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CN114731763A - 内埋电路板及其制造方法 - Google Patents

内埋电路板及其制造方法 Download PDF

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Publication number
CN114731763A
CN114731763A CN202080081568.4A CN202080081568A CN114731763A CN 114731763 A CN114731763 A CN 114731763A CN 202080081568 A CN202080081568 A CN 202080081568A CN 114731763 A CN114731763 A CN 114731763A
Authority
CN
China
Prior art keywords
layer
conductive
circuit
circuit board
mounting groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080081568.4A
Other languages
English (en)
Inventor
李成佳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongqisheng Precision Electronics Qinhuangdao Co Ltd
Avary Holding Shenzhen Co Ltd
Original Assignee
Hongqisheng Precision Electronics Qinhuangdao Co Ltd
Avary Holding Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongqisheng Precision Electronics Qinhuangdao Co Ltd, Avary Holding Shenzhen Co Ltd filed Critical Hongqisheng Precision Electronics Qinhuangdao Co Ltd
Publication of CN114731763A publication Critical patent/CN114731763A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4679—Aligning added circuit layers or via connections relative to previous circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2027—Guiding means, e.g. for guiding flexible circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种内埋电路板(100)，包括一设有安装槽(101)的电路板(10)和多个零件(20)，所述多个零件(20)设置于所述安装槽(101)内，并电连接所述电路板(10)。所述电路板(10)包括围绕所述安装槽(101)设置的多层电路基板(11,12,13,14)，所述多层电路基板(11,12,13,14)堆叠设置。所述内埋电路板(100)包括导电件(30)，所述导电件(30)设置于所述安装槽(101)内，并电连接所述多个零件(20)与所述多层电路基板(11,12,13,14)，至少两个零件(20)通过所述导电件(30)电连接，有利于发挥零件功能，又减少损耗。

Description

PCT国内申请，说明书已公开。

Claims (10)

  1. PCT国内申请，权利要求书已公开。
CN202080081568.4A 2020-04-27 2020-04-27 内埋电路板及其制造方法 Pending CN114731763A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/087172 WO2021217326A1 (zh) 2020-04-27 2020-04-27 内埋电路板及其制造方法

Publications (1)

Publication Number Publication Date
CN114731763A true CN114731763A (zh) 2022-07-08

Family

ID=78373841

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080081568.4A Pending CN114731763A (zh) 2020-04-27 2020-04-27 内埋电路板及其制造方法

Country Status (4)

Country Link
US (1) US20220418101A1 (zh)
CN (1) CN114731763A (zh)
TW (1) TWI741574B (zh)
WO (1) WO2021217326A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117177431A (zh) * 2022-05-25 2023-12-05 鹏鼎控股(深圳)股份有限公司 电路板及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110216513A1 (en) * 2010-03-05 2011-09-08 Samsung Electro-Mechanics Co., Ltd. Electro device embedded printed circuit board and manufacturing method thereof
CN102348328A (zh) * 2011-09-15 2012-02-08 深南电路有限公司 芯片埋入方法和芯片埋入式电路板
US20140151104A1 (en) * 2012-12-04 2014-06-05 Samsung Electro-Mechanics Co., Ltd. Electronic component embedded substrate and manufacturing method thereof
JP2016136615A (ja) * 2015-01-23 2016-07-28 サムソン エレクトロ−メカニックス カンパニーリミテッド． 電子部品内蔵基板およびその製造方法
CN109862695A (zh) * 2017-11-30 2019-06-07 宏启胜精密电子(秦皇岛)有限公司 内埋式电路板及其制作方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0734511B2 (ja) * 1990-03-28 1995-04-12 太陽誘電株式会社 多層基板の電子部品実装構造及びその実装方法
JP3926141B2 (ja) * 2000-12-27 2007-06-06 日本特殊陶業株式会社 配線基板
US8064214B2 (en) * 2008-01-04 2011-11-22 Dialogic Corporation Press fit passive component
US8908387B2 (en) * 2011-10-31 2014-12-09 Ibiden Co., Ltd. Wiring board and method for manufacturing the same
US9839131B2 (en) * 2015-10-21 2017-12-05 International Business Machines Corporation Embedding a discrete electrical device in a printed circuit board
JP6813314B2 (ja) * 2016-09-15 2021-01-13 ローム株式会社 半導体装置およびその製造方法
CN108617089B (zh) * 2016-12-10 2020-12-22 宏启胜精密电子(秦皇岛)有限公司 内埋元件柔性电路板及其制造方法
CN109587974A (zh) * 2017-09-28 2019-04-05 宏启胜精密电子(秦皇岛)有限公司 柔性电路板及该柔性电路板的制造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110216513A1 (en) * 2010-03-05 2011-09-08 Samsung Electro-Mechanics Co., Ltd. Electro device embedded printed circuit board and manufacturing method thereof
CN102348328A (zh) * 2011-09-15 2012-02-08 深南电路有限公司 芯片埋入方法和芯片埋入式电路板
US20140151104A1 (en) * 2012-12-04 2014-06-05 Samsung Electro-Mechanics Co., Ltd. Electronic component embedded substrate and manufacturing method thereof
JP2016136615A (ja) * 2015-01-23 2016-07-28 サムソン エレクトロ−メカニックス カンパニーリミテッド． 電子部品内蔵基板およびその製造方法
CN109862695A (zh) * 2017-11-30 2019-06-07 宏启胜精密电子(秦皇岛)有限公司 内埋式电路板及其制作方法

Also Published As

Publication number Publication date
US20220418101A1 (en) 2022-12-29
WO2021217326A1 (zh) 2021-11-04
TW202142068A (zh) 2021-11-01
TWI741574B (zh) 2021-10-01

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Application publication date: 20220708