CN114924363A

CN114924363A - Optical transmission component and method for packaging optical transmission component

Info

Publication number: CN114924363A
Application number: CN202210850115.4A
Authority: CN
Inventors: 王志文; 贺亮; 袁家勇; 侯炳泽
Original assignee: Dalian Youxun Technology Co ltd; Wuhan Qianxi Technology Co ltd
Current assignee: Dalian Youxun Technology Co ltd; Wuhan Qianxi Technology Co ltd
Priority date: 2022-07-20
Filing date: 2022-07-20
Publication date: 2022-08-19

Abstract

Embodiments of the present disclosure relate to an optical transmission component and a method for packaging an optical transmission component, the optical transmission component including: a tube holder; the tube cap is arranged on one side of the tube seat and surrounds a cavity with the tube seat, and a light through port is formed in the tube cap; the heat sink is arranged in the cavity, is connected with the tube seat and is used for supporting the laser emitting chip and the first lens; the laser emitting chip is arranged at the focal position of the first lens; the first lens is used for converting laser emitted by the laser emitting chip into first parallel light so as to transmit the first parallel light to an adapter outside the tube cap through the light through port; and an adapter, interfacing with the cap, comprising: a second lens for converging the first parallel light to the optical fiber; and an optical fiber for transmitting the light condensed via the second lens. The distance between the first lens and the laser emission chip can be closer to obtain higher optical coupling efficiency, and the length of the tube cap can be shortened to widen the application range of the optical transmission component.

Description

Optical transmission component and method for packaging optical transmission component

Technical Field

Embodiments of the present disclosure relate generally to the field of optical transmission, and more particularly to an optical transmission component and a method for packaging an optical transmission component.

Background

In conventional light emitting assemblies, a dual lens cap approach is used. In such a dual lens cap solution, two lenses need to be sintered on the cap, resulting in an increase in the size of the cap. For example, the length of a post-package TO pipe cap (i.e., a Transistor CAN) is long, so that the use of the light emitting module is limited. Moreover, a longer cap length means a decrease in light coupling efficiency. In addition, the two lenses are sintered on the tube cap, and the manufacturing process is complex. Moreover, the light emitting performance of the light emitting module can be maintained by ensuring good air tightness at both sintering positions. Once the hermeticity is deteriorated, the performance of the light emitting assembly is seriously affected. Therefore, the conventional dual lens cap solution presents reliability risks.

In summary, the conventional dual-lens cap solution has disadvantages such as large size, low optical coupling efficiency, complex manufacturing process, and poor reliability.

Disclosure of Invention

In view of the above problems, the present disclosure provides an optical transmission component and a method for packaging an optical transmission component, which can reduce the size of a cap and achieve high optical coupling efficiency.

According to a first aspect of the present disclosure, a light transmission assembly is provided. The optical transmission module includes: a tube holder; the tube cap is arranged on one side of the tube seat and surrounds a cavity with the tube seat, and a light through port is formed in the tube cap; the heat sink is arranged in the cavity, is connected with the tube seat and is used for supporting the laser emitting chip and the first lens; the laser emitting chip is arranged at the focal position of the first lens; the first lens is used for converting laser emitted by the laser emitting chip into first parallel light so as to transmit the first parallel light to an adapter outside the tube cap through the light through port; and an adapter, interfacing with the cap, comprising: the second lens is used for converging the first parallel light to the optical fiber; and an optical fiber for transmitting the light condensed via the second lens.

In some embodiments, the optical transmission assembly further comprises: the light splitting prism is arranged in the cavity and used for providing a transmission light path for first parallel light and providing a reflection light path for second parallel light incident through the light through port, the first parallel light is sequentially transmitted to an adapter outside the tube cap through the transmission light path and the light through port, and the second parallel light is transmitted to the photoelectric detector through the light through port and the reflection light path; a third lens for converging the reflected light reflected via the reflected light path to the photodetector; and the photoelectric detector is arranged on the heat sink, is positioned at the focal position of the third lens and is used for detecting the light converged by the third lens.

In some embodiments, the second lens is further configured to convert light from the optical fiber into second parallel light, so that the second parallel light is transmitted to the beam splitting prism through the light transmitting port.

In some embodiments, the beam splitter prism includes a first reflective surface and a second reflective surface arranged in parallel such that the second parallel light is transmitted to the photodetector by reflection from the first reflective surface and the second reflective surface in sequence.

In some embodiments, the heat sink is a silicon-based heat sink, and one side of the active area of the laser emitting chip is attached to the heat sink.

In some embodiments, a groove is provided on the heat sink, a portion of the first lens is embedded in the groove, and is fixed in the embedded position via an adhesive.

In some embodiments, the adapter further comprises a tubular housing, the tubular housing interfacing with the cap, the second lens and the optical fiber being embedded within the tubular housing, the second lens comprising a C-lens.

According to a second aspect of the present disclosure, a method for packaging an optical transmission component is provided. The optical transmission component comprises the optical transmission component of the first aspect of the present disclosure. The method for packaging an optical transmission component comprises the following steps: fixing the laser emission chip on the heat sink so as to acquire a first image about the laser emission chip from the image pickup device at the control device; setting a first lens at a first predetermined position on the heat sink so as to acquire a current second image about the first lens from the image pickup apparatus at the control apparatus; determining whether the current second image satisfies a first predetermined condition; in response to determining that the current second image does not satisfy the first predetermined condition, adjusting the first lens until the current second image satisfies the first predetermined condition; fixing the first lens at the position of the first lens when the current second image meets the first preset condition; aligning the second lens with the light-passing port so as to weld the adapter on the pipe cap; and coupling the second lens with the first lens to weld the cap on the socket.

In some embodiments, adjusting the first lens comprises: determining whether the center of the first lens in the current second image is matched with the active area of the laser emitting chip in the first image; in response to determining that the center of the first lens in the current second image does not match the active area of the laser emitting chip in the first image, determining that the current second image does not satisfy a first predetermined condition; and determining that the current second image satisfies a first predetermined condition in response to determining that the center of the first lens in the current second image matches the active area of the laser emitting chip in the first image.

In some embodiments, coupling the second lens with the first lens comprises: butting the pipe cap with the pipe seat; moving the adapter along a spiral path in a normal plane to the optical axis of the first lens to obtain real-time power of light collected by the optical power meter and converged by the second lens; and determining a position in the spiral path corresponding to the maximum real-time optical power as a position at which the second lens is coupled to the first lens.

In some embodiments, securing the laser emitting chip to the heat sink comprises: one side of the active area of the laser emitting chip is attached to the heat sink.

It should be understood that the statements in this section do not necessarily identify key or critical features of the embodiments of the present disclosure, nor do they limit the scope of the present disclosure. Other features of the present disclosure will become apparent from the following description.

Drawings

The above and other features, advantages and aspects of embodiments of the present disclosure will become more apparent upon consideration of the following detailed description, taken in conjunction with the accompanying drawings. In the drawings, like or similar reference characters designate like or similar elements.

Fig. 1 shows a schematic cross-sectional structure of an optical transmission assembly of an embodiment of the present disclosure.

Fig. 2 illustrates a partial cross-sectional structural schematic of an optical transmission assembly of an embodiment of the present disclosure.

Fig. 3 shows a partial structural schematic diagram of an optical transmission assembly of an embodiment of the present disclosure.

Fig. 4 shows a schematic partial cross-sectional structure of an optical transmission component of an embodiment of the present disclosure.

Fig. 5 shows a schematic partial cross-sectional structure of a transmission optical path of an optical transmission component of an embodiment of the present disclosure.

Fig. 6 shows a partial cross-sectional structural schematic diagram of a receiving optical path of an optical transmission component of an embodiment of the present disclosure.

Fig. 7 shows a schematic diagram of a system for implementing a method of packaging an optical transmission component of an embodiment of the present disclosure.

Fig. 8 shows a flow chart of a method for packaging an optical transmission component of an embodiment of the present disclosure.

Fig. 9 shows a schematic diagram of acquiring a first image of an embodiment of the present disclosure.

Fig. 10 shows a schematic diagram of acquiring a current second image of an embodiment of the present disclosure.

Fig. 11 shows a flowchart of a method for determining whether a current second image satisfies a first predetermined condition of an embodiment of the present disclosure.

Fig. 12 shows a schematic diagram of a current second image of an embodiment of the present disclosure.

Fig. 13 illustrates a flow chart of a method for coupling a second lens with a first lens of an embodiment of the present disclosure.

FIG. 14 schematically illustrates a block diagram of an electronic device suitable for use to implement embodiments of the present disclosure.

Detailed Description

Exemplary embodiments of the present disclosure are described below with reference to the accompanying drawings, in which various details of the embodiments of the disclosure are included to assist understanding, and which are to be considered as merely exemplary. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the embodiments described herein can be made without departing from the scope and spirit of the disclosure. Also, descriptions of well-known functions and constructions are omitted in the following description for clarity and conciseness.

The term "include" and variations thereof as used herein is meant to be inclusive in an open-ended manner, i.e., "including but not limited to". Unless specifically stated otherwise, the term "or" means "and/or". The term "based on" means "based at least in part on". The terms "one example embodiment" and "one embodiment" mean "at least one example embodiment". The term "another embodiment" means "at least one additional embodiment". The terms "first," "second," and the like may refer to different or the same object. Other explicit and implicit definitions are also possible below.

As described above, in the conventional optical transmitter module using the dual-lens cap scheme, the TO cap has a long length, a low optical coupling ratio, a complicated process, and insufficient reliability.

To address, at least in part, one or more of the above problems, and other potential problems, example embodiments of the present disclosure propose an optical transmission assembly scheme. In the scheme of the disclosure, the tube cap and the tube seat surround a cavity, and the first lens and the laser emitting chip are arranged in the cavity, so that the first lens and the laser emitting chip can be closer to each other, and higher optical coupling efficiency can be obtained; accordingly, it is also possible to facilitate shortening the length of the cap so as to make the light transmission assembly more widely usable.

The optical transmission component of the embodiment of the present disclosure is explained in detail below. Fig. 1 shows a schematic cross-sectional structure of an optical transmission assembly 100 of an embodiment of the present disclosure. Fig. 2 shows a schematic partial cross-sectional structure of the light transmission component 100 of an embodiment of the present disclosure. The optical transmission module 100 includes: a header 102, a cap 104, a heat sink 106, a laser emitting chip 108, a first lens 110, and an adapter 112. The cap 104 is disposed on one side of the socket 102, and surrounds a cavity 114 with the socket 102, and the cap 104 is disposed with a light-passing opening 116. The heat sink 106 is disposed in the cavity 114, connected to the stem 102, and used for supporting the laser emitting chip 108 and the first lens 110. The laser emitting chip 108 is disposed at a focal position of the first lens 110. The first lens 110 is used for converting the laser light emitted by the laser emitting chip 108 into first parallel light for transmission to an adapter 112 outside the cap 104 via a light passing port 116. For illustration, the first parallel light is illustrated by arrows in fig. 2 as being transmitted to the outside of the cap 104 through the light-passing port 116. With respect to adapter 112, it interfaces with tube cap 104. The adapter 112 includes at least: a second lens 118, a tubular housing 122, and an optical fiber 120. The second lens 118 is used to focus the first parallel light to the optical fiber 120. As for the optical fiber 120, it is used to transmit the light condensed via the second lens 118.

As for the first lens 110, it is, for example, a collimating lens. The distance between the first lens 110 and the laser emitting chip 108 may be, for example, less than a predetermined distance threshold in order to improve optical coupling efficiency and facilitate reducing the length of the cap 104.

In some embodiments, the adapter 112 further includes, for example, a tubular housing 122, the tubular housing 122 interfacing with the vial cap 104, the second lens 118 and the optical fiber 114 being embedded within the tubular housing 122. The second lens 118 is, for example, a converging lens. In some embodiments, second lens 118 is a C-lens (C-lens) such that second lens 118 has a longer length to fit stably within tubular housing 122 and couple well with optical fiber 114. Moreover, the second lens 118 is embedded in the tubular housing 122 after being coupled with the optical fiber 114 to form a fixed connection, so that the second lens 118, the optical fiber 114 and the tubular housing 122 can be moved integrally in the process of coupling the second lens 118 with the first lens 110, and the coupling relationship between the second lens 118 and the optical fiber 114 does not need to be adjusted again.

In some embodiments, the optical transmission component 100, for example, further includes a polarizer 124, the polarizer 124 disposed between the second lens 118 and the first lens 110.

In the above scheme, the first lens and the laser emitting chip are arranged in the cavity surrounded by the tube cap and the tube seat, so that the first lens and the laser emitting chip can be closer to each other, and higher optical coupling efficiency can be obtained; accordingly, the length of the pipe cap can be shortened conveniently, so that the application range of the optical transmission assembly is wider.

Fig. 3 shows a partial structural schematic diagram of an optical transmission assembly 300 of an embodiment of the present disclosure. In some embodiments, heat sink 106 is, for example, a silicon-based heat sink having recesses 136 (e.g., including, but not limited to, V-shaped grooves) disposed at predetermined locations of the silicon-based heat sink. A part of the first lens 110 is embedded in the groove 136 and fixed at the embedded position via an adhesive. The adhesive comprises, for example, glue. It should be understood that, on the one hand, the silicon-based heat sink has extremely high processing precision, and therefore, the groove 136 is arranged at a predetermined position of the silicon-based heat sink, and the position precision of the groove 136 is extremely high, so that the first lens 110 is arranged at a position corresponding to the groove 136, that is, the first lens 110 can be accurately mounted. The passive mounting mode can omit the active mounting (for example, the mounting mode of acquiring the light spot) process, and the packaging efficiency is improved. On the other hand, the groove 136, in addition to accommodating a part of the first lens 110, also has a certain reserved space, which can accommodate an adhesive for fixing the first lens 110, and provide a space for the adhesive to expand when heated, so as to effectively avoid that the adhesive forms pressure on the first lens 110 during the expansion when heated, which causes the displacement of the first lens 110, and affects the precision of the optical transmission assembly.

In some embodiments, the active area side of the laser emitting chip 108 is attached to the heat sink 106. The heat sink 106 may comprise, for example, a silicon-based heat sink to which the active region (i.e., light emitting region) side of the laser emitting chip 108 is attached. It is to be understood that the active region side of the laser emitting chip 108 generates heat during the laser emitting chip 108 emits laser light. One side of the active area of the laser emitting chip 108 is attached to the silicon-based heat sink, which is obviously beneficial to heat dissipation of the laser emitting chip 108, so as to help to prolong the service life of the laser emitting chip 108. On the other hand, due to the thermal stability of the silicon-based heat sink, the size of the silicon-based heat sink is hardly affected by temperature changes, so that the laser emitting chip 108 can be ensured to be at a stable height, and the accuracy of emitted laser can be ensured.

Fig. 4 illustrates a partial cross-sectional structural schematic view of a light delivery assembly 400 of an embodiment of the present disclosure, wherein the cap 104 is illustrated in a transparent state for ease of illustration. Fig. 5 shows a partial cross-sectional structural view of a transmission light path of the optical transmission component 400 of the embodiment of the present disclosure, in which the first parallel light L1 is indicated by a dashed arrow. Fig. 6 shows a partial cross-sectional structural diagram of a receiving optical path of the optical transmission component 400 according to the embodiment of the disclosure, in which the second parallel light L2 is indicated by a dashed arrow. For convenience of explanation, the cap is omitted from fig. 5 and 6 and is not shown. The optical transmission module 400 further includes, for example: a beam splitting prism 402, a third lens 404, and a photodetector 406. Based on the corresponding viewing angles of fig. 5 and 6, the photodetector 406 is blocked, and therefore the photodetector 406 is illustrated by a dotted line in fig. 5 and 6. Regarding the light splitting prism 402, it is disposed in the cavity 114 for providing a transmission light path for the first parallel light L1 and a reflection light path for the second parallel light L2 incident via the light passing port 116. The first parallel light L1 is emitted to the adapter 112 (not shown in fig. 4-6) outside the cap 104 via the transmission light path and the light admission port 116 in turn. The second parallel light L2 is transmitted to the photodetector 406 via the light transmitting port 116 and the reflected light path. The third lens 404 is used to focus the reflected light reflected via the reflected light path to the photodetector 406. And a photodetector 406 disposed on the heat sink 106 at a focal point of the third lens 404 for detecting the light condensed by the third lens 404.

The splitting prism 402 provides, for example, a transmission optical path so that, in the sending mode of the optical transmission assembly 400, the first parallel light L1 is emitted to the adapter 112 outside the cap in turn via the transmission line and the light admission port 116.

The beam splitting prism 402 also provides a reflected light path, for example. For example, the second lens 118 is also used to convert the light from the optical fiber into second parallel light L2, so that the second parallel light L2 is transmitted to the beam splitting prism 402 via the light transmitting port 116. The beam splitting prism 402 includes, for example, a first reflecting surface 408 and a second reflecting surface 410 arranged in parallel so that the second parallel light L2 is transmitted toward the photodetector 406 by reflection from the first reflecting surface 408 and the second reflecting surface 410 in turn. It should be understood that the second parallel light L2 is collected to the photodetector 406 via the third lens 404 after being reflected by the first reflecting surface 408 and the second reflecting surface 410 in sequence.

In the above scheme, through reasonable setting beam splitting prism and third lens, the space that make full use of pipe cap and tube socket surround for under less pipe cap size, this optical transmission subassembly can realize sending and receiving two-way optical signal transmission.

A method for packaging an optical transmission component according to an embodiment of the present disclosure is described below with reference to fig. 7 to 13, and the method may be used for packaging the

optical transmission component

100, 300, or 400, for example. Fig. 7 illustrates a schematic diagram of a system 700 for implementing a method of packaging an optical transmission component of an embodiment of the present disclosure. The system 700 includes: a control apparatus 710, an image pickup apparatus 720, and an optical power meter 730. Fig. 8 shows a flow diagram of a method 800 for packaging an optical transmission component of an embodiment of the present disclosure. It should be understood that method 800 may also include additional steps not shown and/or may omit steps shown, as the scope of the present disclosure is not limited in this respect.

At step 802, a laser emitting chip is secured to a heat sink to acquire a first image from an image capture device about the laser emitting chip at a control device.

In some embodiments, securing the laser emitting chip to the heat sink comprises: one side of the active area of the laser emission chip is attached to the heat sink. It is to be understood that the active region side of the laser emitting chip 108 generates heat during the laser emitting chip 108 emits laser light. One side of the active area of the laser emitting chip 108 is attached to the silicon-based heat sink, which is obviously beneficial to heat dissipation of the laser emitting chip 108, so as to prolong the service life of the laser emitting chip 108.

Fig. 9 shows a schematic diagram of acquiring a first image of an embodiment of the present disclosure. For example, referring to fig. 9, the laser emitting chip 108 is fixed to a target position on the heat sink 106. Then, the image pickup device 720 is controlled by the control device 710 to photograph toward the laser emitting chip 108 in the direction of laser emission of the laser emitting chip 108 to capture a first image about the laser emitting chip 108. For convenience of explanation, fig. 9 shows directions of shooting by the image pickup apparatus 720 with arrows.

At step 804, the first lens is set to a first predetermined position on the heat sink so as to acquire a current second image from the image capture device with respect to the first lens at the control device.

Fig. 10 shows a schematic diagram of acquiring a current second image of an embodiment of the present disclosure. For example, referring to fig. 10, a first lens 110 is disposed at a first predetermined location on the heat sink 106. Then, the image pickup device 720 is controlled by the control device 710 to photograph toward the first lens 110 in the direction of laser emission of the laser emission chip 108 to capture a current second image with respect to the first lens 110. For convenience of explanation, fig. 10 shows directions of shooting by the image pickup apparatus 720 with arrows. It is understood that the first predetermined position is an initial position of the first lens 110, and may not be an accurate target position of the first lens 110, to be adjusted. To improve efficiency, the first predetermined position may be an estimated position close to the target position.

At step 806, it is determined whether the current second image satisfies a first predetermined condition. The method 1100 for determining whether the current second image satisfies the first predetermined condition will be described in detail later with reference to fig. 11, and will not be described again here.

At step 808, if the control apparatus determines that the current second image does not satisfy the first predetermined condition, the control apparatus adjusts the first lens until the current second image satisfies the first predetermined condition.

In some embodiments, the control device 710 comprises, for example, a six-axis displacement adjustment mechanism, and the control device 710 drives the six-axis displacement adjustment mechanism to adjust the position of the first lens 110.

At step 810, the control device stops adjusting the first lens if the control device determines that the current second image satisfies the first predetermined condition.

At step 812, the first lens is fixed at a position where the first lens is located when the current second image satisfies the first predetermined condition.

At step 814, the second lens is aligned with the light admission port to solder the adapter to the cap.

At step 816, a second lens is coupled to the first lens to solder the cap onto the socket. The method 1300 for coupling the second lens with the first lens will be described in detail later with reference to fig. 13, and will not be described again here.

In some embodiments, for the optical transmission assembly 400, the beam splitting prism 402, the third lens 404, and the photodetector 406 are also fixed at the corresponding target locations prior to soldering the cap onto the header. For example, positioning marks are provided on the heat sink 106 to fix the beam splitting prism 402, the third lens 404 and the photodetector 406 to the corresponding target positions according to the corresponding positioning marks.

FIG. 11 shows a flowchart of a method 1100 for determining whether a current second image satisfies a first predetermined condition of an embodiment of the present disclosure. It should be understood that method 1100 may also include additional steps not shown and/or may omit steps shown, as the scope of the present disclosure is not limited in this respect.

At step 1102, it is determined whether the center of the first lens in the current second image matches the active area of the laser emitting chip in the first image.

At step 1104, if the control apparatus determines that the center of the first lens in the current second image does not match the active area of the laser emitting chip in the first image, the control apparatus determines that the current second image does not satisfy a first predetermined condition.

At step 1106, if the control device determines that the center of the first lens in the current second image matches the active area of the laser emitting chip in the first image, the control device determines that the current second image satisfies a first predetermined condition.

Fig. 12 shows a schematic diagram of a current second image 1200 of an embodiment of the present disclosure. For convenience of illustration, the corresponding position of the active region 128 of the laser emitting chip 108 in the first image is indicated by a dotted line in fig. 12. As an illustration, other portions of the optical transmission assembly, where the second image 1200 may appear, are not shown in fig. 12. It should be appreciated that to reduce the complexity of image recognition and matching, in some embodiments, the camera 720 captures the first image and the current second image at the same location so that the first image and the current second image correspond to the same capture range. For example, the control device 710 identifies the active region 128 of the laser emitting chip 108 in the first image according to an image identification algorithm and determines first position information (e.g., coordinate information) of the active region 128 in the first image. Accordingly, the control device 710 identifies the center 130 of the first lens 110 in the current second image 1200 according to an image identification algorithm and determines second position information of the center 130 of the first lens 110 in the second image. The control device 710 determines whether the center 130 of the first lens 110 in the current second image 1200 matches the active region 128 of the laser emitting chip 108 in the first image, based on the first position information and the second position information. In some embodiments, the control device 710 determines a direction and a distance in which the center 130 of the first lens 110 in the current second image 1200 is offset with respect to the active region 128 of the laser emitting chip 108 in the first image based on the first position information and the second position information, so as to generate a control signal for adjusting the displacement of the first lens 110, the control signal for example indicating the direction and the distance for adjusting the displacement of the first lens 110.

In the scheme, the first lens is adjusted in an image recognition and matching mode, so that the first lens is matched with the laser emitting chip in position, the accuracy adjustment is high, and the offset direction and the offset distance of the first lens compared with the laser emitting chip can be determined quickly, so that the quick and efficient adjustment is realized.

In some embodiments, a distance between the first lens and the laser emission chip may be determined according to a focal length of the first lens in order to mount the laser emission chip.

Fig. 13 shows a flow diagram of a method 1300 for coupling a second lens with a first lens of an embodiment of the present disclosure.

At step 1302, a tube cap is docked with a tube socket. It will be appreciated that when the cap is initially mated with the socket, the second lens may not be precisely coupled to the first lens and may need to be adjusted.

At step 1304, the adapter is moved along a spiral path in a plane normal to the optical axis of the first lens to obtain real-time power of the light collected by the optical power meter and focused via the second lens. It should be appreciated that the optical power meter 1330 is stationary during movement of the converging lens.

At step 1306, the location in the spiral path corresponding to the maximum real-time optical power is determined as the location where the second lens is coupled to the first lens. It will be appreciated that the position in the spiral path corresponding to the maximum real-time optical power is the optimum position for coupling the second lens to the first lens.

In the above solution, the adapter is moved along the spiral path (i.e. the second lens is moved accordingly), on one hand, the movement paths can be prevented from being staggered and repeated, which is convenient to save time and improve the efficiency of coupling the second lens with the first lens; in another aspect. It is possible to facilitate traversal with maximum probability of all selectable positions around the position where the coupling of the second lens with the first lens is achieved. Therefore, based on the scheme, the coupling position of the second lens and the first lens can be determined quickly and accurately, and the packaging efficiency and accuracy are improved.

The installation manner of other components of the optical transmission assembly according to the embodiment of the present disclosure is not described herein again.

FIG. 14 schematically illustrates a block diagram of an electronic device 1400 suitable for use to implement embodiments of the present disclosure. The electronic device 1400 may be used to perform the

methods

800, 1100, 1300 illustrated in fig. 8, 11, 13. As shown in fig. 14, the electronic device 1400 includes a central processing unit (i.e., CPU 1401) that can perform various appropriate actions and processes in accordance with computer program instructions stored in a read-only memory (i.e., ROM 1402) or loaded from a storage unit 1408 into a random access memory (i.e., RAM 1403). In the RAM 1403, various programs and data necessary for the operation of the electronic device 1400 can also be stored. The CPU 1401, ROM 1402, and RAM 1403 are connected to each other via a bus 1404. An input/output interface (i.e., I/O interface 1405) is also connected to bus 1404.

A number of components in the electronic device 1400 are connected to the I/O interface 1405, including: an input unit 1406, an output unit 1407, a storage unit 1408, and the CPU 1401 executes the respective methods and processes described above, for example, the

methods

800, 1100, and 1300. For example, in some embodiments, the

methods

800, 1100, 1300 may be implemented as a computer software program stored on a machine-readable medium, such as the storage unit 1408. In some embodiments, part or all of the computer program can be loaded and/or installed onto the electronic device 1400 via the ROM 1402 and/or the communication unit 1409. When the computer programs are loaded into RAM 1403 and executed by the CPU 1401, one or more of the operations of the

methods

800, 1100, 1300 described above may be performed. Alternatively, in other embodiments, the CPU 1401 may be configured by any other suitable means (e.g. by means of firmware) to perform one or more of the acts of the

methods

800, 1100, 1300.

It is further noted that the present disclosure may be methods, apparatus, systems and/or computer program products. The computer program product may include a computer-readable storage medium having computer-readable program instructions embodied thereon for carrying out various aspects of the present disclosure.

The computer readable storage medium may be a tangible device that can hold and store the instructions for use by the instruction execution device. The computer readable storage medium may be, for example, but not limited to, an electronic memory device, a magnetic memory device, an optical memory device, an electromagnetic memory device, a semiconductor memory device, or any suitable combination of the foregoing. More specific examples (a non-exhaustive list) of the computer readable storage medium would include the following: a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a Static Random Access Memory (SRAM), a portable compact disc read-only memory (CD-ROM), a Digital Versatile Disc (DVD), a memory stick, a floppy disk, a mechanical encoding device, such as punch cards or in-groove raised structures having instructions stored thereon, and any suitable combination of the foregoing. Computer-readable storage media as used herein is not to be construed as transitory signals per se, such as radio waves or other freely propagating electromagnetic waves, electromagnetic waves propagating through a waveguide or other transmission medium (e.g., optical pulses through a fiber optic cable), or electrical signals transmitted through electrical wires.

The computer-readable program instructions described herein may be downloaded from a computer-readable storage medium to a respective computing/processing device, or to an external computer or external storage device via a network, such as the internet, a local area network, a wide area network, and/or a wireless network. The network may include copper transmission cables, fiber optic transmission, wireless transmission, routers, firewalls, switches, gateway computers and/or edge servers. The network adapter card or network interface in each computing/processing device receives computer-readable program instructions from the network and forwards the computer-readable program instructions for storage in a computer-readable storage medium in the respective computing/processing device.

Computer program instructions for carrying out operations of the present disclosure may be assembler instructions, Instruction Set Architecture (ISA) instructions, machine-related instructions, microcode, firmware instructions, state setting data, or source or object code written in any combination of one or more programming languages, including an object oriented programming language such as Smalltalk, C + + or the like and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The computer readable program instructions may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the latter scenario, the remote computer may be connected to the user's computer through any type of network, including a Local Area Network (LAN) or a Wide Area Network (WAN), or the connection may be made to an external computer (for example, through the Internet using an Internet service provider). In some embodiments, the electronic circuitry that can execute the computer-readable program instructions implements aspects of the present disclosure by utilizing the state information of the computer-readable program instructions to personalize the electronic circuitry, such as a programmable logic circuit, a Field Programmable Gate Array (FPGA), or a Programmable Logic Array (PLA).

Various aspects of the present disclosure are described herein with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the disclosure. It will be understood that each block of the flowchart illustrations and/or block diagrams, and combinations of blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer readable program instructions.

These computer-readable program instructions may be provided to a processor in a voice interaction device, a processing unit of a general purpose computer, special purpose computer, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processing unit of the computer or other programmable data processing apparatus, create means for implementing the functions/acts specified in the flowchart and/or block diagram block or blocks. These computer-readable program instructions may also be stored in a computer-readable storage medium that can direct a computer, programmable data processing apparatus, and/or other devices to function in a particular manner, such that the computer-readable medium storing the instructions comprises an article of manufacture including instructions which implement the function/act specified in the flowchart and/or block diagram block or blocks.

The computer readable program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other devices to cause a series of operational steps to be performed on the computer, other programmable apparatus or other devices to produce a computer implemented process such that the instructions which execute on the computer, other programmable apparatus or other devices implement the functions/acts specified in the flowchart and/or block diagram block or blocks.

The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of apparatus, methods and computer program products according to various embodiments of the present disclosure. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of instructions, which comprises one or more executable instructions for implementing the specified logical function(s). In some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.

Having described embodiments of the present disclosure, the foregoing description is intended to be exemplary, not exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein was chosen in order to best explain the principles of the embodiments, the practical application, or technical improvements to the market, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.

The above are merely alternative embodiments of the present disclosure and are not intended to limit the present disclosure, which may be modified and varied by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure should be included in the protection scope of the present disclosure.

Claims

1. An optical transmission assembly, comprising:

a tube holder;

the tube cap is arranged on one side of the tube seat and surrounds a cavity with the tube seat, and a light through port is formed in the tube cap;

the heat sink is arranged in the cavity, is connected with the tube seat and is used for supporting the laser emitting chip and the first lens;

the laser emitting chip is arranged at the focal position of the first lens;

the first lens is used for converting laser emitted by the laser emitting chip into first parallel light so as to transmit the first parallel light to an adapter outside the tube cap through the light through port; and

an adapter, interfaced with the cap, comprising:

a second lens for converging the first parallel light to the optical fiber; and

and an optical fiber for transmitting the light condensed via the second lens.

2. The optical transmission assembly of claim 1, further comprising:

the light splitting prism is arranged in the cavity and used for providing a transmission light path for first parallel light and providing a reflection light path for second parallel light incident through the light through port, the first parallel light is sequentially emitted to an adapter outside the tube cap through the transmission light path and the light through port, and the second parallel light is transmitted to the photoelectric detector through the light through port and the reflection light path;

a third lens for condensing the reflected light reflected via the reflected light path to the photodetector; and

and the photoelectric detector is arranged on the heat sink, is positioned at the focal point of the third lens and is used for detecting the light converged by the third lens.

3. The light transmission assembly according to claim 2, wherein the second lens is further configured to convert light from the optical fiber into second parallel light, such that the second parallel light is transmitted to the beam splitting prism via the light transmitting port.

4. The light transmission assembly according to claim 2, wherein the beam splitter prism includes a first reflective surface and a second reflective surface arranged in parallel such that the second parallel light is transmitted to the photodetector by reflection from the first reflective surface and the second reflective surface in sequence.

5. The optical transmission assembly of claim 1, wherein the heat sink is a silicon-based heat sink, and the active area side of the laser emitting chip is attached to the heat sink.

6. The light delivery assembly of claim 5, wherein the heat sink is provided with a groove, and a portion of the first lens is embedded in the groove and secured in the embedded position via an adhesive.

7. The optical transmission assembly of claim 1, wherein the adapter further comprises a tubular housing, the tubular housing interfacing with the cap, the second lens and the optical fiber being embedded within the tubular housing, the second lens comprising a C-lens.

8. A method for packaging an optical transmission assembly, wherein the optical transmission assembly comprises an optical transmission assembly according to any one of claims 1 to 7, the method comprising:

fixing the laser emission chip on the heat sink so as to acquire a first image about the laser emission chip from the image pickup apparatus at the control apparatus;

setting a first lens at a first predetermined position on the heat sink so as to acquire a current second image about the first lens from the image pickup apparatus at the control apparatus;

determining whether the current second image satisfies a first predetermined condition;

in response to determining that the current second image does not satisfy the first predetermined condition, adjusting the first lens until the current second image satisfies the first predetermined condition;

fixing the first lens at the position of the first lens when the current second image meets the first preset condition;

aligning the second lens with the light-passing port so as to weld the adapter on the pipe cap; and

the second lens is coupled to the first lens to weld the cap to the socket.

9. The method of claim 8, wherein determining whether the current second image satisfies the first predetermined condition comprises:

determining whether the center of the first lens in the current second image is matched with the active area of the laser emitting chip in the first image;

in response to determining that the center of the first lens in the current second image does not match the active area of the laser emitting chip in the first image, determining that the current second image does not satisfy a first predetermined condition; and

in response to determining that the center of the first lens in the current second image matches the active area of the laser emitting chip in the first image, determining that the current second image satisfies a first predetermined condition.

10. The method of claim 8, wherein coupling the second lens to the first lens comprises:

butting the pipe cap with the pipe seat;

moving the adapter along a spiral path in a normal plane to the optical axis of the first lens to obtain real-time power of light collected by the optical power meter and converged by the second lens; and

the position in the spiral path corresponding to the maximum real-time optical power is determined as the position where the second lens is coupled to the first lens.

11. The method of claim 8, wherein securing the laser emitting chip to the heat sink comprises:

one side of the active area of the laser emission chip is attached to the heat sink.