CN114867225B - Chip mounting device for integrated circuit processing - Google Patents
Chip mounting device for integrated circuit processing Download PDFInfo
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- CN114867225B CN114867225B CN202110166157.1A CN202110166157A CN114867225B CN 114867225 B CN114867225 B CN 114867225B CN 202110166157 A CN202110166157 A CN 202110166157A CN 114867225 B CN114867225 B CN 114867225B
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- rotating
- groove
- circuit board
- integrated circuit
- fixedly connected
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- 239000000428 dust Substances 0.000 claims abstract description 48
- 230000005540 biological transmission Effects 0.000 claims description 16
- 230000005611 electricity Effects 0.000 claims 2
- 230000003068 static effect Effects 0.000 claims 2
- 210000003437 trachea Anatomy 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 238000010586 diagram Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 206010063385 Intellectualisation Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
- B08B15/04—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area from a small area, e.g. a tool
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/04—Cleaning by suction, with or without auxiliary action
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B6/00—Cleaning by electrostatic means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cleaning In General (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention discloses a chip mounting device for integrated circuit processing, and belongs to the field of integrated circuit processing. The utility model provides a paster device is used in integrated circuit processing, includes work main part, circuit board, work main part one side fixedly connected with backup pad, backup pad lower extreme fixedly connected with multiunit supporting leg, rotate in the backup pad and be connected with the rotation piece, just rotate a part and rotate in the work main part, be equipped with multiunit standing groove on the rotation piece, circuit board and standing groove assorted, just the surface that the standing groove contacted with the circuit board is connected with the rubber pad, all rotate in backup pad, the work main part and be connected with multiunit supporting ball; according to the invention, dust on the circuit board is conveniently sucked through the working cavity, the rotating main shaft, the first rotating fan blade and the dust suction opening, and the circuit board is conveniently adsorbed in the placing groove through the sliding rod, the stop block, the baffle plate, the sliding groove and the thrust spring, so that dust on the circuit board is conveniently removed.
Description
Technical Field
The invention relates to the technical field of integrated circuit processing, in particular to a patch device for integrated circuit processing.
Background
The integrated circuit is a miniature electronic device or component, and adopts a certain process to interconnect elements such as transistors, resistors, capacitors, inductors and the like required by a circuit together, and the elements and wirings are manufactured on a small semiconductor wafer or a medium substrate or a plurality of small semiconductor wafers, and then the semiconductor wafer or the medium substrate is packaged in a tube shell to form a miniature structure with the required circuit function, wherein all the elements are structurally combined into a whole, so that the electronic element has a great step towards microminiaturization, low power consumption, intellectualization and high reliability;
At present, a chip mounter is needed when the integrated circuit board is subjected to chip mounting operation, but the cleanliness of the circuit board before chip mounting possibly cannot meet the requirement, dust needs to be removed from the surface of the circuit board, but the prior art lacks a structure for cleaning dust on the surface of the integrated circuit board, and therefore a chip mounting device for integrated circuit processing is provided.
Disclosure of Invention
The invention aims to solve the problem that the prior art lacks a structure for cleaning dust on the surface of an integrated circuit board, and provides a patch device for integrated circuit processing.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
The utility model provides a paster device is used in integrated circuit processing, includes work main part, circuit board, work main part one side fixedly connected with backup pad, backup pad lower extreme fixedly connected with multiunit supporting leg, rotate in the backup pad and be connected with the rotation piece, just rotate a part and rotate in the work main part, be equipped with multiunit standing groove on the rotation piece, circuit board and standing groove assorted, just the surface connection that standing groove contacted with the circuit board has the rubber pad, all rotate in backup pad, the work main part and be connected with multiunit supporting ball, supporting ball pastes with the rotation piece, all rotate in backup pad, the work main part and be connected with the leading wheel, be equipped with the ring channel with leading wheel assorted on the rotation piece, work main part both sides are equipped with the connector, connector and rotation piece assorted, the connector upper end is connected with the electrostatic plate, the electrostatic plate is used for adsorbing the dust in the air, work main part upper end is connected with dust collection unit, the dust collection unit is used for inhaling on the circuit board, work main part in-connection transmission part, transmission part and transmission part phase connection, transmission part and rotation part are used for carrying out fixed connection with the rotation piece.
Preferably, the dust collection component comprises a placement box, a driving motor is connected in the placement box, a rotating main shaft is fixedly connected to the output end of the driving motor, a working cavity is formed in the upper end of the working main body, the rotating main shaft penetrates through the working cavity, a plurality of groups of first rotating fan blades are fixedly connected to the rotating main shaft, a dust collection opening is formed in the lower end of the working cavity, and the dust collection opening is matched with the circuit board.
Preferably, the transmission part comprises a rotating groove, one side of the rotating groove is connected with a main air pipe, and one end of the main air pipe, which is far away from the rotating groove, is matched with the working cavity.
Preferably, the rotating groove is rotationally connected with a first rotating shaft, a second rotating fan blade is fixedly connected to the first rotating shaft, and the second rotating fan blade is matched with the rotating groove.
Preferably, the upper end of the first rotating shaft is rotationally connected with a second rotating shaft, the second rotating shaft is perpendicular to the first rotating shaft, a rotating gear and a second bevel gear are fixedly connected to the second rotating shaft, a first bevel gear is fixedly connected to one end, close to the second rotating shaft, of the first rotating shaft, and the first bevel gear is meshed with the second bevel gear.
Preferably, the lower end of the rotating member is connected with a driving tooth, and the driving tooth is meshed with the rotating gear.
Preferably, the fixing part comprises a sliding rod, a plurality of groups of air suction holes are formed in the lower end of the placing groove, an air suction groove is formed in the lower end of the air suction holes, the air suction groove is communicated with the air suction holes, and the air suction groove is perpendicular to the air suction holes.
Preferably, the sliding rod runs through the air suction groove, fixedly connected with dog on the sliding rod, dog and air suction groove sliding connection just dog and air suction hole assorted, be equipped with on the work main part with sliding rod assorted arc groove, be equipped with the sliding groove on the rotating member, fixedly connected with baffle on the sliding rod, thrust spring has been cup jointed on the sliding rod, thrust spring both ends respectively with baffle, rotating member fixed connection.
Preferably, one side of the rotating groove far away from the main air pipe is connected with an exhaust pipe, one side close to the exhaust pipe is provided with a water groove, the exhaust pipe is connected with the water groove, one side of the water groove far away from the exhaust pipe is connected with a connecting pipe, one end of the connecting pipe far away from the water groove is connected with a placing box, and the upper end of the placing box is connected with an air outlet pipe.
Compared with the prior art, the invention provides a patch device for integrated circuit processing, which has the following beneficial effects:
1. according to the patch device for integrated circuit processing, the circuit boards are placed in the placing grooves, multiple groups of circuit boards can be placed in the placing grooves simultaneously, so that the device can work continuously, the working efficiency is improved, the first rotating fan blades rotate, air in the working cavity is blown out, the pressure in the working cavity is reduced, the air is sucked through the dust suction openings, and meanwhile dust on the circuit boards is sucked away simultaneously due to the suction effect;
2. The surface mount device for integrated circuit processing is characterized in that air blown out by a first rotating fan blade enters a rotating groove through a main air pipe, the second rotating fan blade in the rotating groove rotates under the pushing of the air, the rotation is transmitted to a first rotating shaft through the second rotating fan blade, the upper end of the first rotating shaft is connected with a first bevel gear, the rotation is transmitted to a second rotating shaft through the second bevel gear, the rotating gear is fixedly connected with the second rotating shaft, the rotating gear is further rotated, and the rotating gear is further connected with a rotating piece through a fixed tooth, so that the rotation is transmitted to the rotating piece, and the rotating piece is rotated;
3. According to the paster device for integrated circuit processing, when the rotating piece rotates, a circuit board is sent into the working body, when the circuit board passes through the connecting port, dust on the circuit board is primarily adsorbed and removed under the action of electrostatic adsorption of the electrostatic board, meanwhile, dust in air of the electrostatic board is adsorbed, the dust in the air is prevented from entering the working body, the cleanness in the working body is ensured, when the circuit board enters the working body, the sliding rod slides under the blocking of the arc-shaped groove, the sliding rod slides, the stop block further slides, the space of one side, close to the air suction hole, of the sliding groove is increased, the pressure is reduced, the upper surface and the lower surface of the circuit board generate pressure difference, the circuit board is firmly connected in the placing groove under the action of the pressure difference, so that the circuit board is conveniently fixed when dust is sucked to the circuit board, and the circuit board is prevented from moving;
4. This paster device is used in integrated circuit processing, gas get into the basin through rotating the inslot, collect the dust in the gas, and exhaust gas gets into through the connecting pipe simultaneously and places the incasement, cools down driving motor, guarantees driving motor can normal work.
The device has the advantages that the parts which are not involved in the device are the same as or can be realized by adopting the prior art, dust on the circuit board is conveniently sucked and removed through the working cavity, the rotating main shaft, the first rotating fan blade and the dust suction opening, and the circuit board is conveniently adsorbed in the placing groove through the sliding rod, the stop block, the baffle plate, the sliding groove and the thrust spring, so that dust is conveniently removed from the circuit board.
Drawings
FIG. 1 is a schematic diagram of a side-view cross-sectional structure of a chip mounter for integrated circuit processing according to the present invention;
FIG. 2 is a schematic side view of an IC chip mounting apparatus according to the present invention;
FIG. 3 is a schematic top cross-sectional view of an IC chip mounting apparatus according to the present invention;
FIG. 4 is a schematic diagram of a first rotary blade of a chip mounter for IC processing according to the present invention;
fig. 5 is a schematic structural diagram of a portion a in fig. 1 of a chip mounter for processing an integrated circuit according to the present invention;
Fig. 6 is a schematic structural diagram of a portion B of fig. 1 of a chip mounter for processing an integrated circuit according to the present invention.
In the figure: 1. a working body; 101. a support plate; 102. support legs; 2. a circuit board; 3. a driving motor; 301. a working chamber; 302. rotating the main shaft; 303. a first rotating fan blade; 304. a main air pipe; 305. a dust collection port; 306. placing a box; 4. a rotating member; 401. a placement groove; 402. an air suction hole; 403. an air suction groove; 404. a slide bar; 405. a stop block; 407. a baffle; 408. a sliding groove; 409. a thrust spring; 5. a rotating groove; 501. a second rotating fan blade; 502. a first rotating shaft; 503. a second rotating shaft; 504. rotating the gear; 505. a first helical gear; 506. a second helical gear; 507. an exhaust pipe; 6. a water tank; 601. a connecting pipe; 602. an air outlet pipe; 7. supporting the balls; 8. a guide wheel; 9. a connection port; 901. an electrostatic plate.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
In the description of the present invention, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Example 1:
Referring to fig. 1-6, a paster device for integrated circuit processing comprises a working main body 1 and a circuit board 2, wherein one side of the working main body 1 is fixedly connected with a supporting plate 101, the lower end of the supporting plate 101 is fixedly connected with a plurality of groups of supporting legs 102, the supporting plate 101 is rotationally connected with a rotating part 4, the rotating part 4 is partially rotated in the working main body 1, a plurality of groups of placing grooves 401 are formed in the rotating part 4, the circuit board 2 is matched with the placing grooves 401, the surface of the placing grooves 401, which is contacted with the circuit board 2, is connected with a rubber pad, a plurality of groups of supporting balls 7 are rotationally connected in the supporting plate 101 and the working main body 1, the supporting balls 7 are attached to the rotating part 4, guide wheels 8 are rotationally connected in the supporting plate 101 and the working main body 1, annular grooves matched with the guide wheels 8 are formed in the rotating part 4, connecting ports 9 are formed in two sides of the working main body 1, the connecting ports 9 are matched with the rotating part 4, an electrostatic plate 901 is connected to the upper end of the connecting ports, the electrostatic plate 901 is used for absorbing dust in the air, the upper end of the working main body 1 is connected with a dust absorbing part used for absorbing dust on the circuit board 2, the lower end of the working main body 1 is connected with a transmission part, the transmission part is connected with the transmission part, and the transmission part is connected with the transmission part 4 for fixing the rotation part and the transmission part 4.
When the device is used, the circuit board 2 is firstly placed in the placing groove 401, and because the placing groove 401 is provided with a plurality of groups, the circuit board 2 can be simultaneously placed in a plurality of groups, so that the device can continuously work, the working efficiency is improved, the driving motor 3 is started, the driving motor 3 rotates to drive the rotating main shaft 302 to rotate, and because the rotating main shaft 302 is fixedly connected with a plurality of groups of first rotating fan blades 303, when the first rotating fan blades 303 rotate, air in the working cavity 301 is blown out, the pressure in the working cavity 301 is reduced, the air is sucked through the dust suction port 305, and meanwhile, dust on the circuit board 2 is sucked away simultaneously due to the action of suction force;
The air blown by the first rotating fan blade 303 enters the rotating groove 5 through the main air pipe 304, the second rotating fan blade 501 in the rotating groove 5 rotates under the pushing of the air, the rotation is transmitted to the first rotating shaft 502 through the second rotating fan blade 501, the upper end of the first rotating shaft 502 is connected with the first bevel gear 505, the rotation is transmitted to the second rotating shaft 503 through the second bevel gear 506, the rotating gear 504 is fixedly connected with the second rotating shaft 503, the rotating gear 504 is further rotated, and the rotating gear 504 is further connected with the rotating piece 4 through the fixed teeth, so that the rotation is transmitted to the rotating piece 4, and the rotating piece is rotated;
When the rotating piece 4 rotates, the circuit board 2 is sent into the working main body 1, when the circuit board 2 passes through the connecting port 9, dust on the circuit board 2 is primarily adsorbed and removed under the action of electrostatic adsorption of the electrostatic plate 901, meanwhile, dust in air of the electrostatic plate 901 is adsorbed, the dust in the air is prevented from entering the working main body 1, the cleanness in the working main body 1 is ensured, when the circuit board 2 enters the working main body 1, the sliding rod 404 slides under the blocking of the arc-shaped groove, the sliding rod 404 slides, the stop block 405 slides, the space of one side of the sliding groove 408 close to the air suction hole 402 is increased, the pressure intensity is reduced, the upper surface and the lower surface of the circuit board 2 are subjected to pressure difference, the circuit board 2 is firmly connected in the placing groove 401 under the action of the pressure difference, and the circuit board 2 is conveniently fixed, and the circuit board 2 is prevented from moving when the circuit board 2 is subjected to dust suction;
The gas passes through the rotating groove 5 and enters the water groove 6 to collect dust in the gas, and meanwhile, the discharged gas enters the placing box 306 through the connecting pipe 601 to cool the driving motor 3, so that the driving motor 3 can work normally.
Example 2:
Referring to fig. 1 to 3, a chip mounter for integrated circuit processing is substantially the same as in embodiment 1, and further: the dust collection component comprises a placing box 306, a driving motor 3 is connected in the placing box 306, the output end of the driving motor 3 is fixedly connected with a rotating main shaft 302, a working cavity 301 is arranged at the upper end of the working main body 1, the rotating main shaft 302 penetrates through the working cavity 301, a plurality of groups of first rotating fan blades 303 are fixedly connected to the rotating main shaft 302, a dust collection opening 305 is formed in the lower end of the working cavity 301, the dust collection opening 305 is matched with the circuit board 2, and dust on the circuit board 2 is conveniently removed.
Example 3:
referring to fig. 1, a chip mounter for integrated circuit processing is substantially the same as in embodiment 1, and further: the transmission part comprises a rotary groove 5, one side of the rotary groove 5 is connected with a main air pipe 304, and one end, far away from the rotary groove 5, of the main air pipe 304 is matched with the working cavity 301, so that air can be conveniently introduced into the rotary groove 5.
Example 4:
Referring to fig. 1 and 4, a chip mounter for integrated circuit processing is substantially the same as in embodiment 1, and further includes: the first rotating shaft 502 is connected to the rotating groove 5 in a rotating mode, the second rotating fan blades 501 are fixedly connected to the first rotating shaft 502, and the second rotating fan blades 501 are matched with the rotating groove 5 and are convenient to enable the first rotating shaft 502 to rotate.
Example 5:
referring to fig. 1, a chip mounter for integrated circuit processing is substantially the same as in embodiment 1, and further: the upper end of the first rotating shaft 502 is rotationally connected with a second rotating shaft 503, the second rotating shaft 503 is perpendicular to the first rotating shaft 502, a rotating gear 504 and a second bevel gear 506 are fixedly connected to the second rotating shaft 503, one end of the first rotating shaft 502, which is close to the second rotating shaft 503, is fixedly connected with a first bevel gear 505, and the first bevel gear 505 is meshed with the second bevel gear 506, so that the rotating gear 504 can conveniently rotate.
Example 6:
Referring to fig. 1 and 6, a chip mounter for integrated circuit processing is substantially the same as in embodiment 1, and further includes: the lower end of the rotating member 4 is connected with a driving gear, which is meshed with the rotating gear 504, so as to transmit rotation to the rotating member 4.
Example 7:
referring to fig. 1-2, a chip mounter for integrated circuit processing is substantially the same as in embodiment 1, and further: the fixed part includes slide bar 404, and the standing groove 401 lower extreme is equipped with multiunit suction port 402, and suction port 402 lower extreme is equipped with suction groove 403, and suction groove 403 is linked together with suction port 402, and suction groove 403 and suction port 402 mutually perpendicular are convenient for circuit board 2 is fixed.
Example 8:
Referring to fig. 1, 2 and 5, a chip mounter for integrated circuit processing is basically the same as in embodiment 1, and further includes: the sliding rod 404 runs through the air suction groove 403, a stop block 405 is fixedly connected to the sliding rod 404, the stop block 405 is in sliding connection with the air suction groove 403, the stop block 405 is matched with the air suction hole 402, an arc-shaped groove matched with the sliding rod 404 is arranged on the working main body 1, a sliding groove 408 is arranged on the rotating piece 4, a baffle 407 is fixedly connected to the sliding rod 404, a thrust spring 409 is sleeved on the sliding rod 404, and two ends of the thrust spring 409 are fixedly connected with the baffle 407 and the rotating piece 4 respectively, so that the circuit board 2 is conveniently fixed.
Example 9:
Referring to fig. 1, a chip mounter for integrated circuit processing is substantially the same as in embodiment 1, and further: one side of the rotating groove 5 far away from the main air pipe 304 is connected with an exhaust pipe 507, one side close to the exhaust pipe 507 is provided with a water tank 6, the exhaust pipe 507 is connected with the water tank 6, one side of the water tank 6 far away from the exhaust pipe 507 is connected with a connecting pipe 601, one end of the connecting pipe 601 far away from the water tank 6 is connected with a placing box 306, the upper end of the placing box 306 is connected with an air outlet pipe 602, and cooling of the driving motor 3 is facilitated.
In the invention, dust on the circuit board 2 is conveniently sucked and removed through the working cavity 301, the rotating main shaft 302, the first rotating fan blade 303 and the dust collection opening 305, and the circuit board 2 is conveniently adsorbed in the placing groove 401 through the sliding rod 404, the stop block 405, the baffle 407, the sliding groove 408 and the thrust spring 409, so that dust collection is conveniently carried out on the circuit board 2.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (9)
1. The utility model provides a paster device for integrated circuit processing, includes work main part (1), circuit board (2), its characterized in that, work main part (1) one side fixedly connected with backup pad (101), backup pad (101) lower extreme fixedly connected with multiunit supporting leg (102), rotate on backup pad (101) and be connected with rotor (4), just rotor (4) part rotates in work main part (1), be equipped with multiunit standing groove (401) on rotor (4), circuit board (2) and standing groove (401) assorted, just the surface that standing groove (401) contacted with circuit board (2) is connected with the rubber pad, all rotate in backup pad (101), work main part (1) and be connected with multiunit supporting ball (7), supporting ball (7) and rotor (4) phase-match, all rotate in backup pad (101), work main part (1) and be connected with leading wheel (8) phase-match, work main part (1) both sides are equipped with multiunit standing groove (401), connector (9) and connector (901) are connected with static electricity absorbing plate (901) in connecting port (9) and connecting port (901) are connected with static electricity absorbing plate (9), the dust collection device is characterized in that the upper end of the working main body (1) is connected with a dust collection part, the dust collection part is used for sucking dust on the circuit board (2), the lower end of the working main body (1) is connected with a transmission part, the transmission part is connected with the dust collection part, the transmission part is used for transmitting rotation to the rotating part (4), a fixing part is connected in the rotating part (4), and the fixing part is used for fixing the circuit board (2).
2. The chip mounter for integrated circuit processing according to claim 1, wherein the dust collection component comprises a placement box (306), a driving motor (3) is connected in the placement box (306), an output end of the driving motor (3) is fixedly connected with a rotating main shaft (302), a working cavity (301) is arranged at the upper end of the working main body (1), the rotating main shaft (302) penetrates through the working cavity (301), a plurality of groups of first rotating fan blades (303) are fixedly connected to the rotating main shaft (302), a dust collection opening (305) is formed in the lower end of the working cavity (301), and the dust collection opening (305) is matched with the circuit board (2).
3. The chip mounter for integrated circuit processing according to claim 1, wherein said transmission member comprises a rotary groove (5), one side of said rotary groove (5) is connected with a main air pipe (304), and one end of said main air pipe (304) away from said rotary groove (5) is matched with said working chamber (301).
4. A chip mounter for integrated circuit processing according to claim 3, wherein said rotating groove (5) is rotatably connected with a first rotating shaft (502), a second rotating fan blade (501) is fixedly connected to said first rotating shaft (502), and said second rotating fan blade (501) is matched with said rotating groove (5).
5. The chip mounter for integrated circuit processing according to claim 4, wherein a second rotating shaft (503) is rotatably connected to an upper end of the first rotating shaft (502), the second rotating shaft (503) is vertically arranged with the first rotating shaft (502), a rotating gear (504) and a second bevel gear (506) are fixedly connected to the second rotating shaft (503), a first bevel gear (505) is fixedly connected to one end, close to the second rotating shaft (503), of the first rotating shaft (502), and the first bevel gear (505) is meshed with the second bevel gear (506).
6. The chip mounter for integrated circuit processing according to claim 5, wherein said rotary member (4) has a lower end connected with a driving tooth, said driving tooth being engaged with a rotary gear (504).
7. The chip mounter for integrated circuit processing according to claim 1, wherein said fixing member comprises a slide bar (404), a plurality of groups of suction holes (402) are provided at a lower end of said placement groove (401), a suction groove (403) is provided at a lower end of said suction holes (402), said suction groove (403) is communicated with said suction holes (402), and said suction groove (403) is perpendicular to said suction holes (402).
8. The surface mount device for integrated circuit processing according to claim 7, wherein the sliding rod (404) penetrates through the air suction groove (403), a stop block (405) is fixedly connected to the sliding rod (404), the stop block (405) is slidably connected to the air suction groove (403), the stop block (405) is matched with the air suction hole (402), an arc-shaped groove matched with the sliding rod (404) is formed in the working body (1), a sliding groove (408) is formed in the rotating member (4), a baffle (407) is fixedly connected to the sliding rod (404), a thrust spring (409) is sleeved on the sliding rod (404), and two ends of the thrust spring (409) are fixedly connected with the baffle (407) and the rotating member (4) respectively.
9. A chip mounter for integrated circuit processing according to claim 3, characterized in that, one side of rotating groove (5) far away from main trachea (304) is connected with blast pipe (507), is close to one side of blast pipe (507) is equipped with basin (6), blast pipe (507) are connected with basin (6), one side of basin (6) far away from blast pipe (507) is connected with connecting pipe (601), one end of connecting pipe (601) far away from basin (6) is connected with placing box (306), placing box (306) upper end is connected with outlet duct (602).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110166157.1A CN114867225B (en) | 2021-02-03 | 2021-02-03 | Chip mounting device for integrated circuit processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110166157.1A CN114867225B (en) | 2021-02-03 | 2021-02-03 | Chip mounting device for integrated circuit processing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114867225A CN114867225A (en) | 2022-08-05 |
| CN114867225B true CN114867225B (en) | 2024-05-28 |
Family
ID=82627683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110166157.1A Active CN114867225B (en) | 2021-02-03 | 2021-02-03 | Chip mounting device for integrated circuit processing |
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| JPH0637460A (en) * | 1992-07-14 | 1994-02-10 | Hitachi Ltd | Dust cleaner for print-circuit board |
| JP2005152717A (en) * | 2003-11-21 | 2005-06-16 | Audio Technica Corp | Dust removing apparatus |
| WO2008084795A1 (en) * | 2007-01-11 | 2008-07-17 | Nix, Inc. | Dust removal device |
| JP2010171264A (en) * | 2009-01-23 | 2010-08-05 | Aisin Seiki Co Ltd | Apparatus for removing foreign matter of printed circuit board |
| CN211802800U (en) * | 2020-02-25 | 2020-10-30 | 东莞市鼎新电路有限公司 | Integrated circuit board dust collector for integrated circuit test |
| CN211860690U (en) * | 2020-01-13 | 2020-11-03 | 中山市文成电路板有限公司 | PCB circuit board dust collector |
| CN112040667A (en) * | 2020-09-06 | 2020-12-04 | 刘德远 | Paster device for integrated circuit processing |
| CN112055471A (en) * | 2020-09-18 | 2020-12-08 | 张利琴 | Integrated circuit production equipment with dust removal function |
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2021
- 2021-02-03 CN CN202110166157.1A patent/CN114867225B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0637460A (en) * | 1992-07-14 | 1994-02-10 | Hitachi Ltd | Dust cleaner for print-circuit board |
| JP2005152717A (en) * | 2003-11-21 | 2005-06-16 | Audio Technica Corp | Dust removing apparatus |
| WO2008084795A1 (en) * | 2007-01-11 | 2008-07-17 | Nix, Inc. | Dust removal device |
| JP2010171264A (en) * | 2009-01-23 | 2010-08-05 | Aisin Seiki Co Ltd | Apparatus for removing foreign matter of printed circuit board |
| CN211860690U (en) * | 2020-01-13 | 2020-11-03 | 中山市文成电路板有限公司 | PCB circuit board dust collector |
| CN211802800U (en) * | 2020-02-25 | 2020-10-30 | 东莞市鼎新电路有限公司 | Integrated circuit board dust collector for integrated circuit test |
| CN112040667A (en) * | 2020-09-06 | 2020-12-04 | 刘德远 | Paster device for integrated circuit processing |
| CN112055471A (en) * | 2020-09-18 | 2020-12-08 | 张利琴 | Integrated circuit production equipment with dust removal function |
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| CN114867225A (en) | 2022-08-05 |
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