CN114927450B - Transmission device and semiconductor process equipment - Google Patents
Transmission device and semiconductor process equipment Download PDFInfo
- Publication number
- CN114927450B CN114927450B CN202210587775.8A CN202210587775A CN114927450B CN 114927450 B CN114927450 B CN 114927450B CN 202210587775 A CN202210587775 A CN 202210587775A CN 114927450 B CN114927450 B CN 114927450B
- Authority
- CN
- China
- Prior art keywords
- wafer
- assembly
- pushing
- carrier
- clamping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000005540 biological transmission Effects 0.000 title claims abstract description 87
- 238000000034 method Methods 0.000 title claims abstract description 61
- 230000008569 process Effects 0.000 title claims abstract description 38
- 239000004065 semiconductor Substances 0.000 title claims abstract description 21
- 230000007246 mechanism Effects 0.000 claims abstract description 335
- 235000012431 wafers Nutrition 0.000 claims description 243
- 238000007599 discharging Methods 0.000 claims description 48
- 238000012546 transfer Methods 0.000 claims description 39
- 238000012545 processing Methods 0.000 claims description 10
- 230000033001 locomotion Effects 0.000 abstract description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000004140 cleaning Methods 0.000 description 19
- 230000009286 beneficial effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000002452 interceptive effect Effects 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- 230000007723 transport mechanism Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000005571 horizontal transmission Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000013404 process transfer Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a transmission device and semiconductor process equipment, and relates to the technical field of semiconductor manufacturing. The transmission device comprises a first bearing mechanism, a second bearing mechanism and a first clamping assembly. The first bearing mechanism and the second bearing mechanism are both used for placing the wafer box. The first clamping assembly comprises a movable frame, a clamping mechanism and a pushing assembly, the pushing assembly is used for pushing out the wafer from the wafer box, and the clamping mechanism is used for clamping the wafer so as to clamp the wafer pushed out by the pushing assembly. The clamping mechanism and the pushing component are arranged on the movable frame, and the movable frame can drive the clamping mechanism and the pushing component to move between a first position and a second position. Under the condition that the movable frame is located at the first position, the pushing assembly is opposite to the first bearing mechanism. In the case that the moving frame is located at the second position, the clamping mechanism is opposite to the second bearing mechanism. The scheme can solve the problem that the wafer transmission system has a complex motion structure.
Description
Technical Field
The present invention relates to the field of semiconductor manufacturing technology, and in particular, to a transmission device and a semiconductor processing apparatus.
Background
Wafer cleaning is an important step in semiconductor processing. During the cleaning process of the wafer, the transmission of the wafer comprises a front end transmission part and a process end transmission part. Wherein front end transfer refers to the transfer process of transferring the wafer into the wafer cleaning apparatus. The process end transport refers to the transport process of the wafer within the cleaning apparatus.
Front end transfer of wafers is accomplished primarily by a wafer transfer system. In the related art, the wafer transmission system includes a manipulator, a first bearing assembly, a second bearing assembly, a third bearing assembly, a second feeding device, and a first feeding device. Specifically, the second feeding and discharging device is used for conveying the wafer box filled with the wafers to the first bearing assembly; the first feeding and discharging device is used for conveying the wafer box filled with the wafers to the second bearing assembly. The manipulator is used for clamping the wafers in the first bearing component and the second bearing component to the third bearing component. The first bearing component, the second bearing component and the third bearing component all comprise a lifting mechanism and a rotating mechanism, and the first bearing component, the second bearing component and the third bearing component can be lifted or lowered by the lifting mechanism so as to prepare for loading or unloading a wafer or a wafer box. The first bearing assembly, the second bearing assembly and the third bearing assembly can also rotate under the driving of the corresponding rotating mechanisms so as to adjust the orientation of the wafer. Because the first bearing component, the second bearing component and the third bearing component all relate to rotary motion and lifting motion, and the manipulator relates to horizontal transmission motion, the transmission motion mechanism of the wafer transmission system is complex, and the transmission efficiency is low.
Disclosure of Invention
The invention discloses a transmission device and semiconductor process equipment, which are used for solving the problem that a wafer transmission system in the related art is complex in motion structure.
In order to solve the problems, the invention adopts the following technical scheme:
The transmission device comprises a first bearing mechanism, a second bearing mechanism and a first clamping assembly; the first bearing mechanism and the second bearing mechanism are used for placing a wafer box, and the wafer box is used for accommodating wafers;
The first clamping assembly comprises a movable frame, a clamping mechanism and a pushing assembly, the pushing assembly is used for pushing out and putting the wafer into the wafer box, and the clamping mechanism is used for clamping the wafer so as to clamp the wafer pushed out by the pushing assembly or put the clamped wafer on the pushing assembly; the clamping mechanism and the pushing component are both arranged on the movable frame, the movable frame can drive the clamping mechanism and the pushing component to move between a first position and a second position,
Under the condition that the movable frame is positioned at the first position, the pushing component is opposite to the first bearing mechanism, and the pushing component can put the wafer into the wafer box positioned at the first bearing mechanism or push the wafer out of the wafer box positioned at the first bearing mechanism;
Under the condition that the movable frame is located at the second position, the clamping mechanism is opposite to the second bearing mechanism, and the pushing component can put the wafer into the wafer box located at the second bearing mechanism or push the wafer out of the wafer box located at the second bearing mechanism.
Based on the transmission device, the invention also discloses semiconductor process equipment. The semiconductor processing equipment comprises the transmission device.
The technical scheme adopted by the invention can achieve the following beneficial effects:
The first clamping assembly in the conveying device disclosed by the embodiment of the invention is provided with a clamping mechanism and a pushing assembly. Specifically, the pushing assembly pushes out the wafers on the first bearing mechanism and the second bearing mechanism, so that the clamping mechanism can clamp the wafers. After the clamping mechanism clamps and fixes the wafer pushed out by the pushing component, the pushing component moves to an initial position before the wafer is taken, so that the pushing component can avoid the first bearing mechanism or the second bearing mechanism in the moving process of the first clamping component. Further, the clamping mechanism and the pushing component are both arranged on the movable frame, so that the pushing component can move between the first position and the second position along with the movable frame, and the pushing component can be used for taking and placing wafers on the first bearing mechanism and the second bearing mechanism. According to the scheme, the first bearing mechanism and the second bearing mechanism can share the same pushing component, so that the structure of the conveying device can be simplified, and the utilization rate of the pushing component can be improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and do not constitute a limitation on the invention. In the drawings:
FIG. 1 is a schematic diagram of a transport device in one or more alternative embodiments of the invention;
FIG. 2 is a schematic view of a first clamping assembly in accordance with one or more alternative embodiments of the present invention;
FIG. 3 is an assembly schematic of a first transport mechanism and a first gripper assembly in one or more alternative embodiments of the invention;
FIG. 4 is a schematic diagram illustrating the control of a semiconductor processing apparatus in accordance with one or more alternative embodiments of the present invention;
FIG. 5 is a schematic view of a third carrying mechanism in a fourth position according to some embodiments of the present invention;
FIG. 6 is a schematic view of a third bearing mechanism according to some embodiments of the present invention in a third position;
fig. 7 is a schematic diagram of a second clamping assembly according to some embodiments of the invention.
In the figure: 100-a first carrying mechanism; 200-a second bearing mechanism; 300-a first gripping assembly; 310-moving a rack; 320-pushing assembly; 321-a first bracket; 322-first pusher; 323-second pushing piece; 324-a first drive mechanism; 325-a second transport mechanism; 330-a second drive mechanism; 340-a first rail; 350-a clamping mechanism; 400-wafer; 500-a third carrying mechanism; 600-a first transmission mechanism; 700-a first feeding and discharging device; 800-a second feeding and discharging device; 900-a second gripping assembly; 910-a second rail; 101-a first position; 102-a second position; 103-a third position; 104-fourth position.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to specific embodiments of the present invention and corresponding drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The following describes the technical solutions disclosed in the embodiments of the present invention in detail with reference to fig. 1 to 7.
In one or more alternative embodiments, the conveying device of the present invention includes a first carrying mechanism 100, a second carrying mechanism 200, and a first gripping assembly 300. Illustratively, both the first and second loading mechanisms 100, 200 are used to place cassettes. Wherein the cassette is configured to hold wafers 400.
The first gripping assembly 300 includes a moving rack 310, a clamping mechanism 350, and a pushing assembly 320. Wherein the pushing assembly 320 is used to push the wafer 400 out of and into the cassette. The clamping mechanism 350 is used for clamping the wafer 400 to clamp the wafer 400 pushed out by the pushing assembly 320, or placing the clamped wafer 400 on the pushing assembly 320. Illustratively, the pushing assembly 320 pushes the wafer 400 from the wafer 400 in the cassette on the first carrier 100 or the second carrier 200 to a position where the clamping mechanism 350 can clamp the wafer 400, i.e. the pushing assembly 320 pushes the wafer 400 in the cassette on the first carrier 100 or the second carrier 200 so that the wafer 400 can move to the clamping range of the clamping mechanism 350.
Referring to fig. 1,2 and 7, the clamping mechanism 350 and the pushing assembly 320 are disposed on the moving frame 310, so that the moving frame 310 can drive the clamping mechanism 350 and the pushing assembly 320 to move. Illustratively, the movable frame 310 may move the clamping mechanism 350 and the pushing assembly 320 between the first position 101 and the second position 102. With the movable frame 310 located at the first position 101, the pushing assembly 320 is opposite to the first carrying mechanism 100, and the pushing assembly 320 may place the wafer 400 in the cassette located at the first carrying mechanism 100 or push the wafer 400 out of the cassette located at the first carrying mechanism 100. With the movable rack 310 in the second position 102, the clamping mechanism 350 is opposite to the second carrying mechanism 200, and the pushing assembly 320 can place the wafer 400 in the cassette located on the second carrying mechanism 200 or push the wafer 400 out of the cassette located on the second carrying mechanism 200.
It should be noted that, the pushing assembly 320 is opposite to the first carrying mechanism 100, that is, the wafer 400 placed in the cassette of the first carrying mechanism 100 is located in the operation range of the pushing assembly 320 for picking and placing the wafer 400. Similarly, the clamping mechanism 350 is opposite to the second carrying mechanism 200, that is, the wafer 400 placed in the cassette of the first carrying mechanism 100 is located in the working range of the pushing assembly 320 for picking and placing the wafer 400.
In the above embodiment, the pushing assembly 320 and the clamping mechanism 350 are disposed on the moving frame 310, so that the pushing assembly 320 and the clamping mechanism 350 can move synchronously with the moving frame 310. Illustratively, in the process that the first clamping assembly 300 clamps the wafer 400 pushed out from the wafer cassette on the first carrying mechanism 100, the moving frame 310 moves to the first position 101, so that the pushing assembly 320 is opposite to the first carrying mechanism 100, and the wafer 400 in the wafer cassette on the first carrying mechanism 100 is located in the working range of the pushing assembly 320.
In the above embodiments, the wafer 400 may be placed in the cassette for transmission during the transmission process, so as to protect the wafer 400 by the cassette and avoid the wafer 400 from being damaged during the transmission process.
In one or more alternative embodiments, the pushing assembly 320 moves in a third direction, and drives the wafer 400 in the cassette on the first carrying mechanism 100 to move out of the cassette, so that the wafer 400 in the cassette on the first carrying mechanism 100 moves to a working range where the clamping mechanism 350 clamps the wafer 400 under the action of the pushing assembly 320. It should be noted that, during the pushing process of pushing the wafer 400 in the wafer cassette on the first carrying mechanism 100, the pushing assembly 320 is at least partially located in the wafer cassette of the first carrying mechanism 100 and/or the wafer 400. Further, the clamping mechanism 350 clamps and holds the wafer 400 removed from the first carrier 100. The pushing assembly 320 moves along a fourth direction, which is opposite to the third direction, so that the pushing assembly 320 can be moved out of the first carrying mechanism 100 and/or the wafer box in which the wafer 400 is placed, so as to avoid the first carrying mechanism 100 interfering with the movement of the pushing assembly 320 during the movement of the moving frame 310.
In one or more alternative embodiments, the pushing assembly 320 may be a telescopic mechanism to enable pushing or placing of the wafer 400 in the cassette on the first carrier 100 or the second carrier 200 by extending or retracting the pushing assembly 320. Illustratively, the pushing assembly 320 may be lengthened or shortened in a third direction such that the pushing assembly 320 may push out the wafer 400 within the cassette or place the wafer 400 within the cassette.
Optionally, the third direction is vertically upward, and the fourth direction is vertically downward, i.e., the pushing assembly 320 may push the wafer 400 in the cassette vertically upward, or place the wafer 400 in the cassette in a vertically downward direction.
The telescopic mechanism may be of various types, for example, a hydraulic cylinder, an air cylinder, a link mechanism, a crank block mechanism, a screw mechanism, etc., and therefore, the specific structure of the pushing assembly 320 is not limited in this embodiment.
In the process of placing the wafer 400 on the first carrying mechanism 100, the moving frame 310 moves to the first position 101, so that the pushing component 320 is opposite to the first carrying mechanism 100, and the area of the wafer 400 in the wafer cassette on the first carrying mechanism 100 is located in the working range of the pushing component 320. Illustratively, the pusher assembly 320 moves in a third direction such that the pusher assembly 320 may support the wafer 400 on the clamping mechanism 350. Further, the clamping mechanism 350 positions the wafer 400 on the pushing assembly 320. The pushing assembly 320 moves in the fourth direction to place the wafer 400 in the cassette on the first carrier 100.
Similarly, the method of placing the wafer 400 in the cassette on the second carrier 200 by the first gripper assembly 300 may be the same as the method of placing the wafer 400 in the cassette on the first carrier 100 by the first gripper assembly 300. The method of pushing the wafer 400 from the cassette on the second carrier 200 by the first gripper assembly 300 may be the same as the method of pushing the wafer 400 from the cassette on the first carrier 100 by the first gripper assembly 300. The method of the first gripper assembly 300 to place the wafer 400 in the cassette on the second carrier 200 and the method of the first gripper assembly 300 to eject the wafer 400 from the cassette on the second carrier 200 will not be further described in this specification.
In the above embodiment, the pushing assembly 320 is disposed on the moving frame 310, so that the pushing assembly 320 can be used to take out the wafers 400 in the cassettes on the first bearing mechanism 100 and the second bearing mechanism 200, or put the wafers 400 into the cassettes on the first bearing mechanism 100 and the second bearing mechanism 200, which not only improves the utilization rate of the pushing assembly 320, but also is beneficial to reducing the number of the pushing assemblies 320 and simplifying the movement structure of the transmission device.
In one or more alternative embodiments, the transfer apparatus of the present invention may be used for front end transfer of semiconductor processing equipment. Illustratively, the transfer device of the present invention may be used for front end transfer of a200 mm tank washer.
In the related art, a transmission system for front end transmission of a 200mm tank type cleaning machine includes a plurality of wafer support platforms and a robot. The manipulator is at the in-process of snatching the wafer on the supporting platform, receives the restriction of magazine, supporting platform structure and manipulator self mechanism, leads to the wafer unable direct ejecting the wafer from the magazine. Specifically, lifting devices are arranged on the supporting platforms, and the lifting devices are used for moving out wafers on the supporting platforms from the wafer boxes of the supporting platforms and grabbing the moved wafers through mechanical arms.
In the embodiment, the transmission device is applied to the front end transmission of the 200mm tank type cleaning machine, so that the number of lifting devices can be reduced, a transmission system for the front end transmission of the cleaning machine can be simplified, and the transmission efficiency of the front end transmission of the 200mm tank type cleaning machine is improved. Thereby improving the cleaning efficiency of the wafer 400.
Referring to fig. 1, 5 and 6, in one or more alternative embodiments, the conveying apparatus further includes a third carrying mechanism 500, a first conveying mechanism 600 and a first feeding and discharging device 700, where the third carrying mechanism 500 is connected to the first conveying mechanism 600, and the first conveying mechanism 600 may drive the third carrying mechanism 500 to move between the third position 103 and the fourth position 104. In the case that the third carrying mechanism 500 is located at the third position 103 and the moving frame 310 is located at the first position 101, the third carrying mechanism 500 is opposite to the pushing component 320, and the pushing component 320 may place the wafer 400 in the cassette located on the third carrying mechanism 500 or push the wafer 400 out of the cassette located on the third carrying mechanism 500. With the third loading mechanism 500 in the fourth position 104, the third loading mechanism 500 is opposite the first loading and unloading device 700, and the first loading and unloading device 700 is configured to load and place the cassette in the third loading mechanism 500 or out of the third loading mechanism 500.
It should be noted that, the third carrying mechanism 500 and the pushing assembly 320 according to the present invention refer to: the wafer 400 in the cassette on the third loading mechanism 500 is located within the working range of the pushing assembly 320, that is, the pushing assembly 320 may be used to push out the wafer 400 in the cassette on the third loading mechanism 500 or put the wafer 400 into the cassette on the third loading mechanism 500.
Illustratively, the method of placing the wafer 400 in the cassette located on the third carrier 500 by the first gripper assembly 300 may be the same as the method of placing the wafer 400 in the cassette located on the first carrier 100 by the first gripper assembly 300. The method of pushing the wafer 400 from the cassette on the third carrier 500 by the first gripper assembly 300 may be the same as the method of pushing the wafer 400 from the cassette on the first carrier 100 by the first gripper assembly 300. The method by which the first gripper assembly 300 places the wafer 400 in a cassette located on the third carrier 500 and the method by which the first gripper assembly 300 ejects the wafer 400 from a cassette located on the third carrier 500 will not be further described in this specification.
The above embodiment can implement the synchronous picking and placing of the wafer 400 by the first clamping assembly 300 on the first carrying mechanism 100 and the third carrying mechanism 500, which is beneficial to improving the transmission efficiency of the wafer 400.
In an alternative embodiment, first transport mechanism 600 includes a rail, a slider, and a second servo motor. Optionally, the slider is in sliding engagement with the rail such that the slider is slidable along the rail. Further alternatively, the third bearing mechanism 500 is disposed on the sliding member, and the sliding member can drive the third bearing mechanism 500 to slide along the guide rail between the third position 103 and the fourth position 104. Illustratively, a second servomotor is coupled to the slider, and the second servomotor is operable to drive the slider along the rail. Alternatively, the second servo motor may be coupled to the slider via a magnetic linkage, a rack and pinion, a lead screw mechanism, and/or a cam mechanism such that the second servo motor may drive the slider to slide along the rail.
Of course, there are many kinds of the first transfer mechanism 600, such as a conveyor belt, a linear slide, and the like. For this reason, the present embodiment is not limited to a specific kind of the first transfer mechanism 600.
Referring to fig. 1, in one or more alternative embodiments, the transfer device further includes a second feeding and discharging device 800, the second feeding and discharging device 800 being opposite to the first loading mechanism 100, and the second feeding and discharging device 800 being used to load a slide and place a cassette on the first loading mechanism 100 or out of the first loading mechanism 100. Illustratively, the second feeding and discharging device 800 is opposite to the first carrying mechanism 100: the first loading mechanism 100 is located within the working range of the second feeding and discharging apparatus 800, so that the second feeding and discharging apparatus 800 can place the cassette containing the wafer 400 on the first loading mechanism 100, or the second feeding and discharging apparatus 800 can discharge the cassette placed on the first loading mechanism 100.
In an alternative embodiment, the first conveying mechanism 600 may drive the third carrying mechanism 500 to move along the fifth direction, so that the third carrying mechanism 500 may move between the third position 103 and the fourth position 104. Further alternatively, in case the third carrying mechanism 500 is located at the third position 103, the first carrying mechanism 100 and the third carrying mechanism 500 are arranged in the sixth direction. Illustratively, the sixth direction is perpendicular to the gripping direction of the first gripping assembly 300. Optionally, the fifth direction is perpendicular to the sixth direction.
It should be noted that the feeding direction of the feeding and discharging device is the same as the axial direction of the wafer 400 during the feeding process. Specifically, the feeding direction of the feeding and discharging device means: the loading and unloading apparatus places the cassette containing the wafers 400 in the direction of movement on the carrier. During the cleaning of the wafer 400, the wafers 400 transferred by the second feeding and discharging apparatus 800 and the first feeding and discharging apparatus 700 need to be stacked in the axial direction of the wafer 400. Due to the influence of the structural dimensions of the semiconductor process equipment and the feeding and discharging equipment, the second feeding and discharging equipment 800 and the first feeding and discharging equipment 700 cannot be arranged in the sixth direction, so that the feeding directions of the second feeding and discharging equipment 800 and the first feeding and discharging equipment 700 are parallel to each other.
In the above embodiment, the first conveying mechanism 600 moves the third bearing mechanism 500, so that the feeding positions of the first feeding and discharging device 700 can be arranged along the fifth direction relative to the feeding positions of the second feeding and discharging device 800, and the feeding directions of the second feeding and discharging device 800 and the first feeding and discharging device 700 can be ensured to be the same. Illustratively, in the case that the third carrying mechanism 500 moves to the third position 103, the axis of the wafer 400 in the cassette on the third carrying mechanism 500 coincides with the axis of the wafer 400 in the cassette on the first carrying mechanism 100, so that the wafers 400 transferred by the second feeding and discharging apparatus 800 and the first feeding and discharging apparatus 700 may be stacked along the axial direction of the wafer 400. In this embodiment, in order to achieve synchronous transmission of the wafers 400 on the first carrier 100 and the third carrier 500, the transmission efficiency of the transmission device may be improved.
In one or more alternative embodiments, the pushing assembly 320 includes a first bracket 321, a first pushing member 322, a second pushing member 323, and a first driving mechanism 324, where the first pushing member 322 and the second pushing member 323 are disposed on the first bracket 321. When the third carrying mechanism 500 is located at the third position 103 and the moving frame 310 is located at the first position 101, the first pushing member 322 is opposite to the first carrying mechanism 100, and the second pushing member 323 is opposite to the third carrying mechanism 500. The first driving mechanism 324 is connected to the first bracket 321 and the moving frame 310, and the first driving mechanism 324 is used for driving the first bracket 321 and driving the first pushing member 322 and the second pushing member 323 to move in a direction approaching or separating from the clamping mechanism 350.
In the process that the first driving mechanism 324 drives the first bracket 321 to move towards the direction approaching the clamping mechanism 350, the first bracket 321 can drive the first pushing member 322 and the second pushing member 323 to push the wafer 400 out of the cassette on the first loading mechanism 100, the third loading mechanism 500 or the second loading mechanism 200. In the process that the first driving mechanism 324 drives the first bracket 321 to move away from the clamping mechanism 350, the first bracket 321 can drive the first pushing member 322 and the second pushing member 323 to place the wafer 400 into the cassette located on the first carrying mechanism 100, the third carrying mechanism 500 or the second carrying mechanism 200.
Illustratively, the first drive mechanism 324 may drive the first carriage 321 to move relative to the mobile carriage 310 between the initial position and the transfer position. Illustratively, with the first bracket 321 located at the initial position, the first pushing member 322 and the second pushing member 323 are located outside the first carrying mechanism 100, the third carrying mechanism 500 or the second carrying mechanism 200, so that the pushing assembly 320 can be switched between the first position 101 and the second position 102 under the driving of the moving frame 310. With the first stand 321 at the transfer position, the first pushing member 322 and the second pushing member 323 push the wafer 400 out to the operating range of the clamping mechanism 350, so that the clamping mechanism 350 can clamp and fix the wafer 400 pushed out by the pushing assembly 320, or the clamping mechanism 350 can place the clamped wafer 400 on the pushing assembly 320, so as to prepare for the pushing assembly 320 to place the wafer 400 in the cassette.
In one or more alternative embodiments, first drive mechanism 324 includes a first servo motor and a lift mechanism. Illustratively, a first servomotor is coupled to the lift mechanism, and the first servomotor is used to drive the lift mechanism up or down.
There are many kinds of lifting mechanisms, such as screw mechanisms, cam slider mechanisms, vertically arranged linear modules, and the like. For this reason, the present embodiment is not limited to a specific kind of the lifting mechanism.
In one or more alternative embodiments, the pushing assembly 320 further includes a second conveying mechanism 325, where the second conveying mechanism 325 is disposed on the first support 321, and the second conveying mechanism 325 is connected to the second pushing member 323, and the second conveying mechanism 325 can drive the second pushing member 323 to move away from or close to the first pushing member 322.
In the above embodiment, the second conveying mechanism 325 drives the second pushing member 323 to move in a direction approaching the first pushing member 322, so as to adjust the distance between the second pushing member 323 and the first pushing member 322, and further adjust the distance between the first pushing member 322 and the wafer 400 on the second pushing member 323, so that the distance between the wafer 400 on the first pushing member 322 and the wafer 400 on the second pushing member 323 can be adapted to the conveying of the process section of the semiconductor process equipment.
Illustratively, the second transfer mechanism 325 is of a wide variety, such as a linear slide, a screw mechanism, a crank block mechanism, a rack and pinion mechanism, and the like.
In an alternative embodiment, second transfer mechanism 325 includes a third servo motor to power second transfer mechanism 325 via the third servo motor.
Of course, the structure of the second transfer mechanism 325 may be the same as that of the first transfer mechanism 600. For this reason, the specific structure of the second transfer mechanism 325 is not explained in the present embodiment.
In one or more alternative embodiments, the transmission device further includes a rotation mechanism, where the rotation mechanism is connected to the first carrying mechanism 100, and the rotation mechanism may drive the first carrying mechanism 100 to rotate about a first axis, where the first axis is parallel to or coincides with a diameter of a wafer 400 placed in the cassette of the first carrying mechanism 100. Alternatively, the first axis may vertically intersect through the axis corresponding to the wafer 400 placed on the first carrying mechanism 100, so that the height of the wafer 400 located on the first carrying mechanism 100 relative to the third carrying mechanism 500 is unchanged before and after rotation, so that the wafer 400 located on the first carrying mechanism 100 and the wafer 400 located on the third carrying mechanism 500 may be coaxially arranged.
It should be noted that, in the process of cleaning the wafer 400, the wafer 400 is required to be oriented differently by two adjacent wafer 400 placement positions in the wafer 400 cleaning apparatus. In the above embodiment, the rotating mechanism is connected to the first carrying mechanism 100, and the rotating mechanism may further drive the first carrying mechanism 100 and/or the wafer 400 placed on the first carrying mechanism 100 to rotate, so that the orientation of the wafer 400 on the first carrying mechanism 100 may be adjusted as required. Illustratively, the rotation mechanism performs the face_to_back function by driving the first carrier 100 to rotate 180 ° about the first axis such that the orientation of the wafer 400 on the first carrier 100 is opposite to the orientation of the wafer 400 on the third carrier 500. Optionally, the front side of the wafer is the process side of the wafer. Illustratively, a process surface during a semiconductor process. The back side of the wafer refers to the surface opposite the process side of the wafer.
Of course, during the process of transferring the wafer 400, the orientation of the wafer 400 on the first carrying mechanism 100 may be kept unchanged according to the requirement of the cleaning apparatus for the wafer 400, so as to implement the face_to_face (the front Face is opposite to the front Face), that is, the orientation of the wafer 400 on the first carrying mechanism 100 is the same as the orientation of the wafer 400 on the third carrying mechanism 500.
In one or more alternative implementations, the first carrier 100 is provided with a first rotation axis, which is arranged along the first axis, such that the first carrier 100 can be rotatably arranged by the first rotation axis. Further, in the case that the third carrying mechanism 500 is located at the third position 103, an avoidance space is provided between the third carrying mechanism 500 and the first carrying mechanism 100, so as to avoid interference of the third carrying mechanism 500 or the first conveying mechanism 600 with rotation of the first carrying mechanism 100 around the first axis, and further enable the rotation of the first carrying mechanism 100 around the first axis and the movement of the third carrying mechanism 500 along with the first conveying mechanism 600 to be independent, that is, in the process that the third carrying mechanism 500 is switched between the third position 103 and the fourth position 104, the first carrying mechanism 100 can rotate around the first axis, so that synchronous feeding between the second feeding and discharging device 800 and the first feeding and discharging device 700 can be realized, and the conveying efficiency of the wafer 400 is improved.
It should be noted that, in the case where the third carrying mechanism 500 is located at the third position 103, in order to avoid the third carrying mechanism 500 interfering with the rotation of the first carrying mechanism 100 about the first axis, the space between the first carrying mechanism 100 and the third carrying mechanism 500 increases, so that the space between the wafer 400 on the first carrying mechanism 100 and the wafer 400 on the third carrying mechanism 500 increases. In an exemplary process of transferring the wafer 400, the second transfer mechanism 325 may be utilized to drive the second pushing member 323 to move closer to or further away from the first pushing member 322, so that the distance between the wafer 400 transferred by the third carrying mechanism 500 and the wafer 400 transferred by the first carrying mechanism 100 may be reduced or increased, and the transfer device may be applied to front-end transfer of a wider variety of semiconductor processing equipment.
In an alternative embodiment, the rotation mechanism includes a fourth servomotor and a transmission assembly. The exemplary drive assembly may be a gearbox or a drive shaft. Specifically, the fourth servo motor is connected to the first bearing mechanism 100 through a transmission assembly, so that the fourth servo motor can drive the first bearing mechanism 100 to rotate around the first axis through the transmission assembly.
In an alternative implementation, the first gripping assembly 300 further includes a second driving mechanism 330 and a first guide 340, the moving frame 310 is slidably engaged with the first guide 340, the second driving mechanism 330 is connected to the moving frame 310, and the second driving mechanism 330 can drive the moving frame 310 to move along the first guide 340. Illustratively, the second drive mechanism 330 may drive the movable carriage 310 along the first rail 340 between the first position 101 and the second position 102.
Illustratively, the second drive mechanism 330 includes a fifth servomotor. Illustratively, a fifth servomotor is used to power the second drive mechanism 330.
In one or more alternative embodiments, the transfer device further includes a second gripping assembly 900, the second gripping assembly 900 being used for end-of-process transfer. The direction in which the first clamping assembly 300 clamps the wafer 400 is the first direction, and when the wafer 400 is positioned in the first clamping assembly 300, the axial direction of the wafer 400 is perpendicular to the first direction. The direction in which the second clamping assembly 900 clamps the wafer 400 is a second direction, and when the wafer 400 is positioned in the second clamping assembly 900, the axial direction of the wafer 400 is perpendicular to the second direction, and the second direction is parallel to the first direction.
In an alternative embodiment, the transfer device further comprises a second rail 910. The second clamping assembly 900 is in sliding engagement with the second rail 910 such that the second clamping assembly 900 can drive the second clamping assembly 900 to move along the second rail 910. The transmission device further comprises a sixth servomotor. Illustratively, a sixth servomotor is coupled to the second gripper assembly 900 such that the sixth servomotor can drive the second gripper assembly 900 along the second rail 910.
In the above embodiment, the first direction is parallel to the second direction, so that the gesture of the wafer 400 in the front end transmission process is the same as the gesture of the wafer 400 in the process of the process end transmission process, and the direction of the wafer 400 does not need to be adjusted by rotating the wafer 400 at the connection part between the front end transmission and the process end transmission, thereby simplifying the structure and the movement mode of the transmission device and achieving the purpose of improving the transmission efficiency of the transmission device. In an exemplary embodiment of the present application, the connection between the front-end transmission and the process-end transmission is the second bearing mechanism 200. Therefore, in the above embodiment, there is no need to provide a rotation mechanism for adjusting the orientation of the wafer 400 on the second carrying mechanism 200.
In one or more alternative embodiments, the transmission device further includes a controller, where the controller is configured to control the first transmission mechanism 600 to move the third carrying mechanism 500 between the third position 103 and the fourth position 104. Illustratively, the controller is coupled to the fifth servomotor such that the controller drives the movable carriage 310 between the first position 101 and the second position 102 by controlling the fifth servomotor.
Further, the controller may be further connected to the first, third, and sixth servomotors, so that the controller may control the first, third, fifth, and sixth servomotors, respectively. Illustratively, in the above embodiment, the controller may drive the first gripper assembly 300 to transfer the wafer 400 on the first carrier 100 and/or the third carrier 500 to the second carrier 200 by controlling the first, third, fifth, and sixth servomotors.
It should be noted that, in the related art, the transmission device adopts a stepping motor to provide power, and although the position can be positioned, the progressive motor needs to be matched with the position sensor to position, and the position needs to be calibrated and corrected in the positioning process. The transmission device in the above embodiment provides power through the servo motor and adopts the absolute encoder to accurately position the position, so that the accuracy of wafer transmission and the stability of the transmission device are improved.
In one or more alternative embodiments, the transmission device further includes a plurality of position sensors. Illustratively, the moving rack 310, the first bracket 321, the second pushing member 323, the first carrying mechanism 100, the second carrying mechanism 200, and the third carrying mechanism 500 are each provided with a position sensor. Illustratively, the position sensor is used to sense the position of the moving rack 310, the first bracket 321, the second pusher 323, and/or the third carrier 500. Further, the position sensor is further configured to sense a position of the wafer 400 on the first carrier 100, the second carrier 200, and/or the third carrier 500.
In one or more alternative embodiments, each position sensor is connected to the controller, such that the controller can control the first gripper assembly 300 to transfer the wafer 400 on the first carrier 100 and/or the third carrier 500 to the second carrier 200 based on the sensed information of each position sensor.
In one or more alternative embodiments, the feeding method for front end transmission of the transmission device of the present invention includes:
step 101: the second feeding and discharging equipment transmits the wafer box loaded with the wafer to the first bearing mechanism;
step 102: moving the first clamping assembly to the position where the pushing assembly is opposite to the first bearing mechanism;
step 103: the pushing assembly moves from the initial position to the transmission position to drive the wafer in the wafer box placed on the first bearing mechanism to the operation range of the clamping mechanism;
step 104: the clamping mechanism clamps and fixes the wafer pushed out by the pushing component;
Step 105: the pushing component moves from the transmission position to the initial position;
Step 106: the movable frame is driven to move to the second position until the pushing component is opposite to the second bearing mechanism;
Step 107: the pushing component moves from an initial position to a transmission position;
step 108: the clamping mechanism is used for placing the wafer on the pushing component;
Step 109: the pushing component moves from the transmission position to the initial position so that the wafer on the pushing component is placed in the wafer box on the second bearing mechanism.
It should be noted that the pushing assembly moves to the initial position, that is, the pushing assembly is located at a position outside the second bearing mechanism, the first bearing mechanism and/or the cassette.
In one or more alternative embodiments, the pushing assembly is a lifting mechanism. Illustratively, the pusher assembly is moved to an initial position, i.e., the pusher assembly is lowered directly below the second carrier, the first carrier, and/or the cassette. The pushing component moves to a transmission position, namely, the pushing component ascends, and at least part of the pushing component moves into the second bearing mechanism, the first bearing mechanism and/or the wafer box so as to move the wafer in the wafer box arranged on the second bearing mechanism or the first bearing mechanism into the operation range of the clamping mechanism, so that the clamping mechanism can clamp and fix the wafer pushed by the pushing component.
In one or more alternative embodiments, the feeding method for front-end transport by the transport device before step 103 further includes:
step 110: the first feeding and discharging equipment transmits the wafer box loaded with the wafer to a third bearing mechanism;
Step 111: the first transmission mechanism drives the third bearing mechanism to move to the third position until the third bearing mechanism is opposite to the pushing component.
In one or more alternative embodiments, after step 104 and before step 109, the method for feeding the front end transport for the transport device further includes:
step 112: the second transmission mechanism drives the second pushing piece to move towards the direction close to the first pushing piece until the distance between the wafer on the first pushing piece and the wafer on the second pushing piece reaches a first preset value.
Illustratively, the first preset value is the distance between the wafer passing through the second feeding and discharging device and the wafer transported by the first feeding and discharging device, which is required in the wafer transporting process of the process transporting end. In the case that the conveying device of the invention can be used for front-end conveying of a 200mm tank type cleaning machine, the first preset value can be the interval between two adjacent feed inlets or feed placement positions of the cleaning machine.
The distances between two adjacent feeding holes or feeding and discharging positions corresponding to different wafer cleaning machines are different. For this reason, the present embodiment is not limited to a specific size of the first preset value.
In one or more alternative embodiments, after step 109, the feeding method for front end transport by the transport device further includes:
step 113: the second transmission mechanism drives the second pushing piece to move in a direction away from the first pushing piece until the distance between the wafer on the first pushing piece and the wafer on the second pushing piece reaches a second preset value.
The second preset value may be, for example, a distance between the third carrying mechanism and the first carrying mechanism in a case where the third carrying mechanism is located at the third position.
In one or more alternative embodiments, after step 105, the feeding method for front end transport by the transport device further includes:
Step 114: the first transmission mechanism drives the third bearing mechanism to move to the fourth position until the third bearing mechanism is opposite to the second feeding and discharging equipment.
In one or more alternative embodiments, after step 101 and before step 102, the feeding method for front end transport by the transport device further includes:
Step 115: the first bearing mechanism is driven to rotate 180 degrees around the first axis along the first time needle direction.
In one or more alternative embodiments, after step 113, the feeding method for front-end transport by the transport device further includes:
Step 116: the first clamping assembly is moved to a position between a first position and a second position of the first bearing mechanism.
In the above embodiment, the first clamping assembly may be moved between the first position and the second position, so as to avoid the first clamping assembly interfering with the rotation of the first carrying mechanism and/or the second feeding and discharging device to carry the wafer on the first carrying mechanism.
In one or more alternative embodiments, after step 106, the feeding method for front end transport by the transport device further includes:
Step 117: the first bearing mechanism is driven to rotate 180 degrees around the first axis along a second clockwise direction, and the second clockwise direction is opposite to the first clockwise direction.
In one or more alternative embodiments, the discharging method for front-end transmission of the transmission device of the present invention includes:
step 201: moving the first clamping assembly to the position where the pushing assembly is opposite to the second bearing mechanism;
Step 202: the pushing component moves from the initial position to the transmission position so as to drive the wafer in the wafer box placed on the second bearing mechanism to be within the operation range of the clamping mechanism;
step 203: the clamping mechanism clamps and fixes the wafer pushed out by the pushing component;
step 204: the pushing component moves from the transmission position to the initial position;
Step 205: the movable frame is driven to move to the first position until the pushing component is opposite to the first bearing mechanism;
Step 206: the pushing component moves from an initial position to a transmission position;
step 207: the clamping mechanism is used for placing the wafer on the pushing component;
Step 208: the pushing assembly moves from the transmission position to the initial position so that the wafer on the pushing assembly is placed in the wafer box of the first bearing mechanism and/or the third bearing mechanism;
Step 209: the second feeding and discharging device transmits the wafer box loaded with the wafers to the first bearing mechanism.
In one or more alternative embodiments, before step 203, the discharging method for front-end transmission by the transmission device of the present invention includes:
Step 209: the second transmission mechanism drives the second pushing piece to move towards the direction close to the first pushing piece until the distance between the wafer on the first pushing piece and the wafer on the second pushing piece reaches a first preset value.
Illustratively, the first preset value is the distance between the wafer passing through the second feeding and discharging device and the wafer transported by the first feeding and discharging device, which is required in the wafer transporting process of the process transporting end. In the case that the conveying device of the invention can be used for front-end conveying of a 200mm tank type cleaning machine, the first preset value can be the interval between two adjacent feed inlets or feed placement positions of the cleaning machine.
The distances between two adjacent feeding holes or feeding and discharging positions corresponding to different wafer cleaning machines are different. For this reason, the present embodiment is not limited to a specific size of the first preset value.
Based on the transmission device, the invention also provides semiconductor process equipment. The semiconductor processing equipment comprises the transmission device.
In one or more alternative embodiments, the semiconductor processing apparatus further includes a machine host computer coupled to the controller.
The upper computer of the machine is connected with the controller in an EtherCAT (Ethernet control Automation technology) bus communication mode, so that the upper computer of the machine can quickly and accurately control a servo motor in the transmission device through communication with the controller, and the accuracy of wafer transmission is improved. Optionally, the host computer can be a multiple-function control system, so that the operation Task period can reach 50 microsecond level at the highest speed, further the operation speed is further improved, and more accurate positioning transmission is realized.
In the above embodiment, the control logic of the servo motor is centralized in the host computer of the machine to complete the control test of the transmission device, which is beneficial to improving the reliability of the transmission device.
The foregoing embodiments of the present invention mainly describe differences between the embodiments, and as long as there is no contradiction between different optimization features of the embodiments, the embodiments may be combined to form a better embodiment, and in view of brevity of line text, no further description is provided herein.
The foregoing is merely exemplary of the present invention and is not intended to limit the present invention. Various modifications and variations of the present invention will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the invention are to be included in the scope of the claims of the present invention.
Claims (10)
1. A transmission device is characterized by comprising a first bearing mechanism (100), a second bearing mechanism (200), a third bearing mechanism (500), a first clamping assembly (300), a first transmission mechanism (600) and a first feeding and discharging device (700); the first bearing mechanism (100) and the second bearing mechanism (200) are used for placing a wafer box, and the wafer box is used for accommodating a wafer (400);
the first clamping assembly (300) comprises a movable frame (310), a clamping mechanism (350) and a pushing assembly (320), wherein the pushing assembly (320) is used for pushing out and putting the wafer (400) into the wafer box, and the clamping mechanism (350) is used for clamping the wafer (400) so as to clamp the wafer (400) pushed out by the pushing assembly (320) or place the clamped wafer (400) on the pushing assembly (320); the clamping mechanism (350) and the pushing component (320) are both arranged on the movable frame (310), the movable frame (310) can drive the clamping mechanism (350) and the pushing component (320) to move between a first position and a second position, the third bearing mechanism (500) is connected with the first transmission mechanism (600), the first transmission mechanism (600) can drive the third bearing mechanism (500) to move between a third position and a fourth position,
With the third carrier (500) in the third position and the movable frame (310) in the first position, the pusher assembly (320) is opposite to the first carrier (100), and the pusher assembly (320) can place the wafer (400) into the cassette located on the first carrier (100) or push the wafer (400) out of the cassette located on the first carrier (100), the third carrier (500) is opposite to the pusher assembly (320), and the pusher assembly (320) can place the wafer (400) into the cassette on the third carrier (500) or push the wafer (400) out of the cassette on the third carrier (500);
with the movable rack (310) in the second position, the clamping mechanism (350) is opposite to the second carrying mechanism (200), and the pushing assembly (320) can put the wafer (400) into a wafer box in the second carrying mechanism (200) or push the wafer (400) out of the wafer box in the second carrying mechanism (200);
With the third loading mechanism (500) in the fourth position, the third loading mechanism (500) is opposite to the first feeding and discharging device (700), and the first feeding and discharging device (700) is used for loading the wafer box and placing the wafer box on the third loading mechanism (500) or transferring the wafer box out of the third loading mechanism (500).
2. The transfer device of claim 1, wherein the pusher assembly (320) comprises a first bracket (321), a first pusher (322), a second pusher (323), and a first drive mechanism (324), the first pusher (322) and the second pusher (323) being disposed on the first bracket (321),
-The first pusher (322) is opposite to the first carrier (100) with the third carrier (500) in the third position and the mobile carriage (310) in the first position, the second pusher (323) being opposite to the third carrier (500);
The first driving mechanism (324) is respectively connected with the first bracket (321) and the movable frame (310), and the first driving mechanism (324) is used for driving the first bracket (321) and driving the first pushing piece (322) and the second pushing piece (323) to move towards a direction approaching or far away from the clamping mechanism (350).
3. The conveying device according to claim 2, wherein the pushing assembly (320) further comprises a second conveying mechanism (325), the second conveying mechanism (325) is disposed on the first support (321), the second conveying mechanism (325) is connected to the second pushing member (323), and the second conveying mechanism (325) can drive the second pushing member (323) to move away from or close to the first pushing member (322).
4. A transfer device according to any one of claims 1 to 3, further comprising a rotation mechanism connected to the first carrier mechanism (100), the rotation mechanism being operable to rotate the first carrier mechanism (100) about a first axis parallel to and/or coincident with a diameter of the wafers (400) placed in the cassettes of the first carrier mechanism (100).
5. A transfer device according to any one of claims 1 to 3, wherein the first gripping assembly (300) further comprises a second drive mechanism (330) and a first guide rail (340), the moving carriage (310) is in sliding engagement with the first guide rail (340), the second drive mechanism (330) is connected to the moving carriage (310), and the second drive mechanism (330) is operable to drive the moving carriage (310) along the first guide rail (340).
6. A transfer device according to any one of claims 1 to 3, characterized in that the transfer device further comprises a second feeding and discharging device (800), the second feeding and discharging device (800) being opposite the first carrying means (100), and the second feeding and discharging device (800) being adapted to carry the cassette and to place the cassette in the first carrying means (100) or to transfer the cassette out from the first carrying means (100).
7. A transfer device according to any one of claims 1 to 3, wherein the transfer device further comprises a second gripping assembly (900), the second gripping assembly (900) being used for process end transfer, the direction in which the first gripping assembly (300) grips the wafer (400) being a first direction, the axis direction of the wafer (400) being perpendicular to the first direction in the case where the wafer (400) is located in the first gripping assembly (300);
The direction in which the second clamping assembly (900) clamps the wafer (400) is a second direction, and when the wafer (400) is located in the second clamping assembly (900), the axis direction of the wafer (400) is perpendicular to the second direction, and the second direction is parallel to the first direction.
8. The transfer device of claim 1, further comprising a controller for controlling the first transfer mechanism (600) to move the third carrier mechanism (500) between a third position and a fourth position; -controlling the first gripping assembly (300) to transfer the wafer (400) on the first carrier (100) and/or the third carrier (500) to the second carrier (200).
9. A semiconductor processing apparatus comprising the transfer device of claim 8.
10. The semiconductor processing apparatus of claim 9, further comprising a mainframe computer coupled to the controller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210587775.8A CN114927450B (en) | 2022-05-27 | 2022-05-27 | Transmission device and semiconductor process equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210587775.8A CN114927450B (en) | 2022-05-27 | 2022-05-27 | Transmission device and semiconductor process equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114927450A CN114927450A (en) | 2022-08-19 |
| CN114927450B true CN114927450B (en) | 2024-06-21 |
Family
ID=82811080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210587775.8A Active CN114927450B (en) | 2022-05-27 | 2022-05-27 | Transmission device and semiconductor process equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114927450B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115910906A (en) * | 2022-11-08 | 2023-04-04 | 智程半导体设备科技(昆山)有限公司 | Bearing module and semiconductor cleaning equipment |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113078089A (en) * | 2021-06-07 | 2021-07-06 | 北京北方华创微电子装备有限公司 | Wafer transfer device, semiconductor process equipment and wafer transfer control method |
| CN113745139A (en) * | 2021-05-07 | 2021-12-03 | 上海大族富创得科技有限公司 | Wafer transfer system and method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0831510B2 (en) * | 1988-03-09 | 1996-03-27 | 東京エレクトロン東北株式会社 | Wafer transfer method |
| JP3735224B2 (en) * | 1999-12-03 | 2006-01-18 | シャープ株式会社 | Wafer transfer device |
| KR20070044126A (en) * | 2005-10-24 | 2007-04-27 | 주식회사 케이씨텍 | Wafer array apparatus and method for arraying wafer |
| CN102709223B (en) * | 2011-06-28 | 2015-02-18 | 清华大学 | Push rod type wafer clamping device employing stretching of cotton rope and springs |
| KR200472921Y1 (en) * | 2012-06-01 | 2014-05-30 | 구뎅 프리시젼 인더스트리얼 코포레이션 리미티드 | Apparatus for transporting wafer carrier |
-
2022
- 2022-05-27 CN CN202210587775.8A patent/CN114927450B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113745139A (en) * | 2021-05-07 | 2021-12-03 | 上海大族富创得科技有限公司 | Wafer transfer system and method |
| CN113078089A (en) * | 2021-06-07 | 2021-07-06 | 北京北方华创微电子装备有限公司 | Wafer transfer device, semiconductor process equipment and wafer transfer control method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114927450A (en) | 2022-08-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4775281A (en) | Apparatus and method for loading and unloading wafers | |
| KR102157427B1 (en) | Substrate transfer robot and substrate processing system | |
| CN106628928B (en) | Combined test assembly line | |
| CN107534007B (en) | Substrate transfer robot and substrate processing system | |
| CN103934721B (en) | Flexible transportation and machining system | |
| CN114927450B (en) | Transmission device and semiconductor process equipment | |
| CN213827509U (en) | Automatic laser carving machine | |
| EP3758074A1 (en) | Automated wafer separating equipment for solar cells | |
| CN213278047U (en) | Single wafer carrying device | |
| JP7425880B2 (en) | Workpiece exchange device and method | |
| CN217673573U (en) | Snatch mechanism and article transfer apparatus | |
| CN218769452U (en) | A get piece machine for wafer access | |
| CN203831165U (en) | Flexible transporting and processing system | |
| CN217673574U (en) | Article boxing equipment | |
| KR100866364B1 (en) | Test handler, transfering method of testtray, and manufacturing method of semiconductor using the same | |
| JP4512970B2 (en) | Resistance welding equipment | |
| CN215437193U (en) | Feeding equipment for chip boxes | |
| CN115057049A (en) | Article boxing apparatus and article boxing method | |
| US4917568A (en) | Suction pick-up apparatus for electrical or electronic components | |
| CN217673669U (en) | Carrier, rotating mechanism and conveying equipment | |
| CN217673572U (en) | Article conveying apparatus | |
| CN218867065U (en) | Wafer access library | |
| CN218859815U (en) | Tray conveying and stacking device | |
| CN110860758A (en) | Double-station tin spot welding machine | |
| CN218533502U (en) | Locking machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |