CN115118798A - Thermal components and foldable electronics - Google Patents

Abstract

The application provides a heat dissipation assembly and a foldable electronic device. This heat dissipation assembly includes: the first part and the second part are connected through the foldable part, a cooling liquid flow passage is arranged inside the foldable part and the first part and the second part, cooling fluid is sealed in the cooling liquid flow passage, and the first part or the foldable part is provided with a cooling liquid inlet and a cooling liquid outlet which are communicated with the cooling liquid flow passage; and the piezoelectric ceramic pump is communicated with the cooling liquid flow passage and is provided with a pumping-in port connected with the cooling liquid outlet and a pumping-out port connected with the cooling liquid inlet. The heat dissipation assembly can accelerate the flow of cooling fluid in the cooling liquid flow channel through the piezoelectric ceramic pump, so that the heat transfer between the cooling fluid is accelerated, the cooling fluid with uniform temperature is finally obtained, and the rapid heat dissipation, the uniform temperature and the size miniaturization are realized.

Description

Thermal components and foldable electronics

technical field

The present application relates to the technical field of electronic devices, and in particular, to heat dissipation assemblies and foldable electronic devices.

Background technique

With the development of electronic technology, electronic devices, especially terminal electronic consumer products, have more and more requirements for thinness and portability. The advent of the 5G era also puts forward new requirements for the heat dissipation function of electronic equipment. Specifically, the power consumption of terminal electronic equipment in the 4G era is usually around 4W, and heat can be effectively dissipated by passive heat dissipation (natural convection). With the advent of 5G, when the power consumption of personal terminal electronic products exceeds 5W, in addition to using high thermal conductivity materials such as graphite, improving the temperature uniformity of electronic devices is also an important means to improve the heat dissipation performance of electronic devices. In particular, when there are multiple heat sources (such as batteries and motherboards) in an electronic device, the temperature of the electronic device at the heat source may be significantly higher than that at other locations, so the temperature average is also an important aspect to improve the heat dissipation performance of the electronic device. However, in some application scenarios, for example, the conventional temperature uniformity method will encounter some problems in the use of notebook computers and folding mobile phones. Specifically, the temperature of the back of the screen of the notebook computer is relatively low, and the heat source is mainly concentrated. On the main board below the keyboard, the main board and the screen are connected through a hinge, and none of the current temperature equalization methods in the related art can conduct heat to the screen through the hinge.

Therefore, there is still room for improvement in the existing technologies related to temperature equalization of electronic devices.

SUMMARY OF THE INVENTION

In one aspect of the present application, the present application provides a heat dissipation assembly. The heat dissipation assembly includes: a first part and a second part, the first part and the second part are connected by a foldable part, the foldable part, the first part and the second part There is a cooling liquid flow channel inside the cooling liquid flow channel, a cooling fluid is sealed in the cooling liquid flow channel, and the first part or the foldable part has a cooling liquid inlet and a cooling liquid outlet communicated with the cooling liquid flow channel; and a pressure an electric ceramic pump, the piezoelectric ceramic pump is communicated with the cooling liquid flow channel, the piezoelectric ceramic pump has a pumping port and a pumping output port, the pumping port is connected with the cooling liquid outlet, the A pump outlet port is connected to the coolant inlet. The heat dissipation component can accelerate the flow of the cooling fluid in the cooling liquid flow channel through the piezoelectric ceramic pump, thereby accelerating the heat transfer between the cooling fluids, and finally obtaining a cooling fluid with uniform temperature, thereby realizing rapid heat dissipation, uniform temperature and miniaturization in size.

In yet another aspect of the present application, the present application provides a foldable electronic device. The foldable electronic device includes: a casing, the interior of the casing defines an accommodating space, the interior of the accommodating space has a main board and a display screen, and the casing includes a first sub-casing and a second sub-casing, The first sub-shell and the second sub-shell are connected by a folded part; and the heat dissipation assembly described above. Because the foldable electronic device has the aforementioned heat dissipation component with better temperature uniformity, the phenomenon of local overheating will not occur during use, and the user experience is better.

Description of drawings

FIG. 1 shows a schematic plan view of a heat dissipation assembly of the present application.

FIG. 2 shows a schematic cross-sectional structure diagram of the heat dissipation assembly in FIG. 1 along the dotted line in FIG. 1 .

FIG. 3 shows a schematic plan view of a first component of the present application.

FIG. 4 shows a schematic plan view of another heat dissipation assembly of the present application.

FIG. 5 shows a schematic structural diagram of the heat dissipation assembly in FIG. 4 when it is folded.

FIG. 6 shows a schematic structural diagram of yet another heat dissipation assembly of the present application.

FIG. 7 shows a schematic cross-sectional structure diagram of a partial structure of yet another heat dissipation assembly of the present application.

FIG. 8 shows a schematic plan view of a partial structure of another heat dissipation assembly of the present application.

FIG. 9 shows a schematic structural diagram of a piezoelectric ceramic pump of the present application.

FIG. 10 shows a schematic structural diagram of another piezoelectric ceramic pump of the present application.

FIG. 11 shows a schematic structural diagram of another piezoelectric ceramic pump of the present application.

FIG. 12 shows a schematic structural diagram of yet another piezoelectric ceramic pump of the present application.

FIG. 13 shows a schematic structural diagram of another heat dissipation assembly of the present application.

FIG. 14 shows a partial structural schematic diagram of another heat dissipation assembly of the present application.

FIG. 15 shows a partial enlarged view of a part of the structure of the heat dissipation assembly of the present application.

FIG. 16 shows a partial structural schematic diagram of still another heat dissipation assembly of the present application.

FIG. 17 shows a partial structural schematic diagram of still another heat dissipation assembly of the present application.

FIG. 18 shows a schematic flow chart of a method of manufacturing a heat dissipation component of the present application.

FIG. 19 shows a partial schematic flow diagram of a method for manufacturing a heat dissipation component of the present application.

FIG. 20 shows a schematic structural diagram of yet another piezoelectric ceramic pump of the present application.

FIG. 21 shows a schematic structural diagram of a one-way valve diaphragm of the present application.

FIG. 22 shows a schematic diagram of a part of the structure of an electronic device of the present application.

Reference number:

10: Cooling liquid flow channel 11, 12: Third through hole 21: Pump inlet port 22: Pump outlet port 80: Barrier layer 110: First cover 120: Second cover 130: Separator 140: Barrier structure 150: Coolant inlet and coolant outlet 151: Coolant inlet 152: Coolant outlet 170: Camera through hole 200: Piezoelectric ceramic pump 201: First side 202: Second side 203: Fifth side 204: Sixth side 205: Third side 206: Fourth side 207: First edge line 208: Second edge line 209: Third edge line 210: Fourth edge line 211: Fifth edge line 212: Sixth edge line 213: Seventh edge line 214: Eighth edge line 220: Support plate 230: Base 240: Fluid accommodation space 241: First check valve 242: Second check valve 251: Piezoelectric ceramic sheet 252: Check valve upper cover 253: Check valve Diaphragm 2531: Hollow area 2532: Solid part 254: One-way valve lower cover 302: First sub-screen 303: First sub-case 305: Second sub-screen 306: Second sub-case 307: Folding parts 308, 309 : Middle frame structure A: The first part B: The second part C, C ₁ , C ₂ : The foldable part 1: The first liquid inlet 2: The first liquid outlet 3: The second liquid inlet 4: The second Liquid outlet p: gap D: the shortest distance from any point on the first side to any point on the second side

Detailed ways

In one aspect of the present application, the present application provides a heat dissipation assembly. Referring to FIG. 1 , FIG. 2 and FIG. 3 , the heat dissipation assembly includes: a first part A and a second part B (it should be understood that in the description of this application, the terms "first" and "second" are only used for The purpose of description is not to be interpreted as indicating or implying relative importance or the number of technical features indicated.Therefore, the features defined with "first" and "second" can explicitly or implicitly include one or More such features, which will not be repeated in the following text), the first part A and the second part B are connected by foldable parts C ₁ , C ₂ , the foldable parts C ₁ , C 2 , C ₂ , the first part A and the second part B have cooling liquid flow passages 10 in the inside, the cooling liquid flow passages 10 are sealed with cooling fluid, and the first part A has the cooling liquid The cooling liquid inlet and the cooling liquid outlet (not marked in the figure, and those skilled in the art can understand that the foldable part may also have a cooling liquid inlet and a cooling liquid outlet) communicated with the liquid flow channel 10, and there is no need for too much here. and the piezoelectric ceramic pump 200, the piezoelectric ceramic pump 200 communicates with the cooling liquid flow channel 10 (in addition, the specific location of the piezoelectric ceramic pump 200 is not particularly limited, for example, refer to FIG. 1. The piezoelectric ceramic pump 200 may be provided on the first component A; of course, those skilled in the art can understand that the piezoelectric ceramic pump may also be provided on other components, which are not described here. Excessive description), the piezoelectric ceramic pump 200 has a pump-in port 21 and a pump-out port 22, the pump-in port 21 is connected to the coolant outlet, and the pump-out port 22 is connected to the coolant inlet connected. By arranging the foldable parts C ₁ , C ₂ , and arranging the cooling liquid flow channel 10 inside the foldable parts C ₁ , C ₂ , and setting the cooling inside the foldable parts C ₁ , C ₂ The liquid flow channel 10 communicates with the cooling liquid flow channel 10 provided inside the first part A and the second part B, so that the cooling fluid can flow through the first part A and the second part B. Part B, and then the heat dissipating assembly can effectively realize the temperature equalization and heat dissipation function between the first part A and the second part B under the premise of being foldable, thereby helping to improve the heat dissipation performance of the electronic device utilizing the heat dissipating assembly; and , the heat dissipation component can accelerate the flow of the cooling fluid in the cooling liquid flow channel through the piezoelectric ceramic pump, thereby speeding up the heat transfer between the cooling fluids, and finally obtaining a cooling fluid with uniform temperature, thereby realizing rapid heat dissipation, uniform temperature, and size miniaturization .

Further, it can be understood that the cooling liquid flow channels 10 arranged inside the foldable parts C ₁ and C ₂ , referring to FIG. 1 , can be arranged in a specific manner along the flow direction of the cooling fluid (the The flow direction of the cooling fluid is the direction of the arrow shown in FIG. 1, which will not be repeated in the following text), and the foldable member is sequentially provided with a first liquid inlet 1 and a first liquid outlet 2 (set on the foldable part _C1 ), a second liquid inlet 3 and a _second liquid outlet 4 (arranged on the foldable part C2), wherein the first liquid inlet 1 and the The second liquid outlet 4 is connected to the first part A, and the first liquid outlet 2 and the second liquid inlet 3 are connected to the second part B. Therefore, the heat dissipation assembly can better realize the flow of the cooling fluid in the cooling liquid flow channel 10 , and further effectively realize the function of temperature uniformity and heat dissipation under the premise of realizing foldability.

Further, the specific implementation of the foldable parts C ₁ and C ₂ is not particularly limited. For example, in some examples of the present application, referring to FIG. 4 , the foldable parts C ₁ and C ₂ may include mutual A first hose and a second hose are arranged in parallel, one end of the first hose is configured as the first liquid inlet, and the other end is configured as the first liquid outlet; One end is configured as the second liquid inlet, and the other end is configured as the second liquid outlet. With the above arrangement of the first hose and the second hose, the structure is simple and easy to implement. At the same time, since the first hose and the second hose both have good bendability, they can be more flexible under the action of stress. Good elastic deformation occurs, and further the flow of the cooling fluid in the cooling liquid flow channel 10 can be further realized, and further the function of uniform temperature and heat dissipation can be effectively realized on the premise of realizing foldable. It can be understood that the specific types of the first hose and the second hose are not particularly limited, for example, they can be plastic tubes, rubber tubes, silicone tubes, etc., which are widely available, easy to obtain, and low in cost. And can better achieve the above-mentioned function of bending.

It can be understood that the arrangement of the first hose and the second hose may be either perpendicular to the edge of the first component or the second component, or not perpendicular; for this, the applicant has After extensive research, it was found that, referring to FIG. 4 , when the cooling liquid flow channel 10 located inside the foldable parts C ₁ , C ₂ , the cooling liquid flow channel 10 located inside the first part A, and the cooling liquid flow channel 10 located inside the first part A and the When the cooling liquid flow channel 10 inside the second part B is in the same plane, if the complementary angle of the angle between the first hose and the edge of the first part A is an acute angle, the first The complementary angle between the two hoses and the edge of the second part B is an acute angle; or the complementary angle between the first hose and the edge of the second part B is an acute angle, and the The complementary angle of the included angle between the second hose and the edge of the first component A is an acute angle (for example, the acute angle may be ∠a shown in FIG. The deformation amount of the first hose and the second hose during the bending process is further effectively reduced, thereby reducing the stress on the cooling liquid flow channel 10, and the folding effect of the heat dissipation assembly is better. In the heat dissipation assembly, refer to Figure 5:

The first part A has a first surface 201 and a second surface 202;

When the cooling liquid flow channel inside the foldable part, the cooling liquid flow channel inside the first part A and the cooling liquid flow channel inside the second part B are in the same When in plane, the second part B has a third surface 205 and a fourth surface 206;

When the second part is folded towards a certain direction, it has a fifth surface 203 and a sixth surface 204;

When the cooling liquid flow channel inside the foldable part, the cooling liquid flow channel inside the first part A and the cooling liquid flow channel inside the second part B are in the same When in a plane, and when the cooling liquid flow channel located inside the foldable part is perpendicular to the edge of the first part A and the edge of the second part B, the cooling liquid flow channel has a first edge line 207 and the second edge line 208;

When the cooling liquid flow channel inside the foldable part, the cooling liquid flow channel inside the first part A and the cooling liquid flow channel inside the second part B are in the same In the plane, and when the complementary angle of the angle between the cooling liquid flow channel inside the foldable part and the edge of the first part A and the edge of the second part B is an acute angle (for example, in FIG. 5 ) ∠α), the cooling liquid flow channel has a third edge line 209 and a fourth edge line 210;

When the second part is folded towards a certain direction, and the cooling liquid flow channel inside the foldable part is perpendicular to the edge of the first part A and the edge of the second part B, the cooling liquid flow channel has a fifth edge line 211 and a sixth edge line 212;

When the second part is folded towards a certain direction, the angle between the cooling liquid flow channel inside the foldable part and the edge of the first part A and the edge of the second part B When the complementary angle of φ is an acute angle, the cooling liquid flow channel has a seventh edge line 213 and an eighth edge line 214,

When the second part B is folded with a radius r, let r=L/π, assuming that the depth δ of the cooling liquid flow channel remains unchanged during the folding process, the length of the first edge line 207 of the cooling liquid flow channel is pulled grows to π·(r+δ), at this time, the length change rate of the cooling liquid flow channel is

And when the complementary angle of the angle between the cooling liquid channel located inside the foldable part and the edge of the first part A and the edge of the second part B is an acute angle, the third edge line 209 and the The length of the four edge line 210 is: π·r/cosα, and further,

The length of the aforementioned seventh edge line 213 is π·r/cosα;

The length of the aforementioned eighth edge line 214

The length change rate of the eighth edge line 214 is then

and

Therefore, when the complementary angle of the angle between the cooling liquid channel located inside the foldable part and the edge of the first part A and the edge of the second part B is an acute angle, the folding process can be effectively reduced. The stretch ratio of the cooling liquid flow channel in the middle, thereby reducing the damage to the foldable part during folding.

It can be understood that, in other examples of the present application, referring to FIG. 6 , the foldable parts C ₁ and C ₂ include a first rotary joint and a second rotary joint, and the water inlet hole of the first rotary joint is configured into the first liquid inlet, the water outlet hole of the first rotary joint is configured as the first liquid outlet; the water inlet hole of the second rotary joint is configured as the second liquid inlet, the The water outlet hole of the second rotary joint is configured as the second liquid outlet. It can be understood that the specific types of the first rotary joint and the second rotary joint are not particularly limited. For example, the diameters of the first rotary joint and the second rotary joint may be between 2 mm and 10 mm. (specifically, it can be 2mm, 4mm, 6mm, 8mm, 10mm, etc.); the size of the inlet and outlet can be the same as the diameter of the cooling liquid flow channel; the first rotary joint and the second rotary joint can all be made of stainless steel , so that it does not cause leakage or rotational jamming due to different expansion coefficients of materials at different temperatures; in addition, the gaskets in the first rotary joint and the second rotary joint can be chemically stabilized by using silicone rubber and the like material, thereby reducing the corrosion of the gasket by the cooling fluid. In addition, the first rotary joint and the second rotary joint can also be directly selected from conventional rotary joints in the related art, and other specific structures of the first rotary joint and the second rotary joint can also be related to the related art. The structure of the conventional rotary joint is not repeated here. Through the above arrangement, the folding of the foldable parts C ₁ , C ₂ is stable and durable, has high reliability, and has a small friction coefficient, and the cooling liquid flow channels inside the foldable parts C ₁ , C ₂ are not prone to leakage, and wear-resistant In addition, the first rotary joint and the second rotary joint can also play the role of connecting the first part A and the second part B, so that the first part A and the second part B can be connected. The stability of the second part B when folded in the direction indicated by the arrow in FIG. 6 is good.

It can be understood that, in some other examples of the present application, referring to FIG. 3 , FIG. 7 and FIG. 8 , the foldable part C, the first part A and the second part B may also be integrally formed . Further, referring to FIG. 8 , the specific arrangement of the foldable portion C may be that the first board portion has a first edge (not shown in the figure) facing the second board portion, and the second board portion The part has a second edge (not shown in the figure) facing the first plate part, the foldable part C connects part of the first edge and part of the second edge, and the first edge is not There is a gap p between the part connected by the foldable part and the part of the second edge not connected by the foldable part C. In this way, since the part where the cooling liquid flow path does not exist is removed from the substrate on which the first member A and the second member B are integrally formed, the foldable member C that is easy to bend and fold is formed, and the The bending stress at the folded part C is relatively small, so the heat dissipation component can better realize the function of heat dissipation of temperature uniformity under the premise of realizing foldability.

Specifically, on the substrate forming the integrally formed first part A and the second part B, the pattern design of the cooling liquid flow channel 10 is not particularly limited, as long as it is ensured that there is no cooling liquid flow channel on the substrate. After removing this part, a foldable part C that is easy to bend and fold can be formed. The specific pattern of the cooling liquid flow channel 10 can be flexibly selected by those skilled in the art according to the specific application scene of the heat dissipation component. This will not be repeated here.

Further, the specific implementation manner of the foldable part C is not particularly limited. For example, in some examples of the present application, the thickness of the foldable part C may be no greater than 0.6 mm. It is 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm or 0.6mm, etc., therefore, the foldable part C has good bending resistance, and is easy to fold and not easily damaged; In an example, the foldable part C may also have a first side edge and a second side edge (not marked in the figure), and the first side edge and the second side edge both have a Edge and both ends of the second edge (not marked in the figure), the shortest distance D between any point on the first side edge and any point on the second side edge is not less than 3mm, specifically , can be 1mm, 2mm or 3mm, etc., thus, the foldable part C has better bending resistance and is easy to be applied in electronic equipment, and the cooling liquid flow channel 10 can also have a relatively suitable width, and the uniform temperature The effect is also better; in addition, in some other examples of the present application, the material for forming the foldable part C may include plastic, and specifically may be polyethylene terephthalate (PET). The folding part C has good bending resistance, is easy to fold, is not easy to be damaged, has a wide range of materials, is easy to obtain, and has low cost; with reference to FIG. The connecting parts of the first edge and the second edge are respectively located at one end of the first edge and the second edge (not marked in the figure), so that the foldable part C is easy to form and easy to industrialize Production.

The other components of the first component and the second component will be described in detail below according to specific examples of the present application:

According to some examples of the present application, referring to FIG. 9 , the structure of the piezoelectric ceramic pump is not particularly limited, for example, the piezoelectric ceramic pump may include: a piezoelectric vibrating membrane, and the piezoelectric vibrating membrane includes a piezoelectric ceramic sheet 251 and a piezoelectric ceramic A support plate that is in contact with each other, the surface of the piezoelectric ceramic sheet 251 has electrodes that can generate an electric field, and the electric field can control the piezoelectric ceramic sheet 251 to oscillate; and a valve body structure, the valve body structure is arranged on the piezoelectric vibrating membrane and the first part. or between the foldable parts, and can control one of the pump inlet port and the pump outlet port to open and the other to close. By utilizing the piezoelectric ceramic pump with low power consumption, small size, easy assembly, etc., a heat dissipation component with better temperature uniformity performance can be obtained.

According to a specific example of the present application, referring to FIGS. 10 , 11 and 12 , the piezoelectric ceramic pump may include a piezoelectric diaphragm, a base 230 and a valve body structure, and the piezoelectric diaphragm includes a piezoelectric ceramic sheet 251 and a piezoelectric ceramic The support plate 220 that is in contact with the sheets has electrodes on the surface of the piezoelectric ceramic sheet (not shown in the figure) that can generate an electric field, and the electric field can control the piezoelectric ceramic sheet 251 to oscillate. Specifically, two opposite surfaces of the piezoelectric ceramic sheet 251 may have two electrodes, and under the condition of electrification, the piezoelectric ceramic sheet may be placed in an electric field. As a result, a controlled oscillation of the piezoelectric ceramic sheet can be achieved to generate power for the cooling liquid to flow. The support plate 220 is located between the piezoelectric ceramic sheet and the base 230, for example, the support plate can be a stainless steel plate. The thickness of the support plate can be relatively thin, and can play a certain role in supporting the piezoelectric ceramic sheet and increasing the amplitude. For example, the support plate and the piezoelectric ceramic sheet can be closely attached together, and the overall thickness of the two can be about 0.2 mm. The base 230 is located on the side of the support plate away from the piezoelectric ceramic sheet, and may specifically include a side wall surrounding the support plate and a bottom surface connected to the side wall. The pump-out port is located on the surface of the base on the side away from the support plate, whereby the base defines a fluid-accommodating space 240 between the pump-in port, the bottom surface where the pump-out port is located, and the support plate, so that another fluid-accommodating space can be utilized. The vibration of the piezoelectric ceramic sheet on the side provides the power to pump in and out the fluid in the fluid containing space. That is to say, the base needs to define a cavity structure for the piezoelectric ceramic pump, and the overall thickness of the base part can be about 2 mm. The valve body structure is arranged inside the fluid accommodating space, and can control one of the pump inlet port and the pump outlet port to be opened and the other to be closed. The specific structure of the valve body structure is not particularly limited, as long as the pumping-in and pumping-out of the cooling liquid in the fluid accommodating space can be controlled cyclically. For example, referring to FIGS. 10 , 11 and 12 , the valve body structure may include two one-way valves arranged in the second direction (the first one-way valve 241 and the second one-way valve 242 as shown in the figures), The one-way valve is located at the pump inlet port and the pump outlet port, the two one-way valves open in opposite directions, and the one-way valve completely covers the opening connected to the pump inlet port and the pump outlet port. Thus, when the piezoelectric ceramic sheet oscillates in the first direction, the one-way valve opened in the first direction is opened, and the one-way valve opened in the second direction is closed. When the piezoelectric ceramic sheet is next oscillating, that is, when the second direction oscillates, the one-way valve opened in the first direction is closed, and the one-way valve opened in the second direction is opened. In this way, the cooling fluid can enter the interior of the fluid accommodating space from the pumping port, and flow out of the accommodating space from the pumping port, so as to realize the circulating flow of the cooling liquid. The inlet and outlet directions of the coolant are shown by arrows in FIG. 11 and FIG. 12 .

According to other examples of the present application, referring to FIG. 9 , FIG. 20 and FIG. 21 , the composition of the valve body structure is not particularly limited, and the one-way valve diaphragm 253 is configured to oscillate with the oscillation of the piezoelectric ceramic sheet 251 , The other parts of the valve body structure have through holes corresponding to the cooling liquid inlet and the cooling liquid outlet. The above through holes cooperate with the hollow area in the one-way valve diaphragm 253 to sequentially control the opening of the cooling liquid inlet and the cooling liquid outlet. closed, and the cooling liquid inlet is closed while the cooling liquid outlet is opened, thereby realizing the pumping in and pumping out of the cooling liquid.

Specifically, referring to FIGS. 20 and 21 , the valve body structure may include a one-way valve upper cover 252 , a one-way valve diaphragm 253 , and a one-way valve lower cover 254 . And the piezoelectric ceramic pump may also have a base 230 to provide a space for cooling fluid to circulate inside the piezoelectric ceramic pump. The one-way valve lower cover 254 may also have two through holes, one large and one small. The projection of the large upper through hole on the lower one-way valve cover 254 is the position of the small through hole on the lower one-way valve cover 254 , and the projection of the small through hole on the upper one-way valve cover 252 on the lower one-way valve cover 254 is the position of the large through hole on the lower cover 254 of the one-way valve. The one-way valve diaphragm 253 can be an elastic film with a thickness of about 0.005mm, and has two hollow areas 2531 with the same shape, and each of the two hollow areas 2531 has a solid part 2532, and the solid part 2532 is in the one-way valve. The orthographic projections on the upper cover 252 and the lower check valve cover 254 can both cover the small through holes on the upper check valve cover 252 and the lower check valve cover 254 . The one-way valve diaphragm 253 of the valve body structure can oscillate in the first direction or in the negative direction with the oscillation of the piezoelectric ceramic plate 251 . Therefore, when the one-way valve diaphragm vibrates in the first direction, the one-way valve diaphragm moves toward the side of the one-way valve upper cover, and the solid part at this time blocks the small through hole of the one-way valve upper cover, while the The hole is not completely covered. At this time, the flow channel on the side of the large through hole on the upper cover of the one-way valve is opened, and the flow channel on the side of the small through hole is closed. Conversely, when the one-way valve diaphragm vibrates in the second direction, the one-way valve diaphragm moves toward the side of the one-way valve lower cover, and the solid part at this time blocks the small through hole of the one-way valve lower cover, while the large through hole If it is not completely covered, the flow channel on the side of the large through hole on the upper cover of the one-way valve is closed, and the flow channel on the side of the small through hole is opened.

Specifically, referring to FIG. 9 and FIG. 21 , since the piezoelectric ceramic pump in this embodiment of the present application is directly disposed on the first component, the plate structure of the first component can be used to provide the piezoelectric vibrating membrane and the valve body structure. Support, which acts as a base for the pump body. Moreover, the thinning of the piezoelectric ceramic pump can be further realized by designing the positions and sizes of the cooling liquid inlet and the cooling liquid outlet. Specifically, for example, the valve body structure may only include the one-way valve upper cover 252 and the one-way valve membrane 253, and the one-way valve upper cover 252 and the one-way valve membrane 253 may be bonded together by means of adhesive. The one-way valve upper cover 252 has a first through hole and a second through hole, the area of the first through hole is larger than that of the second through hole, and the one-way valve diaphragm 253 is located on the one-way valve upper cover 252 and the first component In between, the one-way valve diaphragm 253 is configured to oscillate with the oscillation of the piezoelectric ceramic sheet 251 , and the one-way valve diaphragm 253 has two hollow regions 2531 with the same shape, and each of the two hollow regions 2531 has one The solid part 2532, the orthographic projection of the solid part 2532 on the upper cover of the one-way valve, is located at the first through hole and the second through hole, and the orthographic projections of the first through hole and the second through hole on the liquid cooling plate are respectively It is located at the cooling liquid inlet 151 and the cooling liquid outlet 152, and the orthographic projection of the first through hole on the first component completely covers one of the cooling liquid inlet and the cooling liquid outlet 150, and the orthographic projection of the second through hole on the first component It is located in another range of the cooling liquid inlet and the cooling liquid outlet 150, and the orthographic projection of the solid part corresponding to the second through hole on the one-way valve upper cover 252 completely covers the second through hole, and is connected to the first through hole. The orthographic projection of the solid part corresponding to the hole on the liquid cooling plate completely covers one of the cooling liquid inlet and the cooling liquid outlet 150 .

The one-way valve diaphragm 254 of the valve body structure can oscillate in the first direction or in the negative direction with the oscillation of the piezoelectric ceramic plate 251 . Therefore, when the one-way valve diaphragm vibrates in the first direction, the one-way valve diaphragm moves toward the side of the one-way valve upper cover, and the solid part at this time blocks the second through hole of the one-way valve upper cover, and The first through hole is not completely covered. At this time, the flow channel on the side of the first through hole on the upper cover of the one-way valve is opened, and the flow channel on the side of the second through hole is closed. On the contrary, when the one-way valve diaphragm vibrates in the second direction, the one-way valve diaphragm moves toward the side away from the upper cover of the one-way valve, that is, toward the side of the first part, and the solid part at this time covers the first part. One of the cooling liquid inlet and the cooling liquid outlet corresponding to the first through hole on the first part, and the other one of the cooling liquid inlet and the cooling liquid outlet corresponding to the second through hole on the first part is not completely covered, at this time The flow channel on the side of the first through hole of the upper cover of the one-way valve is closed, and the flow channel on the side of the second through hole is opened. In this way, the lower cover of the check valve can be omitted and the base of the pump body can be used to reduce the thickness of the piezoelectric ceramic pump.

Specifically, the thickness range of the piezoelectric diaphragm of the thinned piezoelectric ceramic pump can be 0.15-0.25mm, the thickness range of the upper cover of the one-way valve can be 0.17-0.23mm, and the thickness range of the one-way valve diaphragm can be is 0.03-0.07mm, and the total thickness of the piezoelectric ceramic pump can range from 0.35-0.55mm.

According to some examples of the present application, when the cover (the first cover or the second cover) on the side of the piezoelectric ceramic pump is provided on the liquid cooling plate, it has better elasticity, and can follow the piezoelectricity of the piezoelectric ceramic pump. When the ceramic sheet is deformed, the cover (the first cover or the second cover) on the side of the piezoelectric ceramic pump on the liquid cooling plate can be used to directly act as the lower cover of the one-way valve, which is conducive to further thinning the valve. The overall thickness of the heat sink assembly.

In order to facilitate understanding, the following briefly describes the principle that the heat dissipation assembly can achieve the above beneficial effects:

The first part and the second part are used as a heat dissipation component of the electronic device, and can be used for internal heat dissipation or heat exchange with an external cold source, so as to help the electronic device to maintain a lower operating temperature. Through direct contact with the heat source, the energy of the heat source enters the cooling fluid through the casing of the first part, and the cooling fluid is driven by the liquid pump to bring the heat to the low temperature area flowing through, passing through the casing of the first part and the second part through the natural Convection or forced cooling is carried away from the electronic equipment. The heat dissipation components in the prior art are usually rigid and inflexible metal materials. Although the thermal conductivity of metal materials is relatively high, it is more conducive to the transmission of heat in the heat dissipation components. The most significant part is that the first part made of metal is large, and there is not enough space in the electronic device to place it, and the metal material will cause shielding and interference to the radio frequency antenna of the electronic device, affecting the operation stability of the electronic device.

In this application, the inventor uses a piezoelectric ceramic pump as the driving pump for the cooling fluid. The size of the micro piezoelectric ceramic pump is much smaller than that of the traditional mechanical pump, and the working current is extremely low due to the extremely poor conductivity of the piezoelectric ceramic itself. Therefore, the driving power of the piezoelectric ceramic pump is extremely low, usually in the order of tens of milliwatts, and its small size and low energy consumption are convenient for its installation on electronic equipment. In addition, the piezoelectric ceramic pump also abandons the electromagnetic coil in the traditional liquid pump, and will not cause any electromagnetic interference to the electronic equipment, which is beneficial to improve the operation stability of the equipment. In this application, referring to FIG. 13 , FIG. 14 and FIG. 17 , the inventor directly processes the cooling liquid flow channel 10 on the cover (the first cover or the second cover) by etching, laser, machining, etc. , so as to form a communication channel on the cover body (the first cover body or the second cover body), and seal the cooling fluid, such as water or organic liquid, inside the cooling fluid flow channel, and install the piezoelectric ceramic pump 200 At any position in the cooling liquid flow channel 10, the cooling fluid is used to drive the cooling fluid to flow in the cooling liquid flow channel 10, and finally an ultra-thin, low-cost, easy-to-assemble, low-electromagnetic interference device with better temperature uniformity is obtained. housing assembly.

According to some examples of the present invention, in order to prevent the cooling liquid from directly circulating between the pump inlet port and the pump outlet port without passing through the cooling liquid flow channel, a liquid short circuit occurs, referring to FIGS. 15 and 16 , the cooling liquid flow channel may further include a blocking structure 140, the cooling liquid inlet and the cooling liquid outlet are arranged adjacently, and the blocking structure 140 is located between the cooling liquid inlet and the cooling liquid outlet to divide the cooling liquid flow channel into a water supply area and a return water area, and one side of the water supply area is connected to the cooling liquid inlet. , the return water area is connected with the cooling liquid outlet, and the water supply area and the return water area are connected on the side away from the cooling liquid inlet. The cooling liquid flow channel is divided into a water supply area and a return water area by the arrangement of the blocking structure, and then the cooling fluid flow rate can be accelerated by the arrangement of the piezoelectric ceramic pump, and the temperature uniformity performance of the heat dissipation component can be improved. Specifically, when the liquid cooling plate has the structure as shown in FIGS. 14 and 15 , the blocking structure 140 may be a rib to space the cooling liquid inlet from the cooling liquid inlet. That is, the cooling liquid inlet and the cooling liquid outlet may be located on the upper and lower sides of the blocking structure 140 shown in FIG. 14 . Taking the water outlet of the pump near the camera through hole 170 in FIG. 14 as an example, at this time, the cooling fluid pumped by the piezoelectric ceramic pump flows in the area of the first cover body near the camera through hole 170, because the blocking structure 140 The existence of the water inlet and the water outlet are spaced apart, and the cooling fluid pumped by the pump outlet will not be directly sucked into the pump by the pressure of the water inlet of the pump without passing through the upper part of the structure of the first cover. The cooling fluid can flow into the lower part of the first cover at the lower part of the camera through hole 170 , and after flowing through the complete cooling liquid flow channel, it can circulate from the water inlet of the pump. The flow direction of the cooling liquid in the cooling liquid flow channel may be shown by arrows in FIG. 14 .

Alternatively, referring to FIG. 15 , the blocking structure 140 may also be a gap between the cooling liquid inlet and the cooling liquid outlet. The gap can be convex, which can also prevent the cooling fluid pumped from the outlet of the pump from passing through the upper structure of the first cover body and being directly sucked into the pump by the pressure of the water inlet of the pump. In this way, the cooling fluid can be sucked in by the pump for the next cycle after flowing through the entire cooling liquid channel.

Specifically, the flow direction of the cooling fluid in the cooling liquid flow channel may be shown by arrows in FIG. 16 .

According to some examples of the present application, referring to FIGS. 14 and 16 , the width and arrangement of the cooling liquid flow channels are not particularly limited. For example, the cooling liquid flow channels may be S-shaped, and the flow direction of the cooling fluid is shown as an arrow in the figure. As shown, when the water supply area and the return water area are both S-shaped, the flow path of the cooling fluid in the corresponding area is the longest, so the heat exchange time between the fluids is the longest, and the heat exchange effect is the best, which helps to obtain uniform temperature. The cooling fluid further improves the temperature uniformity of the heat dissipation components.

According to some examples of the present application, the depth of the cooling liquid flow channel is not particularly limited, for example, the depth of the cooling liquid flow channel may not be less than 25 microns. When the depth of the cooling liquid flow channel is less than 25 microns, the volume of the cooling fluid in the cooling liquid flow channel is less, and the cooling effect is not enough to meet the usage requirements.

According to some examples of the present application, in order to ensure that the piezoelectric ceramic pump has a sufficient head to form the flow rate of the cooling fluid with a sufficient flow rate for heat dissipation, the volume of the piezoelectric ceramic pump and the cooling liquid flow channel is not particularly limited, such as piezoelectric ceramic pump. The volume of the ceramic pump and the cooling liquid flow channel may be configured so that the flow rate of the cooling liquid in the cooling liquid flow channel reaches not less than 0.5 mL/min. When the flow rate of the cooling liquid in the cooling liquid flow channel is less than 0.5 mL/min, the cooling fluid (such as water, etc.) medium will not be able to effectively dissipate the heat of the heat source. Specifically, the inventor found that at least one of the thickness H and the diameter D of the piezoelectric ceramic sheet in the piezoelectric ceramic pump needs to satisfy the requirements of: 0.1mm≤H≤0.5mm; 3mm≤D≤12mm. Specifically, the piezoelectric ceramic sheet can oscillate under the action of an electric field, and the mechanical oscillation can provide the power to flow the cooling liquid. Generally, the upper and lower surfaces of the piezoelectric ceramic sheet are coated with conductive materials (used to form electrodes). ) sheet, the material and size of the piezoelectric ceramic sheet determine the power that the piezoelectric ceramic pump can provide. The specific material of the piezoelectric ceramic sheet is not particularly limited, for example, it may be a zirconium-based ceramic. Those skilled in the art can understand that, for electronic equipment, the area of the heat dissipation component should not be too small, otherwise the heat cannot be effectively distributed from the heat source to the area outside the heat source, that is, the size of the heat dissipation component should at least cover the electronic equipment. At least one heat source in the heat source, and a non-heat source area with a sufficiently large area outside the heat source. The inventor found that in terms of the volume of commonly used electronic devices (such as mobile terminals such as mobile phones, PAD, and notebook computers, etc.), the thickness of the piezoelectric ceramic sheet is not less than 0.1mm and not more than 0.5mm, and the diameter is not less than 3mm and not more than 0.5mm. In the case of more than 12mm, it can not only provide enough power for the heat dissipation component to ensure that the flow rate of the cooling liquid sealed in the heat dissipation component is not less than 0.5mL/min, but also ensure that the volume and weight of the heat dissipation component are moderate, which can be easily placed in electronic equipment.

According to some examples of the present application, in order to further enhance the buffering effect of the fluid at the pumping port, the cooling liquid flow channel adjacent to the cooling liquid inlet and the cooling liquid outlet may have a buffer section, and the width of the buffer section may be larger than that at the non-buffer section. The width of the coolant passage.

That is to say, by increasing the cross-sectional area (that is, the width direction) of the cooling liquid flow channel at the junction of the pump-in and pump-out ports of the piezoelectric ceramic pump and the first or second cover body, The cooling fluid pumped out or pumped in can be further buffered. Specifically, the width of the buffer section may be at least twice the width of the cooling liquid flow channel at the non-buffer section.

According to some examples of the present application, referring to FIG. 13 , the first part and the second part independently include a first cover body 110 and a second cover body 120 arranged opposite to each other, and the cooling liquid flow channel 10 is sealed to the first cover body 110 and the second cover body 120 . Between the second covers 120, the materials for forming the first cover and the second cover are not particularly limited, for example, the materials for forming the first cover and the second cover may independently include polyester, polyimide At least one of amine, polymethyl methacrylate, polyethylene, polyvinyl chloride, polystyrene, ceramic, and glass. For example, both the first cover and the second cover may be hard covers. When the materials of the first cover and the second cover are at least one of plastic and glass, the plastic and glass materials have strong plasticity. , it is convenient to prepare heat dissipation components with different morphologies and structures, which is helpful to further improve the applicable scope of the heat dissipation components. Further, after obtaining the aforementioned heat dissipation assembly with a temperature uniformity effect, the heat dissipation assembly can be directly attached to the back cover of the existing electronic device, that is, attached to the back cover of the electronic device as an externally mounted heat dissipation assembly. , which helps to further improve the application range of the heat dissipation component, and the external heat dissipation component effectively prevents the cooling fluid from entering the electronic equipment after vaporization, causing water to enter the electronic equipment, thereby causing damage to the electronic components inside the electronic equipment. . When the materials for forming the first cover and the second cover are the above-mentioned organic materials, the first cover and the second cover have good bending resistance, which is beneficial to reduce the difficulty of processing and molding of the heat dissipation component and improve the its scope of application.

According to some examples of the present application, the cooling liquid flow channel formed between the first cover body and the second cover body, and the specific shape of the cooling liquid flow channel are not particularly limited, as long as the cooling fluid can be sealed and the cooling fluid can be The circulating flow can be carried out under the power provided by the piezoelectric ceramic pump. For example, referring to FIG. 13 , the side of the first cover 110 facing the second cover 120 may have a first groove, the side of the second cover 120 facing the first cover 110 may have a second groove, the first The groove and the second groove form the cooling liquid flow channel 10, that is to say, the first cover and the second cover may have non-penetrating grooves, and the shape of the first groove and the second groove Consistently, after the first cover body and the second cover body are sealed, the two together form a cooling liquid flow channel. Meanwhile, referring to FIG. 3 , the first cover body or the second cover body may further have third through holes 11 and 12 penetrating the first cover body or the second cover body, the third through holes are connected with the first groove and the first cover body. The cooling liquid flow channels formed by the two grooves communicate with each other, the third through hole is configured as a cooling liquid inlet and a cooling liquid outlet, and the piezoelectric ceramic pump is arranged on the cover body on the side of the first component with the through hole. According to some examples of the present application, the thickness of the first cover body at the first groove and the thickness of the second cover body at the second groove are independently not less than 25 microns.

According to some examples of the present application, the cooling liquid flow channel formed between the first cover body and the second cover body, and the specific shape of the cooling liquid flow channel are not particularly limited, as long as the cooling fluid can be sealed and the cooling fluid can be The circulating flow can be carried out under the power provided by the piezoelectric ceramic pump. For example, referring to FIG. 16 , one of the first cover body and the second cover body may have a groove on one surface, and the groove and the other of the first cover body 110 and the second cover body 120 form a cooling liquid flow channel.

According to some examples of the present application, referring to FIGS. 17 and 19 , the cooling liquid flow channel 10 is formed between the first cover body 110 and the second cover body 120 , and the specific shape of the cooling liquid flow channel 10 is not particularly limited, as long as The cooling fluid can be sealed, and the cooling fluid can be circulated under the power provided by the piezoelectric ceramic pump 200 . For example, a partition 130 may be further provided between the first cover and the second cover, the partition 130 has a hollow pattern, the hollow pattern constitutes a cooling liquid flow channel, and the first cover or the second cover has two through-holes on the first cover or the second cover. The third through hole of the first cover body or the second cover body communicates with the cooling liquid flow channel formed by the hollow pattern, and the third through hole is configured as a cooling liquid inlet and a cooling liquid outlet. According to some examples of the present application, the material for forming the separator may be the same as the material for forming the first cover or the second cover, that is, the material for forming the separator may be polyester, polyimide, polymethylmethacrylate At least one of ester, polyethylene, polyvinyl chloride, polystyrene, ceramic and glass.

As mentioned above, the materials for forming the first cover, the second cover and the separator are not particularly limited, and each independently includes polyester, polyimide, polymethyl methacrylate, polyethylene, polyvinyl chloride , at least one of polystyrene, ceramics and glass, so the first part formed by the sealing process of the first cover body and the second cover body or the sealing process of the first cover body, the second cover body and the separator The first part and the second part formed can obtain a rigid first part and a second part or a flexible first part and a second part according to the different materials used, that is, the first part and the second part and the piezoelectric The heat dissipation component formed by the combination of the ceramic pump can be rigid or flexible.

According to some examples of the present application, when the material forming at least one of the first cover body and the second cover body is a flexible material, the heat dissipation assembly may further include: a water-oxygen barrier film, the water-oxygen barrier film is located on the cover formed of the flexible material The side of the body away from the cooling liquid flow channel, specifically, the above-mentioned flexible material may be a polymer material.

In another aspect of the present application, the present application provides a method of fabricating the aforementioned heat dissipation assembly. The method includes: providing a first part and a second part connected by a foldable part, and making the inside of the foldable part, the first part and the second part form cooling liquid flow passages in communication with each other , a cooling fluid is sealed in the cooling liquid flow channel, and a cooling liquid inlet and a cooling liquid outlet communicated with the cooling liquid flow channel are formed on the first part or the foldable part; a piezoelectric ceramic pump is provided, and The piezoelectric ceramic pump is communicated with the cooling liquid flow channel, the piezoelectric ceramic pump has a pumping port and a pumping outlet, the pumping port is connected with the cooling liquid outlet, and the pumping port is connected with the cooling liquid inlet to obtain the heat dissipation assembly. This method can easily obtain the aforementioned heat dissipation assembly.

It can be understood that the method may specifically include the following operation steps:

S100: Provide a first component and a second component connected by a foldable component (it should be noted that the following will specifically take providing the first component as an example for description).

It will be appreciated that the first part and the second part are provided in this step. As mentioned above, the materials and structures of the first component and the second component are not particularly limited, as long as the first component and the second component have sealed and communicating cooling liquid flow channels.

For example, referring to FIG. 18 , providing the first part may include: first, forming a first groove on one side of the first cover body and forming a second groove on one side of the second cover body. The materials of the first cover body and the second cover body have been described in detail above, and will not be repeated here. It should be noted that, since the first cover body and the second cover body need to be sealed in the subsequent process to form a closed space, the areas of the first cover body and the second cover body need to be the same. Specifically, the first groove and the second groove may be formed by etching the cover body. Specifically, the etching process may include, but is not limited to, photolithography, laser, direct writing, etc. The barrier layer 80 is formed on the surface of the cover body by spin coating, spray coating or film coating, and then the barrier layer can be etched on the barrier layer by means of photolithography, laser, direct writing, etc., so that the etched barrier layer 80' Covering a part of the surface of the plate 110 ′ for forming the cover and exposing the positions where the grooves need to be formed, the exposed cover material is removed by dry etching, wet etching or machining, and the removal depth can be precisely control, so that the first groove or the second groove can be formed. In this step, an operation of forming a through third through hole 11 on the cover may also be included, for example, two through holes may be formed, and the through holes may constitute a cooling liquid inlet communicated with the cooling liquid flow channel and a cooling liquid outlet (not shown in the figure).

After the etching is completed, the remaining barrier layer on the surface of the cover body is cleaned and removed to obtain the first cover body 110 or the second cover body. The first groove and the second groove can be formed in the same manner, and then the first cover body and the second cover body can be aligned and sealed by the alignment mark or with the assistance of the alignment machine. For covers formed of plastic materials, such as covers formed of polymer materials, the sealing process can be selected from solderless welding such as thermal bonding and laser sealing, or sealing with interface agents such as gluing and interlayer bonding. . After completing the sealing and passing the leak test, the temperature uniformity plate body can be obtained.

Alternatively, referring to FIG. 19 , instead of forming grooves on the first cover body and the second cover body, a partition plate is provided, and a hollow pattern is formed on the partition plate, and a cooling liquid flow channel is formed based on the hollow pattern. Specifically, the material 80 for forming the barrier layer may be first etched, and then the barrier layer 80' is used to form the hollow pattern 10 penetrating the separator plate 130', thereby obtaining the separator 130. The hollow pattern is a connected curved figure. The operation of etching the separator can be consistent with the aforementioned operation of forming the first groove and the second groove, the difference is that when the separator is etched, the etching depth may not be controlled to form a penetrating barrier. The hollow pattern of the board is enough. Subsequently, a through hole penetrating the cover body may be formed on the first cover body or the second cover body, so as to form a cooling liquid inlet and a cooling liquid outlet. Finally, the separator is sealed between the first cover and the second cover to form the first component. At this time, the thickness of the partition plate is the depth of the cooling liquid flow channel, and the depth of the formed cooling liquid flow channel can be controlled by controlling the thickness of the partition plate.

In addition, it can be understood that the specific manner in which the foldable component is connected with the first component and the second component in the present application may adopt conventional connection methods in the related art, for example, may be rivets, shaft connections, welding or using Threaded joints are used for connection, etc. Of course, as mentioned above, the foldable part, the first part and the second part may also be integrally formed, which will not be repeated here.

S200: Set the piezoelectric ceramic pump.

It can be understood that, in this step, the piezoelectric ceramic pump may be disposed on one side of the first component. Specifically, the piezoelectric ceramic pump can be installed at the interfaces reserved for the first component, that is, at the coolant inlet and the coolant outlet, and the interfaces are sealed by dispensing, welding, or the like. The structure and working mode of the piezoelectric ceramic pump have been described in detail above, and will not be repeated here.

Thereby, the aforementioned heat dissipation assembly can be easily obtained. The method can obtain a heat dissipation component with a thinner overall thickness, and the design of the piezoelectric ceramic pump and the first and second components can ensure that the cooling fluid inside the first and second components can have a certain flow rate to meet the temperature uniformity requirements. cooling needs. In addition, the processing method of the heat dissipating assembly body is simple, and the production cost is low, which is favorable for realizing large-scale and large-scale production.

In another aspect of the present application, the present application provides a foldable electronic device. The foldable electronic device includes: a casing, the interior of the casing defines an accommodation space, and the interior of the accommodation space is provided with a main board (not shown in the figure) and a display screen. Referring to FIG. 22 , the casing includes a first a sub-shell 303 and a second sub-shell 306, the first sub-shell 303 and the second sub-shell 306 are connected by a folded part 307; and the aforementioned heat dissipation assembly (not shown in the figure) Shows). Because the foldable electronic device has the aforementioned heat dissipation component with better temperature uniformity, the phenomenon of local overheating will not occur during use, and the user experience is better.

Further, it can be understood that when the foldable part in the heat dissipation assembly includes a first rotary joint and a second rotary joint, since the first rotary joint and the second rotary joint can serve to connect the first rotary joint The function of the part A and the second part B, so the first rotary joint and the second rotary joint can be independently constructed as the folding part; of course, the folding part can also include a rotating shaft, the second rotary joint The sub-housing 306 can rotate relative to the first sub-housing 303 along with the rotating shaft, and at this time, the first rotating joint and the second rotating joint are arranged inside the rotating shaft.

Further, it can be understood that when the foldable part in the heat dissipation assembly includes a first hose and a second hose arranged in parallel with each other, the foldable part includes a rotating shaft, and the second sub-housing 306 can As the rotating shaft rotates relative to the first sub-housing 303 , the first hose and the second hose are disposed inside the rotating shaft.

Further, it can be understood that the electronic device may also include components in other conventional electronic devices in the related art and middle frame structures 308 and 309 that play a structural support role, the specific structures of which are the same as those of the electronic device in the related art. The structure is the same as that of , and will not be repeated here.

Further, it can be understood that the specific position of the heat dissipation assembly in the electronic device is not particularly limited, for example, the heat dissipation assembly can be disposed inside the electronic device, such as between the battery and the screen. Alternatively, the heat dissipation assembly can also be arranged at the housing of the electronic device. The heat dissipating assembly has self-supporting performance and is thin, so the setting position can be reasonably designed according to the situation of the internal components of the electronic device. Those skilled in the art can understand that the heat dissipation component has a piezoelectric ceramic pump, so an external circuit is required to control the operation of the heat dissipation component. Therefore, the electrodes in the piezoelectric ceramic pump of the heat dissipation assembly can be electrically connected to the main board, and specifically, the electrodes in the piezoelectric ceramic pump that can generate an electric field can be connected to the main board through metal elastic sheets. Thereby, the control of the piezoelectric ceramic pump can be easily realized.

Specifically, referring to FIG. 22, the display screen includes a first sub-screen 302 and a second sub-screen 305, the first sub-screen 302 is located inside the first sub-casing 303, and the second sub-screen 305 is located inside the second sub-case 306, and the first part and the second part in the heat dissipation assembly satisfy any one of the following: the first part is arranged in the first sub-case close to the first part; On the surface of a sub-screen, the second component is disposed on the surface of the second sub-shell close to the second sub-screen; the first component is disposed on the first sub-shell close to the first sub-screen On the surface of a sub-screen, the second component is disposed on the surface of the second sub-screen close to the second sub-casing; the first component is disposed on the first sub-screen close to the first sub-screen On the surface of the sub-casing, the second component is arranged on the surface of the second sub-casing close to the second sub-screen; the first component is arranged on the first sub-screen close to the first sub-screen On the surface of the sub-housing, the second component is disposed on the surface of the second sub-screen close to the second sub-housing. Therefore, the structure is simple and easy to implement, and when the electronic components in the electronic device generate heat, the heat will be transferred to the aforementioned heat dissipation components, and the heat will be uniformly carried by the cooling fluid to various positions of the heat dissipation components for heat dissipation. For example, when the heat source is in 309, the heat is transferred to the heat dissipation component through the interface material such as thermal pad or silicone grease, the cooling fluid is heated, and the heat is evenly spread on the heat dissipation component under the action of the piezoelectric ceramic pump.

According to some examples of the present application, the cooling liquid flow passages on the first part and the second part in the housing assembly are divided into a water supply area and a return water area, one side of the water supply area is connected to the cooling liquid inlet, and the return water area is connected to the cooling liquid inlet. The cooling liquid outlet is connected, the piezoelectric ceramic pump has a pumping port and a pumping output port, the pumping port is connected with the cooling liquid outlet, and the pumping outlet is connected with the cooling liquid inlet. Specifically, the electronic device may further include a heat source chip, and the heat source chip is located in the side of the water supply area. The heat generation of electronic equipment mainly comes from the battery and the chip on the motherboard. Generally, the temperature of the battery and the motherboard area on the electronic equipment will be higher than that of other parts. The cooling fluid in the regional cooling liquid flow channel quickly transfers the heat in the first heat source region, that is, the region where the heat source chip is located, back to the water region, thereby achieving the effect of uniform heat and temperature. And through the design of the cooling liquid flow channel inside the heat dissipation component, on the basis of simple and uniform heat, the customized distribution of the water supply area and the return water can be realized, and the rational layout can be achieved through the direction and position design of the cooling liquid flow channel. , increase the temperature of the location that is not easily accessible to the user during use, and reduce the temperature of the frequently contacted location. Therefore, because the electronic device has the above-mentioned heat dissipation component with better temperature uniformity, the phenomenon of local overheating will not occur during use, and the user experience is better.

Further, it can be understood that the specific type of the foldable electronic device may be a notebook computer or a foldable mobile phone, and of course, it may also be any other type of foldable electronic device, which will not be repeated here. Thus, the application range is wide.

The embodiments of the present application are described in detail below.

Example 1

The heat dissipation assembly includes: a first part and a second part, the first part and the second part are connected by a foldable part, the foldable part, the first part and the second part are The interior has cooling liquid flow passages that communicate with each other, cooling fluid is sealed in the cooling liquid flow passage, and the first component has a cooling liquid inlet and a cooling liquid outlet communicated with the cooling liquid flow passage; and a piezoelectric A ceramic pump, the piezoelectric ceramic pump is arranged on the first part and communicated with the cooling liquid flow channel, the piezoelectric ceramic pump has a pumping port and a pumping outlet, and the pumping port is connected with The cooling liquid outlet is connected, and the pumping port is connected with the cooling liquid inlet, wherein the foldable part comprises a first hose and a second hose arranged in parallel with each other, a first rotary joint and a second rotary joint, or The foldable part, the first part and the second part are integrally formed, wherein when the first part and the second part are integrally formed, the first part has a first edge facing the second part, and the second part has a first edge facing the first part. The second edge, the foldable part connects part of the first edge and part of the second edge, and there is a gap between the part of the first edge not connected by the foldable part and the part of the second edge not connected by the foldable part.

Comparative Example 1

The heat dissipation component includes: a graphite sheet with a thickness of not more than 100 microns, wherein the graphite sheet can be folded due to its thin thickness.

Comparative Example 2

The heat dissipation component includes: two VC temperature equalizing plates are connected by a graphite sheet with a thickness of no more than 100 microns, wherein the two VC temperature equalizing plates play a role of temperature equalization, and the graphite sheet serves as a foldable part.

Table 1 The measured results of the maximum temperature difference of the heat dissipation components of Example 1, Comparative Example 1 and Comparative Example 2 under different power consumption

Power consumption 2W 3W 4W 5W Example 1 2.3℃ 3℃ 4.3℃ / Comparative Example 1 12.5℃ 18.5℃ 25℃ / Comparative Example 2 5.1℃ 7℃ 9℃ 10℃

It can be seen from Table 1 that while the heat dissipation assembly described in this application is foldable, the maximum temperature difference under different power consumption is much smaller than that of Comparative Example 1 and Comparative Example 2, the thermal conductivity is higher, and the heat dissipation effect is better.

Although the embodiments of the present application have been shown and described above, it should be understood that the above embodiments are exemplary and should not be construed as limitations to the present application. Embodiments are subject to variations, modifications, substitutions and variations.

Claims (25)

1. A heat dissipation assembly, characterized in that, comprising: A first part and a second part, the first part and the second part are connected by a foldable part, and the inside of the foldable part, the first part and the second part has a cooling liquid a flow channel in which cooling fluid is sealed, and the first part or foldable part has a cooling liquid inlet and a cooling liquid outlet communicating with the cooling liquid flow channel; and Piezoelectric ceramic pump, the piezoelectric ceramic pump is communicated with the cooling liquid flow channel, the piezoelectric ceramic pump has a pumping port and a pumping output port, the pumping port is connected with the cooling liquid outlet, so The pump outlet port is connected to the cooling liquid inlet. 2 . The heat dissipation assembly according to claim 1 , wherein, along the flow direction of the cooling fluid, the foldable member is sequentially provided with a first liquid inlet, a first liquid outlet, and a second liquid inlet. 3 . liquid port and second liquid outlet, Wherein, the first liquid inlet and the second liquid outlet are connected with the first component, and the first liquid outlet and the second liquid inlet are connected with the second component. 3 . The heat dissipation assembly of claim 2 , wherein the foldable part comprises a first hose and a second hose arranged in parallel with each other, and one end of the first hose is configured to form the first hose. 4 . The other end of the liquid inlet is configured as the first liquid outlet; one end of the second hose is configured as the second liquid inlet, and the other end is configured as the second liquid outlet. 4 . The heat dissipation assembly according to claim 3 , wherein when the cooling liquid flow channel located inside the foldable part, the cooling liquid flow channel located inside the first part, and the cooling liquid flow channel located inside the first part When the cooling liquid flow channels inside the second part are in the same plane, The complementary angle of the included angle between the first hose and the edge of the first component is an acute angle, and the complementary angle of the included angle between the second hose and the edge of the second component is an acute angle; or The complementary angle of the included angle between the first hose and the edge of the second component is an acute angle, and the complementary angle of the included angle between the second hose and the edge of the first component is an acute angle. 5 . The heat dissipation assembly according to claim 2 , wherein the foldable part comprises a first rotary joint and a second rotary joint, and the water inlet hole of the first rotary joint is configured as the first liquid inlet. 6 . The water outlet of the first rotary joint is configured as the first liquid outlet; the water inlet of the second rotary joint is configured as the second liquid inlet, and the water outlet of the second rotary joint The second liquid outlet is configured. 6. The heat dissipation assembly of claim 2, wherein the foldable part, the first part and the second part are integrally formed. 7. The heat dissipation assembly of claim 6, wherein the first part has a first edge facing the second part, the second part has a second edge facing the first part, The foldable part connects part of the first edge and part of the second edge, and the part of the first edge not connected by the foldable part and the second edge are not connected by the foldable part There are gaps between the parts. 8. The heat dissipation assembly according to claim 7, wherein the foldable part satisfies at least one of the following conditions: The thickness is not more than 0.6mm; It has a first side edge and a second side edge, the first side edge and the second side edge have two ends respectively located on the first edge and the second edge, and the first side edge is on the first side edge. The shortest distance from any point to any point on the second side is not less than 3mm; The material includes plastic, preferably polyethylene terephthalate; Parts connected to the first edge and the second edge are located at one end of the first edge and the second edge, respectively. 9. The heat dissipation assembly according to claim 1, wherein the piezoelectric ceramic pump comprises: Piezoelectric vibrating film, the piezoelectric vibrating film comprises a piezoelectric ceramic sheet and a support plate in contact with the piezoelectric ceramic sheet, the surface of the piezoelectric ceramic sheet has electrodes that can generate an electric field, and the electric field can be controlled the piezoelectric ceramic sheet oscillates; and A valve body structure, the valve body structure is arranged between the piezoelectric diaphragm and the first part or the foldable part, and can control one of the pump inlet port and the pump outlet port to open , the other is closed. 10 . The heat dissipation assembly according to claim 9 , wherein the valve body structure comprises: a check valve upper cover and a check valve diaphragm, and the check valve upper cover has a first through hole and a first through hole. 11 . Two through holes, the area of the first through hole is larger than the area of the second through hole, the one-way valve diaphragm is located between the one-way valve upper cover and the first part, the one-way valve diaphragm The valve diaphragm is configured to oscillate with the oscillation of the piezoelectric ceramic sheet, the one-way valve diaphragm has two hollow areas with the same shape, and each of the two hollow areas has a solid part, so The orthographic projection of the solid part on the upper cover of the one-way valve is located at the first through hole and the second through hole, In addition, the orthographic projection of the first through hole on the first component completely covers one of the cooling liquid inlet and the cooling liquid outlet, and the orthographic projection of the second through hole on the first component the projection is within the other of the coolant inlet and the coolant outlet, In addition, the orthographic projection of the solid part corresponding to the second through hole on the upper cover of the one-way valve completely covers the second through hole, and the solid part corresponding to the first through hole The orthographic projection of the first part on the first part completely covers one of the cooling liquid inlet and the cooling liquid outlet. 11 . The heat dissipation assembly according to claim 1 , wherein the cooling liquid inlet and the cooling liquid outlet are arranged adjacently, and a blocking structure is arranged between the cooling liquid inlet and the cooling liquid outlet. 12 . 12 . The heat dissipation assembly according to claim 1 , wherein the volume of the piezoelectric ceramic pump and the cooling liquid flow channel is configured such that the flow rate of the cooling fluid in the cooling liquid flow channel is not less than 0.5 mL/min. 13. The heat dissipation assembly according to claim 12, wherein at least one of the following conditions is satisfied: The depth of the cooling liquid flow channel is not less than 25 microns; The thickness H of the piezoelectric ceramic sheet satisfies 0.1mm≤H≤0.5mm; The diameter D of the piezoelectric ceramic sheet satisfies 3mm≤D≤12mm. 14. The heat dissipation assembly according to claim 1, wherein the cooling liquid flow channel adjacent to the cooling liquid inlet and the cooling liquid outlet has a buffer section, and the cooling liquid flow in the buffer section The width of the channel is greater than the width of the cooling liquid flow channel at the non-buffer section. 15. The heat dissipation assembly according to any one of claims 1 to 14, wherein the first part and the second part independently comprise a first cover body and a second cover body disposed opposite to each other, the cooling liquid flow channel is sealed between the first cover body and the second cover body, The materials forming the first cover and the second cover each independently include polyester, polyimide, polymethyl methacrylate, polyethylene, polyvinyl chloride, polystyrene, ceramics, and glass at least one of. 16 . The heat dissipation assembly according to claim 15 , wherein a side of the first cover facing the second cover has a first groove, and the second cover faces the first cover. 17 . One side of the body has a second groove, the first groove and the second groove form the cooling liquid flow channel, The first cover body or the second cover body has a third through hole penetrating through the first cover body or the second cover body, and the third through hole is configured as the cooling liquid inlet and the second cover body. the coolant outlet; Optionally, the thickness of the first cover at the first groove and the thickness of the second cover at the second groove are independently not less than 25 microns. 17. The heat dissipation assembly according to claim 15, wherein one surface of the first cover body and the second cover body has a third groove, the third groove and the first cover The other of the cover body and the second cover body forms the cooling liquid flow channel. 18. The heat dissipation assembly according to claim 15, wherein a partition plate is further provided between the first cover body and the second cover body, the partition plate has a hollow pattern, and the hollow pattern constitutes the the cooling liquid flow path, The first cover body or the second cover body has two third through holes penetrating the first cover body or the second cover body, and the third through holes are configured as the cooling liquid inlet and the coolant outlet. 19. The heat dissipation assembly according to claim 15, wherein the material forming at least one of the first cover body and the second cover body is a flexible material, The heat dissipation assembly further includes: a water-oxygen barrier film, the water-oxygen barrier film is located on a side of the cover formed by the flexible material away from the cooling liquid flow channel. 20. A foldable electronic device, comprising: a housing, the interior of the housing defines an accommodating space, the interior of the accommodating space has a main board and a display screen, the housing includes a first sub-housing and a second sub-housing, the first sub-housing is connected with the second sub-shell through a folded portion; and The heat dissipation assembly according to any one of claims 1 to 19. 21. The foldable electronic device according to claim 20, wherein when the foldable part in the heat dissipation assembly comprises a first rotary joint and a second rotary joint, the first rotary joint and the first rotary joint Two rotary joints are configured to form the folded portion; Optionally, the folding part further includes a rotating shaft, the second sub-housing can rotate relative to the first sub-housing along with the rotating shaft, and the first rotary joint and the second rotary joint are arranged at inside of the shaft. 22 . The foldable electronic device according to claim 20 , wherein when the foldable part in the heat dissipation assembly comprises a first hose and a second hose arranged in parallel with each other, the foldable part comprises a rotating shaft. 23 . , the second sub-housing can rotate relative to the first sub-housing along with the rotating shaft, and the first hose and the second hose are arranged inside the rotating shaft. 23 . The foldable electronic device according to claim 20 , wherein the display screen comprises a first sub-screen and a second sub-screen, and the first sub-screen is located in the first sub-screen. 24 . Inside the sub-housing, the second sub-screen is located inside the second sub-housing, and the first component and the second component in the heat dissipation assembly satisfy any one of the following: the first component is arranged on the surface of the first sub-casing close to the first sub-screen, and the second component is arranged on the surface of the second sub-casing close to the second sub-screen; the first part is arranged on the surface of the first sub-housing close to the first sub-screen, and the second part is arranged on the surface of the second sub-screen close to the second sub-housing; The first part is arranged on the surface of the first sub-screen close to the first sub-shell, and the second part is arranged on the surface of the second sub-shell close to the second sub-screen; The first part is disposed on the surface of the first sub-screen close to the first sub-casing, and the second part is disposed on the surface of the second sub-screen close to the second sub-casing. 24 . The foldable electronic device according to claim 20 , wherein the electrodes in the piezoelectric ceramic pump of the heat dissipation component that can generate an electric field are electrically connected to the main board through metal dome sheets. 25 . 25. The foldable electronic device according to claim 24, wherein the cooling liquid flow channel inside the first part and the second part in the heat dissipation assembly is divided into a water supply area and a return water area, and the water supply area One side of the pump is connected to the coolant inlet on the first part, the return area is connected to the coolant outlet on the first part, the piezoelectric ceramic pump has a pumping port and a pumping port, so the pump inlet port is connected with the cooling liquid outlet, the pump outlet port is connected with the cooling liquid inlet, The foldable electronic device further includes a heat source chip, and the heat source chip is located on one side of the water supply area.

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