CN114927533B - Grid conductive structure and preparation method thereof, touch module and display module - Google Patents

Abstract

The embodiment of the specification provides a grid conductive structure preparation method, a grid conductive structure, a touch module and a display module. The preparation method of the grid conductive structure comprises the following steps: arranging a first wiring with the extending direction being the first direction and a second wiring with the extending direction being the second direction on the substrate; the first wires and the second wires are alternately arranged along the second direction, and the adjacent first wires and the adjacent second wires are spaced; a connecting wire for connecting the first wiring and the second wiring is arranged on the substrate; the line width of the connecting line is smaller than or equal to the line width of the first wiring and/or the line width of the second wiring. Through first line and second line looks interval of walking, first line, second line and connecting wire are walked to the second and are prepared in different processes, and the linewidth of connecting wire is less than or equal to the linewidth of first line and/or second line of walking, is favorable to controlling the connecting wire linewidth, is favorable to alleviating the crossing department size of first line and second line and is partial big condition, improves the luminousness.

Description

Grid conductive structure and preparation method thereof, touch module and display module

Technical Field

The present invention relates to the field of conductive grids, and in particular to a method for preparing a grid conductive structure, a grid conductive structure, a touch module, and a display module.

Background Art

The grid conductive structure has the advantages of small line width and good ductility, and is widely used in display devices. For example, the grid conductive structure is used to make touch screens, antennas, etc., and is further applied to display devices. However, the grid conductive structure based on the repeated arrangement of interconnected lines in different directions often has poor light transmittance, which limits the application of the grid conductive structure.

Summary of the invention

In view of this, multiple embodiments of the present specification are dedicated to providing a method for preparing a grid conductive structure, a grid conductive structure, a touch module and a display module, which are conducive to improving the applicability of the grid conductive structure.

An embodiment of the present specification provides a method for preparing a grid conductive structure, including: arranging a first routing line extending in a first direction and a second routing line extending in a second direction on a substrate; wherein the first direction intersects with the second direction, and along the second direction, the first routing line and the second routing line are alternately arranged, and adjacent first routing lines and second routing lines are spaced apart; and arranging a connecting line connecting the first routing line and the second routing line on the substrate; wherein the line width of the connecting line is less than or equal to the line width of the first routing line and/or the line width of the second routing line.

The present specification provides a method for preparing a grid conductive structure, including: setting a plurality of connecting lines on a substrate; setting a first routing line extending in a first direction and a second routing line extending in a second direction on the substrate; wherein the first direction intersects with the second direction, and along the second direction, the first routing lines and the second routing lines are alternately arranged, and adjacent first routing lines and second routing lines are spaced apart; the connecting line connects adjacent first routing lines and second routing lines, and the line width of the connecting line is less than or equal to the line width of the first routing line and/or the line width of the second routing line.

An embodiment of the present specification provides a grid conductive structure, including: a substrate; a first routing line and a second routing line located on the same side of the substrate and extending in different directions; wherein, along the extension direction of the second routing line, the first routing line and the second routing line are alternately arranged, and adjacent first routing lines and second routing lines are spaced apart; a connecting line connecting adjacent first routing lines and second routing lines; wherein the line width of the connecting line is less than or equal to the line width of the first routing line and/or the line width of the second routing line.

The embodiments of the present specification provide a touch module, including a mesh conductive structure obtained by any of the mesh conductive structure preparation methods described above; or including: any of the mesh conductive structures described above.

The embodiments of the present specification provide a display module, comprising any of the above-mentioned touch modules.

The preparation method of the grid conductive structure and the grid conductive structure provided in the embodiment of the present specification are provided by setting a first routing line extending in a first direction and a second routing line extending in a second direction, the first direction intersects with the second direction, the first routing line and the second routing line are alternately arranged along the second direction, and the adjacent first routing line and the second routing line are spaced apart; and a connecting line connecting the first routing line and the second routing line is provided, so that the connecting line and the first routing line and the second routing line are formed in different processes, which can expand the range of process selection in the preparation of the grid conductive structure, and is conducive to reducing the difficulty of preparation. In addition, the connecting line and the first routing line and the second routing line are formed in different processes, and the line width of the connecting line is less than or equal to the line width of the first routing line and/or the line width of the second routing line, so that the line width of the routing lines in different directions at the intersection position is controllable, and can be less than or equal to the line width of the first routing line and/or the line width of the second routing line, which is convenient for reducing the line width of the grid conductive structure, and is conducive to solving the defect of excessive line width at the intersection of routing lines in different directions of the grid conductive structure, improving the light transmittance of the grid conductive structure, and improving the scope of application of the grid conductive structure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic structural diagram of a mesh conductive structure in the prior art.

2a-2d are schematic diagrams of structures at different stages in a preparation process of a mesh conductive structure provided by one embodiment.

3a to 3h are schematic diagrams of structures at different stages in a preparation process of a mesh conductive structure provided by one embodiment.

FIG. 4 is a schematic diagram showing the structure of a first photoresist layer according to an embodiment.

5a-5b are schematic diagrams of structures at different stages in a preparation process of a grid conductive structure provided by one embodiment.

6a-6b are schematic diagrams of structures at different stages in a preparation process of a mesh conductive structure provided by one embodiment.

7a-7b are schematic diagrams of structures at different stages in a preparation process of a mesh conductive structure provided by one embodiment.

FIG. 8 is a schematic diagram of a top view of a grid conductive structure provided in one embodiment.

FIG. 9 is a schematic diagram of a top view of a grid conductive structure provided in one embodiment.

FIG. 10 is a schematic cross-sectional view of a mesh conductive structure provided in one embodiment.

DETAILED DESCRIPTION

The following will be combined with the drawings in some of the embodiments of the specification to clearly and completely describe the technical solutions in some of the embodiments of the specification. Obviously, the described embodiments are only some of the embodiments of the specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of this specification.

Please refer to FIG1. The grid conductive structure generally includes routing lines with different extension directions, and the routing lines in different directions intersect with each other and are arranged repeatedly to form a grid conductive structure. However, due to the small width of the routing lines of the grid conductive structure, it can reach tens of microns or several microns. When the line width is smaller, the process error, the different effects of the same process conditions on the intersection of the routing lines and the remaining areas, and other phenomena have a more prominent impact on the final grid conductive structure morphology. In the process of forming the grid conductive structure, especially when the yellow light process is used to prepare the grid conductive structure, the formed grid conductive structure has a larger line width at the intersection of the routing lines in different directions, resulting in a similar R angle structure. As shown in the dotted circle box in FIG1. Taking the yellow light process as an example, in order to form routing lines with different extension directions and intersections, a photoresist layer with the same pattern is required. When a photoresist layer with a structure with different extension directions and intersections is used, there are problems such as the conductive material used to form the routing lines cannot be fully etched according to the photoresist layer pattern at the intersection position, resulting in a larger line width and unable to form a grid conductive structure of the expected shape and size. When the line width at the intersection of the grid conductive structure is too large, the light transmittance of the grid conductive structure decreases. When applied to a display device, the grid conductive structure may be too visible due to the large size of the intersection area, affecting the display effect of the display device and causing product defects.

The embodiment of the present specification provides a method for preparing a mesh conductive structure. The method for preparing a mesh conductive structure may include the following steps.

Step S110: setting a first routing line 210 extending in a first direction and a second routing line 220 extending in a second direction on the substrate 100; wherein the first direction intersects with the second direction, and along the second direction, the first routing lines 210 and the second routing lines 220 are alternately arranged, and adjacent first routing lines 210 and second routing lines 220 are spaced apart.

Step S120 : providing a connection line connecting the first wiring 210 and the second wiring 220 on the substrate 100 ; wherein the line width of the connection line is less than or equal to the line width of the first wiring 210 and/or the line width of the second wiring 220 .

For step S110, please refer to FIG. 2a and FIG. 3a. FIG. 3a is a schematic diagram of a cross-sectional structure corresponding to FIG. 2a along line AA. In some embodiments, the substrate 100 can be used to provide support for the preparation of the first wiring 210 and the second wiring 220. The material of the substrate 100 can be a polymer material. For example, the material of the substrate 100 can be at least one of polyethylene terephthalate, polycarbonate, polymethyl methacrylate, and glass.

In some embodiments, the shape of the first line 210 extending in the first direction may be a straight line, a broken line, a curve, or other shapes. The first line 210 extending in the first direction may have a size in the first direction greater than that in other directions. The second line 220 corresponds to the first line 210 and is not described in detail here.

In some embodiments, the first direction intersects the second direction, and the first direction and the second direction may be perpendicular, or the angle between the first direction and the second direction is an obtuse angle, or the angle between the first direction and the second direction is an acute angle. The first line 210 and the second line 220 may be perpendicular.

Please refer to FIG. 2a. In some embodiments, there may be a plurality of first routing lines 210 and a plurality of second routing lines 220. The plurality of first routing lines 210 may be arranged along the second direction. The plurality of second routing lines 220 may be arranged along the first direction. The first routing line 210 may be adjacent to at least one second routing line 220. The second routing line 220 may be adjacent to at least one first routing line 210.

In some embodiments, along the second direction, the first routing lines 210 and the second routing lines 220 are arranged alternately, and it can be that along the second direction, one first routing line 210 is arranged between adjacent second routing lines 220. Along the first direction, the first routing line 210 can be adjacent to multiple second routing lines 220; along the first direction, multiple second routing lines 220 can be arranged between adjacent first routing lines 210. The first routing lines 210 and the second routing lines 220 are arranged alternately, and accordingly, along the second direction, the adjacent second routing lines 220 are spaced apart; along the second direction, the adjacent first routing lines 210 are spaced apart.

Please refer to Figures 2a and 3a. In some embodiments, the adjacent first routing lines 210 and the second routing lines 220 are spaced apart, and the first routing lines 210 and the second routing lines 220 may not be directly connected. There is no overlapping area between the orthographic projection of the first routing line 210 on the substrate 100 and the orthographic projection of the second routing line 220 on the substrate 100. Along the second direction, the second routing lines 220 may be provided on both sides of the first routing line 210, and the first routing line 210 passes between the adjacent second routing lines 220 and has no contact with the second routing lines 220. The first routing line 210 and the second routing line 220 are prepared in the same process, which is conducive to the saving of materials and the reduction of process difficulty. The adjacent first routing lines 210 and the second routing lines 220 are spaced apart, and the first routing lines 210 and the second routing lines 220 need to be separately provided with a connecting line 310 for connection. By retaining the interval, the connecting line 310 can be prepared separately using a process different from that of the first routing line 210 and the second routing line 220, which is conducive to the adjustment of the line width of the connecting line 310. In addition, the adjacent first routing lines 210 and second routing lines 220 are spaced apart, that is, the first routing lines 210 and the second routing lines 220 do not directly intersect and do not have any nodes. Instead, they are connected by a separately prepared connecting line 310. This allows the use of a yellow light process that can meet the requirement of reducing routing size while maintaining process accuracy, thereby avoiding the problem of large node size at the node in the yellow light process. While increasing the range of selection for the preparation process, it can also increase the transmittance of the grid conductive structure, reduce the visibility of the grid lines, and improve the applicability of the grid conductive structure.

In some embodiments, adjacent first routing lines 210 and second routing lines 220 are spaced apart so that at least along the second direction, a region where the second routing line 220 is not provided is included between the second routing line 220 and the adjacent first routing line 210; or at least along the first direction, a region where the first routing line 210 is not provided is included between the first routing line 210 and the adjacent second routing line 220. Accordingly, in the preparation of the mesh conductive structure, the first routing lines 210 and the second routing lines 220 are prepared using different processes from the connecting lines 310.

In some embodiments, along the second direction, the spacing between the first routing line 210 and the second routing line 220 may be greater than 42.5 microns, or greater than 62.5 microns, which may be selected according to different error values of exposure equipment, etching agents, etc.; the larger the spacing, the shorter the length of each second routing line along the second direction, and the longer the length of the corresponding connecting line 310 connected thereto along the second direction. In one embodiment, the length of the second routing line formed in step S110 is 0, the spacing reaches a maximum value, and the length of the corresponding connecting line 310 also reaches a maximum value. The connecting line 310 connects the adjacent first routing lines 210, and the connecting line 310 and the first routing lines 210 together form a grid conductive structure with a grid pattern. This is conducive to forming the first routing lines 210 and the second routing lines 220 spaced apart, and can prevent the process from being difficult to implement due to the size being too small.

In some embodiments, the first trace 210 and the second trace 220 may be made of the same material. The first trace 210 and the second trace 220 may be formed by the same process.

In some embodiments, the step of setting a first routing line 210 extending in a first direction and a second routing line 220 extending in a second direction on a substrate 100 may include: setting a conductive material on the surface of the substrate 100; setting a first photoresist layer 400 on the surface of the conductive material; wherein the first photoresist layer 400 includes a first direction photoresist 410 extending in the first direction and a second direction photoresist 420 extending in the second direction, the first direction intersects with the second direction, and along the second direction, the first direction photoresist 410 and the second direction photoresist 420 are alternately arranged, and adjacent first direction photoresist 410 and second direction photoresist 420 are spaced apart; etching the conductive material; wherein the conductive material covered by the first direction photoresist 410 and the second direction photoresist 420 respectively forms the first routing line 210 and the second routing line 220.

Please refer to FIG. 2a and FIG. 4. In some embodiments, a conductive material is disposed on the surface of the substrate 100, and the conductive material can be used to form the first routing line 210 and the second routing line 220. The conductive material can be a metal material, for example, the conductive material can be at least one of copper, silver and other metal materials. The conductive material can be a metal oxide material. For example, the conductive material is indium tin oxide. The conductive material can be formed on the substrate 100 by at least one of printing, sputtering, electroplating, evaporation, coating and the like. The material of the first photoresist layer 400 can be a positive photoresist material or a negative photoresist material. Since the first photoresist layer 400 is disposed on the surface of the conductive material, during the process of etching the conductive material, the conductive material not covered by the first photoresist layer 400 is removed, and the conductive material covered by the first photoresist layer 400 is retained, thereby realizing the patterning of the conductive material and forming the first routing line 210 and the second routing line 220. The adjacent first-direction light blocks 410 and second-direction light blocks 420 are spaced apart from each other, and correspondingly, the adjacent first wirings 210 and second wirings 220 are spaced apart from each other.

In some embodiments, the conductive material can also be used to form functional wiring, for example, to form peripheral signal lines, etc. Accordingly, a functional wiring photoresist layer corresponding to the functional wiring can be set, which is beneficial to process integration and saving conductive materials.

In some embodiments, the step of providing the first photoresist layer 400 on the surface of the conductive material may include: providing a photoresist material on the side of the conductive material facing away from the substrate 100, exposing and developing the photoresist material to form the first photoresist layer 400. Specifically, the photoresist material for forming the first photoresist layer 400 may be coated on the surface of the conductive material. A mask may be provided on the side of the photoresist material facing away from the substrate 100, and the mask may have a hollow pattern. The photoresist material is exposed using the mask. Specifically, ultraviolet light may be used to irradiate the photoresist material corresponding to the hollow pattern through the hollow pattern of the mask. The photoresist material may be a positive photoresist material, which is soluble in a developer after exposure. Then, the developer is used to develop the photoresist material, and the exposed area of the photoresist material is removed, and the photoresist material forms a pattern corresponding to the hollow pattern of the mask, thereby forming the first photoresist layer 400. In some embodiments, the photoresist material may be a negative photoresist material, and the unexposed regions of the negative photoresist material are soluble in a developer. The case where the photoresist material is a negative photoresist material will not be described in detail herein.

In some embodiments, after forming the first photoresist layer 400, the conductive material exposed by the first photoresist layer 400 can be removed by an etching process, and the conductive material covered by the first photoresist layer 400 is retained. Specifically, an etchant can be coated on the surface of the conductive material, and the etchant etches the conductive material to remove the conductive material not covered by the first photoresist layer 400, and the conductive material covered by the first photoresist layer 400 forms the first wiring 210 and the second wiring 220. Please refer to Figures 2a and 4. The first photoresist layer 400 includes a first direction photoresist 410 and a second direction photoresist 420, the first direction photoresist 410 and the second direction photoresist 420 are spaced apart, the extension direction of the first direction photoresist 410 is the first direction, the extension direction of the second direction photoresist 420 is the second direction, and the first direction intersects the second direction. Correspondingly, the conductive material covered by the first direction photoresist 410 layer forms the first wiring 210, and the conductive material covered by the second direction photoresist 420 layer forms the second wiring 220. The extension direction of the first wiring 210 is the first direction, and the extension direction of the second wiring 220 is the second direction. The first direction intersects with the second wiring 220, and the interval between the first direction photoresist 410 and the second direction photoresist 420 forms the interval between the first wiring 210 and the second wiring 220. The first wiring 210 and the second wiring 220 are formed by the exposure, development and etching process. When the line width of the conductive grid structure is narrower, the yield advantage is more obvious, which is conducive to reducing the line width and improving the yield.

In some embodiments, a photoresist layer for forming the first wiring 210 and the second wiring 220 may be disposed on the surface of the substrate 100, the photoresist layer having a first direction opening extending in the first direction and a second direction opening extending in the second direction, the first direction intersects with the second direction, and there is a gap between the first direction opening and the second direction opening. The first wiring 210 and the second wiring 220 are formed by filling the first direction opening and the second direction opening with conductive material through a printing process, and accordingly, the first wiring 210 extending in the first direction and the second wiring 220 extending in the second direction are formed on the substrate 100, and there is a gap between the first wiring 210 and the second wiring 220. The use of a printing process can reduce the setting range of the conductive material, which is conducive to saving conductive materials.

Since the first wiring 210 and the second wiring 220 are formed in one process, it is beneficial to save materials and improve the integration of the process. In the preparation process of the first wiring 210 and the second wiring 220, since there is a gap between the first wiring 210 and the second wiring 220, even if the yellow light process is used, the photoresist layer used to form the first wiring 210 and the second wiring 220 will not cross, which is beneficial to solve the problem of too large nodes in the grid structure, and at the same time, it can expand the selection range of the preparation process, give full play to the high precision of the yellow light process, and help meet the demand for reducing the line width of the wiring.

In step 120, the first routing line 210 and the second routing line 220 are connected by a connecting line 310, thereby forming an interconnected grid conductive structure. The line width of the connecting line 310 can be less than or equal to the line width of the first routing line 210, the line width of the connecting line 310 can be less than or equal to the line width of the second routing line 220, and the line width of the connecting line 310 can be less than or equal to the line width of the first routing line 210 and the line width of the second routing line 220. This is conducive to solving the problem of excessive line width at the intersection of the first routing line 210 and the second routing line 220.

Please refer to Figures 2b, 2c, 3b and 3c. Figure 3b is a schematic diagram of the cross-sectional structure along line AA corresponding to Figure 2b. Figure 3c is a schematic diagram of the cross-sectional structure along line AA corresponding to Figure 2c. The outlines of the first routing line 210 and the second routing line 220 in Figures 2b and 2c are indicated by dotted lines. In order to facilitate the illustration and understanding of the positional relationship between the first routing line 210, the second routing line 220 and the opening 510, in Figure 2c, the first routing line 210, the second routing line 220 and the photoresist layer 500 are not filled with the same pattern as in Figure 3c, and only the outline is illustrated; in Figure 2b, the photoresist material 500-1 is not filled with the same pattern as in Figure 3b, and only the outline is illustrated. In some embodiments, the step of providing a connecting line 310 connecting the first routing line 210 and the second routing line 220 on the substrate 100 includes: providing a second photoresist layer 500 having an opening 510 on the side of the first routing line 210 and the second routing line 220 facing away from the substrate 100; wherein the opening 510 continuously extends between adjacent first routing lines 210 and second routing lines 220, the opening 510 covers the first routing line 210 in the orthographic projection part of the first routing line 210, the opening 510 covers the second routing line 220 in the orthographic projection part of the second routing line 220, and the width of the opening 510 is less than or equal to the line width of the first routing line 210 and/or the line width of the second routing line 220; and providing a connecting line 310 in the opening 510; wherein the connecting line 310 connects adjacent first routing lines 210 and second routing lines 220 on the substrate 100.

Please refer to FIG. 2c and FIG. 3c. In some embodiments, the length d1 of the opening 510 may be greater than or equal to the length d3 of the spacing between the first and second routing lines, so that the first routing line 210 and the adjacent second routing line 220 are connected by the connecting line 310; or, the length d1 of the opening 510 may be greater than or equal to the spacing d2 between the two second routing lines 220 on both sides of the first routing line 210; so that the connecting line 310 connects the second routing lines 220 located on both sides of the same first routing line 210. The length d1 of the opening may be the distance between the side walls on both sides of the opening 510 along the second direction. The length d3 of the spacing between the first routing line 210 and the second routing line 220 may be the distance between the adjacent sides of the first routing line 210 and the second routing line 220 along the second direction. The spacing d2 between the two second routing lines 220 on both sides of the first routing line 210 may be the distance between the adjacent sides of the two second routing lines 220 on both sides of the first routing line 210 on both sides of the same first routing line 210 along the second direction.

In some embodiments, the opening 510 extends continuously between the first routing line 210 and the second routing line 220, so that a connecting line 310 connecting the first routing line 210 and the second routing line 220 can be provided. The orthographic projection of the opening 510 on the substrate 100 partially covers the orthographic projection of the first routing line 210 on the substrate 100, and the orthographic projection of the opening 510 on the substrate 100 partially covers the orthographic projection of the second routing line 220 on the substrate 100. The connecting line 310 can be connected to the first routing line 210 and the second routing line 220, and a part of the connecting line 310 is located on the surface of the first routing line 210, and a part of the connecting line 310 is located on the surface of the second routing line 220, so as to realize the connection between the first routing line 210 and the second routing line 220. The orthographic projection of the connecting line 310 on the substrate 100 can cover the opening 510. The orthographic projection of the opening 510 covers the first routing line 210 , and the orthographic projection of the opening 510 covers the second routing line 220 , which satisfies the connection between the first routing line 210 and the second routing line 220 and helps to improve the connection stability.

In some embodiments, a connecting wire 310 is disposed on the surface of the substrate 100; the connecting wire 310 can be partially or completely disposed in the same layer as the first routing wire 210 and the second routing wire 220, which is conducive to the thinness of the formed grid conductive structure. A connecting wire 310 is disposed in the opening 510; the connecting wire 310 connects the first routing wire 210 and the second routing wire 220. Accordingly, the connecting wire 310 is at least embedded in the gap between the first routing wire 210 and the second routing wire 220. In some embodiments, the connecting wire 310 can be partially embedded in the gap between the first routing wire 210 and the second routing wire 220 and partially overlapped on the surface of the first routing wire 210 on the side facing away from the substrate 100 and/or the surface of the second routing wire 220 on the side facing away from the substrate 100, which is conducive to reducing the process precision requirements and reducing the process difficulty of setting the connecting wire 310. The width of the opening 510 is less than or equal to the line width of the first routing line 210 and/or the line width of the second routing line 220, which is helpful to solve the problem of excessive line width at the intersection of the first routing line 210 and the second routing line 220, improve the light transmittance of the grid conductive structure, reduce the visibility of the grid conductive structure, and improve the application scope of the grid conductive structure.

In some embodiments, the orthographic projection of the opening 510 on the first routing 210 covers a partial area of the first routing 210, and the opening 510 overlaps with the first routing 210; or the orthographic projection of the opening 510 on the second routing 220 partially covers the first routing 210 and partially covers the second routing 220, and the opening 510 overlaps with the first routing 210 and the second routing 220.

In some embodiments, the step of disposing a second photoresist layer 500 having an opening 510 on the side of the first and second traces 210 and 220 facing away from the substrate 100 may include: disposing a photoresist material 500-1 on the side of the first and second traces 210 and 220 facing away from the substrate 100, the photoresist material 500-1 being located on the surface of the substrate 100; disposing a mask on the side of the photoresist material 500-1 facing away from the substrate 100; wherein the mask has a hollow area for forming the opening 510; and exposing and developing the photoresist material 500-1 to form the second photoresist layer 500 having the opening 510. The photoresist material 500-1 may be formed by coating the entire area defined by the first and second traces 210 and 220, and the photoresist material 500-1 covers the surfaces of the first and second traces 210, 220, and the substrate 100. The mask has a hollow area for forming the opening 510, and the hollow area allows light for exposure to pass through. It can be understood that the mask also has a non-hollow area, which is used to provide the support required by the mask and can block the light used for exposure. Taking the photoresist material 500-1 as the positive photoresist material, the hollow area can allow the light used in the exposure process to illuminate the photoresist material 500-1, so that the photoresist material 500-1 corresponding to the hollow area can be removed through the development process after exposure.

In some embodiments, the step of disposing a second photoresist layer 500 having an opening 510 on the side of the first routing 210 and the second routing 220 facing away from the substrate 100 includes: disposing the second photoresist layer 500 on the side of the first routing 210 and the second routing 220 facing away from the substrate 100; wherein, along the second direction, the opening 510 extends continuously between two second routings 220 on both sides of the same first routing 210, and the width of the opening 510 is less than or equal to the line width of the first routing 210 and/or the line width of the second routing 220; correspondingly, the step of disposing a connecting line 310 in the opening 510 includes: disposing a connecting line 310 in the opening 510; wherein, the connecting line 310 connects the two second routings 220 on both sides of the same first routing 210. The first routing line 210 and the second routing line 220 are arranged alternately, and the connecting line 310 connects the two second routing lines 220 on both sides of the same first routing line 210, which is conducive to reducing the process difficulty of connecting the first routing line 210 with the second routing line 220. Please refer to Figures 2d and 3h. Figure 3h is a schematic diagram of the cross-sectional structure along line AA corresponding to Figure 2d. For the convenience of explanation, the two second routing lines located on both sides of the same first routing line 210 are marked as 220a and 220b respectively. Correspondingly, the two ends of the formed connecting line 310 are respectively connected to the two second routing lines 220a and the second routing line 220b located on both sides of the same first routing line 210, and the connecting line 310 is connected to the first routing line 210 to realize the grid conductive structure in which the first routing line and the second routing line intersect. Since the width of the opening 510 is less than or equal to the line width of the first routing line 210 and/or the line width of the second routing line 220, it is conducive to reducing the line width of the connecting line 310, which is conducive to alleviating the problem of enlarged nodes at the intersection of the grid structure.

In some embodiments, the step of providing a connecting line 310 connecting the first routing line 210 and the second routing line 220 on the substrate includes: providing a second photoresist layer 500 having an opening 510 on the side of the first routing line 210 and the second routing line 220 facing away from the substrate 100; wherein the opening 510 extends continuously between adjacent first routing lines 210 and second routing lines 220, the opening 510 covers the first routing line 210 in the orthographic projection part of the first routing line 210, and the opening 510 covers the second routing line 220 in the orthographic projection part of the second routing line 220, the width of the opening 510 is less than or equal to the line width of the first routing line 210 and/or the line width of the second routing line 220, and along the second direction, two second routing lines 220 adjacent to the same first routing line 210 correspond to different openings 510 of the second photoresist layer 500. Please refer to Figures 5a and 6a. Figure 6a is a schematic diagram of the cross-sectional structure along line BB corresponding to Figure 5a. The outlines of the first routing line 210 and the second routing line 220 in FIG. 5a are indicated by dotted lines. In order to facilitate the illustration and understanding of the positional relationship between the first routing line 210, the second routing line 220 and the opening 510, in FIG. 5a, the first routing line 210 and the second routing line 220 are not filled with the same pattern as in FIG. 6a, and only the outline is indicated. Part of the first routing line 210 between adjacent openings 510 is covered by the second photoresist layer 500, so that the same opening 510 is only connected to one first routing line 210 and one second routing line 220. Please refer to FIG. 5b and FIG. 6b. FIG. 6b is a schematic diagram of the cross-sectional structure along line BB corresponding to FIG. 5b. For the convenience of explanation, the two second routing lines located on both sides of the same first routing line 210 are marked as 220a and 220b, respectively, and the two connecting lines located on both sides of the same first routing line 210 are marked as 310a and 310b, respectively. The two ends of the connecting wire 310a are respectively connected to the second routing wire 220a and the first routing wire 210, and the two ends of another connecting wire 310b are respectively connected to the first routing wire 210 and the second routing wire 220b, so that the second routing wires 220a and 220b are connected and intersect with the first routing wire 210 to form a grid conductive structure. Figures 2d and 5b show two different ways of setting the connecting wire. In some embodiments, in the step of setting the connecting wire 310 in the opening 510, it includes: using a printing process or a scraping process to fill the opening 510 with a conductive material to form the connecting wire 310. Using a printing process or a scraping process, the conductive material can be formed only in the area corresponding to the opening 510 to form the connecting wire 310, which is beneficial to material saving.

Please refer to Figures 3d, 3e, 3f, 3g and 3h. In some embodiments, the step of providing the connecting line 310 on the surface of the substrate 100 includes: providing a conductive material 310-1 on the side of the second photoresist layer 500 facing away from the first wiring 210; wherein, corresponding to the opening 510, the conductive material 310-1 is embedded in the opening 510; forming a third photoresist layer 700 corresponding to the opening 510 on the side of the conductive material 310-1 facing away from the second photoresist layer 500; wherein the orthographic projection of the third photoresist layer 700 on the first wiring 210 covers a part of the adjacent first wiring 210 and a part of the adjacent second wiring 220, and the orthographic projection of the third photoresist layer 700 on the second photoresist layer 500 is located in the opening 510; etching the conductive material 310-1; wherein the conductive material 310-1 covered by the third photoresist layer 700 forms the connecting line 310.

Please refer to FIG3d. A conductive material 310-1 is disposed on the side of the second photoresist layer 500 facing away from the first wiring 210. The conductive material 310-1 may be disposed on the surface of the second photoresist layer 500, and the conductive material 310-1 is embedded in the opening 510, thereby forming a conductive material 310-1 disposed on the entire surface. Please refer to FIG3f. The orthographic projection of the third photoresist layer 700 on the first wiring 210 covers a partial area of the adjacent first wiring 210 and a partial area of the second wiring 220. Accordingly, the conductive material 310-1 that can be retained after etching the conductive material 310-1 forms a connecting line 310 to achieve the connection between the first wiring 210 and the second wiring 220. The orthographic projection of the third photoresist layer 700 on the second photoresist layer 500 is located in the opening 510, which facilitates the removal of multiple photoresists after the preparation is completed, and is beneficial to improving the stability and life of the conductive material. Please refer to FIG3e. The third photoresist layer 700 can be prepared by forming a photoresist material 700-1 on the surface of the conductive material 310-1 and performing an exposure and development process, which will not be described in detail here. Please refer to Figures 3g and 3h. After etching the conductive material 310-1 to form the connecting line 310, the second photoresist layer 500 and the third photoresist layer 700 can be removed.

In some embodiments, the orthographic projection of the third photoresist layer 700 on the second photoresist layer 500 overlaps with the opening 510, and the conductive material 310-1 covered by the third photoresist layer 700 forms the connecting line 310, and accordingly, the conductive material 310-1 located within the opening 510 forms the connecting line 310, which is beneficial to improving process stability.

The conductive structure preparation method provided in the embodiment of this specification is that the adjacent first routing lines 210 and the second routing lines 220 are spaced apart along the second direction, and there is no intersection between the first routing lines 210 and the second routing lines 220. A variety of processes can be used for preparation, which is conducive to reducing the difficulty of preparation. The connecting line 310 connects the first routing line 210 and the second routing line 220. The line width of the connecting line 310 is less than or equal to the line width of the first routing line 210 and/or the line width of the second routing line 220. The connecting line 310 is prepared in a separate process, which is conducive to adjusting the line width of the connecting line 310. The connecting line 310 connects the first routing line 210 and the second routing line 220. While forming a grid conductive structure, it is conducive to solving the problem of large line width at the intersection of routing lines in different directions, thereby improving the applicability of the grid conductive structure.

In some embodiments, the step of providing a first routing line 210 extending in a first direction and a second routing line 220 extending in a second direction on the substrate 100 includes: providing a plurality of first routing lines 210 extending in the first direction and a plurality of second routing lines 220 extending in the second direction on the substrate 100, wherein the first direction intersects with the second direction, and along the second direction, the first routing lines 210 and the second routing lines 220 are alternately provided, and adjacent first routing lines 210 and second routing lines 220 are spaced apart. A grid conductive structure that is repeatedly arranged and crossed with each other is formed by the plurality of first routing lines 210, the plurality of second routing lines 220 and the connecting lines 310.

In some embodiments, a protective layer may be provided on the side of the connecting wire 310 facing away from the substrate 100, and the protective layer covers the first wiring 210, the second wiring 220 and the connecting wire 310. This is beneficial to improving the life of the grid conductive structure. The material of the protective layer may be optical adhesive.

In some embodiments, the line width of the first trace 210 and the line width of the second trace 220 may be the same. The line width of the first trace 210 and/or the line width of the second trace 220 may range from 3 to 10 microns; or may range from 6 to 10 microns.

In some embodiments, the materials of the connecting wire 310, the first wiring 210, and the second wiring 220 can all be made of metal materials to form a metal grid conductive structure. The materials of the connecting wire 310, the first wiring 210, and the second wiring 220 can be the same. For example, metal materials such as copper and silver can be selected. Metal materials have good electrical conductivity and ductility, which is conducive to ensuring the conductive performance and flexibility of the grid conductive structure.

The embodiment of the present specification provides a method for preparing a mesh conductive structure. The method for preparing a mesh conductive structure may include the following steps.

Step S210 : disposing a plurality of connection lines 310 on the substrate 100 .

Please refer to Fig. 7a. In some embodiments, the plurality of connection lines 310 are spaced apart from each other. The plurality of connection lines 310 may be arranged in an array to connect the first wiring 210 and the second wiring 220 to form a grid conductive structure.

In some embodiments, the step of providing a plurality of connection lines 310 on the substrate 100 may include: forming a conductive material on the surface of the substrate 100; forming a fourth photoresist layer on the surface of the conductive material; etching the conductive material; wherein the conductive material covered by the fourth photoresist layer forms the connection lines 310. The specific preparation method of the fourth photoresist layer can refer to the preparation method of other photoresist layers mentioned above, and will not be repeated here.

In some embodiments, the step of providing a plurality of connection lines 310 on the substrate 100 may include: forming a fifth photoresist layer on the surface of the conductive material; wherein the fifth photoresist layer includes a plurality of spaced openings 510; and providing a conductive material in the openings 510 of the fifth photoresist layer to form the connection lines 310. Specifically, the connection lines 310 may be formed by a printing process.

Step S220: a first routing line 210 extending in a first direction and a second routing line 220 extending in a second direction are arranged on the substrate 100; wherein the first direction intersects with the second direction, and along the second direction, the first routing lines 210 and the second routing lines 220 are alternately arranged, and adjacent first routing lines 210 and second routing lines 220 are spaced apart; the connecting line 310 connects adjacent first routing lines 210 and second routing lines 220, and the line width of the connecting line 310 is less than or equal to the line width of the first routing line 210 and/or the line width of the second routing line 220.

The first routing line 210 is spaced from the second routing line 220, and the adjacent first routing line 210 and the second routing line 220 are connected by a connecting line 310; the line width of the connecting line 310 is less than or equal to the line width of the first routing line 210 and/or the line width of the second routing line 220, which is conducive to solving the problem of large line width at the intersection of routing lines in different directions, thereby improving the light transmittance of the grid conductive structure and improving the application scope of the grid conductive structure.

Please refer to Figures 7b and 8. Figure 7b is a schematic diagram of the cross-sectional structure along line CC in Figure 8. The connecting line 310 covered by the first routing line 210 and the second routing line 220 in Figure 8 is indicated by a dotted line. In some embodiments, the step of forming a first routing line 210 extending in a first direction and a second routing line 220 extending in a second direction on the substrate 100 includes: disposing a conductive material on a side of the substrate 100 close to the connecting line 310; wherein the conductive material covers the connecting line 310 and the substrate 100; forming a sixth photoresist layer on the conductive material; wherein the sixth photoresist layer includes a first direction photoresist layer extending in the first direction and a second direction photoresist layer extending in the second direction, the first direction intersects with the second direction, and along the second direction, the first direction photoresist layer and the second direction intersect. The second direction photoresist layers are arranged alternately, and the adjacent first direction photoresist layers are spaced apart from the second direction photoresist layers; the orthographic projection of the first direction photoresist layers on the connecting line 310 covers a part of the connecting line 310, and the orthographic projection of the second direction photoresist layers on the connecting line 310 covers a part of the connecting line 310; wherein the line width of the connecting line 310 is less than or equal to the width of the first direction photoresist layers and/or the width of the second direction photoresist layers; the conductive material exposed to the sixth photoresist layer is removed by etching, and the conductive material covered by the sixth photoresist layer forms the first routing line 210 and the second routing line 220. The adjacent first direction photoresist layers are spaced apart from the second direction photoresist layers; the orthographic projection of the first direction photoresist layers on the connecting line 310 covers a part of the connecting line 310, and the orthographic projection of the second direction photoresist layers on the connecting line 310 covers a part of the connecting line 310, which not only satisfies that the first routing line 210 and the second routing line 220 are not in direct contact with each other, but also enables the formed connecting line 310 to connect the first routing line 210 and the second routing line 220.

In some embodiments, before forming the conductive material on the side of the substrate 100 close to the connecting line 310, the method further includes: forming a seventh photoresist layer on the surface of the connecting line 310 facing away from the substrate 100; the seventh photoresist layer includes a first sub-photoresist region and a second sub-photoresist region spaced apart from each other. There may be a gap between the first sub-photoresist region and the contour of the connecting line 310 away from the second sub-photoresist region, and/or there may be a gap between the second sub-photoresist region and the contour of the connecting line away from the first sub-photoresist region.

Accordingly, the step of forming a conductive material on the side of the substrate 100 close to the connecting line 310 includes: forming a conductive material on the side of the substrate 100 close to the connecting line 310; wherein, corresponding to the interval between the first sub-photoresistance area and the second sub-photoresistance area, the conductive material is embedded in the interval; accordingly, the step of forming a sixth photoresistance layer on the conductive material includes: forming a sixth photoresistance layer on the conductive material; wherein, the sixth photoresistance layer exposes the seventh photoresistance layer; the sixth photoresistance layer covers the conductive material corresponding to the interval and extends continuously; the sixth photoresistance layer contacts the conductive material corresponding to the connecting line 310. Thus, when the conductive material is removed by etching, the first routing line 210 and the second routing line 220 with different extension directions and connected by the connecting line 310 can be formed.

In the conductive structure preparation method provided in the embodiment of the present specification, the connecting line 310 and the first routing line 210 and the second routing line 220 are prepared in different processes, the first routing line 210 and the second routing line 220 are spaced apart, the connecting line 310 can realize the connection between the first routing line 210 and the second routing line 220, and the line width of the connecting line 310 is less than or equal to the line width of the first routing line 210 and/or the second routing line 220, which is conducive to solving the problem of large line width at the intersection of routings in different directions while forming a grid conductive structure, thereby improving the applicability of the grid conductive structure.

The embodiments of the present specification provide a grid conductive structure. The grid conductive structure may include: a substrate 100; a first routing line 210 and a second routing line 220 located on the same side of the substrate 100 and extending in different directions; wherein, along the extending direction of the second routing line, the first routing line 210 and the second routing line 220 are alternately arranged, and adjacent first routing lines 210 and second routing lines 220 are spaced apart; a connecting line 310 connecting adjacent first routing lines 210 and second routing lines 220; wherein the line width of the connecting line 310 is less than or equal to the line width of the first routing line 210 and/or the line width of the second routing line 220.

Please refer to Figure 2d and Figure 3h. Alternatively, please refer to Figure 5b and Figure 6b. Alternatively, please refer to Figure 7b and Figure 8. In some embodiments, the first routing 210 and the second routing 220 may be prepared using the same process. This is beneficial to reducing process complexity and improving preparation efficiency. The connecting wire 310 may be prepared using a different process from the first routing 210 and the second routing 220. Please refer to Figure 3h. The first routing 210 and the second routing 220 may be located in the same layer; the connecting wire 310 may be located in the same layer as the first routing 210 and the second routing 220 in at least a portion of its area. The first routing 210 and the second routing 220 may be located on the surface of the substrate 100. Please refer to Figure 7b. The first routing 210 and the second routing 220 may be located in the same layer at least in a portion of its area; the connecting wire 310 may be located in the same layer as the first routing 210 and the second routing 220 in at least a portion of its area. The surface of the connecting wire 310 close to the substrate 100 may be partially or completely in contact with the surface of the substrate 100. A surface of the first wiring 210 close to the substrate 100 and a surface of the second wiring 220 close to the substrate 100 may be partially or completely in contact with the surface of the substrate 100 .

Please refer to FIG. 2d, FIG. 9 and FIG. 10. FIG. 10 is a schematic cross-sectional view of the structure along the DD line corresponding to FIG. 9. In some embodiments, the connecting wire 310 connects the adjacent first routing wire 210 and the second routing wire 220. The connecting wire 310 can be connected to the first routing wire 210 and the second routing wire 220 by direct contact. The connecting wire can contact the surface of the first routing wire 210 and the second routing wire 220. The connecting wire 310 is connected to the first routing wire 210, and the connecting wire 310 is connected to the second routing wire 220. The connecting wire 310 is connected to the first routing wire 210, and the connecting wire 310 is connected to the second routing wire 220. The connecting wire 310 is connected to the first routing wire 210, and the connecting wire 310 is connected to the first routing wire 310 only by side contact, and there is no overlapping area between the orthographic projection of the connecting wire 310 on the substrate 100 and the orthographic projection of the first routing wire 310 on the substrate 100; or, the connecting wire 310 is connected to the first routing wire 210, and the orthographic projection of the connecting wire 310 on the substrate 100 and the orthographic projection of the first routing wire 310 on the substrate 100 are overlapped. The connection mode of the connection line 310 and the second line 220 may refer to the connection mode of the connection line 310 and the first line 210. The connection mode of the same connection line 310 and the second line 220 may be the same as or different from the connection mode of the same connection line 310 and the first line 310.

In some embodiments, the first routing line 210 and the second routing line 220 extend in different directions. The extending direction of the first routing line 210 and the extending direction of the second routing line 220 may be perpendicular, or the extending direction of the first routing line 210 and the extending direction of the second routing line 220 may be an obtuse angle, or the extending direction of the first routing line 210 and the extending direction of the second routing line 220 may be an acute angle. The extending direction of the first routing line 210 may be the direction corresponding to the maximum dimension of the first routing line 210 in various directions. The extending direction of the second routing line 220 may be the direction corresponding to the maximum dimension of the second routing line 220 in various directions. The connecting line 310 connects the adjacent first routing line 210 and the second routing line 220. The extending direction of the connecting line 310 may be the same as the extending direction of the second routing line 220; or, it may be different.

Please refer to FIG. 2a. In some embodiments, along the extension direction of the second routing line 220, the first routing line 210 and the second routing line 220 are arranged alternately. It can be that along the extension direction of the second routing line 220, a first routing line 210 is arranged between adjacent second routing lines 220. Along the extension direction of the first routing line 210, the first routing line 210 may be adjacent to a plurality of second routing lines 220; along the first direction, a plurality of second routing lines 220 may be arranged between adjacent first routing lines 210. Along the extension direction of the second routing line 220, the first routing line 210 and the second routing line 220 are arranged alternately, and there may be other routing lines or other structures between the first routing line and the second routing line, as long as there is a first routing line 210 between adjacent second routing lines 220 along the extension direction of the second routing line 220.

In some embodiments, the adjacent first routing lines 210 and the second routing lines 220 are spaced apart. The first routing lines 210 and the second routing lines 220 may not be directly connected. There is no overlapping area between the orthographic projection of the first routing line 210 on the substrate 100 and the orthographic projection of the second routing line 220 on the substrate 100. Along the second direction, the second routing lines 220 may be provided on both sides of the first routing line 210, and the first routing line 210 passes between the adjacent second routing lines 220 and has no contact with the second routing lines 220. The first routing line 210 and the second routing line 220 may be prepared in the same process, which is conducive to the saving of materials and the reduction of the process difficulty. The adjacent first routing lines 210 and the second routing lines 220 are spaced apart, and the first routing lines 210 and the second routing lines 220 need to be separately provided with a connecting line 310 for connection. By retaining the interval, the connecting line 310 can be prepared separately using a process different from that of the first routing line 210 and the second routing line 220, which is conducive to the adjustment of the line width of the connecting line 310. The first wirings 210 and the second wirings 220 are arranged alternately. Accordingly, along the second direction, adjacent second wirings 220 are spaced apart from each other; along the second direction, adjacent first wirings 210 are spaced apart from each other.

In some embodiments, the line width of the connecting line 310 may be less than or equal to the line width of the first routing line 210; or, the line width of the connecting line 310 may be less than or equal to the line width of the second routing line 220; or, the line width of the connecting line 310 may be less than or equal to the line width of the first routing line 210 and the line width of the second routing line 220. The line width of the connecting line 310 may be the size of the connecting line 310 perpendicular to the extension direction of the connecting line 310. The line width of the first routing line 210 may be the size of the first routing line 210 perpendicular to the extension direction of the first routing line 210. The line width of the second routing line 220 may be the size of the second routing line 220 perpendicular to the extension direction of the second routing line 220. The line width of the first routing line 210 may be equal to the line width of the second routing line 220, which is beneficial to improving the optical uniformity of the mesh conductive structure.

In the mesh conductive structure provided in the embodiment of the present specification, adjacent first routing lines 210 and second routing lines 220 are arranged alternately, the first routing lines 210 and the second routing lines 220 located on the same side of the substrate 100 are spaced apart, and the first routing lines 210 and the second routing lines 220 are connected by connecting lines 310, and the line width of the connecting lines 310 is less than or equal to the line width of the first routing lines 210 and/or the line width of the second routing lines 220, thereby helping to solve the problem of the first routing lines 210 and the second routing lines 220 extending in different directions having a large line width at the intersection position, thereby improving the light transmittance of the mesh conductive structure, reducing the visibility of the mesh lines, and improving the application scope of the mesh conductive structure.

Please refer to FIG. 5 b or FIG. 8 . In some embodiments, along the extension direction of the first routing line 210, the first routing line 210 is adjacent to a plurality of the second routing lines 220, and the first routing line 210 covers the connecting line 310 in the orthographic projection part of the connecting line 310. The first routing line 210 covers the connecting line 310 in the orthographic projection part of the connecting line 310, and the first routing line 210 is located on the surface of the connecting line 310, and the first routing line 210 and the connecting line 310 can be in direct contact. Along the extension direction of the first routing line 210, the first routing line 210 is adjacent to a plurality of the second routing lines 220, and the adjacent first routing lines 210 and the second routing lines 220 are arranged alternately, and the connecting line 310 connects the adjacent first routing lines 210 and the second routing lines 220, so that the same connecting line 310 can be connected to a plurality of the first routing lines 210. The first routing line 210 covers the connecting line 310 in the orthographic projection part of the connecting line 310, which can improve the connection stability between the first routing line 210 and the connecting line 310.

Please refer to FIG. 3h. In some embodiments, the first routing line 210 partially covers the connecting line 310, and the second routing line 220 partially covers the connecting line 310. The connecting line 310 can be prepared prior to the first routing line 210 and the second routing line 220. The first routing line 210 and the second routing line 220 can be located on the surface of the substrate 100, and the connecting line 310 can be partially located on the surface of the substrate 100. Partial coverage between multiple routing lines can reduce the process difficulty during the preparation process and improve the connection stability.

Please refer to FIG. 6b. In some embodiments, the connecting line 310 partially covers the first routing line 210, and the connecting line 310 partially covers the second routing line 220. The first routing line 210 and the second routing line 220 can be prepared prior to the connecting line 310. The connecting line 310 can be located on the surface of the substrate, and the first routing line 210 and the second routing line 220 can be partially located on the surface of the substrate 100. The connecting line 310 overlaps with the first routing line 210 and the second routing line 220, which is conducive to improving the connection stability and reducing the difficulty of the preparation process.

In some embodiments, the region where the first routing line 210 and the connecting line 310 overlap forms a node, and along a direction perpendicular to the plane where the first routing line 210 is located, the thickness of the node is greater than the thickness of the first routing line 210, and the thickness of the node is greater than the thickness of the second routing line 220. The region where the first routing line 210 and the connecting line 310 overlap may be a region where the first routing line 210 and the connecting line 310 are in surface contact. The thickness of the first routing line 210 may be the same as the thickness of the second routing line 220, and the thickness of the first routing line 210 may be the same as the thickness of the connecting line 310.

Please refer to Figure 2d and Figure 3h. In some embodiments, the connecting line 310 intersects with the first routing line 210 and both ends of the connecting line 310 are connected to the second routing lines 220 on both sides of the first routing line 210. This is beneficial to reduce the difficulty of the preparation process and maintain the continuity and flatness of the grid conductive structure.

Please refer to Figures 5b and 6b. In some embodiments, the two ends of the connecting line 310 are respectively connected to the spaced first routing lines 210 and the second routing lines 220. Along the extension direction of the second routing lines 220, the second routing lines 220 adjacent to the same first routing line 210 are connected to the first routing line 210 through different connecting lines 310. Accordingly, there is a gap between adjacent connecting lines 310 on the surface of the first routing line 210. The connecting line 310 is only connected to a section of the second routing line 220 and a section of the first routing line 210.

In some embodiments, along the extension direction of the second routing line 220, the size of the interval between the first routing line 210 and the second routing line 220 can be greater than 42.5 microns, or greater than 62.5 microns, which can be selected according to different error values of exposure equipment, etching agents, etc.; the larger the interval size, the shorter the length of each second routing line along the second direction, and the longer the length of the corresponding connecting line 310 connected thereto along the second direction. It is not only conducive to forming the first routing line 210 and the second routing line 220 that are spaced apart, but also can prevent the process from being difficult to implement due to the size being too small. In one embodiment, the length of the second routing line is 0, the interval size reaches the maximum value, and the length of the corresponding connecting line 310 also reaches the maximum value. The two ends of the connecting line 310 connect the adjacent first routing lines 210, and the connecting line 310 and the first routing line 210 jointly form a grid conductive structure with a grid pattern. The size of the interval between the first routing line 210 and the second routing line 220 can be the distance between the first routing line 210 and the second routing line 220 along the extension direction of the second routing line 220.

The embodiments of the present specification provide a touch module, including the grid conductive structure described in any of the above embodiments. The touch module may include one or more touch electrode layers. Each touch electrode layer may include a plurality of grid conductive structures arranged at intervals. The touch module may include multiple touch electrode layers. For example, it includes two touch electrode layers, and an insulating layer may be provided between the touch electrode layers.

An embodiment of the present specification provides a display module, including the touch module described in any of the above embodiments.

The touch module and the display module provided in the embodiments of this specification include the grid conductive structure provided in the above embodiments, and thus have the same beneficial effects as the grid conductive structure.

The mesh conductive structure provided in the embodiments of this specification can be prepared by using the mesh conductive structure preparation method provided in any of the above embodiments.

The multiple embodiments in this specification emphasize the parts that are different from other embodiments, and the various embodiments can be explained in comparison with each other. Any combination of the multiple embodiments in this specification by technicians in the relevant field based on general technical knowledge is included in the disclosure scope of this specification.

The technical features of the above embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

The above descriptions are only some of the implementation methods in this specification and are not intended to limit this specification. Any modifications, equivalent substitutions, etc. made within the spirit and principles of this specification should be included in the scope of disclosure of this specification.

Claims (10)

1. A method for preparing a grid conductive structure, comprising:

Arranging a first wiring with the extending direction being the first direction and a second wiring with the extending direction being the second direction on the substrate; the first direction intersects with the second direction, and the first wires and the second wires are alternately arranged along the second direction, and adjacent first wires and second wires are spaced;

A connecting wire for connecting the first wiring and the second wiring is arranged on the substrate; the line width of the connecting line is smaller than or equal to the line width of the first wiring and/or the line width of the second wiring, so that the light transmittance of the grid conductive structure is improved.

2. The method of claim 1, wherein the step of providing a first trace having a first direction of extension and a second trace having a second direction of extension on the substrate comprises:

providing a conductive material on the surface of the substrate;

A first photoresist layer is arranged on the surface of the conductive material; the first photoresist layer comprises first-direction photoresists with a first extending direction and second-direction photoresists with a second extending direction, the first-direction photoresists and the second-direction photoresists are intersected, and the first-direction photoresists and the second-direction photoresists are alternately arranged along the second direction, and adjacent first-direction photoresists and the second-direction photoresists are spaced;

Etching the conductive material; the first wiring and the second wiring are formed by the conductive material covered by the first direction photoresist and the second direction photoresist respectively.

3. The method of claim 1, wherein the step of providing a connection line on the substrate connecting the first trace and the second trace comprises:

a second photoresist layer with an opening is arranged on one side of the first wiring and the second wiring, which is opposite to the substrate; the opening continuously extends between the adjacent first wires and the second wires, the opening covers the first wires at the orthographic projection part of the first wires, the opening covers the second wires at the orthographic projection part of the second wires, and the width of the opening is smaller than or equal to the line width of the first wires and/or the line width of the second wires;

a connecting wire is arranged in the opening; the connecting wire is connected with the adjacent first wiring and the adjacent second wiring.

4. The method of claim 3, wherein the step of disposing a second photoresist layer having an opening on a side of the first trace and the second trace opposite the substrate comprises:

A second photoresist layer is arranged on one side of the first wiring and the second wiring, which is opposite to the substrate; the openings continuously extend between the two second wires at two sides of the same first wire along the second direction, and the width of the openings is smaller than or equal to the line width of the first wire and/or the line width of the second wire;

Correspondingly, the step of disposing the connecting wire in the opening includes:

a connecting wire is arranged in the opening; the connecting wires are connected with the two second wires on two sides of the same first wire.

5. A method according to claim 3, wherein the step of providing a connection line within the opening comprises:

filling conductive materials in the openings by adopting a printing process or a knife coating process to form the connecting lines;

Or a conductive material is arranged on one side of the second photoresist layer, which is opposite to the first wiring; wherein the conductive material is embedded in the opening corresponding to the opening;

Forming a third photoresist layer corresponding to the opening on one side of the conductive material opposite to the second photoresist layer; the orthographic projection of the third photoresist layer on the first wiring covers the adjacent partial area of the first wiring and the adjacent partial area of the second wiring, and the orthographic projection of the third photoresist layer on the second photoresist layer is positioned in the opening;

Etching the conductive material; wherein the conductive material covered by the third photoresist layer forms the connecting line.

6. A method for preparing a grid conductive structure, comprising:

a plurality of connecting wires are arranged on a substrate;

Arranging a first wiring with the extending direction being the first direction and a second wiring with the extending direction being the second direction on the substrate; the first direction is intersected with the second direction, the first wires and the second wires are alternately arranged along the second direction, and adjacent first wires and second wires are spaced; the connecting wires are connected with the adjacent first wires and the second wires, and the line width of the connecting wires is smaller than or equal to the line width of the first wires and/or the line width of the second wires so as to improve the light transmittance of the grid conductive structure.

7. A mesh conductive structure, comprising:

A substrate;

The first wiring and the second wiring are positioned on the same side of the substrate and have different extending directions; the first wires and the second wires are alternately arranged along the extending direction of the second wires, and adjacent first wires and second wires are spaced;

Connecting wires connecting adjacent first wires and second wires; the line width of the connecting line is smaller than or equal to the line width of the first wiring and/or the line width of the second wiring, so that the light transmittance of the grid conductive structure is improved.

8. The grid conductive structure according to claim 7, wherein two ends of the connecting wire are connected to the first and second spaced apart wires, respectively;

Or the connecting line is intersected with the first wiring, and two ends of the connecting line are connected with the second wirings on two sides of the first wiring.

9. The utility model provides a touch module which characterized in that includes: a mesh conductive structure obtained by the mesh conductive structure production method of any one of claims 1 to 6; or comprises: the grid conductive structure of any one of claims 7-8.

10. A display module, comprising: the touch module of claim 9.