CN114752894B - Deposition source baffle mechanism and coating equipment with same - Google Patents
Deposition source baffle mechanism and coating equipment with same Download PDFInfo
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- CN114752894B CN114752894B CN202210391244.1A CN202210391244A CN114752894B CN 114752894 B CN114752894 B CN 114752894B CN 202210391244 A CN202210391244 A CN 202210391244A CN 114752894 B CN114752894 B CN 114752894B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The application relates to a deposition source baffle mechanism and have this deposition source baffle mechanism's coating equipment, wherein deposition source baffle mechanism includes rotating barrier, driving piece and runner assembly, the driving piece is connected runner assembly just can drive the runner assembly is rotatory, the runner assembly sets up along the first direction and connects rotating barrier, rotating barrier rotates and can drive rotating barrier is rotatory at the rotation plane, the first direction perpendicular to the rotation plane. According to the scheme, the rotating axis of the rotating assembly is vertically arranged relative to the side wall of the vacuum cavity, the rotating assembly drives the rotating baffle to rotate on the plane vertical to the rotating assembly, so that the rotating baffle rotates in the rotating plane parallel to the side wall of the vacuum cavity, the rotating baffle can occupy less space inside the vacuum cavity in the rotating process, and the utilization rate of the space inside the vacuum cavity of the coating equipment is improved.
Description
Technical Field
The application relates to the technical field of coating equipment, in particular to a deposition source baffle mechanism and coating equipment with the same.
Background
In PVD (physical vapor deposition) vacuum coating equipment, due to the requirements of the processing technology, the vacuum coating equipment sometimes needs to be equipped with several different types of deposition sources, such as: the arc evaporation source, the magnetron target or the ion source, or the magnetron targets for different targets are configured on one device. In such a production situation, since magnetron targets of different targets, or arc evaporation sources, magnetron targets, and ion sources cannot be operated simultaneously, and in order to prevent the respective targets from being contaminated, it is necessary to provide a displaceable shielding device in front of the different deposition sources.
In the existing coating equipment, a deposition source baffle mechanism adopts a door type baffle, and a driving cylinder drives the door type baffle to be pushed away into a coating machine table so as to carry out coating. The space inside the cavity that the gate-type baffle took has reduced the space utilization of coating machine platform.
Disclosure of Invention
Therefore, a deposition source baffle mechanism and a coating device with the deposition source baffle mechanism are needed to be provided, and the problem that the space utilization rate of a coating machine table in the prior art is low is solved.
In a first aspect, the application provides a deposition source baffle mechanism, including rotating barriers, driving piece and runner assembly, the driving piece is connected the runner assembly just can drive the runner assembly is rotatory, the axis of rotation of runner assembly sets up along first direction, the runner assembly connects rotating barriers just can drive rotating barriers is at the rotation of rotation plane, first direction perpendicular to the rotation plane.
When the deposition source baffle mechanism is applied, the rotating axis of the rotating assembly is vertically arranged relative to the side wall of the vacuum cavity, and the rotating assembly drives the rotating baffle to rotate on a plane vertical to the rotating assembly, so that the rotating baffle rotates in a rotating plane parallel to the side wall of the vacuum cavity, the rotating baffle can occupy less space inside the vacuum cavity in the rotating process, and the utilization rate of the space inside the vacuum cavity of the coating equipment is improved.
The technical solution of the present application is further described below:
in any embodiment, the rotating baffle comprises a first baffle and a second baffle. The first baffle and the second baffle correspond to the deposition source anode and the deposition source cathode respectively, compared with a rotary baffle which can shield the deposition source anode and the deposition source cathode simultaneously, the first baffle and the second baffle can shield the deposition source anode and the deposition source cathode respectively and accurately, and the single rotary baffle which can shield the deposition source anode and the deposition source cathode simultaneously needs a relatively large volume, so that the processing and the adjustment are not convenient.
In any embodiment, the rotating assembly includes a first rotating shaft and a second rotating shaft, and the first rotating shaft and the second rotating shaft are respectively connected to the first baffle and the second baffle. The first baffle and the second baffle are respectively connected through the first rotating shaft and the second rotating shaft, so that the first baffle and the second baffle can be respectively controlled to rotate, or the rotating paths of the first baffle and the second baffle can be conveniently designed when the first baffle and the second baffle rotate synchronously.
In any embodiment, the rotating assembly further comprises a linkage member, and the linkage member connects the first rotating shaft and the second rotating shaft, so that the first rotating shaft and the second rotating shaft rotate synchronously. The first rotating shaft and the second rotating shaft synchronously rotate through the linkage piece, so that the first rotating shaft and the second rotating shaft are driven to synchronously rotate through the driving piece, the structure is simplified, and the first baffle and the second baffle are conveniently controlled.
In any embodiment, the linkage piece and the first rotating shaft and the linkage piece and the second rotating shaft are in meshing transmission.
In any embodiment, the first rotating shaft and the second rotating shaft are both rotary bearing blocks.
In any embodiment, the deposition source baffle mechanism further comprises an adapter flange, and the first rotating shaft and the second rotating shaft both penetrate through the adapter flange.
In any embodiment, in the first direction, the first baffle and the second baffle are arranged in a staggered manner, and the first baffle and the second baffle do not interfere with each other when rotating. Through setting up first baffle and second baffle are crisscross, and first baffle and second baffle mutually noninterfere when the rotation plane rotates, can reduce the shared area of first baffle and second baffle in the rotation plane, so that deposit source baffle mechanism can adapt to less installation space, and be convenient for realize first baffle and second baffle synchronous revolution through first pivot and second pivot, and then provide the basis for the convenient operation of deposit source baffle mechanism.
In any embodiment, in the first direction, the gap between the first baffle and the adapter flange and the gap between the second baffle and the adapter flange are not greater than 10mm. The gaps among the first baffle, the second baffle and the adapter flange are limited to be not more than 10mm, so that the space of the rotary baffle in the vacuum cavity can be further limited, the space utilization rate of the vacuum cavity is improved, and the rotary baffle is closer to the adapter flange, so that sputtering particles can be reduced to enter the deposition source cathode and the deposition source anode to a greater extent, the deposition source cathode and the deposition source anode can be better protected, the stability of equipment is improved, and the maintenance period of the deposition source is prolonged.
In a second aspect, the present application further provides a coating apparatus, which includes a vacuum chamber, a deposition source, and the deposition source baffle mechanism as described in any of the above embodiments, wherein the rotation of the rotation baffle plate in the rotation plane can block the deposition source.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, are included to provide a further understanding of the application, and the description of the exemplary embodiments of the application are intended to be illustrative of the application and are not intended to limit the application.
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a top view of a deposition source baffle mechanism according to an embodiment of the present application;
FIG. 2 is a front view of the first deposition source baffle mechanism of FIG. 1;
fig. 3 is a front view of the deposition source shutter mechanism of fig. 1.
Description of reference numerals:
100. a deposition source baffle mechanism; 110. rotating the baffle; 111. a first baffle; 112. a second baffle; 120. a drive member; 130. a rotating assembly; 131. a first rotating shaft; 132. a second rotating shaft; 133. a linkage; 140. a transfer flange;
200. a vacuum chamber; 310. a deposition source anode; 320. a deposition source cathode.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiment in many different forms than those described herein and those skilled in the art will be able to make similar modifications without departing from the spirit of the application and therefore the application is not limited to the embodiments disclosed below.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "including" and "having," and any variations thereof, in the description and claims of this application and the description of the above figures are intended to cover non-exclusive inclusions.
In the description of the embodiments of the present application, the term "and/or" is only one kind of association relation describing an associated object, and means that three kinds of relations may exist, for example, a and/or B, may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
In the description of the present application, it is to be understood that the terms "central," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and to simplify the description, but are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be interconnected within two elements or in a relationship where two elements interact with each other unless otherwise specifically limited. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, a first feature is "on" or "under" a second feature such that the first and second features are in direct contact, or the first and second features are in indirect contact via an intermediary. Also, a first feature "on," "above," and "over" a second feature may be directly on or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Preferred embodiments of the present application will be described below with reference to the accompanying drawings.
Referring to fig. 1, one embodiment of the present application shows a coating apparatus including a vacuum chamber 200, a deposition source, and a deposition source blocking mechanism 100, wherein the deposition source blocking mechanism 100 is used for blocking the deposition source. The deposition source may include two emission sources, i.e., a deposition source anode 310 and a deposition source cathode 320, as shown in fig. 2, when the deposition source is shielded by the deposition source baffle mechanism 100, both the deposition source anode 310 and the deposition source cathode 320 are shielded by the deposition source baffle mechanism 100, so as to prevent the deposition source target from being contaminated.
As shown in fig. 1, a deposition source shutter mechanism 100, which is illustrated for one embodiment of the present application, includes a rotating shutter 110, a driving member 120, and a rotating assembly 130. The driving member 120 is connected to the rotating assembly 130 and can drive the rotating assembly 130 to rotate, a rotating axis of the rotating assembly 130 is disposed along a first direction and connected to the rotating baffle 110, the rotating assembly 130 can drive the rotating baffle 110 to rotate in a rotating plane, and the first direction is perpendicular to the rotating plane.
As shown in fig. 1, the driving member 120 is located outside the vacuum chamber 200, the rotating baffle 110 is located inside the vacuum chamber 200, one end of the rotating assembly 130 is connected to the driving member 120, and the other end extends to the inside of the vacuum chamber 200 along the first direction and is connected to the rotating baffle 110, so that the rotating assembly transmits power to the driving member 120 and the rotating baffle 110. Therefore, when the driving member 120 drives the rotating member to rotate, the rotating member can drive the rotating baffle 110 to rotate.
In the embodiment shown in fig. 1 and 2, the rotating assembly 130 has its axis of rotation arranged in a first direction and the rotating assembly is arranged perpendicular to the rotating assembly 130. As shown in fig. 2, the first direction is preferably consistent with the arrangement direction of the deposition source cathode 320 and the deposition source anode 310, so that when the rotating baffle 110 rotates in the rotating plane, the rotating baffle 110 is perpendicular to the arrangement direction of the deposition source anode 310 and the deposition source cathode 320, and the opening end faces of the rotating baffle 110, the deposition source anode 310 and the deposition source cathode 320 are parallel, so that the rotating baffle 110 has a better shielding effect on the deposition source.
The driving member 120 is used to power the rotation of the rotary shutter 110, and may be a heat engine, an electric motor, a cylinder, etc., and in the embodiment shown in fig. 1, the driving member 120 is a cylinder.
According to the scheme, the rotating assembly 130 drives the rotating baffle 110 to rotate on the plane perpendicular to the rotating assembly 130, so that the rotating baffle 110 rotates in the rotating plane parallel to the side wall of the vacuum chamber 200, the rotating baffle 110 occupies less space inside the vacuum chamber 200 in the rotating process, and the utilization rate of the space inside the vacuum chamber 200 of the coating equipment is improved.
Referring to fig. 1 to 3, according to some embodiments of the present application, the rotating shutter plate 110 may optionally include a first shutter plate 111 and a second shutter plate 112, and the first shutter plate 111 and the second shutter plate 112 correspond to the deposition source anode 310 and the deposition source cathode 320, respectively.
In other embodiments, the number of the rotating baffles 110 may be one, and one baffle may shield both the deposition source anode 310 and the deposition source cathode 320.
By the first and second baffles 111 and 112 corresponding to the deposition source anode 310 and the deposition source cathode 320, respectively, the first and second baffles 111 and 112 can accurately shield the deposition source anode 310 and the deposition source cathode 320, respectively, compared to simultaneously shielding the deposition source anode 310 and the deposition source cathode 320 by one rotating baffle 110, and the volume required by a single rotating baffle 110 to shield the deposition source anode 310 and the deposition source cathode 320 is relatively large, which is inconvenient for processing and adjustment.
Referring to fig. 1 to 3, according to some embodiments of the present application, the rotating assembly 130 optionally includes a first rotating shaft 131 and a second rotating shaft 132, and the first rotating shaft 131 and the second rotating shaft 132 are respectively connected to the first baffle 111 and the second baffle 112.
In other embodiments, the rotating assembly 130 may also include only one rotating shaft, and the first baffle 111 and the second baffle 112 are both connected to the rotating shaft, and the rotating shaft rotates to drive the first baffle 111 and the second baffle 112 simultaneously, at this time, from the initial position to when the first baffle 111 and the second baffle 112 respectively shield the deposition source anode 310 and the deposition source cathode 320, the first baffle 111 and the second baffle 112 rotate in the same direction by the same angle, so that the rotating shaft only needs to rotate by a set angle from the initial position to when the first baffle 111 and the second baffle 112 respectively shield the deposition source anode 310 and the deposition source cathode 320.
Referring to fig. 2 and 3, according to some embodiments of the present disclosure, optionally, when the first baffle 111 and the second baffle 112 shield the deposition source anode 310 and the deposition source cathode 320 from the initial position, the first rotating shaft 131 and the second rotating shaft 132 rotate in the same direction by the same angle, so that the first rotating shaft 131 and the second rotating shaft 132 rotate synchronously, and the first baffle 111 and the second baffle 112 can rotate from the initial position to shield the deposition source anode 310 and the deposition source cathode 320, respectively, for facilitating adjustment.
Referring to fig. 1 to 3, according to some embodiments of the present application, the rotating assembly 130 further optionally includes a link 133, and the link 133 connects the first rotating shaft 131 and the second rotating shaft 132, so that the first rotating shaft 131 and the second rotating shaft 132 rotate synchronously.
The link 133 is used for enabling the first rotating shaft 131 and the second rotating shaft 132 to rotate synchronously, so as to enable the first rotating shaft 131 and the second rotating shaft 132 to rotate synchronously through one driving member 120, simplify the structure, and facilitate the control of the first baffle 111 and the second baffle 112.
Referring to fig. 1, according to some embodiments of the present application, the linking member 133 and the first rotating shaft 131, and the linking member 133 and the second rotating shaft 132 are selectively driven in a meshing manner. In other embodiments, the linkage 133 and the first rotating shaft 131, and the linkage 133 and the second rotating shaft 132 may also be in friction transmission.
Referring to FIG. 1, according to some embodiments of the present application, the linkage 133 is optionally a belt. In other embodiments, the linkage 133 and the first rotating shaft 131, and the linkage 133 and the second rotating shaft 132 may also be a gear transmission, a chain transmission, or the like.
Referring to fig. 1, according to some embodiments of the present application, optionally, the first rotating shaft 131 and the second rotating shaft 132 are both rotating bearing seats. The rotary bearing seat comprises an outer ring and an inner ring which are matched with each other in a relative rotation mode, the outer ring is fixedly connected with the adapter flange 140, and the inner ring is connected with the driving piece 120 and the first baffle 111 or the second baffle 112, so that when the first rotating shaft 131 and the second rotating shaft 132 drive the first baffle 111 and the second baffle 112 to rotate, the side walls of the adapter flange 140 and the vacuum cavity 200 are not affected, and further the influence on the vacuum degree in the vacuum cavity 200 when the first rotating shaft 131 and the second rotating shaft 132 drive the first baffle 111 and the second baffle 112 to rotate is avoided.
Referring to fig. 1, according to some embodiments of the present disclosure, the deposition source baffle mechanism 100 may further include an adapter flange 140, and the first rotating shaft 131 and the second rotating shaft 132 may extend through the adapter flange 140.
As shown in fig. 1, the adaptor flange 140 is disposed on a sidewall of the vacuum chamber 200, the driving member 120 is disposed outside the vacuum chamber 200, the rotation barrier 110 is disposed inside the vacuum chamber 200, the adaptor flange 140 communicates with the inside and the outside of the vacuum chamber 200, one end of the first rotating shaft 131 and the second rotating shaft 132 is connected to the driving member 120, and the other end thereof passes through the adaptor flange 140 to connect the rotation barrier 110 disposed inside the vacuum chamber 200.
In order to prevent the deposition source blocking mechanism 100 from affecting the vacuum degree in the vacuum chamber 200, it is preferable that the adaptor flange 140 is sealed from the sidewall of the vacuum chamber 200, and the adaptor flange 140 is sealed from the first rotating shaft 131, the adaptor flange 140 is sealed from the second rotating shaft 132.
The mounting of the deposition source barrier mechanism 100 to the sidewall of the vacuum chamber 200 and the sealing are facilitated by the provision of the adaptor flange 140, and the connection between the rotation barrier inside the vacuum chamber 200 and the driving member 120 outside the vacuum chamber 200 is accomplished by the penetration of the first and second rotating shafts 131 and 132 through the adaptor flange 140.
Referring to fig. 1, according to some embodiments of the present application, optionally, in the first direction, the first barrier 111 and the second barrier 112 are disposed in a staggered manner, and the first barrier 111 and the second barrier 112 do not interfere with each other when rotating.
The first baffle 111 and the second baffle 112 are disposed alternately in the first direction, i.e., one of the first baffle 111 and the second baffle 112 is closer to the adaptor flange 140 than the other of the first baffle 111 and the second baffle 112. In the embodiment shown in fig. 1, the first baffle 111 is closer to the adapter flange 140 than the second baffle 112, and in other embodiments, the second baffle 112 may be closer to the adapter flange 140 than the first baffle 111.
Through setting up first baffle 111 and second baffle 112 crisscross, and first baffle 111 and second baffle 112 mutually noninterfere when rotatory plane rotates at first baffle 111 and second baffle 112, can reduce the area that first baffle 111 and second baffle 112 were shared at the rotation plane, so that source baffle mechanism 100 can adapt to less installation space, and be convenient for realize first baffle 111 and second baffle 112 synchronous revolution through first pivot 131 and second pivot 132, and then provide the basis for source baffle mechanism 100's convenient operation.
According to some embodiments of the present application, optionally, in the first direction, the gap between the first baffle 111 and the adaptor flange 140 and the gap between the second baffle 112 and the adaptor flange 140 are not greater than 10mm.
The gap between the first baffle 111 and the adaptor flange 140 refers to a gap between a side of the first baffle 111 facing the adaptor flange 140 and a side of the adaptor flange 140 facing the vacuum chamber 200, and accordingly, the gap between the second baffle 112 and the adaptor flange 140 refers to a gap between a side of the second baffle 112 facing the adaptor flange 140 and a side of the adaptor flange 140 facing the vacuum chamber 200.
In the first direction, when the first baffle 111 and the second baffle 112 are flush, the gap between the first baffle 111 and the adapter flange 140 and the gap between the second baffle 112 and the adapter flange 140 are equal. At this time, the gap between the first baffle 111 and the adaptor flange 140 and the gap between the second baffle 112 and the adaptor flange 140 are not greater than 10mm.
In the first direction, when the first baffle 111 and the second baffle 112 are arranged in a staggered manner, the gap between the baffle, which is farther away from the adapter flange 140, of the first baffle 111 and the second baffle 112 and the adapter flange 140 is not greater than 10mm. In the embodiment shown in fig. 1, the first baffle 111 is closer to the adapter flange 140 than the second baffle 112, the gap between the second baffle 112 and the adapter flange 140 is not greater than 10mm, the first baffle 111 is between the second baffle 112 and the adapter flange 140, and the first baffle 111 and the second baffle 112 do not interfere with each other when rotating. In other embodiments, when the second shutter plate 112 is closer to the adaptor flange 140 than the first shutter plate 111, the gap between the first shutter plate 111 and the adaptor flange 140 is not greater than 10mm, the second shutter plate 112 is interposed between the first shutter plate 111 and the adaptor flange 140, and the first shutter plate 111 and the second shutter plate 112 do not interfere with each other when rotating.
Preferably, the first baffle 111 is closer to the adaptor flange 140 than the second baffle 112, the gap between the second baffle 112 and the adaptor flange 140 is 10mm, the first baffle 111 is between the second baffle 112 and the adaptor flange 140, and the gap between the first baffle 111 and the adaptor flange 140 is 5mm.
By limiting the gap between the first baffle 111 and the second baffle 112 and the adaptor flange 140 to be not more than 10mm, on one hand, the space of the rotating baffle 110 in the vacuum chamber 200 can be further limited, and the space utilization rate of the vacuum chamber 200 is improved, and on the other hand, the rotating baffle 110 is closer to the adaptor flange 140, so that sputtering particles can be reduced to a greater extent from entering the deposition source cathode 320 and the deposition source anode 310, the deposition source cathode 320 and the deposition source anode 310 can be better protected, the stability of the equipment is improved, and the maintenance period of the deposition source is prolonged.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and are not limited thereto; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may be modified, or some or all of the technical features may be equivalently replaced; these modifications and substitutions do not cause the corresponding technical solutions to depart from the scope of the technical solutions of the embodiments of the present application, and are intended to be covered by the claims and the specification of the present application. In particular, the features mentioned in the embodiments can be combined in any manner, as long as no structural conflict exists. This application is not intended to be limited to the particular embodiments disclosed herein but is to cover all embodiments that may fall within the scope of the appended claims.
Claims (10)
1. A deposition source baffle mechanism is characterized by comprising a rotating baffle (110), a driving part (120) and a rotating assembly (130), wherein the driving part (120) is connected with the rotating assembly (130) and can drive the rotating assembly (130) to rotate, the rotating axis of the rotating assembly (130) is arranged along a first direction, the rotating assembly (130) is connected with the rotating baffle (110) and can drive the rotating baffle (110) to rotate in a rotating plane, the first direction is perpendicular to the rotating plane, the rotating baffle (110) comprises a first baffle (111) and a second baffle (112), the first baffle (111) and the second baffle (112) rotate synchronously and are arranged in a staggered mode in the first direction, and therefore the first baffle (111) and the second baffle (112) do not interfere with each other when rotating.
2. The deposition source shutter mechanism according to claim 1, wherein the rotating assembly (130) includes a first rotating shaft (131) and a second rotating shaft (132), and the first rotating shaft (131) and the second rotating shaft (132) are connected to the first shutter plate (111) and the second shutter plate (112), respectively.
3. The deposition source shutter mechanism according to claim 2, wherein the rotating assembly (130) further comprises a linkage (133), the linkage (133) connecting the first rotating shaft (131) and the second rotating shaft (132) such that the first rotating shaft (131) and the second rotating shaft (132) rotate synchronously.
4. The deposition source shutter mechanism according to claim 3, wherein the link member (133) is in meshing transmission with the first rotating shaft (131), and the link member (133) is in meshing transmission with the second rotating shaft (132).
5. The deposition source shutter mechanism according to claim 4, wherein the linkage member (133) is a conveyor belt.
6. The deposition source shutter mechanism according to claim 4, wherein the first rotating shaft (131) and the second rotating shaft (132) are each a rotary bearing housing.
7. The deposition source shutter mechanism according to claim 3, wherein the deposition source shutter mechanism (100) further comprises an adapter flange (140), and the first rotating shaft (131) and the second rotating shaft (132) both extend through the adapter flange (140).
8. The deposition source shutter mechanism according to claim 7, wherein the adapter flange (140) is sealed from the first and second shafts (131, 132).
9. The deposition source baffle mechanism of claim 7, wherein a gap between the first baffle (111) and the adaptor flange (140) and a gap between the second baffle (112) and the adaptor flange (140) are no greater than 10mm in the first direction.
10. A plating apparatus comprising a vacuum chamber (200) and a deposition source, characterized by further comprising the deposition source barrier mechanism (100) according to any one of claims 1 to 9, wherein the rotation barrier (110) is rotatable in a rotation plane to shield the deposition source.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202210391244.1A CN114752894B (en) | 2022-04-14 | 2022-04-14 | Deposition source baffle mechanism and coating equipment with same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210391244.1A CN114752894B (en) | 2022-04-14 | 2022-04-14 | Deposition source baffle mechanism and coating equipment with same |
Publications (2)
Publication Number | Publication Date |
---|---|
CN114752894A CN114752894A (en) | 2022-07-15 |
CN114752894B true CN114752894B (en) | 2022-12-16 |
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Address after: 523835 Room 401 and 501, building 5, No.2 mashanmiao Road, baihuadong, Dalingshan Town, Dongguan City, Guangdong Province Patentee after: Guangdong Huasheng Nanotechnology Co.,Ltd. Address before: 523835 Room 401 and 501, building 5, No.2 mashanmiao Road, baihuadong, Dalingshan Town, Dongguan City, Guangdong Province Patentee before: DONGGUAN HUASHENG VACUUM PLATED FILM TECHNOLOGY CO.,LTD. |