperature is avoided.
According to the invention, the type of the temperature sensor is NTC10K, and the temperature sensor can detect the actual working temperature of the laser and feed back the actual working temperature to the TEC temperature controller.
The use method of the temperature control system of the high-power optical fiber coupling semiconductor laser comprises the following operation steps:
(1) Opening a water supply ball valve, and introducing circulating cooling water;
(2) Fastening the laser on the laser mounting hole of the mounting base by using a torque screwdriver, and completely contacting without clearance fit;
(3) Opening a TEC temperature controller, setting the required temperature, starting the TEC temperature controller to output voltage and current to a TEC refrigerating plate, and receiving an input signal detected by a temperature sensor;
(4) After the actual temperature reaches the set temperature and is stable, the laser starts to work, and packaging test is carried out;
(5) And after the packaging test is finished, stopping the laser, closing the TEC temperature controller, and disassembling the laser.
The invention has the beneficial effects that:
1. the temperature control system provided by the invention realizes effective and accurate temperature control on the high-power optical fiber coupling semiconductor laser, meets the product requirement of stable wavelength output, and lays a technological foundation for upgrading and updating the laser.
2. The temperature control system provided by the invention regulates and controls the temperature of the laser through the temperature control of the TEC, and the water-cooled metal plate helps the TEC refrigerating sheet to dissipate heat, so that double temperature control is formed, the temperature of the laser during packaging test can be effectively controlled, the quality problem caused by the phenomenon that the wavelength of the laser is too long due to overhigh temperature and further the spectrum temperature drift is generated is solved, the controllability of key process parameters in the packaging test process is realized, and the quality and consistency of products are improved.
Drawings
FIG. 1 is a schematic diagram of a temperature control system according to the present invention;
fig. 2 is a schematic structural view of the cooling system of the present invention.
FIG. 3 is a schematic structural view of a water-cooled metal plate;
FIG. 4 is a schematic structural diagram of a TEC refrigeration plate;
FIG. 5 is a schematic view of a temperature sensor;
FIG. 6 is a schematic view of the mounting base;
wherein: 1. a TEC temperature controller; 2. water-cooling the metal plate; 3. a TEC refrigeration piece; 4. a temperature sensor; 5. installing a base; 6. a water inlet; 7. a water outlet; 8. a screw hole; 9. a water supply and return pipeline; 10. a circular hole; 11. a laser mounting hole;
Detailed Description
The present invention will be further described by way of examples, but not limited thereto, with reference to the accompanying drawings.
Example 1:
as shown in fig. 1-2 and 4-5, a temperature control system of a high-power optical fiber coupling semiconductor laser comprises a cooling system and a TEC temperature controller 1, wherein the cooling system comprises a mounting base 5, a water-cooled metal plate 2, a water supply and return pipeline 9, a TEC refrigeration sheet 3 and a temperature sensor 4, the water-cooled metal plate 2 is arranged below the mounting base 5, a laser mounting hole 11 is arranged on the surface of the water-cooled metal plate, a round hole 10 is arranged on a side arm of the water-cooled metal plate, and the temperature sensor 4 is arranged in the round hole 10; a water supply and return pipeline 9 is arranged in the water-cooled metal plate 2, and a TEC refrigerating sheet 3 is arranged between the mounting base 5 and the water-cooled metal plate 2; the TEC refrigeration piece 3 and the temperature sensor 4 are respectively connected with the TEC temperature controller 1.
The number of the TEC refrigeration pieces 3 is 4, 2 TEC refrigeration pieces 3 are firstly connected in series by taking 2 TEC refrigeration pieces as a group, and then the 2 groups are connected in parallel and then directly connected with the TEC temperature controller 1 through a cable; the temperature sensor 4 is directly connected with the TEC temperature controller 1 through a cable. The temperature sensor 4 and the TEC refrigerating plate 3 are independent. The mounting base 5 and the water-cooling metal plate 2 are both rectangular and are matched in size.
Four angles of installation base 5 are equipped with fixed orifices 12 respectively, 2 four angles of water-cooling metal sheet are equipped with screw hole 8 respectively, installation base 5, TEC refrigeration piece 3 and water-cooling metal sheet 2 pass through fixed orifices 12 and screw hole 8 fastening connection.
The laser installation holes 11 penetrate through the installation base 5, and the number of the laser installation holes is 13. The laser device with the installation base can be compatible with a plurality of laser devices with different models, and the through of the laser device installation hole enables the front surface and the back surface of the installation base 5 to be universal.
The water supply and return pipeline 9 is provided with a water inlet 6 and a water outlet 7, and the water inlet 6 and the water outlet 7 are connected to a water pipe through a water supply and return ball valve. The cooling of the water-cooling metal plate 2 is realized by the flowing of the cooling water in the water supply and return pipeline 9, and the heat dissipation of the TEC refrigeration piece 3 is further completed.
The type of the TEC refrigeration piece 3 is TEC1212, the front side of the TEC refrigeration piece is refrigerated, the back side of the TEC refrigeration piece is heated, the back side of the TEC refrigeration piece is completely attached to the upper surface of the water-cooling metal plate 2, and the front side of the TEC refrigeration piece is completely attached to the lower surface of the mounting base 5.
The TEC temperature controller 1 is of the type TEC2415F, and a PID algorithm module is arranged in the TEC temperature controller. The TEC temperature controller 1 outputs voltage and current to the TEC refrigerating piece 3 to enable the TEC refrigerating piece to work, and meanwhile receives input signals detected by the temperature sensor 4 to form a closed loop, and then the PID algorithm module effectively and accurately controls the temperature curves between the TEC refrigerating piece and the TEC refrigerating piece to be overlapped according to the set temperature curve and the actual temperature curve, so that the actual temperature of the laser is the set temperature, and the spectral temperature drift of the laser caused by overhigh temperature is avoided.
The type of the temperature sensor 4 is NTC10K, and the temperature sensor 4 can detect the actual working temperature of the laser and feed back the actual working temperature to the TEC temperature controller 1.
The use method of the temperature control system of the high-power optical fiber coupling semiconductor laser comprises the following operation steps:
(1) Opening a water supply ball valve, and introducing circulating cooling water;
(2) Fastening the laser on the laser mounting hole of the mounting base by using a torque screwdriver, and completely contacting without clearance fit;
(3) Opening the TEC temperature control instrument, setting the required temperature, starting the TEC temperature control instrument to output voltage and current to the TEC refrigerating plate, and receiving an input signal detected by the temperature sensor;
(4) After the actual temperature reaches the set temperature and is stable, the laser starts to work, and packaging test is carried out;
(5) And after the packaging test is finished, stopping the laser, closing the TEC temperature controller, and disassembling the laser.
Example 2:
as shown in fig. 3, a temperature control system of a high-power fiber-coupled semiconductor laser has a structure as described in embodiment 1, except that the water supply/return pipeline 9 is continuously folded.
Example 3:
as shown in fig. 6, a temperature control system of a high-power fiber-coupled semiconductor laser has the structure as described in embodiment 1, except that the number of the laser mounting holes 11 is 16.
Claims (10)
1. A temperature control system of a high-power optical fiber coupling semiconductor laser comprises a cooling system and a TEC temperature controller, and is characterized in that the cooling system comprises an installation base, a water-cooling metal plate, a water supply and return pipeline, a TEC refrigeration piece and a temperature sensor, wherein the water-cooling metal plate is arranged below the installation base, a laser installation hole is formed in the surface of the water-cooling metal plate, a round hole is formed in the side wall of the water-cooling metal plate, and the temperature sensor is arranged in the round hole; a water supply and return pipeline is arranged in the water-cooled metal plate, and a TEC (thermoelectric cooler) refrigerating sheet is arranged between the mounting base and the water-cooled metal plate; the TEC refrigerating plate and the temperature sensor are respectively connected with a TEC temperature controller.
2. The temperature control system of the high-power optical fiber coupled semiconductor laser as claimed in claim 1, wherein the number of the TEC refrigeration pieces is 3-6, the TEC refrigeration pieces are connected in series and parallel, and then the TEC temperature controller is directly connected through a cable; the temperature sensor is directly connected with the TEC temperature controller through a cable.
3. The system as claimed in claim 1, wherein the mounting base and the water-cooled metal plate are rectangular and have dimensions matching each other.
4. The temperature control system of claim 1, wherein four corners of the mounting base are respectively provided with fixing holes, four corners of the water-cooled metal plate are respectively provided with screw holes, and the mounting base, the TEC refrigeration plate and the water-cooled metal plate are fastened and connected through fastening holes and screw holes.
5. The system as claimed in claim 1, wherein the number of the laser mounting holes is 10-20 through the mounting base.
6. The temperature control system of a high-power optical fiber coupled semiconductor laser as claimed in claim 1, wherein the water supply and return pipeline is provided with a water inlet and a water outlet, and the water inlet and the water outlet are connected to the water pipe through a water supply and return ball valve.
7. The system as claimed in claim 1, wherein the water supply and return pipes are continuously folded.
8. The temperature control system of a high-power fiber coupled semiconductor laser as claimed in claim 1, wherein the type of the TEC refrigeration plate is TEC1212, which refrigerates on the front side and heats on the back side, and the back side is completely attached to the upper surface of the water-cooled metal plate and the front side is completely attached to the lower surface of the mounting base.
9. The temperature control system of the high-power fiber coupled semiconductor laser as claimed in claim 1, wherein the type of the TEC temperature controller is TEC2415F, and a PID algorithm module is arranged inside the TEC temperature controller; the type of the temperature sensor is NTC10K.
10. A method for using a temperature control system of a high power fiber coupled semiconductor laser as claimed in claim 9, wherein the method comprises the following steps:
(1) Opening a water supply ball valve, and introducing circulating cooling water;
(2) Fastening the laser on the laser mounting hole of the mounting base by using a torque screwdriver, and completely contacting without clearance fit;
(3) Opening a TEC temperature controller, setting the required temperature, starting the TEC temperature controller to output voltage and current to a TEC refrigerating plate, and receiving an input signal detected by a temperature sensor;
(4) After the actual temperature reaches the set temperature and is stable, the laser starts to work, and packaging test is carried out;
(5) And after the packaging test is finished, stopping the laser, closing the TEC temperature controller, and disassembling the laser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110398311.8A CN115218532A (en) | 2021-04-14 | 2021-04-14 | Temperature control system of high-power optical fiber coupling semiconductor laser and use method thereof |
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| CN202110398311.8A CN115218532A (en) | 2021-04-14 | 2021-04-14 | Temperature control system of high-power optical fiber coupling semiconductor laser and use method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115425514A (en) * | 2022-11-04 | 2022-12-02 | 武汉亚格光电技术股份有限公司 | Laser system and therapeutic instrument with same substrate for separate transmission and common output |
| CN115765865A (en) * | 2022-11-09 | 2023-03-07 | 绍兴中科通信设备有限公司 | 100G high-speed optical module three-temperature adjusting and testing system with flow test function |
| CN116027836A (en) * | 2023-03-30 | 2023-04-28 | 济南森峰激光科技股份有限公司 | Laser temperature and humidity control system and method |
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| CN108666856A (en) * | 2018-08-07 | 2018-10-16 | 核工业理化工程研究院 | Power stability type solid state laser and control method |
| CN110676680A (en) * | 2019-09-03 | 2020-01-10 | 南京理工大学 | Device for controlling output wavelength of microchip laser pumping source |
| US20200052461A1 (en) * | 2018-08-13 | 2020-02-13 | Bae Systems Information And Electronic Systems Integration Inc. | Light emitting assembly and method thereof |
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2021
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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Application publication date: 20221021 |