CN114868068A - Adjustable optical filtering device - Google Patents
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- CN114868068A CN114868068A CN201980102504.5A CN201980102504A CN114868068A CN 114868068 A CN114868068 A CN 114868068A CN 201980102504 A CN201980102504 A CN 201980102504A CN 114868068 A CN114868068 A CN 114868068A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
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Abstract
A tunable optical filter device comprises a first transparent substrate (101) and a second transparent substrate (102) which are bonded with each other, wherein a first mirror surface (111) and a second mirror surface (112) which are parallel to each other are respectively arranged on the surfaces, facing to each other, of the first transparent substrate (101) and the second transparent substrate (102), the first transparent substrate (101) is provided with elastic structures (201) distributed around the outside of the first mirror surface (111), and one side, far away from the first transparent substrate (101), of each elastic structure (201) is bonded with the second transparent substrate (102) through a bonding object. The mirror chip composed of the substrate and the mirror and the elastic structure (201) are made into an FPI device driven by a capacitor through separated and heterogeneous materials, the requirement of FPI device design is met in mechanical strength, and the first mirror (111) and the second mirror (112) can keep extremely high flatness. The fabrication of the optical mirrors and the assembly of the FPI device are compatible with standardized micromachining and are therefore suitable for mass production.
Description
The invention relates to the field of filters, in particular to an adjustable optical filtering device.
The tunable optical filter formed by the Fabry-Perot cavity structure is a device realized based on MEMS (Micro-Electro-Mechanical-System) technology, the Fabry-Perot cavity consists of two mirror surfaces capable of providing high reflectivity and a cavity capable of providing a resonance space, incident light is limited in the Fabry-Perot cavity to oscillate and interfere for many times back and forth, the incident light can emit when an interference light signal reaches a certain condition, and the resonance condition is changed by mainly adjusting the length of the Fabry-Perot cavity or the refractive index of the cavity to achieve the filtering effect. The device manufactured by the MEMS technology has the advantages of easy combination with an integrated circuit, small size, low manufacturing cost, high response speed, easy batch production and the like, so that the tunable Fabry-Perot cavity filter device has received wide attention and research.
Tunable FPIs based on Fabry-Perot interference can be applied in micro spectrometers and small and even mini hyperspectral cameras. In the field of visible light-near infrared (400-.
In a FPI device in the visible-near infrared range, optical glass (e.g., synthetic quartz glass) is usually used as a substrate, mirror chips are formed through optical and semiconductor processing, then two mirror chips and an external piezoelectric actuator are assembled to form a glass cavity module, and by adjusting the driving voltage of the piezoelectric actuator, the relative position between the two mirror chips can be adjusted, thereby realizing gating of different wavelengths in the spectrum. Due to the large difference in mechanical characteristics between the piezoelectric actuator and the glass, the mirror chip has non-negligible deformation after assembly, generally, the mirror warpage, so that it is usually necessary to use very thick glass as the substrate to reduce the deformation, and as a result, the processing of the glass substrate and the increase of the system volume are difficult, and the assembly of the module is difficult to achieve mass production.
In addition, the current glass cavity device formed by micromachining (micromachining) is mainly of a bulk process type and a surface process type. The essential characteristic of both processes is that a cantilever beam structure is formed on the substrate of the mirror structure itself, or the mirror film itself is the elastic support of the device. The thin film type device can not be made to be large-sized (for example, more than 10 mm), but the elastic structure and the mirror surface in the existing body process device are provided by the same substrate, so that the mirror surface has intrinsic stress and deformation under the influence of the elastic structure, and the cantilever beam structure occupies a large chip area and also limits the size of the mirror surface.
It follows that there are some key problems with current FPI devices in the visible-near infrared range that result in limited commercial applications of the technology itself, such as:
1. the large-size FPI device has the problems of large volume, unmatched mechanical strength of the external piezoelectric actuator and the mirror chip, large device volume, large processing difficulty, incapability of batch production and the like.
2. The micro-machined FPI device has the defects that an elastic structure cannot be isolated from a mirror surface, so that intrinsic stress and deformation are caused.
Disclosure of Invention
To solve the above existing problems, embodiments of the present application provide an adjustable optical filtering apparatus, which has a simple device structure and a small processing difficulty, and is very suitable for batch generation.
According to one aspect, the invention discloses a tunable optical filter device comprising a first transparent substrate and a second transparent substrate, wherein a first mirror surface and a second mirror surface parallel to each other are respectively arranged on mutually facing surfaces of the first transparent substrate and the second transparent substrate, the first transparent substrate is provided with an elastic structure distributed around the outside of the first mirror surface, and one side of the elastic structure, which is far away from the first transparent substrate, is bonded with the second transparent substrate through a bonding object.
Preferably, the elastic structure comprises a silicon membrane. The silicon thin film and the first mirror surface are formed of two separate and heterogeneous materials on the first transparent substrate, and thus mechanical properties can be improved.
Preferably, the first mirror and the second mirror are made of a metal material. The first mirror and the second mirror form an optical mirror, and the material of the optical mirror can be made of metal such as silver, so that electrodes driven by capacitors can be formed conveniently.
Preferably, the first mirror and the second mirror are respectively used as a first electrode and a second electrode of the capacitive drive. The first mirror surface and the second mirror surface are made of metal, so that the first mirror surface and the second mirror surface can be used as electrodes driven by a capacitor after being electrified, the distance between the first mirror surface and the second mirror surface can be changed, the resonance condition is changed, and the filtering effect is achieved.
Preferably, the first mirror and the second mirror are distributed bragg reflectors formed by stacking silicon, silicon dioxide and silicon. The distributed bragg reflector may enhance specular reflectivity.
Preferably, the first transparent substrate and the second transparent substrate are provided with a third electrode and a fourth electrode respectively, which are distributed to face each other around the outside of the first mirror surface and the second mirror surface. The third electrode and the fourth electrode are used as electrodes driven by a capacitor to perform resonance adjustment on the mirror surface and can also be used for fine adjustment on the inclination of the mirror surface.
Preferably, the third electrode and the fourth electrode are closer to the first mirror or the second mirror than the elastic structure. The third electrode and the fourth electrode are oppositely arranged on one side of the elastic structure and the bonded object close to the first mirror surface or the second mirror surface.
Preferably, the third electrode and the fourth electrode are further away from the first mirror or the second mirror with respect to the resilient structure. The third electrode and the fourth electrode are oppositely arranged on one side of the elastic structure and the bonded object far away from the first mirror surface or the second mirror surface.
Preferably, the third electrode and the fourth electrode are closer to the first mirror or the second mirror with respect to the elastic structure, and the first transparent substrate and the second transparent substrate are further provided with a fifth electrode and a sixth electrode, respectively, which are distributed around the outer peripheries of the first mirror and the second mirror and face each other, and the fifth electrode and the sixth electrode are farther from the first mirror or the second mirror with respect to the elastic structure. The third electrode, the fourth electrode, the fifth electrode and the sixth electrode may also be disposed on two sides of the elastic structure and the bonding object, respectively.
Preferably, a cavity for accommodating deformation and movement of the elastic structure is formed on one side of the first transparent substrate close to the elastic structure. The cavity is beneficial to deformation of the elastic structure, and further the mechanical strength of the mirror surface and the transparent substrate is much higher than that of the elastic structure, so that after assembly, the optical mirror surface can keep extremely high flatness without an extremely thick substrate, and the high flatness can be kept in the working process of a device.
Preferably, a groove is formed in one side, close to the elastic structure, of the first transparent substrate, and the elastic structure covers the groove to form a cavity. The groove is arranged on the substrate, so that the processing is convenient, the separation of the mirror surface and the elastic structure provides higher design flexibility for the FPI device, and the same elastic structure can be applied to glass cavity devices with different sizes (such as wafer levels).
Preferably, the elastic structure and the first transparent substrate are connected by means of bonding. A plurality of elastic structures are formed on the first transparent substrate in a micro-processing and bonding mode, and the process is simple and mature.
Preferably, the bonding means includes eutectic bonding, polymer bonding or anodic bonding. Various bonding modes can be selected according to specific processes and scenes.
Preferably, the material of the first transparent substrate and the second transparent substrate comprises glass or sapphire. Glass or sapphire is convenient for processing to form devices of different sizes.
The embodiment of the application discloses a tunable optical filter device, which comprises a first transparent substrate and a second transparent substrate which are bonded with each other, wherein a first mirror surface and a second mirror surface which are parallel to each other are respectively arranged on the surfaces of the first transparent substrate and the second transparent substrate which face each other, the first transparent substrate is provided with an elastic structure which is distributed around the outside of the first mirror surface, and one side of the elastic structure, which is far away from the first transparent substrate, is bonded with the second transparent substrate through a bonding object. The mirror chip and the elastic structure which are composed of the substrate and the mirror are made into the FPI device driven by the capacitor through separated and heterogeneous materials, the requirement of FPI device design is met on mechanical strength, intrinsic stress and deformation are reduced, the first mirror and the second mirror can keep extremely high flatness, the extremely thick substrate is not needed, and high flatness can be realized even in the device work. The design of the mirror surface chip and the FPI device of the elastic structure separation setting position provides higher flexibility, can adopt more different materials and process manufacture, and can be applied to glass cavity devices of different sizes. The fabrication of the optical mirrors and the assembly of the FPI device are compatible with standardized micromachining and are therefore suitable for mass production.
The accompanying drawings are included to provide a further understanding of the embodiments and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments and together with the description serve to explain the principles of the invention. Other embodiments and many of the intended advantages of embodiments will be readily appreciated as they become better understood by reference to the following detailed description. The elements of the drawings are not necessarily to scale relative to each other. Like reference numerals designate corresponding similar parts.
FIG. 1 is a schematic cross-sectional view of a tunable optical filter arrangement in an embodiment of the present application;
fig. 2 is a schematic cross-sectional view i of a tunable optical filter device according to a first embodiment of the present application;
fig. 3 is a schematic cross-sectional view ii of a tunable optical filter device according to a first embodiment of the present application;
fig. 4 is a schematic cross-sectional view iii of a tunable optical filter device according to a first embodiment of the present application;
FIG. 5 is a schematic cross-sectional view of a tunable optical filter device according to a second embodiment of the present application;
FIG. 6 is a top view I of a tunable optical filter device in an embodiment of the present application;
fig. 7 is a top view ii of a tunable optical filter device in an embodiment of the present application.
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the related invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
As shown in fig. 1, an embodiment of the present invention provides a tunable optical filter device, which includes a first transparent substrate 101 and a second transparent substrate 102, and in a preferred embodiment, the material of the first transparent substrate 101 and the second transparent substrate 102 may be a transparent material such as glass or sapphire, so that the first transparent substrate 101 and the second transparent substrate 102 may be a quartz glass wafer or alumina. Glass or sapphire is industrially convenient to process to form FPI devices meeting different requirements. The first mirror 111 and the second mirror 112 are respectively arranged on the mutually facing surfaces of the first transparent substrate 101 and the second transparent substrate 102, the first mirror 111 and the second mirror 112 as optical mirrors can be deposited on the surfaces of the first transparent substrate 101 and the second transparent substrate 102 in a micro-machining mode, and then etching is carried out to form corresponding patterns, and the first mirror 111 and the second mirror 112 can be made of metal, medium or semiconductor materials, and are specifically selected according to the actual requirements of FPI device design. The first transparent substrate 101 is provided with elastic structures 201 distributed around the outer portion of the first mirror 111, the elastic structures 201 and the first transparent substrate 101 are connected by bonding, and the elastic structures 201 can be formed on the surface of the first transparent substrate 101 by bonding or etching. The method has simple and mature process and is beneficial to industrial mass production. The side of the resilient structure 201 remote from the first transparent substrate 101 is bonded to the second transparent substrate 102 by a bond 202. Forming a bonding object 202 on the elastic structure 201 for further bonding facilitates bonding the elastic structure 201 and the second transparent substrate 102 to achieve the connection between the first transparent substrate 101 and the second transparent substrate 102.
In a particular embodiment, the elastic structure 201 includes a silicon membrane. The silicon thin film and the first mirror 111 are made of two separate and heterogeneous materials on the first transparent substrate 101, when the movable mirror structure formed by the first transparent substrate 101 and the first mirror 111 is driven to move, the distance between the first mirror 111 and the second mirror 112 is changed to gate different wavelengths on a spectrum, and the problems of mechanical strength difference and the like can be overcome through the separation of the elastic structure 201 and the movable mirror structure on the materials, so that the intrinsic stress and strain are reduced, and the mechanical performance can be improved. In alternative embodiments, the elastic structure 201 may be made of other materials to form a sheet structure. As shown in fig. 1, a cavity for accommodating deformation and movement of the elastic structure 201 is formed on a side of the first transparent substrate 101 close to the elastic structure 201. The cavity facilitates the deformation of the elastic structure 201, and thus the mechanical strength of the first mirror 111 and the first transparent substrate 101 is much higher than that of the elastic structure 201, so that after assembly, the first mirror 111 and the second mirror 112 can maintain extremely high flatness, the thickness of the first transparent substrate 101 and the second transparent substrate 102 does not need to be very thick, and the high flatness can be maintained during the operation of the device. In a preferred embodiment, a groove 203 is formed on a side of the first transparent substrate 101 close to the elastic structure 201, and the elastic structure 201 covers the groove 203 to form a cavity. The groove 203 is formed in the first transparent substrate 101 for processing, the separation of the first mirror 111 and the elastic structure 201 provides a higher design flexibility for the FPI device, and the same elastic structure 201 can be applied to the glass-cavity devices with different sizes (e.g., wafer level).
In a specific embodiment, the first mirror 111 and the second mirror 112 are optical mirrors, and may be made of a metal material, a dielectric material, or a semiconductor material.
Example one
As shown in fig. 1, the first mirror 111 and the second mirror 112 are made of a metal material. In a preferred embodiment, the first mirror 111 and the second mirror 112 may be made of silver to form the capacitively driven electrodes. The first mirror 111 and the second mirror 112 thus act as a first electrode and a second electrode, respectively, for capacitive driving. Because the first mirror 111 and the second mirror 112 are made of metal and have conductive characteristics, the first mirror 111 and the second mirror 112 can be used as electrodes driven by a capacitor after being electrified, and the distance between the first mirror 111 and the second mirror 112 is changed by changing the magnitude of voltage applied to the first electrode and the second electrode, so that the resonance condition is changed, the filtering effect is achieved, and light with the required wavelength is obtained.
In this case, the first and second transparent substrates 101 and 102 may be further provided thereon with third and fourth electrodes 301 and 302, respectively, which are distributed to face each other around the outside of the first and second mirrors 111 and 112. Voltages are respectively applied to the third electrode 301 and the fourth electrode 302, and a capacitive driving driver can be formed to finely adjust the distance between the first transparent substrate 101 and the second transparent substrate 102, so as to avoid the first transparent substrate 101 or the second transparent substrate 102 from warping and the like under the driving of the first electrode and the second electrode. In a preferred embodiment, as shown in fig. 2 and 3, the third electrode 301 may be disposed closer to the first mirror 111 with respect to the elastic structure 201, i.e. between the elastic structure 201 and the first mirror 111, or may be disposed farther from the first mirror 111 with respect to the elastic structure 201, i.e. around the outside of the side of the elastic structure 201 away from the first mirror 111, i.e. around the outside of the elastic structure 201. Accordingly, the fourth electrode 302 may be disposed closer to the second mirror 112 relative to the elastic structure 201, i.e., between the bond 202 and the second mirror 112, or may be disposed farther from the second mirror 112 relative to the elastic structure 201, i.e., around the outside of the side of the bond 202 away from the second mirror 112, i.e., around the outside of the bond 202. The third electrode 301 and the fourth electrode 302 are disposed opposite to each other on one of the two sides of the elastic structure 201 and the bonding object 202. In other alternative embodiments, the third electrode 301 and the fourth electrode 302 may also be disposed on both sides of the elastic structure 201 and the bond 202. In this case, the third electrode 301 is disposed between the elastic structure 201 and the first mirror 111 and around the outside of the elastic structure 201 on the side away from the first mirror 111, and the fourth electrode 302 is disposed between the bond 202 and the second mirror 112 and around the outside of the bond 202 on the side away from the second mirror 112. The third electrode 301 and the fourth electrode 302 can be used to fine tune the tilt of the first mirror 111 or the second mirror 112, and thus the distance between the first mirror 111 and the second mirror 112 is more controllable.
In other alternative embodiments, in addition to the third electrode 301 and the fourth electrode 302 on one side of the spring structure 201, a fifth electrode 303 and a sixth electrode 304 are provided on the other side of the spring structure. The third electrode 301 and the fourth electrode 302 are closer to the first mirror 111 or the second mirror 112 than the elastic structure 201, and the first transparent substrate 101 and the second transparent substrate 102 are further provided with a fifth electrode 303 and a sixth electrode 304 respectively, which are distributed around the outer portions of the first mirror 111 and the second mirror 112 and face each other, and the fifth electrode 303 and the sixth electrode 304 are farther from the first mirror 111 or the second mirror 112 than the elastic structure 201. The positions where the third electrode 301, the fourth electrode 302, and the fifth electrode 303, the sixth electrode 304 are provided and the magnitude of the applied voltage have a relationship with the degree of adjustment of the distance between the first mirror 111 and the second mirror 112. The positions of the third electrode 301, the fourth electrode 302, the fifth electrode 303 and the sixth electrode 304 can be flexibly adjusted and set according to the requirements of a specific FPI device. The FPI device thus formed can be driven capacitively and both the fabrication of the optical mirror and the assembly of the FPI device are compatible with standardized micromachining and thus are suitable for mass production.
As shown in fig. 5, the first mirror 111 and the second mirror 112 may also be distributed bragg reflectors formed by stacking silicon, silicon dioxide and silicon. The arrangement of the distributed bragg reflectors on the first transparent substrate 101 and the second transparent substrate 102 may enhance specular reflectivity. In this case, at least the third electrode 301 and the fourth electrode 302 facing each other are disposed on the first transparent substrate 101 and the second transparent substrate 102, respectively, distributed around the outer peripheries of the first mirror 111 and the second mirror 112. The third electrode 301 and the fourth electrode 302 as the electrodes for capacitive driving can perform resonance adjustment of the first mirror 111 and the second mirror 112 to obtain light of a desired wavelength.
In a specific embodiment, the third electrode 301 may be disposed closer to the first mirror 111 with respect to the elastic structure 201, i.e., between the elastic structure 201 and the first mirror 111, or may be disposed farther from the first mirror 111 with respect to the elastic structure 201, i.e., around the outside of the side of the elastic structure 201 away from the first mirror 111, i.e., around the outside of the elastic structure 201. Accordingly, the fourth electrode 302 may be disposed closer to the second mirror 112 with respect to the elastic structure 201, i.e., between the bond 202 and the second mirror 112, or may be disposed farther from the second mirror 112 with respect to the elastic structure 201, i.e., around the outside of the side of the bond 202 away from the second mirror 112, i.e., around the outside of the bond 202. The third electrode 301 and the fourth electrode 302 are oppositely disposed on one of two sides of the elastic structure 201 and the bond 202.
In other alternative embodiments, instead of providing the third electrode 301 and the fourth electrode 302 on one side of the spring structure 201, a fifth electrode 303 and a sixth electrode 304 may be provided on the other side of the spring structure. As shown in fig. 5, the third electrode 301 and the fourth electrode 302 are closer to the first mirror 111 or the second mirror 112 than the elastic structure 201, and the first transparent substrate 101 and the second transparent substrate 102 are further provided with a fifth electrode 303 and a sixth electrode 304 respectively, which are distributed around the outer portions of the first mirror 111 and the second mirror 112 and face each other, and the fifth electrode 303 and the sixth electrode 304 are further away from the first mirror 111 or the second mirror 112 than the elastic structure 201. The positions where the third electrode 301, the fourth electrode 302, and the fifth electrode 303, the sixth electrode 304 are provided and the magnitude of the applied voltage have a relationship with the degree of distance adjustment between the first mirror 111 and the second mirror 112. The positions of the third electrode 301, the fourth electrode 302, the fifth electrode 303 and the sixth electrode 304 can be flexibly adjusted and set according to the requirements of a specific FPI device. The FPI device thus formed can be driven capacitively and both the fabrication of the optical mirror and the assembly of the FPI device are compatible with standardized micromachining and thus are suitable for mass production.
In a specific embodiment, the first mirror 111 and the second mirror 112 can be deposited on the first transparent substrate 101 and the second transparent substrate 102 respectively by plasma deposition or chemical vapor deposition, and then the related patterns can be formed by etching. The elastic structure 201 is formed on the first transparent substrate 101 by bonding or etching. The bonding object 202 is also disposed on the elastic structure 201 and the second transparent substrate 102 in a bonding manner. The bonding means includes eutectic bonding, polymer bonding, or anodic bonding. Eutectic bonding is realized by adopting metal as a transition layer, so that the bonding between silicon and silicon is realized, the surface requirement is low, the bonding temperature is low, and the bonding strength is high; the anodic bonding has the advantages of low bonding temperature, good compatibility with other processes, high bonding strength and stability and the like, and can be used for bonding between silicon/silicon substrates, bonding between non-silicon materials and silicon materials, and bonding between glass, metal, semiconductor and ceramic. The bonding of the mirror chip can be realized by selecting a proper bonding mode according to the surface process and the material of the actual bonding. In a preferred embodiment, the first mirror 111 and the second mirror 112 may be deposited on the first transparent substrate 101 and the second transparent substrate 102, respectively, and the elastic structure 201 and the bonding object 202 may be disposed on the first transparent substrate 101 and the second transparent substrate 102, respectively, by bonding. And assembling the first transparent substrate 101 provided with the elastic structure 201 and the second transparent substrate 102 provided with the bonding object 202 together in a bonding manner, and finally forming a mirror chip comprising a plurality of silicon thin films by scribing.
In a specific embodiment, as shown in fig. 6 and 7, the elastic structure 201 may be a ring-shaped structure disposed around the outer portions of the first mirror 111 and the second mirror 112, or may be a shape structure disposed in a pattern. Similarly, the third electrode 301, the fourth electrode 302, the fifth electrode 303, and the sixth electrode 304 may be disposed in a ring structure around the elastic structure 201, or may be disposed in a shape structure having a certain pattern. The positions and pattern arrangements of the elastic structure 201, the third electrode 301, the fourth electrode 302, the fifth electrode 303 and the sixth electrode 304 are diversified to meet the requirements of FPI devices with different forms or different functions. In a preferred embodiment, as shown in FIG. 6, the spring structure 201 is provided as a plurality of symmetrically distributed circular structures around the outside of the first mirror 111 and the second mirror 112, and the third electrode 301 and the fourth electrode 302 are provided as 4 symmetrically distributed circular structures around the outside of the spring structure 201, respectively.
The embodiment of the application discloses a tunable optical filter device, including first transparent substrate and the second transparent substrate of mutual bonding, be provided with first mirror surface and the second mirror surface that is parallel to each other respectively on the surface that faces each other of first transparent substrate and second transparent substrate, first transparent substrate is provided with the elastic construction who distributes around the outside of first mirror surface, and the one side of keeping away from first transparent substrate of elastic construction is in the same place with the bonding of second transparent substrate through the bonding thing. The mirror chip and the elastic structure which are composed of the substrate and the mirror are made into the FPI device driven by the capacitor through separated and heterogeneous materials, the requirement of FPI device design is met on mechanical strength, intrinsic stress and deformation are reduced, the first mirror and the second mirror can keep extremely high flatness, the extremely thick substrate is not needed, and high flatness can be realized even in the device work. The design of the mirror surface chip and the FPI device of the elastic structure separation setting position provides higher flexibility, can adopt more different materials and process manufacture, and can be applied to glass cavity devices of different sizes. The fabrication of the optical mirrors and the assembly of the FPI device are compatible with standardized micromachining and are therefore suitable for mass production.
While the present invention has been described with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
In the description of the present application, it is to be understood that the terms "upper", "lower", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application. The word 'comprising' does not exclude the presence of elements or steps not listed in a claim. The word 'a' or 'an' preceding an element does not exclude the presence of a plurality of such elements. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage. Any reference signs in the claims shall not be construed as limiting the scope.
Claims (14)
- A tunable optical filter device is characterized by comprising a first transparent substrate and a second transparent substrate, wherein a first mirror surface and a second mirror surface which are parallel to each other are respectively arranged on the mutually facing surfaces of the first transparent substrate and the second transparent substrate, the first transparent substrate is provided with an elastic structure which is distributed around the outer part of the first mirror surface, and one side of the elastic structure, which is far away from the first transparent substrate, is bonded with the second transparent substrate through a bonding object.
- A tunable optical filter device according to claim 1, wherein the elastic structure comprises a silicon membrane.
- A tunable optical filter device according to claim 1, wherein the first mirror and the second mirror are made of a metallic material.
- A tunable optical filter arrangement according to claim 3, wherein the first and second mirrors act as capacitively driven first and second electrodes, respectively.
- A tunable optical filtering device according to claim 1, wherein the first mirror and the second mirror are distributed bragg reflectors formed by superposition of silicon, silicon dioxide and silicon.
- A tunable optical filter arrangement according to any one of claims 1-5, wherein the first and second transparent substrates are provided with third and fourth electrodes, respectively, distributed around the outside of the first and second mirror surfaces facing each other.
- A tunable optical filter arrangement according to claim 6, wherein the third and fourth electrodes are closer to the first or second mirror than the resilient structure.
- A tunable optical filter arrangement according to claim 6, wherein the third and fourth electrodes are further away from the first or second mirror with respect to the resilient structure.
- A tunable optical filtering device according to claim 6, wherein the third and fourth electrodes are closer to the first or second mirror surface than to the elastic structure, and wherein the first and second transparent substrates are further provided with fifth and sixth electrodes, respectively, distributed around the outside of the first and second mirror surfaces facing each other, the fifth and sixth electrodes being further from the first or second mirror surface than to the elastic structure.
- A tunable optical filtering device according to claim 1, wherein a side of the first transparent substrate close to the elastic structure forms a cavity for accommodating deformation movement of the elastic structure.
- A tunable optical filter device according to claim 10, wherein a groove is disposed on a side of the first transparent substrate close to the elastic structure, and the elastic structure covers the groove to form the cavity.
- A tunable optical filtering device according to claim 1, wherein the elastic structure and the first transparent substrate are connected by means of bonding.
- A tunable optical filter device according to claim 1 or 12, wherein the bonding means comprises eutectic bonding, polymer bonding or anodic bonding.
- A tunable optical filter device according to claim 1, wherein the material of the first transparent substrate and the second transparent substrate comprises glass or sapphire.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2019/107806 WO2021056251A1 (en) | 2019-09-25 | 2019-09-25 | Tunable optical filtering apparatus |
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| CN114868068A true CN114868068A (en) | 2022-08-05 |
| CN114868068B CN114868068B (en) | 2023-11-17 |
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| CN114545703B (en) * | 2022-04-21 | 2022-09-13 | 国科大杭州高等研究院 | F-P tunable filter, system and correction and electric tuning method applying precise six-dimensional adjusting mechanism |
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| US6373632B1 (en) * | 2000-03-03 | 2002-04-16 | Axsun Technologies, Inc. | Tunable Fabry-Perot filter |
| CN103257404A (en) * | 2013-06-04 | 2013-08-21 | 贵阳恒浩光电科技有限公司 | MEMS Fabry-Perot cavity tunable filter |
| CN104428642A (en) * | 2012-05-08 | 2015-03-18 | Vtt技术研究中心 | Fabry-perot interferometer and method for producing same |
| CN106133563A (en) * | 2013-11-26 | 2016-11-16 | 英菲尼斯有限责任公司 | The MEMS fp filter of tunable wave length |
| US20180340826A1 (en) * | 2017-05-26 | 2018-11-29 | California Institute Of Technology | Spectral Filter Having Controllable Spectral Bandwidth and Resolution |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US8102592B2 (en) * | 2010-03-24 | 2012-01-24 | Unipel Technologies, LLC | Reflective display using calibration data for electrostatically maintaining parallel relationship of adjustable-depth cavity component |
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- 2019-09-25 CN CN201980102504.5A patent/CN114868068B/en active Active
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| US6373632B1 (en) * | 2000-03-03 | 2002-04-16 | Axsun Technologies, Inc. | Tunable Fabry-Perot filter |
| CN104428642A (en) * | 2012-05-08 | 2015-03-18 | Vtt技术研究中心 | Fabry-perot interferometer and method for producing same |
| CN103257404A (en) * | 2013-06-04 | 2013-08-21 | 贵阳恒浩光电科技有限公司 | MEMS Fabry-Perot cavity tunable filter |
| CN106133563A (en) * | 2013-11-26 | 2016-11-16 | 英菲尼斯有限责任公司 | The MEMS fp filter of tunable wave length |
| US20180340826A1 (en) * | 2017-05-26 | 2018-11-29 | California Institute Of Technology | Spectral Filter Having Controllable Spectral Bandwidth and Resolution |
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| WO2021056251A1 (en) | 2021-04-01 |
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