CN115087343B

CN115087343B - Disassembling and pulling jig for removing electronic element

Info

Publication number: CN115087343B
Application number: CN202110266268.XA
Authority: CN
Inventors: 林志青; 陈正峰; 游源民; 吴志平
Original assignee: Best International Co ltd; Giga Byte Technology Co Ltd
Current assignee: Best International Co ltd; Giga Byte Technology Co Ltd
Priority date: 2021-03-11
Filing date: 2021-03-11
Publication date: 2024-10-25
Anticipated expiration: 2041-03-11
Also published as: CN115087343A

Abstract

The invention provides a disassembling and pulling jig for removing an electronic element, which comprises a plate and at least one buckle. The plate has an upper surface, a lower surface and a window, and the window communicates with the upper surface and the lower surface. The buckle is arranged on the upper surface and comprises a positioning column, a sleeve and an elastic piece. The positioning column is provided with a free end and a fixed end, wherein the fixed end is fixed on the upper surface, so that the positioning column is vertically fixed on the upper surface of the plate and is arranged adjacent to the edge of the window. The sleeve is provided with a top end, a bottom end, an outer peripheral surface connected with the top end and the bottom end, a hook part and an inner space. The positioning column movably penetrates through the sleeve, the bottom end faces the upper surface, and the hook part protrudes out of the peripheral surface. The elastic piece is arranged in the inner space. The elastic piece is provided with a first end and a second end, wherein the first end is used for abutting the sleeve, and the second end is used for abutting the upper surface. The invention does not need to manually pull out the electronic element.

Description

Disassembling and pulling jig for removing electronic element

Technical Field

The present invention relates to a disassembling and assembling jig, and more particularly to a disassembling and assembling jig for removing electronic components.

Background

During reworking (reworking) or repair of circuit boards, soldered connectors and electronic components must be desoldered. For example, when the cpu socket soldered by the ball grid array needs to be removed by soldering on the motherboard, the motherboard must be placed in a reflow oven to be heated, so that the solder (solder ball) is softened and melted, and then the socket is removed by being clamped by tweezers in an operating high temperature environment.

However, when a person uses the tweezers to remove the cpu socket, the person must work at a high temperature, which is easy to burn the hands of the person, or to touch other electronic components by mistake, and the components are displaced or fall. Meanwhile, the operation in high temperature often makes personnel unable to operate quickly, which causes overlong heating time of the circuit board and damages the circuit board or parts.

Disclosure of Invention

Based on the above technical problems, the present invention provides a disassembling and assembling jig for removing electronic components, which can automatically remove electronic components soldered on a circuit board after solder is softened and melted by heating.

The invention provides a disassembling and pulling jig for removing an electronic component, which comprises a plate and at least one buckle. The plate has an upper surface, a lower surface and a window, and the window communicates with the upper surface and the lower surface. The buckle is arranged on the upper surface and comprises a positioning column, a sleeve and an elastic piece. The positioning column is provided with a free end and a fixed end, wherein the fixed end is fixed on the upper surface, so that the positioning column is vertically fixed on the upper surface of the plate and is arranged adjacent to the edge of the window. The sleeve is provided with a top end, a bottom end, an outer peripheral surface connected with the top end and the bottom end, a hook part and an inner space. The positioning column movably penetrates through the sleeve, the bottom end faces the upper surface, and the hook part protrudes out of the peripheral surface. The elastic piece is arranged in the inner space. The elastic piece is provided with a first end and a second end, wherein the first end is used for abutting the sleeve, and the second end is used for abutting the upper surface.

In at least one embodiment, the free end has a height above the upper surface that is greater than a length of the sleeve.

In at least one embodiment, the top end is provided with a through hole, the bottom end is provided with an opening, the through hole and the opening are communicated with the inner space, and the positioning column movably passes through the sleeve through the through hole and the opening.

In at least one embodiment, the free end is provided with a stop block, and the projection area of the stop block at the top end is larger than the through hole.

In at least one embodiment, the elastic member is a compression spring, the positioning post passes through the elastic member, a circle defined by a first outer diameter of the first end is larger than the through hole, and a circle defined by a second outer diameter of the second end is smaller than the through hole.

In at least one embodiment, a free length of the elastic member is greater than a length of the sleeve.

In at least one embodiment, the hook portion extends at the bottom end.

In at least one embodiment, the sleeve includes a positioning block protruding from the outer peripheral surface, a projection of the positioning block on the upper surface at least partially overlapping a projection of the hook portion on the upper surface, and the positioning block is located between the top end and the hook portion.

In at least one embodiment, the hook portion protrudes from the outer peripheral surface by an extension length greater than a minimum distance from the outer peripheral surface to the window.

In at least one embodiment, the edge of the plate has at least one necked-in region.

In at least one embodiment, the at least one necked-in region is rectangular, triangular, trapezoidal, or circular arc.

In at least one embodiment, the fixed end has external threads and the plate has a locating hole, the fixed end is locked to the locating hole and fixed to the upper surface.

In at least one embodiment, the plate further has at least one fixing hole for passing at least one fixing member.

In at least one embodiment, the hook portion extends from the bottom end to pass through the window, and the fixing member further has a spacer portion located on the lower surface of the plate.

The disassembling and pulling jig provided by the invention can be pre-installed on a circuit board and can apply pre-force to an electronic element. During the solder heating process, the electronic component does not need to be pulled out manually. After the solder is softened and melted by heating, the disassembling and pulling jig can upwards lift the electronic element to finish the disassembling and the removing of the electronic element without manually pulling out the electronic element.

Drawings

Fig. 1 is a perspective view of a disassembling tool according to a first embodiment of the present invention.

Fig. 2 is an exploded perspective view of the disassembling tool and the circuit board in the first embodiment of the present invention.

Fig. 3 is a perspective view of a disassembling tool and a circuit board according to a first embodiment of the invention.

Fig. 4 is a top view of the disassembling tool according to the first embodiment of the present invention.

Fig. 5 is a perspective view of a buckle according to a first embodiment of the present invention.

Fig. 6 is a cross-sectional view of a buckle according to a first embodiment of the present invention.

Fig. 7 is a cross-sectional exploded view of a buckle according to a first embodiment of the present invention.

Fig. 8 is a side view of the disassembling tool according to the first embodiment of the invention.

Fig. 9 is another top view of the plate member in the first embodiment of the present invention.

Fig. 10 is a further plan view of the plate member in the first embodiment of the present invention.

Fig. 11 is another side view of the disassembling tool according to the first embodiment of the invention.

Fig. 12 is another top view of the disassembling tool according to the first embodiment of the invention.

Fig. 13 is a perspective view of a fastener according to a second embodiment of the present invention.

Fig. 14 is a side view of a disassembling tool according to a second embodiment of the invention.

Fig. 15 is a side view of a disassembling tool according to a third embodiment of the invention.

The reference numerals are explained as follows:

1, disassembling and pulling jig

2 Electronic component

3 Circuit Board

31 Locking hole

100 Plate member

110 Upper surface

120 Lower surface

130 Windowing

140 Positioning hole

150 Fixing hole

160 Retracted region

200-Step fastener

210 Positioning column

212 Free end

212A stop block

214 Fixed end

220 Sleeve barrel

221 Tip end

221A, perforation

222 Bottom end

222A, open pore

223 Outer peripheral surface

224 Hook portion

225 Internal space

226 Positioning block

230 Elastic member

231 First end

232 Second end

300 Fixing piece

310 Spacer portion

D1 first outer diameter

D2 second outer diameter

G gap

C clamping notch

Detailed Description

Referring to fig. 1,2 and 3, a disassembling tool 1 for removing electronic components 2 according to a first embodiment of the present invention is disclosed, and is used for removing electronic components 2 soldered on a circuit board 3 during a disassembling process. The circuit board 3 may be, but is not limited to, a motherboard, a graphics card, or other function expansion card. The electronic component 2 may be a cpu, a graphics chip, an expansion slot, or other electronic components 2 soldered to the circuit board 3. The electronic component 2 may be, but is not limited to, a Ball grid array (Ball GRIDARRAY, BGA) component or a plug-in component.

As shown in fig. 1,2,3 and 4, the disassembling and assembling jig 1 includes a plate 100 and a plurality of fasteners 200. As shown in fig. 4, the plate 100 has an upper surface 110, a lower surface 120, and a window 130. The fenestration 130 communicates with the upper surface 110 and the lower surface 120. The area of the window 130 is larger than the projection area of the electronic component 2 on the circuit board 3.

As shown in fig. 1,2, 3 and 4, the buckle 200 is disposed on the upper surface 110 of the plate 100 and adjacent to the edge of the window 130, so that a portion of the buckle 200 may be located above the window 130 after moving.

As shown in fig. 4,5 and 6, each buckle 200 has a positioning post 210, a sleeve 220 and an elastic member 230, wherein the elastic member 230 is a compression spring.

As shown in fig. 1, 5 and 6, the positioning post 210 has a free end 212 and a fixed end 214. The fixed end 214 is fixed to the upper surface 110 such that the positioning post 210 is vertically fixed to the upper surface 110 of the plate member 100 and disposed adjacent to the edge of the fenestration 130. In one embodiment, the fixing end 214 has external threads, and the plate 100 has a positioning hole 140, and the fixing end 214 is locked to the positioning hole 140 and fixed to the upper surface 110.

As shown in fig. 5, 6 and 7, the sleeve 220 has a top 221, a bottom 222, an outer peripheral surface 223, a hook 224 and an inner space 225. The outer peripheral surface 223 connects the top end 221 to the bottom end 222. The top 221 has a hole 221a, and the bottom 222 has an opening 222a, the hole 221a communicates with the opening 222a to form an internal space 225. The positioning post 210 movably passes through the sleeve 220 through the through hole 221a and the opening 222a, and the bottom end 222 of the sleeve 220 faces the upper surface 110. The free end 212 has a height above the upper surface 110 that is greater than a length of the sleeve 220 such that the sleeve 220 is movable relative to the positioning post 210 along the longitudinal axis of the positioning post 210.

As shown in fig. 5, 6 and 7, the free end 212 is provided with a stop block 212a, and the projection area of the stop block 212a at the top end 221 is larger than the through hole 221a; thus, the stop block 212a can stop the sleeve 220, preventing the sleeve 220 from falling off the free end 212.

As shown in fig. 4 and 5, the hook 224 protrudes from the outer peripheral surface 223, and can extend to the window 130 after the sleeve 220 rotates relative to the positioning post 210.

As shown in fig. 4 and 8, the hook 224 extends to the bottom end 222, and when the bottom end 222 of the sleeve 220 is close to the upper surface 110 and the hook 224 moves above the window 130, the hook 224 can enter the gap G between the bottom of the electronic component 2 and the circuit board 3 and abut against the bottom of the electronic component 2. The gap G may be the height of the BGA solder ball pad or the reserved height remaining between the electronic component 2 and the circuit board 3 during the soldering process. In addition, the height of the gap G is greater than the sum of the thickness of the plate member 100 and the height of the hook 224. Therefore, when the bottom end 222 of the sleeve 220 abuts against the upper surface 110, the hook 224 can enter the gap G. Generally, the hook 224 may be thin and flexible to facilitate the rotation of the hook 224 into the gap G.

As shown in fig. 6 and 7, the elastic member 230 is disposed in the inner space 225. When the elastic member 230 is a compression spring, the positioning post 210 may pass through the elastic member 230. The elastic member 230 has a first end 231 and a second end 232. When the elastic member 230 is a compression spring and the positioning post 210 passes through the elastic member 230, a circle defined by a first outer diameter D1 of the first end 231 is larger than the through hole 221a, and a circle defined by a second outer diameter D2 of the second end 232 is smaller than the opening 222a. Thus, the first end 231 may abut the sleeve 220 in the inner space 225 without passing through the through hole 221a, and the second end 232 may abut the upper surface 110 of the plate 100 through the opening 222a. The first outer diameter D1 and the second outer diameter D2 may be equal such that the compression spring as the elastic member 230 takes a cylindrical shape or an olive shape; the first outer diameter D1 and the second outer diameter D2 may be different so that the form of the compression spring as the elastic member 230 assumes a cone shape.

As shown in fig. 6, 7 and 8, a free length (length when not compressed) of the elastic member 230 is greater than a length of the sleeve 220; when the bottom end 222 of the sleeve 220 approaches the upper surface 110, the elastic member 230 can be compressed to generate an elastic restoring force to push the sleeve 220 to move toward the free end 212 away from the upper surface 110.

Referring to fig. 4 and 8, the shape of the window 130 is approximately matched with the projection shape of the electronic component 2 on the circuit board 3, so that the electronic component 2 can pass through the window 130. In some embodiments, the window 130 may be slightly larger than the projection of the electronic component 2 on the circuit board 3, so that the extension length of the hook 224 protruding from the outer peripheral surface 223 may be reduced as much as possible.

As shown in fig. 2 and 3, the board 100 further has a plurality of fixing holes 150 for passing the fixing members 300 therethrough to fix the board 100 on the circuit board 3. In one embodiment, the electronic component 2 is a cpu or a socket of the cpu, and the circuit board 3 is a motherboard. The motherboard has a plurality of locking holes 31 corresponding to the electronic components 2 for fixing the heat sink of the CPU. The fixing hole 150 may be positioned to match the locking hole 31. When the electronic component 2 is to be soldered, the heat sink is removed. The fixing member 300 may pass through the fixing hole 150 and then pass through the locking hole 31 to fix the board 100 to the circuit board 3 with the lower surface 120 facing the circuit board 3. At this time, the electronic component 2 passes through the window 130 and protrudes from the upper surface 110.

As shown in fig. 4, the edge of the board 100 has one or more retracted regions 160 for avoiding other components around the electronic component 2, such as a capacitor, a power chip, etc., to ensure that the board 100 can be fixed to the circuit board 3 without interference from other components.

As shown in fig. 9 and 10, the shape or number of the retracted regions 160 mainly matches the positions of the other components with respect to the electronic component 2, and many different types of variations exist. For example, there may be only one of the necked-in regions 160, as shown in FIG. 9; the configuration of the necked-in region 160 may be varied to avoid other elements of different configurations, as shown in fig. 10.

As shown in fig. 6, 7 and 8, when the bottom end 222 of the sleeve 220 abuts against the upper surface 110, the hook 224 can enter the gap G, and the elastic member 230 is compressed to generate an elastic restoring force, so as to push the sleeve 220 to move toward the free end 212 away from the upper surface 110.

As shown in fig. 11, when the circuit board 3, together with the electronic component 2 and the disassembling and assembling jig 1, enters the reflow oven to be heated, the solder is gradually softened and melted and cannot further fix the electronic component 2, and at this time, the sleeve 220 can lift the electronic component 2 upwards under the pushing of the elastic member 230, so that the electronic component 2 is separated from the circuit board 3, and the disassembling and assembling of the electronic component 2 are completed without manually disassembling the electronic component 2.

Since the disassembling tool 1 needs to be heated in the reflow oven, each component of the disassembling tool 1 needs to be able to withstand high temperature, and therefore, the positioning column 210 and the sleeve 220 can be made of metal, particularly stainless steel, so as to avoid softening and deforming after being heated in the reflow oven. The elastic member 230 is also required to be made of a metal resistant to high temperature to avoid elastic deterioration after being heated. In different embodiments, the solder of the electronic component 2 may be heated by the air heater to reduce the heating degree of the disassembling and assembling jig 1, at this time, the positioning column 210 and the sleeve 220 may be made of hard plastic, and the elastic member 230 may be made of elastic materials such as rubber or foam.

As shown in fig. 4 and 12, in the foregoing embodiment, the position of the buckle 200 corresponds to the corner of the window 130, so that the hook 224 can abut against the four corners of the electronic component 2 to uniformly apply force to the electronic component 2. In a different embodiment, the position of the buckle 200 corresponds to the side of the window 130 and is located approximately in the middle of the side, so that the hook 224 can abut against the side of the electronic component 2, and can uniformly apply force to the electronic component 2.

Fig. 13 and 14 show a disassembling tool 1 for removing an electronic component 2 according to a second embodiment of the present invention. In the second embodiment, the sleeve 220 further includes a positioning block 226 protruding from the outer peripheral surface 223, a projection of the positioning block 226 on the upper surface 110 at least partially overlaps a projection of the hook 224 on the upper surface 110, and the positioning block 226 is located between the tip 221 and the hook 224. Therefore, a clamping notch C can be formed between the positioning block 226 and the hook 224. The height of the clamping notch C with respect to the upper surface 110 is equal to or greater than the thickness of the electronic component 2 with respect to the upper surface 110, so that the bottom of the electronic component 2 can be located in the clamping notch C. After the sleeve 220 lifts the electronic component 2 upward and the electronic component 2 is separated from the circuit board 3, the positioning block 226 can stop the electronic component 2 to avoid the electronic component 2 from being tripped. Therefore, the shape of the positioning block 226 is not limited to be the same as the hook 224, and any shape can be used to avoid the electronic component 2 from being tripped.

As shown in fig. 14, in the second embodiment, the hook 224 further extends from the bottom end 222 toward the circuit board 3 and passes through the window 130. In addition, the fixing member 300 further has a spacer 310 disposed on the lower surface 120 of the board 100 and clamped between the board 100 and the circuit board 3, so that a space height is provided between the board 100 and the circuit board 3. At this time, the hook 224 extending through the window 130 only needs to be smaller than the gap G between the bottom of the electronic component 2 and the circuit board 3. In the second embodiment, the height of the bottom of the electronic component 2 is not required to be higher than that of the board 100, and thus the influence of the thickness of the board 100 is not required to be considered.

Fig. 15 shows a disassembling tool 1 for removing electronic components 2 according to a third embodiment of the present invention. In a third embodiment, stop block 212a may be omitted and the length of post 210 increased, lengthening the travel of sleeve 220. The sleeve 220 lifts the electronic component 2 upward, and after the electronic component 2 is separated from the circuit board 3, the positioning post 210 is long enough to avoid the sleeve 220 from being tripped by the free end 212.

The disassembling and pulling jig 1 provided by the invention can be pre-installed on a circuit board and can apply pre-force to an electronic element. During the solder heating process, the electronic component 2 does not need to be pulled out manually. After the solder is softened and melted by heating, the disassembling and pulling jig 1 can lift the electronic element 2 upwards to finish the disassembly and the removal of the electronic element 2 without manually pulling out the electronic element 2.

Claims

1. A tear tool open for removing electronic component, its characterized in that includes:

A plate having an upper surface, a lower surface and a window, wherein the window is communicated with the upper surface and the lower surface; and

At least one fastener is arranged on the upper surface, and the at least one fastener comprises:

The positioning column is provided with a free end and a fixed end, the fixed end is fixed on the upper surface, so that the positioning column is vertically fixed on the upper surface of the plate and is arranged adjacent to the edge of the window;

A sleeve having a top end, a bottom end, an outer peripheral surface connecting the top end and the bottom end, a hook portion, and an inner space; wherein, the positioning column movably passes through the sleeve, the bottom end faces the upper surface, and the hook part protrudes out of the peripheral surface; and

An elastic piece arranged in the inner space; the elastic piece is provided with a first end and a second end, wherein the first end is used for abutting the sleeve, and the second end is used for abutting the upper surface;

wherein, the free end is higher than the sleeve in a length at the upper surface.

2. The fixture of claim 1, wherein the top end has a hole and the bottom end has an opening, the hole and the opening are communicated with the internal space, and the positioning post movably passes through the sleeve through the hole and the opening.

3. The removing tool for removing electronic components as set forth in claim 2, wherein the free end is provided with a stop block, and the projection area of the stop block on the top end is larger than the through hole.

4. The tool of claim 2, wherein the elastic member is a compression spring, the positioning post passes through the elastic member, a first outer diameter of the first end defines a circle larger than the through hole, and a second outer diameter of the second end defines a circle smaller than the opening.

5. The removing tool for removing electronic components as set forth in claim 1, wherein a free length of the elastic member is greater than a length of the sleeve.

6. The removing tool for removing electronic components as claimed in claim 1, wherein the hook portion extends from the bottom end.

7. The removing tool for removing electronic components as set forth in claim 1, wherein the sleeve includes a positioning block protruding from the outer peripheral surface, a projection of the positioning block on the upper surface at least partially overlaps a projection of the hook on the upper surface, and the positioning block is located between the top end and the hook.

8. The removing jig according to claim 1, wherein an extension length of the hook portion protruding from the outer peripheral surface is greater than a minimum distance from the outer peripheral surface to the window.

9. The tool of claim 1, wherein the edge of the plate has at least one area.

10. The fixture of claim 1, wherein the fixing end has an external thread, and the plate has a positioning hole, and the fixing end is locked to the positioning hole and fixed to the upper surface.

11. The fixture of claim 1, wherein the plate further has at least one fixing hole for passing at least one fixing member.