CN115141571A - Support sheet, composite sheet for forming resin film, kit, and method for manufacturing chip with resin film - Google Patents
Support sheet, composite sheet for forming resin film, kit, and method for manufacturing chip with resin film Download PDFInfo
- Publication number
- CN115141571A CN115141571A CN202210129766.4A CN202210129766A CN115141571A CN 115141571 A CN115141571 A CN 115141571A CN 202210129766 A CN202210129766 A CN 202210129766A CN 115141571 A CN115141571 A CN 115141571A
- Authority
- CN
- China
- Prior art keywords
- resin film
- support sheet
- film
- composite sheet
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims description 460
- 239000011347 resin Substances 0.000 title claims description 460
- 239000002131 composite material Substances 0.000 title claims description 263
- 238000004519 manufacturing process Methods 0.000 title claims description 117
- 238000000034 method Methods 0.000 title claims description 80
- 238000006073 displacement reaction Methods 0.000 claims abstract description 114
- 238000010438 heat treatment Methods 0.000 claims abstract description 40
- 238000004458 analytical method Methods 0.000 claims abstract description 37
- 230000000930 thermomechanical effect Effects 0.000 claims abstract description 37
- 239000010410 layer Substances 0.000 claims description 276
- 230000001681 protective effect Effects 0.000 claims description 147
- 239000000203 mixture Substances 0.000 claims description 105
- 239000012790 adhesive layer Substances 0.000 claims description 95
- 239000000463 material Substances 0.000 claims description 72
- 238000005520 cutting process Methods 0.000 claims description 29
- 230000002093 peripheral effect Effects 0.000 claims description 25
- 238000001816 cooling Methods 0.000 claims description 21
- 238000010030 laminating Methods 0.000 claims description 13
- 239000000470 constituent Substances 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 4
- 229920005672 polyolefin resin Polymers 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 124
- 230000001070 adhesive effect Effects 0.000 description 91
- 239000002585 base Substances 0.000 description 50
- 229920000642 polymer Polymers 0.000 description 44
- 230000015572 biosynthetic process Effects 0.000 description 43
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 42
- 239000000758 substrate Substances 0.000 description 40
- 150000001875 compounds Chemical class 0.000 description 39
- -1 polyethylene Polymers 0.000 description 38
- 239000000178 monomer Substances 0.000 description 35
- 239000004840 adhesive resin Substances 0.000 description 29
- 229920006223 adhesive resin Polymers 0.000 description 29
- 238000001723 curing Methods 0.000 description 29
- 229920001187 thermosetting polymer Polymers 0.000 description 27
- 239000002904 solvent Substances 0.000 description 26
- 125000000524 functional group Chemical group 0.000 description 23
- 239000004065 semiconductor Substances 0.000 description 23
- 235000012431 wafers Nutrition 0.000 description 23
- 239000003795 chemical substances by application Substances 0.000 description 21
- 238000002156 mixing Methods 0.000 description 20
- 238000012360 testing method Methods 0.000 description 19
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 18
- 239000003822 epoxy resin Substances 0.000 description 16
- 229920000647 polyepoxide Polymers 0.000 description 16
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 15
- 229920000178 Acrylic resin Polymers 0.000 description 15
- 239000004925 Acrylic resin Substances 0.000 description 15
- 239000003431 cross linking reagent Substances 0.000 description 15
- 239000003999 initiator Substances 0.000 description 15
- 238000011282 treatment Methods 0.000 description 14
- 239000004743 Polypropylene Substances 0.000 description 13
- 125000000217 alkyl group Chemical group 0.000 description 13
- 229920001155 polypropylene Polymers 0.000 description 13
- 125000003277 amino group Chemical group 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 12
- 238000011156 evaluation Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 12
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 11
- 239000011162 core material Substances 0.000 description 11
- 229920000058 polyacrylate Polymers 0.000 description 11
- 229920000728 polyester Polymers 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- 239000000654 additive Substances 0.000 description 10
- 239000003086 colorant Substances 0.000 description 10
- 229920001577 copolymer Polymers 0.000 description 10
- 230000009477 glass transition Effects 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 239000007822 coupling agent Substances 0.000 description 9
- 239000000945 filler Substances 0.000 description 9
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 8
- 125000003700 epoxy group Chemical group 0.000 description 8
- 229920001519 homopolymer Polymers 0.000 description 8
- 238000003475 lamination Methods 0.000 description 8
- 229920001228 polyisocyanate Polymers 0.000 description 8
- 239000005056 polyisocyanate Substances 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 7
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 238000010894 electron beam technology Methods 0.000 description 6
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 6
- 239000011256 inorganic filler Substances 0.000 description 6
- 229910003475 inorganic filler Inorganic materials 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- 239000005011 phenolic resin Substances 0.000 description 5
- 239000002356 single layer Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 4
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 238000010583 slow cooling Methods 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 3
- 241001050985 Disco Species 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 3
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- WURBFLDFSFBTLW-UHFFFAOYSA-N benzil Chemical compound C=1C=CC=CC=1C(=O)C(=O)C1=CC=CC=C1 WURBFLDFSFBTLW-UHFFFAOYSA-N 0.000 description 3
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 3
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical class C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
- 238000010330 laser marking Methods 0.000 description 3
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 229920000570 polyether Polymers 0.000 description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- DPNXHTDWGGVXID-UHFFFAOYSA-N 2-isocyanatoethyl prop-2-enoate Chemical compound C=CC(=O)OCCN=C=O DPNXHTDWGGVXID-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- FFBZKUHRIXKOSY-UHFFFAOYSA-N aziridine-1-carboxamide Chemical compound NC(=O)N1CC1 FFBZKUHRIXKOSY-UHFFFAOYSA-N 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- 150000004697 chelate complex Chemical class 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 125000006841 cyclic skeleton Chemical group 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 238000000113 differential scanning calorimetry Methods 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 238000005247 gettering Methods 0.000 description 2
- 239000004700 high-density polyethylene Substances 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 229920001684 low density polyethylene Polymers 0.000 description 2
- 239000004702 low-density polyethylene Substances 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920001289 polyvinyl ether Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- YOSXAXYCARLZTR-UHFFFAOYSA-N prop-2-enoyl isocyanate Chemical compound C=CC(=O)N=C=O YOSXAXYCARLZTR-UHFFFAOYSA-N 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- MQRMTENGXFRETM-UHFFFAOYSA-N (2-methyl-1h-imidazol-5-yl)methanol Chemical compound CC1=NC=C(CO)N1 MQRMTENGXFRETM-UHFFFAOYSA-N 0.000 description 1
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- 229920003067 (meth)acrylic acid ester copolymer Polymers 0.000 description 1
- QRFMXBKGNQEADL-UHFFFAOYSA-N 1,1'-biphenyl;phenol Chemical class OC1=CC=CC=C1.OC1=CC=CC=C1.C1=CC=CC=C1C1=CC=CC=C1 QRFMXBKGNQEADL-UHFFFAOYSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- OHLKMGYGBHFODF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=C(CN=C=O)C=C1 OHLKMGYGBHFODF-UHFFFAOYSA-N 0.000 description 1
- FWWWRCRHNMOYQY-UHFFFAOYSA-N 1,5-diisocyanato-2,4-dimethylbenzene Chemical compound CC1=CC(C)=C(N=C=O)C=C1N=C=O FWWWRCRHNMOYQY-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- ZVEMLYIXBCTVOF-UHFFFAOYSA-N 1-(2-isocyanatopropan-2-yl)-3-prop-1-en-2-ylbenzene Chemical compound CC(=C)C1=CC=CC(C(C)(C)N=C=O)=C1 ZVEMLYIXBCTVOF-UHFFFAOYSA-N 0.000 description 1
- LFSYUSUFCBOHGU-UHFFFAOYSA-N 1-isocyanato-2-[(4-isocyanatophenyl)methyl]benzene Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=CC=C1N=C=O LFSYUSUFCBOHGU-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- TXTIIWDWHSZBRK-UHFFFAOYSA-N 2,4-diisocyanato-1-methylbenzene;2-ethyl-2-(hydroxymethyl)propane-1,3-diol Chemical compound CCC(CO)(CO)CO.CC1=CC=C(N=C=O)C=C1N=C=O TXTIIWDWHSZBRK-UHFFFAOYSA-N 0.000 description 1
- FWLHAQYOFMQTHQ-UHFFFAOYSA-N 2-N-[8-[[8-(4-aminoanilino)-10-phenylphenazin-10-ium-2-yl]amino]-10-phenylphenazin-10-ium-2-yl]-8-N,10-diphenylphenazin-10-ium-2,8-diamine hydroxy-oxido-dioxochromium Chemical compound O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.Nc1ccc(Nc2ccc3nc4ccc(Nc5ccc6nc7ccc(Nc8ccc9nc%10ccc(Nc%11ccccc%11)cc%10[n+](-c%10ccccc%10)c9c8)cc7[n+](-c7ccccc7)c6c5)cc4[n+](-c4ccccc4)c3c2)cc1 FWLHAQYOFMQTHQ-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- FPKCTSIVDAWGFA-UHFFFAOYSA-N 2-chloroanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3C(=O)C2=C1 FPKCTSIVDAWGFA-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- FKJNJZAGYPPJKZ-UHFFFAOYSA-N 2-hydroxy-1,2-diphenylethanone;methyl benzoate Chemical compound COC(=O)C1=CC=CC=C1.C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 FKJNJZAGYPPJKZ-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- LOUORYQQOPCXGD-UHFFFAOYSA-N 2-methylpropan-1-ol Chemical compound CC(C)CO.CC(C)CO LOUORYQQOPCXGD-UHFFFAOYSA-N 0.000 description 1
- UOBYKYZJUGYBDK-UHFFFAOYSA-N 2-naphthoic acid Chemical compound C1=CC=CC2=CC(C(=O)O)=CC=C21 UOBYKYZJUGYBDK-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- ZXTHWIZHGLNEPG-UHFFFAOYSA-N 2-phenyl-4,5-dihydro-1,3-oxazole Chemical compound O1CCN=C1C1=CC=CC=C1 ZXTHWIZHGLNEPG-UHFFFAOYSA-N 0.000 description 1
- WXISCEUQQBAGKX-UHFFFAOYSA-N 3-(4-prop-1-en-2-ylphenyl)butan-2-one Chemical compound CC(=O)C(C)C1=CC=C(C(C)=C)C=C1 WXISCEUQQBAGKX-UHFFFAOYSA-N 0.000 description 1
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 1
- BUZICZZQJDLXJN-UHFFFAOYSA-N 3-azaniumyl-4-hydroxybutanoate Chemical compound OCC(N)CC(O)=O BUZICZZQJDLXJN-UHFFFAOYSA-N 0.000 description 1
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 1
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- QSJXEFYPDANLFS-UHFFFAOYSA-N Diacetyl Chemical group CC(=O)C(C)=O QSJXEFYPDANLFS-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 229920010126 Linear Low Density Polyethylene (LLDPE) Polymers 0.000 description 1
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 description 1
- 239000004472 Lysine Substances 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- INXWLSDYDXPENO-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CO)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C INXWLSDYDXPENO-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 125000005529 alkyleneoxy group Chemical group 0.000 description 1
- HXBPYFMVGFDZFT-UHFFFAOYSA-N allyl isocyanate Chemical compound C=CCN=C=O HXBPYFMVGFDZFT-UHFFFAOYSA-N 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- CSNNWDJQKGMZPO-UHFFFAOYSA-N benzoic acid;2-hydroxy-1,2-diphenylethanone Chemical compound OC(=O)C1=CC=CC=C1.C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 CSNNWDJQKGMZPO-UHFFFAOYSA-N 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- LKMCJXXOBRCATQ-UHFFFAOYSA-N benzylsulfanylbenzene Chemical compound C=1C=CC=CC=1CSC1=CC=CC=C1 LKMCJXXOBRCATQ-UHFFFAOYSA-N 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 239000012986 chain transfer agent Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- GPAYUJZHTULNBE-UHFFFAOYSA-N diphenylphosphine Chemical compound C=1C=CC=CC=1PC1=CC=CC=C1 GPAYUJZHTULNBE-UHFFFAOYSA-N 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- GFJVXXWOPWLRNU-UHFFFAOYSA-N ethenyl formate Chemical compound C=COC=O GFJVXXWOPWLRNU-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 229920004889 linear high-density polyethylene Polymers 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- LUCXVPAZUDVVBT-UHFFFAOYSA-N methyl-[3-(2-methylphenoxy)-3-phenylpropyl]azanium;chloride Chemical compound Cl.C=1C=CC=CC=1C(CCNC)OC1=CC=CC=C1C LUCXVPAZUDVVBT-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 229920002601 oligoester Polymers 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920003050 poly-cycloolefin Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 230000009993 protective function Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002516 radical scavenger Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- RSVDRWTUCMTKBV-UHFFFAOYSA-N sbb057044 Chemical compound C12CC=CC2C2CC(OCCOC(=O)C=C)C1C2 RSVDRWTUCMTKBV-UHFFFAOYSA-N 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- USFPINLPPFWTJW-UHFFFAOYSA-N tetraphenylphosphonium Chemical compound C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 USFPINLPPFWTJW-UHFFFAOYSA-N 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- IUCJMVBFZDHPDX-UHFFFAOYSA-N tretamine Chemical compound C1CN1C1=NC(N2CC2)=NC(N2CC2)=N1 IUCJMVBFZDHPDX-UHFFFAOYSA-N 0.000 description 1
- 229950001353 tretamine Drugs 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/068—Copolymers with monomers not covered by C09J133/06 containing glycidyl groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
- C09J7/243—Ethylene or propylene polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
- B32B2037/268—Release layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/748—Releasability
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/10—Presence of homo or copolymers of propene
- C09J2423/106—Presence of homo or copolymers of propene in the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68377—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
The present invention provides a support sheet (10) which is used for heating a workpiece or a chip obtained by dividing the workpiece, and which is pulled in either a conveyance direction (MD) or a vertical direction (CD)Displacement (A) at 130 ℃ in thermomechanical analysis (TMA) of a support sheet (10) having a sample size of 20mm in length and 5mm in width in extension mode 130 ) Is 500 μm or less, and has an average displacement per 1 ℃ at a temperature of from 23 ℃ to 130 ℃ (A) 23→130 ) Absolute value (| B) of the average displacement per 1 ℃ when slowly cooled from 130 ℃ to 50 DEG C 130→50 |) small.
Description
Technical Field
The present invention relates to a support sheet, a composite sheet and a kit for forming a resin film, each of which includes the support sheet and a resin film forming layer, and a method for manufacturing a chip with a resin film.
The present application claims priority based on Japanese patent application No. 2021-062255 filed in Japan on 3/31/2021, and the contents thereof are incorporated herein.
Background
Workpieces such as semiconductor wafers, insulator wafers, and semiconductor device panels have circuits formed on one surface (circuit surface) thereof, and have protruding electrodes such as bumps (bumps) on the surface (circuit surface). The workpiece is attached to a support sheet (e.g., a dicing sheet) to obtain a laminated body. The laminate is heated in a state where the peripheral edge of the support sheet is attached to a fixing jig such as a ring frame, and then cooled. The work piece stuck on the supporting sheet is divided, thereby obtaining a chip. Then, the chip is picked up from the supporting sheet (see patent document 1).
In a manufacturing process of a semiconductor device using a mounting method called a flip-chip (facedown) method, in order to protect a back surface of a chip formed by dicing a work, a protective film forming film is used, or a composite sheet for forming a protective film is used in which the protective film forming film and a support sheet are combined. In addition, a film-like adhesive is used for bonding the back surface of the chip to a lead frame, an organic substrate, or the like, and a dicing die (dicing sheet) in which the film-like adhesive and a supporting sheet are combined is used for dicing the work. The protective film forming film and the film-like adhesive are used so as to be attached to the back surface of the workpiece.
Hereinafter, in the present specification, the protective film forming layer or the film-like adhesive is referred to as a resin film forming layer, and the composite sheet for forming a protective film or the dicing die is referred to as a composite sheet for forming a resin film. A protective film formed by forming a film using a protective film or a bonding film formed by using a film-like adhesive is referred to as a resin film.
In the manufacturing process of a chip with a resin film, a resin film forming layer for forming a protective film or a bonding film is attached to the back surface of a work. The resin film-forming layer may be attached to the back surface of the workpiece in a state where the resin film-forming layer is laminated on the support sheet. The resin film-forming layer may be attached to the back surface of the work piece without being laminated on the support sheet and then attached to the support sheet.
The resin film-forming layer attached to the back surface of the workpiece is sometimes heat-cured on the support sheet as necessary, thereby forming a resin film. The first laminated composite sheet is formed by laminating a support sheet, a resin film forming layer and a workpiece in this order in the thickness direction thereof, and is heated and then cooled in a state where the peripheral edge portion of the sheet is bonded to an annular frame. Then, in the dicing step on the backup sheet, the work is divided, the resin film is cut, and the work is picked up as a tape resin film (see patent document 2).
Alternatively, in the dicing step on the support sheet, the resin film forming layer attached to the back surface of the workpiece is divided and the resin film is cut to produce chips with the resin film forming layer, and then the resin film forming layer is thermally cured on the support sheet to produce chips with the resin film. The fourth laminated composite sheet is formed by laminating the support sheet, the resin film-forming layer, and the chip in this order in the thickness direction thereof, and is heated and then cooled in a state where the peripheral portion of the sheet is bonded to the ring frame. Then, the chip with the resin film is picked up.
Documents of the prior art
Patent literature
Patent document 1: international publication No. 2015/190230
Patent document 2: international publication No. 2015/178346
Disclosure of Invention
Technical problems to be solved by the invention
For example, the semiconductor wafers described in patent documents 1 and 2 have a diameter of 8 inches, a thickness of 100 μm, and a mass of about 7.4g. And wherein dicing the semiconductor wafer into 9mm x 9mm chip sizes to make chips is described.
In the manufacturing process of a chip with a resin film, a semiconductor wafer having a larger diameter is used, and the number and size of the protruding electrodes on the semiconductor wafer increase, so that the load applied to the support sheet whose peripheral portion is supported by the ring frame tends to further increase, and the chip size tends to further decrease instead.
In the case of using a conventional composite sheet or support sheet for forming a resin film, when the manufacturing sheet such as the first laminated composite sheet or the fourth laminated composite sheet is heated in a state where the peripheral portion of the manufacturing sheet is attached to the ring frame, the manufacturing sheet may be loosened by a load of a workpiece such as a semiconductor wafer or a load of a plurality of chips, and the position of the chip with the resin film may be shifted. In addition, in the dicing step after heating the production sheet, the chips with the resin film may be displaced. As a result, when the chip size is smaller, there is a problem that the recognition of the resin-coated chip is not good at the time of pickup.
The present invention aims to provide a support sheet which can eliminate the influence of the relaxation of a sheet for manufacturing processing caused by heating and cooling and can improve the recognition of a chip by a pickup device, a composite sheet for forming a resin film having the support sheet and a resin film forming layer, a kit, and a method for manufacturing a chip with a resin film.
Means for solving the problems
The present invention provides the following support sheet, composite sheet and kit for forming resin film, and method for manufacturing chip with resin film.
[1] A support sheet for heating a workpiece or a chip obtained by dividing the workpiece,
when the support sheet is subjected to thermomechanical analysis (TMA) in a stretching mode in either a conveyance direction (MD) or a perpendicular direction (CD) under the following conditions,
displacement at 130 ℃ (A) 130 ) Is less than 500 mu m in the weight ratio,
at a temperature of from 23 ℃ to 130 ℃Average amount of displacement per 1 ℃ (A) 23→130 ) Absolute value (| B) of the average displacement per 1 ℃ when slowly cooled from 130 ℃ to 50 DEG C 130→50 |) small.
< Condition of thermomechanical analysis (TMA) >
Sample size: length 20mm, width 5mm
Chuck spacing: 15mm
The temperature was raised from 23 ℃ to 130 ℃ under a load of 0.8g and at a temperature raising rate of 10 ℃/min, and the temperature was maintained for 30 minutes. Then, the mixture was cooled from 130 ℃ to 50 ℃ under a load of 0.8g at a cooling rate of 1 ℃/min. The amount of displacement [ μm ] during this period was measured.
[2] The support sheet according to [1], wherein,
under the conditions, when the support sheet is subjected to thermomechanical analysis (TMA) in a transport direction (MD) stretching mode and a perpendicular direction (CD) stretching mode,
displacement at 130 ℃ (A) 130 ) All of them are below 500 mu m in diameter,
average displacement per 1 ℃ when increasing the temperature from 23 ℃ to 130 ℃ (A) 23→130 ) All compare the absolute value (| B) of the average displacement per 1 ℃ when slowly cooled from 130 ℃ to 50 ℃ 130→50 |) small.
[3] The support sheet according to [1] or [2], wherein,
under the conditions, when the support sheet is subjected to thermomechanical analysis (TMA) in a stretching mode in either of a transport direction (MD) or a perpendicular direction (CD),
average displacement per 1 ℃ at a temperature of from 23 ℃ to 130 ℃ (A) 23→130 ) Positive values.
[4] The support sheet according to [3], wherein,
under the conditions, when the support sheet is subjected to thermomechanical analysis (TMA) in a transport direction (MD) stretching mode and a vertical direction (CD) stretching mode,
average displacement per 1 ℃ at a temperature of from 23 ℃ to 130 ℃ (A) 23→130 ) Are all positive values.
[5] The support sheet according to [3] or [4], wherein,
under the conditions, when the support sheet is subjected to thermomechanical analysis (TMA) in a stretching mode in either a conveyance direction (MD) or a perpendicular direction (CD),
average displacement per 1 ℃ at a temperature of 60 ℃ to 130 ℃ (A) 60→130 ) Average displacement per 1 ℃ with respect to the temperature rise from 23 ℃ to 130 ℃ (A) 23→130 ) The ratio of (A) to (B) is less than 1.
[6] The support sheet according to [5], wherein,
under the conditions, when the support sheet is subjected to thermomechanical analysis (TMA) in a transport direction (MD) stretching mode and a vertical direction (CD) stretching mode,
average displacement per 1 ℃ at a temperature of 60 ℃ to 130 ℃ (A) 60→130 ) Average displacement per 1 ℃ with respect to the temperature rise from 23 ℃ to 130 ℃ (A) 23→130 ) Are all less than 1.
[7] The support sheet according to any one of [1] to [6], which is composed of a base material alone or which is provided with a base material and an adhesive layer provided on one surface of the base material, wherein a constituent material of the base material contains a polyolefin resin.
[8] The support sheet according to any one of [1] to [7], which is composed of only a base material, or which is provided with a base material and an adhesive layer provided on one surface of the base material, wherein the base material is a stretched film.
[9] The supporting sheet according to any one of [1] to [8], wherein the supporting sheet is in a roll shape.
[10] A composite sheet for forming a resin film, comprising the support sheet according to any one of [1] to [8] and a resin film-forming layer provided on one surface of the support sheet.
[11] The composite sheet for forming a resin film according to [10], wherein the resin film-forming layer is a protective film-forming film.
[12] The composite sheet for forming a resin film according to [10] or [11], wherein the composite sheet for forming a resin film is in a roll shape.
[13] A kit, comprising: a first laminate formed by sequentially laminating a first release film, a resin film-forming layer, and a second release film; and a support sheet according to any one of [1] to [9] for supporting a work to be attached to the resin film-forming layer and the resin film-forming layer.
[14] The kit according to [13], wherein the resin film-forming layer is a protective film-forming film.
[15] The kit according to [13] or [14], wherein the first laminate is in a roll shape.
[16] A method for manufacturing a chip with a resin film, which includes a chip and a resin film provided on the back surface of the chip, the method comprising:
a step of attaching the resin film forming layer in the composite sheet for forming a resin film according to any one of [10] to [12] to the back surface of a workpiece, or attaching the resin film forming layer in the set according to any one of [13] to [15] to the back surface of a workpiece, thereby producing a first laminated film in which the resin film forming layer and the workpiece are laminated in the thickness direction thereof, and further attaching a support sheet in the set to the resin film forming layer in the first laminated film, thereby producing a first laminated composite sheet in which the resin film forming layer and the workpiece are laminated in order on the support sheet in the thickness direction thereof;
a step of heating the first laminated composite sheet in a state where a peripheral portion of the first laminated composite sheet is attached to a fixing jig, and curing the resin film-forming layer to form the resin film, thereby producing a second laminated composite sheet in which the resin film and the workpiece are sequentially laminated on the support sheet in a thickness direction thereof;
a step of cooling the second laminated composite sheet, dividing the work in the second laminated composite sheet on the support sheet, and cutting the resin film to produce a third laminated composite sheet in which a plurality of resin film-attached core pieces are fixed to the support sheet; and
and a step of separating the resin film-attached chip in the third laminated composite sheet from the support sheet to thereby perform pickup.
[17] A method for manufacturing a chip with a resin film, which includes a chip and a resin film provided on the back surface of the chip, the method comprising:
a step of attaching the resin film-forming layer of the composite sheet for forming a resin film according to any one of [10] to [12] to the back surface of a workpiece, or attaching the resin film-forming layer of the set according to any one of [13] to [15] to the back surface of a workpiece, thereby producing a first laminated film in which the resin film-forming layer and the workpiece are laminated in the thickness direction thereof, and further attaching a support sheet of the set to the resin film-forming layer of the first laminated film, thereby producing a first laminated composite sheet in which the resin film-forming layer and the workpiece are laminated in this order on the support sheet in the thickness direction thereof;
a step of producing a fourth laminated composite sheet in which a plurality of chips each having a resin film-forming layer are fixed to the support sheet by dividing the work in the first laminated composite sheet on the support sheet and cutting the resin film-forming layer;
heating and cooling the fourth laminated composite sheet in a state where a peripheral portion of the fourth laminated composite sheet is attached to a fixing jig, and solidifying the resin film-forming layer in the fourth laminated composite sheet to form the resin film, thereby producing a third laminated composite sheet in which a plurality of resin film-equipped chips are fixed to the support sheet; and
and a step of separating the resin film-attached chip in the third laminated composite sheet from the support sheet, thereby performing pickup.
Effects of the invention
According to the present invention, there can be provided a support sheet capable of eliminating the influence of the slack of the sheet for manufacturing processing caused by heating and cooling and capable of eliminating the defective recognition of the chip by the pickup device, a composite sheet for forming a resin film and a kit including the support sheet and a resin film forming layer, and a method for manufacturing a chip with a resin film.
Drawings
Fig. 1 is a sectional view schematically showing one example of a support sheet of the embodiment of the present invention.
Fig. 2 is a sectional view schematically showing one example of the composite sheet for resin film formation according to the embodiment of the present invention.
Fig. 3 is a sectional view schematically showing another example of the composite sheet for resin film formation according to the embodiment of the present invention.
Fig. 4 is a sectional view schematically showing still another example of the composite sheet for resin film formation according to the embodiment of the present invention.
Fig. 5 is a sectional view schematically showing still another example of the composite sheet for resin film formation according to the embodiment of the present invention.
Fig. 6 is a sectional view schematically showing one example of a kit according to an embodiment of the present invention.
Fig. 7A is a sectional view for schematically illustrating a part of one example of a method for manufacturing a chip with a resin film according to an embodiment of the present invention.
Fig. 7B is a sectional view for schematically illustrating a part of one example of a method for manufacturing a chip with a resin film according to an embodiment of the present invention.
Fig. 7C is a sectional view for schematically illustrating a part of one example of the method for manufacturing a chip with a resin film according to the embodiment of the present invention.
Fig. 7D is a sectional view for schematically illustrating a part of one example of a method for manufacturing a chip with a resin film according to an embodiment of the present invention.
Fig. 7E is a sectional view for schematically illustrating a part of one example of a method for manufacturing a chip with a resin film according to an embodiment of the present invention.
Fig. 8 is a sectional view for schematically illustrating a part of another example of the method for manufacturing a chip with a resin film according to the embodiment of the present invention.
Fig. 9A is a sectional view for schematically illustrating a part of another example of the method for manufacturing a chip with a resin film according to the embodiment of the present invention.
Fig. 9B is a sectional view for schematically illustrating a part of another example of the method for manufacturing a chip with a resin film according to the embodiment of the present invention.
Fig. 9C is a sectional view for schematically illustrating a part of another example of the method for manufacturing a chip with a resin film according to the embodiment of the present invention.
Description of the reference numerals
1: a kit; 5: a first laminate; 10. 20: a support sheet; 10a: one face (first face) of the support sheet; 11: a substrate; 12: an adhesive layer; 13. 23: a resin film forming layer; 13': a resin film; 13b': the other surface (second surface) of the resin film; 130: a cut resin film forming layer; 130': a cut resin film; 101. 102, 103, 104: a composite sheet for forming a resin film; 501: a first laminated composite sheet; 502: a second laminated composite sheet; 503: a third laminate composite sheet; 504: a fourth laminated composite sheet; 16: an adhesive layer for a jig; 15: stripping the film; 15: stripping the film; 151: a first release film; 152: a second release film; 18: a fixture for fixing; 601: a first laminated film; 9: a workpiece; 9b: the back of the workpiece; 90: a chip; 90b: the back side of the chip; 901: a chip with a resin film; 902: a chip having a resin film forming layer.
Detailed Description
Support sheet
The support sheet of the embodiment of the present invention is a support sheet for heating of the workpiece or the chip into which the workpiece is divided,
when the support sheet is subjected to thermomechanical analysis (TMA) in a stretching mode in either a conveyance direction (MD) or a perpendicular direction (CD) under the following conditions,
displacement at 130 ℃ (A) 130 ) Is less than 500 mu m in the weight ratio,
average displacement per 1 ℃ at a temperature of from 23 ℃ to 130 ℃ (A) 23→130 ) Absolute value (| B) of the average displacement per 1 ℃ when slowly cooled from 130 ℃ to 50 DEG C 130→50 |) small.
< Condition of thermomechanical analysis (TMA) >
Sample size: length 20mm, width 5mm
Chuck spacing: 15mm
The temperature was raised from 23 ℃ to 130 ℃ under a load of 0.8g and at a temperature raising rate of 10 ℃/min, and the temperature was maintained for 30 minutes. Then, the mixture was cooled from 130 ℃ to 50 ℃ at a cooling rate of 1 ℃/min under a load of 0.8 g. The amount of displacement [ μm ] in this period was measured.
When the displacement amount in the thermomechanical analysis (TMA) is a positive value, it means that the support sheet is elongated, and when the displacement amount is a negative value, it means that the support sheet is contracted.
Displacement (A) of the support sheet of the present embodiment at 130 ℃ 130 ) Is 500 μm or less. Here, the amount of displacement (A) at 130 ℃ 130 ) Measured at the time of increasing the temperature from 23 ℃ to 130 ℃ and reaching 130 ℃.
By making the amount of displacement at 130 ℃ (A) 130 ) Is 500 μm or less, and can reduce the relaxation of the support sheet during heating. Amount of Displacement at 130 ℃ (A) 130 ) Preferably 450 μm or less, more preferably 400 μm or less, and still more preferably 360 μm or less. Amount of Displacement at 130 ℃ (A) 130 ) Preferably more than-50 μm, more preferably more than 0 μm, more preferably more than 21 μm, more preferably more than 43 μm, and particularly preferably more than 64 μm.
For example, the displacement (A) at the support piece 130 ) When the support sheet has a negative value and has a property of shrinking significantly, the support sheet may peel off from the fixing jig and fall off due to the weight of the work because the adhesive force with the fixing jig such as the jig adhesive layer is weak at high temperature. However, since the adhesive force with the fixing jig such as the adhesive layer for the jig recovers at a low temperature, the absolute value (| B) of the average displacement amount per 1 ℃ when the temperature is slowly cooled from 130 ℃ to 50 ℃ 130→50 |) may be larger. Therefore, the average displacement amount per 1 ℃ at a temperature of from 23 ℃ to 130 ℃ is preferable (A) 23→130 ) Absolute value (| B) of the average displacement per 1 ℃ when slowly cooled from 130 ℃ to 50 ℃ 130→50 |) small.
Here, the average displacement amount per 1 ℃ at the time of increasing the temperature from 23 ℃ to 130 ℃ (A) 23→130 ) Can be obtained by the following equation.
A 23→130 ＝(A 130 -A 23 )/107＝A 130 /107[μm/℃]
Displacement at 23 ℃ (A) 23 )＝0μm
Amount of Displacement at 130 ℃ (A) 130 )[μm]
Here, the average amount of displacement per 1 ℃ when slowly cooled from 130 ℃ to 50 ℃ (B) 130→50 ) Can be obtained by the following equation.
B 130→50 ＝(B 50 -B 130 )/80[μm/℃]
In addition, since the support sheet does not elongate when slowly cooled, B 130→50 Typically a negative value.
Here, the absolute value (| B) of the average amount of displacement per 1 ℃ when slowly cooled from 130 ℃ to 50 ℃ | B 130→50 |) can be obtained by the following equation.
|B 130→50 |＝|B 50 -B 130 |/80[μm/℃]
Displacement after 30 minutes at 130 ℃ (B) 130 )[μm]
Amount of displacement at 50 ℃ after Slow Cooling (B) 50 )[μm]
By making the average displacement amount (A) 23→130 ) Less than the absolute value (| B) of the average displacement 130→50 And | this configuration can reduce the positional change of the chip on the support sheet due to heating and cooling, and can eliminate the defective recognition of the chip by the pickup device.
The average displacement amount (A) when the support sheet is subjected to thermomechanical analysis (TMA) in a stretching mode in either a conveyance direction (MD) or a perpendicular direction (CD) under the following conditions 23→130 ) Subtracting the absolute value (| B) of the average displacement 130→50 L) to obtain a value [ (A) 23→130 )-|B 130→50 |]The value is negative, preferably-0.10 to-5 μm/DEG C, more preferably-0.40 to-4 μm/DEG C, and still more preferably-0.75 to-3 μm/DEG C.
When the temperature is raised and maintained in a state where the temperature does not change after reaching 130 ℃, the average displacement amount (a) when the temperature changes due to the temperature rise and the slow cooling is larger than a phenomenon in which the support sheet slowly extends when the same load (load of the workpiece) is applied to the base material of the support sheet for a long time 23→130 ) Subtracting the average bitAbsolute value of shift (| B) 130→50 L) to obtain a value [ (A) 23→130 )-|B 130→50 |]And more importantly. This is because, when the first laminated composite sheet or the fourth laminated composite sheet is actually held at 130 ℃, the resin film-forming layer, the adhesive layer, and the adhesive layer for a jig in the first laminated composite sheet or the fourth laminated composite sheet are tacky at high temperatures, and therefore, the first laminated composite sheet or the fourth laminated composite sheet as a whole relaxes stress against the phenomenon that the support sheet gradually elongates, and is less likely to affect relaxation.
Here, [ (A) in the "conveyance direction (MD) 23→130 )-|B 130→50 |]Value of (A) 'minus' the vertical direction (CD) [ (A) 23→130 )-|B 130→50 |]The absolute value of the obtained value is obtained as "balance evaluation value of MD and CD".
The balance evaluation value of MD and CD is preferably 3.0 or less, more preferably 2.5 or less, further preferably 2.0 or less, and particularly preferably 1.8 or less. If the balance evaluation value between MD and CD is greater than the above upper limit value, in a situation where the shrinkage behavior of the support sheet is limited by a fixing jig such as a ring frame, after heating and cooling, a force that excessively shrinks only in either the MD or CD direction is generated in the support sheet, and wrinkles are likely to be formed in the support sheet near the fixing jig (the support sheet is in a wave shape). In the formation of the wrinkles, a force is generated in a direction in which the support sheet or the composite sheet for forming a resin film is peeled from the fixing jig (i.e., a direction perpendicular to a plane of the fixing jig such as a ring frame), and therefore, the possibility that the support sheet or the composite sheet for forming a resin film is peeled from the fixing jig and comes off from the fixing jig from this point is increased. However, it is considered that this possibility can be further reduced by setting the balance evaluation value of MD and CD to be equal to or less than the upper limit value.
Under the above conditions, when the support sheet is subjected to thermomechanical analysis (TMA) in a stretching mode in either the conveyance direction (MD) or the perpendicular direction (CD), the above requirements may be satisfied.
Under the above conditions, when the support sheet is subjected to thermomechanical analysis (TMA) in a stretching mode in the Machine Direction (MD) and a stretching mode in the Cross Direction (CD), all the above requirements are preferably satisfied.
Namely, it is preferable that: under the conditions, the displacement (A) at 130 ℃ when the support sheet is subjected to thermomechanical analysis (TMA) in a stretching mode in the Machine Direction (MD) 130 ) Is 500 μm or less, and has a displacement (A) at 130 ℃ when the support sheet is subjected to thermomechanical analysis (TMA) in a vertical direction (CD) stretching mode 130 ) Is 500 μm or less.
Preferably, the following components: under said conditions, the average displacement (A) when the support sheet is subjected to thermomechanical analysis (TMA) in a stretching mode in the transport direction (MD) 23→130 ) Is less than the absolute value (| B) of the average displacement 130→50 I) is small and the average amount of displacement (A) is when the support sheet is subjected to thermomechanical analysis (TMA) in a perpendicular direction (CD) stretching mode 23→130 ) Is less than the absolute value (| B) of the average displacement 130→50 |) small.
Generally, the conveyance direction (MD) of the support sheet refers to the conveyance direction of the resin when the support sheet is molded. The Cross Direction (CD) of the support sheet refers to a direction orthogonal to the conveyance direction (MD) of the support sheet. When the support sheet is in the form of a roll, the longitudinal direction of the support sheet is the conveyance direction (MD) and the width direction of the support sheet is the vertical direction (CD) regardless of whether the support sheet is stretched or not.
Even when the support sheet is a sheet, the resin transport directions can be distinguished from each other by optical analysis such as analysis of an X-ray two-dimensional diffraction pattern.
When the support sheet includes the base material and the adhesive layer, since the displacement amount when the support sheet is subjected to thermomechanical analysis (TMA) is greatly affected by the characteristics of the base material, the transport direction (MD) of the support sheet is the transport direction (MD) of the base material, and the vertical direction (CD) of the support sheet is the vertical direction (CD) of the base material.
For the support sheet of the present embodiment, under the conditions described above, when the support sheet is subjected to thermomechanical analysis (TMA) in a stretching mode in either the conveyance direction (MD) or the perpendicular direction (CD), the average amount of displacement (a) per 1 ℃ when the temperature is raised from 23 ℃ to 130 ℃ is preferable 23→130 ) A positive value.
And for fasteningThe adhesive force of the jig is weak at high temperature. If the average displacement (A) 23→130 ) If the temperature is negative, the support sheet may contract, and the support sheet may be peeled off from the fixing jig and fall off due to the weight of the workpiece or the chip at high temperature. By making the average displacement amount (A) 23→130 ) The positive value of the amount of the support sheet can eliminate the possibility that the support sheet is peeled off and separated from the fixing jig.
Here, the average displacement per 1 ℃ at the time of increasing the temperature from 23 ℃ to 130 ℃ (A) 23→130 ) Can utilize the formula (A) 23→130 ＝A 130 /107[μm/℃]) And (4) obtaining.
The average displacement amount (A) 23→130 ) More preferably 0.20 μm/DEG C or more, still more preferably 0.40 μm/DEG C or more, and particularly preferably 0.60 μm/DEG C or more.
Under the condition, when the support sheet is subjected to thermomechanical analysis (TMA) in a stretching mode in either one of a conveyance direction (MD) or a perpendicular direction (CD), the average displacement amount (A) is 23→130 ) It is positive.
Under the above conditions, when the support sheet is subjected to thermomechanical analysis (TMA) in a stretching mode in the Machine Direction (MD) and in a stretching mode in the Cross Direction (CD), the average displacement amount (a) is preferably 23→130 ) Are all positive values.
Under the above conditions, when the support sheet is subjected to thermomechanical analysis (TMA) in a stretching mode in the Machine Direction (MD) and a stretching mode in the Cross Direction (CD), the average displacement amount (a) is more preferable 23→130 ) All of them are 0.20 μm/DEG C or more, more preferably 0.40 μm/DEG C or more, and particularly preferably 0.60 μm/DEG C or more.
Under the conditions, when the support sheet is subjected to thermomechanical analysis (TMA) in a stretching mode in either the conveying direction (MD) or the perpendicular direction (CD), the average amount of displacement (a) per 1 ℃ when the temperature is raised from 60 ℃ to 130 ℃ is preferred 60→130 ) Relative to the average displacement per 1 ℃ when the temperature is raised from 23 ℃ to 130 ℃ (A) 23→130 ) The ratio of (A) to (B) is less than 1.
After the temperature is raised to 60 ℃, the support sheet tends to become soft as a material.
By making theAverage displacement (A) 60→130 ) Relative to the average displacement amount (A) 23→130 ) The ratio of (a) to (b) is less than 1, so that the stretching behavior of the support sheet is suppressed after the temperature is raised to 60 ℃, and thus the relaxation after the final cooling is easily suppressed.
Average displacement per 1 ℃ at a temperature of from 23 ℃ to 130 ℃ (A) 23→130 ) Can be obtained by the following equation.
A 23→130 ＝(A 130 -A 23 )/107＝A 130 /107[μm/℃]
Displacement at 23 ℃ (A) 23 )＝0μm
Displacement at 130 ℃ (A) 130 )[μm]
Here, the average displacement amount per 1 ℃ at the time of increasing the temperature from 60 ℃ to 130 ℃ (A) 60→130 ) Can be obtained by the following equation.
A 60→130 ＝(A 130 -A 60 )/70[μm/℃]
Displacement at 60 ℃ (A) 60 )[μm]
Displacement at 130 ℃ (A) 130 )[μm]
Therefore, the average displacement amount per 1 ℃ at a temperature rise from 60 ℃ to 130 ℃ (A) 60→130 ) Average displacement per 1 ℃ with respect to the temperature rise from 23 ℃ to 130 ℃ (A) 23→130 ) Ratio of (A) [ (A) 60→130 )/(A 23→130 )]Can be obtained by the above formula.
The average displacement amount (A) 60→130 ) Relative to the average displacement amount (A) 23→130 ) Ratio of (A) [ (A) 60→130 )/(A 23→130 )]Preferably less than 1, more preferably 0.99 or less, and still more preferably 0.98 or less. The average displacement amount (A) 60→130 ) Relative to the average displacement amount (A) 23→130 ) Ratio of (A) [ (A) 60→130 )/(A 23→130 )]Preferably 0.10 or more, more preferably 0.20 or more, further preferably 0.30 or more, and particularly preferably 0.90 or more.
When the temperature is raised and the support sheet is kept in a state where there is no temperature change after the temperature is raised to 130 ℃, the support sheet generated by applying the same load (load of the workpiece) to the base material of the support sheet for a long time is gradually releasedThe average displacement (A) when the temperature is changed by temperature rise and slow cooling is compared with the elongation phenomenon 60→130 ) Relative to the average displacement amount (A) 23→130 ) Ratio of (A) [ (A) 60→130 )/(A 23→130 )]And more importantly. This is because, when the first laminated composite sheet or the fourth laminated composite sheet is actually held at 130 ℃, the resin film-forming layer, the adhesive layer, and the adhesive layer for a jig in the first laminated composite sheet or the fourth laminated composite sheet are tacky at high temperatures, and therefore, the first laminated composite sheet or the fourth laminated composite sheet as a whole relaxes stress against the phenomenon that the support sheet gradually elongates, and is less likely to affect relaxation.
Under the above conditions, when the support sheet is subjected to thermomechanical analysis (TMA) in a transport direction (MD) stretching mode and a perpendicular direction (CD) stretching mode, it is preferable that the average displacement amount (a) is 60→130 ) Relative to the average displacement amount (A) 23→130 ) The ratios of (A) to (B) are all less than 1.
Under the above conditions, when the support sheet is subjected to thermomechanical analysis (TMA) in a stretching mode in the Machine Direction (MD) and in a stretching mode in the Cross Direction (CD), the average displacement amount (a) is preferably 60→130 ) Relative to the average displacement amount (A) 23→130 ) Ratio of (A) [ (A) 60→130 )/(A 23→130 )]All of them are less than 1, more preferably 0.99 or less, and still more preferably 0.98 or less. Preferably the average displacement amount (A) 60→130 ) Relative to the average displacement amount (A) 23→130 ) Ratio of (A) [ (A) 60→130 )/(A 23→130 )]All of them are 0.10 or more, more preferably 0.20 or more, and still more preferably 0.30 or more.
The support sheet of the present embodiment can be applied to the following method for manufacturing a chip with a resin film: the method includes the steps of attaching a resin film forming layer to the back surface of a workpiece, heating the first laminated composite sheet, which is formed by laminating the resin film forming layer and the workpiece on the support sheet in this order in the thickness direction thereof, while attaching the peripheral portion of the first laminated composite sheet to a fixing jig, to form a second laminated composite sheet, which is formed by laminating a resin film and the workpiece on the support sheet in this order in the thickness direction thereof, cooling the second laminated composite sheet, then dividing the workpiece on the support sheet, cutting the resin film, forming a third laminated composite sheet, which is formed by fixing a plurality of chips with resin films on the support sheet, and picking up the chips with resin films in the third laminated composite sheet. Since the support sheet according to the embodiment of the present invention has the above-described configuration, even when the first laminated composite sheet is heated in a state where the peripheral portion of the first laminated composite sheet is attached to the fixing jig and then the second laminated composite sheet is cooled, the influence of the slack of the third laminated composite sheet can be eliminated, and the visibility of the pickup device to the chip can be improved.
Further, the support sheet of the present embodiment can be applied to the following method for manufacturing a chip with a resin film: attached resin film cambium at the back of work piece, cut apart the resin film cambium reaches the work piece is stacked gradually along their thickness direction in the first lamination composite piece that constitutes on the support piece the work piece, and cut off resin film cambium forms the fourth lamination composite piece that is fixed with the chip of a plurality of tape resin film cambium on the support piece is directed at the fourth lamination composite piece, in order to incite somebody to action the peripheral part of the fourth lamination composite piece is attached in the state heating of anchor clamps for fixing the fourth lamination composite piece forms the third lamination composite piece that is fixed with the chip of a plurality of tape resin films on the support piece will the third lamination is cooled, then picks up in the third lamination composite piece the chip of tape resin film. Since the support sheet according to the embodiment of the present invention has the above-described configuration, even when the fourth laminated composite sheet is heated in a state where the peripheral portion of the fourth laminated composite sheet is attached to the fixing jig and then the third laminated composite sheet is cooled, the influence of the slack of the third laminated composite sheet can be eliminated, and the visibility of the pickup device to the chip can be improved.
Since the support sheet according to the embodiment of the present invention has the above-described configuration, the recognition of the chip by the pickup device can be improved even when the workpiece has a mass of 20g or more, the recognition of the chip by the pickup device can be improved even when the workpiece has a mass of 30g or more, and the recognition of the chip by the pickup device can be improved even when the workpiece has a mass of 40g or more.
In the present specification, "workpiece" refers to a wafer or a semiconductor device panel.
Examples of the "wafer" include a semiconductor wafer made of an elemental semiconductor such as silicon, germanium, or selenium, or a compound semiconductor such as GaAs, gaP, inP, cdTe, znSe, or SiC; an insulator wafer is composed of an insulator such as sapphire, glass, lithium niobate, or lithium tantalate.
The "semiconductor device panel" is an assembly in which a plurality of semiconductor devices in which at least one electronic component is sealed by a sealing resin layer are arranged in a plane.
A circuit is formed on one surface of these workpieces, and in this specification, the surface of the workpiece on which the circuit is formed is referred to as a "circuit surface". The surface of the workpiece opposite to the circuit surface is referred to as a "back surface".
The workpiece is divided by means such as dicing to form chips. In the present specification, as in the case of a workpiece, the surface of a chip on which a circuit is formed is referred to as a "circuit surface", and the surface of the chip opposite to the circuit surface is referred to as a "back surface".
Both the circuit surface of the workpiece and the circuit surface of the chip are provided with bump electrodes such as bumps and pillars (pilars). The bump electrode is preferably made of solder.
The support sheet may be formed of one layer (single layer) or may be formed of a plurality of layers of two or more layers. When the support sheet is composed of a plurality of layers, the constituent materials and thicknesses of the plurality of layers may be the same as or different from each other, and the combination of the plurality of layers is not particularly limited as long as the effect of the present invention is not impaired.
The support sheet is preferably transparent and may be colored according to the purpose.
When the resin film-forming layer has energy ray curability, the support sheet preferably transmits energy rays.
Examples of the support sheet include a support sheet having a base material and an adhesive layer provided on one surface of the base material; a support sheet composed only of a base material, and the like. When the support sheet includes the adhesive layer, the adhesive layer is disposed between the base material and the resin film-forming layer in the composite sheet for forming a resin film.
When a support sheet including a base material and an adhesive layer is used, in the composite sheet for forming a resin film, adhesiveness and peelability between the support sheet and the resin film-forming layer can be easily adjusted.
When a support sheet composed only of a base material is used, a composite sheet for forming a resin film can be produced at low cost.
Hereinafter, an example of the support sheet of the present embodiment will be described with reference to the drawings.
Fig. 1 is a sectional view schematically showing one example of the support sheet of the present embodiment. In order to make the features of the present invention easier to understand, important parts of the drawings used in the following description may be enlarged for convenience, and the dimensional ratios of the respective components are not necessarily the same as those in reality.
The support sheet 10 shown in fig. 1 has an adhesive layer 12 provided on one surface 11a (in this specification, may be referred to as a "first surface 11 a") of a base material 11.
Next, the respective layers constituting the support sheet 10 will be described in further detail.
O base material
The substrate is in the form of a sheet or a film, and examples of the constituent material include various resins.
Examples of the resin include polyethylene such as Low Density Polyethylene (LDPE), linear Low Density Polyethylene (LLDPE), and High Density Polyethylene (HDPE); polyolefins other than polyethylene, such as polypropylene, polybutene, polybutadiene, polymethylpentene, and norbornene resins; ethylene copolymers (copolymers obtained using ethylene as a monomer) such as ethylene-vinyl acetate copolymers, ethylene- (meth) acrylic acid ester copolymers, and ethylene-norbornene copolymers; vinyl chloride-based resins (resins obtained by using vinyl chloride as a monomer) such as polyvinyl chloride and vinyl chloride copolymers; polystyrene; a polycycloolefin; polyesters such as polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, polyethylene isophthalate, polyethylene 2, 6-naphthalate, and wholly aromatic polyesters having an aromatic ring group in all the structural units; copolymers of two or more of said polyesters; poly (meth) acrylates; a polyurethane; a urethane acrylate; a polyimide; a polyamide; a polycarbonate; a fluororesin; a polyacetal; modified polyphenylene ether; polyphenylene sulfide; polysulfones; polyether ketones, and the like.
The constituent material of the base material preferably contains a polyolefin resin, and among these, polyolefins other than polyethylene are preferred, and polypropylene is more preferred.
Examples of the resin include polymer alloys (polymer alloys) such as a mixture of the polyester and a resin other than the polyester. It is preferable that the amount of the resin other than polyester in the polymer alloy of the polyester and the resin other than polyester is smaller.
Examples of the resin include crosslinked resins obtained by crosslinking one or two or more of the above-exemplified resins; one or two or more kinds of modified resins such as ionomers among the above-exemplified resins are used.
The resin constituting the base material may be one kind only, or two or more kinds, and in the case of two or more kinds, the combination and ratio thereof may be arbitrarily selected.
The substrate may be composed of one layer (single layer) or a plurality of layers of two or more layers, and when composed of a plurality of layers, these plurality of layers may be the same as or different from each other, and the combination of these plurality of layers is not particularly limited.
The thickness of the substrate is preferably 50 to 300. Mu.m, more preferably 60 to 100. Mu.m. By setting the thickness of the base material to such a range, the flexibility and the suitability for adhesion to a workpiece of the support sheet and the composite sheet for forming a resin film can be further improved.
Here, the "thickness of the substrate" refers to the thickness of the entire substrate, and for example, the thickness of the substrate composed of a plurality of layers refers to the total thickness of all the layers constituting the substrate.
In the present specification, unless otherwise specified, "thickness" means an average value of thicknesses measured at 5 positions randomly selected in an object, and can be obtained using a constant pressure thickness gauge based on JIS K7130.
The base material may contain various known additives such as a filler, a colorant, an antioxidant, an organic lubricant, a catalyst, and a softener (plasticizer), in addition to the main constituent materials such as the resin.
The substrate is preferably transparent, may be colored according to the purpose, and may have another layer deposited thereon.
In order to adjust the adhesion between the substrate and the adhesive layer or the resin film-forming layer provided on the substrate, the surface may be subjected to a roughening treatment such as a sandblasting treatment or a solvent treatment; oxidation treatments such as corona discharge treatment, electron beam irradiation treatment, plasma treatment, ozone-ultraviolet irradiation treatment, flame treatment, chromic acid treatment, and hot air treatment; oleophylic treatment; hydrophilic treatment, etc. Further, the surface of the substrate may be subjected to primer treatment (primer treatment).
The substrate may have adhesiveness on at least one surface by containing a component (e.g., a resin or the like) in a specific range.
Method for producing O-base material
The substrate can be manufactured by a known method. For example, the resin-containing substrate can be produced by molding a resin composition containing the resin.
The substrate is preferably a stretched film. The stretching direction of the base material may be only the conveyance direction (MD) of the base material or only the perpendicular direction (CD) of the base material, and biaxial stretching in the conveyance direction (MD) and the perpendicular direction (CD) is preferable.
By making the substrate a stretched film, the residual stress of the stretched film can reduce the average displacement amount (A) of the support sheet 23→130 ) And the average displacement amount (A) 60→130 ). In particular, the average displacement amount (A) is reduced due to the residual stress of the stretched film 60→130 ) Is large, so that the amount of displacement (A) at 130 ℃ can be reduced 130 ) And the ratio [ (A) 60→130 )/(A 23→130 )]。
The stretching of the substrate is preferably carried out under heating. The temperature condition of heating may be adjusted according to the constituent material of the base material. For example, when the material constituting the substrate is polypropylene, the heating temperature is preferably 100 to 140 ℃, more preferably 105 to 135 ℃, and still more preferably 110 to 130 ℃.
The heating time is preferably 15 to 120 seconds, more preferably 30 to 100 seconds, and still more preferably 45 to 80 seconds.
The tension of the drawing is preferably 1.0 to 6.0N/m, more preferably 1.3 to 5.0N/m, and still more preferably 1.6 to 4.0N/m.
Adhesive layer
The adhesive layer is in a sheet or film shape and contains an adhesive resin.
Examples of the adhesive resin include acrylic resins, urethane resins, rubber resins, silicone resins, epoxy resins, polyvinyl ethers, polycarbonates, ester resins, and the like. Among these, acrylic resins are preferable from the viewpoint of adjusting adhesion to the resin film-forming layer and the resin film.
The adhesive layer may be composed of one layer (single layer) or a plurality of layers of two or more layers, and in the case of being composed of a plurality of layers, these plurality of layers may be the same as or different from each other, and the combination of these plurality of layers is not particularly limited.
The thickness of the adhesive layer is not particularly limited, but is preferably 1 to 100 μm, more preferably 1 to 60 μm, further preferably 1 to 30 μm, further preferably 1 to 15 μm, and particularly preferably 1 to 9 μm, from the viewpoint of easier adjustment of adhesion to the resin film-forming layer and the resin film.
Here, the "thickness of the adhesive agent layer" refers to the thickness of the entire adhesive agent layer, and for example, the thickness of the adhesive agent layer composed of a plurality of layers refers to the total thickness of all layers constituting the adhesive agent layer.
The adhesive layer is preferably transparent and may be colored according to the purpose.
When the resin film-forming layer has energy ray curability, the adhesive layer preferably transmits energy rays.
The adhesive layer may be either energy ray-curable or non-energy ray-curable. The energy ray-curable adhesive agent layer can be adjusted in physical properties before and after curing. For example, before picking up a chip with a resin film described later, the chip with a resin film can be picked up more easily by curing an energy ray-curable adhesive layer.
In the present specification, "energy ray" refers to a ray having an energy quantum in an electromagnetic wave or a charged particle beam. Examples of the energy ray include ultraviolet rays, radiation, and electron beams. The ultraviolet rays can be irradiated by using, for example, a high-pressure mercury lamp, a fusion lamp (fusion lamp), a xenon lamp, a black light lamp, an LED lamp, or the like as an ultraviolet ray source. The electron beam can be irradiated with an electron beam generated by an electron beam accelerator or the like.
In the present specification, "energy ray-curable property" refers to a property of curing by irradiation with an energy ray, and "non-energy ray-curable property" refers to a property of not curing even by irradiation with an energy ray.
The term "non-curable" refers to a property that does not cure by any means such as heating or irradiation with energy rays.
When the adhesive layer is energy ray-curable, examples of the energy ray-curable adhesive composition include: an adhesive composition (I-1) comprising an adhesive acrylic resin (I-1 a) (hereinafter, may be abbreviated as "adhesive resin (I-1 a)") and an energy ray-curable compound, wherein the acrylic resin (I-1 a) has a functional group such as a hydroxyl group and is non-energy ray-curable; an adhesive composition (I-2) comprising an energy ray-curable adhesive resin (I-2 a) (hereinafter, sometimes abbreviated as "adhesive resin (I-2 a)") having an unsaturated group introduced into a side chain of the non-energy ray-curable adhesive resin (I-1 a); and an adhesive composition (I-3) containing the adhesive resin (I-2 a) and an energy ray-curable compound.
When the adhesive layer is non-energy ray-curable, examples of the non-energy ray-curable adhesive composition include the adhesive composition (I-4) containing the non-energy ray-curable adhesive resin (I-1 a).
[ non-energy ray-curable adhesive resin (I-1 a) ]
The adhesive resin (I-1 a) is an adhesive acrylic resin having a functional group such as a hydroxyl group.
Examples of the acrylic resin include acrylic polymers having a structural unit derived from a hydroxyl group-containing monomer and a structural unit derived from an alkyl (meth) acrylate.
Examples of the alkyl (meth) acrylate include alkyl (meth) acrylates in which the alkyl group constituting the alkyl ester has 1 to 20 carbon atoms, and the alkyl group is preferably linear or branched.
The acrylic resin is a resin containing a structural unit derived from a (meth) acrylate ester as a monomer. By "derived from" herein is meant that the monomer undergoes the structural change required for polymerization.
In the present specification, "(meth) acrylic acid" is a concept including "acrylic acid" and "methacrylic acid". Similar terms to (meth) acrylic acid are also the same.
The acrylic polymer may further have a structural unit derived from a functional group-containing monomer other than the hydroxyl group-containing monomer, in addition to a structural unit derived from a hydroxyl group-containing monomer, a structural unit derived from an alkyl (meth) acrylate.
Examples of the functional group-containing monomer include a functional group-containing monomer which can introduce an unsaturated group into a side chain of an acrylic polymer by reacting the functional group with a crosslinking agent described later to form a starting point of crosslinking or by reacting the functional group with a functional group such as an isocyanate group or a glycidyl group in an unsaturated group-containing compound described later.
Examples of the functional group-containing monomer include a carboxyl group-containing monomer, an amino group-containing monomer, and an epoxy group-containing monomer, in addition to a hydroxyl group-containing monomer.
The acrylic polymer may further have a structural unit derived from other monomer in addition to a structural unit derived from an alkyl (meth) acrylate and a structural unit derived from a functional group-containing monomer.
The other monomer is not particularly limited as long as it can be copolymerized with an alkyl (meth) acrylate or the like.
Examples of the other monomer include styrene, α -methylstyrene, vinyltoluene, vinyl formate, vinyl acetate, acrylonitrile, and acrylamide.
In the adhesive composition (I-1), the adhesive composition (I-2), the adhesive composition (I-3) and the adhesive composition (I-4) (hereinafter, these adhesive compositions are collectively abbreviated as "adhesive compositions (I-1) to (I-4)"), the acrylic resin such as the acrylic polymer may have only one kind of structural unit, or two or more kinds thereof, and when two or more kinds thereof are used, the combination and ratio thereof may be arbitrarily selected.
In the acrylic polymer, the proportion of the structural unit derived from the functional group-containing monomer to the total amount of the structural units is preferably 1 to 35% by mass.
The adhesive resin (I-1 a) contained in the adhesive composition (I-1) or the adhesive composition (I-4) may be one type or two or more types, and when two or more types are used, the combination and ratio thereof may be arbitrarily selected.
In the adhesive layer formed of the adhesive composition (I-1) or the adhesive composition (I-4), the content of the adhesive resin (I-1 a) is preferably 5 to 99% by mass, for example, may be in any range of 25 to 98% by mass, 45 to 97% by mass, and 65 to 96% by mass, with respect to the total mass of the adhesive layer.
[ energy-ray-curable adhesive resin (I-2 a) ]
The adhesive resin (I-2 a) is obtained, for example, by reacting an unsaturated group-containing compound having an energy ray-polymerizable unsaturated group with a functional group in the adhesive resin (I-1 a).
The unsaturated group-containing compound is a compound having, in addition to the energy ray-polymerizable unsaturated group, a group capable of bonding to the adhesive resin (I-1 a) by reacting with a functional group in the adhesive resin (I-1 a).
Examples of the energy ray-polymerizable unsaturated group include a (meth) acryloyl group, a vinyl group (ethylene group), and an allyl group (2-propenyl group), and a (meth) acryloyl group is preferable.
Examples of the group capable of bonding to the functional group in the adhesive resin (I-1 a) include an isocyanate group and a glycidyl group capable of bonding to a hydroxyl group or an amino group, and a hydroxyl group and an amino group capable of bonding to a carboxyl group or an epoxy group.
Examples of the unsaturated group-containing compound include (meth) acryloyloxyethyl isocyanate, (meth) acryloyl isocyanate, glycidyl (meth) acrylate, and the like.
The adhesive resin (I-2 a) contained in the adhesive composition (I-2) or (I-3) may be one type or two or more types, and when two or more types are used, the combination and ratio thereof may be arbitrarily selected.
In the adhesive layer formed from the adhesive composition (I-2) or (I-3), the content of the adhesive resin (I-2 a) is preferably 5 to 99% by mass with respect to the total mass of the adhesive layer.
[ energy ray-curable Compound ]
Examples of the energy ray-curable compound contained in the adhesive composition (I-1) or (I-3) include a monomer or an oligomer having an energy ray-polymerizable unsaturated group and being curable by irradiation with an energy ray.
Examples of the monomer in the energy ray-curable compound include trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1, 4-butanediol di (meth) acrylate, 1,6-
Polyvalent (meth) acrylates such as hexanediol (meth) acrylate; urethane (meth) acrylate; polyester (meth) acrylates; polyether (meth) acrylates; epoxy (meth) acrylates, and the like.
Examples of the oligomer in the energy ray-curable compound include oligomers of polymers as the monomers exemplified above.
The energy ray-curable compound contained in the adhesive composition (I-1) or (I-3) may be one kind or two or more kinds, and when two or more kinds are contained, the combination and ratio thereof may be arbitrarily selected.
In the adhesive layer formed from the adhesive composition (I-1) or (I-3), the proportion of the content of the energy ray-curable compound with respect to the total mass of the adhesive layer is preferably 1 to 95% by mass.
[ crosslinking agent ]
The adhesive compositions (I-1) to (I-4) preferably further contain an isocyanate-based crosslinking agent.
The crosslinking agent reacts with the hydroxyl groups, for example, to crosslink the adhesive resins (I-1 a) with each other or to crosslink the adhesive resins (I-2 a) with each other.
In the adhesive compositions (I-1) to (I-4), the content of the crosslinking agent is preferably 0.01 to 50 parts by mass, and may be, for example, any one of 1 to 40 parts by mass, 5 to 35 parts by mass, and 10 to 30 parts by mass, based on 100 parts by mass of the content of the adhesive resin (I-1 a).
Examples of the crosslinking agent include the same crosslinking agents as those mentioned in "(crosslinking agent)" mentioned in the composition (III-1) for forming a protective film described later.
[ photopolymerization initiator ]
The adhesive compositions (I-1), (I-2) and (I-3) (hereinafter, these adhesive compositions will be collectively referred to as "adhesive compositions (I-1) to (I-3)") may further contain a photopolymerization initiator. Even when the adhesive compositions (I-1) to (I-3) containing a photopolymerization initiator are irradiated with a relatively low energy ray such as an ultraviolet ray, the compositions sufficiently undergo a curing reaction.
Examples of the photopolymerization initiator include the same photopolymerization initiators as mentioned in "(photopolymerization initiator)" listed in the composition (III-1) for forming a protective film described later.
The photopolymerization initiators contained in the adhesive compositions (I-1) to (I-3) may be only one type, or two or more types, and when two or more types are used, the combination and ratio thereof may be arbitrarily selected.
In the adhesive composition (I-1), the content of the photopolymerization initiator is preferably 0.01 to 20 parts by mass relative to 100 parts by mass of the content of the energy ray-curable compound.
In the adhesive composition (I-2), the content of the photopolymerization initiator is preferably 0.01 to 20 parts by mass relative to 100 parts by mass of the content of the adhesive resin (I-2 a).
In the adhesive composition (I-3), the content of the photopolymerization initiator is preferably 0.01 to 20 parts by mass relative to 100 parts by mass of the total content of the adhesive resin (I-2 a) and the energy ray-curable compound.
[ other additives ]
The adhesive compositions (I-1) to (I-4) may contain other additives not belonging to any of the above components within a range not impairing the effects of the present invention.
Examples of the other additives include known additives such as antistatic agents, antioxidants, softeners (plasticizers), fillers (fillers), rust inhibitors, colorants (pigments and dyes), sensitizers, tackifiers, reaction retarders, and crosslinking accelerators (catalysts).
The reaction retarder is a component that suppresses the occurrence of unintended cross-linking reactions in the adhesive compositions (I-1) to (I-4) during storage, for example, due to the action of the catalyst mixed in the adhesive compositions (I-1) to (I-4). Examples of the reaction retarder include a reaction retarder which forms a chelate complex (chelate complex) by a chelate compound corresponding to a catalyst, and more specifically, a reaction retarder having two or more carbonyl groups (= C) -) in one molecule.
The other additives contained in the adhesive compositions (I-1) to (I-4) may be only one type, or two or more types, and when two or more types are used, the combination and ratio thereof may be arbitrarily selected.
The content of the other additives in the adhesive compositions (I-1) to (I-4) is not particularly limited, and may be appropriately selected depending on the kind thereof.
[ solvent ]
The adhesive compositions (I-1) to (I-4) may contain a solvent. By adding the solvents to the adhesive compositions (I-1) to (I-4), the applicability to the surface to be coated is improved.
The solvent is preferably an organic solvent, and examples of the organic solvent include ketones such as methyl ethyl ketone and acetone; esters (carboxylic acid esters) such as ethyl acetate; ethers such as tetrahydrofuran and dioxane; aliphatic hydrocarbons such as cyclohexane and n-hexane; aromatic hydrocarbons such as toluene and xylene; alcohols such as 1-propanol and 2-propanol, and the like.
The adhesive compositions (I-1) to (I-4) may contain only one solvent, or may contain two or more solvents, and when two or more solvents are contained, the combination and ratio of the solvents can be arbitrarily selected.
The content of the solvent in the adhesive compositions (I-1) to (I-4) is not particularly limited, and may be appropriately adjusted.
Method for preparing O adhesive composition
The adhesive compositions such as the adhesive compositions (I-1) to (I-4) can be obtained by blending the respective components for constituting the adhesive composition, that is, by blending the adhesive resin with components other than the adhesive resin as required.
The order of addition when blending the components is not particularly limited, and two or more components may be added simultaneously.
When blending, the method of mixing the components is not particularly limited, and may be appropriately selected from the following known methods: a method of mixing by rotating a stirrer, a stirring blade, or the like; a method of mixing using a mixer (mixer); a method of mixing by applying ultrasonic waves, and the like.
The temperature and time for adding and mixing the components are not particularly limited as long as the components are not deteriorated, and may be appropriately adjusted, but the temperature is preferably 15 to 30 ℃.
Method for producing O adhesive layer
The adhesive layer can be formed using an adhesive composition containing an adhesive resin. For example, the adhesive agent layer can be formed at a target site by applying the adhesive agent composition to a surface to be formed with the adhesive agent layer and drying the composition as necessary. The content ratio of the components that do not vaporize at normal temperature in the adhesive composition is generally the same as the content ratio of the components in the adhesive layer.
In the adhesive agent layer, the ratio of the total content of one or more of the following contained components in the adhesive agent layer to the total mass of the adhesive agent layer is not more than 100% by mass.
Similarly, in the adhesive composition, the ratio of the total content of one or two or more of the following-described components contained in the adhesive composition to the total mass of the adhesive composition is not more than 100% by mass.
The adhesive composition may be applied by a known method, and examples thereof include a method using various coaters such as an air knife coater, a blade coater, a bar coater, a gravure coater, a roll coater, a curtain coater, a die coater, a knife coater, a screen coater, a meyer bar coater, and a kiss coater.
The drying conditions of the adhesive composition are not particularly limited. However, when the adhesive composition contains a solvent, it is preferably dried by heating. The adhesive composition containing a solvent is preferably dried by heating at 70 to 130 ℃ for 10 seconds to 5 minutes, for example.
Manufacturing method of diamond support chip
When the adhesive layer is provided on a substrate, for example, the adhesive composition may be applied to the substrate and dried as necessary. For example, an adhesive composition is applied to a release film and dried as necessary, so that an adhesive layer is formed on the release film, and the exposed surface of the adhesive layer is bonded to one surface of a substrate, so that the adhesive layer is laminated on the substrate. The release film in this case may be removed at any time during the production process or the use process of the composite sheet for forming a resin film.
The support sheet 10 is preferably in the form of a roll.
When the support sheet 10 is in a roll shape, the longitudinal direction of the support sheet 10 is the conveyance direction (MD) and the width direction of the support sheet 10 is the vertical direction (CD) regardless of whether the support sheet 10 is stretched.
Composite sheet for forming resin film
The composite sheet for forming a resin film according to the embodiment of the present invention includes the support sheet 10 according to the embodiment of the present invention and a resin film forming layer provided on one surface of the support sheet 10.
Hereinafter, an example of the composite sheet for forming a resin film according to the present embodiment will be described with reference to the drawings.
Fig. 2 is a sectional view schematically showing one example of the composite sheet for forming a resin film of the present embodiment.
In the drawings subsequent to fig. 2, the same reference numerals as those in the already-described drawings are assigned to the same components as those shown in the already-described drawings, and detailed description thereof is omitted.
The composite sheet 101 for forming a resin film shown here is configured by including a support sheet 10 and a resin film forming layer 13 provided on one surface (in this specification, may be referred to as a "first surface") 10a of the support sheet 10.
The support sheet 10 is configured by including a base material 11 and an adhesive layer 12 provided on one surface (first surface) 11a of the base material 11. In the composite sheet 101 for forming a resin film, the adhesive layer 12 is disposed between the base material 11 and the resin film forming layer 13.
That is, the composite sheet 101 for forming a resin film is configured by sequentially laminating the base material 11, the adhesive layer 12, and the resin film forming layer 13 in the thickness direction thereof.
The first surface 10a of the supporting sheet 10 is the same as a surface (in this specification, may be referred to as "first surface") 12a of the adhesive layer 12 on the side opposite to the base material 11.
The composite sheet 101 for forming a resin film further includes a jig adhesive layer 16 and a release film 15 on the resin film forming layer 13.
In the composite sheet 101 for forming a resin film, the resin film forming layer 13 is laminated on the entire surface or almost the entire surface of the first surface 12a of the adhesive agent layer 12, and the adhesive agent layer 16 for a jig is laminated on a part of the surface (in this specification, sometimes referred to as "first surface") 13a of the resin film forming layer 13 on the opposite side to the adhesive agent layer 12 side, that is, on the region near the peripheral portion. Further, a release film 15 is laminated on a region of the first surface 13a of the resin film formation layer 13 where the adhesive agent layer 16 for a jig is not laminated and a surface (in this specification, may be referred to as a "first surface") 16a of the adhesive agent layer 16 for a jig opposite to the resin film formation layer 13 side. The support sheet 10 is provided on a surface (in this specification, may be referred to as a "second surface") 13b of the resin film formation layer 13 opposite to the first surface 13 a.
The composite sheet for forming a resin film of the present embodiment is not limited to the composite sheet 101 for forming a resin film, and the release film may be optionally provided in the composite sheet for forming a resin film of the present embodiment.
The jig adhesive layer 16 is used to fix the composite sheet 101 for resin film formation to a fixing jig 18 such as a ring frame.
The adhesive layer 16 for a jig may have, for example, a single-layer structure containing an adhesive component, or may have a multilayer structure including a sheet as a core material and layers containing an adhesive component provided on both surfaces of the sheet.
As the adhesive constituting the adhesive layer 16 for a jig, an adhesive having a desired adhesive force and removability is preferable, and for example, an acrylic adhesive, a rubber adhesive, a silicone adhesive, a urethane adhesive, a polyester adhesive, a polyvinyl ether adhesive, or the like can be used. Among these, acrylic adhesives are preferable which have high adhesion to the fixing jig 18 such as a ring frame and can effectively prevent the protective film-forming composite sheet from peeling off from the fixing jig 18 such as a ring frame in a dicing step or the like. In addition, a base material as a core material may be present in the middle of the adhesive agent layer for a jig in the thickness direction.
The adhesive layer for a jig can be formed using an adhesive composition for a jig containing an adhesive resin. For example, the adhesive composition for a jig is applied to a surface to be formed with the adhesive layer for a jig and dried, whereby the adhesive layer for a jig can be formed at a target site. The adhesive composition for jigs may be the same as the adhesive compositions (I-1) to (I-4). The content ratio of the components that do not vaporize at ordinary temperature in the adhesive composition for jigs is generally the same as the content ratio of the components in the adhesive layer for jigs.
On the other hand, the thickness of the adhesive layer for a jig is preferably 5 to 200 μm, and particularly preferably 10 to 100 μm from the viewpoint of adhesiveness to the fixing jig 18 such as a ring frame.
The composite sheet 101 for forming a resin film is used in the following manner: with the release film 15 removed, the back surface of the work is attached to the first surface 13a of the resin film forming layer 13, and the first surface 16a of the adhesive agent layer 16 for a jig is further attached to a fixing jig 18 such as a ring frame.
Fig. 3 is a sectional view schematically showing another example of the composite sheet for forming a resin film of the present embodiment.
The composite sheet 102 for forming a resin film shown here is the same as the composite sheet 101 for forming a resin film shown in fig. 2, except that the shape and size of the resin film forming layer are different, and the adhesive layer for a jig is laminated on the first surface of the adhesive layer instead of the first surface of the resin film forming layer.
More specifically, in the composite sheet 102 for forming a resin film, the resin film forming layer 23 is laminated on a partial region of the first surface 12a of the adhesive agent layer 12, that is, a region on the center side in the width direction (the left-right direction in fig. 3) of the adhesive agent layer 12. Further, the jig adhesive layer 16 is laminated on the first surface 12a of the adhesive layer 12 in a region where the resin film formation layer 23 is not laminated so as to surround the protective film formation film 23 from the outside in the width direction of the protective film formation film 23 without contacting the protective film formation film 23. The release film 15 is laminated on a surface (in this specification, it may be referred to as a "first surface") 23a of the resin film formation layer 23 opposite to the adhesive agent layer 12 side and a first surface 16a of the adhesive agent layer 16 for a jig. The support sheet 10 is provided on a surface (in this specification, may be referred to as a "second surface") 23b of the resin film formation layer 23 opposite to the first surface 23 a.
Fig. 4 is a sectional view schematically showing still another example of the composite sheet for forming a resin film of the present embodiment.
The composite sheet 103 for forming a resin film shown here is the same as the composite sheet 102 for forming a resin film shown in fig. 3, except that it does not include the adhesive agent layer 16 for a jig.
Fig. 5 is a sectional view schematically showing still another example of the composite sheet for forming a resin film of the present embodiment.
The composite sheet 104 for forming a resin film shown here is the same as the composite sheet 101 for forming a resin film shown in fig. 2, except that it is configured to include the support sheet 20 instead of the support sheet 10.
That is, the composite sheet 104 for forming a resin film is configured by laminating the substrate 11 and the resin film forming layer 13 in the thickness direction thereof.
The surface (first surface) 20a of the support sheet 20 on the resin film formation layer 13 side is the same as the first surface 11a of the substrate 11.
The substrate 11 has adhesiveness at least in the first face 11a thereof.
The composite sheet for forming a resin film according to the present embodiment is not limited to the composite sheet for forming a resin film shown in fig. 2 to 5, and may be a composite sheet in which a part of the composite sheet for forming a resin film shown in fig. 2 to 5 is modified or deleted, or a composite sheet in which another configuration is further added to the composite sheet for forming a resin film described above, within a range in which the effects of the present invention are not impaired.
O resin film Forming layer
The resin film-forming layer is used by being attached to the back surface of a workpiece in a method for manufacturing a chip with a resin film. The resin film-forming layer is preferably a protective film-forming film for protecting the work or the back surface of the chip obtained by dividing the work.
By using the composite sheet for forming a resin film or the kit, which is provided with the support sheet and the resin film forming layer, a chip with a resin film, which is provided with a chip and a resin film provided on the back surface of the chip, can be manufactured by a method for manufacturing a chip with a resin film, which will be described later.
When the resin film forming layer is a protective film forming film, by using the protective film forming composite sheet or the kit including the support sheet and the protective film forming film, a chip with a protective film including a chip and a protective film provided on the back surface of the chip can be manufactured by a method for manufacturing a chip with a resin film, which will be described later.
Further, by using the chip with a resin film, a substrate device can be manufactured.
In the present specification, the term "substrate device" refers to a device in which a chip with a resin film is flip-chip connected to a connection pad on a circuit board at a projecting electrode on a circuit surface thereof. For example, when a semiconductor wafer is used as a wafer, a semiconductor device is used as a substrate device.
The resin film-forming layer is preferably thermosetting. The resin film-forming layer can be formed using the resin film-forming composition, and particularly, when the resin film-forming layer is a thermosetting protective film-forming layer, the protective film-forming layer can be formed using the protective film-forming composition (III-1) described below.
< composition for Forming protective film (III-1) >
Examples of the resin film-forming composition include a protective film-forming composition (III-1) (in the present specification, the composition may be abbreviated as "protective film-forming composition (III-1)") containing a polymer component (a) and a thermosetting component (B).
[ Polymer component (A) ]
The polymer component (a) is a polymer compound for imparting film formability, flexibility, and the like to a thermosetting protective film-forming film.
The polymer component (a) contained in the composition (III-1) for forming a protective film and the thermosetting protective film-forming film may be one type or two or more types, and when two or more types are contained, the combination and ratio thereof may be arbitrarily selected.
The polymer component may be a curable component. In the present specification, when the protective film forming composition contains the above-described components belonging to both the polymer component and the curable component, the protective film forming composition is regarded as containing the polymer component and the curable component.
As the polymer component, an acrylic resin, a urethane resin, a phenoxy resin, a silicone resin, a saturated polyester resin, or the like can be used. As the polymer component, an acrylic resin is preferably used.
The weight average molecular weight (Mw) of the polymer component is preferably 1 to 200 ten thousand, more preferably 10 to 120 ten thousand. When the weight average molecular weight of the polymer component is not less than the lower limit, the adhesion to the support sheet 10 tends to be easily lowered, and the adhesion between the support sheet and the protective film can be lowered. When the weight average molecular weight of the polymer component is not more than the upper limit, the adhesion between the support sheet and the protective film forming film can be improved.
The glass transition temperature (Tg) of the polymer component is preferably in the range of-60 to 50 ℃, more preferably-50 to 40 ℃, and particularly preferably-40 to 30 ℃.
When the glass transition temperature of the polymer component is not lower than the lower limit, the adhesion between the support sheet and the protective film can be reduced. When the glass transition temperature of the polymer component is not higher than the upper limit, the adhesion between the support sheet and the protective film forming film can be improved, and the risk of occurrence of cracks (fissures) when the protective film forming film is bent by forming a roll body is reduced.
From the viewpoint of adhesiveness, and film-forming property, the content of the polymer component is preferably 5 to 50 parts by mass, 10 to 45 parts by mass, 14 to 40 parts by mass, and 18 to 35 parts by mass, relative to 100 parts by mass of the total weight of the protective film-forming film.
The glass transition temperature (Tg) of the resin constituting the polymer component can be determined by calculation using the Fox equation shown below.
1/Tg＝(W1/Tg1)+(W2/Tg2)+…+(Wm/Tgm)
Wherein Tg is the glass transition temperature of a resin constituting a polymer component, tg1, tg2, \ 8230, tgm is the glass transition temperature of a homopolymer of each monomer as a raw material of the resin constituting the polymer component, and W1, W2, \ 8230, and Wm are mass fractions of each monomer. Wherein, W1+ W2+ \8230and + Wm =1.
The glass transition temperature of homopolymers of each monomer in the Fox formula can be determined using the values described in the Polymer data Handbook (macromolecules: 12487125401247912495125021248312463), the adhesion Handbook (adhesion 124951253112489125124831250212463). For example, the glass transition temperature of a homopolymer of methyl acrylate is 10 deg.C, that of a homopolymer of methyl methacrylate is 105 deg.C, that of a homopolymer of n-butyl acrylate is-54 deg.C, that of a homopolymer of 2-ethylhexyl acrylate is-70 deg.C, that of a homopolymer of glycidyl methacrylate is 41 deg.C, and that of a homopolymer of 2-hydroxyethyl acrylate is-15 deg.C.
Examples of the monomer constituting the acrylic resin include a (meth) acrylate monomer and a derivative thereof. Examples of the alkyl (meth) acrylate include alkyl (meth) acrylates having an alkyl group of 1 to 18 carbon atoms, and specific examples thereof include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, and 2-ethylhexyl (meth) acrylate. Examples of the (meth) acrylic ester having a cyclic skeleton include cyclohexyl (meth) acrylate, benzyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, and imide (meth) acrylate. Further, examples of the functional group-containing monomer include hydroxymethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and the like having a hydroxyl group; in addition, glycidyl (meth) acrylate having an epoxy group and the like can be exemplified. The acrylic polymer containing a structural unit having a hydroxyl group is preferable for the acrylic resin because the acrylic polymer has good compatibility with a curable component described later. Further, the acrylic polymer may be copolymerized with acrylic acid, methacrylic acid, itaconic acid, vinyl acetate, acrylonitrile, styrene, and the like.
(curing component)
As the curable component, for example, the thermosetting component (B) can be used. This can make the protective film-forming film thermoset.
By forming the film using the thermosetting protective film, the film can be easily thermally cured even when the protective film is formed to have a thick film, and therefore the protective film having excellent protective performance can be formed to have a thick film. In the heat curing step, the plurality of workpieces can be collectively cured.
As the thermosetting component, a thermosetting resin and a thermosetting agent can be used. As the thermosetting resin, for example, an epoxy resin is preferable.
As the epoxy resin, a conventionally known epoxy resin can be used. Specific examples of the epoxy resin include epoxy compounds having a functionality of 2 or more in the molecule, such as polyfunctional epoxy resins, biphenyl compounds, bisphenol a diglycidyl ether or hydrogenated compounds thereof, o-cresol novolac epoxy resins, dicyclopentadiene epoxy resins, biphenyl epoxy resins, bisphenol a epoxy resins, bisphenol F epoxy resins, and phenylene skeleton epoxy resins. These epoxy resins can be used singly or in combination of two or more.
The content of the thermosetting component is preferably 1 to 75 parts by mass, more preferably 2 to 60 parts by mass, further preferably 3 to 50 parts by mass, for example, 4 to 40 parts by mass, 5 to 35 parts by mass, or 6 to 30 parts by mass, based on 100 parts by mass of the total weight of the protective film-forming film.
When the content of the thermosetting resin is not less than the lower limit, the protective film can obtain sufficient adhesiveness to the work, and the protective film has excellent performance of protecting the work, and when the content is not more than the upper limit, the protective film has excellent storage stability when stored in the form of a roll.
The thermosetting agent functions as a curing agent for thermosetting resins, particularly epoxy resins. A preferable example of the thermosetting agent is a compound having two or more functional groups capable of reacting with an epoxy group in one molecule. Examples of the functional group include a phenolic hydroxyl group, an alcoholic hydroxyl group, an amino group, a carboxyl group, and an acid anhydride. Among them, preferred are a phenolic hydroxyl group, an amino group, an acid anhydride, and the like, and more preferred are a phenolic hydroxyl group and an amino group.
Specific examples of the phenol type curing agent include polyfunctional phenol resins, biphenyl diphenols, novolak type phenol resins, dicyclopentadiene type phenol resins, novalac type phenol resins (a model of \1247012452125251248312463type \\125011255512494), aralkyl phenol resins (a model of \125125409412512512512512512512512512512512523resin. As a specific example of the amine-based curing agent, DICY (dicyandiamide) is cited. These curing agents may be used singly or in combination of two or more.
The content of the thermosetting agent is preferably 0.1 to 500 parts by mass, and more preferably 1 to 200 parts by mass, relative to 100 parts by mass of the thermosetting resin. When the content of the thermosetting agent is not less than the lower limit, the thermosetting agent is sufficiently cured to obtain adhesiveness, and when the content is not more than the upper limit, the moisture absorption rate of the protective film is suppressed, and the adhesion reliability between the work and the protective film is improved.
The protective film-forming composition (III-1) may contain an energy ray-curable component. As the energy ray-curable component, a low-molecular compound (energy ray-polymerizable compound) which contains an energy ray-polymerizable group and is polymerized and cured upon irradiation with an energy ray such as ultraviolet ray or electron beam can be used. Specific examples of the energy ray-curable component include acrylate compounds such as trimethylolpropane triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, 1, 4-butanediol diacrylate, 1, 6-hexanediol diacrylate, polyethylene glycol diacrylate, oligoester acrylates, urethane acrylates, epoxy-modified acrylates, polyether acrylates, and itaconic acid oligomers. Such a compound has at least 1 polymerizable double bond in the molecule, and usually has a weight average molecular weight of 100 to 30000, preferably about 300 to 10000. The preferable content of the energy ray-curable component is1 to 30 parts by mass, and more preferably 5 to 25 parts by mass, relative to 100 parts by mass of the total weight of the protective film forming film.
Further, as the energy ray-curable component, an energy ray-curable polymer in which an energy ray-polymerizable group is bonded to a main chain or a side chain of a polymer component can be used. Such an energy ray-curable polymer has both a function as a polymer component and a function as a curable component.
The main skeleton of the energy ray-curable polymer is not particularly limited, and may be an acrylic polymer commonly used as a polymer component, or may be a polyester, polyether or the like, and the acrylic polymer is particularly preferably used because synthesis and physical properties are easily controlled.
The energy ray-polymerizable group bonded to the main chain or side chain of the energy ray-curable polymer is, for example, an energy ray-polymerizable group containing a carbon-carbon double bond, and specifically, a (meth) acryloyl group or the like can be exemplified. The energy ray-polymerizable group may be bonded to the energy ray-curable polymer via an alkylene group, an alkyleneoxy group, or a polyalkyleneoxy group.
The weight average molecular weight (Mw) of the energy ray-curable polymer is preferably 1 to 200 ten thousand, and more preferably 10 to 150 ten thousand. The glass transition temperature (Tg) of the energy ray-curable polymer is preferably from-60 to 50 ℃, more preferably from-50 to 40 ℃, and particularly preferably from-40 to 30 ℃.
The energy ray-curable polymer can be obtained, for example, by reacting an acrylic resin containing a functional group such as a hydroxyl group, a carboxyl group, an amino group, a substituted amino group, or an epoxy group with a polymerizable group-containing compound having 1 to 5 substituents reactive with the functional group and an energy ray-polymerizable carbon-carbon double bond per molecule. Examples of the substituent reactive with the functional group include an isocyanate group, a glycidyl group, and a carboxyl group.
Examples of the polymerizable group-containing compound include (meth) acryloyloxyethyl isocyanate, 3-isopropenyl- α, α -dimethylbenzyl isocyanate, (meth) acryloyl isocyanate, allyl isocyanate, glycidyl (meth) acrylate; (meth) acrylic acid, and the like.
The acrylic resin is preferably a copolymer of a (meth) acrylic monomer having a functional group such as a hydroxyl group, a carboxyl group, an amino group, a substituted amino group, or an epoxy group, or a derivative thereof, and another (meth) acrylate monomer copolymerizable with the (meth) acrylic monomer or a derivative thereof.
Examples of the (meth) acrylic monomer having a functional group such as a hydroxyl group, a carboxyl group, an amino group, a substituted amino group, an epoxy group, or a derivative thereof include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate; acrylic acid, methacrylic acid, itaconic acid having a carboxyl group; glycidyl methacrylate, glycidyl acrylate, etc. having an epoxy group.
Examples of the other (meth) acrylic ester monomer or derivative thereof copolymerizable with the above-mentioned monomers include alkyl (meth) acrylates having an alkyl group of 1 to 18 carbon atoms, specifically, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, and the like; examples of the (meth) acrylic acid ester having a cyclic skeleton include cyclohexyl (meth) acrylate, benzyl (meth) acrylate, isobornyl acrylate, dicyclopentanyl acrylate, dicyclopentenyl acrylate, dicyclopentenyloxyethyl acrylate, imide acrylate, and the like. In addition, vinyl acetate, acrylonitrile, styrene, and the like may be copolymerized in the acrylic resin.
Even when an energy ray-curable polymer is used, the energy ray-polymerizable compound may be used together, and a polymer component may be used together.
The protective film forming film may contain the following components in addition to the polymer component and the curable component.
(coloring agent)
The protective film forming film preferably contains a colorant. By blending a colorant in the protective film forming film, when the semiconductor device is loaded into a machine, infrared rays and the like generated from peripheral devices can be shielded, and thus malfunction of the semiconductor device can be prevented. In a semiconductor device or a semiconductor chip having a protective film formed thereon, a product number or the like is usually marked on the surface of the protective film by a laser marking method, and a coloring agent is contained in the protective film, whereby a difference in contrast between a portion of the protective film marked with a laser and portions other than the portion can be sufficiently obtained, and visibility can be improved. As the colorant, organic or inorganic pigments and dyes can be used. From the viewpoint of heat resistance and the like, pigments are preferred. Examples of the pigment include carbon black, iron oxide, manganese dioxide, aniline black, and activated carbon, but are not limited thereto. Among them, carbon black is particularly preferable from the viewpoint of handling properties and dispersibility. The colorant may be used alone or in combination of two or more.
The content of the colorant is preferably 0.05 to 35 parts by mass, more preferably 0.1 to 25 parts by mass, and particularly preferably 0.2 to 15 parts by mass, relative to 100 parts by mass of the total solid content constituting the protective film forming film.
(curing accelerators)
The curing accelerator can be used to adjust the curing speed of the protective film-forming film. Particularly, it is preferable to use a curing accelerator when an epoxy resin and a thermosetting agent are used together in the thermosetting component (B).
Preferred examples of the curing accelerator include tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris (dimethylaminomethyl) phenol; 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4, 5-dimethyloimidazole, 2-phenyl-4-
Imidazoles such as methyl-5-hydroxymethylimidazole; organic phosphines such as tributylphosphine, diphenylphosphine, and triphenylphosphine; tetraphenylboron salts such as tetraphenylphosphonium (tetraphenylphosphonium tetraphenylborate) and triphenylphosphine tetraphenylboron (triphenylphosphonium tetraphenylborate). These curing accelerators may be used singly or in combination of two or more.
The curing accelerator is preferably contained in an amount of 0.01 to 10 parts by mass, and more preferably 0.1 to 5 parts by mass, based on 100 parts by mass of the curable component. By containing the curing accelerator in an amount within the above range, excellent adhesion characteristics are obtained even when exposed to high temperature and high humidity, and high adhesion reliability can be achieved even when exposed to severe reflow soldering conditions.
(coupling agent)
The coupling agent can be used to improve the adhesion reliability of the protective film to the workpiece. Further, by using a coupling agent, the water resistance of the protective film obtained by curing the protective film-forming film is improved without impairing the heat resistance.
As the coupling agent, a compound having a group reactive with a functional group of a polymer component, a curable component, or the like is preferably used. As the coupling agent, a silane coupling agent is preferable. Examples of such coupling agents include gamma-glycidoxypropyltrimethoxysilane, gamma-glycidoxypropylmethyldiethoxysilane, beta- (3, 4-epoxycyclohexyl) ethyltrimethoxysilane, gamma- (methacryloxypropyl) trimethoxysilane, gamma-aminopropyltrimethoxysilane, N-6- (aminoethyl) -gamma-aminopropylmethyldiethoxysilane, N-phenyl-gamma-aminopropyltrimethoxysilane, gamma-ureidopropyltriethoxysilane, gamma-mercaptopropyltrimethoxysilane, gamma-mercaptopropylmethyldimethoxysilane, bis (3-triethoxysilylpropyl) tetrasulfide, methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetoxysilane, and imidazolesilane. These coupling agents may be used singly or in combination of two or more.
The coupling agent is usually contained in an amount of 0.1 to 20 parts by mass, preferably 0.2 to 10 parts by mass, and more preferably 0.3 to 5 parts by mass, based on 100 parts by mass of the total of the polymer component and the curable component. If the content of the coupling agent is less than 0.1 parts by mass, the above-described effects may not be obtained, and if it exceeds 20 parts by mass, degassing (outgas) may be caused.
(Filler)
The thermal expansion coefficient of the protective film after curing can be adjusted by blending a filler in the protective film forming film, and the adhesion reliability between the work and the protective film can be improved by optimizing the thermal expansion coefficient of the protective film after curing for the semiconductor chip. As the filler, an inorganic filler is preferable. In addition, the moisture absorption rate of the cured protective film can be reduced.
Preferred inorganic fillers include powders of silica, alumina, talc, calcium carbonate, titanium oxide, iron oxide, silicon carbide, boron nitride, and the like, beads obtained by spheroidizing these powders, single crystal fibers, glass fibers, and the like. Among them, silica filler and alumina filler are preferable. The inorganic fillers may be used alone or in combination of two or more. The content of the inorganic filler may be 1 to 85 parts by mass, 5 to 80 parts by mass, 10 to 75 parts by mass, 20 to 70 parts by mass, or 30 to 66 parts by mass with respect to 100 parts by mass of the total solid content constituting the protective film forming film.
When the content of the inorganic filler is equal to or less than the upper limit, the risk of cracks (flaws) occurring when the protective film is bent by forming a roll body is reduced, and when the content of the inorganic filler is equal to or more than the lower limit, the heat resistance of the protective film can be improved.
(photopolymerization initiator)
When the protective film forming film contains an energy ray-curable component, the energy ray-curable component is cured by irradiation with an energy ray such as ultraviolet ray. In this case, by adding a photopolymerization initiator to the composition, the polymerization curing time and the amount of light can be reduced.
Specific examples of such photopolymerization initiators include benzophenone, acetophenone, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin methyl benzoate, benzoin dimethyl ketal, 2, 4-diethylthioxanthone, α -hydroxycyclohexyl phenyl ketone, benzyl phenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, benzil (benzil), benzil, diacetyl, 1, 2-diphenylmethane, 2-hydroxy-2-
Methyl-1- [4- (1-methylvinyl) phenyl ] propanone, 2,4, 6-trimethylbenzoyldiphenylphosphine oxide, β -chloroanthraquinone, and the like. The photopolymerization initiator may be used singly or in combination of two or more.
The blending ratio of the photopolymerization initiator is preferably 0.1 to 10 parts by mass, more preferably 1 to 5 parts by mass, based on 100 parts by mass of the energy ray-curable component. When the amount is equal to or greater than the lower limit, satisfactory protective performance can be obtained by photopolymerization, and when the amount is equal to or less than the upper limit, generation of residues that do not contribute to photopolymerization can be suppressed, and curability of the protective film forming film can be sufficient.
(crosslinking agent)
In order to adjust the adhesion and cohesion of the protective film-forming film to the work, a crosslinking agent may be further added. Examples of the crosslinking agent include organic polyisocyanate compounds and organic polyimine compounds.
Examples of the organic polyisocyanate compound include aromatic polyisocyanate compounds, aliphatic polyisocyanate compounds, alicyclic polyisocyanate compounds, trimers of these organic polyisocyanate compounds, isocyanate-terminated urethane prepolymers obtained by reacting these organic polyisocyanate compounds with polyol compounds, and the like.
Examples of the organic polyisocyanate compound include 2, 4-tolylene diisocyanate, 2, 6-tolylene diisocyanate, 1, 3-xylylene diisocyanate, 1, 4-xylylene diisocyanate, diphenylmethane-4, 4 '-diisocyanate, diphenylmethane-2, 4' -diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4, 4 '-diisocyanate, dicyclohexylmethane-2, 4' -diisocyanate, trimethylolpropane-tolylene diisocyanate, and lysine isocyanate.
Examples of the organic polyimine compound include N, N ' -diphenylmethane-4, 4' -bis (1-aziridinecarboxamide), trimethylolpropane-tri- β -aziridinylpropionate, tetramethylolmethane-tri- β -aziridinylpropionate, and N, N ' -toluene-2, 4-bis (1-aziridinecarboxamide) triethylenemelamine.
The crosslinking agent is used in an amount of usually 0.01 to 20 parts by mass, preferably 0.1 to 10 parts by mass, and more preferably 0.5 to 5 parts by mass, based on 100 parts by mass of the total amount of the polymer component and the energy ray-curable polymer.
(general additive)
In addition to the above components, various additives may be blended into the protective film-forming film as needed.
Examples of the various additives include a thickener, a leveling agent (leveling agent), a plasticizer, an antistatic agent, an antioxidant, an ion scavenger, a gettering agent (gettering agent), and a chain transfer agent.
(solvent)
The protective film-forming composition preferably further contains a solvent. The protective film-forming composition containing a solvent is excellent in handling properties.
The solvent is not particularly limited, and preferable examples thereof include hydrocarbons such as toluene and xylene; alcohols such as methanol, ethanol, 2-propanol, isobutanol (2-methylpropane-1-ol), and 1-butanol; esters such as ethyl acetate; ketones such as acetone and methyl ethyl ketone; ethers such as tetrahydrofuran; amides (compounds having an amide bond) such as dimethylformamide and N-methylpyrrolidone.
The protective film-forming composition may contain only one kind of solvent, or may contain two or more kinds of solvents, and in the case of two or more kinds of solvents, the combination and ratio of the solvents may be arbitrarily selected.
The solvent contained in the protective film-forming composition is preferably methyl ethyl ketone or the like, because the components contained in the composition can be mixed more uniformly.
The protective film forming film obtained by applying and drying the protective film forming composition formed of the respective components as described above has adhesiveness and curability, and is pressure-bonded to a workpiece in an uncured state. When the pressure bonding is performed, the protective film forming film may be heated. Then, the cured product can provide a protective film having high impact resistance, excellent in adhesion, and capable of maintaining a sufficient protective function even under severe conditions of high temperature and high humidity. The protective film-forming film may have a single-layer structure, or may have a multilayer structure if it includes 1 or more layers containing the above-described components.
The thickness of the protective film forming film is not particularly limited, and may be 3 to 300 μm, 3 to 200 μm, 5 to 100 μm, 7 to 80 μm, 10 to 70 μm, 12 to 60 μm, 15 to 50 μm, 18 to 40 μm, or 20 to 30 μm.
If the thickness of the protective film forming film is not less than the lower limit, the protective performance of the protective film can be made sufficient, and if the thickness is not more than the upper limit, the cost can be reduced.
Method for producing composition for forming resin film
The resin film-forming composition such as the protective film-forming composition (III-1) can be obtained by blending the respective components constituting the resin film-forming composition.
The order of addition when blending the components is not particularly limited, and two or more components may be added simultaneously.
When a solvent is used, the solvent may be mixed with any of the components other than the solvent to dilute the components in advance, or the solvent may be mixed with the components without diluting any of the components other than the solvent.
When blending, the method for mixing the components is not particularly limited, and may be appropriately selected from the following known methods: a method of mixing by rotating a stirrer, a stirring blade, or the like; a method of mixing using a mixer; a method of mixing by applying ultrasonic waves, and the like.
The temperature and time for adding and mixing the components may be appropriately adjusted in consideration of the conditions under which the components are less likely to deteriorate, but the temperature is preferably 15 to 30 ℃.
Manufacturing method of composite sheet for resin film formation
The composite sheet for forming a resin film can be produced by laminating the above layers in a corresponding positional relationship and adjusting the shape of a part or all of the layers as required. The formation method of each layer is as described above.
The resin film-forming layer can be formed directly by further applying the resin film-forming composition to the adhesive layer laminated on the base material. In this manner, when a new layer (hereinafter, abbreviated as "second layer") is formed on any one layer (hereinafter, abbreviated as "first layer") already laminated on the base material to form a laminated structure of two continuous layers (in other words, a laminated structure of the first layer and the second layer), a method of coating the composition for forming the second layer on the first layer and drying it as necessary can be applied.
The second layer is preferably formed on a release film in advance using a composition for forming the layer, and an exposed surface of the formed second layer on the side opposite to the side in contact with the release film is bonded to an exposed surface of the first layer, thereby forming a continuous two-layer laminated structure. In this case, the composition is preferably applied to the release-treated surface of the release film. After the laminated structure is formed, the release film may be removed as needed.
Here, a case where a resin film forming layer is laminated on the adhesive agent layer is exemplified, but a target laminated structure can be arbitrarily selected, for example, a laminated structure in a case where a layer (film) other than the resin film forming layer is laminated on the adhesive agent layer.
In this manner, since the layers other than the base material constituting the composite sheet for forming a resin film can be laminated by a method of forming the layers on the release film in advance and bonding the layers to the surface of the target layer, the composite sheet for forming a resin film can be produced by appropriately selecting the layers to be subjected to the above-described steps as needed.
The composite sheet for forming a resin film is usually stored in a state where a release film is bonded to the surface of the outermost layer (for example, a resin film-forming layer) on the side opposite to the support sheet of the composite sheet.
Therefore, a composite sheet for forming a resin film with a release film can be obtained by applying a composition for forming a resin film on the release film (preferably on the release-treated surface thereof) and drying it as necessary to form a resin film-forming layer on the release film, laminating the remaining layers on the exposed surface of the resin film-forming layer on the side opposite to the side in contact with the release film by any of the above-described methods, and bonding the release film without removing the release film.
When the resin film-forming layer is a protective film-forming film, the protective film-forming composite sheet including the support sheet and the protective film-forming film can be obtained.
The composite sheet for forming a resin film may be in a sheet form, and preferably in a roll form.
External member
The kit according to the embodiment of the present invention comprises: a first laminate formed by sequentially laminating a first release film, a resin film-forming layer, and a second release film; and a support sheet for supporting a work to be attached to the resin film forming layer and the resin film forming layer.
Hereinafter, an example of the kit 1 of the present embodiment will be described with reference to the drawings.
Fig. 6 is a sectional view schematically showing one example of the cartridge 1 of the present embodiment.
The kit 1 of the present embodiment includes: a first laminate 5 in which a first release film 151, a resin film formation layer 13, and a second release film 152 are laminated in this order; and a support sheet 10 for supporting the work to be attached to the resin film formation layer 13 and the resin film formation layer 13, the support sheet 10 being the support sheet according to the embodiment of the present invention described above.
The resin film-forming layer 13 shown here is formed on one surface thereof (in this specification, it is sometimes referred to as
"first surface") 13a is provided with a first release film 151, and the other surface (in this specification, sometimes referred to as "second surface") 13b opposite to the first surface 13a is provided with a second release film 152.
When the resin film forming layer is a protective film forming layer, by using the kit 1 including the support sheet 10 and the protective film forming layer, a chip with a protective film including a chip and a protective film provided on the back surface of the chip can be manufactured by a method for manufacturing a chip with a resin film, which will be described later.
Such a resin film-forming layer 13 is suitably stored in a roll form, for example. That is, the first laminate is preferably in the form of a roll.
The resin film forming layer 13 can be formed using the resin film forming composition described above.
Both the first release film 151 and the second release film 152 may be known release films.
The first release film 151 and the second release film 152 may be the same release film as each other, or may be different release films having different release forces from each other, for example, when the release films are peeled from the resin film formation layer 13.
In the resin film forming layer 13 shown in fig. 6, an exposed surface formed by removing either one of the first release film 151 and the second release film 152 is a surface to be stuck to the back surface of a workpiece (not shown). The exposed surface formed by removing the remaining one of the first release film 151 and the second release film 152 is the attachment surface of the support sheet.
Although fig. 6 shows an example in which the release film is provided on both surfaces (the first surface 13a and the second surface 13 b) of the resin film formation layer 13, the release film may be provided only on any one surface of the resin film formation layer 13, that is, may be provided only on the first surface 13a or only on the second surface 13b.
Since the kit 1 of the present embodiment uses the resin film formation layer 13 and the support sheet 10 at the same time, the resin film formation layer can be simultaneously attached to the work and the subsequent support sheet can be simultaneously attached in an inline process. Here, the "in-line process" refers to a process of carrying out a plurality of (a plurality of) apparatuses for carrying out one or a plurality of processes, in a single apparatus or in a plurality of apparatuses, and carrying workpieces one by one between one process and the next process, including a plurality of processes and carrying of a process in the plurality of processes in connection with a process.
Method for manufacturing chip with resin film
The support sheet, the composite sheet for forming a resin film provided with the support sheet, and the kit 1 provided with the support sheet according to the embodiments of the present invention described above can be used in a method for manufacturing a chip with a resin film, which includes a chip and a resin film provided on the back surface of the chip.
< preparation method 1 >
The manufacturing method of the first embodiment is a manufacturing method of a chip with a resin film including a chip and a resin film provided on a back surface of the chip,
the method for manufacturing the chip with the resin film comprises the following steps:
a step of attaching the resin film-forming layer of the composite sheet for forming a resin film according to the embodiment of the present invention to the back surface of a workpiece to produce a first laminated composite sheet in which the resin film-forming layer and the workpiece are sequentially laminated on the support sheet in the thickness direction thereof;
a step of heating the first laminated composite sheet in a state where a peripheral portion of the first laminated composite sheet is attached to a fixing jig, and curing the resin film-forming layer to form the resin film, thereby producing a second laminated composite sheet in which the resin film and the workpiece are sequentially laminated on the support sheet in a thickness direction thereof;
a step of cooling the second laminated composite sheet, dividing the work in the second laminated composite sheet on the support sheet, and cutting the resin film to produce a third laminated composite sheet in which a plurality of resin film-attached core pieces are fixed to the support sheet; and
and a step of separating the resin film-attached chip in the third laminated composite sheet from the support sheet to thereby perform pickup.
Hereinafter, in the present specification, the production method of the first embodiment may be referred to as "production method 1".
Fig. 7A to 7E are sectional views for schematically explaining the manufacturing method 1. Here, the manufacturing method 1 will be described by taking, as an example, a case where the composite sheet 101 for forming a resin film of fig. 2 provided with the support sheet 10 shown in fig. 1 is used.
In the step of producing the first laminated composite sheet of the production method 1, as shown in fig. 7A, the resin film forming layer 13 of the composite sheet 101 for forming a resin film is attached to the back surface 9b of the workpiece 9, whereby the first laminated composite sheet 501 is produced in which the resin film forming layer 13 and the workpiece 9 are sequentially laminated on the support sheet 10 in the thickness direction thereof. The first surface 13a of the resin film formation layer 13 in the composite sheet 101 for resin film formation is stuck to the back surface 9b of the workpiece 9.
The resin film forming layer 13 in the composite sheet 101 for forming a resin film can be attached to the workpiece 9 by a known method. For example, the resin film forming layer 13 may be attached to the workpiece 9 while heating.
Next, in the step of manufacturing the second laminated composite sheet of the manufacturing method 1, the first laminated composite sheet 501 is heated in a state where the peripheral portion of the first laminated composite sheet 501 is attached to a fixing jig 18 such as a ring frame via a jig adhesive layer 16 (fig. 7B). As a result, the resin film forming layer 13 is cured to form a resin film 13', and a second laminated composite sheet 502 is produced in which the support sheet 10, the resin film 13', and the workpiece 9 are laminated in this order in the thickness direction thereof, as shown in fig. 7C.
Reference numeral 13a 'denotes a surface (in this specification, sometimes referred to as "first surface") of the resin film 13' that was the first surface 13a of the resin film-forming layer 13. Reference numeral 13b 'denotes a surface (in this specification, sometimes referred to as "second surface") of the resin film 13' that was the second surface 13b of the resin film forming layer 13.
For the curing of the resin film forming layer 13, when the resin film forming layer 13 is thermosetting, it can be cured by heating the resin film forming layer 13.
When the resin film forming layer 13 is a protective film forming film, laser marking may be performed by irradiating the resin film forming layer 13 shown in fig. 7A with a laser beam through the support sheet 10 (through the support sheet 10), or laser marking may be performed by irradiating the resin film 13' shown in fig. 7C with a laser beam through the support sheet 10 (through the support sheet 10).
Next, in the step of manufacturing the third laminated composite sheet of the manufacturing method 1, the second laminated composite sheet 502 is cooled, and then, as shown in fig. 7D, the work 9 in the second laminated composite sheet 502 is divided on the support sheet 10, and the resin film 13' is cut. The work 9 is divided and singulated to form a plurality of chips 90.
The division of the work 9 and the cutting of the resin film 13' may be performed by a known method. For example, the division of the work 9 and the cutting of the resin film 13' can be continuously performed by various kinds of cutting such as blade cutting (blade dicing), laser cutting by laser irradiation, or water cutting by jetting of water containing an abrasive.
Regardless of the method of cutting the resin film 13', the resin film 13' is cut along the outer periphery of the chip 90.
By dividing the work 9 and cutting the resin film 13 'in this manner, a plurality of resin film-attached chips 901 each including the chip 90 and the resin film (hereinafter, simply referred to as "resin film") 130' provided on the rear surface 90b of the chip 90 after cutting can be obtained. Reference numeral 130b 'denotes a surface (in this specification, sometimes referred to as a "second surface") that was the second surface 13b' of the resin film 13 'in the cut resin film 130'.
In the above manner, in the step of manufacturing the third laminated composite sheet of the manufacturing method 1, the third laminated composite sheet 503 in which the plurality of resin film-attached core pieces 901 are fixed to the support sheet 10 is manufactured.
Next, in the step of picking up in the production method 1, as shown in fig. 7E, the resin film-equipped chip 901 in the third laminated composite sheet 503 is separated from the support sheet 10, thereby picking up.
In the manufacturing method 1 according to the embodiment of the present invention, since the supporting sheet 10 has the above-described configuration, even if the second laminated composite sheet 502 is cooled after heating the first laminated composite sheet 501 with the peripheral portion thereof stuck to the fixing jig, the influence of the slack of the third laminated composite sheet 503 can be eliminated, and the chip visibility of the pickup device can be improved.
In the step of picking up, peeling occurs between the second surface 130b 'of the resin film 130' in the resin film-attached chip 901 and the first surface 12a of the adhesive agent layer 12 in the support sheet 10.
Here, the case where the chip 901 with a resin film is pulled away in the direction of the arrow P by pulling the release section 7 with a vacuum nozzle (vacuum collelet) or the like is shown. Here, the cross section of the pulling-off means 7 is not shown.
The resin film-attached chip 901 can be picked up by a known method.
When the adhesive layer 12 is energy ray-curable, in the step of picking up, the adhesive layer 12 is irradiated with an energy ray to cure the adhesive layer 12 to form a cured product (not shown), and then the chip 901 with a resin film may be separated from the support sheet 10. In this case, in the step of picking up, the resin film 130' in the resin film-attached chip 901 and the cured product of the adhesive layer 12 in the support sheet 10 are peeled off from each other.
At this time, since the adhesive force between the cured product of the adhesive layer 12 and the resin film 130' is smaller than the adhesive force between the cured product of the adhesive layer 12 and the base material 11, the chip 901 with the resin film can be easily picked up.
In the present specification, as long as the laminated structure of the substrate and the cured product of the energy ray-curable adhesive agent layer can be maintained, the laminated structure is referred to as a "support sheet" even after the energy ray-curable adhesive agent layer is cured by an energy ray.
On the other hand, when the adhesive layer 12 is non-energy-ray curable, the chip 901 with the resin film may be pulled off directly from the adhesive layer 12, and the curing of the adhesive layer 12 is not necessary, so that the chip 901 with the resin film can be picked up in a simplified process.
In the picking-up step, all the chips 901 with a resin film as a target are picked up by the chips 901 with a resin film.
In the manufacturing method 1, the steps up to the above-described picking up are performed, whereby the target chip 901 with a resin film can be obtained.
The description of the production method 1 thus far has described the production method 1 when the composite sheet 101 for forming a resin film provided with the support sheet 10 shown in fig. 2 is used, but in the production method 1, a composite sheet 102 for forming a resin film, a composite sheet 103 for forming a resin film, a composite sheet 104 for forming a resin film, or the like shown in fig. 3 to 5 may be used in addition to the composite sheet 101 for forming a resin film.
< manufacturing method 2 >
The manufacturing method of the second embodiment is a manufacturing method of a chip with a resin film, which includes a chip and a resin film provided on a back surface of the chip, and includes:
a step of attaching the resin film forming layer in the kit 1 according to the embodiment of the present invention to the back surface of a workpiece to produce a first laminated film in which the resin film forming layer and the workpiece are laminated in the thickness direction thereof, and further attaching the adhesive layer of the support sheet in the kit 1 to the resin film forming layer in the first laminated film to produce a first laminated composite sheet in which the resin film forming layer and the workpiece are laminated in order on the support sheet in the thickness direction thereof;
a step of heating the first laminated composite sheet in a state where a peripheral portion of the first laminated composite sheet is attached to a fixing jig, and curing the resin film-forming layer to form the resin film, thereby producing a second laminated composite sheet in which the resin film and the workpiece are sequentially laminated on the support sheet in a thickness direction thereof;
a step of cooling the second laminated composite sheet, dividing the work in the second laminated composite sheet on the support sheet, and cutting the resin film to produce a third laminated composite sheet in which a plurality of resin film-attached core pieces are fixed to the support sheet; and
and a step of separating the resin film-attached chip in the third laminated composite sheet from the support sheet to thereby perform pickup.
Hereinafter, in the present specification, the production method of the second embodiment may be referred to as "production method 2".
Fig. 8 and 7A to 7E are sectional views for schematically explaining the manufacturing method 2. Here, the manufacturing method 2 will be described by taking as an example the case of using the package 1 of fig. 6 including the support sheet 10 shown in fig. 1.
In the step of producing the first laminated composite sheet of production method 2, first, the resin film forming layer 13 in the package 1 is attached to the back surface 9b of the workpiece 9, whereby a first laminated film 601 in which the resin film forming layer 13 and the workpiece 9 are laminated in the thickness direction thereof is produced as shown in fig. 8. In this case as well, the first surface 13a of the resin film formation layer 13 in the first laminate 5 is bonded to the back surface 9b of the workpiece 9, as in the case of the manufacturing method 1.
Here, although the case where the first release film 151 is removed from the first laminate 5 of the package 1 shown in fig. 6 and the first surface 13a of the resin film formation layer 13 is attached to the back surface 9b of the workpiece 9 is shown, the second release film 152 may be removed from the resin film formation layer 13 of the package 1 shown in fig. 6 and the second surface 13b of the resin film formation layer 13 may be attached to the back surface 9b of the workpiece 9. With respect to the first laminate 5 of the kit 1 shown in fig. 6, a circular punching blade may be inserted from the side of the first release film 151 to peel the first release film 151, and the circular outer side of the resin film formation layer 13 may be removed together with the first release film 151, and the first surface 13a of the obtained circular resin film formation layer 13 may be attached to the back surface 9b of the workpiece 9.
The resin film forming layer 13 can be attached to the workpiece 9 by a known method. For example, the resin film forming layer 13 may be attached to the workpiece 9 while heating.
Next, the adhesive layer 12 of the support sheet 10 in the kit 1 is bonded to the resin film-forming layer 13 in the first laminated film 601, whereby the first laminated composite sheet 501 is produced in which the resin film-forming layer 13 and the workpiece 9 are sequentially laminated on the support sheet 10 in the thickness direction thereof.
The second release film 152 is removed from the resin film formation layer 13 in the first laminated film 601. Then, as shown in fig. 7A, the one surface 10a of the support sheet 10 is attached to the second surface 13b of the resin film formation layer 13 newly exposed. The adhesive layer 16 for a jig can be provided thereafter.
The support sheet 10 shown here is configured to include a base material 11 and an adhesive layer 12 provided on one surface 11a of the base material 11, and the adhesive layer 12 in the support sheet 10 is attached to a resin film formation layer 13. The first surface 12a of the adhesive layer 12 on the resin film formation layer 13 side is the same as the first surface 10a of the support sheet 10.
In manufacturing method 2, the first laminated composite sheet 501 is the same as the first laminated composite sheet 501 in manufacturing method 1.
In the manufacturing method 2, the step of manufacturing the second laminated composite sheet may be performed by the same method as the step of manufacturing the second laminated composite sheet in the manufacturing method 1.
In the manufacturing method 2, the step of manufacturing the third laminated composite sheet may be performed by the same method as the step of manufacturing the third laminated composite sheet in the manufacturing method 1.
In the manufacturing method 2, the step of performing pickup may be performed by the same method as the step of performing pickup of the manufacturing method 1.
In the manufacturing method 2 according to the embodiment of the present invention, since the supporting sheet 10 has the above-described configuration, even if the second laminated composite sheet 502 is cooled after heating the first laminated composite sheet 501 with the peripheral portion thereof stuck to the fixing jig, the influence of the slack of the third laminated composite sheet 503 can be eliminated, and the chip visibility of the pickup device can be improved.
< preparation method 3 >
The manufacturing method of the third embodiment is a manufacturing method of a chip with a resin film including a chip and a resin film provided on a back surface of the chip, the manufacturing method including:
a step of attaching the resin film-forming layer of the composite sheet for forming a resin film according to the embodiment of the present invention described above to the back surface of a workpiece, or attaching the resin film-forming layer of the kit 1 according to the embodiment of the present invention described above to the back surface of a workpiece, thereby producing a first laminated film in which the resin film-forming layer and the workpiece are laminated in the thickness direction thereof, and further attaching the adhesive layer of the support sheet of the kit 1 to the resin film-forming layer of the first laminated film, thereby producing a first laminated composite sheet in which the resin film-forming layer and the workpiece are laminated in this order on the support sheet in the thickness direction thereof;
a step of producing a fourth laminated composite sheet in which a plurality of chips with a resin film formation layer are fixed to the support sheet by dividing the work in the first laminated composite sheet on the support sheet and cutting the resin film formation layer;
heating and cooling the fourth laminated composite sheet in a state where a peripheral portion of the fourth laminated composite sheet is attached to a fixing jig, and solidifying the resin film-forming layer in the fourth laminated composite sheet to form the resin film, thereby producing a third laminated composite sheet in which a plurality of resin film-equipped chips are fixed to the support sheet;
and a step of separating the resin film-attached chip in the third laminated composite sheet from the support sheet to thereby perform pickup.
Hereinafter, in the present specification, the production method of the third embodiment may be referred to as "production method 3".
Fig. 9A to 9C and fig. 7D to 7E are sectional views for schematically explaining the manufacturing method 3. Here, the manufacturing method 3 will be described by taking, as an example, a case where the composite sheet 101 for forming a resin film of fig. 2 provided with the support sheet 10 shown in fig. 1 is used.
In the step of producing the first laminated composite sheet of the production method 3, as shown in fig. 9A, the resin film formation layer 13 in the composite sheet 101 for forming a resin film is attached to the back surface 9b of the workpiece 9, whereby the first laminated composite sheet 501 is produced in which the resin film formation layer 13 and the workpiece 9 are sequentially laminated on the support sheet 10 in the thickness direction thereof.
The first laminated composite sheet 501 in fig. 9A is the same as the first laminated composite sheet 501 in fig. 7A.
Next, in the step of manufacturing the fourth laminated composite sheet of manufacturing method 3, as shown in fig. 9B, the work 9 in the first laminated composite sheet 501 is divided on the support sheet 10, and the resin film forming layer 13 is cut. The work 9 is divided and singulated to form a plurality of chips 90.
The division of the work 9 and the cutting of the resin film forming layer 13 may be performed by a known method. For example, the work 9 and the resin film-forming layer 13 are divided by various kinds of dicing such as blade dicing, laser dicing by laser irradiation, or water dicing by jetting water containing an abrasive, and the resin film-forming layer 13 is cut along the outer periphery of the chip 90 regardless of the cutting method of the resin film-forming layer 13.
By dividing the work 9 and cutting the resin film-forming layer 13 in this manner, a plurality of chips 902 with a resin film-forming layer including the chip 90 and the resin film-forming layer (hereinafter, simply referred to as "resin film-forming layer") 130 after cutting provided on the back surface 90b of the chip 90 can be obtained. Reference numeral 130b denotes a surface (in this specification, may be referred to as "second surface") that is the second surface 13b of the resin film forming layer 13 in the resin film forming layer 130 after cutting.
In the above manner, in the step of manufacturing the fourth laminated composite sheet of manufacturing method 3, the fourth laminated composite sheet 504 in which the plurality of core sheets 902 with the resin film forming layer are fixed to the support sheet 10 is manufactured.
Next, in the step of manufacturing the third laminated composite sheet of the manufacturing method 3, as shown in fig. 9C, the fourth laminated composite sheet 504 is heated and cooled in a state where the peripheral portion of the fourth laminated composite sheet 504 is attached to the fixing jig 18 such as a ring frame, and then, as shown in fig. 7D, the resin film forming layer 130 in the fourth laminated composite sheet 504 is solidified to form the resin film 130'.
In manufacturing method 3, the third laminated composite sheet 503 is the same as the third laminated composite sheet 503 in manufacturing method 1.
In the manufacturing method 3, the step of performing pickup may be performed by the same method as the step of performing pickup of the manufacturing method 1.
In the manufacturing method 3 according to the embodiment of the present invention, since the supporting sheet 10 has the above-described configuration, even if the third laminated composite sheet 503 is cooled after heating in a state where the peripheral portion of the fourth laminated composite sheet 504 is attached to the fixing jig 18 such as a ring frame, the influence of the slack of the third laminated composite sheet 503 can be eliminated, and the chip recognition performance by the pickup device can be improved.
The description of the production method 3 thus far has described the production method 3 when the composite sheet 101 for forming a resin film provided with the support sheet 10 shown in fig. 2 is used, but in the production method 3, composite sheets for forming a resin film according to the present embodiment other than the composite sheet 101 for forming a resin film, such as the composite sheet 102 for forming a resin film, the composite sheet 103 for forming a resin film, or the composite sheet 104 for forming a resin film shown in fig. 3 to 5, may be used.
In the step of producing the first laminated composite sheet of the production method 3, the resin film forming layer 13 in the kit 1 is bonded to the back surface 9b of the workpiece 9 using the kit 1 shown in fig. 6, thereby producing a first laminated film 601 in which the resin film forming layer 13 and the workpiece 9 are laminated in the thickness direction thereof as shown in fig. 8, and the adhesive layer 12 of the support sheet 10 in the kit 1 is further bonded to the resin film forming layer 13 in the first laminated film 601, thereby producing the first laminated composite sheet 501.
Manufacturing method of substrate device (method of using chip with resin film)
The substrate device can be manufactured by the same method as the conventional method for manufacturing the substrate device, except that after the resin film-attached chip is obtained by the above-described manufacturing method, the resin film-attached chip is used instead of the conventional resin film-attached chip.
For example, when the resin film forming layer is a protective film forming film and the chip with the resin film is a chip with a protective film, a manufacturing method including the steps of: and a flip chip connection step of picking up the chip with the protective film obtained by forming the film using the protective film from the support sheet, and bringing the protruding electrodes on the chip with the resin film into contact with connection pads on the circuit board to electrically connect the protruding electrodes to the connection pads on the circuit board.
When the resin film-forming layer is a film-like adhesive and the chip with the resin film is a chip with a film-like adhesive, a production method comprising the steps of: and a connecting step of picking up the chip with the resin film forming layer obtained by using the film-like adhesive from a support sheet, and bonding the chip with the resin film obtained by the picking up step to a circuit board via the film-like adhesive.
Examples
The present invention will be described in more detail below with reference to specific examples. However, the present invention is not limited to the examples shown below.
[ example 1]
In example 1, the support sheet 10 shown in fig. 1 and the composite sheet 101 for forming a resin film shown in fig. 2 in which the resin film forming layer is a protective film forming film were manufactured in the following manner.
(1) Producing a first laminate including a protective film forming film
The following components (a) to (g) were mixed and diluted with methyl ethyl ketone so that the solid content concentration became 50 mass%, thereby preparing a composition for forming a protective film.
(a) Polymer composition: ( A (meth) acrylate copolymer (a copolymer obtained by copolymerizing 10 parts by mass of n-butyl acrylate, 70 parts by mass of methyl acrylate, 5 parts by mass of glycidyl methacrylate, and 15 parts by mass of 2-hydroxyethyl acrylate, having a weight average molecular weight: 80 ten thousand, glass transition temperature: 120 parts by mass (in terms of solid content, the same applies hereinafter) at-1 ℃ C )
(b-1) thermosetting component: 60 parts by mass of bisphenol A type epoxy resin (product name "jER828" manufactured by Mitsubishi Chemical Corporation, epoxy equivalent 184-194 g/eq)
(b-2) thermosetting component: bisphenol A type epoxy resin (product name "jER1055", epoxy equivalent 800-900 g/eq, manufactured by Mitsubishi Chemical Corporation) 10 parts by mass
(b-3) thermosetting component: 30 parts by mass of a dicyclopentadiene type epoxy resin (product name "EPICLON HP-7200HH" manufactured by DIC CORPORATION, epoxy equivalent 255 to 260 g/eq)
(c) Thermally active latent epoxy resin curing agent: dicyandiamide (manufactured by ADEKA CORPORATION: ADEKA HARDENER EH3636AS, active hydrogen equivalent 21 g/eq) 3 parts by mass
(d) Curing accelerator: 3 parts by mass of 2-phenyl-4, 5-dimethylol imidazole (product name "CURZOL 2PHZ" manufactured by SHIKOKU CHEMICALS CORPORATION)
(e) Filling: 290 parts by mass of a silica filler (product name "SC2050MA", average particle diameter: 0.5 μm, manufactured by Admatechs Co., ltd.)
(f) Colorant: carbon Black (manufactured by Mitsubishi Chemical Corporation, product name "# MA650", average particle diameter: 28 nm) 1.2 parts by mass
(g) Silane coupling agent: (Shin-Etsu Chemical Co., ltd., product name "KBM-403" manufactured by Ltd.) 2 parts by mass
A first release film (product name "SP-PET381031", manufactured by LINTEC Corporation) having a thickness of 38 μm and formed by forming a silicone-based release agent layer on one surface of a polyethylene terephthalate (PET) film, and a second release film (product name "manufactured by LINTEC Corporation") having a thickness of 38 μm and formed by forming a silicone-based release agent layer on one surface of a PET film were prepared
“SP-PET381130”)。
First, the above-described composition for forming a protective film was applied to the release surface of the first release film by a blade coater and dried, thereby forming a protective film-forming film having a thickness of 25 μm. Then, the release surface of the second release film was superimposed on the protective film forming film, and the two were bonded to each other, thereby obtaining a laminate composed of the first release film, the protective film forming film (thickness: 25 μm), and the second release film. The laminate is long and wound to form a roll-shaped wound body.
(2) Making a second laminate comprising a support sheet
The following components (h) and (i) were mixed and diluted with methyl ethyl ketone so that the solid content concentration became 25 mass%, thereby preparing an adhesive composition.
(h) An adhesion main agent: (meth) acrylate ester copolymer (copolymer obtained by copolymerizing 60 parts by mass of 2-ethylhexyl acrylate, 30 parts by mass of methyl methacrylate, and 10 parts by mass of 2-hydroxyethyl acrylate, weight average molecular weight: 60 ten thousand) 100 parts by mass
(i) A crosslinking agent: 20 parts by mass of a xylylene diisocyanate adduct of trimethylolpropane (manufactured by Mitsui Takeda Chemicals, inc., product name "TAKENATE D110N")
As the release film, a release film (manufactured by linetec corporation, product name) having a thickness of 38 μm and formed by forming a silicone-based release agent layer on one surface of a PET film was prepared
“SP-PET381031”)。
As a material for the base material of the support sheet, a polypropylene film 1 (thickness: 80 μm) having a no-load shrinkage ratio (elongation ratio of 12394123757575. The polypropylene film 1 was stretched at a temperature of 120 ℃ and a tension of 2N/m only in the MD direction for 1 minute to prepare a substrate. The measurement methods of the no-load expansion ratio, tensile elastic modulus and melting point are shown in test examples described later (the same applies hereinafter).
First, the above adhesive composition was applied to the release surface of the release film by a blade coater, and dried at 100 ℃ for 1 minute to form an adhesive layer having a thickness of 5 μm. Then, the substrate was bonded to the adhesive layer to obtain a second laminate composed of the support sheet of example 1 composed of the substrate and the adhesive layer and the release film. The laminate is long. Then, the laminate is wound to form a roll-shaped wound body.
(3) Production of a third laminate comprising an adhesive layer 16 for a jig
The following components (j) and (k) were mixed and diluted with toluene so that the solid content concentration was 15 mass%, thereby preparing an adhesive composition for a jig.
(j) A main adhesive agent: (meth) acrylate copolymer (copolymer obtained by copolymerizing 69.5 parts by mass of butyl acrylate, 30 parts by mass of methyl acrylate, and 0.5 part by mass of 2-hydroxyethyl acrylate, weight-average molecular weight: 50 ten thousand) 100 parts by mass
(k) A crosslinking agent: 5 parts by mass of a toluene diisocyanate based crosslinking agent (CORONATE L, manufactured by TOSOH CORPORATION)
First and second release films (manufactured by LINTEC corporation, product name) were prepared in which a silicone release agent layer was formed on one surface of a PET film to a thickness of 38 μm
"SP-PET 381031") and a polyvinyl chloride film (manufactured by Okamoto Industries, inc., thickness: 50 μm).
First, the above-described adhesive composition for a jig was applied to the release surface of the first release film by a blade coater and dried, thereby forming a first adhesive layer having a thickness of 5 μm. Then, the core material was bonded to the first adhesive layer to obtain a laminate a composed of the core material, the first adhesive layer, and the first release film. The laminate a is long, and is wound to form a roll-shaped wound body.
Next, the above adhesive composition for a jig was applied to the release surface of the second release film by a blade coater and dried, thereby forming a second adhesive layer having a thickness of 5 μm. Then, the exposed surface of the core material in the laminate a was bonded to the second adhesive layer, thereby obtaining a third laminate composed of the first release film/the first adhesive layer/the core material/the second adhesive layer/the second release film. The laminate is long and wound to form a roll-shaped wound body.
(4) Production of the fourth laminate
The second release film was peeled from the first laminate obtained in (1) above, and the protective film-forming film was exposed. On the other hand, the release film was peeled from the second laminate obtained in (2) above, and the adhesive layer was exposed. The first laminate and the second laminate are laminated so that the adhesive layer is in contact with the protective film forming film, thereby obtaining a fourth laminate in which a support sheet composed of a base material and an adhesive layer, a protective film forming film, and a first release film are laminated. The fourth laminate is long and wound to form a roll-shaped wound body.
(5) Production of composite sheet for Forming protective film
The second release film was peeled from the third laminate obtained in (3) above, leaving the first release film, and the inner periphery of the adhesive layer for a jig was half-cut (half cutting), and the inner circular portion was removed. In this case, the diameter of the inner periphery of the adhesive layer for a jig was 345mm.
The first release film was peeled from the fourth laminate obtained in the above (4), and the exposed protective film-forming film and the exposed adhesive layer for a jig of the third laminate were laminated and pressure-bonded. Then, the first release film in the third laminate was left, the outer periphery of the composite sheet for forming a protective film was half-cut, and the outer side portion was removed. At this time, the outer periphery of the composite sheet for forming a protective film had a diameter of 370mm.
In this way, a composite sheet for forming a protective film of example 1 was obtained, which was composed of a support sheet formed by laminating an adhesive agent layer (thickness: 5 μm) on a base material, a protective film forming film laminated on the adhesive agent layer side of the support sheet, an annular adhesive agent layer for a jig laminated on the peripheral portion of the protective film forming film on the side opposite to the support sheet, and a release film laminated on the side of the adhesive agent layer for a jig opposite to the protective film forming film. In the composite sheet for forming a protective film, the release film in the composite sheet for forming a protective film is continuously elongated, and the composite sheet for forming a protective film is wound into a roll shape with the release film as a support to form a wound body.
Examples 2 to 6 and comparative example 1
As a material for the base material of the support sheet, the polypropylene film 1 (thickness: 80 μm) was prepared. Then, a support sheet and a composite sheet for forming a protective film were produced by using the respective base materials in the same manner as in example 1 except that the polypropylene film 1 was subjected to a stretching treatment in the direction, temperature, time, and tension shown in table 1.
Comparative example 2
As a material of the base material of the back-up sheet, a polypropylene film 2 (thickness: 80 μm) having an unloaded modulus of elasticity of 100% in the MD direction/100% in the CD direction, a tensile modulus of elasticity of 450MPa in the MD direction/440 MPa in the CD direction, and a melting point of 155 ℃ was prepared. A base material, a support sheet, and a composite sheet for forming a protective film were produced in the same manner as in example 1, except that the polypropylene film 2 was subjected to stretching treatment for 1 minute at a temperature of 120 ℃ and a tension of 1N/m only in the MD direction.
Test example 1 measurement of No-load expansion/contraction ratio
The polypropylene films 1 and 2 used in examples and comparative examples were cut into a size of 22mm in the short side and 110mm in the long side so that the short side was in the CD direction and the long side was in the MD direction, respectively, and the cut pieces were used as test pieces in the MD direction. The test piece was marked at a measurement pitch of 100mm at the center in the longitudinal direction among the length 110mm, and a clip (clip) having a mass of 2.2g was attached to one end (5 mm portion of the end) in the longitudinal direction of the test piece.
The test piece was hung in an oven using a jig. After heating at 130 ℃ and 30% RH for 2 hours in the oven, the test piece was taken out of the oven and cooled to 23 ℃. Then, the marked measurement pitch of the test piece was measured again, and the unloaded ratio (%) of expansion and contraction of the base material was calculated based on the following formula.
No-load expansion ratio (%) = (measurement pitch after heating/measurement pitch before heating) × 100
The polypropylene films 1 and 2 used in examples and comparative examples were cut into a size of 22mm short side and 110mm long side so that the short side was MD direction and the long side was CD direction, respectively, and the cut pieces were used as test pieces in CD direction. The no-load expansion ratio (%) of the test piece in the CD direction was calculated in the same manner as described above.
[ test example 2] < determination of tensile elastic modulus >
The polypropylene films 1 and 2 used in examples and comparative examples were cut into test pieces of 15mm × 140mm, and the tensile modulus (Young's modulus) at 23 ℃ was measured in accordance with JIS K7127: 1999. Specifically, the tensile modulus (MPa) was measured by setting the distance between the chucks to 100mm using a tensile tester (manufactured by Shimadzu Corporation, product name "AUTOGRAPH AG-IS 500N") and then subjecting the test piece to a tensile test at a rate of 200 mm/min. The tensile modulus of elasticity was measured in both the MD direction and the CD direction of the substrate.
[ test example 3] < measurement of melting Point >
The melting points of the polypropylene films 1 and 2 used in examples and comparative examples were measured using a thermogravimetric analyzer (manufactured by PerkinElmer inc., product name "Pyris 1"). Specifically, the base material was heated at 10 ℃ per minute from 50 ℃ to 250 ℃ for DSC (differential scanning calorimetry) measurement, and the temperature at which an endothermic peak was observed was taken as the melting point.
[ test example 4] < relaxation evaluation >
The release film was peeled off from the composite sheet for forming a protective film produced in examples and comparative examples, and the obtained composite sheet for forming a protective film was attached to a silicon wafer (6000 mesh polished, diameter: 12 inches, thickness: 300 μm, mass: 50 g) and a ring frame (made of stainless steel, inner diameter 350 mm) as shown in fig. 7A. In this state, only the ring frame was held so that the silicon wafer surface was horizontal, and the protective film was formed by heating at 130 ℃ for 2 hours to solidify the protective film, and then cooled to room temperature.
Then, the difference (the amount of sinking; mm) between the height of the lower end face of the composite sheet for forming a protective film positioned on the lower side of the ring frame and the height of the lower end face of the composite sheet for forming a protective film positioned on the lower side of the silicon wafer was measured and evaluated as the sag. The evaluation criteria are as follows. The results are shown in Table 1.
A (Excellent): less than 1.2mm
B (good): 1.2mm or more and less than 3.0mm
C (poor): more than 3.0mm
As a result of the above evaluation, the composite sheets for forming a protective film of examples 1 to 6 were evaluated as a (excellent), and the composite sheets for forming a protective film of comparative examples 1 to 2 were evaluated as B (excellent).
[ test example 5] < thermomechanical analysis (TMA) >)
Test pieces in the form of strips 20mm long and 5mm wide were cut out from the support sheets of examples and comparative examples, with the MD direction being the longitudinal direction. Using a thermomechanical analyzer ("TMA-4000 SA", manufactured by BRUKER AXS corporation), the rate of separation between chucks: 15mm, load: 0.8g, rate of temperature rise: the temperature was increased from 23 ℃ to 130 ℃ at 10 ℃/min and maintained for 30 minutes. Then, with the load: 0.8g, cooling rate: cooling from 130 ℃ to 50 ℃ at 1 ℃/min. In 1s -1 Measuring the amount of displacement [ mu m ] during the period]。
Test pieces in the form of a strip having a length of 20mm and a width of 5mm were cut out from the support sheets of examples and comparative examples with the CD direction being the longitudinal direction. Similarly, using a thermomechanical analyzer ("TMA-4000 SA", manufactured by BRUKER AXS), the rate of change in the chuck spacing: 15mm, load: 0.8g, rate of temperature rise: the temperature was increased from 23 ℃ to 130 ℃ at 10 ℃/min and maintained for 30 minutes. Then, with the load: 0.8g, cooling rate: cooling from 130 ℃ to 50 ℃ at 1 ℃/min.
In 1s -1 Measuring the amount of displacement [ mu m ] in the period]。
The average displacement (A) per 1 ℃ at a temperature of 60 ℃ to 130 ℃ was determined by the following procedure 60→130 ) Average displacement per 1 ℃ with respect to the temperature rise from 23 ℃ to 130 ℃ (A) 23→130 ) Ratio of (A) [ (A) 60→130 )/(A 23→130 )]。
The average displacement (A) per 1 ℃ at a temperature of from 23 ℃ to 130 ℃ was determined by the following formula 23→130 )。
A 23→130 ＝(A 130 -A 23 )/107＝A 130 /107[μm/℃]
The average displacement (A) per 1 ℃ at a temperature of 60 ℃ to 130 ℃ was determined by the following formula 60→130 )。
A 60→130 ＝(A 130 -A 60 )/70[μm/℃]
Displacement at 23 ℃ (A) 23 )＝0μm
Amount of Displacement at 60 ℃ (A) 60 )[μm]
Displacement at 130 ℃ (A) 130 )[μm]
The average displacement per 1 ℃ when slowly cooled from 130 ℃ to 50 ℃ was determined by the following formula (B) 130→50 )。
B 130→50 ＝(B 50 -B 130 )/80[μm/℃]
The absolute value (| B) of the average displacement per 1 ℃ when slowly cooled from 130 ℃ to 50 ℃ was obtained by the following equation 130→50 |)。
|B 130→50 |＝|B 50 -B 130 |/80[μm/℃]
Displacement after 30 minutes at 130 ℃ (B) 130 )[μm]
Amount of displacement at 50 ℃ after Slow Cooling (B) 50 )[μm]
Determining the average displacement (A) 23→130 ) Subtracting an absolute value (| B) of the average displacement amount 130→50 L) to obtain a value [ (A) 23→130 )-|B 130→50 |]。
The evaluation results of the thermomechanical analysis (TMA) described above are shown in table 1.
Here, [ (A) in the "conveyance direction (MD) is obtained 23→130 )-|B 130→50 |]Value of (A) 'minus' the vertical direction (CD) [ (A) 23→130 )-|B 130→50 |]The absolute value of the obtained value is referred to as "balance evaluation value of MD and CD". The calculation results are shown in table 1.
The balance evaluation value of MD and CD is preferably 3.0 or less, more preferably 2.5 or less, further preferably 2.0 or less, and particularly preferably 1.8 or less. By making the balance evaluation value of MD and CD small, the possibility that the support sheet or the composite sheet for forming a resin film will peel off from the fixing jig after heating and cooling and fall off from the fixing jig as a starting point can be reduced.
[ test example 6] < evaluation of chip discrimination >
(production of semiconductor chip with protective film)
A protective film-forming film side surface of a composite sheet for forming a protective film was attached to a polished surface of a silicon wafer (6000 mesh polished, diameter: 12 inches, thickness: 300 μm, mass: 50 g) by a film applicator (product name: adwill (registered trademark) RAD2500 manufactured by LINTEC Corporation), a first laminated composite sheet was formed by laminating the protective film-forming film and the silicon wafer in this order on a support sheet in the thickness direction thereof, and the peripheral edge portion of the first laminated composite sheet was fixed to a ring frame for dicing wafer (stainless steel, inner diameter: 350 mm) (FIG. 7A). Next, only the ring frame was held so that the silicon wafer surface was horizontal, the protective film was cured by heating at 130 ℃ for 2 hours in an oven manufactured by ESPEC corp (fig. 7B), a second laminated composite sheet was formed in which the protective film and the silicon wafer were laminated in this order on the support sheet in the thickness direction thereof, and the second laminated composite sheet was cooled to 23 ℃ (fig. 7C).
Next, using a cutting device (manufactured by DISCO Corporation, DFD 6361), at a cutting speed: 30mm/s, rotation speed: 40000rpm, the silicon wafer and the protective film were cut into a chip size of 3mm × 3mm on the support sheet, and a third laminated composite sheet in which a plurality of chips with protective films were fixed to the support sheet was formed (fig. 7D). The amount of incision during cutting was set to 20 μm into the backup sheet. The cutting blade used was ZH05-SD2000-D1-90 CC manufactured by DISCO Corporation.
Using a pick-up and die bonding apparatus ("beam D-510" manufactured by Canon Machinery inc.), chip recognition was performed on 500 chips by an automatic tracing function, and a case where all of the 500 chips were recognizable was evaluated as a (good) and a case where the number of recognizable chips was less than 500 was evaluated as B (bad). The results are shown in Table 1.
Likewise, using a cutting device (manufactured by DISCO Corporation, DFD 6361), the cutting rate: 30mm/s, rotation speed: 40000rpm, the silicon wafer and the protective film were cut into a chip size of 3mm × 1.5mm on the support sheet, and a third laminated composite sheet in which a plurality of chips with protective films were fixed to the support sheet was formed (fig. 7D). The amount of incision during cutting was set to 20 μm into the backup sheet.
Similarly, using a pick-up and die bonding apparatus ("beam D-510" manufactured by Canon Machinery inc.), chip recognition was performed on 500 chips by an automatic tracing function, and a case where all of the 500 chips were recognizable was evaluated as a (good) and a case where the number of recognizable chips was less than 500 was evaluated as B (bad). The results are shown in Table 1.
When the chips were cut into a chip size of 3mm × 3mm and chip discrimination was evaluated, the number of chips that could be recognized was 500 and B (defective) in each of comparative examples 1 to 2, whereas the number of chips that could be recognized was 500 and A (excellent) in each of examples 1 to 6.
When the chips were diced into chip sizes of 3mm × 1.5mm and chip discrimination was evaluated, the number of chips recognized was 500 and evaluated as "a" (good), whereas the number of chips recognized was 500 and evaluated as "B" (bad) in comparative examples 1 and 2, and examples 4 and 6.
Industrial applicability
The present invention is applicable to the manufacture of various substrate devices including semiconductor devices.
Claims (17)
1. A support sheet for heating a workpiece or a chip obtained by dividing the workpiece,
when the support sheet is subjected to thermomechanical analysis (TMA) in a stretching mode in either a conveyance direction (MD) or a perpendicular direction (CD) under the following conditions,
displacement at 130 ℃ (A) 130 ) Is less than 500 mu m in the weight ratio,
average displacement per 1 ℃ when increasing the temperature from 23 ℃ to 130 ℃ (A) 23→130 ) Absolute value (| B) of the average displacement per 1 ℃ when slowly cooled from 130 ℃ to 50 DEG C 130→50 I) is small, and,
< Condition of thermomechanical analysis (TMA) >
Sample size: length 20mm, width 5mm
Chuck spacing: 15mm
Heating from 23 ℃ to 130 ℃ under the conditions that the load is 0.8g and the heating speed is 10 ℃/min, and keeping for 30 minutes; then, the mixture was cooled from 130 ℃ to 50 ℃ under the conditions of a load of 0.8g and a cooling rate of 1 ℃/min; the amount of displacement [ μm ] during this period was measured.
2. The support sheet according to claim 1,
under the conditions, when the support sheet is subjected to thermomechanical analysis (TMA) in a transport direction (MD) stretching mode and a vertical direction (CD) stretching mode,
displacement at 130 ℃ (A) 130 ) All the particles are less than 500 mu m in diameter,
average displacement per 1 ℃ when increasing the temperature from 23 ℃ to 130 ℃ (A) 23→130 ) All than 1 ℃ when slowly cooled from 130 ℃ to 50 ℃Absolute value of average displacement (| B) 130→50 |) small.
3. The support sheet according to claim 1 or 2,
under the conditions, when the support sheet is subjected to thermomechanical analysis (TMA) in a stretching mode in either a conveyance direction (MD) or a perpendicular direction (CD),
average displacement per 1 ℃ at a temperature of from 23 ℃ to 130 ℃ (A) 23→130 ) Positive values.
4. The support sheet of claim 3,
under the conditions, when the support sheet is subjected to thermomechanical analysis (TMA) in a transport direction (MD) stretching mode and a vertical direction (CD) stretching mode,
average displacement per 1 ℃ when increasing the temperature from 23 ℃ to 130 ℃ (A) 23→130 ) Are all positive values.
5. The support sheet according to claim 3 or 4,
under the conditions, when the support sheet is subjected to thermomechanical analysis (TMA) in a stretching mode in either of a transport direction (MD) or a perpendicular direction (CD),
average displacement per 1 ℃ at a temperature of 60 ℃ to 130 ℃ (A) 60→130 ) Average displacement per 1 ℃ with respect to the temperature rise from 23 ℃ to 130 ℃ (A) 23→130 ) Is less than 1.
6. The support sheet of claim 5,
under the conditions, when the support sheet is subjected to thermomechanical analysis (TMA) in a transport direction (MD) stretching mode and a perpendicular direction (CD) stretching mode,
average displacement per 1 ℃ at a temperature of 60 ℃ to 130 ℃ (A) 60→130 ) Average displacement per 1 ℃ with respect to the temperature rise from 23 ℃ to 130 ℃ (A) 23→130 ) The ratios of (A) to (B) are all less than 1.
7. The support sheet according to any one of claims 1 to 6, which is composed of a base material alone, or which is provided with a base material and an adhesive layer provided on one surface of the base material, wherein a constituent material of the base material contains a polyolefin resin.
8. The support sheet according to any one of claims 1 to 7, which is composed of only a base material, or which is provided with a base material and an adhesive layer provided on one surface of the base material, wherein the base material is a stretched film.
9. A support sheet according to any one of claims 1 to 8, wherein the support sheet is roll-shaped.
10. A composite sheet for forming a resin film, comprising the support sheet according to any one of claims 1 to 8 and a resin film-forming layer provided on one surface of the support sheet.
11. The composite sheet for forming resin film according to claim 10, wherein the resin film forming layer is a protective film forming film.
12. The composite sheet for forming resin film according to claim 10 or 11, wherein the composite sheet for forming resin film is in a roll shape.
13. A kit, comprising: a first laminate formed by sequentially laminating a first release film, a resin film-forming layer, and a second release film; and the support sheet according to any one of claims 1 to 9 for supporting a work to be attached to the resin film-forming layer and the resin film-forming layer.
14. The kit according to claim 13, wherein the resin film-forming layer is a protective film-forming film.
15. A kit according to claim 13 or 14, wherein the first laminate is in the form of a roll.
16. A method for manufacturing a chip with a resin film, which includes a chip and a resin film provided on the back surface of the chip, the method comprising:
a step of attaching the resin film forming layer of the composite sheet for forming a resin film according to any one of claims 10 to 12 to the back surface of a workpiece, or attaching the resin film forming layer of the kit according to any one of claims 13 to 15 to the back surface of a workpiece, thereby producing a first laminated film in which the resin film forming layer and the workpiece are laminated in the thickness direction thereof, and further attaching a support sheet of the kit to the resin film forming layer of the first laminated film, thereby producing a first laminated composite sheet in which the resin film forming layer and the workpiece are laminated in this order on the support sheet in the thickness direction thereof;
a step of heating the first laminated composite sheet in a state where a peripheral portion of the first laminated composite sheet is attached to a fixing jig, and curing the resin film-forming layer to form the resin film, thereby producing a second laminated composite sheet in which the resin film and the workpiece are sequentially laminated on the support sheet in a thickness direction thereof;
a step of producing a third laminated composite sheet in which a plurality of chips with resin films are fixed to the support sheet by cooling the second laminated composite sheet, then dividing the work in the second laminated composite sheet on the support sheet, and cutting the resin films; and
and a step of separating the resin film-attached chip in the third laminated composite sheet from the support sheet to thereby perform pickup.
17. A method for manufacturing a chip with a resin film, which includes a chip and a resin film provided on the back surface of the chip, the method comprising:
a step of attaching the resin film-forming layer of the composite sheet for forming a resin film according to any one of claims 10 to 12 to the back surface of a workpiece, or attaching the resin film-forming layer of the kit according to any one of claims 13 to 15 to the back surface of a workpiece, thereby producing a first laminated film in which the resin film-forming layer and the workpiece are laminated in the thickness direction thereof, and further attaching a support sheet of the kit to the resin film-forming layer of the first laminated film, thereby producing a first laminated composite sheet in which the resin film-forming layer and the workpiece are laminated in this order in the thickness direction thereof on the support sheet;
a step of producing a fourth laminated composite sheet in which a plurality of chips each having a resin film-forming layer are fixed to the support sheet by dividing the work in the first laminated composite sheet on the support sheet and cutting the resin film-forming layer;
heating and cooling the fourth laminated composite sheet in a state where a peripheral portion of the fourth laminated composite sheet is attached to a fixing jig, and solidifying the resin film-forming layer in the fourth laminated composite sheet to form the resin film, thereby producing a third laminated composite sheet in which a plurality of resin film-equipped chips are fixed to the support sheet; and
and a step of separating the resin film-attached chip in the third laminated composite sheet from the support sheet to thereby perform pickup.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-062255 | 2021-03-31 | ||
| JP2021062255A JP2022157810A (en) | 2021-03-31 | 2021-03-31 | Support sheet, composite sheet for resin film formation, kit, and manufacturing method of chip with resin film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115141571A true CN115141571A (en) | 2022-10-04 |
Family
ID=83405009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210129766.4A Pending CN115141571A (en) | 2021-03-31 | 2022-02-11 | Support sheet, composite sheet for forming resin film, kit, and method for manufacturing chip with resin film |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2022157810A (en) |
| KR (1) | KR20220136089A (en) |
| CN (1) | CN115141571A (en) |
| TW (1) | TW202241713A (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102378063B1 (en) | 2014-05-23 | 2022-03-23 | 린텍 가부시키가이샤 | Composite sheet for forming protective film |
| KR102355108B1 (en) | 2014-06-10 | 2022-01-24 | 린텍 가부시키가이샤 | Dicing sheet |
-
2021
- 2021-03-31 JP JP2021062255A patent/JP2022157810A/en active Pending
-
2022
- 2022-01-19 TW TW111102125A patent/TW202241713A/en unknown
- 2022-02-04 KR KR1020220014926A patent/KR20220136089A/en unknown
- 2022-02-11 CN CN202210129766.4A patent/CN115141571A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW202241713A (en) | 2022-11-01 |
| JP2022157810A (en) | 2022-10-14 |
| KR20220136089A (en) | 2022-10-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102152605B1 (en) | Holding membrane forming film | |
| KR101492629B1 (en) | Adhesive composition, adhesive sheet and production process for semiconductor device | |
| KR101370245B1 (en) | Adhesive composition, adhesive sheet and production process for semiconductor device | |
| JP6239498B2 (en) | Resin film forming sheet for chips | |
| KR20130105435A (en) | Adhesive composition, adhesive sheet and method for manufacturing semiconductor device | |
| KR20100061390A (en) | Semiconductor chip laminate and adhesive composition for semiconductor chip lamination | |
| US8247503B2 (en) | Adhesive composition and adhesive sheet | |
| JPWO2014155756A1 (en) | Adhesive sheet, composite sheet for forming protective film, and method for producing chip with protective film | |
| JP2020017758A (en) | Composite sheet for forming protective film | |
| KR20160039197A (en) | Adhesive composition, adhesive sheet, and method for producing semiconductor device | |
| WO2014142151A1 (en) | Composite sheet for protective film formation, method for producing composite sheet for protective film formation, and method for producing chip with protective film | |
| JP5743638B2 (en) | Protective film forming film and chip protective film forming sheet | |
| KR20170029416A (en) | Protective membrane forming film | |
| KR102140470B1 (en) | Sheet for forming resin film for chips and method for manufacturing semiconductor device | |
| CN115141571A (en) | Support sheet, composite sheet for forming resin film, kit, and method for manufacturing chip with resin film | |
| JP5727811B2 (en) | Semiconductor chip pickup method and semiconductor device manufacturing method | |
| JP5234594B2 (en) | Adhesive composition, adhesive sheet and method for producing semiconductor device | |
| JP2015180735A (en) | Film for forming protective film and sheet for forming chip protective film | |
| JP7540884B2 (en) | Kit and method for producing third laminate using said kit | |
| JP7540885B2 (en) | Kit and method for producing third laminate using said kit | |
| WO2022210087A1 (en) | Filmy adhesive, dicing/die bonding sheet, method for producing semiconductor device, use of filmy adhesive, use of dicing/die bonding sheet, and method for reworking semiconductor wafer | |
| CN115136294A (en) | Composite for forming back surface protective film, method for producing first laminate, method for producing third laminate, and method for producing semiconductor device with back surface protective film | |
| KR20230139763A (en) | Resin film-forming composite sheet, kit, and method for manufacturing workpiece with resin film | |
| CN115141568A (en) | Support sheet, composite sheet for forming resin film, kit, and method for manufacturing chip with resin film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |