CN115209291A

CN115209291A - Earphone set

Info

Publication number: CN115209291A
Application number: CN202110873176.8A
Authority: CN
Inventors: 李辰龙; 姚超
Original assignee: Beijing Honor Device Co Ltd
Current assignee: Beijing Honor Device Co Ltd
Priority date: 2021-04-08
Filing date: 2021-07-30
Publication date: 2022-10-18

Abstract

The application provides an earphone can solve the big problem of the response module area that meets an emergency that realizes the function button in the present earphone to realize the function button of earphone and reduce the whole size of earphone through the mode of multidirectional pressing. The earphone includes a housing and a pressure strain structure disposed within a cavity formed by the housing. The two end parts of the pressure strain structure are stably contacted with the inner wall of the shell. The pressure strain structure is provided with a strain inductor. In the case of pressing the housing, the pressure-strain structure generates strain, and the strain sensor is used to sense the strain generated by the pressure-strain structure.

Description

Earphone set

The present application claims priority of chinese patent application entitled "a dual-wing multi-directional key, capacitor and slide detection method for tubular terminal" filed by the national intellectual property office on 8/4/2021, with application number 202110379581.4, the entire contents of which are incorporated herein by reference.

Technical Field

The application relates to the technical field of electronic equipment, in particular to an earphone.

Background

Generally, in order to facilitate user operation, the earphone is provided with function keys for triggering operations such as power-on, power-off, pause, play, record and the like. Taking a wireless headset as an example, the current scheme adopted in the industry is as follows: a strain sensing module is arranged in a cavity formed by the shell of the earphone handle. The strain sensitive module needs to fit inside the housing of the earphone stem. In order to improve the sensing capability of the strain sensing module, a planar auxiliary positioning area is usually added on the shell of the earphone handle, or the number of strain detection units of the strain sensing module is increased, so that the space area occupied by the shell of the earphone handle is large, and the shape and the space size of the earphone handle are limited.

Disclosure of Invention

The embodiment of the application provides an earphone, can solve the problem that the strain induction module that realizes the function button in the present earphone occupies a large area of space to realize the function button of earphone and reduce the whole size of earphone through the mode of multidirectional pressing.

In order to achieve the purpose, the technical scheme is as follows:

the embodiment of the application provides an earphone. The headset includes a housing. A pressure strain structure is also arranged in a cavity formed by the shell. The two end parts of the pressure strain structure are stably contacted with the inner wall of the shell. The pressure strain structure is provided with a strain inductor. In the case of pressing the housing, the pressure-strain structure generates strain, and the strain sensor is used to sense the strain generated by the pressure-strain structure.

It should be understood that both ends of the pressure-strain structure are in stable contact with the inner wall of the housing, so that the pressure-strain structure may be strained when receiving the pressing force of the housing. Wherein, the strain refers to the relative deformation of the pressure strain structure under the condition of being pressed by the outer shell. For example, when a user presses the contact portions of the housing and the two ends of the pressure-strain structure, the pressure-strain structure may generate a line strain by the bidirectional pressing force of the housing. Specifically, the inner side surface of the compressive strain structure (i.e., the concave surface of the compressive strain structure) is compressively deformed to generate negative strain; the outer side of the compressive strain structure (i.e. the convex side of the compressive strain structure) is in tensile deformation, and thus positive strain is generated. The earphone can be triggered to execute corresponding operations (such as starting up, shutting down, pausing, playing and the like) according to the strain generated by the pressure strain structure.

Therefore, the earphone provided by the embodiment of the application does not need to be provided with the strain sensing module attached to the shell, does not need to be provided with the auxiliary positioning pressing area on the shell, does not need to be provided with the strain detection unit, only needs to stably contact the two end parts of the pressure strain structure with the inner wall of the shell, and enables the pressure strain structure to adapt to the cavity space formed by the shell, so that the pressure strain structure can fully utilize the cavity space formed by the shell, and further, the space area occupied by the earphone shell is reduced, and the whole size of the earphone is reduced.

In one possible implementation, the strain sensor is disposed on a first side of the compressive strain structure (i.e., an outer side of the compressive strain structure) and/or a second side of the compressive strain structure (i.e., an inner side of the compressive strain structure). Illustratively, still taking the contact position of the user pressing the shell and two ends of the pressure strain structure as an example, the strain sensor is arranged on the outer side surface of the pressure strain structure and is used for sensing the positive strain generated on the outer side surface of the pressure strain structure; and the strain sensor is arranged on the inner side surface of the compressive strain structure and is used for sensing negative strain generated on the inner side surface of the compressive strain structure.

In one possible implementation, the compressive strain structure includes a bottom plate and side plates connected to both sides of the bottom plate. An included angle is formed between the side plate and the bottom plate. The end part of the side plate far away from the bottom plate is stably contacted with the inner wall of the shell. The side plates and the bottom plate can be integrally formed and can also be connected in a welding mode and the like. When the stable contact area of extrusion shell and compressive strain structure, compressive strain structure wholly receives the compression, and the curb plate of compressive strain structure both sides receives the extrusion of shell and is close to each other to the medial surface that drives the bottom plate produces compression deformation and produces the negative strain, and the lateral surface that drives the bottom plate produces tensile deformation and produces positive strain.

In one possible implementation, the strain sensors are arranged on the first side of the base plate (i.e. the outer side of the base plate) and/or on the second side of the base plate (i.e. the inner side of the base plate). It will be appreciated that the strain induced by the compressive strain structure is mainly reflected on the base plate of the compressive strain structure, and therefore the strain sensor is disposed on the base plate to improve the accuracy of strain sensing.

In one possible implementation, the strain sensor is configured to sense a first strain generated by the compressive strain structure when the contact portion between the housing and the two ends of the compressive strain structure is pressed.

In a possible implementation manner, a processor is arranged in a cavity formed by the shell, and the strain sensor is electrically connected with the processor through a measuring circuit. The measurement circuit is configured to output a first signal to the processor based on the first strain. The first signal is used for instructing the earphone to execute a first operation. The first operation comprises one of starting, shutting down, pausing, playing and recording. Therefore, a user can realize a function, such as one of starting, shutting down, pausing, playing and recording, by extruding the contact parts of the shell and the two ends of the pressure strain structure.

In one possible implementation, the strain sensor is configured to sense a second strain generated by the compressive strain structure when the non-contact portion of the housing and the compressive strain structure is pressed.

In a possible implementation manner, a processor is arranged in a cavity formed by the shell, and the strain sensor is electrically connected with the processor through a measuring circuit. The measuring circuit is used for outputting a second signal to the processor according to the second strain. The second signal is used for instructing the earphone to execute a second operation. The second operation comprises one of starting, shutting down, pausing, playing and recording. Therefore, the user can realize another function, such as one of starting, shutting down, pausing, playing and recording, by extruding the shell and the non-contact parts at the two ends of the pressure strain structure.

It should be noted that the compressive strain structure produces different strains when different portions of the housing are pressed. Illustratively, when a user squeezes the contact portions of the housing and the two ends of the compressive strained structure, the inner side of the compressive strained structure generates a negative strain and the outer side of the compressive strained structure generates a positive strain (i.e., a first strain). However, when the user presses the non-contact portion between the housing and the two ends of the pressure strain structure, the inner side of the pressure strain structure generates a positive strain, and the outer side of the pressure strain structure generates a negative strain (i.e., a second strain).

Therefore, the pressure strain structure generates strain by extruding the shell, the contact part of the shell and the pressure strain structure is not required to be aligned, the non-contact part of the extrusion shell and the pressure strain structure can also generate strain by extruding the pressure strain structure, and the mode of realizing the function keys of the earphone is more flexible.

In one possible implementation, the cavity formed by the housing may further include a printed circuit board. The processor is disposed on the printed circuit board. The strain inductor is electrically connected with the printed circuit board through the flexible board so as to electrically connect the strain inductor with the processor.

In one possible implementation, the housing includes a headset head housing and a headset stem housing. The pressure strain structure is arranged in a cavity formed by the earphone handle shell, and two end parts of the pressure strain structure are stably contacted with the inner wall of the earphone handle shell. Therefore, the operation of the user can be facilitated.

In one possible implementation, the outer surface of the earphone handle housing is provided with a planar positioning area near the contact position of the earphone handle housing and the pressure strain structure. Thus, the user can quickly find the extrusion position of the function key.

In one possible implementation, the housing includes a headset housing. The pressure strain structure is arranged in a cavity formed by the earphone head shell, and the two end parts of the pressure strain structure are stably contacted with the inner wall of the earphone head shell. Therefore, the volume is smaller, and the carrying is more convenient for users.

In a possible implementation mode, a capacitance auxiliary detection scheme can be added in the pressure strain structure, and the extrusion force and direction can be judged in an auxiliary mode through capacitance changes of different area positions in the pressure strain structure in the extrusion process.

Specifically, the first side of the compressive strained structure (e.g., the outer side of the compressive strained structure) includes a first region (e.g., the C region) and a second region (e.g., the D region). The first area and the second area are respectively close to the contact parts of the two ends of the compressive strain structure and the shell. The first area is attached with a first capacitance detection contact piece (such as a copper sheet network), and the first capacitance detection contact piece can be electrically connected with the processor through a soft board. And/or the second area is attached with a second capacitance detection contact piece (such as a copper sheet network), and the second capacitance detection contact piece can be electrically connected with the processor through the soft board.

When the housing is pressed, the first capacitance detection contact piece is used for detecting capacitance generated in the first area, and the second capacitance detection contact piece is used for detecting capacitance generated in the second area. Illustratively, when a user squeezes the contact area of the housing and the pressure strain structure, the capacitance of the C region and the D region of the pressure strain structure changes significantly due to the proximity and touch of a finger to the housing. When the user squeezes the housing with the non-contact areas of the pressure-strained structure, the capacitance change in the C-region and D-region is insignificant, since the finger may be further away from the C-region and D-region. Therefore, the extrusion force and direction can be judged in an auxiliary manner through the capacitance change of the C region and the D region of the pressure strain structure.

In one possible implementation, the first face (e.g., the outer face) of the compressive strained structure further includes a third region. The third region (e.g., B region) is located between the first region and the second region. The third area is attached with a third capacitance detection contact (such as a copper foil network). The third capacitive sensing contact pad may be electrically connected to the processor through the flexible board. The third capacitance detecting contact piece is used for detecting the capacitance generated in the third area when the housing is pressed. Illustratively, when a user presses the contact area of the housing and the pressure strain structure, the capacitance of the C region and the D region of the pressure strain structure is obviously changed due to the approach and touch of a finger on the housing, and the capacitance of the B region is slightly changed. When the user squeezes the housing with the non-contact area of the pressure-strain structure, the capacitance change of the C and D regions is smaller and the capacitance change of the B region is larger because the finger may be farther from the C and D regions. Therefore, the extrusion force and direction can be judged in an auxiliary manner through the change of the capacitance of the pressure strain structure C area and the capacitance of the pressure strain structure D area, and the accuracy of auxiliary judgment is improved.

In one possible implementation, on the second face (e.g., the inner face) of the compressive strained structure, at a position opposite to the third region, is a fourth region (e.g., region a); a fourth capacitance detection contact piece (such as a copper sheet network) is attached to the fourth area; the fourth capacitance detection contact piece can be electrically connected with the processor through the soft board; the fourth capacitance detecting contact piece is for detecting a capacitance generated in the fourth area when the housing is pressed. Illustratively, when the user presses the contact area of the housing and the pressure-strain structure, the variation amount of the area a is also small due to the finger approaching and touching the housing; the amount of change in area a may also be greater when a user squeezes the housing with the non-contact areas of the pressure-strained structure. In this case, the region C and the region D can be combined to assist in judging the extrusion strength and direction, and accuracy of the auxiliary judgment is improved.

Therefore, the extrusion direction (namely the direction of stress generation) can be judged in an auxiliary manner through capacitance detection, so that the earphone shell can be configured into different key functions in a manner of extruding in different directions according to the stress direction difference and capacitance change difference caused by different extrusion directions, the key functions can be expanded, and the user experience can be improved.

In one possible implementation, the above-described compressive strain structure may also be used for slip detection. Specifically, the first capacitance detection contact piece is also used to detect the capacitance generated in the first region (e.g., C region) when sliding along the outer wall of the housing. The second capacitance sensing contact is also used to sense the capacitance generated in the second region (e.g., D region). The third capacitance sensing contact is also used to sense the capacitance generated in the third region (e.g., region B). Illustratively, when the finger of the user slides in the direction sequentially passing through the C region, the B region and the D region, the finger first approaches the C region, then approaches the B region, and finally approaches the D region. Therefore, the time for changing the capacitance is different in the C region, the B region and the D region. Therefore, according to the capacitance change characteristics of the B area, the C area and the D area, and in combination with the sensing of the corresponding increase and decrease of the strain sensor in the pressure strain structure, the earphone can be arranged on the surface of the shell of the earphone to realize certain functions (such as volume adjustment) of the earphone when the shell slides.

Drawings

Fig. 1A is a schematic structural diagram of a wireless headset in the prior art;

fig. 1B is a schematic structural diagram of a strain sensing module in an earphone in the prior art;

fig. 2 is a schematic diagram of an architecture of a wireless headset according to an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of an earphone body according to an embodiment of the present application;

FIG. 4 is a first schematic view illustrating a configuration of a strain sensor according to an embodiment of the present disclosure;

fig. 5 is a second schematic structural diagram illustrating a setting position of a strain sensor according to an embodiment of the present disclosure;

fig. 6 is a schematic structural diagram of an extrusion scene according to an embodiment of the present disclosure;

FIG. 7 is a schematic structural diagram of a compressive strain structure according to an embodiment of the present disclosure;

fig. 8A is a schematic structural diagram of another earphone body according to an embodiment of the present application;

fig. 8B is a schematic structural diagram of another earphone body according to an embodiment of the present application;

FIG. 9 is a schematic view of a compressive strain structure disposed within an earphone stem according to an embodiment of the present application;

FIG. 10 is a schematic diagram of a structure for providing a capacitive sensing area on a compressive strain structure according to an embodiment of the present disclosure;

fig. 11 is a schematic structural diagram of an extrusion scene according to an embodiment of the present disclosure;

fig. 12 is a schematic structural diagram of another squeezing scenario provided in the embodiment of the present application;

fig. 13 is a schematic structural diagram of a sliding scene according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments.

In the following, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.

In the description of the present application, the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "vertical", "lateral", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and for simplicity in description, and do not indicate or imply that the referred device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application.

In this application, unless expressly stated or limited otherwise, the term "coupled" is to be construed broadly, e.g., "coupled" may be a fixed connection or a releasable connection or may be integral; may be directly connected or indirectly connected through an intermediate. Furthermore, the terms "coupled" or "coupling" may be a manner of making electrical connections that communicate signals. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

The earphone can be used in cooperation with electronic equipment such as a mobile phone, a notebook computer and a watch, and is used for processing audio services such as media and conversation of the electronic equipment and other data services. For example, the audio service may include media services such as playing music, recording, sound in a video file, background music in a game, incoming call prompt tone, etc. for the user; the method can also comprise playing voice data of an opposite terminal for a user or collecting voice data of the user and sending the voice data to the opposite terminal under call service scenes such as telephone, weChat voice message, audio call, video call, game, voice assistant and the like.

Generally, the headset is provided with function keys for the convenience of user operation. For example, for a wired headset, the function keys on the headset connection line can be used to pause or continue playing music, and can also be used to answer and hang up a phone call. For a wireless headset (such as a bluetooth headset), the function keys on the wireless headset can be used for pausing or continuing playing when music is played, answering and hanging up a phone call, and can also be used for controlling the wireless headset to be powered on or powered off.

The wireless headset may be a True Wireless Stereo (TWS) headset. TWS headsets are typically implemented based on a bluetooth chip. When the TWS earphone is used, the electronic equipment is connected with the main earphone, and then the main earphone is quickly connected with the auxiliary earphone in a wireless mode, so that real Bluetooth left and right sound channels are wirelessly separated for use.

Fig. 1 is a schematic diagram of a TWS headset 100 in the prior art. Referring to fig. 1A (a) and 1A (b), the TWS headset 100 includes a headset head 101 (which may also be referred to as an earbud), and a headset stem 102 connected to the headset head 101. The cavity formed by the shell of the earphone head 101 is internally provided with an audio module which can be used for managing audio data and realizing the input and output of audio signals of the earphone, so that a user can make and receive calls, play music and the like through the wireless earphone. A strain sensing module 104 is disposed within the cavity formed by the housing of the earphone handle 102. The strain sensing module 104 generally employs a resistance bridge pressing detection method that generates strain by direct contact and pressing, so the strain sensing module 104 needs to be disposed in close contact with the housing of the earphone handle 102. In order to make the strain sensing module 104 fit to the housing such that the strain sensing module 104 can sense the strain accurately when the user presses the housing of the earphone handle 102, the following two processes are usually performed:

first, as shown in fig. 1A (a) and fig. 1A (b), a flat pressing area 103 is provided outside the housing of the earphone handle 102 for assisting positioning of a user when pressing the strain sensing module 104. In this case, the housing of the earphone handle 102 needs to design a plane area so that the shape of the earphone handle 102 is limited.

Second, if a flat pressing area is not added outside the housing of the earphone handle 102 as an auxiliary positioning, the strain sensing module 103 needs to have an additional strain sensing area. As shown in fig. 1B, the strain sensing module 104 includes a connector 1041 coupled to the processor, and at least two sets of strain detecting units 1042 (two sets are shown, three sets may be provided, or even more) to increase the strain sensing area. In this case, if the number of the strain detection units in the strain sensing module 104 is increased, the length of the strain sensing module 104 is increased, which not only increases the manufacturing cost of the strain sensing module 104, but also increases the internal space of the strain sensing module 104 in the cavity formed by the housing of the earphone handle 102, so that the housing of the earphone handle is longer, and the occupied space of the housing of the earphone is large.

Therefore, in the prior art, the function key implementation manner of the earphone may cause that the housing of the earphone has a planar auxiliary positioning area, or the space area occupied by the housing of the earphone is large, so that the shape and the size of the housing of the earphone are limited. In addition, in the prior art, the function keys of the earphone are realized by adopting a resistance bridge pressing detection mode of generating strain by direct contact and pinching, so that the strain sensing module 104 senses the pressing action, and the pressing force is mainly transmitted by the joint part of the shell of the earphone handle 102 and the strain sensing module 104, so that the strain sensing module 104 can only sense a single pressing action, and the function of a case which can be realized is too single.

In addition, because the housing of the earphone in the prior art occupies a large space area, the earphone may not be convenient for the user to carry or wear. In addition, the function keys of the earphone in the prior art can only be sensed by sensing a single pressing action, and the user can sense the single pressing action only by pressing a specific position of the earphone, so that the user is inconvenient to operate and has poor user experience.

In order to solve the above problem, an embodiment of the present application provides an earphone. The earphone can realize the corresponding function of the function key in a multi-direction pressing mode, and can reduce the space occupied by the earphone handle shell, thereby reducing the whole size of the earphone. The following describes the earphone provided by the embodiment of the present application in detail by taking a wireless earphone as an example. The multi-directional pressing means that the user can press the housing of the earphone in two opposite directions, for example, the user uses two fingers to pinch the housing of the earphone. A multi-directional press may also refer to a user pressing different positions of the earphone housing in different directions, e.g. the user pressing any position of the earphone housing with two fingers.

For example, fig. 2 shows an architecture diagram of a wireless headset 200 according to an embodiment of the present application. The wireless headset 200 may include at least one processor 201, at least one memory 202, a wireless communication module 203, an audio module 204, a power module 205, and an input/output interface 206, among others. The processor 201 may include one or more interfaces for connecting with other components of the wireless headset 200.

The memory 202 may be used to store program codes, such as program codes for charging the wireless headset 200, wirelessly pairing the wireless headset 200 with other electronic devices, or wirelessly communicating the wireless headset 200 with the electronic devices; or, the method can also be used for recording the gesture of the user and the habit (such as pressing strength of the earphone function key) of the user to realize the operations of starting, shutting down, pausing, playing, recording, starting charging, stopping charging and the like triggered by the key.

The processor 201 may be configured to execute the application program codes and call the relevant modules to implement the functions of the wireless headset 200 in the embodiment of the present application. For example, a charging function, a wireless communication function, an audio data playing function, and the like of the wireless headset 200 are realized. The processor 201 may include one or more processing units, and the different processing units may be separate devices or may be integrated in one or more of the processors 201. The processor 201 may be specifically an integrated control chip, or may be composed of a circuit including various active and/or passive components, and the circuit is configured to perform the functions described in the embodiments of the present application, which belong to the processor 201.

The wireless communication module 203 may be configured to support data exchange between the wireless headset 200 and other electronic devices or headset boxes, including Bluetooth (BT), global Navigation Satellite System (GNSS), wireless Local Area Network (WLAN) (such as wireless fidelity (Wi-Fi) network), frequency Modulation (FM), near Field Communication (NFC), infrared (infrared, IR) and other wireless communications. In some embodiments, the wireless communication module 203 may be a bluetooth chip. The wireless headset 200 can be paired with bluetooth chips of other electronic devices through the bluetooth chip and establish a wireless connection, so as to implement wireless communication between the wireless headset 200 and other electronic devices through the wireless connection.

In addition, the wireless communication module 203 may further include an antenna, and the wireless communication module 203 receives electromagnetic waves via the antenna, frequency modulates and filters electromagnetic wave signals, and transmits the processed signals to the processor 201. The wireless communication module 203 may also receive a signal to be transmitted from the processor 201, perform frequency modulation and amplification on the signal, and convert the signal into electromagnetic waves through the antenna to radiate the electromagnetic waves.

The audio module 204 may be used to process audio data to enable the wireless headset 200 to input and output audio signals. For example, the audio module 204 may obtain an audio signal from the wireless communication module 203 or transfer the audio signal to the wireless communication module 203, so as to achieve functions of making and receiving calls through a wireless headset, playing music, activating/deactivating a voice assistant of an electronic device connected to the headset, receiving/transmitting voice data of a user, and the like. The audio module 204 may include a speaker (or called an earpiece or a receiver) for outputting an audio signal, a microphone (or called a mike or a microphone), a microphone receiving circuit matched with the microphone, and the like. The speaker may be used to convert the electrical audio signal into an acoustic signal and play it. The microphone may be used to convert sound signals into electrical audio signals. It should be understood that the audio module 204 may be separately disposed outside the processor 201, or may be integrated inside the processor 201.

A power module 205, which can supply power to each module of the wireless headset 200; the supporting wireless headset 200 receives a charging input, etc. The power module 205 may include a Power Management Unit (PMU) and a battery. The power management unit may include a charging circuit, a voltage drop adjusting circuit, a protection circuit, an electric quantity measuring circuit, and the like. The charging circuit may receive an external charging input. The voltage drop adjusting circuit can transform the electric signal input by the charging circuit and output the transformed electric signal to the battery to complete charging of the battery, and can transform the electric signal input by the battery and output the transformed electric signal to other modules such as the audio module 204 and the wireless communication module 203. The protection circuit can be used to prevent battery overcharge, overdischarge, short circuit, overcurrent, or the like. In some embodiments, the power module 205 may also include a wireless charging coil for wirelessly charging the wireless headset 200. In addition, the power management unit can also be used for monitoring parameters such as battery capacity, battery cycle number, battery health state (electric leakage and impedance) and the like.

A plurality of input/output interfaces 206 may be used to provide a wired connection for charging or communication between the wireless headset 200 and the headset case. In some embodiments, the input/output interface 206 may include a headphone electrical connector for conducting and transmitting electrical current. When the wireless headset 200 is placed in the headset case, the wireless headset 200 may establish an electrical connection with an electrical connector in the headset case through the headset electrical connector (e.g., the headset electrical connector is in direct contact with the electrical connector in the headset case). After the electrical connection is established, the earphone box can charge the battery in the wireless earphone 200 through the current transfer function of the earphone electrical connector and the electrical connector in the earphone box. For example, the earphone electrical connector may be a pogo pin, a spring plate, a conductive block, a conductive patch, a conductive sheet, a pin, a plug, a contact pad, a jack, a socket, or the like, and the embodiment of the present application is not limited to a specific type of the electrical connector.

Specifically, the wireless headset 200 may include a pair of headset bodies for use with the left and right ears of the user, and each headset body may include two headset electrical connectors. When the earphone body is placed in the earphone box, the earphone body can be electrically connected with the two electric connectors correspondingly arranged in the earphone box through the two earphone electric connectors. After establishing the electrical connection, the headset case may charge the battery in the headset body.

In other embodiments, after the electrical connection is established, the wireless headset 200 may also be in data communication with a headset box, for example, may receive pairing instructions from the headset box.

In addition, the wireless headset 200 may also include a sensor 207. For example, the sensor 207 may be a distance sensor or a proximity light sensor that may be used to determine whether the wireless headset 200 is worn by a user. For example, the wireless headset 200 may determine whether the wireless headset 200 is worn by the user by detecting whether there is an object near the wireless headset 200 using a distance sensor. Upon determining that the wireless headset 200 is worn, the wireless headset 200 may turn on the speaker. In some embodiments, the wireless headset 200 may also include a bone conduction sensor, incorporated into a bone conduction headset. By using the bone conduction sensor, the wireless headset 200 can acquire the vibration signal of the bone mass vibrated by the sound part, analyze the voice signal and realize the voice function.

For another example, the outer surface of the wireless headset 200 may further include: a touch sensor for detecting a touch operation by a user; the fingerprint sensor is used for detecting the fingerprint of the user, identifying the identity of the user and the like; and other sensors, such as capacitive sensors, for detecting changes in capacitance and adaptively adjusting parameters (e.g., volume level).

It is to be understood that the illustrated structure of the embodiment of the present application does not constitute a specific limitation to the wireless headset 200. It may have more or fewer components than shown in fig. 2, may combine two or more components, or may have a different configuration of components. For example, the wireless headset 200 may further include a key 208, an indicator light (which may indicate the status of power, incoming/outgoing call, pairing mode, etc.), a display screen (which may prompt the user for relevant information), a dust screen (which may be used with an earphone), and other components on the outer surface. The key 208 may be a physical key or a touch key (used in cooperation with a touch sensor), and is used to trigger operations such as power on, power off, pause, play, record, start charging, and stop charging.

The various components shown in fig. 2 may be implemented in hardware, software, or a combination of hardware and software, including one or more signal processing or application specific integrated circuits.

In order to realize multidirectional pressing of function keys of the earphone, the earphone provided by the embodiment of the application comprises an earphone body. Exemplarily, as shown in fig. 3, a schematic structural diagram of an earphone body 300 provided in an embodiment of the present application is shown. The earphone body 300 includes a housing 301 and internal components. The internal components are disposed within a cavity formed by the housing 301. The internal components may include the above-mentioned components in modules such as the processor 201, the wireless communication module 203, the audio module 204, and the power module 205 in the wireless headset shown in fig. 2.

A pressure strain structure 302 is further disposed in the cavity formed by the housing 301, and two end portions (a first end 3021 and a second end 3022 shown in fig. 3 (a)) of the pressure strain structure 302 are in stable contact with the inner wall of the housing 301, for example, the pressure strain structure may be in a spring contact manner or a welding contact manner, and the embodiment of the present invention is not particularly limited. When the user presses the housing in both directions (i.e., the user pinches the housing with two fingers), the pressure-strain structure 302 is strained by the pressing force of the housing 301. Wherein the strain refers to the relative deformation of the compressive strain structure 302 under the pressing force of the housing 301. Taking the earphone body 300 shown in fig. 3 as an example, when a user presses the contact portions between the housing 301 and the two ends of the pressure-strain structure 302 (i.e., presses the two sides in the direction of the arrow in (b) shown in fig. 3), the pressure-strain structure 302 is pressed by the two sides of the housing 301 to generate a line strain, and the inner side surface 3023 of the pressure-strain structure 302 is compressed to generate a negative strain; the outer side 3024 of the compressive strain structure 302 is given a tensile set resulting in a positive strain.

In order to sense the strain generated by the compressive strain structure 302, as shown in fig. 4, a strain sensor 303 is disposed on the compressive strain structure 302. The strain sensor 303 may be electrically connected to a processor of the earphone, and is configured to send the strain generated by the pressure-strain structure 302 to the processor, so that the processor triggers the earphone to perform operations such as starting, shutting down, pausing, playing, recording, and the like according to the strain generated by the pressure-strain structure 302. When the user squeezes the housing 301, the strain sensor 303 is used for sensing the strain generated by the pressure strain structure 302, so that the processor performs a corresponding function operation (such as pause or play) according to the strain sensed by the strain sensor 303.

The strain sensor 303 may be a resistive strain gauge that converts a change in strain on the mechanical member into a change in resistance. The resistive strain gage comprises a sensitive gate resistive element and a lead. The sensitive grid resistance element can be made by bending a high resistivity filament with a diameter of 0.01 mm to 0.05 mm into a grid shape as a sensitive part of a resistive strain gauge sensing mechanical member. The lead may be made of a metal wire such as a copper wire and is electrically connected to the sensitive gate resistance element for connecting the sensitive gate resistance element to the measurement circuit.

During installation, the resistance strain gauge is attached to the surface of the pressure strain structure 302 by an adhesive. In the case where the compressive strain structure 302 is subjected to a pressing force of the housing 301, the compressive strain structure 302 is strained. In the case that the compressive strain structure 302 is strained, the sensitive gate resistance element in the resistive strain gauge is also strained, so that the resistance value of the sensitive gate resistance element is changed. By measuring the change in resistance of the resistive strain gage via the measurement circuit, it can be known whether the compressive strain structure 302 is compressed.

It should be understood that the strain sensor 303 is attached to the surface of the pressure strain structure 302, and the strain sensor 303 may be coupled to the processor through a Flexible Printed Circuit (FPC). A measurement circuit for measuring a change in resistance value of the strain sensor 303 may be provided on the FPC.

In this way, in the earphone of the embodiment of the present application, it is not necessary to attach the strain sensing module (i.e. the pressure strain structure 302 and the strain sensor 303 shown in fig. 3) to the housing, it is not necessary to provide an auxiliary positioning pressing area on the housing 301 of the earphone body 300, it is not necessary to add multiple sets of strain detection units, and it is only necessary to stably contact the two end portions of the pressure strain structure 302 with the inner wall of the housing 301. In this way, the pressure strain structure 302 can be strained when the housing is bi-directionally pressed, and the strain generated by the pressure strain structure 302 can be sensed by the strain sensor 303, so as to realize the corresponding function (such as pause or play) of the function key of the earphone. In the cavity that shell 301 of earphone body 300 in this application embodiment formed, set up pressure strain structure 302, can adapt to the cavity space setting that shell 301 formed with pressure strain structure 302 to the cavity space that shell 301 formed can make full use of, and then reduce the space area that the earphone shell occupy, with the whole size that reduces the earphone.

It should be appreciated that the strain sensors 303 described above may be disposed on the inner side 3023 of the compressive strain structure 302 as shown in FIG. 4. The strain sensor 303 may be provided on the outer side surface 3024 of the compressive strain structure 302, as shown in fig. 5 (a). The strain sensor 303 may be provided on both the inner side surface 3023 and the outer side surface 3024 of the compressive strain structure 302 as shown in fig. 5 (b) (three circles in the figure indicate the strain sensors 303 provided on the inner side surface 3023).

When the strain sensor 303 is disposed on both the inner side surface 3023 and the outer side surface 3024 of the compressive strain structure 302, the strain sensor 303 detects the strain generated by the compressive strain structure 302 in a differential detection manner. That is, the strain received by the processor to the compressive strain structure 302 is: the differential value between the strain values sensed by the strain sensors 303 on the inner side 3023 and the strain values sensed by the strain sensors 303 on the outer side 3024 of the compressive strain structure 302. Thus, the accuracy of detection can be improved.

Illustratively, when the contact portion of the housing 301 and the compressive strain structure 302 is pressed in the direction shown in (b) in fig. 3, the compressive strain structure 302 is strained by the pressing force of the housing 301. At this time, the strain sensor 303 attached to the inner side 3023 of the compressive strain structure 302 can be used to sense the negative strain generated on the inner side 3024 of the compressive strain structure 302. The strain sensors 303 attached to the outer side 3024 of the compressive strain structure 302 may be used to sense positive strain generated by the outer side 3024 of the compressive strain structure 302. In this case, the measuring circuit may output an indication signal (i.e. a first signal) to the processor according to the negative strain sensed by the strain sensor 303 attached to the inner side surface 3023 of the pressure strain structure 302 or the positive strain sensed by the strain sensor 303 attached to the outer side surface 3024 of the pressure strain structure 302, so as to instruct the earphone to perform operations such as power on, power off, pause, play, and record. It should be understood that the indicator signal is typically a voltage signal.

It should be noted that, in the earphone body 300 shown in fig. 3, when the user presses the non-contact portion between the housing 301 and the pressure-strain structure 302 (e.g., presses in two directions in the direction of the arrow shown in fig. 6), the pressure-strain structure 302 is pressed by the housing 301 to generate a line strain. At this time, the inner side surface 3023 of the compressive strain structure 302 is subjected to tensile deformation to generate positive strain; the outer side 3024 of the compressive strain structure 302 is compressively deformed to produce a negative strain.

In this case, the strain sensor 303 attached to the inner surface 3023 of the compressive strain structure 302 may be used to sense a positive strain generated on the inner surface 3024 of the compressive strain structure 302. The strain sensors 303 attached to the outer side 3024 of the compressive strain structure 302 may be used to sense negative strain generated by the outer side 3024 of the compressive strain structure 302. In this case, the measuring circuit may output an indication signal (i.e., a second signal) to the processor according to the positive strain sensed by the strain sensor 303 attached to the inner side surface 3023 of the pressure strain structure 302 or the negative strain sensed by the strain sensor 303 attached to the outer side surface 3024 of the pressure strain structure 302, so as to instruct the earphone to perform operations such as power on, power off, pause, play, and record. It should be understood that the indicator signal is typically a voltage signal.

Therefore, the pressing of the shell 301 to cause the pressure-strain structure 302 to generate strain can be achieved without aligning with the contact portion between the shell 301 and the pressure-strain structure 302, and the non-contact portion between the pressing of the shell 301 and the pressure-strain structure 302 can also cause the pressure-strain structure 302 to generate strain, that is, a user can pinch any position of the headset with two fingers (i.e., multi-directional pressing), so that the manner of implementing the function key of the headset is more flexible, for example, one of the function keys of the headset, such as pausing or playing music, can be implemented by pressing the contact portion between the shell 301 and the pressure-strain structure 302, and the other function key of the headset, such as power on or power off, can be implemented by pressing the non-contact portion between the shell 301 and the pressure-strain structure 302.

It should be understood that the indication signal (such as the first signal or the second signal) outputted by the strain sensor 303 to the processor through the measuring circuit is related to the force of the user pressing the housing, and the first signal or the second signal may indicate that the operation performed by the earphone may be different, and the earphone may be set according to the use habit of the user. Therefore, the embodiment of the application does not specially limit the function corresponding to the extrusion position of the shell by the user.

Fig. 7 is a schematic structural diagram of a pressure strain structure 302 in an earphone according to an embodiment of the present disclosure. Referring to fig. 7, the compressive strain structure 302 includes a bottom plate 701 and side plates 702 connected to two sides of the bottom plate 701. The side plates 702 and the bottom plate 701 form an included angle therebetween and form a groove structure. The side plate 702 and the bottom plate 701 may be integrally formed, or may be connected by welding or the like. When the pressure strain structure 302 is arranged in the cavity formed by the housing 301 of the earphone as shown in fig. 3, the end 7021 of the side plate 702 far from the bottom plate 701 is stably contacted with the inner wall of the cavity formed by the housing 301 of the earphone.

As a result, when the contact region between the housing 301 and the pressure-strain structure 302 is pressed (i.e., the direction of the arrow shown in fig. 3 (b)), the pressure-strain structure 302 is compressed as a whole, the side plates 702 on both sides of the pressure-strain structure 302 are pressed by the housing 301 to approach each other, so as to drive the inner side 7011 of the bottom plate 701 to generate compression deformation and generate negative strain, and drive the outer side 7012 of the bottom plate 701 to generate tensile deformation and generate positive strain.

When the non-contact area between the housing 301 and the pressure strain structure 302 is pressed (i.e. the direction of the arrow shown in fig. 6), the pressure strain structure 302 is also stretched as a whole, and the side plates 702 on both sides of the pressure strain structure 302 are pressed by the housing 301 to move away from each other, so as to drive the inner side 7011 of the bottom plate 701 to generate tensile deformation and generate positive strain, and drive the outer side 7012 of the bottom plate 701 to generate compressive deformation and generate negative strain.

It can be seen that the direction of the strain generated by the compressive strain structure 302 is related to the location where the user squeezes the housing 301. The user can press the contact part or non-contact part of the shell 301 and the pressure strain structure 302 of the earphone body to generate different strain directions, so that the earphone body 300 can set different functions of the function keys according to different pressing directions.

The compressive strain structure 302 is not limited to the groove-like structure shown in fig. 7, and may have any other shape having two ends, such as an irregular groove structure, a curved groove structure, and the like. The material of the compressive strain structure 302 may be SUS301 stainless steel, or may be another high-strength elastic material, and the embodiment of the present invention is not particularly limited.

It should also be understood that in the compressive strain structure 302 shown in fig. 7, since the strain generated by the compressive strain structure 302 is mainly reflected on the base plate 701, the strain sensor 303 is disposed on the base plate 701, and the accuracy of strain sensing can be improved. For example, the strain sensor 303 may be disposed on the inner side 7011 of the bottom plate 701, may be disposed on the outer side 7012 of the bottom plate 701, or may be disposed on both the inner side 7011 and the outer side 7012 of the bottom plate 701, which is not limited in this embodiment.

Fig. 8A shows a schematic structural diagram of the earphone body 800. The earphone body 800 may include an earphone handle 801, and an earphone head 802 connected to a top end of the earphone handle 801. The interior of the cavity formed by the earphone stem 801 and the earphone head 802 may include internal components such as a circuit board 804. The circuit board 804 may be a Printed Circuit Board (PCB). The circuit board 804 may include various components such as a processor, a memory, a charging circuit, etc. to implement the functions of the wireless communication module 203, the audio module 204, and the power module 205 shown in fig. 2. For example, the power module 205 may be disposed inside a formed cavity of the earphone handle 801. The speaker assembly in the audio module 204 may be disposed inside the cavity formed by the earpiece 802. When the user wears the headset, the user can hear the sound signal emitted from the speaker assembly inside the cavity formed by the headset head 802, thereby realizing the functions of playing music, making/receiving calls and the like for the user.

In the earpiece body 800 shown in fig. 8A, the pressure strain structure 803 is arranged inside the cavity formed by the earpiece stem 801, the earpiece stem 801 typically being intended to be held by a user in order to wear the earpiece body 800 into the ear canal of the user. For making the user more comfortable after wearing, experience feels better, earphone handle 801 generally designs for smooth cylindrical body of rod structure. Considering the convenience of a user pressing the housing of the earphone stem 801 of the earphone to operate the function keys of the earphone, the pressure strain structure 803 (i.e., the pressure strain structure 302 shown in fig. 7) may be generally disposed at the rear of the cavity formed by the earphone stem 801. Typically, the power module 205 of the headset shown in fig. 2 is disposed in the cavity formed by the handle 801 at a position near the rear of the handle 801. Therefore, the power module 205 can be coupled with the earphone electrical connector arranged at the tail of the earphone handle 205 and used for charging the earphone, so that when the wireless earphone is placed in the earphone box, the wireless earphone can be electrically connected with the electrical connector in the earphone box through the earphone electrical connector, and charging of the wireless earphone is realized. Thus, the pressure strain structure 803 may be disposed within the cavity formed by the earpiece 801 and proximate to the power module 205.

It should be understood that the shape of the earphone handle 801 is not limited to a cylindrical shape, and may be other shapes, such as a bar shape, a hexagonal prism shape, and the like, and the shape of the earphone handle 801 is not particularly limited in the embodiments of the present application.

When the compressive strain structure 803 is disposed in the cavity formed by the earphone handle 801, the strain sensor disposed on the compressive strain structure 803 may be coupled to the circuit board 804 through a flexible board, i.e., an FPC, so that the strain sensor may be coupled to the processor.

It should also be appreciated that embodiments of the present application may provide a headset 800 without a headset stem 801, such as the headset shown in fig. 8B (processor and the like are not shown). That is to say, the pressure strain structure 803 and the modules such as the processor of the earphone are all disposed in the earphone head 802 of the earphone, and the function key of the earphone can also be implemented by the above-mentioned multi-directional pressing manner for the pressure strain structure in the earphone, and the specific manner can refer to the description of the above embodiments, and is not described here again.

In order to reduce the structural displacement in long-term use, the compressive strain structure 803 is provided with a positioning hole 8031, and the compressive strain structure 803 can be fixed on the circuit board 804 through the positioning hole 8031 on the compressive strain structure 803. The compressive strain structures 803 may be secured to the circuit board 804 by, for example, soldering, heat staking, or screw attachment.

In order to facilitate the user to squeeze the housing of the earphone, as shown in fig. 9 (a), the housing of the earphone handle 801 has a smooth cylindrical rod structure, and the inside of the housing of the earphone handle 801 also has a circular arc. In this case, two side plates 8031 in the compressive strain structure 803 may be disposed toward both sides of the housing of the earphone handle 801, and an end portion 8032 of the side plate 8031 is stably in contact with the housing inner wall of the earphone handle 801.

In order to facilitate the user to quickly find the function key pressing position of the earphone body 900, the outer diameter of the earphone handle 801 is partially processed in a plane at the contact area of the housing of the earphone handle 801 and the end portion 8032 of the side plate 8031 of the pressure strain structure 803 to form a plane positioning region 8011, as shown in fig. 9 (b). When the user presses the shell of the earphone handle 801 to use the function keys, the user only needs to find the plane positioning area 8011 for pressing, so that the positioning sense can be increased, and the use experience of the user is improved. In addition, the plane positioning region 8011 is added to enable a user to accurately find the position of the functional key for extrusion, so that when the user performs bidirectional extrusion on the pressure strain structure 803, the detection precision and the detection stability of the strain sensor in the pressure strain structure 803 are improved, and the overall usability of the earphone is improved.

In general, for the convenience of user operation, the contact areas between the pressure strain structure 803 in the earphone body 800 and the housing of the earphone handle 801 are located on both sides of the earphone body 800 (taking fig. 8A as an example, both sides of the earphone body 800 refer to the front side and the rear side of the housing of the earphone handle 801 shown in fig. 8A).

In addition, the earphone body provided by the embodiment of the application adopts the extrusion mode to use the function keys of the earphone, and the problem of mistaken touch can occur in the use process of a user.

To reduce the occurrence of false touches, for example, in some embodiments, a capacitance-assisted detection scheme may be added to the compressive strain structure 803 shown in fig. 8A, and the determination of the compressive force and direction is assisted by the capacitance changes at different regions of the compressive strain structure 803 during the compression process.

Taking the compressive strain structure 302 shown in fig. 7 as an example, the compressive strain structure 803 may be divided into four regions, namely, an a region 1001, a B region 1002, a C region 1003, and a D region 1004. The inner side 7011 of the base plate 701 is an a region 1001, the outer side 7012 of the base plate 701 is a B region 1002, and the back surfaces of the side plates 702 are a C region 1003 and a D region 1004, respectively. Copper foil networks are respectively arranged on the A area 1001, the B area 1002, the C area 1003 and the D area 1004 of the pressure strain structure 302, and the copper foil networks are coupled and connected with the capacitance sensing channels through a flexible printed circuit (such as an FPC). In addition, the compressive strain structure 302 is also coupled to the capacitive sensing channel through a flexible board (e.g., FPC) and serves as a reference terminal for capacitive sensing. The capacitive sensing channels may be disposed on a circuit board 804 as shown in FIG. 8A and coupled to a processor on the circuit board 804.

Taking the example in which the pressure-strain structure 302 is disposed inside the cavity formed by the earphone handle 801, the user can press the housing of the earphone in the direction of the arrow shown in (a) in fig. 11, that is, in the direction of the arrow shown in (b) in fig. 11, and press the contact area of the housing of the earphone handle 801 and the pressure-strain structure 302. As a finger approaches and touches the housing of the earphone handle 801, the capacitance of the regions on the side plate 702 (i.e., the region C1003 and the region D1004 shown in fig. 10) in the compressive strain structure 203 changes significantly, and the capacitance change amount of the regions on the bottom plate 701 (i.e., the region a 1001 and the region B1002 shown in fig. 10) of the compressive strain structure 203 is smaller than that of the regions on the side plate 702 (i.e., the region C1003 and the region D1004 shown in fig. 10).

It should be understood that when a user accidentally squeezes the housing, the capacitance variation of the four capacitance regions, a region 1001, B region 1002, C region 1003 and D region 1004 shown in fig. 10, is clearly different from that of the four regions (i.e., a region 1001, B region 1002, C region 1003 and D region 1004) when the user actively squeezes the housing of the earphone handle 801. For example, when the user accidentally presses the contact region between the housing of the earphone stem 801 and one side of the pressure-strain structure 302 (for example, one side of the C region 1003 shown in fig. 10), the capacitance change of the C region 1003 is significant, and the capacitance change amount is large; the capacitance change amount of the D region 1014 is small, and the capacitance change amounts of the a region and the B region are also small. When a user accidentally touches the shell of the earphone stem 801 and the non-contact area of the pressure-strain structure 302, it may occur that the capacitance change amounts of the a-region 1001, the B-region 1002, the C-region 1003 and the D-region 1004 shown in fig. 10 are all small.

Therefore, the processor in the earphone can assist in judging the force and direction of the extrusion by analyzing the capacitance variation of the area a 1001, the area B1002, the area C1003 and the area D1004 shown in fig. 10, and can determine whether the user actively extrudes the earphone shell (such as the shell of the earphone handle 801) by combining the sensing of the corresponding size of the strain sensor 303 in the pressure strain structure 302, so as to achieve the purpose of pause or play, thereby improving the accuracy of stress detection.

It should be noted that the four capacitance detection areas can be flexibly configured according to actual situations. For example, only the B region 1002, the C region 1003, and the D region 1004 may be provided, or only the B region 1002, the C region 1003, or the B region 1002 and the D region 1004 may be provided.

Furthermore, the user may also press the housing of the earphone in the direction of the arrow shown in (a) in fig. 12, that is, in the direction of the arrow shown in (b) in fig. 12, the non-contact area of the housing and the pressure strain structure. In this case, when the user presses the housing of the earphone (i.e., the housing of the earphone handle 801) from the outside toward the auricle side, the region inside the housing of the earphone handle 801 comes into contact with the skin of the human body (e.g., the skin of the auricle or cheek), and the region outside the housing of the earphone handle 801 comes into contact with the finger of the user. At this time, the regions a 1001 and B1002 shown in fig. 10 in the compressive strain structure 302 are closer to the human body contact region, the capacitance change of the regions a 1001 and B1002 is more obvious, and the capacitance change amount is larger; the C region 1003 and the D region 1004 are far from the human body contact region, and thus the capacitance change amount of the C region 1003 and the D region 1004 is small. That is, there is a large difference in the amount of capacitance change in the above four regions (i.e., the a region 1001, the B region 1002, the C region 1003, and the D region 1004) when the non-contact region of the headphone housing and the pressure strain structure is pressed, and when the contact region of the headphone housing and the pressure strain structure 302 is pressed.

Therefore, the extrusion direction (namely the direction of stress generation) can be judged in an auxiliary manner through capacitance detection, so that the mode of extruding the earphone shell in different directions can be configured into different key functions according to the stress direction difference and capacitance change difference caused by different extrusion directions, the extension of the key functions is realized, and the user experience is improved.

It will be appreciated that the compressive strain structure 302 remains in an initial position when the earphone housing (e.g., the housing of the earphone stem 801) is not compressed by an external force. The a region 1001, B region 1002, C region 1003 and D region 1004 shown in fig. 10 maintain the initial capacitance state.

Furthermore, the compressive strain structure 302 described above may also be used for slip detection. For example, in the case of a normal wearing scene, the user may slide gently along the tube wall of the earphone stem 801 housing, as indicated by the arrow in fig. 13 (a). At this time, the housing of the earphone handle 801 has no significant pressing force, and the strain generated by the pressure strain structure 302 is insignificant.

In this case, the user's finger slides along the outer wall of the housing of the earphone handle 801 in the direction of the arrow shown in fig. 13 (b). The finger skin gradually approaches the C region 1003 in the compressive strain structure 302 as shown in fig. 10 and then gradually moves away from the C region 1003. In the process of moving away from the C region 1003, the finger skin gradually approaches the B region 1002 of the pressure strain structure 302 and then gradually moves away from the B region 1002. In moving away from the B-region 1002, the finger skin gradually approaches the D-region 1004 of the compressive strain structure 302 and then gradually moves away from the D-region 1004. Therefore, the change in capacitance of the B region 1002 of the compressive strain structure gradually increases and then gradually decreases, then the capacitance of the C region 1003 gradually increases and then gradually decreases, and then the capacitance of the D region 1004 gradually increases and then decreases. That is, during the sliding, the capacitance of the B region 1002 changes first, then the capacitance of the C region 1003 changes, and finally the capacitance of the D region 1004 changes.

Therefore, according to the capacitance variation characteristics of the B region 1002, the C region 1003 and the D region 1004, and in combination with the sensing of the corresponding magnitude of the strain sensor in the pressure strain structure 302, certain functions (such as volume adjustment) of the earphone can be realized when the strain sensor is arranged on the surface of the shell (such as the shell of the earphone handle 801) of the earphone and slides.

In order to achieve the detection accuracy, a certain displacement needs to be formed during the sliding process, that is, the sliding range needs to be as large as possible.

Hereinafter, taking listening to music as an example, interaction between an earphone and an electronic device (such as a mobile phone) will be described.

After the earphone and the mobile phone are connected in a communication mode (such as Bluetooth connection), the earphone can listen to music played by the mobile phone. For example, the user wants to pause playing music, the user may press the housing of the earphone in the direction shown in fig. 11 (a). The earphone responds to the pressing operation of the user on the earphone shell, and the earphone sends a first instruction to the mobile phone. The mobile phone receives a first instruction sent by the earphone and controls the mobile phone to stop playing music. For another example, when the user wants to record a sound, the user may press the housing of the headset in the direction shown in (a) in fig. 12, and the headset transmits the second instruction to the cellular phone in response to the pressing operation of the housing of the headset by the user. And the mobile phone receives a second instruction sent by the earphone and controls the mobile phone to carry out recording operation. For another example, if the user wants to adjust the volume level, the user may slide on the housing of the headset in the direction shown in (a) in fig. 13, and the headset sends a third instruction to the mobile phone in response to the user sliding the housing of the headset. And the mobile phone receives a third instruction sent by the earphone and controls the mobile phone to adjust the volume (such as increasing the volume or decreasing the volume).

The above only describes some scenarios of the interaction between the headset and the mobile phone, and thus the above examples do not limit the scenarios of the interaction between the headset and the mobile phone.

It should be understood that the above embodiments are illustrated by using a wireless headset, and the function keys for implementing the headset through the above pressure-strain structure are not limited to be applied to the wireless headset, but may also be applied to a wired headset, and the embodiments of the present application do not specifically limit the type of the headset.

Through the above description of the embodiments, it is clear to those skilled in the art that, for convenience and simplicity of description, the foregoing division of the functional modules is merely used as an example, and in practical applications, the above function distribution may be completed by different functional modules according to needs, that is, the internal structure of the device may be divided into different functional modules to complete all or part of the above described functions. For the specific working processes of the system, the apparatus and the unit described above, reference may be made to the corresponding processes in the foregoing method embodiments, and details are not described here again.

Each functional unit in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.

The integrated unit, if implemented in the form of a software functional unit and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solutions of the embodiments of the present application may be essentially implemented or make a contribution to the prior art, or all or part of the technical solutions may be implemented in the form of a software product stored in a storage medium and including several instructions for causing a computer device (which may be a personal computer, a server, or a network device) or a processor to execute all or part of the steps of the methods described in the embodiments of the present application. And the aforementioned storage medium includes: flash memory, removable hard drive, read only memory, random access memory, magnetic or optical disk, and the like.

The above description is only a specific implementation of the embodiments of the present application, but the scope of the embodiments of the present application is not limited thereto, and any changes or substitutions within the technical scope disclosed in the embodiments of the present application should be covered by the scope of the embodiments of the present application. Therefore, the protection scope of the embodiments of the present application shall be subject to the protection scope of the claims.

Claims

1. An earphone, comprising a housing;

a pressure strain structure is also arranged in a cavity formed by the shell; the two end parts of the pressure strain structure are stably contacted with the inner wall of the shell;

a strain inductor is arranged on the pressure strain structure;

the pressure strain structure generates strain under the condition of pressing the shell, and the strain sensor is used for sensing the strain generated by the pressure strain structure.

2. The earpiece according to claim 1, wherein the strain sensor is provided at the first side of the pressure strain structure and/or at the second side of the pressure strain structure.

3. The earphone according to claim 1 or 2, wherein the pressure strain structure comprises a bottom plate and side plates connected to both side edges of the bottom plate; an included angle is formed between the side plate and the bottom plate; the end part of the side plate far away from the bottom plate is stably contacted with the inner wall of the shell.

4. The earpiece according to claim 3, wherein the strain sensor is provided on the first side of the bottom plate and/or the second side of the bottom plate.

5. The earphone according to any of claims 1 to 4, wherein the strain sensor is adapted to sense a first strain generated by the compressive strain structure when the contact portion of the casing with the two ends of the compressive strain structure is pressed.

6. The headset of claim 5, wherein a processor is disposed within the cavity formed by the housing, the strain sensor being electrically connected to the processor through a measurement circuit; the measurement circuit is used for outputting a first signal to the processor according to the first strain;

the first signal is used for instructing the earphone to execute a first operation; the first operation comprises one of starting, shutting down, pausing, playing and recording.

7. The earphone according to any of claims 1 to 5, wherein the strain sensor is adapted to sense a second strain generated by the compressive strain structure when the non-contact portion of the casing and the compressive strain structure is pressed.

8. The headset of claim 7, wherein a processor is disposed within the cavity formed by the housing, the strain sensor being electrically connected to the processor through a measurement circuit; the measurement circuit is used for outputting a second signal to the processor according to the second strain;

the second signal is used for instructing the earphone to execute a second operation; the second operation comprises one of starting, shutting down, pausing, playing and recording.

9. The headset of claim 6 or 8, further comprising a printed circuit board within the cavity formed by the housing; the processor is disposed on the printed circuit board; the strain sensor is electrically connected with the printed circuit board through a flexible board so as to electrically connect the strain sensor with the processor.

10. The headset of any one of claims 1 to 9, wherein the housing comprises a headset head housing and a headset stem housing; the pressure strain structure is arranged in a cavity formed by the earphone handle shell, and two end parts of the pressure strain structure are stably contacted with the inner wall of the earphone handle shell.

11. The earphone of claim 10, wherein the outer surface of the earphone handle housing is provided with a flat positioning area near the contact of the earphone handle housing with the pressure strain structure.

12. The headset of any one of claims 1 to 9, wherein the housing comprises a headset head housing; the pressure strain structure is arranged in a cavity formed by the earphone head shell, and two end parts of the pressure strain structure are stably contacted with the inner wall of the earphone head shell.

13. The earpiece according to any of claims 1 to 12, wherein the first face of the pressure strained structure comprises a first region and a second region; the first region and the second region are respectively close to contact parts of two ends of the compressive strain structure and the shell;

a first capacitance detection contact piece is attached to the first area; and/or a second capacitance detection contact piece is attached to the second area;

when the housing is pressed, the first capacitance detection contact piece is used for detecting capacitance generated by the first area, and the second capacitance detection contact piece is used for detecting capacitance generated by the second area.

14. The earpiece of claim 13, wherein the first face of the pressure strained structure further comprises a third region; the third region is located between the first region and the second region; a third capacitance detection contact piece is attached to the third area;

the third capacitance detecting contact piece is used for detecting capacitance generated by the third area when the housing is pressed.

15. The earphone according to claim 14, wherein on the second face of the pressure-strain structure at a position opposite to the third region is a fourth region; a fourth capacitance detection contact piece is attached to the fourth area;

the fourth capacitance detecting contact piece is used for detecting capacitance generated by the fourth area when the housing is pressed.

16. The headset of claim 14 or 15, wherein the first capacitance sensing contact is further adapted to sense a capacitance generated by the first region when slid along the outer wall of the housing; the second capacitance detection contact piece is also used for detecting capacitance generated by the second area; the third capacitance detecting contact piece is also used for detecting capacitance generated by the third area.