CN114688905B - Flexible thermal diode, preparation method and application thereof - Google Patents
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Abstract
Description
技术领域technical field
本发明属于热管理材料技术领域,具体涉及,一种柔性热二极管、其制备方法及应用。The invention belongs to the technical field of thermal management materials, and specifically relates to a flexible thermal diode, its preparation method and application.
背景技术Background technique
热二极管与电子二极管相似,也含有两极,分别为温度输入端和温度输出端。当一极连接热端,另一极连接冷端,其热流量为Jf,冷、热端位置互换后,热流量为Jr,如果Jf与Jr数值不相等,打破了傅里叶定律,这个现象被称为热整流,此元器件被称为热二极管(见专利CN111895827A)。虽然目前热管理材料可同时具备导热和储能功能(CN111439001A),但热二极管具备的热整流功能可以更好的控制热传递,在许多领域都有着广泛的应用前景。Thermal diodes are similar to electronic diodes in that they also have two poles, a temperature input terminal and a temperature output terminal. When one pole is connected to the hot end and the other pole is connected to the cold end, the heat flow is J f . After the positions of the cold and hot ends are exchanged, the heat flow is J r . If the values of J f and J r are not equal, the Fourier Ye law, this phenomenon is called thermal rectification, and this component is called thermal diode (see patent CN111895827A). Although current thermal management materials can have both heat conduction and energy storage functions (CN111439001A), the thermal rectification function of thermal diodes can better control heat transfer, and has broad application prospects in many fields.
热二极管能够实现热整流,要求两极材料的热导率温度系数不同,最好是热导率随温度变化趋势相反,一极材料在高温态时传热好,低温态时传热差;另一极则在低温态时传热好,高温态时传热差。从而使正、反两个方向上传热不对称,产生热整流。满足以上要求的两极材料是构建热二极管的关键。合金材料、金属氧化物的热导率通常随温度的变化发生改变(Sci.Technol.Adv.Mater.2014,15,064801;Appl.Phys.Lett.2009,95,171905),可用于制备热二级管,然而,这些材料改变其热导率需要很大的温度区间来实现,其工作温度区间也多为极端温度,无法在实际生产、生活中广泛应用。Thermal diodes can realize thermal rectification, requiring that the temperature coefficients of thermal conductivity of the two pole materials are different. It is best that the thermal conductivity changes with temperature in the opposite direction. One pole material has good heat transfer at high temperature and poor heat transfer at low temperature; The pole has good heat transfer in the low temperature state and poor heat transfer in the high temperature state. As a result, the heat transfer in the positive and negative directions is asymmetrical, resulting in heat rectification. A bipolar material that meets the above requirements is the key to constructing a thermal diode. The thermal conductivity of alloy materials and metal oxides usually changes with temperature (Sci.Technol.Adv.Mater.2014,15,064801; Appl.Phys.Lett.2009,95,171905), which can be used to prepare thermal Grade tubes, however, these materials require a large temperature range to change their thermal conductivity, and their working temperature ranges are mostly extreme temperatures, which cannot be widely used in actual production and life.
利用相变材料在相转变时吸收或释放大量潜热的特性可对电子元器件进行热管理(CN109449131A),同时,相变材料在发生相转变过程中热导率发生突变(Adv.Mater.2019,31,1806518),而且发生转变的温度区间比较窄,因此,选择相变温度接近,热导率随温度变化相反的两种相变材料组装成热二级管,其工作温差小,热整流比大。但是,目前报道的相变热二极管均是将相变材料封装在塑料管,组装成的热二极管都是刚性的(Mater.Horiz.,2015,2,125-129;Adv.Energy Mater.2018,8,1702692),无法获得柔性,限制了其广泛应用。The thermal management of electronic components can be carried out by using the characteristics of phase change materials to absorb or release a large amount of latent heat during phase transition (CN109449131A). At the same time, the thermal conductivity of phase change materials changes suddenly during the phase transition process (Adv.Mater.2019, 31,1806518), and the transition temperature range is relatively narrow. Therefore, two phase change materials with close phase transition temperature and opposite thermal conductivity with temperature change are selected to form a thermal diode. The working temperature difference is small and the thermal rectification ratio big. However, the phase-change thermal diodes currently reported are all packaged with phase-change materials in plastic tubes, and the assembled thermal diodes are all rigid (Mater.Horiz., 2015, 2, 125-129; Adv.Energy Mater.2018, 8, 1702692), the flexibility cannot be obtained, which limits its wide application.
发明内容Contents of the invention
本发明的主要目的在于提供一种柔性热二极管、其制备方法及应用,以克服现有技术的不足。The main purpose of the present invention is to provide a flexible thermal diode, its preparation method and application, so as to overcome the deficiencies of the prior art.
为实现前述发明目的,本发明采用的技术方案包括:In order to realize the aforementioned object of the invention, the technical solutions adopted in the present invention include:
本发明实施例提供了一种柔性热二极管,其包括具有不同的热导率温度系数的第一相变复合薄膜和第二相变复合薄膜,所述第一相变复合薄膜和第二相变复合薄膜彼此热接触,所述第一相变复合薄膜和第二相变复合薄膜形态稳定且相变前后均具有柔性,所述第一相变复合薄膜和第二相变复合薄膜的热导率随温度变化呈相反趋势,所述第一相变复合薄膜和第二相变复合薄膜的相变温度差值小于10℃;所述第一相变复合薄膜与第二相变复合薄膜的表面润湿性能相反,且界面不相容。An embodiment of the present invention provides a flexible thermal diode, which includes a first phase-change composite film and a second phase-change composite film with different thermal conductivity temperature coefficients, the first phase-change composite film and the second phase-change composite film The composite films are in thermal contact with each other, the first phase-change composite film and the second phase-change composite film are stable in shape and have flexibility before and after the phase change, and the thermal conductivity of the first phase-change composite film and the second phase-change composite film is The trend is opposite with the temperature change, the phase change temperature difference between the first phase change composite film and the second phase change composite film is less than 10°C; the surface of the first phase change composite film and the second phase change composite film are wet Wet properties are reversed and the interface is incompatible.
本发明实施例还提供了前述的柔性热二极管的制备方法,其包括:The embodiment of the present invention also provides the aforementioned method for preparing the flexible thermal diode, which includes:
使负温度系数相变材料、正温度系数相变材料分别负载到气凝胶薄膜的内部,从而分别制得第一相变复合薄膜、第二相变复合薄膜;The negative temperature coefficient phase change material and the positive temperature coefficient phase change material are respectively loaded inside the airgel film, so as to respectively prepare the first phase change composite film and the second phase change composite film;
以及,将所述第一相变复合薄膜、第二相变复合薄膜组装形成所述柔性热二极管。And, assembling the first phase-change composite film and the second phase-change composite film to form the flexible thermal diode.
本发明实施例还提供了前述的柔性热二极管于热管理领域中的用途。The embodiment of the present invention also provides the use of the aforementioned flexible thermal diode in the field of thermal management.
与现有技术相比,本发明的有益效果在于:Compared with prior art, the beneficial effect of the present invention is:
(1)本发明提供的柔性热二极管具有良好的柔韧性,颠覆了传统热二极管为刚性的传统,同时,所述柔性热二极管工作温差小、热整流比大;(1) The flexible thermal diode provided by the present invention has good flexibility, which overturns the tradition that the traditional thermal diode is rigid. At the same time, the flexible thermal diode has a small operating temperature difference and a large thermal rectification ratio;
(2)本发明提供的柔性热二极管制备方法、组装工艺简单,易于进行规模化生产;(2) The preparation method and assembly process of the flexible thermal diode provided by the present invention are simple and easy to carry out large-scale production;
(3)本发明提供的柔性热二极管应用前景广泛,可共形贴附在需要进行热管理的弯曲表面或者不规则表面。(3) The flexible thermal diode provided by the present invention has broad application prospects, and can be conformally attached to curved or irregular surfaces that require thermal management.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明中记载的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments described in the present invention. Those skilled in the art can also obtain other drawings based on these drawings without creative work.
图1是本发明一典型实施例中所述柔性热二极管的光学照片;Fig. 1 is the optical photo of flexible thermal diode described in a typical embodiment of the present invention;
图2是本发明实施例1所获柔性热二极管的结构示意图;Fig. 2 is a schematic structural view of the flexible thermal diode obtained in Example 1 of the present invention;
图3是本发明实施例2所获柔性热二极管在拉伸模式下应力-应变曲线图;Fig. 3 is a stress-strain curve diagram of the flexible thermal diode obtained in Example 2 of the present invention under tension mode;
图4a-图4b分别是本发明实施例4所获C20/PI相变复合薄膜和PNIPAM/PI相变复合薄膜的热导率随温度变化曲线图;Fig. 4a-Fig. 4b are respectively the thermal conductivity of the obtained C20/PI phase-change composite film and PNIPAM/PI phase-change composite film in Example 4 of the present invention as a function of temperature curve;
图5a-图5b分别是本发明实施例5所获C20/Cellulose相变复合薄膜和PNIPAM/Cellulose相变复合薄膜的疏水角照片;Fig. 5a-Fig. 5b are the hydrophobic angle photos of C20/Cellulose phase-change composite film and PNIPAM/Cellulose phase-change composite film obtained in Example 5 of the present invention respectively;
图6是本发明实施例9所获柔性热二极管正、反两方向的热流量随温差的变化曲线图;Fig. 6 is a graph showing the change of heat flow in forward and reverse directions with temperature difference of the flexible thermal diode obtained in Example 9 of the present invention;
图7是本发明实施例10所获柔性热二极管的热整流比示意图;7 is a schematic diagram of the thermal rectification ratio of the flexible thermal diode obtained in Example 10 of the present invention;
图8是本发明实施例11中柔性热二极管的应用示意图。Fig. 8 is a schematic diagram of the application of the flexible thermal diode in Embodiment 11 of the present invention.
具体实施方式Detailed ways
鉴于现有技术的缺陷,本案发明人经长期研究和大量实践,得以提出本发明的技术方案,相变材料在相变温度附近,较窄的温度区间内热导率会发生较大变化,当筛选出两种相变材料,它们的相变温度接近、热导率温度系数相反,并将它们分别封装在表面润湿性能相反的两种高强度柔性气凝胶薄膜内,由于气凝胶具有超低的热导率,不会对气凝胶/相变复合薄膜的热导率产生显著影响,将获得相变前后均具有柔性、相变温度接近、热导率温度系数相反、表面润湿性能相反的两种柔性相变复合薄膜。再将这两种相变复合薄膜组装成热二极管,此热二极管将具有良好的柔性、较小的工作温差、较优的热整流性能。因此,本发明可以共形贴附在需要进行热管理的弯曲表面或者不规则表面,拓展了相变薄膜的应用领域,同时提高了热二极管的实用性。In view of the defects of the prior art, the inventor of this case was able to propose the technical solution of the present invention after long-term research and a lot of practice. The thermal conductivity of the phase change material will change greatly in a narrow temperature range near the phase change temperature. When screening Two kinds of phase change materials with close phase transition temperature and opposite temperature coefficient of thermal conductivity were developed, and they were respectively encapsulated in two high-strength flexible airgel films with opposite surface wettability. Low thermal conductivity will not have a significant impact on the thermal conductivity of the airgel/phase change composite film. It will have flexibility before and after the phase change, close to the phase change temperature, opposite temperature coefficient of thermal conductivity, and surface wetting properties. Opposite two flexible phase-change composite films. These two phase-change composite films are then assembled into a thermal diode, which will have good flexibility, small operating temperature difference, and better thermal rectification performance. Therefore, the present invention can be conformally attached to a curved surface or an irregular surface that requires thermal management, thereby expanding the application field of the phase change film and improving the practicability of the thermal diode.
下面将对本发明的技术方案进行清楚、完整地描述,显然,所描述的实施例是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。The technical solutions of the present invention will be clearly and completely described below, and obviously, the described embodiments are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
本发明实施例的一个方面提供了一种柔性热二极管,其包括具有不同的热导率温度系数的第一相变复合薄膜和第二相变复合薄膜,所述第一相变复合薄膜和第二相变复合薄膜彼此热接触,所述第一相变复合薄膜和第二相变复合薄膜形态稳定且相变前后均具有柔性,所述第一相变复合薄膜和第二相变复合薄膜的热导率随温度变化呈相反趋势,所述第一相变复合薄膜和第二相变复合薄膜的相变温度差值小于10℃;所述第一相变复合薄膜与第二相变复合薄膜的表面润湿性能相反,且界面不相容。One aspect of the embodiments of the present invention provides a flexible thermal diode, which includes a first phase-change composite film and a second phase-change composite film with different thermal conductivity temperature coefficients, the first phase-change composite film and the second phase-change composite film The two phase change composite films are in thermal contact with each other, the first phase change composite film and the second phase change composite film are stable in shape and flexible before and after the phase change, the first phase change composite film and the second phase change composite film are The thermal conductivity shows an opposite trend with temperature change, the phase change temperature difference between the first phase change composite film and the second phase change composite film is less than 10°C; the first phase change composite film and the second phase change composite film The surface wetting properties of the opposite, and the interface is not compatible.
进一步的,所述柔性热二极管工作温差小。Further, the working temperature difference of the flexible thermal diode is small.
进一步的,所述第一相变复合薄膜和第二相变复合薄的相变温度接近。Further, the phase transition temperatures of the first phase-change composite thin film and the second phase-change composite thin film are close to each other.
在一些较为具体的实施方案中,所述柔性热二极管的热整流比为1.5~3.0。In some more specific embodiments, the thermal rectification ratio of the flexible thermal diode is 1.5-3.0.
在一些较为具体的实施方案中,所述柔性热二极管中第一相变复合薄膜与第二相变复合薄膜的界面不相容。In some more specific embodiments, the interfaces of the first phase-change composite film and the second phase-change composite film in the flexible thermal diode are incompatible.
进一步的,所述第一相变复合薄膜由气凝胶薄膜负载负温度系数相变材料获得。Further, the first phase-change composite film is obtained by loading a negative temperature coefficient phase-change material on an airgel film.
进一步的,所述第一相变复合薄膜中负温度系数相变材料的负载量为30wt%~98wt%。Further, the loading amount of the negative temperature coefficient phase change material in the first phase change composite film is 30wt%-98wt%.
进一步的,所述第二相变复合薄膜由气凝胶薄膜负载正温度系数相变材料获得。Further, the second phase-change composite film is obtained by loading a positive temperature coefficient phase-change material on an airgel film.
进一步的,所述第二相变复合薄膜中正温度系数相变材料的负载量为30wt%~98wt%。Further, the loading amount of the positive temperature coefficient phase change material in the second phase change composite film is 30wt%-98wt%.
进一步的,所述第一相变复合薄膜的表面与水的接触角为100°~180°。Further, the contact angle between the surface of the first phase-change composite film and water is 100°-180°.
进一步的,所述第二相变复合薄膜的表面与水的接触角为0°~80°。进一步的,所述第一相变复合薄膜与第二相变复合薄膜的厚度比为1:10~10:1。Further, the contact angle between the surface of the second phase-change composite film and water is 0°-80°. Further, the thickness ratio of the first phase-change composite film to the second phase-change composite film is 1:10˜10:1.
在一些较为具体的实施方案中,所述负温度系数相变材料与所述正温度系数相变材料在相变点的热导率随温度变化呈相反趋势。In some more specific embodiments, the thermal conductivity of the negative temperature coefficient phase change material and the positive temperature coefficient phase change material at the phase change point have opposite trends with temperature.
进一步的,所述负温度系数相变材料热导率随温度的升高而减小。Further, the thermal conductivity of the phase change material with negative temperature coefficient decreases as the temperature increases.
进一步的,所述负温度系数相变材料包括石蜡(paraffin)、十六烷(C16)、十八烷(C18)、二十烷(C20)、聚乙烯(PE)中的任意一种或两种以上的组合,且不限于此。Further, the negative temperature coefficient phase change material includes any one or both of paraffin, hexadecane (C16), octadecane (C18), eicosane (C20), and polyethylene (PE). More than one combination, and not limited thereto.
进一步的,所述正温度系数相变材料热导率随温度的升高而增大。Further, the thermal conductivity of the positive temperature coefficient phase change material increases as the temperature increases.
进一步的,所述正温度系数相变材料包括聚(N-异丙基丙烯酰胺)(PNIPAM)水溶液和/或二氧化钒(VO2)。Further, the positive temperature coefficient phase change material includes poly(N-isopropylacrylamide) (PNIPAM) aqueous solution and/or vanadium dioxide (VO 2 ).
进一步的,所述聚(N-异丙基丙烯酰胺)(PNIPAM)水溶液的浓度为10wt%~50wt%。Further, the concentration of the poly(N-isopropylacrylamide) (PNIPAM) aqueous solution is 10wt%˜50wt%.
在一些较为具体的实施方案中,所述气凝胶薄膜为柔性自支撑气凝胶薄膜。In some more specific embodiments, the airgel film is a flexible self-supporting airgel film.
进一步的,所述气凝胶薄膜的拉伸强度在1MPa以上。Further, the tensile strength of the airgel film is above 1 MPa.
进一步的,所述气凝胶薄膜的孔隙率在60%以上。Further, the porosity of the airgel film is above 60%.
进一步的,所述气凝胶薄膜的热导率在0.1W/m·K以下。Further, the thermal conductivity of the airgel film is below 0.1 W/m·K.
进一步的,所述气凝胶薄膜包括凯夫拉(Kevlar)气凝胶薄膜、聚酰亚胺(PI)气凝胶薄膜、纤维素(Cellulose)气凝胶薄膜、聚对苯撑苯并二噁唑(PBO)气凝胶薄膜中的任意一种或者两种以上的组合,且不限于此。Further, the airgel film includes Kevlar (Kevlar) airgel film, polyimide (PI) airgel film, cellulose (Cellulose) airgel film, polyparaphenylene phthalate Any one or a combination of two or more of the oxazole (PBO) airgel films, and not limited thereto.
在一些更为具体的实施方案中,请参阅图1所示,所述柔性热二极管包括具有不同热导率温度系数的第一相变复合薄膜和第二相变复合薄膜;所述两种相变复合薄膜分别由高强柔性气凝胶薄膜负载负温度系数相变材料、正温度系数相变材料得到。In some more specific embodiments, please refer to FIG. 1, the flexible thermal diode includes a first phase-change composite film and a second phase-change composite film with different temperature coefficients of thermal conductivity; The variable composite film is respectively obtained by loading a negative temperature coefficient phase change material and a positive temperature coefficient phase change material on a high-strength flexible airgel film.
本发明实施例的另一个方面还提供了前述的柔性热二极管的制备方法,其包括:Another aspect of the embodiments of the present invention also provides the aforementioned method for preparing a flexible thermal diode, which includes:
使负温度系数相变材料、正温度系数相变材料分别负载到气凝胶薄膜的孔洞内,从而分别制得第一相变复合薄膜、第二相变复合薄膜;The negative temperature coefficient phase change material and the positive temperature coefficient phase change material are respectively loaded into the pores of the airgel film, thereby respectively preparing the first phase change composite film and the second phase change composite film;
以及,将所述第一相变复合薄膜、第二相变复合薄膜组装形成所述柔性热二极管。And, assembling the first phase-change composite film and the second phase-change composite film to form the flexible thermal diode.
进一步的,所述气凝胶薄膜为高强度、柔性自支撑气凝胶薄膜。Further, the airgel film is a high-strength, flexible and self-supporting airgel film.
在一些较为具体的实施方案中,所述制备方法具体包括:利用毛细作用将熔融态或者溶液态的负温度系数相变材料负载到气凝胶薄膜的内部,制得第一相变复合薄膜。In some more specific embodiments, the preparation method specifically includes: using capillary action to load the melted or solution state negative temperature coefficient phase change material into the airgel film to prepare the first phase change composite film.
在一些较为具体的实施方案中,所述制备方法具体包括:利用毛细作用将熔融态或者溶液态的正温度系数相变材料负载到气凝胶薄膜的内部,或者,采用原位生长的方式将正温度系数相变材料与气凝胶薄膜进行复合,从而获得第二相变复合薄膜。In some more specific embodiments, the preparation method specifically includes: using capillary action to load the melted or solution-state positive temperature coefficient phase change material into the interior of the airgel film, or using in-situ growth to The positive temperature coefficient phase change material is compounded with the airgel film to obtain the second phase change composite film.
在一些较为具体的实施方案中,所述制备方法包括:将所述第一相变复合薄膜、第二相变复合薄膜贴合,形成所述柔性热二极管。In some more specific embodiments, the preparation method includes: laminating the first phase-change composite film and the second phase-change composite film to form the flexible thermal diode.
进一步的,所述制备方法具体包括:使所述第一相变复合薄膜与第二相变复合薄膜彼此热接触,进而组装形成所述柔性热二极管。Further, the preparation method specifically includes: bringing the first phase-change composite film and the second phase-change composite film into thermal contact with each other, and then assembling to form the flexible thermal diode.
在一些较为具体的实施方案中,所述制备方法还包括:先对所述气凝胶薄膜进行致密化处理。In some more specific embodiments, the preparation method further includes: first densifying the airgel film.
进一步的,所述致密化处理方法包括热压法、冷压法中的任意一种,且不限于此。Further, the densification treatment method includes any one of hot pressing method and cold pressing method, and is not limited thereto.
进一步的,所述致密化处理可以提高气凝胶薄膜的强度和柔韧性。Further, the densification treatment can improve the strength and flexibility of the airgel film.
本发明实施例的另一个方面还提供了前述的柔性热二极管于热管理领域中的用途。Another aspect of the embodiments of the present invention also provides the use of the aforementioned flexible thermal diode in the field of thermal management.
本发明提供的柔性热二极管的制备、组装工艺简单,易于进行规模化生产。The preparation and assembly process of the flexible thermal diode provided by the invention is simple, and it is easy to carry out large-scale production.
进一步的,所述柔性热二极管于弯曲表面或不规则形状表面的热管理中的用途。Further, the use of the flexible thermal diode in thermal management of curved surfaces or irregularly shaped surfaces.
藉由上述技术方案,本发明提供的柔性热二极管由具有不同的热导率温度系数的两种柔性相变复合薄膜彼此热接触组成。所述两种相变复合薄膜分别由力学性能优异的气凝胶薄膜负载相变材料得到,形态稳定且相变前后都具有柔性;相变温度接近;热导率随温度变化趋势相反;表面润湿性能相反。相比于传统的热二极管,本发明提供的柔性热二极管可共形贴附在需要进行热管理的弯曲表面或者不规则表面,拓展了相变薄膜的应用领域,同时提高了热二极管的实用性。With the above technical solution, the flexible thermal diode provided by the present invention is composed of two kinds of flexible phase-change composite films with different temperature coefficients of thermal conductivity in thermal contact with each other. The two phase-change composite films are respectively obtained from airgel films with excellent mechanical properties loaded with phase-change materials, which are stable in shape and flexible before and after the phase change; the phase change temperature is close; the thermal conductivity changes with temperature in the opposite direction; the surface wetting Wet performance is the opposite. Compared with traditional thermal diodes, the flexible thermal diodes provided by the present invention can be conformally attached to curved or irregular surfaces that require thermal management, which expands the application field of phase change films and improves the practicability of thermal diodes .
下面结合若干优选实施例及附图对本发明的技术方案做进一步详细说明,本实施例在以发明技术方案为前提下进行实施,给出了详细的实施方式和具体的操作过程,但本发明的保护范围不限于下述的实施例。The technical solution of the present invention will be described in further detail below in conjunction with several preferred embodiments and accompanying drawings. This embodiment is implemented on the premise of the technical solution of the invention, and detailed implementation methods and specific operating procedures are provided. However, the present invention The scope of protection is not limited to the examples described below.
下面所用的实施例中所采用的实验材料,如无特殊说明,均可由常规的生化试剂公司购买得到。The experimental materials used in the following examples can be purchased from conventional biochemical reagent companies unless otherwise specified.
实施例1Example 1
选择石蜡(paraffin)和PNIPAM水溶液分别作为热导率温度系数相反的负温度系数相变材料、正温度系数相变材料,之后分别负载到不同厚度的Kevlar气凝胶薄膜中,分别得到paraffin/Kevlar相变复合薄膜和PNIPAM/Kevlar相变复合薄膜,二者的厚度比为1:10,将二者裁剪成同样尺寸,贴合在一起,组装成柔性热二极管。图2示出了本实施例所得柔性热二极管结构示意图,其他参数请见表1。Select paraffin (paraffin) and PNIPAM aqueous solution as phase change materials with negative temperature coefficient and positive temperature coefficient, respectively, which have opposite thermal conductivity temperature coefficients, and then load them into Kevlar airgel films with different thicknesses to obtain paraffin/Kevlar respectively. Phase-change composite film and PNIPAM/Kevlar phase-change composite film, the thickness ratio of the two is 1:10, the two are cut into the same size, pasted together, and assembled into a flexible thermal diode. FIG. 2 shows a schematic diagram of the structure of the flexible thermal diode obtained in this embodiment, and other parameters are shown in Table 1.
实施例2Example 2
选择石蜡(paraffin)和PNIPAM水溶液分别作为热导率温度系数相反的负温度系数相变材料、正温度系数相变材料,之后分别负载到致密化处理后的Kevlar气凝胶薄膜中,分别得到paraffin/D-Kevlar相变复合薄膜和PNIPAM/D-Kevlar相变复合薄膜,二者的厚度比为1:5,将二者裁剪成同样尺寸,贴合在一起,组装成柔性热二极管。详细参数请见表1。Paraffin (paraffin) and PNIPAM aqueous solution were selected as the negative temperature coefficient phase change material and positive temperature coefficient phase change material with opposite thermal conductivity temperature coefficients, respectively, and then loaded into the densified Kevlar airgel film respectively to obtain paraffin /D-Kevlar phase-change composite film and PNIPAM/D-Kevlar phase-change composite film, the thickness ratio of the two is 1:5, the two are cut into the same size, pasted together, and assembled into a flexible thermal diode. See Table 1 for detailed parameters.
实施例3Example 3
选择C20和PNIPAM水溶液分别作为热导率温度系数相反的负温度系数相变材料、正温度系数相变材料,之后分别负载到致密化处理后Kevlar气凝胶薄膜和未致密化处理Kevlar气凝胶薄膜中,分别得到C20/D-Kevlar相变复合薄膜和PNIPAM/Kevlar相变复合薄膜,二者的厚度比为1:6。将二者裁剪成同样尺寸,贴合在一起,组装柔性成热二极管。图3示出了本实施例所得柔性热二极管的拉伸强度曲线,其他参数请见表1。C20 and PNIPAM aqueous solutions were selected as negative temperature coefficient phase change materials and positive temperature coefficient phase change materials with opposite thermal conductivity temperature coefficients, respectively, and then loaded on the densified Kevlar airgel film and the undensified Kevlar airgel respectively In the film, C20/D-Kevlar phase change composite film and PNIPAM/Kevlar phase change composite film were obtained respectively, and the thickness ratio of the two was 1:6. Cut the two into the same size, stick them together, and assemble them into flexible thermal diodes. Fig. 3 shows the tensile strength curve of the flexible thermal diode obtained in this embodiment, and other parameters are shown in Table 1.
实施例4Example 4
选择C20和PNIPAM水溶液分别作为热导率温度系数相反的负温度系数相变材料、正温度系数相变材料,之后分别负载到不同厚度的PI气凝胶薄膜中,分别得到C20/PI相变复合薄膜和PNIPAM/PI相变复合薄膜,二者的厚度比为1:6。将二者裁剪成同样尺寸,贴合在一起,组装成柔性热二极管。图4示出了本实施例所得柔性热二极管中C20/PI相变复合薄膜和PNIPAM/PI相变复合薄膜热导率随温度变化曲线,其他参数请见表1。C20 and PNIPAM aqueous solutions were selected as negative temperature coefficient phase change materials and positive temperature coefficient phase change materials with opposite thermal conductivity temperature coefficients, respectively, and then loaded into PI airgel films of different thicknesses respectively to obtain C20/PI phase change composites. Thin film and PNIPAM/PI phase change composite film, the thickness ratio of the two is 1:6. Cut the two into the same size, stick them together, and assemble them into a flexible thermal diode. Figure 4 shows the curves of the thermal conductivity of the C20/PI phase-change composite film and the PNIPAM/PI phase-change composite film as a function of temperature in the flexible thermal diode obtained in this embodiment, and other parameters are shown in Table 1.
实施例5Example 5
选择C20和PNIPAM水溶液分别作为热导率温度系数相反的负温度系数相变材料、正温度系数相变材料,之后分别负载到不同厚度的Cellulose气凝胶薄膜中,分别得到C20/Cellulose相变复合薄膜和PNIPAM/Cellulose相变复合薄膜,二者的厚度比为1:6,将二者裁剪成同样尺寸,贴合在一起,组装成柔性热二极管。图5示出了本实施例所得柔性热二极管的两极材料C20/Cellulose相变复合薄膜和PNIPAM/Cellulose相变复合薄膜表面润湿性,其他参数请见表1。C20 and PNIPAM aqueous solutions were selected as negative temperature coefficient phase change materials and positive temperature coefficient phase change materials with opposite thermal conductivity temperature coefficients, respectively, and then loaded into Cellulose airgel films with different thicknesses to obtain C20/Cellulose phase change composites. Thin film and PNIPAM/Cellulose phase change composite film, the thickness ratio of the two is 1:6, the two are cut into the same size, pasted together, assembled into a flexible thermal diode. Figure 5 shows the surface wettability of the bipolar materials C20/Cellulose phase-change composite film and PNIPAM/Cellulose phase-change composite film of the flexible thermal diode obtained in this embodiment, and other parameters are shown in Table 1.
实施例6Example 6
选择C18和PNIPAM水溶液分别作为热导率温度系数相反的负温度系数相变材料、正温度系数相变材料,之后分别负载到致密化处理后Kevlar气凝胶薄膜和未致密化处理Kevlar气凝胶薄膜中,分别得到C18/D-Kevlar相变复合薄膜和PNIPAM/Kevlar相变复合薄膜,二者的厚度比为1:6,将二者裁剪成同样尺寸,贴合在一起,组装成柔性热二极管。其他参数请见表1。C18 and PNIPAM aqueous solutions were selected as negative temperature coefficient phase change materials and positive temperature coefficient phase change materials with opposite thermal conductivity temperature coefficients, respectively, and then loaded on the densified Kevlar airgel film and the undensified Kevlar airgel respectively Among the films, C18/D-Kevlar phase-change composite film and PNIPAM/Kevlar phase-change composite film were respectively obtained, and the thickness ratio of the two was 1:6. The two were cut into the same size, pasted together, and assembled into a flexible thermal diode. See Table 1 for other parameters.
实施例7Example 7
选择PE和VO2分别作为热导率温度系数相反的负温度系数相变材料、正温度系数相变材料,PE通过溶液填充的方法负载到PBO气凝胶薄膜中,VO2通过原位生长的方法负载到PBO气凝胶薄膜中分别得到PE/PBO相变复合薄膜和VO2/PBO相变复合薄膜,二者的厚度比为10:1,将二者裁剪成同样尺寸,贴合在一起,组装成柔性热二极管。参数请见表1。PE and VO2 were selected as phase change materials with negative temperature coefficient and positive temperature coefficient, respectively, with opposite temperature coefficients of thermal conductivity. PE was loaded into the PBO airgel film by the method of solution filling, and VO2 was grown by in-situ growth. Method Loaded into PBO airgel film to obtain PE/PBO phase change composite film and VO 2 /PBO phase change composite film respectively, the thickness ratio of the two is 10:1, cut them into the same size, and stick them together , assembled into flexible thermal diodes. See Table 1 for parameters.
实施例8Example 8
选择PE和VO2分别作为热导率温度系数相反的负温度系数相变材料、正温度系数相变材料,PE通过溶液填充的方法负载到PBO气凝胶薄膜中,VO2通过原位生长的方法负载到PBO气凝胶薄膜中分别得到PE/PBO相变复合薄膜和VO2/PBO相变复合薄膜,二者的厚度比为2.5:1,将二者裁剪成同样尺寸,贴合在一起,组装成柔性热二极管。参数请见表1。PE and VO2 were selected as phase change materials with negative temperature coefficient and positive temperature coefficient, respectively, with opposite temperature coefficients of thermal conductivity. PE was loaded into the PBO airgel film by the method of solution filling, and VO2 was grown by in-situ growth. Method Loaded into PBO airgel film to obtain PE/PBO phase change composite film and VO 2 /PBO phase change composite film respectively, the thickness ratio of the two is 2.5:1, cut them into the same size, and stick them together , assembled into flexible thermal diodes. See Table 1 for parameters.
实施例9Example 9
选择C18和PNIPAM水溶液分别作为热导率温度系数相反的负温度系数相变材料、正温度系数相变材料,之后分别负载到致密化处理后Kevlar气凝胶薄膜和Cellulose气凝胶薄膜中,分别得到C18/D-Kevlar相变复合薄膜和PNIPAM/Cellulose相变复合薄膜,二者的厚度比为1:6,将二者裁剪成同样尺寸,贴合在一起,组装成柔性热二极管。图6示出了本实施例所得柔性热二极管正、反两方向热流量随两极温差的变化曲线,其他参数请见表1。C18 and PNIPAM aqueous solutions were selected as negative temperature coefficient phase change materials and positive temperature coefficient phase change materials with opposite thermal conductivity temperature coefficients, respectively, and then loaded into the densified Kevlar airgel film and Cellulose airgel film, respectively. The C18/D-Kevlar phase-change composite film and the PNIPAM/Cellulose phase-change composite film were obtained, and the thickness ratio of the two was 1:6. The two were cut into the same size, pasted together, and assembled into a flexible thermal diode. Fig. 6 shows the variation curve of the heat flux in the positive and negative directions of the flexible thermal diode obtained in this embodiment with the temperature difference between the two poles. For other parameters, please refer to Table 1.
实施例10Example 10
选择C16和PNIPAM水溶液分别作为热导率温度系数相反的负温度系数相变材料、正温度系数相变材料,之后分别负载到不同厚度的PI气凝胶薄膜和Cellulose气凝胶薄膜中,分别得到C20/PI相变复合薄膜和PNIPAM/Cellulose相变复合薄膜,二者的厚度比为1:6。将二者裁剪成同样尺寸,贴合在一起,组装成热二极管。图7示出了本实施例所得柔性热二极管热整流比,其他参数请见表1。C16 and PNIPAM aqueous solutions were selected as negative temperature coefficient phase change materials and positive temperature coefficient phase change materials with opposite thermal conductivity temperature coefficients, respectively, and then loaded into PI airgel films and Cellulose airgel films with different thicknesses, respectively, to obtain C20/PI phase change composite film and PNIPAM/Cellulose phase change composite film, the thickness ratio of the two is 1:6. Cut the two into the same size, stick them together, and assemble them into thermal diodes. Figure 7 shows the thermal rectification ratio of the flexible thermal diode obtained in this embodiment, and other parameters are shown in Table 1.
表1.实施例1-10所获柔性热二极管的结构与性能参数Table 1. The structure and performance parameters of the flexible thermal diodes obtained in Examples 1-10
实施例11Example 11
将C20/D-Kevlar作为第一相变复合薄膜,PNIPAM/Kevlar作为第二相变复合薄膜,二者的厚度比为1:6,并裁剪成同样尺寸,贴合在一起,组装成柔性成热二极管。第二相变复合薄膜在外,第一相变复合薄膜在内,贴附到水管表面,当外界温度高于水管中水的温度时,可对水进行加热,当外界温度低于水管中水的温度时,可对水进行保温,实现热管理的功能。图8示出了本实施例中柔性热二极管的应用示意图。C20/D-Kevlar is used as the first phase-change composite film, and PNIPAM/Kevlar is used as the second phase-change composite film. The thickness ratio of the two is 1:6, and they are cut into the same size, pasted together, and assembled into a flexible composite film. thermal diode. The second phase-change composite film is on the outside, and the first phase-change composite film is on the inside. It is attached to the surface of the water pipe. When the external temperature is higher than the temperature of the water in the water pipe, the water can be heated. When the external temperature is lower than the temperature of the water in the water pipe When the temperature is high, the water can be kept warm to realize the function of heat management. Fig. 8 shows a schematic diagram of the application of the flexible thermal diode in this embodiment.
通过实施例1-11,可以发现,藉由本发明的上述技术方案获得的热二极管具有良好的柔韧性、较小的工作温差以及优异的热整流性能,且制备、组装工艺简单,易于进行规模化生产,可共形贴附在需要进行热管理的弯曲表面或者不规则表面。Through Examples 1-11, it can be found that the thermal diode obtained by the above technical solution of the present invention has good flexibility, small operating temperature difference and excellent thermal rectification performance, and the preparation and assembly process is simple, and it is easy to scale up production, conformally attached to curved or irregular surfaces where thermal management is required.
此外,本案发明人还参照前述实施例,以本说明书述及的其它原料、工艺操作、工艺条件进行了试验,并均获得了较为理想的结果。In addition, the inventors of the present case also conducted experiments with reference to the foregoing examples, using other raw materials, process operations, and process conditions mentioned in this specification, and obtained satisfactory results.
本发明的各方面、实施例、特征及实例应视为在所有方面为说明性的且不打算限制本发明,本发明的范围仅由权利要求书界定。在不背离所主张的本发明的精神及范围的情况下,所属领域的技术人员将明了其它实施例、修改及使用。Aspects, embodiments, features and examples of the present invention are to be considered illustrative in all respects and not intended to be limiting, the scope of which is defined only by the claims. Other embodiments, modifications, and uses will be apparent to those skilled in the art without departing from the spirit and scope of the invention as claimed.
在本发明案中标题及章节的使用不意味着限制本发明;每一章节可应用于本发明的任何方面、实施例或特征。The use of headings and sections in this application is not meant to limit the invention; each section may apply to any aspect, embodiment or feature of the invention.
在本发明案通篇中,在将组合物描述为具有、包含或包括特定组份之处或者在将过程描述为具有、包含或包括特定过程步骤之处,预期本发明教示的组合物也基本上由所叙述组份组成或由所叙述组份组成,且本发明教示的过程也基本上由所叙述过程步骤组成或由所叙述过程步骤组组成。Throughout this specification, where compositions are described as having, comprising or comprising particular components or where processes are described as having, comprising or comprising particular process steps, it is contemplated that compositions of the present teachings also essentially consists essentially of, or consists of, the recited components, and the processes taught herein also consist essentially of, or consist of, the recited process steps.
应理解,各步骤的次序或执行特定动作的次序并非十分重要,只要本发明教示保持可操作即可。此外,可同时进行两个或两个以上步骤或动作。It should be understood that the order of steps or order for performing certain actions is immaterial so long as the teachings remain operable. Furthermore, two or more steps or actions may be performed simultaneously.
尽管已参考说明性实施例描述了本发明,但所属领域的技术人员将理解,在不背离本发明的精神及范围的情况下可做出各种其它改变、省略及/或添加且可用实质等效物替代所述实施例的元件。另外,可在不背离本发明的范围的情况下做出许多修改以使特定情形或材料适应本发明的教示。因此,本文并不打算将本发明限制于用于执行本发明的所揭示特定实施例,而是打算使本发明将包含归属于所附权利要求书的范围内的所有实施例。此外,除非具体陈述,否则术语第一、第二等的任何使用不表示任何次序或重要性,而是使用术语第一、第二等来区分一个元素与另一元素。Although the present invention has been described with reference to illustrative embodiments, it will be understood by those skilled in the art that various other changes, omissions and/or additions may be made without departing from the spirit and scope of the invention and that substantial, etc. Effects replace elements of the described embodiments. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from its scope. Therefore, it is not intended that the invention be limited to the particular embodiments disclosed for carrying out this invention, but that the invention will include all embodiments falling within the scope of the appended claims. Furthermore, unless specifically stated otherwise, any use of the terms first, second, etc. does not imply any order or importance, but rather the terms first, second, etc. are used to distinguish one element from another.
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001153577A (en) * | 1999-11-29 | 2001-06-08 | Furukawa Electric Co Ltd:The | Variable conductance heat pipe |
CN104650814A (en) * | 2015-01-15 | 2015-05-27 | 北京大学 | Phase-change thermal rectifier and preparation method thereof |
JPWO2015030239A1 (en) * | 2013-09-02 | 2017-03-02 | 日本碍子株式会社 | Thermal diode |
CN107194037A (en) * | 2017-04-25 | 2017-09-22 | 江苏大学 | A kind of design method of asymmetric insert structure nanometre film thermal rectifier |
JP6492211B1 (en) * | 2018-05-18 | 2019-03-27 | 株式会社フジクラ | Thermal diode and method of manufacturing thermal diode |
CN210687297U (en) * | 2019-07-04 | 2020-06-05 | 湖北凯科塑业有限公司 | One-way heat-releasing aluminum-plastic composite pipe |
CN111439001A (en) * | 2020-03-26 | 2020-07-24 | 东莞市弗勒特电子科技有限公司 | High-strength heat management material |
CN111793472A (en) * | 2020-07-17 | 2020-10-20 | 中国科学院苏州纳米技术与纳米仿生研究所 | Boron nitride aerogel phase change film, its preparation method and application |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10403767B2 (en) * | 2017-07-23 | 2019-09-03 | Rhode Island Council On Postsecondary Education | High contrast far-field radiative thermal diode |
-
2020
- 2020-12-31 CN CN202011621418.6A patent/CN114688905B/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001153577A (en) * | 1999-11-29 | 2001-06-08 | Furukawa Electric Co Ltd:The | Variable conductance heat pipe |
JPWO2015030239A1 (en) * | 2013-09-02 | 2017-03-02 | 日本碍子株式会社 | Thermal diode |
CN104650814A (en) * | 2015-01-15 | 2015-05-27 | 北京大学 | Phase-change thermal rectifier and preparation method thereof |
CN107194037A (en) * | 2017-04-25 | 2017-09-22 | 江苏大学 | A kind of design method of asymmetric insert structure nanometre film thermal rectifier |
JP6492211B1 (en) * | 2018-05-18 | 2019-03-27 | 株式会社フジクラ | Thermal diode and method of manufacturing thermal diode |
CN210687297U (en) * | 2019-07-04 | 2020-06-05 | 湖北凯科塑业有限公司 | One-way heat-releasing aluminum-plastic composite pipe |
CN111439001A (en) * | 2020-03-26 | 2020-07-24 | 东莞市弗勒特电子科技有限公司 | High-strength heat management material |
CN111793472A (en) * | 2020-07-17 | 2020-10-20 | 中国科学院苏州纳米技术与纳米仿生研究所 | Boron nitride aerogel phase change film, its preparation method and application |
Non-Patent Citations (3)
Title |
---|
Dual Phase Change Thermal Diodes for Enhanced Rectification Ratios: Theory and Experiment;Anton L. Cottrill, Song Wang, Albert Tianxiang Liu, Wen-Jun Wang, and Michael S. Strano;Advanced Energy Materials;第8卷(第11期);1702692 * |
微纳尺度热能调控的声子学元器件研究进展;徐象繁;杨诺;李保文;;物理(第03期);全文 * |
气凝胶微球的制备及应用;王叙春,李金泽,李广勇,王锦,张学同,郭强;物理化学学报;第33卷(第11期);2141-5152 * |
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