CN114951975A - Laser processing apparatus and method - Google Patents

Abstract

The invention relates to a laser processing equipment and method. The processing equipment comprises a laser emission source, a light source emitted by the laser emission source is connected with a light splitting device, and the light source emitted by the laser emission source is input into the light splitting device and then outputs two optical path branches. It is slidably installed at the intersection of its two optical path branches. The sliding direction of the beam splitting device intersects with the incident direction of the light source emitted by the laser emitting source entering the beam splitting device. Each optical path branch is connected with a processing device. In addition, the processing methods of the processing devices connected to different optical path branches are different, and spectroscopic devices of different specifications can be alternatively arranged at the intersection of the two intersecting optical paths. By adopting the invention, the processing methods of the processing devices of different optical path branches are different, which not only improves the processing efficiency, but also reduces the cost of the enterprise; Effectively improve the processing efficiency of a laser processing equipment.

Description

Laser processing equipment and method

technical field

The present invention relates to the field of laser processing, in particular to a laser processing device and method.

Background technique

At present, the vigorous rise of domestic laser equipment manufacturers and the introduction of foreign equipment have led to fierce competition in domestic laser equipment. At present, the processing methods of laser processing equipment are mainly divided into two types, one is laser marking, laser engraving, etc. through laser processing equipment; the other is cutting workpieces through laser processing equipment. Laser scanning galvanometers are required for laser marking, laser engraving and other processes, and laser processing objective lenses or laser cutting heads are required for workpiece cutting; at present, the factory has requirements for both processing methods, so generally two sets of equipment are equipped. One device is used for laser marking, laser engraving, etc. through a laser scanning galvanometer, and the other device is used for workpiece cutting through a laser processing objective lens or a laser cutting head; or the same laser processing equipment is used for laser scanning The galvanometer and the laser processing objective lens (or laser cutting head) perform line switching, but the laser scanning galvanometer and the laser processing objective lens (or laser cutting head) cannot be processed at the same time, resulting in low processing efficiency.

SUMMARY OF THE INVENTION

Based on this, it is necessary to provide a laser processing apparatus and method that can improve the efficiency of laser processing in response to the above technical problems.

On the one hand, a laser processing equipment is provided, the laser processing equipment includes a laser emission source, a light source emitted by the laser emission source is connected to a spectroscopic device, and the light source emitted by the laser emission source is input into the spectroscopic device and outputs two Optical path branch, the light splitting device is slidably installed at the intersection of its two optical path branches, the sliding direction of the light splitting device and the incident direction of the light source emitted by the laser emitting source entering the light splitting device Each optical path branch is connected with a processing device, and the processing devices connected to different optical path branches have different processing methods, and the spectroscopic devices of different specifications can be alternatively arranged at the intersection of the two intersecting optical paths.

In one of the embodiments, the processing methods of the different processing devices include an objective lens/cutting head processing method and a laser galvanometer processing method.

In one embodiment, the light source emitted by the laser emitting source is connected with at least two light splitting devices, and the output light source of one of the optical branch of the former light splitting device is used as the input light source of the latter light splitting device.

In one of the embodiments, a moving mechanism is provided at the intersection of two adjacent optical path branches, the beam splitting device adopts a beam splitter, and the beam splitter is connected to the moving mechanism.

In one of the embodiments, a control device is further included, and the control device is communicatively connected with a plurality of the moving mechanisms.

In one embodiment, a dimming fixture, an attenuator, a beam expander and a dimming fixture are sequentially connected on the optical path between the light splitting device and the processing device.

In another aspect, a laser processing method is provided, the laser processing method comprising:

The control device controls the splitting device to move to the optical path of the light source emitted by the laser emission source, and the light source emitted by the laser emission source is input to the optical splitting device to form two optical path branches;

Different processing devices connected to different optical path branches use different processing methods to process the same or different workpieces at the same time;

The control device controls the beam splitting device to leave the light path of the light source emitted by the laser emitting source, and the light source emitted by the laser emitting source is input to the corresponding processing device, and the workpiece is processed by a processing method corresponding to the processing device.

In one embodiment, the laser processing equipment used in the laser processing method includes a plurality of light splitting devices, and the laser processing method further includes:

The control device controls multiple spectroscopic devices, so that different processing devices participate in laser processing at different stations. .

In one embodiment, the laser processing method further includes:

Replace the spectroscopic device with different specifications to change the processing power of different optical branches.

In one embodiment, the laser processing method further includes:

Adjust the parameters of the attenuator to change the processing power of different optical branches.

The above-mentioned technical scheme of the present invention has the following advantages compared with the prior art:

In the above-mentioned laser processing equipment and method, after the light source emitted by the laser emission source is input into the optical splitting device, it outputs two optical path branches, each optical path branch will be connected to a processing device, and the processing methods of different optical path branches are different. , including the objective lens/cutting head processing method, the laser galvanometer processing method, and the processing devices of different processing methods are integrated into the same laser processing equipment, which not only improves the processing efficiency, but also reduces the cost of the enterprise; in addition, on the same laser processing equipment A plurality of light splitting devices are arranged, and the output light source of one of the optical path branches of the former light splitting device is used as the input light source of the latter light splitting device, forming a series connection of the light splitting devices. The same light source provides a plurality of optical path branches. The configuration of the laser processing device enables different processing devices to perform laser operations at different stations, effectively improving the processing efficiency of a laser processing equipment.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings used in the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without any creative effort.

Fig. 1 is the first structural schematic diagram of the laser processing equipment of the present invention;

Fig. 2 is the second structural schematic diagram of the laser processing equipment of the present invention;

Fig. 3 is the third structural schematic diagram of the laser processing equipment of the present invention;

FIG. 4 is a method flow chart of the laser processing method of the present invention.

Instructions for reference signs:

1. Laser emission source; 2. Spectroscopic device; 3. Optical branch; 4. Processing device; 5. Control device; 6. Light adjustment fixture; 7. Attenuator; 8. Beam expander; 9. Reflector.

Detailed ways

In order to make the purpose, technical solutions and advantages of the present application more clearly understood, the present application will be described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application.

Example 1:

1 to 3, FIG. 1 is a schematic diagram of the first structure of the laser processing equipment of the present invention; FIG. 2 is a schematic diagram of the second structure of the laser processing equipment of the present invention; A schematic diagram of the third structure of the laser processing equipment of the present invention.

The laser processing equipment includes a laser emitting source 1, the light source emitted by the laser emitting source 1 is connected to a spectroscopic device 2, and the light source emitted by the laser emitting source 1 is input into the spectroscopic device 2 and then outputs two optical path branches 3. The spectroscopic device 2 is slidably installed at the intersection of its two optical path branches 3 , and the sliding direction of the spectroscopic device 2 intersects with the incident direction of the light source emitted by the laser emitting source 1 entering the spectroscopic device 2 Setting, each optical path branch 3 is connected with a processing device 4, and the processing methods of the processing devices 4 connected to different optical path branches 3 are different, and the spectroscopic devices 2 of different specifications are alternatively arranged in two intersecting optical paths. the intersection.

The laser processing equipment in the prior art cannot satisfy the simultaneous processing of workpieces in different processing methods. Based on this problem, the present invention proposes a laser processing equipment. The laser processing equipment includes a laser emission source 1, and the laser emission source 1 is used to provide Laser energy source for laser machining operations. The light source emitted by the laser emitting source 1 is connected with a spectroscopic device 2, and the spectroscopic device 2 is used to divide the light source emitted by the laser emitting source 1 into two to form two optical path branches 3, and each optical path branch 3 is connected to one The processing device 4, and the processing methods of the processing devices 4 connected with different optical path branches 3 are different, for example, one of the processing devices 4 adopts the objective lens/cutting head processing method, and the other processing device 4 adopts the laser galvanometer processing method, so different The processing device 4 connected to the optical path branch 3 can process the same or different workpieces in different processing methods at the same time, and can simultaneously mark and cut the same or different workpieces, that is, the same workpiece can be marked at the same time. and cutting, or, marking one workpiece and cutting the other workpiece, marking and cutting are carried out at the same time, which effectively improves the laser processing efficiency of the same laser processing equipment and reduces the cost. The spectroscopic device 2 is slidably installed at the intersection of its two optical path branches 3, so when the spectroscopic device 2 moves to the optical path of the light source emitted by the laser emission source 1, the spectroscopic device 2 participates in the work, at this time, the laser The light source emitted by the emission source 1 is input into the beam splitting device 2 and then divided into two to form two optical path branches 3, as shown in Figure 1; When the optical path is connected, the splitting device 2 does not participate in the work. At this time, the light source emitted by the laser emission source 1 is directly input to the corresponding light source branch, as shown in FIG. 2 . By moving the spectroscopic device 2, the switching of different processing modes can be realized, which effectively improves the processing efficiency of the laser processing equipment. The spectroscopic devices 2 have different specifications, and the powers of the optical branch 3 output by the spectroscopic devices 2 of different specifications are different. Therefore, in order to meet the requirements of different processing powers during laser processing, the spectroscopic device 2 of the required specification can be replaced according to the actual processing requirements. For example, the power ratio of the optical branch 3 output by the spectroscopic device 2 is 3:7, 4:6, etc. The user can choose according to the specific actual processing requirements, and can select the appropriate processing power for different workpieces to improve the processing power. quality. In addition, the sliding direction of the spectroscopic device 2 intersects with the incident direction of the light source emitted by the laser emitting source 1 entering the spectroscopic device 2 , that is, the sliding direction of the spectroscopic device 2 and the light source emitted by the laser emitting source 1 enter the spectroscopic device 2 . The incident directions of the laser beams are not set in parallel, so as to ensure that the spectroscopic device 2 includes two states, that is, the spectroscopic device 2 is located on the optical path of the light source emitted by the laser emission source 1, and the beam splitting device 2 is away from the optical path of the light source emitted by the laser emission source 1. .

In one of the embodiments, different processing methods of the processing device 4 include an objective lens/cutting head processing method and a laser galvanometer processing method.

The existing laser processing methods mainly include two types, one is the cutting of the workpiece, such as the objective lens/cutting head processing method; the other is the engraving of the workpiece, such as the laser galvanometer processing method. In order to ensure the coexistence of the two processing methods and also reduce the cost of the enterprise, the two laser processing methods are integrated into the same processing equipment. The function of processing can effectively improve the processing efficiency of laser processing equipment and reduce the cost of enterprises.

In one embodiment, the light source emitted by the laser emitting source 1 is connected to at least two spectroscopic devices 2, and the output light source of one of the optical branch 3 of the former spectroscopic device 2 is used as the latter spectroscopic device 2 input light sources.

As shown in Figure 3, the light source emitted by the laser emission source 1 is connected to at least two spectroscopic devices 2. In order to improve the production capacity of the enterprise, the existing processing methods and processing modes of the laser processing equipment have been unable to meet the needs of the manufacturer. The processing tools are modularized and integrated on the same processing equipment, similar to the processing equipment on the automatic production line, including multiple stations, each station is provided with a processing device 4 to realize the automatic operation of the assembly line; modularization refers to each station. Each processing device 4 is a processing module, and integration refers to integrating multiple processing modules into one laser processing device. Therefore, the light source of the same laser emitting source 1 passes through a plurality of spectroscopic devices 2 in sequence, and the output light source of one of the optical path branches 3 of the previous spectroscopic device 2 is used as the input light source of the next spectroscopic device 2, and they are connected in sequence, which can satisfy multiple requirements. The requirements of a processing device 4. And considering that the laser power of the light source emitted by the same laser emitting source 1 will drop after being split by multiple spectroscopic devices 2, different processing procedures can be configured for different stations, and some processing procedures require The laser processing power is relatively large, and the laser processing power required by some processing procedures is relatively small. The resource allocation can be carried out according to the specific actual needs to improve the utilization rate of the laser processing power.

In one of the embodiments, a moving mechanism is provided at the intersection of two adjacent optical path branches 3 , and the beam splitting device 2 adopts a beam splitter, and the beam splitter is connected to the moving mechanism.

In the actual application scenario, the spectroscopic device 2 needs to be continuously moved according to the actual scene requirements. Therefore, the spectroscopic device 2 needs a moving mechanism, and the movement of the spectroscopic device 2 is realized by the moving mechanism. Therefore, the spectroscopic device 2 can be directly connected to the moving mechanism. Generally, the moving mechanism includes a sliding rail and a sliding block. The sliding rail is fixed on the laser processing equipment, and the sliding block is slidably connected to the sliding rail. The power of the sliding block The source can be driven by a motor, or driven by a cylinder, etc. Preferably, Qigong is selected to move, which can reduce the cost. The piston rod of the cylinder drives the slider to move, the beam splitter 2 is connected to the slider, the slider will drive the beam splitter 2 to move, and the beam splitter 2 can enter or leave the light path of the light source emitted by the laser emission source 1 to achieve different Switching of processing methods.

In one of the embodiments, a control device 5 is further included, and the control device 5 is connected in communication with a plurality of the moving mechanisms.

When there are multiple beam splitting devices 2 , the laser processing equipment can be divided into multiple optical path branches 3 , and the multiple optical path branches 3 can be connected to the processing devices 4 at different stations, so as to realize the assembly line processing of the multiple processing devices 4 . In the actual demand scenario, it is necessary to set which stations of the processing devices 4 need to participate in the processing and which of the processing devices 4 do not need to participate in the processing according to the actual needs. Therefore, it is necessary to control multiple spectroscopic devices 2 to determine A spectroscopic device 2 involved in processing is required. The laser processing equipment further includes a control device 5, which is connected in communication with the moving mechanism, so that the spectroscopic device 2 that needs to be processed can be controlled by the control device 5. In the automated production line, the laser processing equipment is directly integrated into the automated production line, and different processing devices 4 are located on different workstations, which improves the versatility and processing efficiency of the laser processing equipment. As shown in the figure, one to four of the spectroscopic devices 2 can be selected to participate in the laser processing.

In one embodiment, a dimming fixture 6 , an attenuator 7 , a beam expander 8 and a dimming fixture 6 are sequentially connected on the optical path between the spectroscopic device 2 and the processing device 4 .

In order to realize the effective propagation of the optical path on the entire laser processing equipment, it is necessary to carry out corresponding optical path control on the optical path. A dimming fixture 6 , an attenuator 7 , a beam expander 8 and a dimming fixture 6 are sequentially arranged on the optical path between the spectroscopic device 2 and the processing device 4 . The dimming fixture 6 mainly plays the role of optical path alignment, so that the optical path branch 3 of the spectroscopic device 2 is aligned with the optical path of the attenuator 7, and the optical path of the beam expander 8 is aligned with the optical path of the processing tool. The attenuator 7 plays the role of power attenuation. As shown in FIG. 1 , when the beam splitting device 2 is located on the optical path of the light source emitted by the laser emission source 1, the beam splitting device 2 participates in the laser processing. Therefore, the light source emitted by the laser emission source 1 After input to the beam splitting device 2, two optical path branches 3 are formed; when the beam splitting device 2 leaves the optical path of the light source emitted by the laser emission source 1, the light source emitted by the laser emission source 1 will only enter the optical path branch 3 on the right side of the figure. ; In order to satisfy the simultaneous laser processing of the two optical path branches 3, and to be able to perform laser processing independently, an attenuator 7 is provided. In the actual scene where there are two optical path branches 3, the attenuator 7 can attenuate the laser power of one of the optical path branches 3 to zero, so that one of the optical path branches 3 can be individually laser processed, and one of the optical path branches 3 Not involved in laser processing. The beam expander 8 plays the role of adjusting the beam diameter to meet different machining precisions.

Embodiment 2:

Referring to FIG. 4 , FIG. 4 is a method flowchart of the laser processing method of the present invention.

The laser processing method based on the laser processing equipment, by means of the movement of the spectroscopic device 2, realizes that the processing devices 4 using different processing methods simultaneously process the same or different workpieces; Combined machining of the machining device 4 .

The laser processing method includes:

As shown in FIG. 1 , the control device 5 controls the spectroscopic device 2 to move to the optical path of the light source emitted by the laser emitting source 1, and the light source emitted by the laser emitting source 1 is input to the spectroscopic device 2 to form two optical path branches 3;

Different processing devices 4 connected to different optical path branches 3 respectively use different processing methods to simultaneously process the same or different workpieces.

As shown in Figure 1, it includes a laser emission source 1, a beam splitting device 2 (including a moving mechanism, not shown in the figure), a processing device 4 for the processing of the objective lens/cutting head, a processing device 4 for the processing of a laser galvanometer, and a dimming device. Fixture 6, attenuator 7, beam expander 8, reflector 9. Connect these devices according to the actual optical path requirements. The state at this time is that the spectroscopic device 2 is located on the optical path of the light source emitted by the laser transmitter. The specific method is:

The control device 5 is connected in communication with the moving mechanism, and the control device 5 controls the movement of the moving mechanism, so that the moving mechanism drives the spectroscopic device 2 to move to the optical path of the light source emitted by the laser emission source 1, and the light source emitted by the laser emission source 1 undergoes dimming control. The device 6 is input to the light splitting device 2, and the light splitting device 2 divides the light source into two to form two optical path branches 3, as shown in FIG. 1, the left optical path branch 3 and the right optical path branch 3. The left optical path branch 3 passes through the dimming fixture 6, the attenuator 7, the beam expander 8, and the dimming fixture 6 in sequence, and finally reaches the processing device 4, that is, the processing device 4 in the objective lens/cutting head processing method. At this time, the processing device 4 can perform the laser processing of the cutting method. At the same time, the right optical path branch 3 passes through the reflector 9, the dimming fixture 6, the attenuator 7, the beam expander 8, the dimming fixture 6, and the reflector 9 in sequence, and finally reaches the processing device 4, that is, the laser galvanometer The processing device 4 in the processing mode, at this time, the processing device 4 can perform the laser processing in the engraving mode. Therefore, the optical path branches 3 on the left and right sides can perform laser processing at the same time, and different laser processing methods can be used to perform laser processing on the same or different workpieces. The reflecting mirror 9 mainly plays the role of changing the optical path, and a required number of reflecting mirrors 9 can be set according to actual requirements to transform the optical path.

In addition, due to the existence of the attenuator 7, the attenuator 7 can attenuate the laser power of the optical branch 3 where the attenuator 7 is located to zero. Therefore, in order to enable the processing device 4 of the optical path branches 3 on the left and right sides to work at the same time or work independently, attenuators 7 are provided, and the optical path branches 3 on the left and right sides can be laser processed at the maximum power, or can be Within the maximum power range, the attenuator 7 is used to perform laser operations at different powers. Of course, it also includes using the attenuator 7 to attenuate the power of a certain optical branch 3 to zero, so that another optical branch 3 can independently perform laser operations.

As shown in FIG. 2 , the state at this time is that the spectroscopic device 2 leaves the optical path of the light source emitted by the laser emission source 1 . The specific method is:

The control device 5 controls the beam splitting device 2 to leave the optical path of the light source emitted by the laser emission source 1 .

The control device 5 is connected in communication with the moving mechanism, and the control device 5 controls the movement of the moving mechanism, so that the moving mechanism drives the spectroscopic device 2 to leave the optical path of the light source emitted by the laser emission source 1, and the light source emitted by the laser emission source 1 directly reaches the reflector 9, After passing through the dimming fixture 6, the attenuator 7, the beam expander 8, the dimming fixture 6, and the reflector 9 in sequence, it finally reaches the processing device 4, that is, the processing device 4 of the laser galvanometer processing method. At this time, the processing device 4 can perform engraving laser processing. At this time, the power of the optical path branch 3 is relatively large, so the optical path branch 3 can process products with high power requirements, while the power of the optical path branch 3 that is split by the optical splitting device 2 is relatively small, which can process power requirements. low product.

As shown in Figure 3, a plurality of beam splitting devices 2 can be set on the optical path of the laser processing equipment, and the specific implementation method is as follows:

In one of the embodiments, the laser processing equipment used in the laser processing method includes a plurality of spectroscopic devices 2, and the laser processing method further includes:

The control device 5 controls the plurality of spectroscopic devices 2 so that different processing devices 4 participate in laser processing at different stations.

The control device 5 is connected in communication with the moving mechanism, the control device 5 can control the moving mechanism to slide, and the moving mechanism drives the spectroscopic device 2 to slide, so the sliding action of the spectroscopic device 2 can be indirectly controlled by the control device 5 . The control device 5 controls the plurality of spectroscopic devices 2 to control the spectroscopic device 2 specifically involved in laser processing. Different spectroscopic devices 2 are connected to different processing devices 4, and different processing devices 4 are placed in different workstations. Through the control device 5, different spectroscopic devices 2 can be controlled to be located on the optical path of the light source emitted by the laser transmitter. 2. The corresponding processing devices 4 can participate in the laser operation, and the processing devices 4 located in different stations can complete the corresponding processing actions to realize the pipeline laser processing operation.

In one embodiment, the laser processing method further comprises:

Replace the spectroscopic device 2 with different specifications to change the processing power of the different optical path branches 3 .

The spectroscopic devices 2 have different specifications, and the powers of the optical branch 3 output by the spectroscopic devices 2 of different specifications are different. Therefore, in order to meet the requirements of different processing powers during laser processing, the spectroscopic device 2 of the required specification can be replaced according to the actual processing requirements. For example, the power ratio of the optical branch 3 output by the spectroscopic device 2 is 3:7, 4:6, etc. The user can choose according to the specific actual processing requirements, and can select the appropriate processing power for different workpieces to improve the processing power. quality. By replacing the spectroscopic device 2 with different specifications, the processing power of the different optical path branches 3 can be changed. The beam splitter 2 determines the maximum power of the optical branch 3 passing through the beam splitter 2 .

In one embodiment, the laser processing method further comprises:

Adjust the parameters of the attenuator 7 to change the processing power of the different optical branch 3 .

The control device 5 controls the spectroscopic device 2 to move to the optical path of the light source emitted by the laser emitting source 1, and the light source emitted by the laser emitting source 1 is input to the spectroscopic device 2, and when two optical path branches 3 are formed, the attenuator 7 can be adjusted. parameters to change the processing power of different optical path branches 3. Due to the existence of the attenuator 7, the attenuator 7 can attenuate the laser power of the optical branch 3 where the attenuator 7 is located to zero. Therefore, in order to enable the processing device 4 of the optical path branches 3 on the left and right sides to work at the same time or work independently, attenuators 7 are provided, and the optical path branches 3 on the left and right sides can be laser processed at the maximum power, or can be Within the maximum power range, the attenuator 7 is used to perform laser operations at different powers. Of course, it also includes using the attenuator 7 to attenuate the power of a certain optical branch 3 to zero, so that another optical branch 3 can independently perform laser operations.

It should be understood that although the various steps in the flowchart of FIG. 4 are sequentially displayed according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, the execution of these steps is not strictly limited to the order, and these steps may be performed in other orders. Moreover, at least a part of the steps in FIG. 4 may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily executed and completed at the same time, but may be executed at different times. The execution of these sub-steps or stages The sequence is also not necessarily sequential, but may be performed alternately or alternately with other steps or sub-steps of other steps or at least a portion of a phase.

The technical features of the above embodiments can be combined arbitrarily. In order to make the description simple, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction in the combination of these technical features It is considered to be the range described in this specification.

The above-mentioned embodiments only represent several embodiments of the present application, and the descriptions thereof are specific and detailed, but should not be construed as a limitation on the scope of the invention patent. It should be pointed out that for those skilled in the art, without departing from the concept of the present application, several modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the scope of protection of the patent of the present application shall be subject to the appended claims.

Claims (10)

1. The laser processing equipment is characterized by comprising a laser emission source (1), wherein a light source emitted by the laser emission source (1) is connected with a light splitting device (2), a light source emitted by the laser emission source (1) is input into the light splitting device (2) and then outputs two light path branches (3), the light splitting device (2) is arranged at the intersection of two light path branches (3) thereof in a sliding way, the sliding direction of the light splitting device (2) is intersected with the incident direction of a light source emitted by the laser emission source (1) entering the light splitting device (2), each light path branch (3) is connected with a processing device (4), and the processing modes of the processing devices (4) connected with different light path branches (3) are different, and the light splitting devices (2) with different specifications can be arranged at the intersection of two intersecting light paths in a replaceable manner.

2. The laser processing apparatus according to claim 1, wherein the processing modes of the different processing devices (4) comprise an objective/cutting head processing mode and a laser galvanometer processing mode.

3. The laser processing apparatus according to claim 2, wherein the light source emitted by the laser emission source (1) is connected with at least two light splitting devices (2), and the output light source of one of the optical path branches (3) of the former light splitting device (2) is used as the input light source of the latter light splitting device (2).

4. The laser processing equipment according to any one of claims 1 to 3, wherein a moving mechanism is arranged at the intersection of two adjacent light path branches (3), and the light splitting device (2) adopts a light splitting mirror connected to the moving mechanism.

5. The laser machining apparatus according to claim 4, further comprising a control device (5), the control device (5) being communicatively connected to a plurality of the moving mechanisms.

6. The laser processing apparatus according to claim 1, wherein a dimming jig (6), an attenuator (7), a beam expander (8) and a dimming jig (6) are connected in sequence on the light path between the light splitting device (2) and the processing device (4).

7. A laser processing method using the laser processing apparatus according to any one of claims 1 to 6, characterized by comprising:

the control device (5) controls the light splitting device (2) to move to a light path of a light source emitted by the laser emission source (1), and the light source emitted by the laser emission source (1) is input into the light splitting device (2) to form two light path branches (3);

different processing devices (4) connected with different light path branches (3) respectively adopt different processing modes to simultaneously process the same or different workpieces;

the control device (5) controls the light splitting device (2) to leave the light path of the light source emitted by the laser emission source (1), the light source emitted by the laser emission source (1) is input into the corresponding processing device (4), and the workpiece is processed by adopting a processing mode corresponding to the processing device (4).

8. The laser processing method according to claim 7, wherein the laser processing apparatus used in the laser processing method includes a plurality of beam splitters (2), and the laser processing method further includes:

the control device (5) controls the plurality of light splitting devices (2) so that different processing devices (4) participate in laser processing at different stations.

9. The laser processing method according to claim 7, further comprising:

and replacing the light splitting devices (2) with different specifications to change the processing power of different light path branches (3).

10. The laser processing method according to claim 9, further comprising:

and adjusting parameters of the attenuator (7) to change the processing power of different optical path branches (3).

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