CN114740237A - Probe structure for high frequency test - Google Patents
Probe structure for high frequency test Download PDFInfo
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- CN114740237A CN114740237A CN202210367993.0A CN202210367993A CN114740237A CN 114740237 A CN114740237 A CN 114740237A CN 202210367993 A CN202210367993 A CN 202210367993A CN 114740237 A CN114740237 A CN 114740237A
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- 239000000523 sample Substances 0.000 title claims abstract description 134
- 238000012360 testing method Methods 0.000 title claims abstract description 47
- 238000003825 pressing Methods 0.000 claims description 5
- 238000012546 transfer Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 6
- 230000007774 longterm Effects 0.000 abstract description 5
- 238000000926 separation method Methods 0.000 abstract description 2
- 230000003068 static effect Effects 0.000 abstract 2
- 238000001514 detection method Methods 0.000 description 10
- 230000008859 change Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a probe structure for high-frequency test, which comprises a body, a supporting plate positioned below the body, a probe used for contacting with a chip to be tested and a moving point contact probe, wherein when the probe contacts with the chip to be tested, the moving point contact probe rotates along with the supporting plate to be away from the static point contact probe, the moving point contact probe and the static point contact probe are changed from an initial state of mutual contact to a state of mutual separation, the middle part of the supporting plate is connected with the body through a second elastic member which is vertically arranged, a first pin shaft which is vertical to the length direction of the supporting plate is arranged in a region which is positioned above the supporting plate and is positioned between the probe and the second elastic member through a switching seat, the lower end of the first elastic member which is in a stretching state is connected with the first pin shaft, and the upper end of the first elastic member is connected with a fourth pin shaft which is positioned in the body and is positioned above the second pin shaft and a third pin shaft. The invention solves the problem of unstable and inconsistent test data in the long-term use process caused by the fatigue of the probe station.
Description
Technical Field
The invention relates to a probe structure for high-frequency testing, and belongs to the technical field of chip testing.
Background
In the testing process of an optical communication single laser chip (LD), the stability of a probe plays a very important role, because the size of a single chip is very small (generally in the range of 300 μm), the position or the angle of the chip is more or less pushed to be deviated by the test probe in the process of contacting the chip, once the position and the angle of the chip are changed, the stability and the test efficiency of subsequent test indexes are directly influenced, and the pressure stability of the test probe is also directly fed back to the stability of a test value, in the mass production test link, one probe needs to detect a large number of chips, and needs to detect the same chip for many times, the stability and durability of the power-on probe assembly can directly influence the consistency and reproducibility of test data, therefore, a very strict requirement is put on the long-term stability of the probe structure for high-frequency test in the test process.
Disclosure of Invention
The inventor finds that: the pressure change of the probe acting on the chip can cause the change of the contact resistance, thereby influencing the consistency of test data, and in the long-time test process, if the pressure change is overlarge, the change which can cause the test result to be indistinguishable is caused by the chip or the machine table, thereby causing the test result to lose the comparability. Based on the above findings, an object of the present invention is to provide a probe structure for high frequency test, which solves the problem of unstable and inconsistent test data during long-term use due to fatigue of a probe stage.
In order to achieve the purpose, the invention adopts the technical scheme that: a probe structure for a high-frequency test comprises a body, a supporting plate, a probe and a moving point contact probe, wherein the supporting plate is positioned below the body, the probe is used for being in contact with a chip to be tested, the moving point contact probe and the probe are respectively arranged at two ends of the supporting plate, the middle part of the supporting plate is connected with the body through a second elastic piece which is vertically arranged, a fixed point contact probe which is positioned above the moving point contact probe and corresponds to the moving point contact probe is arranged on one side of the lower end face of the body, when the probe is in contact with the chip to be tested, the moving point contact probe rotates along with the supporting plate to be away from the fixed point contact probe, and the moving point contact probe and the fixed point contact probe are changed into a mutually separated state from an initial state of mutual contact;
a first pin shaft perpendicular to the length direction of the supporting plate is arranged in a region above the supporting plate and between the probe and the second elastic part through a transfer base, a second pin shaft and a third pin shaft which are parallel to the first pin shaft are arranged on a lower lug on the other side of the lower end surface of the body, the second pin shaft and the third pin shaft are arranged above the first pin shaft and are arranged on two sides of the first pin shaft, two ends of the second pin shaft and two ends of the third pin shaft respectively extend out from the front side and the rear side of the lower lug, a first bearing and a second bearing are arranged at two ends of the second pin shaft, a third bearing and a fourth bearing are arranged at two ends of the third pin shaft, the first bearing and the third bearing which are arranged on the front side of the lower lug are attached to the outer circumferential surface of one end of the first pin shaft, the second bearing and the fourth bearing which are arranged on the rear side of the lower lug are attached to the outer circumferential surface of the other end of the first pin shaft, the lower end of the first elastic part in a stretching state is connected with the first pin shaft, the upper end of the first elastic part is connected with a fourth pin shaft which is arranged in the body and is positioned above the second pin shaft and the third pin shaft, so that respective moving coils of the first bearing, the second bearing, the third bearing and the fourth bearing are kept in pressing contact with the outer circumferential surface of the first pin shaft;
the area of the support plate between the moving point contact probe and the adapter is provided with a hanging rod, the body is provided with a hanging hole, two ends of the second elastic piece are respectively connected to the hanging rod and the hanging hole, the second elastic piece is a spring, and the hanging rod is arranged in the through hole of the support plate.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, a cantilever is installed at one end of the support plate far away from the moving point contact probe, and the probe is installed at one end of the cantilever far away from the support plate through a probe seat.
2. In the above scheme, the cantilever further includes the riser and the horizontal plate of being connected with the riser upper end, the riser lower extreme is connected with the backup pad, the horizontal plate is kept away from riser one end and is installed the probe seat.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
1. the invention relates to a probe structure for high-frequency test, which is characterized in that a first pin shaft perpendicular to the length direction of a support plate is arranged on the rotatable support plate provided with a probe, a second pin shaft and a third pin shaft which are fixed on a body are arranged on two sides above the first pin shaft, four bearings attached to the first pin shaft are arranged at two ends of the second pin shaft and the third pin shaft, and finally the first pin shaft on the support plate and a fourth pin shaft in the body are tensioned by a first elastic piece, so that outer rings of the four bearings are kept in pressing contact with the outer circumferential surface of the first pin shaft and can rotate relatively, the fatigue problem in the prior art is eliminated, the accurate setting of position parameters in the horizontal direction and the vertical direction is facilitated, and the stability of an initial pressure set value can be still kept after long-term and high-frequency use, thereby the stability, repeatability, comparability and consistency of detection data are improved, and the defect that when the probe is separated from a chip is overcome, the probe has the defect of micro-jitter in the vertical direction, so that the time between adjacent detections is favorably shortened, the detection efficiency is improved, and unnecessary damage to a chip is avoided; and the micro rotation offset of the probe in the horizontal direction is eliminated, the accuracy of the detection data is ensured, and the stability, repeatability, comparability and consistency of the detection data are further improved.
2. According to the probe structure for the high-frequency test, the support plate is positioned between the moving point contact probe and the adapter and is provided with the hanging rod, the lifting rod is positioned in the guide channel of the body, two ends of the second elastic piece are respectively connected to the upper end of the hanging rod and the lower end of the lifting rod, the lower end of the rotating rod is connected with the upper end of the lifting rod and is used for driving the lifting rod to move in the vertical direction, the downward pressure of the probe can be conveniently adjusted, therefore, application objects are greatly expanded, the accuracy of the probe on the pressure of a chip is realized when different chips are tested, and the application range is wide; furthermore, the surface that its direction passageway and lifter contact is provided with at least a pair of locating pin and the location line recess that supplies the locating pin embedding, and the lifter is with changeing when can effectively avoiding adjusting through the rotary rod, guarantees the precision and the stability of adjusting.
Drawings
FIG. 1 is a front view of a high frequency test probe structure according to the present invention;
FIG. 2 is a schematic view of a partial structure of a probe structure for high frequency test according to the present invention;
FIG. 3 is an exploded view of the structure of FIG. 2;
FIG. 4 is a partial cross-sectional view of the structure of the probe for high frequency test in one direction according to the present invention;
FIG. 5 is a partial cross-sectional view of the high frequency test probe structure of the present invention taken in another direction;
FIG. 6 is a partial bottom view of the structure of the probe for high frequency test according to the present invention;
FIG. 7 is a schematic structural diagram of one end of a supporting plate in the probe structure for high frequency test according to the present invention;
fig. 8 is a partial structural sectional view showing a probe structure for high frequency test according to embodiment 2 of the present invention.
In the above drawings: 1. a body; 2. a support plate; 31. the moving point contacts the probe; 32. a stationary point contact probe; 4. a cantilever; 41. a vertical plate; 42. a horizontal plate; 5. a probe base; 51. a probe; 6. a transfer seat; 61. a front baffle; 62. a tailgate; 7. a first through hole; 8. a guide groove; 9. a first pin shaft; 10. a lower bump; 11. a second pin shaft; 12. a third pin shaft; 13. a first bearing; 14. a second bearing; 15. a third bearing; 16. a fourth bearing; 17. a vertical through hole; 18. a first elastic member; 19. a fourth pin shaft; 20. a hanging rod; 21. a lifting rod; 211. hanging holes; 22. a guide channel; 23. a second elastic member; 24. rotating the rod; 251. positioning pins; 252. and positioning the wire groove.
Detailed Description
In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.
Example 1: a probe structure for a high-frequency test comprises a body 1, a supporting plate 2 positioned below the body 1, a probe 51 used for contacting with a chip to be tested and a moving point contact probe 31, wherein the probe 51 and the moving point contact probe 31 are respectively installed at two ends of the supporting plate 2, the middle part of the supporting plate 2 is connected with the body 1 through a second elastic piece 23 which is vertically arranged, and a fixed point contact probe 32 which is positioned above the moving point contact probe 31 and corresponds to the moving point contact probe 31 is arranged on one side of the lower end surface of the body 1;
a first pin shaft 9 perpendicular to the length direction of the supporting plate 2 is arranged in the area between the probe 51 and the second elastic element 23 above the supporting plate 2 through a transfer seat 6, a lower boss 10 positioned at the other side of the lower end surface of the body 1 is provided with a second pin shaft 11 and a third pin shaft 12 which are parallel to the first pin shaft 9, the second pin shaft 11 and the third pin shaft 12 are positioned above the first pin shaft 9 and positioned at two sides of the first pin shaft 9, the two ends of the second pin shaft 11 and the third pin shaft 12 respectively extend out from the front and back sides of the lower boss 10, the two ends of the second pin shaft 11 are provided with a first bearing 13 and a second bearing 14, the two ends of the third pin shaft 12 are provided with a third bearing 15 and a fourth bearing 16, the first bearing 13 and the third bearing 15 positioned at the front side of the lower boss 10 are attached to the outer circumferential surface of one end of the first pin shaft 9, the second bearing 14 and the fourth bearing 16 positioned at the back side of the lower boss 10 are attached to the outer circumferential surface of the other end of the first pin shaft 9, the lower end of a first elastic part 18 in a stretching state is connected with the first pin shaft 9, and the upper end of the first elastic part 18 is connected with a fourth pin shaft 19 which is arranged in the body 1 and above the second pin shaft 11 and the third pin shaft 12, so that the respective moving coils of the first bearing 13, the second bearing 14, the third bearing 15 and the fourth bearing 16 are kept in pressing contact with the outer circumferential surface of the first pin shaft 9.
A hanging rod 20 is installed in the area of the support plate 2 between the moving point contact probe 31 and the adapter 6, a hanging hole 211 is formed in the body 1, and two ends of the second elastic element 23 are respectively connected to the hanging rod 20 and the hanging hole 211; the hanging rod 20 is arranged in the through hole of the supporting plate 2; the first elastic member 18 and the second elastic member 23 are both springs;
a cantilever 4 is arranged at one end of the supporting plate 2 far away from the moving point contact probe 31, and the probe 51 is arranged at one end of the cantilever 4 far away from the supporting plate 2 through a probe seat 5; the cantilever 4 further comprises a vertical plate 41 and a horizontal plate 42 connected with the upper end of the vertical plate 41, the lower end of the vertical plate 41 is connected with the supporting plate 2, and the end of the horizontal plate 42 far away from the vertical plate 41 is provided with a probe seat 5.
Example 2: a probe structure for high frequency test comprises a body 1, a supporting plate 2 positioned below the body 1, a probe 51 used for contacting with a chip to be tested and a moving point contact probe 31, wherein the probe 51 and the moving point contact probe 31 are respectively arranged at two ends of the supporting plate 2, the middle part of the supporting plate 2 is connected with the body 1 through a second elastic piece 23 which is vertically arranged, one side of the lower end surface of the body 1 is provided with a fixed point contact probe 32 which is positioned above the moving point contact probe 31 and corresponds to the moving point contact probe 31, when the probe contacts with the chip to be tested, the moving point contact probe rotates along with the supporting plate to be away from the fixed point contact probe, the moving point contact probe and the fixed point contact probe are changed into a mutually separated state from an initial state of mutual contact, a control system for testing the chip receives signals of mutual separation of the moving point contact probe and the fixed point contact probe, executes electrifying operation to make the probe and the chip electrically conducted, then testing various parameters of the chip;
a first pin shaft 9 perpendicular to the length direction of the supporting plate 2 is arranged in the area between the probe 51 and the second elastic element 23 above the supporting plate 2 through a transfer seat 6, a lower boss 10 positioned at the other side of the lower end surface of the body 1 is provided with a second pin shaft 11 and a third pin shaft 12 which are parallel to the first pin shaft 9, the second pin shaft 11 and the third pin shaft 12 are positioned above the first pin shaft 9 and positioned at two sides of the first pin shaft 9, the two ends of the second pin shaft 11 and the third pin shaft 12 respectively extend out from the front and back sides of the lower boss 10, the two ends of the second pin shaft 11 are provided with a first bearing 13 and a second bearing 14, the two ends of the third pin shaft 12 are provided with a third bearing 15 and a fourth bearing 16, the first bearing 13 and the third bearing 15 positioned at the front side of the lower boss 10 are attached to the outer circumferential surface of one end of the first pin shaft 9, the second bearing 14 and the fourth bearing 16 positioned at the back side of the lower boss 10 are attached to the outer circumferential surface of the other end of the first pin shaft 9, the lower end of a first elastic element 18 in a stretching state is connected with the first pin shaft 9, and the upper end of the first elastic element 18 is connected with a fourth pin shaft 19 which is arranged in the body 1 and is positioned above the second pin shaft 11 and the third pin shaft 12, so that the respective moving coils of the first bearing 13, the second bearing 14, the third bearing 15 and the fourth bearing 16 are kept in pressing contact with the outer circumferential surface of the first pin shaft 9.
A hanging rod 20 is installed on the supporting plate 2 between the moving point contact probe 31 and the adapter 6, a lifting rod 21 is located in the guide channel 22 of the body 1, two ends of the second elastic element 23 are respectively connected to the hanging rod 20 and the lower end of the lifting rod 21, and the lower end of a rotating rod 24 is connected with the upper end of the lifting rod 21 and used for driving the lifting rod 21 to move in the vertical direction;
two pairs of positioning pins 251 and positioning line grooves 252 for embedding the positioning pins 251 are arranged on the surface of the guide channel 22, which is in contact with the lifting rod 21, and the 2 positioning pins 251 and the 2 positioning line grooves 252 are symmetrically arranged;
the positioning pin 251 is located on the side surface of the lifting rod 21, and the positioning wire groove 252 is located on the inner wall of the guide passage 22;
the adapter 6 mounted on the upper surface of the support plate 2 is provided with a front baffle 61 and a rear baffle 62 which are arranged in a front-rear manner, the front baffle 61 and the rear baffle 62 are respectively provided with a first through hole 7, and two ends of the first pin shaft 9 are respectively positioned in the respective first through holes 7 of the front baffle 61 and the rear baffle 62;
the front baffle plate 61 and the rear baffle plate 62 are respectively provided with 2 guide grooves 8 positioned at two sides of the first through hole 7, and two tail ends of the second pin shaft 11 and the third pin shaft 12 are respectively embedded into the corresponding guide grooves 8;
the first bearing 13 and the third bearing 15 are located between the lower projection 10 and the front baffle 61, and the second bearing 14 and the fourth bearing 16 are located between the lower projection 10 and the rear baffle 62, respectively;
the upper end of the first elastic element 18 positioned in the vertical through hole 17 of the lower protruding block 10 is connected with the middle area of the first pin shaft 9 positioned between the front baffle 61 and the rear baffle 62.
When the probe structure for high-frequency test is adopted, a probe table is generally arranged on a driving mechanism (such as a three-axis motion platform), the probe table is moved to enable the probe to be in contact with a chip to be tested, the probe applies downward pressure to the chip and simultaneously receives upward reaction force from the chip to drive a supporting plate to rotate, a moving point contact probe arranged on the supporting plate moves downward, the initial state of contact with a stationary point contact probe is changed into a state separated from the stationary point contact probe to indicate that the probe applies proper pressure to the chip, at the moment, a control system for chip test executes power-on operation to enable the probe to be electrically conducted with the chip and test various parameters of the chip, after the test is finished, the supporting plate reversely rotates under the action of the second elastic piece and returns to the initial horizontal position, and meanwhile, the moving point contact probe is contacted with the fixed point contact probe;
in the process of testing a large number of chips for a long time and reciprocating rotation of the supporting plate, the first pin shaft arranged on the supporting plate is attached to the four bearings which are arranged on the body and arranged at two sides and two ends of the first pin shaft through the first elastic piece, so that the first pin shaft can be accurately limited while the supporting plate can smoothly rotate by taking the first pin shaft as a fulcrum, and the supporting plate can only rotate without deviating in other directions; the problem of fatigue in the prior art adopting the elastic sheet is solved, the position parameters in the horizontal and vertical directions can be accurately set, and the stability of the initial pressure set value can be still kept after long-term and high-frequency use, so that the stability, repeatability, comparability and consistency of detection data are improved, the defect that the probe has micro-jitter in the vertical direction when the probe is separated from the chip is overcome, the time between adjacent detections can be favorably shortened, the detection efficiency is improved, and unnecessary damage to the chip is avoided;
furthermore, the micro rotation offset of the probe in the horizontal direction is eliminated, the accuracy of the detection data is ensured, and the stability, repeatability, comparability and consistency of the detection data are further improved;
the adjustment of the downward pressure of the probe is convenient, so that the application objects are greatly expanded, the accuracy of the probe on the pressure of the chip is realized when different chips are tested, and the application range is wide; furthermore, the surface that its direction passageway and lifter contact is provided with at least a pair of locating pin and the location line recess that supplies the locating pin embedding, and the lifter follows the commentaries on classics when can effectively avoiding adjusting through the rotary rod, guarantees the precision and the stability of adjusting.
The probe structure for the high-frequency test can be expanded to other industries for testing semiconductor chips, is not limited to the optical communication industry, can be synchronously expanded and used in all industries needing the probe structure for the high-frequency test, and has wide application range.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (3)
1. The utility model provides a probe structure is used in high frequency test, includes body (1), backup pad (2) that are located body (1) below, is used for probe (51) and moving point contact probe (31) with the chip contact of awaiting measuring, its characterized in that: the probe (51) and the moving point contact probe (31) are respectively installed at two ends of the supporting plate (2), the middle of the supporting plate (2) is connected with the body (1) through a second elastic piece (23) which is vertically arranged, one side of the lower end face of the body (1) is provided with a fixed point contact probe (32) which is positioned above the moving point contact probe (31) and corresponds to the moving point contact probe (31), when the probe (51) is contacted with a chip to be tested, the moving point contact probe (31) rotates along with the supporting plate (2) to be away from the fixed point contact probe (32), and the moving point contact probe (31) and the fixed point contact probe (32) are changed into a mutually separated state from an initial state of mutual contact;
a first pin shaft (9) perpendicular to the length direction of the support plate (2) is installed in a region between the probe (51) and the second elastic piece (23) above the support plate (2) through a transfer seat (6), a second pin shaft (11) and a third pin shaft (12) which are parallel to the first pin shaft (9) are arranged on a lower convex block (10) on the other side of the lower end face of the body (1), the second pin shaft (11) and the third pin shaft (12) are located above the first pin shaft (9) and on two sides of the first pin shaft, the respective two ends of the second pin shaft (11) and the third pin shaft (12) extend from the front side and the back side of the lower convex block (10), a first bearing (13) and a second bearing (14) are installed at two ends of the second pin shaft (11), a third bearing (15) and a fourth bearing (16) are installed at two ends of the third pin shaft (12), and a first bearing (13) and a second bearing (16) which are located on the front side of the lower convex block (10), A third bearing (15) is attached to the outer circumferential surface of one end of the first pin shaft (9), a second bearing (14) and a fourth bearing (16) which are positioned on the rear side of the lower protruding block (10) are attached to the outer circumferential surface of the other end of the first pin shaft (9), the lower end of a first elastic piece (18) in a stretching state is connected with the first pin shaft (9), the upper end of the first elastic piece (18) is connected with a fourth pin shaft (19) which is positioned in the body (1) and above the second pin shaft (11) and the third pin shaft (12), so that respective moving coils of the first bearing (13), the second bearing (14), the third bearing (15) and the fourth bearing (16) are kept in pressing contact with the outer circumferential surface of the first pin shaft (9);
the area of backup pad (2) between being located movable point contact probe (31) and adapter (6) installs a peg (20), be provided with a hanging hole (211) on body (1), second elastic component (23) both ends are connected to on peg (20) and hanging hole (211) respectively, second elastic component (23) are the spring, peg (20) set up in the through-hole of backup pad (2).
2. The probe structure for high frequency test according to claim 1, wherein: one end of the support plate (2) far away from the moving point contact probe (31) is provided with a cantilever (4), and the probe (51) is arranged at one end of the cantilever (4) far away from the support plate (2) through a probe seat (5).
3. The probe structure for high frequency test according to claim 2, wherein: cantilever (4) further include riser (41) and horizontal plate (42) be connected with riser (41) upper end, riser (41) lower extreme is connected with backup pad (2), vertical plate (41) one end is kept away from in horizontal plate (42) and probe seat (5) are installed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210367993.0A CN114740237A (en) | 2021-08-09 | 2021-08-09 | Probe structure for high frequency test |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110906710.0A CN113533939B (en) | 2021-08-09 | 2021-08-09 | Probe station for chip test |
| CN202210367993.0A CN114740237A (en) | 2021-08-09 | 2021-08-09 | Probe structure for high frequency test |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110906710.0A Division CN113533939B (en) | 2021-08-09 | 2021-08-09 | Probe station for chip test |
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| CN114740237A true CN114740237A (en) | 2022-07-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210367993.0A Pending CN114740237A (en) | 2021-08-09 | 2021-08-09 | Probe structure for high frequency test |
| CN202110906710.0A Active CN113533939B (en) | 2021-08-09 | 2021-08-09 | Probe station for chip test |
| CN202210371465.2A Pending CN115704857A (en) | 2021-08-09 | 2021-08-09 | Test probe station for laser chip |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110906710.0A Active CN113533939B (en) | 2021-08-09 | 2021-08-09 | Probe station for chip test |
| CN202210371465.2A Pending CN115704857A (en) | 2021-08-09 | 2021-08-09 | Test probe station for laser chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115856370A (en) * | 2023-02-01 | 2023-03-28 | 苏州中熙精密电机有限公司 | Flying probe module and flying probe tester |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116519998A (en) * | 2022-04-21 | 2023-08-01 | 河北圣昊光电科技有限公司 | Probe adjusting piece, probe frame and test platform |
| CN114859213A (en) * | 2022-07-05 | 2022-08-05 | 深圳市标谱半导体科技有限公司 | Test needle adjusting part and chip test equipment |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030178988A1 (en) * | 2002-03-22 | 2003-09-25 | Electro Scientific Industries, Inc. | Test probe alignment apparatus |
| JP2005049280A (en) * | 2003-07-30 | 2005-02-24 | Sony Corp | Probe system |
| JP2008311075A (en) * | 2007-06-14 | 2008-12-25 | Alps Electric Co Ltd | Socket for electronic component and manufacturing method therefor |
| KR101255095B1 (en) * | 2013-01-30 | 2013-04-16 | 주식회사 프로이천 | Film type pin board |
| CN207557349U (en) * | 2017-12-12 | 2018-06-29 | 万盛兴精密技术（惠州）有限公司 | A kind of electric resistance measuring apparatus |
| CN208334440U (en) * | 2018-06-15 | 2019-01-04 | 苏州联讯仪器有限公司 | A kind of chip of laser test spring probe component and the test device using it |
| CN109387773A (en) * | 2018-10-22 | 2019-02-26 | 青岛海信宽带多媒体技术有限公司 | Powering on mechanism |
| CN111239444A (en) * | 2020-03-17 | 2020-06-05 | 山东省科学院激光研究所 | Positioning detection device based on leaf spring fine adjustment |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2632136B2 (en) * | 1994-10-17 | 1997-07-23 | 日本電子材料株式会社 | High temperature probe card |
| KR100257053B1 (en) * | 1997-06-18 | 2000-05-15 | 정인권 | Work press of ic chip tester |
| GB9724457D0 (en) * | 1997-11-20 | 1998-01-14 | Dage Precision Ind Limited | Test apparatus |
| SG108210A1 (en) * | 1998-06-19 | 2005-01-28 | Advantest Corp | Probe contactor formed by photolithography process |
| CN2457596Y (en) * | 2000-12-27 | 2001-10-31 | 中国科学院上海技术物理研究所 | Adjustable constant pressure probe drive frame |
| CH695122A5 (en) * | 2002-02-20 | 2005-12-15 | Ismeca Semiconductor Holding | System for actuating electronic component contactor containing contact force controlling mechanism |
| CN101826505A (en) * | 2009-03-05 | 2010-09-08 | 南茂科技股份有限公司 | Packaging substrate and chip packaging structure |
| CN101769944B (en) * | 2009-12-30 | 2012-04-25 | 广东志成华科光电设备有限公司 | Micromotion detection device used for detecting LED chip |
| CN102360062B (en) * | 2011-08-23 | 2014-09-03 | 广东志成华科光电设备有限公司 | Chip detector for SMD (Surface Mounted Device) LED (Light-Emitting Diode) chip light spitting machine |
| CN202210136U (en) * | 2011-08-23 | 2012-05-02 | 广东志成华科光电设备有限公司 | Chip detection device for SMD LED paster beam-splitting machine |
| TW201344213A (en) * | 2012-04-17 | 2013-11-01 | Mpi Corp | Electromagnetic controlled point contact apparatus |
| CN202757956U (en) * | 2012-08-01 | 2013-02-27 | 旺矽科技股份有限公司 | Rotatable edge sensor |
| CN203535079U (en) * | 2013-09-12 | 2014-04-09 | 旺矽科技股份有限公司 | Probe apparatus |
| CN203909100U (en) * | 2014-06-19 | 2014-10-29 | 高新华 | Semiconductor chip test probe station |
| CN207396556U (en) * | 2017-08-01 | 2018-05-22 | 深圳市矽电半导体设备有限公司 | Probe mounting structure and LED core chip test system |
| CN207851234U (en) * | 2018-03-06 | 2018-09-11 | 深圳市朝阳光科技有限公司 | The crystal grain point measurement machine of probe unit and adjust automatically probe pressure |
| CN210072002U (en) * | 2019-04-12 | 2020-02-14 | 深圳市迅特通信技术有限公司 | COC chip aging testing equipment |
| CN209946318U (en) * | 2019-04-30 | 2020-01-14 | 北京大学 | Sample platform and chip electrode self-sealing structure for in-situ atmosphere thermoelectric two-field test |
| CN210283623U (en) * | 2019-05-06 | 2020-04-10 | 广州众诺电子技术有限公司 | Chip detection device |
| CN210604727U (en) * | 2019-07-02 | 2020-05-22 | 元鼎丰投资有限公司 | Probe card for wafer multi-point test |
| CN211784059U (en) * | 2019-08-07 | 2020-10-27 | 苏州伊欧陆系统集成有限公司 | Piezoresistive pressure sensor chip on-chip testing device |
| CN212207459U (en) * | 2020-04-24 | 2020-12-22 | 胤达智能科技(昆山)有限公司 | Automatic detection line of integrated circuit chip |
| CN212514886U (en) * | 2020-04-28 | 2021-02-09 | 天津蓝鳍科技有限公司 | Probe card fine-tuning device and coupling device of photonic integrated chip test system |
-
2021
- 2021-08-09 CN CN202210367993.0A patent/CN114740237A/en active Pending
- 2021-08-09 CN CN202110906710.0A patent/CN113533939B/en active Active
- 2021-08-09 CN CN202210371465.2A patent/CN115704857A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030178988A1 (en) * | 2002-03-22 | 2003-09-25 | Electro Scientific Industries, Inc. | Test probe alignment apparatus |
| JP2005049280A (en) * | 2003-07-30 | 2005-02-24 | Sony Corp | Probe system |
| JP2008311075A (en) * | 2007-06-14 | 2008-12-25 | Alps Electric Co Ltd | Socket for electronic component and manufacturing method therefor |
| KR101255095B1 (en) * | 2013-01-30 | 2013-04-16 | 주식회사 프로이천 | Film type pin board |
| CN207557349U (en) * | 2017-12-12 | 2018-06-29 | 万盛兴精密技术（惠州）有限公司 | A kind of electric resistance measuring apparatus |
| CN208334440U (en) * | 2018-06-15 | 2019-01-04 | 苏州联讯仪器有限公司 | A kind of chip of laser test spring probe component and the test device using it |
| CN109387773A (en) * | 2018-10-22 | 2019-02-26 | 青岛海信宽带多媒体技术有限公司 | Powering on mechanism |
| CN111239444A (en) * | 2020-03-17 | 2020-06-05 | 山东省科学院激光研究所 | Positioning detection device based on leaf spring fine adjustment |
Non-Patent Citations (2)
| Title |
|---|
| 赵联春, 马家驹, 曹志飞, 刘雪峰, 刘朝晖: "传感器安装方式对轴承振动测量特性的影响", 轴承, no. 01, 5 January 2003 (2003-01-05), pages 26 - 28 * |
| 顾吉、吴建伟: "一种微型探针台的设计和应用", 电子与封装, vol. 17, no. 1, 31 January 2017 (2017-01-31), pages 41 - 46 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115856370A (en) * | 2023-02-01 | 2023-03-28 | 苏州中熙精密电机有限公司 | Flying probe module and flying probe tester |
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|---|---|
| CN115704857A (en) | 2023-02-17 |
| CN113533939B (en) | 2022-03-15 |
| CN113533939A (en) | 2021-10-22 |
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