CN114951975A - Laser processing apparatus and method - Google Patents
Laser processing apparatus and method Download PDFInfo
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- CN114951975A CN114951975A CN202210608261.6A CN202210608261A CN114951975A CN 114951975 A CN114951975 A CN 114951975A CN 202210608261 A CN202210608261 A CN 202210608261A CN 114951975 A CN114951975 A CN 114951975A
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- 230000003287 optical effect Effects 0.000 claims description 41
- 238000003672 processing method Methods 0.000 claims description 26
- 230000007246 mechanism Effects 0.000 claims description 25
- 238000003754 machining Methods 0.000 claims description 15
- 238000005520 cutting process Methods 0.000 claims description 11
- 230000008859 change Effects 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 7
- 238000004891 communication Methods 0.000 description 6
- 238000003698 laser cutting Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000010330 laser marking Methods 0.000 description 3
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
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Abstract
The invention relates to a laser processing device and a method, wherein the processing device comprises a laser emission source, a light source emitted by the laser emission source is connected with a light splitting device, the light source emitted by the laser emission source outputs two light path branches after being input into the light splitting device, the light splitting device can be arranged at the intersection of the two light path branches in a sliding manner, the sliding direction of the light splitting device is intersected with the incident direction of the light source emitted by the laser emission source entering the light splitting device, each light path branch is connected with a processing device, the processing modes of the processing devices connected with different light path branches are different, and the light splitting devices with different specifications can be alternatively arranged at the intersection of the two intersected light paths. By adopting the invention, the processing modes of the processing devices of different light path branches are different, thereby not only improving the processing efficiency, but also reducing the enterprise cost; the laser operation of different processing devices at different stations is realized by the configuration of the light splitting device, and the processing efficiency of one laser processing device is effectively improved.
Description
Technical Field
The invention relates to the field of laser processing, in particular to laser processing equipment and a laser processing method.
Background
The present domestic laser equipment manufacturers are vigorously rising, and the introduction of foreign equipment causes the domestic laser equipment to be rather fierce in competition. The processing mode of present laser processing equipment mainly divide into two kinds, one kind is that laser marking, laser carve in through laser processing equipment etc.: another is to cut the workpiece by a laser processing apparatus. The procedures of laser marking, laser inner carving and the like need laser scanning galvanometers, and the cutting of the workpiece needs laser processing of an objective lens or a laser cutting head; at present, a factory has requirements on two processing modes, so that two devices are generally equipped, one device is used for carrying out laser marking, laser inner carving and the like through a laser scanning galvanometer, and the other device is used for cutting a workpiece through a laser processing objective lens or a laser cutting head; or the same laser processing equipment is adopted to perform line switching between the laser scanning galvanometer and the laser processing objective lens (or the laser cutting head), but the laser scanning galvanometer and the laser processing objective lens (or the laser cutting head) cannot be processed simultaneously, so that the processing efficiency is low.
Disclosure of Invention
In view of the above, it is necessary to provide a laser processing apparatus and method capable of improving laser processing efficiency in view of the above technical problems.
On the one hand, the laser processing equipment comprises a laser emission source, a light source emitted by the laser emission source is connected with a light splitting device, two light path branches are output after the light source emitted by the laser emission source is input into the light splitting device, the light splitting device can be installed at the intersection of the two light path branches in a sliding mode, the sliding direction of the light splitting device and the incident direction of the light source emitted by the laser emission source entering the light splitting device are arranged in an intersecting mode, each light path branch is connected with a processing device, the processing modes of the processing devices connected with different light path branches are different, and the light splitting devices of different specifications can be arranged at the intersection of the two intersecting light paths in a replaceable mode.
In one embodiment, the processing modes of the different processing devices include an objective lens/cutting head processing mode and a laser galvanometer processing mode.
In one embodiment, the light source emitted by the laser emission source is connected with at least two light splitting devices, and the output light source of one of the optical path branches of the former light splitting device is used as the input light source of the latter light splitting device.
In one embodiment, a moving mechanism is arranged at the intersection of two adjacent light path branches, the light splitting device adopts a light splitter, and the light splitter is connected to the moving mechanism.
In one embodiment, the mobile mechanism further comprises a control device, and the control device is connected with the mobile mechanisms in a communication mode.
In one embodiment, a dimming jig, an attenuator, a beam expander and a dimming jig are sequentially connected to an optical path between the light splitting device and the processing device.
In another aspect, there is provided a laser processing method including:
the control device controls the light splitting device to move to a light path of a light source emitted by the laser emission source, and the light source emitted by the laser emission source is input into the light splitting device to form two light path branches;
different processing devices connected with different light path branches respectively adopt different processing modes to simultaneously process the same or different workpieces;
the control device controls the light splitting device to leave a light path of a light source emitted by the laser emission source, the light source emitted by the laser emission source is input to the corresponding processing device, and the workpiece is processed by adopting a processing mode corresponding to the processing device.
In one embodiment, the laser processing apparatus used in the laser processing method includes a plurality of light splitting devices, and the laser processing method further includes:
the control device controls the plurality of light splitting devices, so that different processing devices participate in laser processing at different stations. .
In one embodiment, the laser processing method further includes:
and the light splitting devices with different specifications are replaced to change the processing power of different light path branches.
In one embodiment, the laser processing method further includes:
and adjusting parameters of the attenuator to change the processing power of different optical path branches.
Compared with the prior art, the technical scheme of the invention has the following advantages:
according to the laser processing equipment and the laser processing method, after a light source emitted by a laser emission source is input into the light splitting device, two light path branches are output, each light path branch is connected with one processing device, the processing modes of the processing devices of different light path branches are different, the processing devices of different processing modes comprise an objective lens/cutting head processing mode and a laser galvanometer processing mode, and the processing devices of different processing modes are integrated on the same laser processing equipment, so that the processing efficiency is improved, and the enterprise cost is reduced; in addition, a plurality of light splitting devices are arranged on the same laser processing equipment, the output light source of one light path branch of the previous light splitting device is used as the input light source of the next light splitting device, the light splitting devices are connected in series, the same light source provides a plurality of light path branches, laser operation of different processing devices at different stations is realized through configuration of the light splitting devices, and the processing efficiency of the laser processing equipment is effectively improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic view of a first configuration of the laser machining apparatus of the present invention;
FIG. 2 is a second schematic structural view of the laser machining apparatus of the present invention;
FIG. 3 is a schematic view of a third structure of the laser machining apparatus of the present invention;
fig. 4 is a method flowchart of the laser processing method of the present invention.
The specification reference numbers indicate:
1. a laser emission source; 2. a light splitting device; 3. a light path branch; 4. a processing device; 5. a control device; 6. a light adjusting jig; 7. an attenuator; 8. a beam expander; 9. a mirror.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The first embodiment is as follows:
the laser processing apparatus of the present embodiment is shown in fig. 1 to 3, and fig. 1 is a schematic view of a first structure of the laser processing apparatus of the present invention; FIG. 2 is a second schematic structural view of the laser machining apparatus of the present invention; fig. 2 is a schematic view of a third structure of the laser processing apparatus of the present invention.
The laser processing equipment comprises a laser emission source 1, wherein a light source emitted by the laser emission source 1 is connected with a light splitting device 2, the light source emitted by the laser emission source 1 is input into the light splitting device 2 and then outputs two light path branches 3, the light splitting device 2 can be installed at the intersection of the two light path branches 3 in a sliding manner, the sliding direction of the light splitting device 2 and the incident direction of the light source emitted by the laser emission source 1 entering the light splitting device 2 are arranged in an intersecting manner, each light path branch 3 is connected with a processing device 4, the processing modes of the processing devices 4 connected with different light path branches 3 are different, and the light splitting devices 2 with different specifications can be arranged at the intersection of the two intersecting light paths in a replaceable manner.
Based on the problem that the laser processing equipment in the prior art cannot simultaneously process workpieces in different processing modes, the invention provides the laser processing equipment, which comprises a laser emission source 1, wherein the laser emission source 1 is used for providing a laser energy source for carrying out laser processing operation. The light source emitted by the laser emission source 1 is connected with the light splitting device 2, the light splitting device 2 is used for dividing the light source emitted by the laser emission source 1 into two light path branches 3, each light path branch 3 is connected with one processing device 4, and the processing modes of the processing devices 4 connected with different light path branches 3 are different, for example, one processing device 4 adopts an objective lens/cutting head processing mode, and the other processing device 4 adopts a laser galvanometer processing mode, so that the processing devices 4 connected with different light path branches 3 can simultaneously process the same or different workpieces in different processing modes, and can simultaneously mark and cut the same or different workpieces, namely, mark and cut the same workpiece simultaneously, or mark one workpiece, cut the other workpiece, mark and cut simultaneously, the laser processing efficiency of the same laser processing equipment is effectively improved, and the cost is also reduced. The light splitting device 2 is slidably installed at the intersection of the two light path branches 3, so that when the light splitting device 2 moves to the light path of the light source emitted by the laser emission source 1, the light splitting device 2 participates in work, and at the moment, the light source emitted by the laser emission source 1 is input into the light splitting device 2 and then is split into two parts to form the two light path branches 3, as shown in fig. 1; when the light splitting device 2 moves to make the light splitting device 2 leave the light path of the light source emitted by the laser emission source 1, the light splitting device 2 does not participate in the work, and at this time, the light source emitted by the laser emission source 1 is directly input to the corresponding light source branch, as shown in fig. 2. The switching of different processing modes can be realized by moving the light splitting device 2, and the processing efficiency of the laser processing equipment is effectively improved. The light splitting devices 2 have different specifications, and the power of the optical path branches 3 output by the light splitting devices 2 with different specifications is different. Therefore, in order to meet the requirements of different processing powers in laser processing, the beam splitter 2 with the required specification can be replaced according to the actual processing requirements. For example, the power ratio of the optical path branch 3 output by the light splitting device 2 is 3:7, 4:6, etc., and a user can select the power ratio according to specific actual processing requirements, and can select appropriate processing power for different workpieces to improve the processing quality. In addition, the sliding direction of the light splitting device 2 intersects with the incident direction of the light source emitted by the laser emission source 1 entering the light splitting device 2, that is, the sliding direction of the light splitting device 2 is not parallel to the incident direction of the light source emitted by the laser emission source 1 entering the light splitting device 2, so that the light splitting device 2 can be ensured to have two states, that is, the light splitting device 2 is located on the light path of the light source emitted by the laser emission source 1, and the light splitting device 2 leaves the light path of the light source emitted by the laser emission source 1.
In one embodiment, the processing modes of the processing device 4 include an objective lens/cutting head processing mode and a laser galvanometer processing mode.
The existing laser processing modes mainly comprise two modes, one mode is to cut a workpiece, such as an objective lens/cutting head processing mode; the other is carving on the workpiece, such as laser galvanometer processing. In order to guarantee that two kinds of processing methods coexist, enterprise cost can also be reduced, the two kinds of laser processing methods are integrated on the same processing equipment, and through the control of the light splitting device 2, the function of processing a workpiece by adopting different processing methods can be realized, so that the processing efficiency of the laser processing equipment is effectively improved, and the enterprise cost is also reduced.
In one embodiment, at least two light splitting devices 2 are connected to the light source emitted by the laser emission source 1, and the output light source of one of the optical path branches 3 of the former light splitting device 2 is used as the input light source of the latter light splitting device 2.
As shown in fig. 3, a light source emitted by a laser emission source 1 is connected to at least two light splitting devices 2, and in order to improve the productivity of an enterprise, the processing method and the processing mode of the existing laser processing equipment cannot meet the requirements of manufacturers, so that a processing tool can be modularized and integrated on the same processing equipment, which is similar to the processing equipment on an automatic production line and comprises a plurality of stations, and each station is provided with one processing device 4, thereby realizing the production line automation operation; the modularization means that each processing device 4 is a processing module, and the integration means that a plurality of processing modules are integrated into one laser processing apparatus. Therefore, the light source of the same laser emission source 1 sequentially passes through the plurality of light splitting devices 2, and the output light source of one of the light path branches 3 of the previous light splitting device 2 is used as the input light source of the next light splitting device 2, and is sequentially connected, so that the requirements of the plurality of processing devices 4 can be met. In addition, the laser power of the light source emitted by the same laser emission source 1 is reduced after being split by the plurality of splitting devices 2, so that different machining processes can be configured for different stations, the laser machining power required by some machining processes is large, the laser machining power required by some machining processes is small, and resource configuration can be performed according to specific actual requirements, so that the utilization rate of the laser machining power is improved.
In one embodiment, a moving mechanism is disposed at an intersection of two adjacent light path branches 3, and the light splitting device 2 employs a light splitter, and the light splitter is connected to the moving mechanism.
In an actual application scene, the light splitting device 2 needs to be moved continuously according to actual scene requirements, so that the light splitting device 2 needs a moving mechanism, and the moving mechanism is used for moving the light splitting device 2. Therefore, the light splitting device 2 can be directly connected to a moving mechanism, generally, the moving mechanism includes a slide rail and a slide block, the slide rail is fixed on the laser processing equipment, the slide block is connected to the slide rail in a sliding manner, the power source of the slide block can be motor-driven or cylinder-driven, preferably, the cost can be reduced by selecting pneumatic power to move. The piston rod of cylinder drives the slider and moves, and beam splitting device 2 connects on the slider, and the slider just can drive beam splitting device 2 and move, and beam splitting device 2 alright get into or break away from the light path of the light source that laser emission source 1 sent to realize the switching of different processing methods.
In one embodiment, the device further comprises a control device 5, and the control device 5 is connected with a plurality of moving mechanisms in a communication mode.
When the light splitting device 2 is provided with a plurality of light splitting devices, the laser processing equipment can split a plurality of light path branches 3, and the light path branches 3 can be connected with processing devices 4 at different stations, so that the assembly line operation processing of the processing devices 4 is realized. In an actual demand scene, it is necessary to set which stations of the processing devices 4 need to participate in processing according to actual demands, and which stations of the processing devices 4 do not need to participate in processing, so that the plurality of light splitting devices 2 need to be controlled to determine the light splitting devices 2 that need to participate in processing. The laser processing equipment also comprises a control device 5, and the control device 5 is in communication connection with the moving mechanism, so that the light splitting device 2 needing to participate in processing can be controlled through the control device 5. On an automatic production line, the laser processing equipment is directly integrated on the automatic production line, and different processing devices 4 are positioned on different stations, so that the universality and the processing efficiency of the laser processing equipment are improved. As shown in the figure, 1-4 light splitting devices 2 can be selected to participate in laser processing.
In one embodiment, a light adjusting jig 6, an attenuator 7, a beam expander 8 and the light adjusting jig 6 are sequentially connected on an optical path between the light splitting device 2 and the processing device 4.
In order to realize effective propagation of the optical path on the whole laser processing equipment, corresponding optical path control needs to be carried out on the optical path. A dimming jig 6, an attenuator 7, a beam expander 8 and the dimming jig 6 are sequentially arranged on a light path between the light splitting device 2 and the processing device 4. The light adjusting jig 6 mainly plays a role in aligning light paths, so that the light path branch 3 of the light splitting device 2 is aligned with the light path of the attenuator 7, and the light path of the beam expanding lens 8 is aligned with the light path of the processing tool. The attenuator 7 plays a role of power attenuation, as shown in fig. 1, when the light splitting device 2 is located on the light path of the light source emitted by the laser emission source 1, the light splitting device 2 participates in laser processing, so that the light source emitted by the laser emission source 1 is input into the light splitting device 2 to form two light path branches 3; when the light splitting device 2 leaves the light path of the light source emitted by the laser emission source 1, the light source emitted by the laser emission source 1 only enters the light path branch 3 on the right side of the figure 2; in order to allow the two optical path branches 3 to be laser-machined simultaneously and also independently, an attenuator 7 is provided. In an actual scenario where two optical path branches 3 exist, the attenuator 7 may attenuate the laser power of one of the optical path branches 3 to zero, so that one of the optical path branches 3 may perform laser processing alone, and one of the optical path branches 3 does not participate in the laser processing. The beam expander 8 plays a role in adjusting the beam diameter to meet different processing accuracies.
Example two:
referring to fig. 4, fig. 4 is a method flowchart of the laser processing method of the present invention.
The laser processing method based on the laser processing equipment realizes that the processing devices 4 adopting different processing modes simultaneously process the same or different workpieces by means of the movement of the light splitting device 2; and a plurality of spectroscopic devices 2 are arranged in combination, and combined processing by a plurality of processing devices 4 is realized.
The laser processing method comprises the following steps:
as shown in fig. 1, the control device 5 controls the light splitting device 2 to move to the light path of the light source emitted by the laser emission source 1, and the light source emitted by the laser emission source 1 is input to the light splitting device 2 to form two light path branches 3;
As shown in fig. 1, the laser processing apparatus includes a laser emitter 1, a beam splitter 2 (including a moving mechanism, not shown), an objective lens/cutting head processing system 4, a laser galvanometer processing system 4, a light control jig 6, an attenuator 7, a beam expander 8, and a reflector 9. These devices are connected according to the actual optical path requirements. In this case, the light splitting device 2 is located on the optical path of the light source emitted by the laser emitter. The specific method comprises the following steps:
the control device 5 is in communication connection with the moving mechanism, the control device 5 controls the moving mechanism to move, so that the moving mechanism drives the light splitting device 2 to move to a light path of a light source emitted by the laser emission source 1, the light source emitted by the laser emission source 1 is input to the light splitting device 2 through the light adjusting jig 6, the light splitting device 2 divides the light source into two light path branches 3, and as shown in fig. 1, the left light path branch 3 and the right light path branch 3 are formed. The left light path branch 3 sequentially passes through the dimming jig 6, the attenuator 7, the beam expander 8 and the dimming jig 6, and finally reaches the processing device 4, namely, the processing device 4 of the objective/cutting head processing mode. The machining device 4 can now perform laser machining in a cutting mode. Meanwhile, the right light path branch 3 sequentially passes through the reflector 9, the dimming jig 6, the attenuator 7, the beam expander 8, the dimming jig 6 and the reflector 9, and finally reaches the processing device 4, namely, the processing device 4 adopting the laser galvanometer processing mode, and at the moment, the processing device 4 can execute laser processing in the carving mode. Therefore, the left and right optical path branches 3 can simultaneously perform laser processing, and the same or different workpieces can be laser processed by adopting different laser processing modes. The reflector 9 mainly plays a role in changing the light path, and the required number of reflectors 9 can be set according to actual requirements to change the light path.
In addition, due to the existence of the attenuator 7, the attenuator 7 can attenuate the laser power of the optical path branch 3 where the attenuator 7 is located to zero. Therefore, in order to enable the processing devices 4 of the left and right optical path branches 3 to work simultaneously and independently, the attenuators 7 are provided, the optical path branches 3 on the left and right sides can perform laser processing according to the maximum power, and can also perform laser operation under different powers by matching with the attenuators 7 within the maximum power range, and certainly, the method also includes the step of attenuating the power of a certain optical path branch 3 to zero by using the attenuators 7, so that the other optical path branch 3 can perform laser operation independently.
As shown in fig. 2, the state at this time is that the spectroscopic device 2 is away from the optical path of the light source emitted from the laser emission source 1. The specific method comprises the following steps:
the control device 5 controls the light splitting device 2 to leave the light path of the light source emitted by the laser emission source 1, the light source emitted by the laser emission source 1 is input into the corresponding processing device 4, and the workpiece is processed by adopting a processing mode corresponding to the processing device 4.
As shown in fig. 3, a plurality of beam splitters 2 may be disposed on the optical path of the laser processing apparatus, and the specific implementation method is as follows:
in one embodiment, the laser processing apparatus used in the laser processing method includes a plurality of light splitting devices 2, and the laser processing method further includes:
the control device 5 controls the plurality of beam splitters 2 such that different processing devices 4 participate in the laser processing at different stations.
The control device 5 is in communication connection with the moving mechanism, the control device 5 can control the moving mechanism to slide, and the moving mechanism can drive the light splitting device 2 to slide, so that the control device 5 can indirectly control the sliding action of the light splitting device 2. The control device 5 controls the plurality of spectroscopic devices 2 to control the spectroscopic devices 2 that specifically participate in the laser processing. Different beam-splitting device 2 connects different processingequipment 4, and different processingequipment 4 are arranged in different stations, can control different beam-splitting device 2 and be located the light path of the light source that laser emitter sent through controlling means 5, with beam-splitting device 2 corresponding processingequipment 4 alright in participating in the laser operation, be located different stations processingequipment 4 alright in order to accomplish corresponding processing action, realize assembly line laser machining operation.
In one embodiment, the laser processing method further includes:
and replacing the light splitting devices 2 with different specifications to change the processing power of different optical path branches 3.
The light splitting devices 2 have different specifications, and the power of the optical path branches 3 output by the light splitting devices 2 with different specifications is different. Therefore, in order to meet the requirements of different processing powers in laser processing, the beam splitter 2 with the required specification can be replaced according to the actual processing requirements. For example, the power ratio of the optical path branch 3 output by the light splitting device 2 is 3:7, 4:6, etc., and a user can select the power ratio according to specific actual processing requirements, and can select appropriate processing power for different workpieces to improve the processing quality. By replacing the light splitting devices 2 with different specifications, the processing power of different light path branches 3 can be changed. The beam splitter 2 determines the maximum power of the optical path branch 3 through the beam splitter 2.
In one embodiment, the laser processing method further includes:
the parameters of the attenuator 7 are adjusted to vary the processing power of the different optical circuit branches 3.
The control device 5 controls the light splitting device 2 to move to the light path of the light source emitted by the laser emission source 1, the light source emitted by the laser emission source 1 is input into the light splitting device 2, and when two light path branches 3 are formed, the parameters of the attenuator 7 can be adjusted to change the processing power of different light path branches 3. Due to the existence of the attenuator 7, the attenuator 7 can attenuate the laser power of the optical path branch 3 where the attenuator 7 is located to zero. Therefore, in order to enable the processing devices 4 of the left and right optical path branches 3 to work simultaneously and independently, the attenuators 7 are provided, the optical path branches 3 on the left and right sides can perform laser processing according to the maximum power, and can also perform laser operation under different powers by matching with the attenuators 7 within the maximum power range, and certainly, the method also includes the step of attenuating the power of a certain optical path branch 3 to zero by using the attenuators 7, so that the other optical path branch 3 can perform laser operation independently.
It should be understood that, although the steps in the flowchart of fig. 4 are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and described, and may be performed in other orders, unless explicitly stated otherwise. Moreover, at least a portion of the steps in fig. 4 may include multiple sub-steps or multiple stages that are not necessarily performed at the same time, but may be performed at different times, and the order of performance of the sub-steps or stages is not necessarily sequential, but may be performed in turn or alternately with other steps or at least a portion of the sub-steps or stages of other steps.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The laser processing equipment is characterized by comprising a laser emission source (1), wherein a light source emitted by the laser emission source (1) is connected with a light splitting device (2), a light source emitted by the laser emission source (1) is input into the light splitting device (2) and then outputs two light path branches (3), the light splitting device (2) is arranged at the intersection of two light path branches (3) thereof in a sliding way, the sliding direction of the light splitting device (2) is intersected with the incident direction of a light source emitted by the laser emission source (1) entering the light splitting device (2), each light path branch (3) is connected with a processing device (4), and the processing modes of the processing devices (4) connected with different light path branches (3) are different, and the light splitting devices (2) with different specifications can be arranged at the intersection of two intersecting light paths in a replaceable manner.
2. The laser processing apparatus according to claim 1, wherein the processing modes of the different processing devices (4) comprise an objective/cutting head processing mode and a laser galvanometer processing mode.
3. The laser processing apparatus according to claim 2, wherein the light source emitted by the laser emission source (1) is connected with at least two light splitting devices (2), and the output light source of one of the optical path branches (3) of the former light splitting device (2) is used as the input light source of the latter light splitting device (2).
4. The laser processing equipment according to any one of claims 1 to 3, wherein a moving mechanism is arranged at the intersection of two adjacent light path branches (3), and the light splitting device (2) adopts a light splitting mirror connected to the moving mechanism.
5. The laser machining apparatus according to claim 4, further comprising a control device (5), the control device (5) being communicatively connected to a plurality of the moving mechanisms.
6. The laser processing apparatus according to claim 1, wherein a dimming jig (6), an attenuator (7), a beam expander (8) and a dimming jig (6) are connected in sequence on the light path between the light splitting device (2) and the processing device (4).
7. A laser processing method using the laser processing apparatus according to any one of claims 1 to 6, characterized by comprising:
the control device (5) controls the light splitting device (2) to move to a light path of a light source emitted by the laser emission source (1), and the light source emitted by the laser emission source (1) is input into the light splitting device (2) to form two light path branches (3);
different processing devices (4) connected with different light path branches (3) respectively adopt different processing modes to simultaneously process the same or different workpieces;
the control device (5) controls the light splitting device (2) to leave the light path of the light source emitted by the laser emission source (1), the light source emitted by the laser emission source (1) is input into the corresponding processing device (4), and the workpiece is processed by adopting a processing mode corresponding to the processing device (4).
8. The laser processing method according to claim 7, wherein the laser processing apparatus used in the laser processing method includes a plurality of beam splitters (2), and the laser processing method further includes:
the control device (5) controls the plurality of light splitting devices (2) so that different processing devices (4) participate in laser processing at different stations.
9. The laser processing method according to claim 7, further comprising:
and replacing the light splitting devices (2) with different specifications to change the processing power of different light path branches (3).
10. The laser processing method according to claim 9, further comprising:
and adjusting parameters of the attenuator (7) to change the processing power of different optical path branches (3).
Priority Applications (1)
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