CN115003121A - Structure capable of realizing centralized heat dissipation and sealing of electronic components and preparation method thereof - Google Patents

Abstract

The invention discloses a structure capable of realizing centralized heat dissipation and sealing of electronic components and a preparation method thereof, relating to the technical field of centralized heat dissipation and sealing of electronic components of a domain controller, wherein the structure capable of realizing centralized heat dissipation and sealing of electronic components comprises a domain controller shell internally provided with a PCBA board; the heat pipe assembly comprises a heat pipe mounting base and a plurality of heat pipes connected to the heat pipe mounting base; the heat dissipation assembly comprises at least one radiator arranged outside the upper cover of the domain controller and a fan used for dissipating heat of the radiator, the heat pipe penetrates out of the upper cover of the domain controller and is inserted into the radiator so as to dissipate heat through the radiator, and the upper cover of the domain controller is provided with a through hole for the heat pipe to penetrate through; the sealing seat body is connected with the upper cover of the domain controller and used for sealing the through hole. The invention can enable the PCBA board electronic components of the domain controller to meet the heat dissipation requirement, and can enable the domain controller to integrally meet the sealing requirement of dust prevention and water prevention.

Description

Structure capable of realizing centralized heat dissipation and sealing of electronic components and preparation method thereof

Technical Field

The invention relates to the technical field of centralized heat dissipation and sealing of electronic components of a domain controller, in particular to a structure capable of realizing centralized heat dissipation and sealing of the electronic components, and further relates to a preparation method.

Background

Generally, as the control and interaction capabilities of the vehicle-mounted domain controller are improved, higher requirements are placed on the performance of internal electronic components of the vehicle-mounted domain controller, which means that the working performance of the electronic components on a PCBA board of the vehicle-mounted domain controller needs to be improved, but the improvement of the working performance of the electronic components is often accompanied by the increase of power consumption. In addition, with the rapid development of the vehicle-mounted domain controller towards high efficiency, high integration and other directions and the continuous progress of the electronic and information processing technology, a series of heat dissipation problems such as narrow heat dissipation space, high heat flux density and the like are brought to the domain controller. If the heat generated by the electronic components cannot be dissipated in time, the temperature inside the electronic components becomes higher and higher, the service life and the performance of the electronic components are seriously influenced, and even the failure of the electronic components caused by overhigh temperature is fatal to the vehicle-mounted domain controller.

The heat pipe heat dissipation technology is a passive two-phase heat exchange technology and is called as a hot superconductor. The heat pipe is a heat transfer element with extremely high heat conductivity, transfers heat through gas-liquid phase change of working media in the totally-enclosed vacuum pipe, and has extremely high heat conductivity. The heat pipe radiator generally comprises a heat pipe mounting base, a heat pipe and heat radiating fins, wherein the upper surface of the heat pipe mounting base can be provided with a plurality of heat radiating fins, and a heat pipe element for heat conduction can be embedded in the lower surface of the heat pipe mounting base. The space occupied by the traditional heat pipe radiator is larger than that of the whole domain controller, one reason is that the heat pipe needs space to be bent, and the other reason is that the radiating fins need space to radiate heat. Generally, the PCBA board of the domain controller is heat-dissipated by combining the heat pipe heat sink, and the PCBA board cannot be sealed integrally due to the space limitation of the heat pipe and the heat dissipating fins, which directly causes the PCBA board to be exposed to the air as a whole, and is not conceivable for the domain controller having the requirements of dust-proof and water-proof. However, the heat dissipation method combined with the heat pipe radiator has the capability of intensively dissipating heat of electronic components, and plays an important role in improving the overall heat dissipation capability of the system. Therefore, how to meet the heat dissipation requirement of the electronic components of the PCBA board of the domain controller on the premise of using the heat pipe radiator, and the sealing requirement of the domain controller on dust prevention and water prevention can be met integrally, and the problem to be solved is urgently needed.

Disclosure of Invention

The present invention is directed to solving, at least to some extent, one of the above-mentioned problems in the prior art. Therefore, the embodiment of the invention provides a structure capable of realizing centralized heat dissipation and sealing of electronic components, so that the electronic components of the PCBA board of the domain controller can meet the heat dissipation requirement, and the domain controller can integrally meet the sealing requirements of dust prevention and water prevention.

The embodiment of the invention also provides a preparation method for preparing the structure capable of realizing centralized heat dissipation and sealing of the electronic component.

According to an embodiment of the first aspect of the present invention, a structure capable of realizing centralized heat dissipation and sealing of electronic components is provided, including a domain controller housing in which a PCBA board is installed, where the domain controller housing includes an upper domain controller cover and a lower domain controller cover that are connected to each other; the heat pipe assembly comprises a heat pipe mounting base and a plurality of heat pipes, wherein the heat pipe mounting base conducts heat with a high-heating-power chip of the PCBA through a heat conducting medium, and the heat pipes are connected to the heat pipe mounting base; the heat pipe penetrates out of the upper cover of the domain controller and is inserted into the radiator so as to radiate heat through the radiator, and the upper cover of the domain controller is provided with a through hole for the heat pipe to pass through; and the sealing base body is connected with the upper cover of the domain controller and is used for sealing the through hole.

The structure capable of realizing centralized heat dissipation and sealing of the electronic components at least has the following beneficial effects:

the technical scheme can carry out concentrated heat dissipation on the high-heating-power chip by utilizing the heat pipe and the radiator under the condition of limited space, thereby improving the heat dissipation capacity of the whole system and increasing the allowable working power consumption of the chip; compared with the traditional heat dissipation mode adopting heat pipes, the PCBA cannot be integrally sealed due to the space limitation of the heat pipes and the heat dissipation fins, in the embodiment of the invention, the through holes are formed in the upper cover of the domain controller and are used for the heat pipes to pass through, then the sealing base body is matched with the heat radiator to seal the through holes, the whole PCBA is sealed, the short part for heat dissipation by using the heat pipes is avoided, the domain controller can integrally realize dust prevention and water prevention, the heat pipes can be applied to a wider heat dissipation field, the heat dissipation capability of the whole system is improved, the structural design is simple, and the overall cost is reduced.

According to an embodiment of the first aspect of the present invention, the sealing seat includes a cover plate for covering an exposed portion of the heat pipe between the domain controller upper cover and the heat sink, an edge of the cover plate extends downward to form a plurality of side plates, and each of the side plates is connected to the domain controller upper cover, so as to seal the through hole.

According to the embodiment of the first aspect of the present invention, two radiators are provided and distributed on the left and right sides of the through hole, and each heat pipe in the heat pipe assembly is inserted into two radiators in sequence in a staggered manner.

According to the embodiment of the first aspect of the present invention, the cover plate is disposed between the two heat sinks, the left and right sides of the cover plate are pressed against the heat sinks, and the two ends of the cover plate respectively extend downward to form the side plates.

According to an embodiment of the first aspect of the present invention, the sealing seat body includes a plurality of connecting strips mounted on the heat sink, the connecting strips are connected with the cover plate, and the fan is mounted on the heat sink through the connecting strips to dissipate heat of the heat sink.

According to an embodiment of the first aspect of the present invention, a heat dissipation auxiliary boss is provided on a side surface of the high heat generating power chip of the PCBA board for conducting heat of the high heat generating power chip of the PCBA board to the heat pipe mounting base more.

According to an embodiment of the first aspect of the present invention, the inner side of the domain controller upper cover is provided with a mounting groove for the heat pipe mounting base to be mounted and fixed.

According to the embodiment of the first aspect of the invention, the distance between the heat pipe mounting base and the high-heating-power chip of the PCBA is 0.2-0.7 mm.

According to an embodiment of the first aspect of the present invention, the upper cover of the domain controller, the lower cover of the domain controller, the heat pipe mounting base, the auxiliary heat dissipation boss, the heat sink, and the sealing seat body are made of a high thermal conductivity material, and the high thermal conductivity material is one or more of aluminum alloy, copper alloy, aluminum, and copper.

According to an embodiment of the second aspect of the present invention, a manufacturing method is provided for manufacturing the structure capable of realizing centralized heat dissipation and sealing of electronic components according to the embodiment of the first aspect of the present invention, including the following steps:

s1, connecting the heat pipe in the heat pipe assembly with the radiator;

s2, welding the sealing seat body and the radiator in a positioning manner, and connecting the fan and the radiator;

s3, bending the heat pipe to pass through the through hole of the upper cover of the domain controller;

s4, welding the radiator and the upper cover of the domain controller in a positioning way;

s5, the heat pipe is connected with the heat pipe mounting base in an embedded manner;

s6, embedding the heat pipe mounting base in the upper cover of the domain controller;

and S7, assembling the upper cover of the domain controller, the lower cover of the domain controller, the fan and the sealing seat body through fasteners.

The preparation method at least has the following beneficial effects: the structure capable of realizing centralized heat dissipation and sealing of electronic components can be prepared by assembling the heat pipe and the radiator firstly, then bending the heat pipe to penetrate through the through hole of the upper cover of the domain controller and installing the heat pipe on the upper cover of the domain controller through the heat pipe installing base, and finally assembling the upper cover of the domain controller and the lower cover of the domain controller.

Drawings

The invention is further described below with reference to the drawings and examples;

FIG. 1 is a perspective view of an embodiment of the present invention;

FIG. 2 is an exploded view of an embodiment of the present invention;

FIG. 3 is a schematic view of the assembly of the upper cover of the domain controller and the heat pipe assembly in an embodiment of the present invention;

FIG. 4 is a front view of a PCBA board in an embodiment of the present invention;

fig. 5 is a perspective view of a seal housing in an embodiment of the invention.

Detailed Description

Reference will now be made in detail to the present preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout.

In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.

Referring to fig. 1 to 5, a structure capable of realizing centralized heat dissipation and sealing of electronic components includes a domain controller housing 10, a heat pipe assembly 30, a heat dissipation assembly 40, and a sealing seat 50.

Wherein, the PCBA board 21 is installed inside the domain controller housing 10, the domain controller housing 10 includes the domain controller upper cover 11 and the domain controller lower cover 12 that are connected with each other, and the domain controller upper cover 11 and the domain controller lower cover 12 are connected and then internally formed with the containing cavity for installing the PCBA board 21. In addition to the high heat generating power chip 22, other low heat generating power chips 23 are disposed on the PCBA board 21, and the "high heat generating power" and "low heat generating power" in the embodiment of the present invention are based on the respective chips in the PCBA board 21, and those skilled in the art can understand that there is no unclear situation.

The heat pipe assembly 30 includes a heat pipe mounting base 31 that conducts heat with the high heat generating power chip 22 of the PCBA board 21 through a heat conductive medium, and a plurality of heat pipes 32 connected to the heat pipe mounting base 31. Further preferably, the heat dissipation auxiliary boss 14 is provided on the side surface of the high heat generation power chip 22 of the PCBA board 21, and is used for conducting more heat of the high heat generation power chip 22 of the PCBA board 21 to the heat pipe mounting base 31, and then dissipating the heat through each heat pipe 32. The heat dissipation auxiliary boss 14 is provided to transfer heat from the side surface of the high heat generating power chip 22 to the heat pipe mounting base 31, so as to increase the heat conduction from the high heat generating power chip to the heat pipe 32.

The heat dissipation assembly 40 includes at least one heat sink 41 installed outside the domain controller upper cover 11 and a fan 42 for dissipating heat from the heat sink 41, the heat pipes 32 are inserted into the heat sink 41 after penetrating out of the domain controller upper cover 11 to dissipate heat through the heat sink 41, and the domain controller upper cover 11 is provided with through holes 13 through which the heat pipes 32 pass. The heat sink 41 has an insertion hole 43 into which the heat supply pipe 32 is inserted.

It is understood that most of the heat of the high heat generating power chip 22 is transferred from the heat pipe mounting base 31 to the heat pipe 32, the heat pipe 32 transfers the heat to the heat sink 41, and the heat sink 41 performs air cooling heat dissipation by the fan 42.

In this embodiment, two radiators 41 are disposed and distributed on the left and right sides of the through hole 13, and the heat pipes 32 in the heat pipe assembly 30 are inserted into the two radiators 41 in an interlaced manner, and correspondingly, two fans 42 are disposed.

Preferably, the upper domain controller cover 11, the lower domain controller cover 12, the heat pipe mounting base 31, the auxiliary heat dissipation boss 14, the heat sink 41, and the sealing seat 50 are made of high thermal conductivity material, and the high thermal conductivity material is one or more of aluminum alloy, copper alloy, aluminum, and copper. Specifically, the two radiators 41 are FIN radiators, the thickness of each FIN is 0.3-1 mm, the FINs are arranged at intervals in the vertical direction, the distance is 1.5-3 mm, the usable materials are high-thermal-conductivity-coefficient materials such as pure aluminum, pure copper, aluminum alloy and copper alloy, and the processing mode is a FIN fastening process. The number of the heat pipes 32 is at least eight, the diameter of each heat pipe 32 is 6-10 mm, liquid ammonia, acetone or other working media are filled and sealed in each heat pipe 32, and the heat conductivity coefficient is larger than or equal to 10000W/(mxK). The heat pipe mounting base 31 is made of high thermal conductive materials such as aluminum alloy and copper alloy, and can be designed and adjusted according to the number and diameter of heat pipes to be actually used and the size and position of a high-heating-power chip. The heat dissipation auxiliary boss 14 on the side surface of the high-heating-power chip 22 is made of high-heat-conduction materials such as aluminum alloy and copper alloy, and can be designed and adjusted according to the size and position of the actual high-power heating chip.

In this embodiment, two heat sinks 41 are provided, most of the heat of the high heat generating power chip 22 is transferred from the heat pipe mounting base 31 to the heat pipe 32, the heat pipe 32 transfers the heat to the heat sink 41, and the heat sink 41 performs air cooling heat dissipation by the fan 42. The heat pipes 32 transfer heat to the two heat sinks 41 in the vertical direction, and the heat dissipation fins of the heat sinks 41 are cooled by air via the corresponding fans 42.

Referring to fig. 2, 3 and 5, the sealing housing 50 is connected to the domain controller upper cover 11 for sealing the through hole 13. Specifically, the sealing housing 50 includes a cover plate 51 for covering an exposed portion of the heat pipe 32 between the domain controller upper cover 11 and the heat sink 41, an edge of the cover plate 51 extends downward to form a plurality of side plates 52, and each side plate 52 is connected to the domain controller upper cover 11, so as to seal the through hole 13. In this embodiment, the cover plate 51 is disposed between the two heat sinks 41, the left and right sides of the cover plate 51 are pressed against the heat sinks 41, and the two ends of the cover plate 51 are respectively provided with a side plate 52 extending downward.

It can be understood that, firstly, in order to ensure that the heat pipe 32 can transfer the heat generated by the high heat generating power chip 22 to the heat dissipating fins of the heat sink 41, the domain controller upper cover 11 is correspondingly perforated to allow the heat pipe 41 to pass through the domain controller upper cover 11 through the through hole 13. Then, the domain controller housing 10, the sealing seat body 50 and the two radiators 41 are connected in a welding mode, and the domain controller upper cover 11 and the domain controller lower cover 12 can be connected and sealed by bolts, so that dust, water and the like can be prevented from entering the domain controller housing 10 through the through holes of the domain controller upper cover 11, and the PCBA board 21 is waterproof and dustproof.

In other embodiments, only one heat sink may be provided, one side of the cover plate of the sealing seat body is connected to the heat sink, the other three sides are respectively provided with a side plate extending downwards, and the sides are connected to the upper cover of the domain controller, so as to seal the through hole. Of course, if three radiators are arranged, the three sides of the cover plate of the sealing seat body are respectively connected to the corresponding radiators, the other side extends downwards to form a side plate, and the side plate is connected to the upper cover of the domain controller, so that the through hole is sealed. The cover plate and the corresponding side plate can be adjusted correspondingly by those skilled in the art according to the number and arrangement of the radiators.

The inner side of the upper cover 11 of the domain controller and the inner side of the lower cover 12 of the domain controller are provided with heat dissipation bosses 15, other low-heating-power chips 23 on the PCBA board 21 are in heat transfer with the corresponding heat dissipation bosses 15 through heat conducting media, and heat dissipation is completed by means of the upper cover 11 of the domain controller and the lower cover 12 of the domain controller, so that all electronic components of the domain controller can meet the heat dissipation requirements.

In addition, the sealing seat 50 includes a plurality of connecting strips 53 mounted on the heat sink 41, the connecting strips 53 are connected to the cover plate 51, and the fan 42 is mounted on the heat sink 41 through the connecting strips 53 to dissipate heat from the heat sink.

The inner side of the domain controller upper cover 11 is provided with a mounting groove for the embedding and fixing of the heating pipe mounting base 31. Fix heat pipe mounting base 31 through the mounting groove, the interval of heat pipe mounting base 31 and PCBA board 21's high heating power chip 22 is 0.2 ~ 0.7mm, avoids leading to unable concentrated heat dissipation that realizes high heating power chip because machining error and unable location. The length and width of the mounting groove are consistent with those of the embedded part of the heat pipe mounting base 31 and are larger than those of the high-heat-generating power chip; the depth of the mounting groove is 0.3mm, and the purpose is to position the heat pipe mounting base while ensuring the rigidity of the upper cover of the field control, and ensure that the distance between the heat pipe mounting base 31 and the high-heating power chip 22 of the PCBA board 21 is 0.2-0.7 mm.

In the embodiment, the structure for centralized heat dissipation and sealing of the electronic components can be realized, and the overall dimension is 247.6mm × 189.5mm × 65 mm. The upper cover 11 and the lower cover 12 of the domain controller can be manufactured by casting, milling and the like, and are made of high-thermal-conductivity materials such as aluminum alloy, copper alloy, aluminum, copper and the like.

The embodiment also shows a preparation method for preparing the structure capable of realizing centralized heat dissipation and sealing of the electronic component, which comprises the following steps:

s1, the heat pipe 32 in the heat pipe assembly 30 is connected to the heat sink 41.

S2, the seal housing 50 and the heat sink 41 are welded together.

S3, bending the heat pipe 32 through the through hole of the domain controller upper cover 11.

S4, the heat sink 41 and the domain controller upper cover 11 are welded in position.

And S5, the heat pipe is connected with the heat pipe mounting base in an embedded mode.

S6, the heat pipe mounting base 31 is mounted inside the domain controller upper cover 11.

S7, assembling the domain controller upper cover 11, the domain controller lower cover 12, the fan 42 and the sealing housing 50 by fasteners.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.

Claims (10)

1. The utility model provides a can realize that electronic components concentrates heat dissipation and sealed structure which characterized in that: comprises that

A domain controller housing with a PCBA board mounted therein, the domain controller housing comprising the domain controller upper cover and the domain controller lower cover connected to each other;

the heat pipe assembly comprises a heat pipe mounting base and a plurality of heat pipes, wherein the heat pipe mounting base conducts heat with a high-heating-power chip of the PCBA through a heat conducting medium, and the heat pipes are connected to the heat pipe mounting base;

the heat pipe penetrates out of the upper cover of the domain controller and is inserted into the radiator so as to radiate heat through the radiator, and the upper cover of the domain controller is provided with a through hole for the heat pipe to pass through; and

and the sealing seat body is connected with the upper cover of the domain controller and is used for sealing the through hole.

2. The structure capable of realizing centralized heat dissipation and sealing of electronic components according to claim 1, characterized in that: the sealing base comprises a cover plate used for covering the exposed part of the heat pipe between the domain controller upper cover and the radiator, the edge of the cover plate extends downwards to form a plurality of side plates, and each side plate is connected to the domain controller upper cover, so that the through hole is sealed.

3. The structure capable of realizing centralized heat dissipation and sealing of electronic components according to claim 2, characterized in that: the two radiators are arranged and distributed on the left side and the right side of the through hole, and the heat pipes in the heat pipe assembly are inserted into the two radiators in a staggered mode in sequence.

4. The structure capable of realizing centralized heat dissipation and sealing of electronic components according to claim 3, characterized in that: the cover plate is arranged between the two radiators, the left side and the right side of the cover plate are pressed on the radiators, and the two ends of the cover plate are respectively provided with the side plates in a downward extending mode.

5. The structure capable of realizing centralized heat dissipation and sealing of electronic components according to claim 2, characterized in that: the sealed pedestal is including installing a plurality of on the radiator connects the slat, connect slat and cover connection, the fan passes through it installs to connect the slat on the radiator, in order to right the radiator dispels the heat.

6. The structure capable of realizing centralized heat dissipation and sealing of electronic components according to any one of claims 1 to 5, characterized in that: the side of the high heating power chip of PCBA board sets up the supplementary boss of heat dissipation for with the heat of the high heating power chip of PCBA board conducts more to the heat pipe mounting base.

7. The structure capable of realizing centralized heat dissipation and sealing of electronic components as claimed in claim 6, wherein: and the inner side of the upper cover of the domain controller is provided with a mounting groove for the heat pipe mounting base to be embedded and fixed.

8. The structure capable of realizing centralized heat dissipation and sealing of electronic components according to claim 7, characterized in that: the distance between the heat pipe mounting base and the high-heating-power chip of the PCBA board is 0.2-0.7 mm.

9. The structure capable of realizing centralized heat dissipation and sealing of electronic components as claimed in claim 6, wherein: the upper cover of the domain controller, the lower cover of the domain controller, the heat pipe mounting base, the heat dissipation auxiliary boss, the radiator and the sealing seat body are made of high-thermal-conductivity-coefficient materials, and the high-thermal-conductivity-coefficient materials are one or more of aluminum alloy, copper alloy, aluminum and copper.

10. A preparation method for preparing the structure capable of realizing centralized heat dissipation and sealing of electronic components according to any one of claims 1 to 9, comprising the following steps:

s1, connecting the heat pipe in the heat pipe assembly with the radiator;

s2, welding the sealing seat body and the radiator in a positioning manner;

s3, bending the heat pipe to pass through the through hole of the upper cover of the domain controller;

s4, welding the radiator and the upper cover of the domain controller in a positioning way;

s5, the heat pipe is connected with the heat pipe mounting base in an embedded manner;

s6, embedding the heat pipe mounting base in the upper cover of the domain controller;

and S7, assembling the upper cover of the domain controller, the lower cover of the domain controller, the fan and the sealing seat body through fasteners.

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