CN114914351A - Lead frame structure and manufacturing method thereof - Google Patents
Lead frame structure and manufacturing method thereof Download PDFInfo
- Publication number
- CN114914351A CN114914351A CN202110184289.7A CN202110184289A CN114914351A CN 114914351 A CN114914351 A CN 114914351A CN 202110184289 A CN202110184289 A CN 202110184289A CN 114914351 A CN114914351 A CN 114914351A
- Authority
- CN
- China
- Prior art keywords
- conductive portion
- conductive
- extending
- leadframe structure
- extension
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 9
- 238000005530 etching Methods 0.000 claims description 3
- 230000007547 defect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000012858 packaging process Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000007689 inspection Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The present disclosure relates to a leadframe structure and a method for manufacturing the same. The lead frame structure comprises a bottom plate and a retaining wall. The bottom plate is provided with a first conductive part and a second conductive part. The first conductive portion is separated from the second conductive portion. The first conductive part and the second conductive part are configured to be electrically connected with the light source. The retaining wall is positioned on the bottom plate and surrounds an opening. The first conductive part and the second conductive part are exposed from the opening. The first conductive part and the second conductive part are respectively provided with an extending part. The extension part extends along the horizontal direction and exceeds the outer surface of the retaining wall. Therefore, after the bonding layer is coated below the lead frame structure and bonded with the circuit board, the extruded bonding layer can overflow from the extension part, so that the bonding layer is easy to observe.
Description
Technical Field
The present disclosure relates to a leadframe structure and a method for manufacturing the leadframe structure.
Background
Generally, a leadframe structure for a Light Emitting Diode (LED) may include an electrode and a dam over the electrode. When the LED is disposed on the electrode, the retaining wall may surround the LED. The retaining wall may be formed from an epoxy resin. In manufacturing the lead frame structure, due to the horizontal cutting and the vertical cutting, the side surface of the electrode of the lead frame structure is generally flush with the side surface of the epoxy resin above the electrode, so that the outer side surface of the lead frame structure is a plane. In addition, when the lead frame structure and the circuit board are assembled, the bonding layer is coated under the lead frame structure. The jointing layer is positioned between the lead frame structure and the circuit board so as to stabilize the lead frame structure on the circuit board. However, when the bonding layer is sandwiched between the lead frame structure and the circuit board, the inspection personnel cannot visually observe the bonding layer under the lead frame structure, so that the inspection personnel cannot know whether the bonding layer is uniformly coated between the lead frame structure and the circuit board, which causes defects of the lead frame structure during packaging application, and reduces the yield of products of the lead frame structure.
Disclosure of Invention
One aspect of the present disclosure is a leadframe structure.
According to an embodiment of the present disclosure, a leadframe structure includes a bottom plate and a retaining wall. The bottom plate is provided with a first conductive part and a second conductive part. The first conductive portion is separated from the second conductive portion. The first conductive part and the second conductive part are configured to be electrically connected with the light source. The retaining wall is positioned on the bottom plate and surrounds an opening. The first conductive part and the second conductive part are exposed from the opening. The first conductive part and the second conductive part are respectively provided with an extending part. The extension portion extends in the horizontal direction beyond the outer surface of the retaining wall.
In one embodiment of the present disclosure, the bottom plate has an insulating portion. The insulating part is positioned between the first conductive part and the second conductive part.
In an embodiment of the present disclosure, the extending portion of the first conductive portion and the extending portion of the second conductive portion each have an outer side surface away from the retaining wall, and two outer side surfaces of the two extending portions each have a concave portion.
In an embodiment of the present disclosure, the extending portion of the first conductive portion and the extending portion of the second conductive portion each have an outer side surface away from the retaining wall, and two outer side surfaces of the two extending portions each have a convex portion.
In an embodiment of the present disclosure, the extending portion of the first conductive portion and the extending portion of the second conductive portion each have an outer side surface away from the retaining wall, and both outer side surfaces of the two extending portions are entirely flat.
In an embodiment of the present disclosure, the bottom surface of the extending portion of the first conductive portion and the bottom surface of the extending portion of the second conductive portion are disposed to coat the bonding layer.
In an embodiment of the present disclosure, a bottom surface of the extending portion of the first conductive portion and a bottom surface of the extending portion of the second conductive portion each have a recess.
In an embodiment of the present disclosure, the concave portion of the bottom surface of the extending portion of the first conductive portion and the concave portion of the bottom surface of the extending portion of the second conductive portion are disposed to be coated with the bonding layer.
In an embodiment of the present disclosure, the bottom plate further has a third conductive portion. The insulating portion extends to between the second conductive portion and the third conductive portion. The third conductive portion has an extension portion. The extension part of the third conductive part extends along the horizontal direction and exceeds the outer surface of the retaining wall.
In an embodiment of the present disclosure, the bottom plate further has a fourth conductive portion. The insulating part extends to the position between the first conductive part and the fourth conductive part. The fourth conductive portion has an extension portion. The extending part of the fourth conducting part extends along the horizontal direction and exceeds the outer surface of the retaining wall.
One aspect of the present disclosure is a method of fabricating a leadframe structure.
According to an embodiment of the present disclosure, a method for manufacturing a leadframe structure includes: forming a bottom plate having a first conductive portion and a second conductive portion, wherein the first conductive portion is separated from the second conductive portion, and the first conductive portion and the second conductive portion each have an extension portion; and forming a retaining wall on the bottom plate by using a mold for shielding the two extending parts, so that the extending parts extend along the horizontal direction and exceed the outer surface of the retaining wall, wherein the retaining wall surrounds an opening, and the first conductive part and the second conductive part are exposed from the opening.
In an embodiment of the present disclosure, the method further includes: the bottom surface of the extension portion of the first conductive portion and the bottom surface of the extension portion of the second conductive portion are etched to form a recess in each of the bottom surface of the extension portion of the first conductive portion and the bottom surface of the extension portion of the second conductive portion.
In the above-mentioned embodiments of the present disclosure, since the first conductive portion and the second conductive portion of the leadframe structure have the extending portions, and the extending portions of the first conductive portion and the second conductive portion extend along the horizontal direction to exceed the outer surfaces of the retaining walls above the extending portions, when the bonding layer is coated below the leadframe structure and bonded to the circuit board, the compressed bonding layer may overflow from the extending portions, so that the bonding layer is easy to observe. Therefore, a detection person can ensure that the bonding layer is uniformly filled below the lead frame structure by observing the bonding layer positioned on the extension part, so that the defects of the lead frame structure are reduced, the yield of products of the lead frame structure is improved, and the lead frame structure can be applied to subsequent packaging processes.
Drawings
An embodiment of the disclosure is best understood from the following detailed description when read with the accompanying drawings. It is emphasized that, in accordance with the standard practice in the industry, various features are not drawn to scale and are used for illustrative purposes only. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.
Fig. 1 is a perspective view illustrating a lead frame structure according to an embodiment of the present disclosure;
fig. 2 is a bottom view of the lead frame structure of fig. 1;
FIG. 3 is a top view of the leadframe structure of FIG. 1 coated with a bonding layer and bonded to a circuit board;
fig. 4 is a bottom view of a leadframe structure according to another embodiment of the present disclosure;
fig. 5 is a top view of a leadframe structure according to another embodiment of the disclosure;
fig. 6 is a top view of a leadframe structure according to another embodiment of the present disclosure;
fig. 7 is a top view of a leadframe structure according to another embodiment of the present disclosure;
fig. 8 is a top view of a leadframe structure according to another embodiment of the present disclosure;
fig. 9 is a flowchart illustrating a method of manufacturing a leadframe structure according to an embodiment of the present disclosure.
[ notation ] to show
100,100a,100b,100c,100d,100e leadframe structure
110: bottom plate
112 first conductive part
113 third conductive part
114 second conductive part
115 fourth conductive part
116 insulating part
117 bottom surface
117a concave part
118 an extension part
119 lateral surface of
119a concave part
119b convex part
120 retaining wall
122 opening (c)
124 outer surface
130 light source
140 bonding layer
200 circuit board
D1 horizontal direction
Detailed Description
The following disclosure of embodiments provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these examples are merely examples and are not intended to be limiting. Further, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
Spatially relative terms such as "below … …," "below … …," "lower," "above … …," "upper," and the like may be used herein for ease of description to describe one element or feature's relationship to another element or feature as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
Fig. 1 is a perspective view illustrating a lead frame structure 100 according to an embodiment of the present disclosure. Referring to fig. 1, a leadframe structure 100 includes a bottom plate 110 and a dam 120. The bottom plate 110 of the leadframe structure 100 has a first conductive portion 112 and a second conductive portion 114. The first conductive portion 112 of the bottom plate 110 is separated from the second conductive portion 114. The first conductive portion 112 and the second conductive portion 114 of the bottom plate 110 are disposed to electrically connect the light source 130. For example, the light source 130 may be a light emitting diode, and the bottom surface (e.g., positive electrode) thereof is electrically connected to the first conductive portion 112, and the top surface (e.g., negative electrode) thereof is electrically connected to the second conductive portion 114 by a conductive wire. The retaining wall 120 of the leadframe structure 100 is located on the bottom plate 110, and the retaining wall 120 surrounds an opening 122. The opening 122 of the wall 120 surrounds the light source 130 and may be used for shading or reflecting purposes. The first conductive portion 112 and the second conductive portion 114 of the base plate 110 are exposed from the opening 122 of the retaining wall 120. The first conductive portion 112 and the second conductive portion 114 of the bottom plate 110 have an extending portion 118. The extending portions 118 of the first conductive portions 112 and the second conductive portions 114 extend along the horizontal direction D1 and exceed the outer surfaces 124 of the retaining walls 120. In some embodiments, the material of the retaining wall 120 of the leadframe structure 100 may include epoxy resin, and may be formed by molding.
In some embodiments, the extending portions 118 of the first conductive portion 112 and the second conductive portion 114 have outer side surfaces 119 away from the retaining wall 120. The outer surfaces 119 of the extending portions 118 of the first conductive portion 112 and the second conductive portion 114 have recesses 119 a. For example, the recess 119a of the extension 118 may be located at the middle of the outer side surface 119 of the extension 118. In addition, the bottom plate 110 of the leadframe structure 100 has an insulating portion 116. The insulating portion 116 of the bottom plate 110 is located between the first conductive portion 112 and the second conductive portion 114 of the bottom plate 110 to separate the first conductive portion 112 and the second conductive portion 114, so as to avoid short circuit. Also, the insulating portion 116 of the base plate 110 is exposed from an opening 122 surrounded by the retaining wall 120.
Fig. 2 is a bottom view of the leadframe structure 100 of fig. 1. Fig. 3 is a top view of the leadframe structure 100 of fig. 1 coated with a bonding layer 140 and bonded to a circuit board 200. Referring to both fig. 2 and 3, in some embodiments, the bottom surfaces 117 of the extensions 118 of the first and second conductive portions 112, 114 may be coated with a bonding layer 140. For example, the bonding layer 140 may be a solder paste, but is not limited thereto. When the leadframe structure 100 is coated with the bonding layer 140 and bonded to the circuit board 200, the bonding layer 140 secures the leadframe structure 100 on the circuit board 200, and also allows the first conductive portion 112 and the second conductive portion 114 of the leadframe structure 100 to be electrically connected to the circuit board 200.
Specifically, since the first conductive portion 112 and the second conductive portion 114 of the lead frame structure 100 have the extending portion 118, and the extending portion 118 of the first conductive portion 112 and the second conductive portion 114 extends along the horizontal direction D1 to exceed the outer surface 124 of the retaining wall 120 above the extending portion, after the bonding layer 140 is coated under the lead frame structure 100 and bonded to the circuit board 200, the compressed bonding layer 140 may overflow from the recess 119a of the extending portion 118, so that the bonding layer 140 is easy to observe. In this way, a tester can observe the bonding layer 140 located on the extension portion 118 to ensure that the bonding layer 140 has been uniformly filled under the leadframe structure 100, so as to reduce defects of the leadframe structure 100 and improve the yield of the leadframe structure 100, so that the leadframe structure 100 can be applied to subsequent packaging processes.
It should be understood that the connection and function of the elements described above will not be repeated and will not be described in detail. In the following description, other forms of the extension will be described.
Fig. 4 is a bottom view of a leadframe structure 100a according to another embodiment of the present disclosure. The leadframe structure 100a includes a bottom plate 110 and a dam 120. The bottom plate 110 of the leadframe structure 100a has a first conductive portion 112 and a second conductive portion 114. The difference from the embodiment of fig. 2 is that the bottom surface 117 of the extension portion 118 of the first conductive portion 112 and the second conductive portion 114 has a recess 117a in addition to the recess 119a on the outer surface 119 of the extension portion 118. In some embodiments, the depth of the recess 117a in the horizontal direction D1 is deeper than the recess 119 a. That is, the recess 117a is closer to the insulating portion 116 than the recess 119 a. The recess 117a on the bottom surface 117 of the extension 118 may be formed by an etching process. For example, half the thickness of the extension 118 may be etched at the bottom surface 117 of the extension 118 to form the recess 117 a. The recess 117a of the extension 118 has a large receiving space in which the bonding layer 140 (see fig. 3) of fig. 3 can be located to improve the securing effect. When the bonding layer 140 is coated under the leadframe structure 100a, the recess 117a of the extension 118 may accommodate more bonding layer 140. Therefore, the recess 117a of the extension 118 may enhance and stabilize the position relationship between the leadframe structure 100a and the circuit board 200 (see fig. 3).
Fig. 5 is a top view of a leadframe structure 100b according to another embodiment of the disclosure. The leadframe structure 100b includes a bottom plate 110 and a dam 120. The bottom plate 110 of the lead frame structure 100b has a first conductive portion 112 and a second conductive portion 114. The extending portions 118 of the first conductive portion 112 and the second conductive portion 114 have outer lateral surfaces 119 away from the retaining walls 120. The difference from the embodiment of fig. 3 is that the outer side surface 119 of the extension 118 has a convex portion 119 b. Since the outer side 119 of the extension 118 has the protrusion 119b, and the protrusion 119b extends along the horizontal direction D1 to exceed the outer surface 124 of the dam 120 above the protrusion, when the bonding layer 140 is coated under the leadframe structure 100b and the leadframe structure 100b is bonded to the circuit board 200, the compressed bonding layer 140 may overflow from the outer side 119 of the extension 118 and the protrusion 119b, so that the bonding layer 140 is easy to observe. In this way, a tester can observe the bonding layer 140 located on the extension portion 118 to ensure that the bonding layer 140 has been uniformly filled under the leadframe structure 100b, so as to reduce the defects of the leadframe structure 100b, and the leadframe structure 100b can be applied to the subsequent packaging process.
Fig. 6 is a top view of a leadframe structure 100c according to yet another embodiment of the present disclosure. The leadframe structure 100c includes a bottom plate 110 and a retaining wall 120. The bottom plate 110 of the leadframe structure 100c has a first conductive portion 112 and a second conductive portion 114. The extending portions 118 of the first conductive portion 112 and the second conductive portion 114 have outer side surfaces 119 away from the retaining wall 120. In contrast to the embodiment of fig. 3, the outer side 119 of the extension 118 is entirely planar. Since the outer surfaces 119 of the extending portions 118 of the first conductive portion 112 and the second conductive portion 114 are entirely planar, when the bonding layer 140 is coated under the lead frame structure 100c and bonded to the circuit board 200, the compressed bonding layer 140 may overflow from the outer surfaces 119 of the extending portions 118, so that the bonding layer 140 is easy to observe. In this way, the bonding layer 140 on the outer side 119 of the extension portion 118 can be observed by an inspector to ensure that the bonding layer 140 is uniformly filled under the leadframe structure 100, so as to reduce defects of the leadframe structure 100c and improve the yield of the leadframe structure 100 c.
Fig. 7 is a top view of a leadframe structure 100d according to yet another embodiment of the present disclosure. The leadframe structure 100d includes a bottom plate 110 and a dam 120. The bottom plate 110 of the leadframe structure 100d has a first conductive portion 112 and a second conductive portion 114. The difference from the embodiment of fig. 3 is that the bottom plate 110 of the lead frame structure 100d further has a third conductive portion 113, and the insulating portion 116 of the lead frame structure 100d extends between the second conductive portion 114 and the third conductive portion 113. The third conductive portion 113 of the base plate 110 has an extension portion 118. The extension 118 of the third conductive portion 113 extends beyond the outer surface 124 of the retaining wall 120 in the horizontal direction D1. Moreover, the insulating portion 116 of the lead frame structure 100d extends between the extending portion 118 of the second conductive portion 114 and the extending portion 118 of the third conductive portion 113 to provide an insulating effect. The extending portions 118 of the first conductive portion 112, the second conductive portion 114 and the third conductive portion 113 all have outer side surfaces 119 far away from the retaining wall 120, and the outer side surfaces 119 of the extending portions 118 have recesses 119 a.
Fig. 8 is a top view of a leadframe structure 100e according to yet another embodiment of the disclosure. The leadframe structure 100e includes a bottom plate 110 and a retaining wall 120. The bottom plate 110 of the lead frame structure 100e has a first conductive portion 112, a second conductive portion 114 and a third conductive portion 113. The difference from the embodiment of fig. 7 is that the bottom plate 110 of the leadframe structure 100e further has a fourth conductive portion 115, and the insulating portion 116 of the leadframe structure 100e extends between the first conductive portion 112 and the fourth conductive portion 115. The fourth conductive portion 115 of the base plate 110 has an extension 118. The extending portion 118 of the fourth conductive portion 115 extends beyond the outer surface 124 of the retaining wall 120 in the horizontal direction D1. Moreover, the insulating portion 116 of the lead frame structure 100e extends between the extending portion 118 of the first conductive portion 112 and the extending portion 118 of the fourth conductive portion 115, so as to provide an insulating effect. The extending portions 118 of the first conductive portion 112, the second conductive portion 114, the third conductive portion 113 and the fourth conductive portion 115 have outer side surfaces 119 away from the retaining walls 120, and the outer side surfaces 119 of the extending portions 118 have recesses 119 a.
In the following description, a method of manufacturing a lead frame structure will be described.
Fig. 9 is a flowchart illustrating a method of manufacturing a leadframe structure according to an embodiment of the present disclosure. The manufacturing method of the lead frame structure comprises the following steps. First, in step S1, a bottom plate having a first conductive portion and a second conductive portion is formed, wherein the first conductive portion is separated from the second conductive portion, and the first conductive portion and the second conductive portion each have an extending portion. Next, in step S2, a retaining wall is formed on the bottom plate by using a mold for shielding the two extending portions, so that the extending portions extend along the horizontal direction to exceed the outer surface of the retaining wall, wherein the retaining wall surrounds an opening, and the first conductive portion and the second conductive portion are exposed from the opening.
In step S1, an insulating portion may be disposed between the first conductive portion and the second conductive portion to separate the first conductive portion from the second conductive portion.
After step S2, a light source may be disposed on the first conductive portion, and the light source may be a light emitting diode, so as to obtain the structure of fig. 1.
In some embodiments, the method for manufacturing a leadframe structure further includes etching a bottom surface of the extended portion of the first conductive portion and a bottom surface of the extended portion of the second conductive portion, such that the bottom surface of the extended portion of the first conductive portion and the bottom surface of the extended portion of the second conductive portion each have a recess, as shown in fig. 4. In detail, a half thickness of the extension portion may be etched at a bottom surface of the extension portion to form the recess. The recess at the bottom surface of the extension portion may be coated with a bonding layer. The bonding layer can bond the lead frame structure and the circuit board, so that the lead frame structure is firmly fixed on the circuit board.
The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions and alterations herein without departing from the spirit and scope of the present disclosure.
Claims (12)
1. A leadframe structure, comprising:
a bottom plate having a first conductive portion and a second conductive portion, the first conductive portion being separated from the second conductive portion, the first conductive portion and the second conductive portion being configured to electrically connect to a light source; and
and the retaining wall is positioned on the bottom plate, surrounds an opening, and exposes the first conductive part and the second conductive part from the opening, wherein the first conductive part and the second conductive part are respectively provided with an extension part which extends along the horizontal direction and exceeds the outer surface of the retaining wall.
2. The leadframe structure according to claim 1, wherein the base has an insulating portion, and the insulating portion is located between the first conductive portion and the second conductive portion.
3. The leadframe structure according to claim 1, wherein the extending portion of the first conductive portion and the extending portion of the second conductive portion each have an outer side surface away from the dam, and the outer side surfaces of the extending portions each have a recess.
4. The leadframe structure according to claim 1, wherein the extending portion of the first conductive portion and the extending portion of the second conductive portion each have an outer side surface away from the dam, and the outer side surfaces of the extending portions each have a protrusion.
5. The leadframe structure according to claim 1, wherein the extending portion of the first conductive portion and the extending portion of the second conductive portion each have an outer side surface away from the dam, and the outer side surfaces of the extending portions are all planar.
6. The leadframe structure according to claim 1, wherein a bottom surface of the extension portion of the first conductive portion and a bottom surface of the extension portion of the second conductive portion are configured to be coated with a bonding layer.
7. The leadframe structure according to claim 1, wherein a bottom surface of the extending portion of the first conductive portion and a bottom surface of the extending portion of the second conductive portion each have a recess.
8. The leadframe structure according to claim 7, wherein the recess of the bottom surface of the extended portion of the first conductive portion and the recess of the bottom surface of the extended portion of the second conductive portion are configured to be coated with a bonding layer.
9. The leadframe structure according to claim 2, wherein the bottom plate further has a third conductive portion, the insulating portion extends between the second conductive portion and the third conductive portion, and the third conductive portion has an extending portion, the extending portion of the third conductive portion extends along the horizontal direction to exceed the outer surface of the dam.
10. The leadframe structure according to claim 9, wherein the bottom plate further has a fourth conductive portion, the insulating portion extends between the first conductive portion and the fourth conductive portion, and the fourth conductive portion has an extending portion, the extending portion of the fourth conductive portion extends along the horizontal direction to exceed the outer surface of the dam.
11. A method for manufacturing a leadframe structure, comprising:
forming a base plate having a first conductive portion and a second conductive portion, wherein the first conductive portion is separated from the second conductive portion, and the first conductive portion and the second conductive portion each have an extension portion; and
and forming a retaining wall on the bottom plate by using a mold for shielding the two extending parts, so that the extending parts extend along the horizontal direction and exceed the outer surfaces of the retaining wall, wherein the retaining wall surrounds an opening, and the first conductive part and the second conductive part are exposed from the opening.
12. The method of claim 11, further comprising:
etching a bottom surface of the extension portion of the first conductive portion and a bottom surface of the extension portion of the second conductive portion to make the bottom surface of the extension portion of the first conductive portion and the bottom surface of the extension portion of the second conductive portion have a recess respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110184289.7A CN114914351A (en) | 2021-02-08 | 2021-02-08 | Lead frame structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110184289.7A CN114914351A (en) | 2021-02-08 | 2021-02-08 | Lead frame structure and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114914351A true CN114914351A (en) | 2022-08-16 |
Family
ID=82762275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110184289.7A Pending CN114914351A (en) | 2021-02-08 | 2021-02-08 | Lead frame structure and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114914351A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200705716A (en) * | 2005-04-19 | 2007-02-01 | Koninkl Philips Electronics Nv | Illumination system comprising a red-emitting ceramic luminescence converter |
| KR20070105630A (en) * | 2006-04-27 | 2007-10-31 | 삼성전기주식회사 | Light emitting diode package |
| JP2011507228A (en) * | 2007-12-06 | 2011-03-03 | ソウル セミコンダクター カンパニー リミテッド | LED package and method of manufacturing the same |
| JP2012231068A (en) * | 2011-04-27 | 2012-11-22 | Nichia Chem Ind Ltd | Light emitting device |
| TW201340420A (en) * | 2012-03-27 | 2013-10-01 | Lextar Electronics Corp | Light emitting diode package and method for fabricating the same |
| US20170040516A1 (en) * | 2015-08-07 | 2017-02-09 | Nichia Corporation | Lead frame, package, light emitting device, and method for producing the same |
| US20170155021A1 (en) * | 2015-11-30 | 2017-06-01 | Nichia Corporation | Package, package intermediate body, light emitting device, method for manufacturing same |
| JP2017183620A (en) * | 2016-03-31 | 2017-10-05 | 日亜化学工業株式会社 | Lead frame, package and light-emitting device, and method of manufacturing them |
| US20180301600A1 (en) * | 2008-09-03 | 2018-10-18 | Nichia Corporation | Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body |
| CN214226943U (en) * | 2021-02-08 | 2021-09-17 | 健策精密工业股份有限公司 | Lead frame structure |
-
2021
- 2021-02-08 CN CN202110184289.7A patent/CN114914351A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200705716A (en) * | 2005-04-19 | 2007-02-01 | Koninkl Philips Electronics Nv | Illumination system comprising a red-emitting ceramic luminescence converter |
| KR20070105630A (en) * | 2006-04-27 | 2007-10-31 | 삼성전기주식회사 | Light emitting diode package |
| JP2011507228A (en) * | 2007-12-06 | 2011-03-03 | ソウル セミコンダクター カンパニー リミテッド | LED package and method of manufacturing the same |
| US20180301600A1 (en) * | 2008-09-03 | 2018-10-18 | Nichia Corporation | Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body |
| JP2012231068A (en) * | 2011-04-27 | 2012-11-22 | Nichia Chem Ind Ltd | Light emitting device |
| TW201340420A (en) * | 2012-03-27 | 2013-10-01 | Lextar Electronics Corp | Light emitting diode package and method for fabricating the same |
| US20170040516A1 (en) * | 2015-08-07 | 2017-02-09 | Nichia Corporation | Lead frame, package, light emitting device, and method for producing the same |
| US20170155021A1 (en) * | 2015-11-30 | 2017-06-01 | Nichia Corporation | Package, package intermediate body, light emitting device, method for manufacturing same |
| JP2017183620A (en) * | 2016-03-31 | 2017-10-05 | 日亜化学工業株式会社 | Lead frame, package and light-emitting device, and method of manufacturing them |
| CN214226943U (en) * | 2021-02-08 | 2021-09-17 | 健策精密工业股份有限公司 | Lead frame structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8551794B2 (en) | LED package and mold of manufacturing the same | |
| US6650020B2 (en) | Resin-sealed semiconductor device | |
| EP2605276A2 (en) | Packaged leadless semiconductor device | |
| TWI634634B (en) | Semiconductor device and method of manufacturing the same | |
| CN107275466B (en) | Lead frame, package, light emitting device, and method of manufacturing the same | |
| JP2012028699A (en) | Semiconductor device, lead frame assembly and manufacturing method of the same | |
| CN112913009B (en) | Semiconductor device and lead frame material | |
| KR20150109284A (en) | Semiconductor device and method of manufacturing the same | |
| JP2016532283A (en) | Optoelectronic component and manufacturing method thereof | |
| JP6677616B2 (en) | Method for manufacturing semiconductor device | |
| CN214226943U (en) | Lead frame structure | |
| JP2006294809A (en) | Semiconductor device | |
| JP2008252054A (en) | Semiconductor device and method for manufacturing semiconductor device | |
| US11069838B2 (en) | Light-emitting device with light-emitting element mounted on supporting member and display apparatus | |
| CN114914351A (en) | Lead frame structure and manufacturing method thereof | |
| JP7283938B2 (en) | semiconductor light emitting device | |
| CN108074901B (en) | Semiconductor device having wettable corner leads and method of assembling semiconductor device | |
| JP2001077424A (en) | Optical semiconductor device and manufacture thereof | |
| US11984385B2 (en) | Lead frame structure and manufacturing method thereof | |
| JP2012216654A (en) | Resin mold frame and optical semiconductor device | |
| US9818675B2 (en) | Semiconductor device including conductive clip with flexible leads and related methods | |
| TWI531096B (en) | Sideview light emitting diode package and method for manufacturing the same | |
| JP6822442B2 (en) | Light emitting device and its manufacturing method | |
| TWM613976U (en) | Lead frame structure | |
| KR200342680Y1 (en) | Lead Frame Structure of Surface Mounting Type Lighting Diode |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |