CN114706092A

CN114706092A - Time-of-flight module, assembling method thereof, shooting assembly and terminal

Info

Publication number: CN114706092A
Application number: CN202210239082.XA
Authority: CN
Inventors: 戴阳; 刘海亮
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2022-03-11
Filing date: 2022-03-11
Publication date: 2022-07-05
Also published as: WO2023169057A1

Abstract

The application discloses a time-of-flight module, an assembling method thereof, a shooting assembly and a terminal. The time-of-flight module comprises an integrated support, a heat dissipation plate, a circuit board, a light source, a sensor, a first optical assembly and a second optical assembly, wherein the first optical assembly and the second optical assembly are fixed on the support. Wherein: the heat dissipation plate comprises a first area and a second area, the first side of the circuit board is combined with the first area, the light source is arranged in the second area, and the light source and the sensor are both electrically connected with the circuit board; the support is arranged on the second side of the circuit board, an accommodating cavity capable of accommodating the light source and the sensor is formed by the support and the circuit board, and the second side of the circuit board is back to the first side of the circuit board. The first optical component is arranged on the bracket, corresponds to the light source and is used for guiding the light emitted by the light source to the outside of the time-of-flight module. The second optical assembly is arranged on the bracket and corresponds to the sensor, and is used for receiving at least part of light reflected by the object and guiding the light to the sensor.

Description

Time-of-flight module, assembling method thereof, shooting assembly and terminal

Technical Field

The application relates to the technical field of distance measurement, in particular to a time of flight module, an assembling method of the time of flight module, a shooting assembly and a terminal.

Background

Time of flight (ToF) is a technique that calculates the distance between an object and a sensor by measuring the Time difference between the transmitted signal and the signal reflected back by the object. When the time-of-flight module normally works, heat generated by the light source is transferred to the circuit board, so that the temperature of the circuit board is increased, and the circuit board may not work normally.

Disclosure of Invention

The embodiment of the application provides a time-of-flight module, a terminal and an assembling method of the time-of-flight module.

The time-of-flight module of this application embodiment includes integrative support, heating panel, circuit board, light source, sensor and is fixed in the first optical assembly and the second optical assembly of support. Wherein: the heat dissipation plate comprises a first area and a second area, the first side of the circuit board is combined with the first area, the light source is arranged in the second area, and the light source and the sensor are both electrically connected with the circuit board; the support is arranged on the second side of the circuit board, an accommodating cavity capable of accommodating the light source and the sensor is formed by the support and the circuit board, and the second side of the circuit board is back to the first side of the circuit board. The first optical assembly is mounted on the bracket, corresponds to the light source and is used for guiding the light emitted by the light source to the outside of the time-of-flight module. The second optical assembly is mounted on the bracket and corresponds to the sensor, and is used for receiving at least part of the light reflected by the object and guiding the light to the sensor.

The terminal of this application embodiment includes casing and time of flight module, the casing with the time of flight module combines. The flight time module comprises an integrated support, a heat dissipation plate, a circuit board, a light source, a sensor, a first optical assembly and a second optical assembly, wherein the first optical assembly and the second optical assembly are fixed on the support. Wherein: the heat dissipation plate comprises a first area and a second area, the first side of the circuit board is combined with the first area, the light source is arranged in the second area, and the light source and the sensor are both electrically connected with the circuit board; the support is arranged on the second side of the circuit board, an accommodating cavity capable of accommodating the light source and the sensor is formed by the support and the circuit board, and the second side of the circuit board is back to the first side of the circuit board. The first optical assembly is mounted on the bracket, corresponds to the light source and is used for guiding the light emitted by the light source to the outside of the time-of-flight module. The second optical assembly is mounted on the bracket and corresponds to the sensor, and is used for receiving at least part of the light reflected by the object and guiding the light to the sensor.

The shooting component of the embodiment of the application comprises a two-dimensional camera module and a flight time module. The two-dimensional camera module is used for acquiring a two-dimensional image, the time-of-flight module is used for acquiring a depth information image, and the distance between the center of the sensor of the time-of-flight module and the center of the two-dimensional camera module is smaller than a second preset distance. The flight time module comprises an integrated support, a heat dissipation plate, a circuit board, a light source, a sensor, a first optical assembly and a second optical assembly, wherein the first optical assembly and the second optical assembly are fixed on the support. Wherein: the heat dissipation plate comprises a first area and a second area, the first side of the circuit board is combined with the first area, the light source is arranged in the second area, and the light source and the sensor are both electrically connected with the circuit board; the support is arranged on the second side of the circuit board, an accommodating cavity capable of accommodating the light source and the sensor is formed by the support and the circuit board, and the second side of the circuit board is back to the first side of the circuit board. The first optical assembly is mounted on the bracket, corresponds to the light source and is used for guiding the light emitted by the light source to the outside of the time-of-flight module. The second optical assembly is mounted on the bracket and corresponds to the sensor, and is used for receiving at least part of the light reflected by the object and guiding the light to the sensor.

The terminal of this application embodiment includes the casing and shoots the subassembly, the casing with shoot the subassembly and combine. The shooting assembly comprises a two-dimensional camera module and a flight time module. The two-dimensional camera module is used for acquiring a two-dimensional image, the time-of-flight module is used for acquiring a depth information image, and the distance between the center of the sensor of the time-of-flight module and the center of the two-dimensional camera module is smaller than a second preset distance. The flight time module comprises an integrated support, a heat dissipation plate, a circuit board, a light source, a sensor, a first optical assembly and a second optical assembly, wherein the first optical assembly and the second optical assembly are fixed on the support. Wherein: the heat dissipation plate comprises a first area and a second area, the first side of the circuit board is combined with the first area, the light source is arranged in the second area, and the light source and the sensor are both electrically connected with the circuit board; the support is arranged on the second side of the circuit board, an accommodating cavity capable of accommodating the light source and the sensor is formed by the support and the circuit board, and the second side of the circuit board is back to the first side of the circuit board. The first optical assembly is arranged on the bracket, corresponds to the light source and is used for guiding the light emitted by the light source to the outside of the time-of-flight module. The second optical assembly is arranged on the bracket and corresponds to the sensor, and is used for receiving at least part of the light reflected by the object and guiding the light to the sensor.

The application provides a method for assembling a time-of-flight module, comprising the following steps: providing a heat dissipation plate, wherein the heat dissipation plate comprises a first area and a second area, and the first side of the circuit board is combined with the first area; arranging a light source in the second area of the heat dissipation plate, installing the sensor to the circuit board, and electrically connecting the light source and the sensor with the circuit board; mounting the first optical assembly to an integral bracket; installing the bracket provided with the first optical assembly on a second side of the circuit board, wherein the bracket and the circuit board form an accommodating cavity so that the sensor and the light source are accommodated in the accommodating cavity, and the first optical assembly corresponds to the light source; and mounting a second optical component on the bracket so that the second optical component corresponds to the sensor.

The application provides a method for assembling a time-of-flight module, comprising the following steps: providing a heat dissipation plate, wherein the heat dissipation plate comprises a first area and a second area, and the first side of the circuit board is combined with the first area; arranging a light source in the second area of the heat dissipation plate, installing the sensor to the circuit board, and electrically connecting the light source and the sensor with the circuit board; fixing an integrated bracket on the second side of the circuit board, wherein the bracket and the circuit board form an accommodating cavity so that the sensor and the light source are accommodated in the accommodating cavity; and fixing the first optical assembly and the second optical assembly on the bracket so that the first optical assembly corresponds to the light source and the second optical assembly corresponds to the sensor.

According to the time-of-flight module, the assembling method of the time-of-flight module, the shooting assembly and the terminal in the embodiment of the application, the light source is arranged in the second area of the radiating plate in the time-of-flight module, and the first area of the radiating plate is combined with the circuit board, so that compared with the situation that the light source is directly arranged on the circuit board, heat generated by the light source can be prevented from being transmitted to the circuit board, and the situation that the circuit board cannot normally work due to the fact that the temperature of the circuit board rises is avoided.

Additional aspects and advantages of embodiments of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic cross-sectional view of a three-dimensional structure of a time-of-flight module in certain embodiments of the present application;

FIG. 2 is an exploded view of the three-dimensional structure of a time-of-flight module in some embodiments of the present application;

FIGS. 3 and 4 are schematic diagrams of the relationship between the baseline and the distance traveled by the spot in the sensor in the time-of-flight module according to some embodiments of the present disclosure;

FIG. 5 is a schematic diagram of a time-of-flight module in accordance with certain embodiments of the present disclosure;

FIG. 6 is a schematic diagram of a conventional time-of-flight module and a time-of-flight module according to some embodiments of the present disclosure

FIG. 7 is a schematic diagram of a prior art time-of-flight module portion configuration and a time-of-flight module portion configuration in certain embodiments of the present application;

FIGS. 8 and 9 are schematic structural diagrams of a time of flight module according to certain embodiments of the present disclosure;

FIGS. 10 and 11 are schematic diagrams of electrical connections between a light source and a circuit board in a time-of-flight module according to some embodiments of the present disclosure;

FIG. 12 is a schematic structural diagram of a portion of the structure of a time-of-flight module in some embodiments of the present application;

FIGS. 13-15 are schematic structural diagrams of a first optical element in a time of flight module according to some embodiments of the present disclosure;

FIG. 16 is a schematic diagram showing the relationship between the back focus size of the optical element in the light-emitting module and the length, width and height of the light-emitting module;

FIGS. 17 and 18 are schematic structural views of a second optical element in a time of flight module according to some embodiments of the present disclosure;

fig. 19 and 20 are schematic structural views of a terminal according to some embodiments of the present application;

fig. 21-24 are flow charts illustrating methods of assembling a time of flight module according to certain embodiments of the present disclosure.

Detailed Description

Embodiments of the present application will be further described below with reference to the accompanying drawings. The same or similar reference numbers in the drawings identify the same or similar elements or elements having the same or similar functionality throughout.

In addition, the embodiments of the present application described below in conjunction with the accompanying drawings are exemplary and are only for the purpose of explaining the embodiments of the present application, and are not to be construed as limiting the present application.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Referring to fig. 1 and 2, a time-of-flight module 100 is provided according to an embodiment of the present disclosure. The time-of-flight module 100 includes an integrated bracket 50, a heat sink 20, a circuit board 10, a light source 30, a sensor 40, and a first optical element 60 and a second optical element 70 fixed to the bracket 50. The heat dissipation plate 20 includes a first area 201 and a second area 202, the first side 11 of the circuit board 10 is combined with the first area 201, the light source 30 is disposed in the second area 202, and both the light source 30 and the sensor 40 are electrically connected to the circuit board 10. The bracket 50 is mounted on the second side 12 of the circuit board 10, and forms an accommodating cavity 501 with the circuit board 10, which can accommodate the light source 30 and the sensor 40, and the second side 12 of the circuit board 10 is opposite to the first side 11 of the circuit board 10. The first optical assembly 60 is mounted on the bracket 50 and corresponds to the light source 30, and is used for guiding the light emitted by the light source 30 to the outside of the time-of-flight module 100. The second optical assembly 70 is mounted to the bracket 50 and corresponds to the sensor 40, and is configured to receive at least a portion of the light reflected by the object and direct the light to the sensor 40.

The time of flight module 100 in this application is through setting up the light source 30 in the second district 202 of heating panel 20, and the first district 201 of heating panel 20 combines with circuit board 10, compares in directly locating light source 30 on circuit board 10, can avoid the heat transfer that light source 30 produced to circuit board 10 to avoid appearing because the temperature of circuit board 10 risees, lead to the condition that circuit board 10 can not normally work.

The following is further described with reference to the accompanying drawings.

Referring to fig. 1 and 2, the time-of-flight module 100 includes an integrated bracket 50, a heat dissipation plate 20, a circuit board 10, a light source 30, a sensor 40, a first optical element 60, and a second optical element 70. The sensor 40 and the light source 30 provided on the heat sink 20 are electrically connected to the circuit board 10. The light source 30 is used for emitting light outwards, and the first optical assembly 60 is disposed on the bracket 50 and corresponds to the light source 30, so as to guide the light emitted by the light source 30 out of the time-of-flight module 100; the second optical assembly 70 is disposed on the bracket 50 and corresponds to the sensor 40 to guide the received light reflected by the object to the sensor 40, and the sensor 40 is used to convert the received light into an electrical signal.

Specifically, the heat dissipation plate 20 includes a first region 201 and a second region 202, the circuit board 10 includes a first side 11 and a second side 12 opposite to each other, and the first region 201 of the heat dissipation plate 20 is combined with the first side 11 of the circuit board 10. The light source 30 is disposed in the second region 202 of the heat sink 20, and the heat sink 20 is used for dissipating heat from the light source 30. Because the heat dissipation plate 20 can dissipate heat of the light source 30, that is, heat generated by the light source 30 arranged on the heat dissipation plate 20 during normal operation can be dissipated through the heat dissipation plate 20, compared with the case that the light source 30 is directly arranged on the circuit board 10, the heat generated by the light source 30 can be prevented from being transferred to the circuit board 10, and therefore the situation that the circuit board 10 cannot normally operate due to the rise of the temperature of the circuit board 10 is avoided. It should be noted that, in some embodiments, the heat dissipation plate 20 may be made of a ceramic material, that is, the heat dissipation plate 20 may be a ceramic plate. Of course, the heat dissipation plate 20 may be made of other materials capable of dissipating heat, and is not limited herein

Referring to fig. 1, in some embodiments, the distance between the center of the sensor 40 and the center of the light source 30 is less than a first predetermined distance. This is advantageous for the time-of-flight module 100 to obtain the depth information of the object. In some embodiments, the first preset distance may be 5mm, i.e., the distance between the center of the sensor 40 and the center of the light source 30 is less than 5 mm. For example, the distance between the center of the sensor 40 and the center of the light source 30 may be 4mm, 3.5mm, 2mm, etc. without limitation. Of course, in some embodiments, the distance between the center of the sensor 40 and the center of the light source 30 may also be equal to 5 mm. Preferably, in some embodiments, the distance between the center of the sensor 40 and the center of the light source 30 may be 3.6 mm. The distance between the sensor 40 and the optical center of the light source 30 is defined as a baseline, and the baseline appearing hereinafter is also explained as well, and is not described in detail.

It should be noted that, in the embodiment of the present application, the Time of flight module 100 is based on a Time of flight (ToF) technique to obtain depth information of an object to be measured. The time-of-flight technique calculates depth information of the object to be measured based on a time difference between the emitted light and the received light reflected by the object to be measured. Therefore, during the design process, the position of the light spot irradiated on the sensor in the receiving end is expected not to change as much as possible, which is beneficial to simplifying the design of the sensor reading circuit.

Since the baseline distance of the time-of-flight module 100 can be shortened in this embodiment, the time-of-flight module 100 can acquire the depth information of the object to be measured. Specifically, when the light is projected, it is reflected by the target back to the receiving end, and can be received by a certain pixel or pixels of the sensor 40 in the receiving end. For the same pixel, when the distance between the target object and the module changes, the position on which the pixel is finally projected also changes. For example, as shown in fig. 3, point D emits a beam of laser light, and when the target is at position F, the laser light is reflected through the focal point C of the receiving end and finally irradiates point a on the image plane (plane where point AB is located) of the sensor 40; when the object is at the E position, it passes through the C point of the focal point of the receiving end lens group (i.e. the second optical assembly 70) and then irradiates the B point of the sensor 40. It can be seen that the same laser beam, due to the different distances of the target object from the module, may eventually be received by different areas/pixels of the sensor 40. Defining the above-mentioned difference of the moving distance on the sensor 40 as L_disparityThe focal length of the receiving lens (i.e. the second optical assembly 70) is f, and the distance between the optical center of the light emitting module and the optical center of the light receiving module is the baseline L_baselineThe distance between the target object and the laser radar ranging module is L_rangeThe above parameters obey the following relationships:

that is, the focal length f of the lens (i.e. the second optical assembly 70) at the receiving end and the distance L between the target object and the lidar ranging module_rangeIn a certain case, the difference L in the moving distance of the sensor 40_disparityAnd a base line L_baselineIs in direct proportion. Assume baseline L_baseline3mm (typical value of the distance between the center of the emitting module and the center of the light receiving module in the conventional time-of-flight module 100 is 10mm), the equivalent focal length of the second optical element 70 is 1.63mm, the distance between the current object to be measured is changed when the size of the pixel in the sensor 40 is 10um., and the light spot on the sensor 40 changesThe movement relationship is shown in fig. 4. It will be appreciated that at base line L_baselineUnder influence, the laser spot position mainly has influence on short-range ranging (such as less than 2 m). The time-of-flight module 100 calculates the depth information of the object to be measured based on the time difference between the emitted light and the received light reflected by the object to be measured. Therefore, it is desirable that the position of the light spot irradiated on the sensor 40 is not changed as much as possible during the design process, which is advantageous for simplifying the design of the readout circuit of the sensor 40. As can be seen from fig. 4, when the target distance is 0.3m, the spot position is shifted by only about 2.5 pixels when the center distance between the emission module and the light reception module is small (3 mm), but the spot position is shifted by about 8 pixels when the center distance between the emission module and the light reception module is large (10 mm). Thus, it can be shown that shortening the baseline distance of the time-of-flight module 100 is beneficial for the time-of-flight module 100 to obtain the depth information of the object to be measured.

Referring to fig. 5, in some embodiments, the circuit board 10 is formed with a first through hole 13 penetrating through the first side 11 and the second side 12, and the first through hole 13 corresponds to the second area 202, so that the light emitted from the light source 30 disposed on the second area 202 can be smoothly emitted.

For example, referring to fig. 5, in some embodiments, the light source 30 is disposed in the second region 202 and is received in the first through hole 13. On one hand, since the light source 30 is disposed in the second region 202 of the heat dissipation plate 20, compared to the light source 30 directly disposed on the circuit board 10, the heat generated by the light source 30 can be prevented from being transferred to the circuit board 10. On the other hand, since other electronic components 801 are usually disposed around the light source 30, the electronic components 801 need to be spaced apart from the light source 30 (as shown in the left side of fig. 6), and the light source 30 is disposed in the second region 202 and accommodated in the first through hole 13, so that the lateral distance between the electronic components 801 and the light source 30 can be shortened, and the electronic components 801 can be prevented from contacting the light source 30 (as shown in the right side of fig. 6). Thus, the baseline distance of the time-of-flight module 100 can be further shortened on the premise of ensuring the normal operation of the time-of-flight module 100. On the other hand, it can be understood that when the light source 30 is directly disposed on the second side 12 of the circuit board 10 as shown in the left view of fig. 7, the light emitted from the light source 30 may be directly incident on the second optical assembly 70 and then guided to the sensor 40, i.e., unnecessary stray light is introduced. In the present application (as shown in the right side of fig. 7), since the light source 30 is disposed in the second region 202 and is accommodated in the first through hole 13 of the circuit board 10, compared to the light source 30 directly disposed on the second side 12 of the circuit board 10, the circuit board 10 can block at least a part of the light emitted by the light source 30 from entering the second optical component 70, so as to reduce the stray light interference in the time-of-flight module 100, and facilitate the time-of-flight module 100 to obtain the accuracy of the depth information of the object to be measured. On the other hand, since the light source 30 is disposed in the second region 202 and is accommodated in the first through hole 13, the overall thickness of the optical time-of-flight module 100 can be reduced without changing the distance between the light source 30 and the first optical element 60.

For another example, referring to fig. 8, in some embodiments, the second region 202 includes a protrusion 21 protruding toward the circuit board 10, the protrusion 21 can be exposed from the second side 12 of the circuit board 10 through the first through hole 13, and the light source 30 is disposed on a side of the protrusion 21 away from the circuit board 10. On one hand, since the light source 30 is disposed in the second region 202 of the heat dissipation plate 20, compared to the light source 30 directly disposed on the circuit board 10, the heat generated by the light source 30 can be prevented from being transferred to the circuit board 10. On the other hand, since the protruding portion 21 can be exposed from the second side 12 of the circuit board 10 through the first through hole 13, the light source 30 is disposed on a side of the protruding portion 21 away from the circuit board 10, and there is a height difference between the light source 30 and the second side 12 of the circuit board 10 in the light emitting direction of the light source 30. In this way, by providing the light source 30 on the side of the protruding portion 21 away from the circuit board 10, the lateral distance between the electronic component 801 and the light source 30 can be shortened, and the electronic component 801 and the light source 30 can be prevented from contacting each other. That is, by disposing the light source 30 on the side of the protruding portion 21 away from the circuit board 10, the baseline distance of the time-of-flight module 100 can be further shortened on the premise of ensuring the normal operation of the time-of-flight module 100.

It should be noted that, in some embodiments, as shown in fig. 9, in some embodiments, the area of the circuit board 10 is smaller than that of the heat dissipation plate 20. That is, the circuit board 10 cannot completely cover the heat dissipation plate 20, and a portion of the heat dissipation plate 20 not covered by the circuit board 10 is the second region 202. This also enables the light emitted from the light source 30 disposed on the second region 202 to be smoothly emitted.

In some embodiments, referring to fig. 5, the time-of-flight module 100 further includes an electronic device 801, and the electronic device 801 is disposed on the second side 12 of the circuit board 10. The distance between the electronic device 801 and the light source 30 is less than a preset threshold. Thus, the lateral distance between the electronic device 801 and the light source 30 can be shortened, and meanwhile, the electronic device 801 and the light source 30 can be prevented from contacting, so that the baseline distance of the flight time module 100 is shortened. Among other things, the electronics 801 may be a register for controlling the emission time interval of the light source 30; alternatively, the electronic device 801 may be a digital-to-analog converter, an analog-to-digital converter, or the like, without limitation.

Referring to fig. 5, the light source 30 is electrically connected to the circuit board 10, and the circuit board 10 can provide power to the light source 30, so that the light source 30 can emit light. Specifically, referring to fig. 10 and 11, in some embodiments, the light source 30 has a first electrode terminal 31 on a side close to the heat dissipation plate 20 and a second electrode terminal 32 on a side far from the heat dissipation plate 20. The first electrode terminal 31 and the second electrode terminal 32 are opposite electrodes. For example, the first electrode terminal 31 is an anode, and the second electrode terminal 32 is a cathode; alternatively, the first electrode terminal 31 is a cathode, and the second electrode terminal 32 is an anode, which is not limited herein. The first electrode terminal 31 and the second electrode terminal 32 of the light source 30 are electrically connected to corresponding electrodes of the circuit board 10, respectively, so that the light source 30 is electrically connected to the circuit board 10.

For example, referring to fig. 10, in some embodiments, the time-of-flight module 100 may further include a conductive member 81 and a first lead 82. One end of the conductive member 81 is located between the light source 30 and the heat dissipation plate 20 and electrically connected to the first electrode terminal 31, and the other end is located between the circuit board 10 and the heat dissipation plate 20 and electrically connected to the circuit board 10, so that the first electrode terminal 31 of the light source 30 can be electrically connected to the circuit board 10 through the conductive member 81. One end of the first lead 82 is electrically connected to the second electrode terminal 32, and the other end is electrically connected to an electrode located on a side of the circuit board 10 away from the heat sink 20, so that the second electrode terminal 32 of the light source 30 can be electrically connected to the circuit board 10 through the first lead 82. Even if the light source 30 is not directly disposed on the circuit board 10, the light source can be electrically connected to the circuit board 10 through the conductive member 81 and the first lead 82, so that the circuit board 10 can normally provide power for the light source 30.

For another example, referring to fig. 11, in some embodiments, the time-of-flight module 100 may further include a conductive member 81, a first lead 82, and a second lead 83. The conductive member 81 has one end located between the light source 30 and the heat dissipation plate 20 and electrically connected to the first electrode terminal 31, and the other end located in the second region 202 of the heat dissipation plate 20 and electrically connected to the electrode located on the side of the circuit board 10 away from the heat dissipation plate 20 through the second lead 83. Even if the light source 30 is not directly disposed on the circuit board 10, the light source can be electrically connected to the circuit board 10 through the conductive member 81 and the first lead 82, so that the circuit board 10 can normally provide power for the light source 30.

Referring to fig. 10 and 11, in some embodiments, in the light emitting direction of the light source 30, the distance between the second electrode end 32 and the electrode on the second side 12 of the circuit board 10 is different from the distance between two opposite sides of the light source 30. It is understood that when the side of the light source 30 close to the heat dissipation plate 20 and the second side 12 of the circuit board 10 are disposed at the same horizontal plane, the distance between the second electrode terminal 32 and the electrode on the second side 12 of the circuit board 10 in the light emitting direction of the light source 30 must be equal to the distance between the two opposite sides of the light source 30. The second electrode terminal 32 is located on the electrode on the second side 12 of the circuit board 10, and if the electrode on the second side 12 of the circuit board 10 is directly contacted with the light source 30, a short circuit or other faults may easily occur, which may cause the time-of-flight module 100 to fail to operate normally. Therefore, it is necessary to maintain a certain distance between the electrodes located on the second side 12 of the circuit board 10 and the light source 30. However, in the present embodiment, since the distance between the second electrode end 32 and the electrode on the second side 12 of the circuit board 10 is different from the distance between the opposite sides of the light source 30 in the light emitting direction of the light source 30, the side of the light source 30 close to the heat dissipation plate 20 and the second side 12 of the circuit board 10 are not disposed on the same horizontal plane, that is, there is a height difference between the side of the light source 30 close to the heat dissipation plate 20 and the second side 12 of the circuit board 10. At this time, even if the transverse distance between the electrode on the second side 12 of the circuit board 10 and the light source 30 is shortened, the electrode and the light source do not directly contact with each other, so that the baseline distance of the time-of-flight module 100 can be further shortened while the normal operation of the time-of-flight module 100 is ensured.

It should be noted that, in some embodiments, the distance between the second electrode end 32 and the electrode located on the second side 12 of the circuit board 10 in the light emitting direction of the light source 30 is within a preset range. That is, in the light emitting direction of the light source 30, the distance between the side of the light source 30 away from the heat dissipation plate 20 and the second side 12 of the circuit board 10 is within a preset range. Gold wires are typically used as the first leads 82, but the gold wires have a limited curvature based on current process technology, i.e. the curvature of the gold wires cannot be too large. In the present embodiment, since the distance between the second electrode end 32 and the electrode located on the second side 12 of the circuit board 10 is within the preset range, the curvature of the first lead 82 connecting the second electrode end 32 and the electrode located on the second side 12 of the circuit board 10 can be maintained within a certain range, that is, the limit curvature of the gold wire is not exceeded, which is beneficial to reducing the difficulty of manufacturing the time-of-flight module 100.

Referring to fig. 1 and 2, in some embodiments, the sensor 40 is mounted on the second side 12 of the circuit board 10 and electrically connected to the circuit board 10. Specifically, referring to fig. 12, in some embodiments, the heat dissipation plate 20 further includes a third region 203, and the circuit board 10 further has a second through hole 14 penetrating through the first side 11 and the second side 12. The sensor 40 is provided in the third region 203 of the heat dissipation plate 20 and is accommodated in the second through hole 14. At this time, the heat dissipation plate 20 may also be used to dissipate heat from the sensor 40. Compared with the case that the sensor 40 is directly disposed on the circuit board 10, the heat generated by the sensor 40 can be prevented from being transferred to the circuit board 10, which increases the temperature of the circuit board 10 and causes the circuit board 10 not to work normally. It should be noted that even though the sensor 40 is disposed in the heat dissipation plate 20, the sensor 40 is still electrically connected to the circuit board 10, and the specific connection manner is similar to the manner of electrically connecting the light source 30 and the circuit board 10 in the above embodiment, and is not described herein again.

Referring to fig. 1 and 2, the integrated bracket 50 is fixedly mounted on the second side 12 of the circuit board 10, and forms an accommodating cavity 501 with the circuit board 10 for accommodating the light source 30 and the sensor 40. The first optical assembly 60 fixed in the bracket 50 can correspond to the light source 30, and the second optical assembly 70 fixed in the bracket 50 can correspond to the sensor 40. In some embodiments, the number of the accommodating cavities 501 may be 1, and the light source 30 and the sensor 40 are both accommodated in the accommodating cavities 501; alternatively, in some embodiments, the number of the accommodating cavities 501 may also be two, and the light source 30 and the sensor 40 are respectively accommodated in different accommodating cavities 501.

Because in the time of flight module 100 in this application, all fixed mounting in integrative support 50 with first optical component 60 and second optical component 70 can make time of flight module 100 structure compacter compared with traditional time of flight module (transmitting terminal and receiving terminal all respectively have independent support and independent circuit board respectively) to can also shorten the baseline distance of time of flight module 100.

Specifically, referring to fig. 1 and 2, in some embodiments, the integrated bracket 50 includes a first supporting member 51, a second supporting member 52, and a connecting member 53 connecting the first supporting member 51 and the second supporting member 52. The first supporting member 51 and the second supporting member 52 are disposed at intervals and fixed to the second side 12 of the circuit board 10, respectively. The first supporting member 51 and the second supporting member 52 may be fixedly connected to the second side 12 of the circuit board 10 by different connection methods, and of course, the first supporting member 51 and the second supporting member 52 may also be fixedly connected to the second side 12 of the circuit board 10 by the same connection method, which is not limited herein. Further, the means of attachment include, but are not limited to, adhesive, snap, threaded, etc.

More specifically, the first supporting member 51 is closer to the light source 30 than the second supporting member 52, and in some embodiments, the first supporting member 51 and the second supporting member 52 are both carried on the second side 12 of the circuit board 10. In particular, as shown in fig. 9, in some embodiments, the first supporting member 51 may be carried on the heat dissipation plate 20 and fixed on the heat dissipation plate 20, and the second supporting member 52 may be carried on a side of the circuit board 10 away from the heat dissipation plate 20.

Referring to fig. 1 and 2, the connecting assembly 53 is connected to the first support 51 and the second support 52, and the connecting assembly 53 includes a first mounting hole 531 and a second mounting hole 532. The first mounting hole 531 is used for mounting the first optical assembly 60, and the second mounting hole 532 is used for mounting the second optical assembly 70. Illustratively, the first mounting hole 531 is a through hole whose axis is perpendicular to the circuit board 10 and the heat dissipation plate 20, so as to facilitate the propagation of the light beam, the first optical component 60 is disposed in the first mounting hole 531, and the first optical component 60 is fixedly connected to the first mounting hole 531 through a glue, and the optical axis of the first optical component 60 coincides with the optical axis of the light source 30, so as to achieve the corresponding arrangement of the first optical component and the light source 30 after the bracket 50 is fixedly connected to the circuit board 10, so that the first optical component 60 can guide the light emitted by the light source 30 to the outside of the time-of-flight module 100. Of course, the first optical assembly 60 can be fixed in the first mounting hole 531 by other methods, which are not limited herein.

The second mounting hole 532 is a through hole with an axis perpendicular to the circuit board 10, so as to facilitate propagation of the light beam, and the second optical component 70 is connected to the second mounting hole 532, after the bracket 50 and the circuit board 10 are fixedly connected, the second optical component and the light source 30 can be correspondingly disposed, so that the light reflected by the object to be measured is guided to the sensor 40 through the second optical component 70.

It should be noted that, in some embodiments, the time-of-flight module 100 further includes a filter 84, the filter 84 is disposed between the second optical assembly 70 and the sensor 40, and the filter 84 is used for filtering light out of the predetermined wavelength range. Specifically, in some embodiments, the second mounting hole 532 includes a first cavity 5321 and a second cavity 5322 connected to each other, and after the bracket 50 and the circuit board 10 are fixedly connected, the first cavity 5321 is closer to the circuit board 10 than the second cavity 5322. The second optical assembly 70 is installed in the second cavity 5322, and the optical filter 84 is installed in the first cavity 5321, so that the light reflected by the object to be measured sequentially passes through the second optical assembly 70 and the optical filter 84 and then enters the sensor 40.

In some embodiments, the light emitted by the light source 30 forms a planar pattern. Illustratively, the light source 30 includes a plurality of light emitting elements (not shown), each of which is capable of emitting a light beam, and the light beams emitted from the plurality of light emitting elements form a planar pattern. Referring to fig. 1 and 13-15, the first optical element 60 may include a diffractive optical element 61. The diffractive optical element 61 is provided with an integrated microstructure 611, and the integrated microstructure 611 can collimate the planar pattern and copy the planar pattern to emit the speckle pattern out of the time-of-flight module 100. Because integrated microstructure 611 on diffractive optical element 61 can collimate the plane pattern and duplicate the plane pattern with the emergent speckle pattern, compare in adopting different optical element to realize collimation respectively and duplicate the function, the time of flight module 100 of this application can also dwindle the volume of time of flight module 100 under the prerequisite that does not influence the optical effect who throws speckle image, and reduce the manufacturing cost of time of flight module 100.

In addition, when the light source 30 is disposed in the second region of the heat dissipation plate 20 and located in the first through hole 13 (as shown in fig. 5) while maintaining the distance between the first optical assembly 60 and the circuit board 10, a larger back focus of the first optical assembly 60 is required compared to when the light source 30 is directly disposed on the second side 12 of the circuit board 10. And the electronic devices 801 and gold wires around the light source 30 also cause the back focus required for the first optical assembly 60 to become large. Referring to fig. 16, it can be understood that the larger the back focus of the first optical element 60 is, the larger the volume of the light emitting module formed by the light source 30 and the first optical element 60 is, and thus the larger the volume of the time-of-flight module 100 is. In the embodiment, the integrated microstructure 611 is adopted to realize the functions of the conventional lens set and the diffraction element, so that the space of the light emitting module can be released to the greatest extent, which is very helpful for compressing the baseline of the time-of-flight module 100. That is, the integrated microstructure 611 on the diffractive optical element 61 can collimate the planar pattern and reproduce the planar pattern to emit the speckle pattern, which can further shorten the baseline of the flight time module 100 compared to using different optical elements to respectively realize the collimating and reproducing functions.

In particular, the integrated microstructure 611 may be formed by the fusion of a virtual phase-based first microstructure and a virtual second microstructure. The first microstructure is used for collimating light rays, and the second microstructure is used for copying light spots formed by received light rays. For example, in some embodiments, the first microstructure is a microstructure of an n-step diffractive lens or a microstructure of a superlens, where n is greater than or equal to 2. Such that the first microstructure can be used to collimate light. For another example, in some embodiments, the second microstructure is a grating-based diffractive microstructure or a superlens-based diffractive microstructure. The second microstructure can thus be used to replicate the spot formed by the received light.

Further, referring to fig. 13 and 14, the diffractive optical element 61 includes a first surface 6101 and a second surface 6102 opposite to each other, wherein the first surface 6101 faces the light source 30, and the second surface 6102 is away from the light source 30. That is, the light emitted from the light source 30 enters the first surface 6101 of the diffractive optical element 61 and exits from the second surface of the diffractive optical element 61. The integrated microstructures 611 can be disposed on the first face 6101 and/or the second face 6102 of the diffractive optical element 61. For example, referring to fig. 13, in some embodiments, the integrated microstructure 611 may be disposed on the first surface 6101 of the diffractive optical element 61, which is advantageous to prevent the integrated microstructure 611 from being scratched and to prevent moisture and dust from entering the integrated microstructure 611, compared to the second surface 6102 of the diffractive optical element 61, thereby prolonging the service life of the time-of-flight module 100. For another example, referring to fig. 14, in some embodiments, the integrated microstructure 611 may also be disposed on the second surface 6102 of the diffractive optical element 61. Glare may occur due to direct incidence of strong light on the integrated microstructure 611, and the stray light is relatively severe, which may affect the detection accuracy of the time-of-flight module 100. Therefore, in the present embodiment, the integrated microstructure 611 is disposed on the second surface 6102 away from the light source 30, so that the volume of the time-of-flight module 100 can be reduced, and simultaneously, the occurrence of glare and the reduction of stray light can be avoided, which is beneficial to improving the detection accuracy of the time-of-flight module 100. Of course, in some embodiments, the diffractive optical element 61 is provided with the integrated microstructures 611 on opposite sides, which is not limited herein.

Referring to fig. 15, in some embodiments, the diffractive optical element 61 includes a first layer 612 and a second layer 613, and the first layer 612 is closer to the light source 30 than the second layer 613. Integrated microstructure 611 is located within a sealed cavity 614 formed by first layer 612 and second layer 613. Because the integrated microstructure 611 is accommodated in the sealed cavity 614, moisture and dust can be prevented from entering the integrated microstructure 611, which is beneficial to prolonging the service life of the time-of-flight module 100. The first layer 612 and the second layer 613 of the diffractive optical element 61 may be made of a plastic material. Of course, the first layer 612 and the second layer 613 of the diffractive optical element 61 may be made of other materials that can prevent water and dust, and are not limited herein.

In some embodiments, fillers 615 (shown in fig. 13) are disposed between the voids of the integrated microstructures 611. Thus, on one hand, moisture and dust can be prevented from entering the gaps of the integrated microstructure 611, thereby prolonging the service life of the time-of-flight module 100; on the other hand, the light beam emitted from the light source 30 can be prevented from directly entering the human eye through the gap between the integrated microstructures 611, thereby improving the safety of the time-of-flight module 100. It is noted that in some embodiments, the filler may comprise an organic or silicon dioxide.

Referring to fig. 17 and 18, in some embodiments, the second optical assembly 70 includes a phase lens 71, and the phase lens 71 is used for receiving at least a portion of the light reflected by the object and adjusting the phase of the light emitted from the phase lens 71 to the sensor 40. Because the phase type lens 71 that can adjust the light phase place through setting up in this embodiment replaces traditional refraction lens group, so can reduce the volume of time of flight module 100, can also promote the illuminance that light reachd sensor 40, be favorable to sensor 40 to receive light to promote time of flight module 100's detection precision.

It is noted that in some embodiments, the illumination of the light passing through the phase lens 71 to the sensor 40 is greater than or equal to 98%. Specifically, the phase type lens 71 includes a substrate 711 and a phase microstructure 712 disposed on the substrate 711. The phase structure is used to adjust the phase of the light exiting from the phase lens 71 to the sensor 40.

More specifically, the substrate 711 includes first and second opposing

faces

7111 and 7112, the first face 7111 being farther from the sensor 40 than the second face 7112. Phase microstructures 712 may be disposed on first face 7111 and/or second face 7112 of substrate 711. For example, referring to fig. 17, in some embodiments, phase microstructures 712 can be disposed on a first face 7111 of a substrate 711. Since the phase microstructure 712 adjusts the phase of the light emitted from the phase lens 71 to the sensor 40, compared to the case where the light directly passes through the lens and then is emitted to the sensor 40, the illumination of the light reaching the image sensor can be improved. For another example, referring to fig. 18, in some embodiments, phase microstructures 712 can also be disposed on second face 7112 of substrate 711. Glare may occur due to direct incidence of strong light on the action microstructure, and the stray light is relatively severe, which is not favorable for the sensor 40 to receive light, thereby affecting the detection accuracy of the time-of-flight module 100. Therefore, in the embodiment, the phase microstructure 712 is disposed on the second face 7112 of the substrate 711, and compared with the microstructure disposed on the first face 71111 of the substrate 711, the illumination of the light reaching the sensor 40 is improved, and simultaneously, the glare and the stray light are avoided and reduced, which is beneficial for the sensor 40 to receive the light, so as to improve the detection accuracy of the time-of-flight module 100. Of course, in some embodiments, the opposite sides of the substrate 711 may be provided with the phase microstructures 712, which is not limited herein.

It should be noted that, in some embodiments, the phase lens 71 is a planar phase lens, and the phase microstructure 712 includes a nano-microstructure; alternatively, in some embodiments, the phase-type lens 71 is a fresnel lens, and the phase microstructure 712 includes a ring-shaped fresnel microstructure, which is not limited herein.

Referring to fig. 19, the present embodiment further provides a terminal 1000. Terminal 1000 can include housing 200 and time of flight module 100 as described in any of the embodiments above, time of flight module 100 being coupled to housing 200. It should be noted that the terminal 1000 may be a mobile phone, a computer, a tablet computer, an intelligent watch, an intelligent wearable device, and the like, which is not limited herein.

Terminal 1000 in this application, through set up light source 30 in time of flight module 100 in the second district 202 of heating panel 20, and the first district 201 of heating panel 20 combines with circuit board 10, compare in and directly locate light source 30 on circuit board 10, can avoid the heat transfer that light source 30 produced to circuit board 10 to avoid appearing because the temperature rise of circuit board 10, lead to the condition that circuit board 10 can not normally work.

Referring to fig. 20, the present embodiment further provides a camera assembly 300. The camera module 300 includes a two-dimensional camera module 301 and the time-of-flight module 100 described in any of the above embodiments. The two-dimensional camera module 301 is used for acquiring a two-dimensional image, and the time-of-flight module 100 is used for acquiring a depth information image. The distance between the center of the sensor 40 of the time-of-flight module 100 and the center of the two-dimensional camera module 301 is smaller than a second preset distance. Because the distance between the center of the sensor 40 of the time-of-flight module 100 and the center of the two-dimensional camera module 301 is smaller than the second preset distance, the field of view of the time-of-flight module 100 is close to the field of view of the two-dimensional camera module 301, thereby facilitating the shooting assembly 300 to simultaneously acquire the two-dimensional image and the depth information image in the same field of view. The two-dimensional camera module 301 may be a color camera module, and the two-dimensional image obtained at this time is a color image; alternatively, the two-dimensional camera module 301 may also be a black-and-white camera module, and the two-dimensional image obtained at this time is a black-and-white image, which is not limited herein.

It should be noted that in some embodiments, the second predetermined distance may be 2 cm. I.e. the distance between the center of the sensor 40 of the time of flight module 100 and the center of the two-dimensional camera module 301 is less than 2 cm. For example, the distance between the center of the sensor 40 of the camera module 100 and the center of the two-dimensional camera module 301 may be 1.8cm, 1.3cm, 1cm, 0.8cm, etc., without limitation. Of course, in some embodiments, the distance between the center of the sensor 40 of the time of flight module 100 and the center of the two-dimensional camera module 301 may also be 2 cm. Preferably, in some embodiments, the distance between the center of the sensor 40 of the time-of-flight module 100 and the center of the two-dimensional camera module 301 is 1.5cm, so that the field of view of the time-of-flight module 100 is close to the field of view of the two-dimensional camera module 301, and a certain distance is kept between the time-of-flight module 100 and the two-dimensional camera module 301, so as to prevent the temperature generated by the time-of-flight module 100 during the engineering process from affecting the normal operation of the two-dimensional camera module 301.

In some embodiments, the temperature of the time-of-flight module 100 is less than the predetermined temperature when the camera assembly 300 is in operation. Wherein, in some embodiments, the preset temperature may be 60 ℃. That is, the temperature of the time-of-flight module 100 is less than 60 ℃ when the camera assembly 300 is in operation. For example, the temperature of the time-of-flight module 100 may be 55 ℃, 50 ℃, 48 ℃, 45 ℃, 42 ℃, 35 ℃, 30 ℃ or the like when the camera module 300 is in operation. Since the temperature of the time-of-flight module 100 is less than the preset temperature, it can be avoided that the temperature of the time-of-flight module 100 is too high, which affects the normal operation of the components (e.g., the two-dimensional camera module 301) disposed around the time-of-flight module. Preferably, in some embodiments, the temperature of the time-of-flight module 100 is stabilized at about 45 ℃ while the camera assembly 300 is in operation.

Referring to fig. 20, the present embodiment further provides a terminal 1000. Terminal 1000 can include housing 200 and camera assembly 300 as described in any of the embodiments above, with camera assembly 300 coupled to housing 200. It should be noted that the terminal 1000 may be a mobile phone, a computer, a tablet computer, an intelligent watch, an intelligent wearable device, and the like, which is not limited herein.

The terminal 1000 in the present application, by setting the distance between the center of the sensor 40 of the time-of-flight module 100 and the center of the two-dimensional camera module 301 in the photographing assembly 300, is smaller than a second preset distance. Therefore, the field of view of the time-of-flight module 100 is close to the field of view of the two-dimensional camera module 301, and the terminal 1000 can acquire the two-dimensional image and the depth information image under the same field of view at the same time.

Referring to fig. 1, fig. 2 and fig. 21, an assembly method of the time-of-flight module 100 is further provided in the present embodiment. The assembling method comprises the following steps:

011: providing a heat dissipation plate 20, wherein the heat dissipation plate 20 comprises a first area 201 and a second area 202, and the first side 11 of the circuit board 10 is combined with the first area 201;

012: disposing the light source 30 in the second region 202 of the heat dissipation plate 20, and mounting the sensor 40 to the circuit board 10, and electrically connecting both the light source 30 and the sensor 40 to the circuit board 10;

013: mounting the first optical assembly 60 to the integral bracket 50;

014: mounting the bracket 50 with the first optical assembly 60 mounted thereon on the second side 12 of the circuit board 10, wherein the bracket 50 and the circuit board 10 form an accommodating cavity 501, so that the sensor 40 and the light source 30 are accommodated in the accommodating cavity 501, and the first optical assembly 60 corresponds to the light source 30; and

015: the second optical group 70 is mounted to the bracket 50 such that the second optical group 70 corresponds to the sensor 40.

In the assembling method of the time-of-flight module 100 in the present application, the light source 30 is disposed in the second region 202 of the heat dissipation plate 20, and the first region 201 of the heat dissipation plate 20 is combined with the circuit board 10, so that the heat generated by the light source 30 can be prevented from being transferred to the circuit board 10, and the situation that the circuit board 10 cannot normally operate due to the temperature rise of the circuit board 10 is avoided.

Specifically, the first region 201 of the heat dissipation plate 20 is first bonded to the first side 11 of the circuit board 10. The heat dissipation plate 20 may be fixed to the first side 11 of the circuit board 10 by gluing. After the sensor 40 is mounted to the circuit board 10 and the light source 30 is mounted to the second region 202 of the heat dissipation plate 20, both the light source 30 and the sensor 40 may be electrically connected to the circuit board 10 through a gold wire bonding process. The first optical member 60 is mounted to the integrated bracket 50, for example, the first optical member 60 is mounted in the first mounting hole 531 of the bracket 50.

The bracket 50 with the first optical assembly 60 mounted thereon is then mounted on the second side 12 of the circuit board 10 provided with the sensor 40 and the light source 30, the bracket 50 and the circuit board 10 form a receiving cavity 501, so that the sensor 40 and the light source 30 are received in the receiving cavity 501, and the first optical assembly 60 corresponds to the light source 30.

For example, in some embodiments, the first optical assembly 60 mounted on the bracket 50 and the light source 30 disposed on the heat dissipation plate 20 are aligned by an Alignment process (AA process), after the Alignment is completed, the bracket 50 is fixed on the second side 12 of the circuit board 10, the bracket 50 and the circuit board 10 form an accommodating cavity 501, so that the sensor 40 and the light source 30 are accommodated in the accommodating cavity 501, and the first optical assembly 60 corresponds to the light source 30. It should be noted that in some embodiments, the first optical element assembly and the light source 30 are aligned by an alignment process, and the relative position between the first optical element assembly 60 and the light source 30 is gradually adjusted, so that the first optical element assembly 60 and the light source 30 are gradually brought close to being oppositely disposed. After the relative position between the first optical assembly 60 and the light source 30 is adjusted to satisfy the alignment accuracy of the first optical assembly 60 and the light source 30, the bracket 50 is fixed to the circuit board 10, and the connection stability is ensured.

After the first optical assembly 60 is mounted, the second optical assembly 70 is mounted to the bracket 50 such that the second optical assembly 70 corresponds to the sensor 40. For example, in some embodiments, the second optical assembly 70 is aligned with the sensor 40 disposed on the circuit board 10 through an alignment process, and the second optical assembly 70 is mounted in the second mounting hole 532 of the bracket 50 after the alignment is completed, so that the second optical assembly 70 corresponds to the sensor 40.

In some embodiments, at step 014: before the bracket 50 mounted with the first optical assembly 60 is mounted on the second side 12 of the circuit board 10, the assembly method further includes: the filter 84 is installed in the second installation hole 532 of the bracket 50, and the filter 84 is used for filtering light out of a predetermined wavelength range. Specifically, in some embodiments, before the bracket 50 with the first optical assembly 60 mounted thereon is mounted on the second side 12 of the circuit board 10, the optical filter 84 may be mounted in the second mounting hole 532 of the bracket 50, and then the bracket 50 with the first optical assembly 60 and the optical filter 84 mounted thereon is mounted on the second side 12 of the circuit board 10. The filter 84 may be installed before the first optical assembly 60 is installed, or may be installed after the first optical assembly 60 is installed, which is not limited herein.

Referring to fig. 1, 2 and 22, the present embodiment further provides a method for assembling the time-of-flight module 100. The assembling method comprises the following steps:

021: providing a heat dissipation plate 20, wherein the heat dissipation plate 20 comprises a first area 201 and a second area 202, and the first side 11 of the circuit board 10 is combined with the first area 201;

022: disposing the light source 30 in the second region 202 of the heat dissipation plate 20, and mounting the sensor 40 to the circuit board 10, and electrically connecting both the light source 30 and the sensor 40 to the circuit board 10;

023: fixing the integrated bracket 50 on the second side 12 of the circuit board 10, wherein the bracket 50 and the circuit board 10 form a containing cavity 501, so that the sensor 40 and the light source 30 are contained in the containing cavity 501;

024: the first optical element 60 and the second optical element 70 are fixed on the bracket 50 such that the first optical element 60 corresponds to the light source 30 and the second optical element 70 corresponds to the sensor 40.

Specifically, the first region 201 of the heat dissipation plate 20 is first bonded to the first side 11 of the circuit board 10. Wherein the heat dissipation plate 20 may be fixed to the first side 11 of the circuit board 10 by gluing. After the sensor 40 is mounted on the circuit board 10 and the light source 30 is mounted on the heat sink 20 and received in the first through hole 13, the light source 30 and the sensor 40 can be electrically connected to the circuit board 10 by a gold wire bonding process. Then, the bracket 50 is fixedly mounted on the circuit board 10 provided with the sensor 40 and the light source 30, and the bracket 50 and the circuit board 10 form an accommodating cavity 501, so that the sensor 40 and the light source 30 are accommodated in the accommodating cavity 501.

After the bracket 50 is fixedly connected to the circuit board 10 provided with the sensor 40 and the light source 30, the first optical element 60 and the second optical element 70 are fixed to the bracket 50 such that the first optical element 60 corresponds to the light source 30 and the second optical element 70 corresponds to the sensor 40. Specifically, referring to fig. 23, in some embodiments, step 024: the first optical assembly 60 and the second optical assembly 70 are fixed to the bracket 50, and include:

0241: aligning the first optical assembly 60 by an alignment process and fixing the first optical assembly 60 to the bracket 50, so that the first optical assembly 60 corresponds to the light source 30; and

0242: the second optical assembly 70 is aligned by an alignment process and then fixed to the bracket 50, so that the second optical assembly 70 corresponds to the sensor 40.

For example, after the bracket 50 is fixedly connected to the circuit board 10 provided with the sensor 40 and the light source 30, the first optical assembly 60 and the light source 30 are aligned through an alignment process, and after the alignment is completed, the first optical assembly 60 is fixed in the first mounting hole 531 of the bracket 50, so that the first optical assembly 60 corresponds to the light source 30. Subsequently, the second optical assembly 70 and the sensor 40 are aligned through an alignment process, and after the alignment process is completed, the second optical assembly 70 is fixed in the second mounting hole 532 of the bracket 50, so that the second optical assembly 70 corresponds to the sensor 40. Since the first optical assembly 60 and the second optical assembly 70 are respectively mounted on the bracket 50 after the alignment process, the first optical assembly 60 and the second optical assembly 70 can be mounted without providing two clamps on a machine for implementing the alignment process. Of course, in some embodiments, the second optical assembly 70 may be installed first, and then the first optical assembly 60 may be installed, without limitation.

Referring to fig. 1, 2, and 24, in some embodiments, at step 024: the first optical assembly 60 and the second optical assembly 70 are fixed to the bracket 50, and further include:

0243: the first optical assembly 60 and the second optical assembly 70 are aligned by an alignment process and then fixed to the bracket 50, so that the first optical assembly 60 corresponds to the light source 30 and the second optical assembly 70 corresponds to the sensor 40.

For example, after the bracket 50 is fixedly connected to the circuit board 10 provided with the sensor 40 and the light source 30, the first optical assembly 60 and the second optical assembly 70 are aligned by the alignment process and then fixed to the bracket 50, so that the first optical assembly 60 corresponds to the light source 30 and the second optical assembly 70 corresponds to the sensor 40. Since the first optical element 60 and the second optical element 70 are aligned and installed at the same time, the success rate of light path alignment can be improved compared to the case where the non-optical element and the second optical element 70 are aligned and installed respectively.

In the description herein, reference to the description of the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present application, "a plurality" means at least two, e.g., two, three, unless specifically limited otherwise.

Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations of the above embodiments may be made by those of ordinary skill in the art within the scope of the present application, which is defined by the claims and their equivalents.

Claims

1. The utility model provides a time of flight module, its characterized in that includes integrative support, heating panel, circuit board, light source, sensor and is fixed in the first optical assembly and the second optical assembly of support, wherein:

the heat dissipation plate comprises a first area and a second area, the first side of the circuit board is combined with the first area, the light source is arranged in the second area, and the light source and the sensor are both electrically connected with the circuit board;

the support is arranged on the second side of the circuit board, an accommodating cavity capable of accommodating the light source and the sensor is formed by the support and the circuit board, and the second side of the circuit board is opposite to the first side of the circuit board;

the first optical component is arranged on the bracket, corresponds to the light source and is used for guiding the light rays emitted by the light source to the outside of the time-of-flight module;

the second optical assembly is mounted on the bracket and corresponds to the sensor, and is used for receiving at least part of the light reflected by the object and guiding the light to the sensor.

2. The time of flight module of claim 1, in which the circuit board defines a first via that extends through the first side and the second side, the first via corresponding to the second region,

the light source is arranged in the second area and is contained in the first through hole; or

The second area comprises a protruding portion protruding towards the circuit board, the protruding portion penetrates through the first through hole and can be exposed from the second side of the circuit board, and the light source is arranged on one side, far away from the circuit board, of the protruding portion.

3. The time of flight module of claim 1, in which the distance between the center of the sensor and the center of the light source is less than a first predetermined distance.

4. The time of flight module of claim 1, in which the side of the light source proximate the heat sink has a first electrode end and the side distal the heat sink has a second electrode end, the time of flight module further comprising:

the conductive piece is positioned between the light source and the heat dissipation plate and electrically connected with the first electrode end, and the other end of the conductive piece is positioned between the circuit board and the heat dissipation plate and electrically connected with the circuit board; and

and one end of the first lead is electrically connected with the second electrode end, and the other end of the first lead is electrically connected with an electrode positioned on the second side of the circuit board.

5. The time of flight module of claim 1, in which the side of the light source proximate the heat sink has a first electrode end and the side distal the heat sink has a second electrode end, the time of flight module further comprising:

the conductive piece is positioned between the light source and the heat dissipation plate and electrically connected with the first electrode end, and the other end of the conductive piece is positioned in the second area of the heat dissipation plate and electrically connected with the electrode positioned on the second side of the circuit board through a second lead; and

6. The time-of-flight module of claim 4 or 5, wherein a distance between the second electrode end and the electrode on the second side of the circuit board in a light emitting direction of the light source is different from a distance between two opposite sides of the light source.

7. The time of flight module of claim 1, in which the sensor is mounted to a second side of the circuit board; or

The heat dissipation plate further comprises a third area, the circuit board is provided with a second through hole penetrating through the first side and the second side, the second through hole corresponds to the third area, and the sensor is arranged in the third area and contained in the second through hole.

8. The time of flight module of claim 1, wherein the bracket comprises a first support member, a second support member, and a connecting assembly connecting the first support member and the second support member, wherein the first support member and the second support member are respectively fixed to the second side of the circuit board, and the connecting assembly comprises:

a first mounting hole for mounting the first optical component; and

a second mounting hole for mounting the second optical assembly.

9. The time-of-flight module of claim 1, wherein the light emitted by the light source forms a planar pattern, the first optical assembly comprising:

the diffraction optical element is provided with an integrated microstructure, and the integrated microstructure can collimate the planar pattern and copy the planar pattern so as to emit the speckle pattern out of the time-of-flight module.

10. The time of flight module of claim 1, in which the second optical component comprises:

a phase lens for receiving at least a portion of the light reflected back by the object and adjusting a phase of the light exiting the phase lens to the sensor.

11. A terminal, comprising:

a housing; and

the time of flight module of any one of claims 1-10, the housing being integrated with the time of flight module.

12. A camera assembly, comprising:

the two-dimensional camera module is used for acquiring a two-dimensional image; and

the time of flight module of any one of claims 1 to 10, the time of flight module to acquire an image of depth information, a distance between a center of the sensor of the time of flight module and a center of the two dimensional camera module being less than a second predetermined distance.

13. The camera assembly of claim 12, wherein the temperature of the deep time-of-flight module is less than a preset temperature when the camera assembly is in operation.

14. A terminal, comprising:

a housing; and

the camera assembly of claim 12 or 13, the housing being coupled to the camera assembly.

15. A method of assembling a time of flight module, comprising:

providing a heat dissipation plate, wherein the heat dissipation plate comprises a first area and a second area, and the first side of the circuit board is combined with the first area;

arranging a light source in the second area of the heat dissipation plate, installing the sensor to the circuit board, and electrically connecting the light source and the sensor with the circuit board;

mounting the first optical assembly to an integral bracket;

installing the bracket provided with the first optical assembly on a second side of the circuit board, wherein the bracket and the circuit board form an accommodating cavity so that the sensor and the light source are accommodated in the accommodating cavity, and the first optical assembly corresponds to the light source; and

and mounting a second optical component on the bracket so that the second optical component corresponds to the sensor.

16. A method of assembling a time-of-flight module, comprising:

fixing an integrated bracket on the second side of the circuit board, wherein the bracket and the circuit board form an accommodating cavity so that the sensor and the light source are accommodated in the accommodating cavity;

and fixing the first optical assembly and the second optical assembly on the bracket so that the first optical assembly corresponds to the light source and the second optical assembly corresponds to the sensor.

17. The method of assembling of claim 16, wherein said securing said first and second optical assemblies to said bracket comprises:

aligning the first optical assembly through an alignment process and then fixing the first optical assembly on the bracket so that the first optical assembly corresponds to the light source; and

and aligning the second optical assembly through an alignment process and then fixing the second optical assembly on the bracket so that the second optical assembly corresponds to the sensor.

18. The method of assembling of claim 16, wherein said securing said first and second optical assemblies to said bracket comprises:

and aligning the first optical assembly and the second optical assembly simultaneously through an alignment process and then fixing the first optical assembly and the second optical assembly on the bracket so that the first optical assembly corresponds to the light source and the second optical assembly corresponds to the sensor.