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CN114677908A - Display module assembly, display screen and electronic equipment - Google Patents

Display module assembly, display screen and electronic equipment Download PDF

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Publication number
CN114677908A
CN114677908A CN202011569019.XA CN202011569019A CN114677908A CN 114677908 A CN114677908 A CN 114677908A CN 202011569019 A CN202011569019 A CN 202011569019A CN 114677908 A CN114677908 A CN 114677908A
Authority
CN
China
Prior art keywords
display
display panel
area
cover plate
display module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202011569019.XA
Other languages
Chinese (zh)
Inventor
方建平
李志海
姜帆
龙浩晖
李小龙
吴昊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to CN202011569019.XA priority Critical patent/CN114677908A/en
Publication of CN114677908A publication Critical patent/CN114677908A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/115Via connections; Lands around holes or via connections
    • H05K1/116Lands, clearance holes or other lay-out details concerning the surrounding of a via

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

A display module, a display screen and electronic equipment relate to the technical field of electronic equipment. The display module comprises a cover plate, a display panel and a connecting structure; the display panel is arranged with the cover plate in a stacked mode and comprises a display area and a lead area, a first connecting pad is arranged on the surface, close to the cover plate, of the lead area, a lead is arranged in the lead area, the first connecting pad is electrically connected with the display area through the lead in the lead area, a groove is arranged on the surface, far away from the cover plate, of the lead area, and the first connecting pad is exposed out of the groove; the connecting structure comprises a first end and a second end, the first end of the connecting structure extends into the groove and is electrically connected with the first connecting bonding pad, and the second end of the connecting structure is used for being electrically connected with a main board of the electronic equipment. The possibility of the bright line problem in the display area of the electronic equipment can be reduced, and meanwhile, the screen occupation ratio of the electronic equipment is favorably improved.

Description

Display module assembly, display screen and electronic equipment
Technical Field
The application relates to the technical field of electronic equipment, especially, relate to a display module assembly, display screen and electronic equipment.
Background
At present, electronic devices with display functions, such as smart phones and tablet computers, are widely used in daily life of people. In order to improve the yield of such electronic devices, how to avoid the bright line problem in the display area is an important research direction for manufacturers. Meanwhile, in order to make the electronic equipment more beautiful and improve user experience, how to make the electronic equipment have a higher screen occupation ratio also becomes an important direction for research of various manufacturers.
Disclosure of Invention
The embodiment of the application provides a display module assembly, display screen and electronic equipment, can reduce the display area of electronic equipment and appear the possibility of bright line problem, is favorable to improving electronic equipment's screen proportion simultaneously.
In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions:
in a first aspect, some embodiments of the present application provide a display module, which includes a cover plate, a display panel and a connecting structure; the display panel is arranged with the cover plate in a stacked mode, the display panel comprises a display area and a lead area, a first connecting pad is arranged on the surface, close to the cover plate, of the lead area, a lead is arranged in the lead area, the first connecting pad is electrically connected with the display area through the lead in the lead area, a groove is arranged on the surface, far away from the cover plate, of the lead area, the groove penetrates through the lead area, and the first connecting pad is exposed; the connecting structure comprises a first end and a second end, the first end of the connecting structure extends into the groove and is electrically connected with the first connecting bonding pad, and the second end of the connecting structure is used for being electrically connected with a main board of the electronic equipment.
The embodiment of the application provides a display module assembly, set up the recess through the surface of keeping away from the apron in the lead wire region, expose in order to set up the first connection pad that is close to the surface of apron in the lead wire region, the first end that will connect the connection structure of mainboard simultaneously stretches into in the recess and is connected with first connection pad electricity by one side of keeping away from the apron of display panel, consequently, lead wire region or connection structure need not reverse the bending, can reduce the possibility that the fracture appears in lead wire region or connection structure's inside lead wire from this, thereby can reduce the possibility that the bright line problem appears in the display module assembly. Meanwhile, one end of the connecting structure, which is connected with the display panel, can be hidden to one side of the display panel, which is far away from the cover plate, so that the screen occupation ratio of the electronic equipment is improved.
In a possible implementation manner of the first aspect, the connection structure is a flexible circuit board, a first end of the connection structure is provided with a second connection pad, and the first end of the connection structure is electrically connected to the first connection pad through the second connection pad. The flexible circuit board is of a flexible structure and is convenient to bend so as to be hidden to one side, far away from the cover plate, of the display panel.
In a possible implementation manner of the first aspect, the connection structure portion where the first end is located is perpendicular to a plane where the first connection pad is located, and the second connection pad is disposed on an end surface, close to the first connection pad, of the connection structure portion where the first end is located. Therefore, the connecting structure at which the first end is located can be electrically connected with the first connecting pad without bending. Therefore, the possibility of breakage of the inner leads of the connecting structure can be further reduced, and the screen occupation ratio of the electronic equipment can be further improved.
In one possible implementation manner of the first aspect, a thickness of a portion of the connection structure where the first end is located is larger than a thickness of other portions of the connection structure except for the portion of the connection structure where the first end is located. Thus, the end surface area of the connection structure portion where the first end is located is large, and the second connection pad is convenient to arrange.
In a possible implementation manner of the first aspect, a height of the connection structure portion where the first end is located is less than or equal to a distance between a surface of the first connection pad far from the cover plate and a surface of the second structure layer far from the cover plate in a thickness direction of the display module. Therefore, other parts of the connecting structure except the connecting structure part where the first end is located can be bent and extend in the direction parallel to the display panel, the thickness of the other parts is small, the bending is convenient, and the connecting structure part where the first end is located cannot influence the thickness of the display module.
In a possible implementation manner of the first aspect, the connection structure portion where the first end is located is parallel to a plane where the first connection pad is located, the second connection pad is disposed on a side surface, close to the first connection pad, of the connection structure portion where the first end is located, and the other portion of the connection structure, except for the connection structure portion where the first end is located, is bent with respect to the connection structure portion where the first end is located and extends toward a side, away from the cover plate, of the display panel. Therefore, the connecting structure can be set to be a structure with each area being equal in thickness, and can be formed by adopting a conventional FPC (flexible printed circuit) forming process, so that the processing operation is convenient.
In a possible implementation manner of the first aspect, the display module further includes foam adhesive, and the connection structure is fixed to one side of the display panel, which is far away from the cover plate, through the foam adhesive. In some embodiments, the foam adhesive is disposed on a surface of the second structure layer away from the cover plate, and the foam adhesive is disposed near the groove. Therefore, the extra wrinkles of the connecting structure at the position close to the groove can be avoided, the influence of the connecting structure on the screen occupation ratio of the electronic equipment is avoided, and the possibility that the connecting structure causes the problem of bright lines of the electronic equipment can be reduced.
In one possible implementation manner of the first aspect, the second connection pad is electrically connected to the first connection pad through an Anisotropic Conductive Film (ACF). The ACF has the characteristics of electric conduction in the Z-axis direction and insulation barrier in any direction parallel to the XY plane, wherein the Z direction is vertical to the XY plane. In some embodiments, the Z-axis direction is the same as the thickness direction of the first connection pads, and the XY plane is parallel to the plane where the first connection pads are located, so that when the number of the first connection pads and the second connection pads is multiple, one ACF can be used to realize one-to-one corresponding electrical connection between the multiple second connection pads and the multiple first connection pads, and the complexity of the electrical connection operation between the second connection pads and the first connection pads can be reduced.
In a possible implementation manner of the first aspect, the display module further includes a first structural layer and a pad block; the cover plate is provided with a first cover plate area opposite to the display area of the display panel and a second cover plate area opposite to the lead area of the display panel, the first structural layer is arranged between the display area and the first cover plate area, and the cushion block is arranged between the lead area and the second cover plate area. The cushion block is used for supporting a lead wire area of the display panel, so that a groove is formed in the surface, far away from the cover plate, of the lead wire area in a cutting mode.
In one possible implementation manner of the first aspect, the first structural layer includes a transparent adhesive layer and a polarizer; the polaroid is arranged on the surface of the display area close to the first cover plate area, and the transparent adhesive layer is arranged between the polaroid and the first cover plate area.
In a possible implementation manner of the first aspect, the display panel is a flexible display panel, and the display module further includes a back film; the back film covers the surface of the display panel far away from the cover plate, a through hole is formed in the position, opposite to the groove, of the back film, and the first end of the connecting structure penetrates through the through hole, extends into the groove and is electrically connected with the first connecting bonding pad. The notacoria is used for promoting display panel's hardness to make things convenient for display panel to form the in-process of display module assembly at the assembly and transport.
In a possible implementation manner of the first aspect, the display module further includes a second structural layer; the second structure layer is arranged on the surface of the back film far away from the display panel, and the through holes on the back film are not covered by the second structure layer.
In one possible implementation manner of the first aspect, the second structural layer includes a buffer layer and a shielding layer; the buffer layer is arranged on the surface of the back film far away from the display panel, and the shielding layer is arranged on the buffer layer. The buffer layer is made of elastic compressible materials such as sponge and rubber, and is used for preventing the display panel from being in hard contact with the structure of the buffer layer, which is far away from the display panel, so that the display panel is crushed. The shielding layer is disposed on the buffer layer, and a material of the shielding layer is a conductive material such as metal, for example, copper, and the shielding layer is configured to prevent electromagnetic interference from being generated between the display panel and a circuit structure of the shielding layer on a side away from the display panel.
In one possible implementation form of the first aspect, the groove extends in a direction parallel to the display panel and away from the display area and penetrates a side face of the display panel. Like this, the recess is closed for bottom surface and three side, and the groove structure of other side openings is favorable to reducing the width that sets up of lead wire region at the edge of display area, can further improve electronic equipment's screen and account for than.
In a second aspect, some embodiments of the present application provide a display screen, where the display screen includes the display module according to any one of the above technical solutions.
In the display screen in this application embodiment, because this display screen includes as above any technical scheme the display module assembly, as above any technical scheme the display module assembly the possibility that bright line problem appears is lower, and is favorable to increasing the screen and accounts for the ratio, consequently can promote the yield and the aesthetic property of display screen.
In a third aspect, some embodiments of the present application provide an electronic device, where the electronic device includes a main board and the display screen according to the above technical solution, the main board is located on a side of a display panel of the display screen, which is far away from a cover plate of the display screen, and a second end of a connection structure of the display screen is electrically connected to the main board.
In the electronic equipment in this application embodiment, because the display screen among this electronic equipment is as above technical scheme the display screen, the display module group appears the possibility of bright line problem lower among the above-mentioned display screen, and is favorable to increasing the screen and accounts for the ratio, consequently also can promote electronic equipment's yield and aesthetic property.
Drawings
Fig. 1 is a front view of an electronic device to which the present application relates;
FIG. 2 is a schematic cross-sectional view of the electronic device shown in FIG. 1 taken along the line A0-A0;
FIG. 3 is a schematic structural diagram of an electronic device according to some embodiments of the present application when displaying;
fig. 4 is a schematic structural diagram of an electronic device according to yet another embodiment of the present application when displaying;
fig. 5 is a schematic structural diagram of an electronic device according to yet another embodiment of the present application when displaying;
FIG. 6 is an enlarged view of region I of FIG. 2;
fig. 7 is a partial schematic structural diagram of another electronic device related to the present application;
FIG. 8 is a cross-sectional view of a display module according to some embodiments of the present disclosure;
FIG. 9 is an enlarged view of area II of FIG. 8;
FIG. 10 is a bottom view of the display module shown in FIG. 8;
FIG. 11 is an orientation diagram of a first projection area and a second projection area on a front surface of a lead area in the display module shown in FIG. 10;
fig. 12 is a schematic partial structure view of a display module according to still other embodiments of the present disclosure;
fig. 13 is a schematic structural diagram of a display module according to still other embodiments of the present application;
FIG. 14 is an enlarged view of a region III of the display module shown in FIG. 13;
fig. 15 is a schematic partial structure view of a display module according to still other embodiments of the present disclosure;
FIG. 16 is a schematic view of a portion of the connection structure of the display module shown in FIGS. 14 and 15;
FIG. 17 is a schematic view of a portion of a connection structure provided in accordance with further embodiments of the present application;
fig. 18 is a schematic structural view of the connection structure shown in fig. 17 applied to a display module;
fig. 19 is a flowchart of a processing method of a display module according to some embodiments of the present disclosure;
fig. 20 is a schematic cross-sectional structure diagram of an electronic device according to some embodiments of the present application.
Reference numerals:
011-display screen; 012-main board; 013-linkage structure; 01-an electronic device; 0111-cover plate; 0112-display panel; 0112 a-display area; 0112 b-lead region; 100-a display module; 104-a cover plate; 101-a display panel; 108-a backing film; 101 a-a display area; 101 b-lead area; 102-first connection pads; 101 c-lead; 103-a groove; 108 a-a via; 104 a-a first cover plate area; 104 b-a second cover plate area; 105-a first structural layer; 1051-a polarizer; 1052-transparent glue layer; 107-cushion blocks; 106-a second structural layer; 1061-a buffer layer; 1062-a shielding layer; 300-a connecting structure; 301-second connection pad; 700-anisotropic conductive film; 600-foam cotton glue; 200-a main board; 500-back cover; 400-middle frame; 401-middle plate; 402-borders.
Detailed Description
In the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.
In the embodiments of the present application, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
In the embodiment of the present application, the character "/" indicates that the former and latter associated objects are in an "or" relationship.
One type of electronic device with a display function includes a display screen, a motherboard, and a connection structure connecting the display screen and the motherboard, where the display screen includes but is not limited to a flexible display screen and a rigid display screen, the connection structure includes but is not limited to a wire, a Flexible Printed Circuit (FPC), and an enameled wire, and the motherboard is used to transmit signals and electric quantity to the display screen through the connection structure to control the display screen to display images/videos, etc.
Referring to fig. 1, fig. 1 is a front view of an electronic device 01 according to the present application, and fig. 2 is a schematic cross-sectional view of the electronic device 01 shown in fig. 1 along a direction a0-a 0. In this embodiment, the electronic device 01 is a mobile phone. The electronic device 01 includes a display screen 011, a main board 012, and a connection structure 013.
The display screen 011 is for displaying images/videos or the like. The display screen 011 includes a cover plate 0111 and a display panel 0112 stacked with the cover plate 0111. The cover plate 0111 is a light-transmitting cover plate, and the material of the cover plate 0111 includes, but is not limited to, optical glass and plastic. The display panel 0112 may be a flexible display panel or a rigid display panel, and fig. 2 only shows an example in which the display panel 0112 is a flexible display panel. The display panel 0112 includes a display area 0112a and a lead area 0112 b.
The display region 0112a is a region of the display panel 0112 for displaying an image. Referring to fig. 3, fig. 3 is a schematic structural diagram of an electronic device in display according to some embodiments of the present disclosure, in which in the present embodiment, the electronic device is a tablet phone, a rectangular display area Q1 capable of displaying an image is disposed in a middle portion of a display screen, and a display area 0112a of a display panel is a portion of the display panel forming the rectangular display area Q1. Referring to fig. 4, fig. 4 is a schematic structural diagram of an electronic device during display according to still another embodiment of the present disclosure, in this embodiment, the electronic device is a curved-panel mobile phone, a curved display area Q1 capable of displaying an image is disposed in the middle of a display screen, and a display area 0112a of a display panel is a portion of the display panel forming the curved display area Q1. Referring to fig. 5, fig. 5 is a schematic structural diagram of an electronic device in a display process according to still another embodiment of the present disclosure, in this embodiment, the electronic device is a folding-screen mobile phone, a foldable display area Q1 capable of displaying an image is disposed in the middle of the display screen, and a display area 0112a of the display panel is a portion of the display panel forming the foldable display area Q1. In the embodiment shown in fig. 3, 4 and 5, the display region Q1 is a definite region surrounded by the non-display region Q2 or a frame, and when a black spot and a bright line appear in the display region Q1 due to an accident such as dropping, hitting, scratching, etc., the black spot region and the portion of the display panel at the bright line region still belong to the display region 0112a of the display panel 0112. The non-display area Q2 of the display screen is an area not used for displaying and surrounded on at least one side edge of the display area Q1, and in the non-display area Q2, a light shielding structure such as a light shielding ink layer and a light shielding adhesive tape is generally arranged on the surface of the cover plate close to the display module. In addition, a portion of the cover plate 0111, which is opposite to the display area 0112a of the display panel 0112, is a light-transmitting portion, that is, the cover plate 0111 is not provided with a light-shielding structure such as a light-shielding ink layer or a light-shielding tape, so as to allow image light generated by the display area 0112a to pass through, thereby implementing image display.
The lead region 0112b is a region where a signal and power are introduced to the display region 0112 a. The lead line region 0112b is located in a non-display area of the display screen. The lead wire region 0112b is provided with a lead wire for transmitting signals and electric quantity. The lead region 0112b is provided with a connection pad a, which is limited by the processing of the display panel 0112, and the connection pad a is generally disposed on a surface of the lead region 0112b facing the cover 0111. The connection pad a is connected to the display region 0112a through a wire in the wire region 0112 b. In order to narrow the frame or to form a full screen of the electronic device 01, the main board 012 is provided on the side of the display panel 0112 away from the cover 0111. In some embodiments, connection structure 013 is an FPC. One end of the connection structure 013 is electrically connected to the connection pad a of the display screen 011, and the other end is electrically connected to the main board 012. Thereby transmitting the signal and the power outputted from the main board 012 to the display screen 011 to control the display screen 011 to display images/videos.
Referring to fig. 6, fig. 6 is an enlarged view of a region I in fig. 2, in the present embodiment, the lead region 0112b is reversely bent to a side of the display region 0112a away from the cover 0111 to connect with an end of the connection structure 013. Referring to fig. 7, fig. 7 is a partial schematic structural diagram of another electronic device 01 according to the present invention, in this embodiment, a display panel 0112 is a rigid display panel, and an end of a connection structure 013 connected to the display panel 011 is bent backward to be welded to a connection pad a of a lead region 0112b near a surface of a cover 0111.
Since the lead region 0112b of the electronic device 01 shown in fig. 6 and the connection structure 013 of the electronic device 01 shown in fig. 7 are reversely bent (the bending angle is about 180 °), the lead region 0112b and the connection structure 013 have a larger bending angle, and the lead in the electronic device is easily cracked due to stress during the bending process, so that the bright line problem is easily generated in the display region 0112a of the display panel 0112. On the other hand, in order to reduce the possibility of the bright line problem occurring in the display region 0112a of the display panel 0112 in the electronic device 01 shown in fig. 6 and 7, the bending radius of the lead region 0112b in the electronic device 01 shown in fig. 6 and the connection structure 013 in the electronic device 01 shown in fig. 7 may be set to be larger, but in this way, the occupied width w of the lead region 0112b and the connection structure 013 at the edge of the display region 0112a is larger, which is not favorable for increasing the screen occupation ratio of the electronic device 01.
In order to reduce the possibility of the bright line problem occurring in the display area of the display panel in the electronic device and improve the screen occupation ratio of the electronic device, the present application provides a display module 100, and the display module 100 is applied to electronic devices such as a smart phone, a tablet computer, a watch, a pendant device or other wearable or micro devices, a cellular phone, a media player, etc.
Referring to fig. 8 to 10, fig. 8 is a cross-sectional view of a display module 100 according to some embodiments of the present disclosure, fig. 9 is an enlarged view of a region II in fig. 8, and fig. 10 is a bottom view of the display module 100 shown in fig. 8. In the present embodiment, the display module 100 includes a cover plate 104 and a display panel 101. The cover plate 104 is a light-transmissive plate-shaped structure, the cover plate 104 is formed of a material including, but not limited to, glass, plastic, and sapphire, the cover plate 104 is used for protecting the display panel 101, and the cover plate 104 is capable of transmitting image light emitted from the display panel 101.
The display panel 101 and the cover plate 104 are stacked. In some embodiments, the display panel 101 is a flexible display panel, and the display panel 101 includes, but is not limited to, a flexible organic light-emitting diode (OLED) display panel and a flexible quantum dot light-emitting diode (QLED) display panel, for example. On this basis, in some embodiments, the display module 100 further includes a back film 108, the back film 108 covers the surface of the display panel 101 away from the cover plate 104, in some embodiments, the forming material of the back film 108 is plastic, and the back film 108 is used for improving the rigidity of the display panel 101, so as to facilitate the transportation of the display panel 101 in the process of assembling the display module 100.
It is understood that the display panel 101 may also be a rigid display panel, for example, the display panel 101 includes, but is not limited to, a rigid organic light-emitting diode (OLED) display panel, a rigid active matrix organic light-emitting diode (AMOLED) display panel, a rigid mini light-emitting diode (mini-OLED) display panel, a rigid quantum dot light-emitting diode (QLED) display panel, and a rigid Liquid Crystal Display (LCD) panel.
The display panel 101 includes a display region 101 a. The display region 101a is a region for displaying an image on the display panel 101. The shape of the display region 101a may be rectangular, circular, square, polygonal, etc., and is not particularly limited herein. In some embodiments, referring to fig. 10, the display area 101a is rectangular.
With reference to fig. 9, the display panel 101 further includes a lead region 101b, and the lead region 101b is a region for introducing signals and power to the display region 101 a. The surface of the lead region 101b near the cap plate 104 is provided with a first connection pad 102. The number of the first connection pads 102 may be one or more, and is not limited specifically, and the application only gives an example that the number of the first connection pads 102 is more, and this is not to be considered as a specific limitation to the application. A lead 101c is disposed in the lead region 101b, and in some embodiments, the lead 101c is a Source Drain (SD) trace. The first connection pad 102 is electrically connected to the display region 101a through a wire 101c in the wire region 101 b. The display module 100 is electrically connected to the main board through the first connection pad 102 to receive power and image/video signals from the main board.
The surface of the lead region 101b remote from the cover plate 104 is provided with a groove 103, and the groove 103 penetrates the lead region 101b to expose the first connection pad 102. When the surface of the display panel 101 away from the cover plate 104 is covered with the back film 108, a through hole 108a is disposed on the back film 108 at a position opposite to the groove 103, and the cross-sectional shape and size of the through hole 108a may be the same as the opening shape and size of the groove 103, or may be different from the opening shape and size of the groove 103, and is not particularly limited herein. In the embodiment of the present application, the cross-sectional shape and size of the through hole 108a are the same as the opening shape and size of the groove 103, which should not be construed as a particular limitation to the present application.
In order to expose the first connection pad 102 by the recess 103, an orthogonal projection area of the recess 103 on a surface of the lead region 101b close to the cap plate 104 is defined as a first projection area C, and an orthogonal projection area of the first connection pad 102 on a surface of the lead region 101b close to the cap plate 104 is defined as a second projection area D. Referring to fig. 11, fig. 11 is an orientation relationship diagram of a first projection area C and a second projection area D on a surface of the lead area 101b of the display module 100 shown in fig. 10, the surface being close to the cover plate 104, wherein at least a portion of the second projection area D is located in the first projection area C, that is, the second projection area D overlaps with the first projection area C.
In some embodiments, with continued reference to fig. 9, the cover plate 104 includes a first cover plate region 104a and a second cover plate region 104 b. The first cover area 104a is directly opposite to the display area 101a of the display panel 101, that is, the orthographic projection area of the display area 101a of the display panel 101 on the cover 104 coincides with the first cover area 104 a. The second cover region 104b is opposite to the lead region 101b of the display panel 101, that is, the orthographic projection area of the lead region 101b of the display panel 101 on the cover 104 coincides with the second cover region 104 b.
In some embodiments, referring to fig. 9, the display module 100 further includes a first structure layer 105 and a spacer 107, wherein the first structure layer 105 is disposed between the display region 101a and the first cover region 104a of the display panel 101. The first structure layer 105 is a light-transmitting structure and does not block image light emitted from the display region 101 a. The spacer 107 is disposed between the lead region 101b of the display panel 101 and the second cover region 104b of the cover 104. The material forming the spacer 107 is plastic, and in some embodiments, the material forming the spacer 107 is polyethylene terephthalate (PET). The spacer 107 is used for supporting the lead region 101b of the display panel 101, so as to provide the groove 103 by cutting on the surface of the lead region 101b away from the cover plate 104. In some embodiments, the pad 107 and the lead region 101b and the pad 107 and the second cover region 104b of the cover 104 may be fixed by adhesive.
In some embodiments, with continued reference to FIG. 9, the first structural layer 105 includes a polarizer 1051 and a transparent adhesive layer 1052. The polarizer 1051 includes, but is not limited to, a circular polarizer and a linear polarizer, and the polarizer 1051 is disposed on the surface of the display region 101a close to the first cover region 104 a. The polarizer 1051 is used to reduce the influence of the reflected light on the display effect of the display module 100. The polarizer 1051 may be directly formed on the surface of the display region 101a close to the first cover region 104a, or may be adhered to the surface of the display region 101a close to the first cover region 104a by a glue layer, and fig. 9 only shows an example in which the polarizer 1051 is directly formed on the surface of the display region 101a close to the first cover region 104a, which should not be considered as a specific limitation to the present application. The transparent adhesive layer 1052 is disposed between the polarizer 1051 and the first cover region 104a of the cover 104, the transparent adhesive layer 1052 is used to bond the display panel 101 with the polarizer 1051 to the cover 104, and the transparent adhesive layer 1052 can transmit the image light emitted from the display region 101 a. In some embodiments, the transparent adhesive layer 1052 is an Optical Clear Adhesive (OCA), and the OCA has characteristics of being colorless and transparent, having a light transmittance of more than 90%, and having a good adhesive strength, so that interference to image light emitted from the display region 101a can be reduced, and an adhesive strength between the display panel 101 with the polarizer 1051 and the cover plate 104 can be ensured.
It is understood that the first structure layer 105 may include other structures such as a touch layer in addition to the polarizer 1051 and the transparent adhesive layer 1052, which is not particularly limited herein. The first structural layer 105 may also be in other structural forms, and is not limited herein.
In some embodiments, with continued reference to fig. 9, the trench 103 is a trench structure with a closed bottom and four sides.
In other embodiments, referring to fig. 12, fig. 12 is a schematic partial structure diagram of a display module 100 according to still other embodiments of the present application. In the present embodiment, the groove 103 extends in a direction parallel to the display panel 101 and away from the display region 101a and penetrates the side surface of the display panel 101. In this way, the groove 103 is a groove structure in which the bottom surface and three side surfaces are closed and the other side is open, which is advantageous for reducing the setting width w1 of the lead region 101b at the edge of the display region 101a, and can further improve the screen occupation ratio of the electronic device.
In some embodiments, referring to fig. 9 or fig. 12, the display module 100 further includes a second structural layer 106, the second structural layer 106 is disposed on a surface of the back film 108 away from the display panel 101, and the second structural layer 106 does not cover the through hole 108a on the back film 108.
In some embodiments, with continued reference to fig. 9 or 12, the second structural layer 106 includes a buffer layer 1061 and a shielding layer 1062. The buffer layer 1061 is disposed on a surface of the back film 108 away from the display panel 101, the buffer layer 1061 is formed of an elastic and compressible material such as sponge or rubber, and the buffer layer 1061 is used to prevent the display panel 101 from being in hard contact with a structure of the buffer layer 1061 on a side away from the display panel 101 to crush the display panel 101. The shielding layer 1062 is disposed on the buffer layer 1061, a material of the shielding layer 1062 is a conductive material such as metal, for example, the material of the shielding layer 1062 is copper, and the shielding layer 1062 is used to prevent electromagnetic interference from being generated between the display panel 101 and a circuit structure of the shielding layer 1062 on a side far from the display panel 101. In some embodiments, the buffer layer 1061 and the display region 101a, and the buffer layer 1061 and the shielding layer 1062 may be adhered by a glue layer.
It is understood that the second structural layer 106 may include other layers besides the buffer layer 1061 and the shielding layer 1062, and is not limited in particular. The second structural layer 106 may also be in other structural forms, which are not limited herein.
In some embodiments, please refer to fig. 13 and 14, fig. 13 is a schematic structural diagram of a display module 100 according to still other embodiments of the present application, and fig. 14 is an enlarged view of a region III in the display module 100 shown in fig. 13. In this embodiment, the display module 100 further includes a connecting structure 300 in addition to the structures of the display module 100 shown in fig. 8 and 9. The connecting structure 300 includes a first end E and a second end F opposite to each other, the first end E of the connecting structure 300 extends into the recess 103 and is electrically connected to the first connection pad 102, and the second end F of the connecting structure 300 is used for electrically connecting to a motherboard of the electronic device. In some embodiments, the first end E of the connection structure 300 extends into the recess 103 through the through hole 108a on the back film 108 and is electrically connected to the first connection pad 102. The connection structure 300 is used for transmitting signals and power output by the main board to the display panel 101 to control the display panel 101 to display images/videos and the like.
The connection structure 300 includes, but is not limited to, a conductive wire, an FPC, and an enameled wire, and in some embodiments, referring to fig. 13 and 14, the connection structure 300 is an FPC. The first end E of the connection structure 300 is provided with a second connection pad 301, and the first end E of the connection structure 300 is electrically connected to the first connection pad 102 through the second connection pad 301.
Specifically, the second connection pad 301 and the first connection pad 102 may be electrically connected by soldering, conductive adhesive bonding, or the like, and are not particularly limited herein.
In some embodiments, please refer to fig. 15, and fig. 15 is a schematic partial structure diagram of a display module 100 according to still other embodiments of the present application. In the present embodiment, the second connection pad 301 is electrically connected to the first connection pad 102 through an Anisotropic Conductive Film (ACF) 700. The ACF has characteristics of electrical conduction in a Z-axis direction and insulation barrier in any direction parallel to an XY plane, wherein the Z direction is perpendicular to the XY plane. In some embodiments, the Z-axis direction is the same as the thickness direction of the first connection pads 102, and the XY plane is parallel to the plane where the first connection pads 102 are located, so that when the number of the first connection pads 102 and the second connection pads 301 is multiple, one ACF can be used to electrically connect the multiple second connection pads 301 and the multiple first connection pads 102 in a one-to-one correspondence, and the complexity of the electrical connection operation between the second connection pads 301 and the first connection pads 102 can be reduced.
When the connection structure 300 is an FPC, specifically, the specific structure of the connection structure 300 may include the following two embodiments:
the first embodiment is as follows: referring to fig. 14, 15 and 16, fig. 16 is a partial schematic structural view of the connection structure 300 in the display module 100 shown in fig. 14 and 15. The connection structure portion where the first end E is located is perpendicular to the plane where the first connection pad 102 is located, and the second connection pad 301 is disposed on the end surface of the connection structure portion where the first end E is located, which is close to the first connection pad 102. Thus, the connection structure at which the first end E is located can be electrically connected to the first connection pad 102 without bending. Therefore, the possibility of breakage of the inner leads of the connection structure 300 can be further reduced, and the screen occupation ratio of the electronic device can be further improved.
In the above-described embodiments, in order to facilitate the arrangement of the second connection pads 301 on the end faces of the connection structure portions where the first ends E are located, in some embodiments, referring to fig. 16, the thickness d1 of the connection structure portions where the first ends E are located is larger than the thickness d2 of the other portions of the connection structure 300 than the connection structure portions where the first ends E are located. Thus, the end surface area of the connection structure portion where the first end E is located is large, facilitating the arrangement of the second connection pad 301.
In order to manufacture the connection structure 300 of the above embodiment, a conventional process may be used to manufacture a connection structure body with equal thickness in each region; then adding lining plates on two opposite sides or one side of the part of the connecting structure main body forming the first end E to form a connecting structure part with larger thickness; finally, a second connection pad 301 is formed on the end face of the first end E of the connection structure portion.
In the above embodiment, optionally, with reference to fig. 16, the height h1 of the connection structure portion where the first end E is located is less than or equal to the distance h2 between the surface of the first connection pad 102 away from the cover plate 104 and the surface of the second structure layer 106 away from the cover plate 104 along the thickness direction of the display module 100 (see fig. 15). In this way, the other portion of the connection structure 300 except the connection structure portion where the first end E is located may be bent and extend in a direction parallel to the display panel 101, the thickness of the other portion is small, the bending is convenient, and the connection structure portion where the first end E is located does not affect the thickness of the display module 100.
Example two: referring to fig. 17 and 18, fig. 17 is a partial schematic structural view of a connection structure 300 according to still other embodiments of the present application, and fig. 18 is a schematic structural view of the connection structure shown in fig. 17 applied to a display module. The connection structure portion where the first end E is located is parallel to the plane where the first connection pad 102 is located, the second connection pad 301 is disposed on the side surface, close to the first connection pad 102, of the connection structure portion where the first end E is located, and the other portion, except the connection structure portion where the first end E is located, of the connection structure 300 is bent relative to the connection structure portion where the first end E is located, and extends toward the side, away from the cover plate 104, of the display panel 101. In this way, the connection structure 300 can be configured to have a structure with the same thickness in each region, and can be formed by adopting a conventional FPC forming process, so that the processing operation is convenient.
In the first and second embodiments, in order to fix the connection structure 300 on the side of the display panel 101 away from the cover plate 104, the display module 100 further includes the foam plastic 600, and the connection structure 300 is fixed on the side of the display panel 101 away from the cover plate 104 through the foam plastic 600. In some embodiments, the foam rubber 600 is disposed on a surface of the second structural layer 106 away from the cover plate 104, and the foam rubber 600 is disposed near the groove 103. In this way, the extra wrinkles of the connection structure 300 at the position close to the groove 103 can be avoided, the influence of the connection structure 300 on the screen occupation ratio of the electronic device can be avoided, and the possibility that the connection structure 300 causes the bright line problem of the electronic device can be reduced.
In this way, the groove 103 is formed on the surface of the lead region 101b far from the cover plate 104 to expose the first connection pad 102 formed on the surface of the lead region 101b near the cover plate 104, and the first end of the connection structure 300 for connecting the main board is inserted into the groove from the side of the display panel 101 far from the cover plate 104 and is electrically connected to the first connection pad 102, so that the lead region 101b or the connection structure 300 does not need to be bent reversely, thereby reducing the possibility of cracking of the lead region 101b or the inner lead of the connection structure 300, and reducing the possibility of the display panel 101 having bright line problem. Meanwhile, one end of the connection structure 300, which is connected to the display panel 101, may be hidden to a side of the display panel 101, which is away from the cover plate 104, so as to facilitate increasing a screen occupation ratio of the electronic device.
The present application further provides a processing method of a display module, which is used for processing the display module 100 according to any of the above embodiments. Referring to fig. 19, fig. 19 is a flowchart of a processing method of a display module according to some embodiments of the present disclosure, the processing method including:
s100: the display panel 101 is stacked on the cover plate 104. The display panel 101 includes a display region 101a and a lead region 101b, a first connection pad 102 is disposed on a surface of the lead region 101b close to the cover plate 104, a lead 101c is disposed in the lead region 101b, and the first connection pad 102 is electrically connected to the display region 101a through a lead in the lead region 101 b.
S200: a recess 103 is provided in a surface of the lead region 101b remote from the cap plate 104, the recess 103 penetrating the lead region 101b to expose the first connection pad 102.
In some embodiments, step S200 comprises: a groove 103 is provided on the surface of the lead region 101b remote from the cap plate 104 using a laser cutting process. The laser cutting process has high precision, and avoids removing part of the material of the first connection pad 102 while cutting to form the groove 103.
In order to expose the first connection pad 102 from the recess 103, an orthogonal projection area of the recess 103 on the surface of the lead region 101b close to the cover plate 104 is defined as a first projection area, an orthogonal projection area of the first connection pad 102 on the surface of the lead region 101b close to the cover plate 104 is defined as a second projection area, and at least a part of the second projection area is located in the first projection area, that is, there is an overlap between the first projection area and the second projection area.
S300: the first end E of the connection structure 300 is extended into the recess 103 and electrically connected to the first connection pad 102, and the second end F of the connection structure 300 is used for electrically connecting to a motherboard of an electronic device.
Because the groove 103 is arranged on the surface of the lead region 101b far from the cover plate 104 in the processing method provided by the embodiment of the application, the first connection pad 102 arranged on the surface of the lead region 101b near to the cover plate 104 is exposed by the groove 103, and the connection structure 300 connected with the main board is directly connected with the lead region 101b of the display panel 101 from the side of the display panel 101 far from the cover plate 104, the lead region 101b or the connection structure 300 does not need to be bent reversely, so that the possibility of cracking of the inner lead of the lead region 101b or the connection structure 300 can be reduced, and the possibility of the bright line problem of the display panel 101 can be reduced. Meanwhile, one end of the connection structure 300, which is connected to the display panel 101, may be hidden to a side of the display panel 101, which is away from the cover plate 104, so as to facilitate increasing a screen occupation ratio of the electronic device.
In some embodiments, the display panel 101 is a flexible display panel, and the processing method of the display module 100 further includes: s400: the surface of the display panel 101 remote from the cover plate 104 is covered with a back film 108. The material forming the backing film 108 may be plastic. In some embodiments, step S400 is before step S100, so that the stiffness of the display panel 101 can be increased by the back film 108 to facilitate the transportation of the display panel 101 during the assembly process with the cover plate 104. On this basis, step S200 further includes: a through hole 108a is provided in the back film 108 at a position opposite to the groove 103. Step S300 includes: the first end E of the connection structure 300 is extended into the recess 103 through the via hole 108a and electrically connected to the first connection pad 102.
Specifically, in some embodiments, the display module further includes a first structure layer 105 and a spacer 107, the cover plate 104 includes a first cover plate region 104a and a second cover plate region 104b, the first cover plate region 104a is opposite to the display region 101a, and the second cover plate region 104b is opposite to the lead region 101b, and the step S100 further includes:
a first structural layer 105 is provided between the display region 101a and the first cover region 104a, and a spacer 107 is provided between the lead region 101b and the second cover region 104 b.
In some embodiments, the first structure layer 105 includes a polarizer 1051 and a transparent adhesive layer 1052, and disposing the first structure layer 105 between the display region 101a and the first cover plate region 104a includes: a polarizer 1051 is arranged on the surface of the display area 101a close to the first cover plate area 104 a; a transparent adhesive layer 1052 is disposed between the polarizer 1051 and the first cover region 104 a.
After step S400, the processing method of the display module 100 further includes:
s500: the second structure layer 106 is disposed on the surface of the back film 108 away from the display panel 101, and the second structure layer 106 does not cover the through hole 108 a. In some embodiments, the second structural layer 106 includes a buffer layer 1061 and a shielding layer 1062, and the step S500 includes: a buffer layer 1061 is disposed on the surface of the back film 108 away from the display panel 101; a shield layer 1062 is provided on the buffer layer 1061.
The present application further provides a display screen, which includes the display module 100 according to any of the above embodiments. In this embodiment, the display screen may include other structures, such as a fingerprint recognition device, besides the display module 100.
In the display screen of the embodiment of the application, since the display screen includes the display module 100 according to any one of the above embodiments, the display module 100 according to any one of the above embodiments has a low possibility of causing a bright line problem, and is favorable for increasing the screen occupation ratio, so that the yield and the aesthetic property of the display screen can be improved.
The present application further provides an electronic device, which is a type of electronic device with a display function, and specifically, the electronic device may be a portable electronic device or other suitable electronic device. For example, the electronic device may be a laptop, a tablet, a smaller device such as a cell phone, a watch, a pendant device or other wearable or miniature device, a cellular phone, a media player, and the like.
Referring to fig. 20, fig. 20 is a schematic cross-sectional structure diagram of an electronic device according to some embodiments of the present application. In this embodiment, the electronic device is a mobile phone. The electronic device comprises the display screen and the main board 200 according to the above embodiment. The main board 200 is a control circuit board in the electronic device. The main board 200 is disposed on a side of the display panel of the display module 100 of the display screen, which is far away from the cover plate of the display module 100, and the second end F of the connection structure 300 of the display module 100 is electrically connected to the main board 200.
In the electronic device according to the embodiment of the present application, since the display screen in the electronic device is the display screen according to the embodiment of the present application, the possibility that the bright line problem occurs in the display module 100 in the display screen is low, and the increase of the screen occupation ratio is facilitated, so that the yield and the aesthetic property of the electronic device can be improved.
In some embodiments, with continued reference to fig. 20, the electronic device includes a back cover 500 and a middle frame 400 in addition to the display screen and the main board 200.
The back cover 500 constitutes a rear housing of the electronic device, and the back cover 500 is used for protecting electronic devices in the electronic device from water and dust, and ensuring the tidiness of the appearance of the electronic device. The material forming the back cover 500 may be a conductive material such as metal, or may be a non-conductive material such as glass or plastic.
Middle frame 400 includes middle plate 401 and bezel 402. The middle plate 401 is located between the display screen and the back cover 500 and stacked with the display screen and the back cover 500, and the middle plate 401 is made of a conductive material such as metal. A bezel 402 is disposed around the periphery of the midplane 401. The main board 200 is disposed between the middle plate 401 and the back cover 500, and the connecting structure 300 is disposed on the middle plate 401.
In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims (13)

1. A display module is characterized by comprising a cover plate, a display panel and a connecting structure;
the display panel and the cover plate are arranged in a stacked mode, the display panel comprises a display area and a lead area, a first connecting pad is arranged on the surface, close to the cover plate, of the lead area, a lead is arranged in the lead area, the first connecting pad is electrically connected with the display area through the lead in the lead area, a groove is arranged on the surface, far away from the cover plate, of the lead area, and the first connecting pad is exposed out of the groove;
the connecting structure comprises a first end and a second end, the first end of the connecting structure extends into the groove and is electrically connected with the first connecting bonding pad, and the second end of the connecting structure is used for being electrically connected with a main board of the electronic equipment.
2. The display module according to claim 1, wherein the connecting structure is a flexible circuit board, the first end of the connecting structure is provided with a second connecting pad, and the first end of the connecting structure is electrically connected to the first connecting pad through the second connecting pad.
3. The display module according to claim 2, wherein the connection structure portion at the first end is perpendicular to a plane in which the first connection pad is located, and the second connection pad is disposed on an end surface of the connection structure portion at the first end, the end surface being close to the first connection pad.
4. The display module according to claim 2, wherein the connection structure portion at the first end is parallel to the plane of the first connection pad, the second connection pad is disposed on a side of the connection structure portion at the first end close to the first connection pad, and the other portion of the connection structure except the connection structure portion at the first end is bent with respect to the connection structure portion at the first end and extends toward a side of the display panel away from the cover plate.
5. The display module according to any one of claims 2 to 4, wherein the second connection pad is electrically connected to the first connection pad through an anisotropic conductive film.
6. The display module of any one of claims 1-5, further comprising a first structural layer and a spacer;
the cover plate is provided with a first cover plate area opposite to a display area of the display panel and a second cover plate area opposite to a lead area of the display panel, the first structural layer is arranged between the display area and the first cover plate area, and the cushion block is arranged between the lead area and the second cover plate area.
7. The display module of claim 6, wherein the first structural layer comprises a transparent adhesive layer and a polarizer;
the polaroid is arranged on the surface, close to the first cover plate area, of the display area, and the transparent adhesive layer is arranged between the polaroid and the first cover plate area.
8. The display module according to any one of claims 1 to 7, wherein the display panel is a flexible display panel, and the display module further comprises a back film;
The notacoria cover in display panel keeps away from the surface of apron, just on the notacoria with the position that the recess is relative is equipped with the through-hole, connection structure's first end passes the through-hole stretches into in the recess and with first connection pad electricity is connected.
9. The display module of claim 8, further comprising a second structural layer;
the second structure layer is arranged on the surface of the back film far away from the display panel, and the second structure layer does not cover the through hole.
10. The display module of claim 9, wherein the second structural layer comprises a buffer layer and a shielding layer;
the buffer layer is arranged on the surface of the back film far away from the display panel, and the shielding layer is arranged on the buffer layer.
11. A display module according to any one of claims 1-10, wherein the recess extends in a direction parallel to the display panel and away from the display area and through a side of the display panel.
12. A display screen, characterized in that it comprises a display module according to any one of claims 1 to 11.
13. An electronic device, comprising:
The display screen of claim 12;
the mainboard is located keeping away from of display module's display panel in the display screen one side of the apron of display screen, just the connection structure's of display screen second end with the mainboard electricity is connected.
CN202011569019.XA 2020-12-25 2020-12-25 Display module assembly, display screen and electronic equipment Pending CN114677908A (en)

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