CN114769941A - Water-soluble aluminum-silicon soldering paste and preparation method thereof - Google Patents
Water-soluble aluminum-silicon soldering paste and preparation method thereof Download PDFInfo
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- CN114769941A CN114769941A CN202210448366.XA CN202210448366A CN114769941A CN 114769941 A CN114769941 A CN 114769941A CN 202210448366 A CN202210448366 A CN 202210448366A CN 114769941 A CN114769941 A CN 114769941A
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- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 title claims abstract description 89
- 238000005476 soldering Methods 0.000 title claims abstract description 50
- 238000002360 preparation method Methods 0.000 title abstract description 13
- 238000005219 brazing Methods 0.000 claims abstract description 76
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 62
- 239000000843 powder Substances 0.000 claims abstract description 44
- 229910000676 Si alloy Inorganic materials 0.000 claims abstract description 43
- 230000004907 flux Effects 0.000 claims abstract description 40
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims abstract description 30
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229920000058 polyacrylate Polymers 0.000 claims abstract description 25
- 239000000178 monomer Substances 0.000 claims abstract description 23
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 15
- 239000002904 solvent Substances 0.000 claims abstract description 13
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 9
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 8
- 238000007334 copolymerization reaction Methods 0.000 claims abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 26
- 229910052782 aluminium Inorganic materials 0.000 claims description 25
- 229910000679 solder Inorganic materials 0.000 claims description 23
- XJHCXCQVJFPJIK-UHFFFAOYSA-M caesium fluoride Chemical compound [F-].[Cs+] XJHCXCQVJFPJIK-UHFFFAOYSA-M 0.000 claims description 20
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 claims description 20
- 238000002156 mixing Methods 0.000 claims description 20
- NROKBHXJSPEDAR-UHFFFAOYSA-M potassium fluoride Chemical compound [F-].[K+] NROKBHXJSPEDAR-UHFFFAOYSA-M 0.000 claims description 20
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 14
- 229910052700 potassium Inorganic materials 0.000 claims description 14
- 239000011591 potassium Substances 0.000 claims description 14
- IRPGOXJVTQTAAN-UHFFFAOYSA-N 2,2,3,3,3-pentafluoropropanal Chemical compound FC(F)(F)C(F)(F)C=O IRPGOXJVTQTAAN-UHFFFAOYSA-N 0.000 claims description 10
- KLZUFWVZNOTSEM-UHFFFAOYSA-K Aluminum fluoride Inorganic materials F[Al](F)F KLZUFWVZNOTSEM-UHFFFAOYSA-K 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 235000003270 potassium fluoride Nutrition 0.000 claims description 10
- 239000011698 potassium fluoride Substances 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 8
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 claims description 7
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 7
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims description 7
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 claims description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 6
- -1 aluminum-silicon-zinc Chemical compound 0.000 claims description 6
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 claims description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 4
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 4
- 229910052792 caesium Inorganic materials 0.000 claims description 4
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 claims description 4
- GNSFRPWPOGYVLO-UHFFFAOYSA-N 3-hydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCO GNSFRPWPOGYVLO-UHFFFAOYSA-N 0.000 claims description 3
- KTZVZZJJVJQZHV-UHFFFAOYSA-N 1-chloro-4-ethenylbenzene Chemical compound ClC1=CC=C(C=C)C=C1 KTZVZZJJVJQZHV-UHFFFAOYSA-N 0.000 claims description 2
- JZHGRUMIRATHIU-UHFFFAOYSA-N 1-ethenyl-3-methylbenzene Chemical compound CC1=CC=CC(C=C)=C1 JZHGRUMIRATHIU-UHFFFAOYSA-N 0.000 claims description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 claims description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 claims description 2
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 claims description 2
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 claims description 2
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 claims description 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 claims description 2
- 229910000861 Mg alloy Inorganic materials 0.000 claims description 2
- 239000002202 Polyethylene glycol Substances 0.000 claims description 2
- UYFXWCIZFDKSTJ-UHFFFAOYSA-J aluminum;cesium;tetrafluoride Chemical compound [F-].[F-].[F-].[F-].[Al+3].[Cs+] UYFXWCIZFDKSTJ-UHFFFAOYSA-J 0.000 claims description 2
- 239000003125 aqueous solvent Substances 0.000 claims description 2
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 claims description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 claims description 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 2
- 235000013024 sodium fluoride Nutrition 0.000 claims description 2
- 239000011775 sodium fluoride Substances 0.000 claims description 2
- KMWBBMXGHHLDKL-UHFFFAOYSA-N [AlH3].[Si] Chemical compound [AlH3].[Si] KMWBBMXGHHLDKL-UHFFFAOYSA-N 0.000 claims 1
- 239000004411 aluminium Substances 0.000 claims 1
- 238000003860 storage Methods 0.000 abstract description 5
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 238000003756 stirring Methods 0.000 description 27
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 20
- 238000003466 welding Methods 0.000 description 19
- 238000000498 ball milling Methods 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 11
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 7
- 239000000945 filler Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000003723 Smelting Methods 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 238000009690 centrifugal atomisation Methods 0.000 description 6
- 230000006698 induction Effects 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 230000036571 hydration Effects 0.000 description 5
- 238000006703 hydration reaction Methods 0.000 description 5
- 239000003999 initiator Substances 0.000 description 5
- 230000007935 neutral effect Effects 0.000 description 5
- 238000010992 reflux Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000032798 delamination Effects 0.000 description 3
- 238000004062 sedimentation Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229920006222 acrylic ester polymer Polymers 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000002674 ointment Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 235000015842 Hesperis Nutrition 0.000 description 1
- 235000012633 Iberis amara Nutrition 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Nonmetallic Welding Materials (AREA)
Abstract
The invention discloses a water-soluble aluminum-silicon soldering paste and a preparation method thereof, wherein the water-soluble aluminum-silicon soldering paste comprises the following components: 45-65 wt% of aluminum-silicon alloy brazing powder, 5-35 wt% of fluoride brazing flux and 10-45 wt% of aqueous paste forming body; wherein the aqueous paste-forming body comprises: 5-30 wt% of water-based acrylate polymer and 70-95 wt% of water-based solvent; the water-based acrylate polymer is obtained by copolymerization reaction of an acrylate monomer, a hydroxyl-containing acrylate hydrophilic monomer and a styrene hydrophobic monomer. The water-soluble aluminum-silicon soldering paste and the preparation method thereof provided by the invention have the advantages that the water-soluble aluminum-silicon soldering paste has environmental protection and storage stability, and meanwhile, the solderability of the soldering paste can be effectively improved.
Description
Technical Field
The invention belongs to the technical field of welding materials, and particularly relates to a water-soluble aluminum-silicon soldering paste and a preparation method thereof.
Background
Aluminum and aluminum alloys are widely applied to industries in various fields such as artificial satellites, rockets, missiles, airplanes, automobile water tanks, air-conditioning radiators and the like due to small density, high thermal conductivity and high electrical conductivity, and accordingly welding among aluminum, aluminum alloys and stainless steel is more and more involved. The traditional aluminum welding material is matched with powdered brazing flux and powdered, filamentous, foil-shaped and sheet-shaped brazing filler metals for use. However, with the development of the times and the progress of science and technology, the types of products to be welded are increasing, and the miniaturization of welding workpieces, the irregularity and diversification of joint forms, the automation of welding processes and the like become popular and trends gradually. The traditional welding material can not meet the requirements of modern welding, and on the basis of the traditional welding material, the aluminum soldering paste integrates aluminum soldering flux, aluminum brazing filler metal and paste forming body, has the characteristics of convenience, flexibility and high efficiency, and is produced at the right moment.
The aluminum brazing flux is mainly used for removing chemical auxiliary effect of oxide skin on the surfaces of the base metal and the aluminum brazing filler metal; the aluminum brazing filler metal is mainly used for realizing the main body welding effect of firm metallurgical connection of two base metals. The two are matched for use, but one is not necessary, the aluminum brazing flux acts in the front, and the aluminum brazing filler metal acts in the back. The paste body is a bridge and a link which are connected with aluminum brazing filler metal and aluminum soldering flux. The finished paste body should meet the following conditions: the paste can well combine the aluminum soldering flux and the aluminum solder together, stably coexist with the aluminum soldering flux and the solder, and do not generate chemical reaction; the ointment has no pungent smell and is suitable for factory operation; the paste is easy to volatilize before the aluminum soldering flux and the brazing filler metal are melted; the paste is not deposited with carbon and has no residue after volatilization or firing.
The traditional oily or solvent-based paste forming body takes oily organic matters as a carrier, and the oily or solvent-based paste forming body is oily and can cause environmental sanitation and difficult cleaning; smoke is generated during heating and welding, so that the environment is not protected; the cracking is difficult to be complete, and carbon deposition can be remained after welding. Although the aqueous paste-forming body can avoid using organic matters and is very environment-friendly, the aqueous paste-forming body has two defects: water cannot effectively bond the aluminum brazing flux solder together due to low viscosity; if water is used as a carrier, the powdered aluminum solder can react with water chemically due to the chemical activity of the powdered aluminum solder, so that the oxide skin of the aluminum solder is thickened, and the welding quality is affected.
Disclosure of Invention
Based on the technical problems, the invention provides the water-soluble aluminum-silicon soldering paste and the preparation method thereof, and the water-soluble aluminum-silicon soldering paste has environmental protection property and storage stability and can effectively improve the solderability of the soldering paste.
The invention provides a water-soluble aluminum-silicon soldering paste, which comprises the following components: 45-65 wt% of aluminum-silicon alloy brazing powder, 5-35 wt% of fluoride brazing flux and 10-45 wt% of aqueous paste;
wherein the aqueous paste-forming body comprises: 5-30 wt% of water-based acrylate polymer and 70-95 wt% of water-based solvent;
the water-based acrylate polymer is obtained by copolymerization reaction of an acrylate monomer, a hydroxyl-containing acrylate hydrophilic monomer and a styrene hydrophobic monomer.
In the soldering paste, the water-based paste forming body consists of the water-based acrylate polymer and the water-based solvent, and the water-based acrylate polymer comprises the hydroxyl-containing acrylate hydrophilic monomer and the styrene hydrophobic monomer, so that the water-based acrylate polymer has the amphiphilic characteristics of hydrophilicity and lipophilicity, and on one hand, the polar hydrophilic hydroxyl group and the aluminum-silicon alloy powder form effective affinity, so that the aluminum-silicon alloy brazing powder can be coated, the aluminum-silicon alloy brazing powder is favorably dispersed in the water-based solvent, and the contact between the aluminum-silicon alloy brazing powder and the water-based solvent or water can be prevented, so that the aluminum-silicon alloy brazing powder is prevented from reacting with the water, and higher storage stability is obtained; on the other hand, the water-based acrylate polymer with the amphiphilic characteristics of hydrophilicity and lipophilicity can be used for preparing the soldering paste with proper viscosity and rheological property in water, so that the aluminum-silicon alloy brazing powder and the fluoride brazing flux are prevented from layering, higher sedimentation resistance is obtained, and the stable welding quality is ensured.
Preferably, the mass ratio of the acrylate monomer, the hydroxyl-containing acrylate hydrophilic monomer and the styrene hydrophobic monomer is 3-6:1-2: 1-4.
According to the invention, the viscosity of the paste body can be better ensured by the water-based acrylic polymer in the content proportion, and the welding performance of the aluminum-silicon soldering paste prepared from the paste body can be effectively improved.
Preferably, the acrylate monomer is at least one of methyl acrylate, ethyl acrylate, n-butyl acrylate, isobutyl acrylate, methyl methacrylate, ethyl methacrylate, n-butyl methacrylate or glycidyl methacrylate; the hydroxyl-containing acrylate hydrophilic monomer is at least one of hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate, hydroxypropyl methacrylate or polyethylene glycol methacrylate; the styrene hydrophobic monomer is at least one of styrene, p-methylstyrene, m-methylstyrene or p-chlorostyrene.
Preferably, the aqueous solvent is at least one of water, ethanol, propanol, isopropanol, ethylene glycol, propylene glycol, glycerol, ethylene glycol methyl ether or ethylene glycol butyl ether.
Preferably, the aluminum-silicon alloy brazing powder is at least one of an aluminum-silicon alloy, an aluminum-silicon-zinc alloy, an aluminum-silicon-magnesium alloy or an aluminum-silicon-copper alloy;
preferably, the aluminum-silicon alloy brazing powder is at least one of aluminum-12 silicon alloy, aluminum-10 silicon alloy or aluminum-10 silicon-1 zinc alloy.
Preferably, the fluoride based flux is at least one of potassium fluoroaluminate, potassium fluoride, aluminum fluoride, lithium fluoride, sodium fluoride, cesium fluoride, potassium fluoroaluminate-cesium complex, cesium fluoroaluminate, potassium fluorozincate, or cesium fluorozincate.
Preferably, the fluoride based flux comprises: 25-40 wt% of aluminum fluoride, 25-30 wt% of potassium fluoride, 5-10 wt% of lithium fluoride, 10-25 wt% of potassium fluoroaluminate and 10-20 wt% of cesium fluoride.
In the invention, the aluminum-silicon alloy brazing powder and the fluoride brazing flux with specific proportion and content are controlled, so that the effects of the brazing powder and the brazing flux are better exerted, and the quality of a welded product is greatly improved.
The invention provides a preparation method of water-soluble aluminum-silicon soldering paste, which comprises the following steps: and uniformly mixing the aluminum-silicon alloy brazing powder, fluoride brazing flux and aqueous paste according to a designed proportion to obtain the water-soluble aluminum-silicon soldering paste.
The invention also provides an application of the water-soluble aluminum-silicon soldering paste in the brazing of aluminum products.
Preferably, the application comprises: and coating the soldering paste on the aluminum product, and heating after assembly.
Compared with the prior art, the invention has the following beneficial effects:
(1) in the invention, the paste forming body contains the water-based acrylate polymer, so that the contact between the aluminum-silicon alloy brazing powder and water can be prevented, the storage stability of the soldering paste can be ensured, the viscosity of the soldering paste system can be improved, and the anti-settling property can be greatly improved.
(2) In the invention, the aluminum-silicon soldering paste has proper viscosity and rheological property, and is easy to coat on the parts needing to be connected; the paste is stable, sedimentation and delamination are not easy to occur in the storage process, and the corrosion resistance of a soldered joint is strong; the welding method has the advantages of good welding characteristics, compact welding seam interface after welding, good air tightness, good tensile strength and low residues after welding.
Drawings
Fig. 1 is a diagram of an aluminum silicon solder paste according to embodiment 1 of the present invention.
Detailed Description
The present invention will be described in detail below with reference to specific examples, but these examples should be specifically mentioned for illustration, but should not be construed as limiting the scope of the present invention.
Example 1
This example proposes a water-soluble aluminum silicon solder paste, which is prepared by the following method:
preparing aluminum-silicon alloy brazing powder: smelting Al-12Si alloy in a medium-frequency induction furnace, and preparing powder in an ultrasonic centrifugal atomization mode to obtain spherical aluminum-silicon alloy brazing powder with the average particle size of 30 microns;
preparation of fluoride type brazing flux: mixing 35 wt% of aluminum fluoride, 28 wt% of potassium fluoride, 7 wt% of lithium fluoride, 16 wt% of potassium fluoroaluminate and 14 wt% of cesium fluoride according to weight percentage, carrying out ball milling, and uniformly ball milling to obtain a powdery fluoride brazing flux;
preparing aqueous paste: dissolving 0.5 part of initiator azobisisobutyronitrile in 50 parts of acetone according to the parts by weight, adding 15 parts of methyl methacrylate, 5 parts of butyl acrylate, 7 parts of hydroxyethyl methacrylate, 11 parts of styrene and 2 parts of acrylic acid, heating in a water bath, stirring for reaction, keeping the temperature at 70 ℃, condensing and refluxing, finishing the reaction after 6 hours, stirring for hydration, distilling to remove the acetone solvent, adding a pH regulator, and adjusting to be neutral to obtain the water-based acrylate polymer; uniformly stirring the water-based acrylate polymer and water to obtain a water-based paste-forming body with the water-based acrylate polymer content of 20 wt%;
preparing water-soluble aluminum-silicon soldering paste: mixing 56 wt% of aluminum-silicon alloy brazing powder, 25 wt% of fluoride brazing flux and 19 wt% of aqueous paste forming body according to the weight percentage, stirring and uniformly mixing under the condition that the stirring speed is 30r/min, sealing and standing for 24 hours to obtain the water-soluble aluminum-silicon soldering paste.
Referring to fig. 1, it is seen from fig. 1 that the water-soluble aluminum-silicon solder paste obtained in this example has a moderate paste viscosity and good fluidity, does not settle or delaminate within 1 month, and does not generate bubbles.
Example 2
This example proposes a water-soluble aluminum silicon solder paste, which is prepared by the following method:
preparing aluminum-silicon alloy brazing powder: smelting Al-12Si alloy by using a medium-frequency induction furnace, and preparing powder by using an ultrasonic centrifugal atomization mode to obtain spherical aluminum-silicon alloy brazing powder with the average particle size of 30 mu m;
preparation of fluoride type brazing flux: mixing 30 wt% of aluminum fluoride, 30 wt% of potassium fluoride, 5 wt% of lithium fluoride, 25 wt% of potassium fluoroaluminate and 10 wt% of cesium fluoride according to the weight percentage, carrying out ball milling, and uniformly ball milling to obtain a powdery fluoride brazing flux;
preparing an aqueous paste forming body: dissolving 0.5 part of initiator azobisisobutyronitrile in 50 parts of acetone according to the parts by weight, adding 10 parts of methyl methacrylate, 5 parts of n-butyl methacrylate, 5 parts of butyl acrylate, 7 parts of hydroxyethyl methacrylate, 11 parts of styrene and 2 parts of acrylic acid, heating in a water bath, stirring for reaction, keeping the temperature at 70 ℃ for condensation reflux, finishing the reaction after 6 hours, stirring for hydration, distilling to remove the acetone solvent, adding a pH regulator, and adjusting to be neutral to obtain the water-based acrylate polymer; uniformly stirring the water-based acrylate polymer and water to obtain a water-based paste-forming body with the water-based acrylate polymer content of 20 wt%;
preparing water-soluble aluminum-silicon soldering paste: mixing 65 wt% of aluminum-silicon alloy brazing powder, 25 wt% of fluoride brazing flux and 10 wt% of aqueous paste forming agent according to the weight percentage, stirring and uniformly mixing under the condition that the stirring speed is 30r/min, sealing and standing for 24 hours to obtain the water-soluble aluminum-silicon soldering paste.
The water-soluble aluminum-silicon soldering paste obtained in the embodiment has moderate paste viscosity and good fluidity, does not settle or delaminate within 1 month, and does not generate bubbles.
Example 3
This example proposes a water-soluble aluminum silicon solder paste, which is prepared by the following method:
preparing aluminum-silicon alloy brazing powder: smelting Al-12Si alloy by using a medium-frequency induction furnace, and preparing powder by using an ultrasonic centrifugal atomization mode to obtain spherical aluminum-silicon alloy brazing powder with the average particle size of 30 mu m;
preparation of fluoride brazing flux: mixing 35 wt% of aluminum fluoride, 25 wt% of potassium fluoride, 10 wt% of lithium fluoride, 10 wt% of potassium fluoroaluminate and 20 wt% of cesium fluoride according to the weight percentage, carrying out ball milling, and uniformly ball milling to obtain a powdery fluoride brazing flux;
preparing aqueous paste: dissolving 0.5 part of initiator azobisisobutyronitrile in 50 parts of acetone according to the parts by weight, adding 15 parts of methyl methacrylate, 5 parts of butyl acrylate, 8 parts of hydroxypropyl methacrylate, 10 parts of styrene and 2 parts of acrylic acid, heating in a water bath, stirring for reaction, keeping the temperature at 70 ℃, condensing and refluxing, finishing the reaction after 6 hours, stirring for hydration, distilling to remove the acetone solvent, adding a pH regulator, and adjusting to be neutral to obtain the water-based acrylate polymer; uniformly stirring the water-based acrylate polymer and water to obtain a water-based paste-forming body with the water-based acrylate polymer content of 20 wt%;
preparing water-soluble aluminum-silicon soldering paste: mixing 45 wt% of aluminum-silicon alloy brazing powder, 20 wt% of fluoride brazing flux and 35 wt% of water-based paste-forming body according to weight percentage, stirring and uniformly mixing under the condition that the stirring speed is 30r/min, and sealing and standing for 24 hours to obtain the water-soluble aluminum-silicon soldering paste.
The water-soluble aluminum-silicon soldering paste obtained in the embodiment has moderate paste viscosity and good fluidity, does not settle or delaminate within 1 month, and does not generate bubbles.
Example 4
This example proposes a water-soluble aluminum silicon solder paste, which is prepared by the following method:
preparing aluminum-silicon alloy brazing powder: smelting Al-10Si alloy by using a medium-frequency induction furnace, and preparing powder by using an ultrasonic centrifugal atomization mode to obtain spherical aluminum-silicon alloy brazing powder with the average particle size of 30 mu m;
preparation of fluoride brazing flux: mixing 35 wt% of aluminum fluoride, 28 wt% of potassium fluoride, 7 wt% of lithium fluoride, 16 wt% of potassium fluoroaluminate and 14 wt% of cesium fluoride according to the weight percentage, carrying out ball milling, and uniformly ball milling to obtain a powdery fluoride brazing flux;
preparing an aqueous paste forming body: dissolving 0.5 part of initiator azobisisobutyronitrile in 60 parts of acetone according to the parts by weight, adding 10 parts of methyl methacrylate, 5 parts of butyl acrylate, 10 parts of hydroxyethyl methacrylate, 20 parts of styrene and 2 parts of acrylic acid, heating in a water bath, stirring for reaction, keeping the temperature at 70 ℃, condensing and refluxing, finishing the reaction after 6 hours, stirring for hydration, distilling to remove the acetone solvent, adding a pH regulator, and adjusting to be neutral to obtain the water-based acrylate polymer; uniformly stirring the water-based acrylate polymer and water to obtain a water-based paste-forming body with the water-based acrylate polymer content of 20 wt%;
preparing water-soluble aluminum-silicon soldering paste: mixing 56 wt% of aluminum-silicon alloy brazing powder, 25 wt% of fluoride brazing flux and 19 wt% of water-based paste-forming agent according to weight percentage, stirring and uniformly mixing under the condition that the stirring speed is 30r/min, and sealing and standing for 24 hours to obtain the water-soluble aluminum-silicon soldering paste.
The water-soluble aluminum-silicon soldering paste obtained in the embodiment has moderate paste viscosity and good fluidity, does not generate sedimentation and delamination within 1 month, and does not generate bubbles.
Comparative example 1
The comparative example proposes a water-soluble aluminum-silicon solder paste, which is prepared by the following method:
preparing aluminum-silicon alloy brazing powder: smelting Al-12Si alloy in a medium-frequency induction furnace, and preparing powder in an ultrasonic centrifugal atomization mode to obtain spherical aluminum-silicon alloy brazing powder with the average particle size of 30 microns;
preparation of fluoride brazing flux: mixing 35 wt% of aluminum fluoride, 28 wt% of potassium fluoride, 7 wt% of lithium fluoride, 16 wt% of potassium fluoroaluminate and 14 wt% of cesium fluoride according to the weight percentage, carrying out ball milling, and uniformly ball milling to obtain a powdery fluoride brazing flux;
preparing water-soluble aluminum-silicon soldering paste: mixing 56 wt% of aluminum-silicon alloy brazing powder, 25 wt% of fluoride brazing flux and 19 wt% of water according to weight percentage, stirring and uniformly mixing under the condition that the stirring speed is 30r/min, and sealing and standing for 24 hours to obtain the water-soluble aluminum-silicon soldering paste.
The water-soluble aluminum-silicon soldering paste obtained by the comparative example has low paste viscosity and low consistency, fluoride brazing flux and aluminum-silicon alloy brazing powder are separated and float on the aluminum-silicon alloy brazing powder, bubbles begin to generate within 20min, and delamination begins within 2 h.
Comparative example 2
The comparative example proposes a water-soluble aluminum-silicon solder paste, which is prepared by the following method:
preparing aluminum-silicon alloy brazing powder: smelting Al-12Si alloy by using a medium-frequency induction furnace, and preparing powder by using an ultrasonic centrifugal atomization mode to obtain spherical aluminum-silicon alloy brazing powder with the average particle size of 30 mu m;
preparation of fluoride type brazing flux: mixing 35 wt% of aluminum fluoride, 28 wt% of potassium fluoride, 7 wt% of lithium fluoride, 16 wt% of potassium fluoroaluminate and 14 wt% of cesium fluoride according to weight percentage, carrying out ball milling, and uniformly ball milling to obtain a powdery fluoride brazing flux;
preparing an ointment body: dissolving 0.5 part of initiator azobisisobutyronitrile into 50 parts of acetone according to the parts by weight, adding 28 parts of methyl methacrylate, 10 parts of butyl acrylate and 2 parts of acrylic acid, heating in a water bath, stirring for reaction, keeping the temperature at 70 ℃, condensing and refluxing, finishing the reaction after 6 hours, stirring for hydration, distilling to remove the acetone solvent, adding a pH regulator, and adjusting to be neutral to obtain the acrylate polymer; uniformly stirring the acrylic ester polymer and water to obtain a paste-forming body with the content of the water-based acrylic ester polymer being 20 wt%;
preparing water-soluble aluminum-silicon soldering paste: mixing 56 wt% of aluminum-silicon alloy brazing powder, 25 wt% of fluoride brazing flux and 19 wt% of water-based paste-forming agent according to the weight percentage, stirring and uniformly mixing under the condition that the stirring speed is 30r/min, and sealing and standing for 24 hours to obtain the water-soluble aluminum-silicon soldering paste.
The water-soluble aluminum-silicon soldering paste obtained by the comparative example has high paste viscosity, is slightly layered after 48 hours, and begins to generate bubbles.
The water-soluble aluminum-silicon soldering pastes obtained in the examples and the comparative examples are printed on a 3A21 aluminum plate, heated for 60s in a furnace at the temperature of (590 +/-5) DEG C, and the expansion rate and the residual rate after soldering are tested, and the shear strength of each soldered joint is tested to measure the quality of the mechanical property of each soldered joint according to GB 11363-.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered as the technical solutions and the inventive concepts of the present invention within the technical scope of the present invention.
Claims (10)
1. A water-soluble aluminum silicon solder paste, characterized by comprising: 45-65 wt% of aluminum-silicon alloy brazing powder, 5-35 wt% of fluoride brazing flux and 10-45 wt% of aqueous paste forming body;
wherein the aqueous paste-forming body comprises: 5-30 wt% of water-based acrylate polymer and 70-95 wt% of water-based solvent;
the water-based acrylate polymer is obtained by copolymerization reaction of an acrylate monomer, a hydroxyl-containing acrylate hydrophilic monomer and a styrene hydrophobic monomer.
2. The water-soluble aluminum silicon solder paste as claimed in claim 1, wherein the mass ratio of the acrylate monomer, the hydroxyl-containing acrylate hydrophilic monomer and the styrene hydrophobic monomer is 3-6:1-2: 1-4.
3. The water-soluble aluminum silicon solder paste according to claim 2, wherein the acrylate monomer is at least one of methyl acrylate, ethyl acrylate, n-butyl acrylate, isobutyl acrylate, methyl methacrylate, ethyl methacrylate, n-butyl methacrylate or glycidyl methacrylate; the hydroxyl-containing acrylate hydrophilic monomer is at least one of hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate, hydroxypropyl methacrylate or polyethylene glycol methacrylate; the styrene hydrophobic monomer is at least one of styrene, p-methylstyrene, m-methylstyrene or p-chlorostyrene.
4. The water-soluble aluminum silicon solder paste according to any one of claims 1 to 3, wherein the aqueous solvent is at least one of water, ethanol, propanol, isopropanol, ethylene glycol, propylene glycol, glycerol, ethylene glycol methyl ether, and ethylene glycol butyl ether.
5. The water soluble aluminum silicon solder paste according to any one of claims 1 to 4, wherein the aluminum silicon alloy brazing powder is at least one of an aluminum-silicon alloy, an aluminum-silicon-zinc alloy, an aluminum-silicon-magnesium alloy, or an aluminum-silicon-copper alloy;
preferably, the aluminum-silicon alloy brazing powder is at least one of aluminum-12 silicon alloy, aluminum-10 silicon alloy or aluminum-10 silicon-1 zinc alloy.
6. The water-soluble aluminum silicon solder paste according to any one of claims 1 to 5, wherein the fluoride-based flux is at least one of potassium fluoroaluminate, potassium fluoride, aluminum fluoride, lithium fluoride, sodium fluoride, cesium fluoride, a potassium fluoroaluminate-cesium complex, cesium fluoroaluminate, potassium fluorozincate, or cesium fluorozincate.
7. The water-soluble aluminum silicon solder paste according to claim 6, wherein the fluoride based flux comprises: 25-40 wt% of aluminum fluoride, 25-30 wt% of potassium fluoride, 5-10 wt% of lithium fluoride, 10-25 wt% of potassium fluoroaluminate and 10-20 wt% of cesium fluoride.
8. A method for preparing a water soluble aluminum silicon solder paste according to any one of claims 1 to 7, comprising: and uniformly mixing the aluminum-silicon alloy brazing powder, fluoride brazing flux and aqueous paste according to a designed proportion to obtain the water-soluble aluminum-silicon soldering paste.
9. Use of a water-soluble aluminium silicon solder paste according to any one of claims 1 to 7 for soldering aluminium articles.
10. Use according to claim 9, characterized in that it comprises: and coating the soldering paste on the aluminum product, and heating after assembly.
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| WO1980002524A1 (en) * | 1979-05-18 | 1980-11-27 | Ohara Metal Ind Co Ltd | Water-soluble soft-brazing aid |
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| CN1263485A (en) * | 1997-07-15 | 2000-08-16 | 清美化学股份有限公司 | Composition for preventing creeping of flux for soldering |
| US20080274454A1 (en) * | 2004-04-07 | 2008-11-06 | Mirkin Chad A | Reversible and Chemically Programmable Micelle Assembly With Dna Block-Copolymer Amphiphiles |
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| US20090169721A1 (en) * | 2007-12-27 | 2009-07-02 | Shekhawat Linda A | Amphiphilic block copolymers for improved flux application |
| JP2014097514A (en) * | 2012-11-13 | 2014-05-29 | Harima Chemicals Inc | PASTE FOR Al-Cu BRAZING AND Al-Cu BRAZING METHOD |
| CN107755921A (en) * | 2017-09-18 | 2018-03-06 | 广东省焊接技术研究所（广东省中乌研究院） | A kind of water-based organic aluminium soldering paste into lotion and its comprising this into lotion |
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2022
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1980002524A1 (en) * | 1979-05-18 | 1980-11-27 | Ohara Metal Ind Co Ltd | Water-soluble soft-brazing aid |
| CN1263485A (en) * | 1997-07-15 | 2000-08-16 | 清美化学股份有限公司 | Composition for preventing creeping of flux for soldering |
| JP2000079496A (en) * | 1998-09-03 | 2000-03-21 | Furukawa Electric Co Ltd:The | Binder resin used in paste for brazing aluminum material, paste for brazing aluminum material and aluminum material |
| US20080274454A1 (en) * | 2004-04-07 | 2008-11-06 | Mirkin Chad A | Reversible and Chemically Programmable Micelle Assembly With Dna Block-Copolymer Amphiphiles |
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| US20090169721A1 (en) * | 2007-12-27 | 2009-07-02 | Shekhawat Linda A | Amphiphilic block copolymers for improved flux application |
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| CN107755921A (en) * | 2017-09-18 | 2018-03-06 | 广东省焊接技术研究所（广东省中乌研究院） | A kind of water-based organic aluminium soldering paste into lotion and its comprising this into lotion |
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