CN114654379B - Grinding head and wafer grinding device with same - Google Patents
Grinding head and wafer grinding device with same Download PDFInfo
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- CN114654379B CN114654379B CN202210279801.0A CN202210279801A CN114654379B CN 114654379 B CN114654379 B CN 114654379B CN 202210279801 A CN202210279801 A CN 202210279801A CN 114654379 B CN114654379 B CN 114654379B
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- soft film
- chamber
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- film chamber
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention relates to the technical field of wafer grinding, in particular to a grinding head and a wafer grinding device with the same. A polishing head, comprising: the device comprises a body, wherein a first soft film cavity and a second soft film cavity are sequentially arranged in the body along a force application direction; the force application structure is arranged at the joint of the first soft film cavity and the second soft film cavity, extends to be close to the outer edge of the action surface of the second soft film cavity, and has a first state that the force is applied to the outer edge of the action surface of the second soft film cavity under the action of the gas pressure in the first soft film cavity so as to press the edge of the piece to be ground, and a second state that the gap is arranged between the first state and the outer edge of the action surface of the second soft film cavity when the first soft film cavity is not filled with gas. The invention provides a grinding head and a wafer grinding device with the same, which enable a wafer to be flatter, more uniform and more consistent after being ground.
Description
Technical Field
The invention relates to the technical field of wafer grinding, in particular to a grinding head and a wafer grinding device with the same.
Background
In the chip manufacturing process, a Chemical Mechanical Polishing (CMP) process is applied as an important planarization technique in the grinding process of a wafer, however, as the diameter size of the wafer increases and the critical feature size of the chip gradually decreases, the uniformity and consistency of the wafer surface are more and more difficult to process for high planarization of the chip. Meanwhile, in the wafer manufacturing process, the wafer is thickened continuously, and particularly, in the back-end metal and through hole manufacturing process, a Chemical Mechanical Polishing (CMP) process is used for grinding the wafer for many times so as to ensure high flatness of the surface of the wafer. If the polishing rate of the edge of the wafer is too slow or the material removal rate is too low during the polishing process, a large height difference exists between the edge and the center, which will affect the adjacent complete chips during the subsequent polishing process.
The existing wafer grinding technology is to perform pressure filling on a soft film chamber in a grinding head, wherein the size of the soft film chamber is similar to that of a wafer, and the pressure filling enables the interior of the soft film chamber to generate downward pressure so as to grind and polish the wafer on a polishing pad. The number of the soft film chambers in the polishing head in direct contact with the wafer is only one, and although the soft film chambers are designed in a partitioning manner in the prior art, pressure filling is performed in the soft film chambers to form different pressure areas, in the pressure filling process, compared with a circular interface, the downward pressure generated after pressure filling in the central area of the soft film mechanism is more uniform, and the closer to the edge of the soft film chamber, the softer the material property of the soft film chamber is, the edge part of the soft film chamber cannot directly contact with the edge area of the wafer, so that the pressure state of the edge area of the wafer is not uniform.
Disclosure of Invention
Therefore, the technical problem to be solved by the present invention is to overcome the defect in the prior art that the edge of the soft film chamber cannot directly contact the edge area of the wafer, so that the pressure state of the edge area of the wafer is not uniform, thereby providing a polishing head and a wafer polishing apparatus having the same, which enable the polished wafer to be flatter, more uniform and more consistent.
In order to solve the above technical problem, the present invention provides a polishing head, including:
the device comprises a body, wherein a first soft film cavity and a second soft film cavity are sequentially arranged in the body along a force application direction;
the force application structure is arranged at the joint of the first soft film cavity and the second soft film cavity, extends to be close to the outer edge of the action surface of the second soft film cavity, and has a first state that the force is applied to the outer edge of the action surface of the second soft film cavity under the action of the gas pressure in the first soft film cavity so as to press the edge of the piece to be ground, and a second state that the gap is arranged between the first state and the outer edge of the action surface of the second soft film cavity when the first soft film cavity is not filled with gas.
Optionally, the force application structure comprises a first supporting member arranged in the first soft membrane chamber, a pressurizing member arranged in the second soft membrane chamber, and a connecting assembly for connecting the first supporting member and the pressurizing member, wherein the pressurizing member can move in the second soft membrane chamber under the force so as to press the outer edge of the action surface of the second soft membrane chamber.
Optionally, the connecting assembly includes a fastener connected to the first supporting element and the pressurizing element, and a limiting element sleeved outside the fastener, and the limiting element is wrapped on the outer circumferential wall of the first soft film cavity to limit radial deformation of the first soft film cavity under the action of gas pressure.
Optionally, a second supporting member is sleeved on the outer peripheral wall of the second soft membrane chamber to limit radial deformation of the second soft membrane chamber under the action of gas pressure.
Optionally, the end of the pressure member near the active surface of the second film chamber is shaped as a flat surface.
Optionally, a first elastic sealing element is arranged between the first supporting element and the connecting assembly, and a second elastic sealing element is arranged between the connecting assembly and the pressurizing element.
Optionally, the first resilient seal is an annular boss structure.
Optionally, the difference in fill pressure within the first and second bladder chambers is less than or equal to 2psi.
Optionally, the filling pressure in the first soft film chamber is 3.5-6.5psi, and the filling pressure in the second soft film chamber is 1.5-4.5psi.
The invention also provides a wafer grinding device which comprises the grinding head.
The technical scheme of the invention has the following advantages:
1. the force application structure of the grinding head provided by the invention is arranged at the joint of the first soft film chamber and the second soft film chamber, extends to the outer edge close to the action surface of the second soft film chamber, and has a first state of applying force to the outer edge of the action surface of the second soft film chamber under the action of the gas pressure in the first soft film chamber so as to press the edge of a to-be-ground piece and a second state of being arranged at a clearance with the outer edge of the action surface of the second soft film chamber when the first soft film chamber is not filled with gas. When the workpiece to be ground is ground, the force application structure is matched with the second soft film cavity to press the edge of the workpiece to be ground, so that the bottom surface of the second soft film cavity is completely contacted with the workpiece to be ground, and the grinding is more uniform; and the down force generated by the hard force application structure is faster than the down force generated by vacuum pressure contact, has no hysteresis and high timeliness, so that the workpiece to be ground is flatter.
2. The force application structure of the grinding head provided by the invention comprises a first supporting piece arranged in a first soft membrane chamber, a pressurizing piece arranged in a second soft membrane chamber and a connecting assembly used for connecting the first supporting piece and the pressurizing piece, wherein the pressurizing piece can move in the second soft membrane chamber under the stress so as to press the outer edge of the action surface of the second soft membrane chamber. The first soft film chamber is connected with the second soft film chamber through the connecting assembly, and the pressing uniformity of the pressing piece is guaranteed.
3. The connecting component of the grinding head provided by the invention comprises a fastener which is simultaneously connected with the first supporting component and the pressurizing component and a limiting component which is sleeved outside the fastener, wherein the limiting component is coated on the peripheral wall of the first soft film cavity so as to limit the radial deformation of the first soft film cavity under the action of gas pressure. The effectual radial deformation that has restricted first mantle cavity of locating part for first mantle cavity produces invariable vertical deformation under the pressure effect, and vertical deformation produces even holding down force, and the effective transmission of rethread locating part adds the pressure member, has further improved the ageing of power transmission, realizes treating the effective pressing at grinding a marginal, guarantees the homogeneity of pressing.
4. According to the grinding head provided by the invention, the second supporting piece is sleeved on the outer peripheral wall of the second soft film chamber so as to limit the radial deformation of the second soft film chamber under the action of gas pressure. The second supporting piece effectively limits the radial deformation of the second soft film cavity, the second soft film cavity is forced to form longitudinal deformation, and the timeliness of force transmission is further improved, so that the bottom surface of the second soft film cavity is in contact with the back surface of the piece to be ground, and the flatness of the edge of the piece to be ground is improved.
5. In the polishing head provided by the invention, one end of the pressure piece, which is close to the action surface of the second film chamber, is formed into a plane. The planar setting has increased the working face area of contact of pressurization piece with the second mantle cavity for the produced holding down force of first mantle cavity longitudinal deformation transmits to on the pressurization piece, and the homodisperse is used in on treating the grinding piece, prevents to treat because of holding down the pressure concentration makes on a bit that to grind the piece and take place the damage.
6. According to the grinding head provided by the invention, the first elastic sealing element is arranged between the first supporting element and the connecting assembly, the second elastic sealing element is arranged between the connecting assembly and the pressurizing element, and the first elastic sealing element is of an annular boss structure. The connecting assembly is extruded through the annular boss, so that the sealing effect is improved; the problem that the structure of the soft membrane deviates from the center when the grinding head is used is solved by encircling the first soft membrane chamber, the air pressure of the first soft membrane chamber is stressed to apply force downwards along the vertical direction, and the movement is smooth; meanwhile, the tensile deformation of the first soft film cavity is reduced, the service life is prolonged, and the working stability is improved.
7. The polishing head provided by the invention has the advantage that the difference of the filling pressures in the first soft film chamber and the second soft film chamber is less than or equal to 2psi. The consistency of the process is improved by the small pressure difference, the pressurizing piece is prevented from excessively pressing the piece to be ground, the controllability of the edge pressure of the piece to be ground is improved, and the risk of air leakage when the soft membrane chamber is used is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic view of a polishing head;
fig. 2 is a schematic structural view of the sealing member.
Description of reference numerals:
1-a first soft membrane chamber; 2-a first support; 3-a fastener; 4-a second soft film chamber;
5-a pressing member; 6-a second support; 7-a third soft membrane chamber; 8-a third support;
9-a limiting member; 10-a retaining ring; 11-a housing; 12-a first resilient sealing member;
13-second resilient seal.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it is to be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in a specific case to those of ordinary skill in the art.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
A polishing head for polishing a wafer, as shown in figure 1, includes a body and a force applying structure.
A first soft film cavity 1, a second soft film cavity 4 and a third soft film cavity 7 are sequentially arranged in the body along the force application direction.
The force application structure is arranged at the joint of the first soft film cavity 1 and the second soft film cavity 4 and extends to the outer edge close to the action surface of the second soft film cavity 4, and concretely comprises a first supporting piece 2 arranged in the first soft film cavity 1, a pressurizing piece 5 arranged in the second soft film cavity 4 and a fastening piece 3 used for connecting the first supporting piece 2 and the pressurizing piece 5, wherein the fastening piece 3 is a screw, a limiting piece 9 is sleeved outside the fastening piece 3, the limiting piece 9 is of a T-shaped structure and is connected with the first supporting piece 2 and the pressurizing piece 5 through the screw, the T-shaped structure is horizontally arranged so that the included angle of the T-shaped structure is wrapped on the side wall of the lower end of the first soft film cavity 1, the pressurizing piece 5 comprises a supporting part with a groove body and a force application part arranged below the supporting part, the lower end of the screw is fastened in the groove body of the supporting part, and the inner ring part of the supporting part is contacted with the top of the third soft film cavity 7.
The force application structure has a first state in which the outer edge of the action surface of the second soft film chamber 4 is applied with a force under the action of the gas pressure in the first soft film chamber 1 to press the edge of the member to be ground, and a second state in which the outer edge of the action surface of the second soft film chamber 4 is set at a gap when the first soft film chamber 1 is not filled with gas. Specifically, when the first state is that the first soft film chamber 1 is inflated, the first soft film chamber 1 deforms to drive the first supporting member 2 to move downwards, the upper portion of the limiting member 9 limits radial deformation of the first soft film chamber 1, the first supporting member 2 is connected with the first soft film chamber 1, so that the first soft film chamber 1 generates constant longitudinal deformation, the downward pressure generated by the longitudinal deformation of the first soft film chamber 1 is transmitted to the pressurizing member 5 located in the second soft film chamber 4 through the limiting member 9, and the pressurizing member 5 moves in the second soft film chamber 4 under the stress to press the outer edge of the action surface of the second soft film chamber 4. In order to ensure that the edge of the piece to be ground is not excessively stressed, the end of the pressure piece 5 close to the active surface of the second film chamber 4 is shaped as a plane. In order to ensure that the action surface of the second soft film chamber 4 is completely contacted with a to-be-ground part, a second supporting piece 6 and a third supporting piece 8 are sleeved on the periphery of the second soft film chamber 4, the radial deformation of the second soft film chamber 4 is limited by the second supporting piece 6 and the third supporting piece 8, the radial deformation of the third soft film chamber 7 is further limited by the second supporting piece 6, the second soft film chamber 4 and the third soft film chamber 7 are forced to form longitudinal deformation, the action surface of the second soft film chamber 4 is contacted with the edge back of the to-be-ground part, the down force generated by the longitudinal deformation of the second soft film chamber 4 is transmitted to the third soft film chamber 7, the third soft film chamber 7 is stressed to press the center back of the to-be-ground part, and the to-be-ground part is a wafer; in the second state, when the first film chamber 1 is not filled with gas, a gap of 0.7-1mm is kept between the pressurizing member 5 and the second film chamber 4.
In order to ensure the overall sealing performance of the grinding head, as shown in fig. 2, a first elastic sealing element 12 is arranged between the first supporting element 2 and the limiting element 9, the first elastic sealing element 12 is in an annular boss structure, the annular boss achieves the effect of further enhancing sealing by extruding the limiting element 9, the boss is in a semicircular structure, and the number of turns of the annular boss is not less than 2; a second elastic sealing element 13 is also arranged between the limiting element 9 and the pressurizing element 5, and the second elastic sealing element 13 is an O-shaped sealing ring; an O-shaped sealing ring is also arranged between the fastening piece 3 and the first supporting piece 2, and the abutting part of the fastening piece 3 and the O-shaped sealing ring is a curved surface so as to limit the movement of the O-shaped sealing ring and further improve the sealing property.
In order to prevent the grinding piece from slipping off the grinding head, a retaining ring 10 is provided at the edge of the grinding head housing 11.
When the polishing head is used, filling different pressure gases into a film chamber which is in contact with a wafer, wherein the filling pressure in a first film chamber 1 is 3.5-6.5psi, the filling pressure in a second film chamber 4 is 1.5-4.5psi, the difference between the filling pressures in the first film chamber 1 and the second film chamber 4 is controlled to be less than or equal to 2psi, when the gas is filled into the first film chamber 1, the first film chamber 1 deforms, the radial deformation of the first film chamber 1 is limited by the upper portion of a limiting part 9, so that the first film chamber 1 generates constant longitudinal deformation, the downward force generated by the longitudinal deformation of the first film chamber 1 drives a first supporting part 2 to move downwards, the downward force generated by the longitudinal deformation of the first film chamber 1 is transmitted to a pressurizing part 5 because the first supporting part 2 is connected with the pressurizing part 5 through a fastening part 3, the downward force generated by the longitudinal deformation of the first film chamber 1 is transmitted to the pressurizing part 5, so that the pressurizing part 5 moves in the second film chamber 4, the bottom end of the pressurizing part 5 presses the outer edge of the action surface of the second film chamber, and the wafer contact with the outer edge of the wafer. Inject into gas in the second mantle chamber 4, second mantle chamber 4 produces deformation, because the cover is equipped with second support piece 6 on the periphery wall of second mantle chamber 4, second support piece 6 has restricted the radial deformation of second mantle chamber 4 under the gas pressure effect for second mantle chamber 4 produces vertical deformation, there is the effort because of 5 bottom ends of pressurization spare to second mantle chamber 4 working face, is favorable to second mantle chamber 4 working face to contact with the wafer back completely. Meanwhile, the downward force generated by the second soft film chamber 4 under the action of the gas is transmitted to the third soft film chamber 7, and the second support piece 6 limits the radial deformation of the third soft film chamber 7, so that the third soft film chamber 7 generates longitudinal deformation, and the action surface of the third soft film chamber 7 contacts with the center of the wafer.
Also provides a wafer grinding device which comprises the grinding head.
As an alternative embodiment, the force application structure is a pressing bar integrally formed and simultaneously penetrating through the first film chamber 1 and the second film chamber 4, and the lower end of the pressing bar is formed with a slope.
As an alternative embodiment, the limiting member 9 and the second supporting member 6 are both annular and are respectively sleeved on the outer peripheries of the first soft film chamber 1 and the second soft film chamber 4.
Alternatively, the annular boss may have other shapes such as an oblong shape.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (8)
1. A polishing head, comprising:
the device comprises a body, wherein a first soft film chamber (1) and a second soft film chamber (4) are sequentially arranged in the body along a force application direction;
the force application structure is arranged at the joint of the first soft film chamber (1) and the second soft film chamber (4), extends to be close to the outer edge of the action surface of the second soft film chamber (4), and has a first state of applying force to the outer edge of the action surface of the second soft film chamber (4) under the action of the gas pressure in the first soft film chamber (1) so as to press the edge of a member to be ground, and a second state of setting a gap with the outer edge of the action surface of the second soft film chamber (4) when the first soft film chamber (1) is not filled with gas;
the force application structure comprises a first supporting piece (2) arranged in the first soft membrane chamber (1), a pressurizing piece (5) arranged in the second soft membrane chamber (4) and a connecting assembly for connecting the first supporting piece (2) and the pressurizing piece (5), and the pressurizing piece (5) can move in the second soft membrane chamber (4) under the stress to press the outer edge of the action surface of the second soft membrane chamber (4); coupling assembling include simultaneously with fastener (3) and the cover that first support piece (2) and pressurization piece (5) are connected are established locating part (9) outside fastener (3), locating part (9) cladding is in on the periphery wall of first mantle cavity (1), in order to restrict radial deformation of first mantle cavity (1) under the gas pressure effect.
2. The grinding head according to claim 1, characterized in that said second soft membrane chamber (4) has a peripheral wall provided with a second support element (6) to limit the radial deformation of said second soft membrane chamber (4) under the action of the gas pressure.
3. The grinding head according to claim 1 or 2, characterized in that the pressure element (5) is shaped as a plane surface close to the active surface of the second film chamber (4).
4. Grinding head according to claim 1 or 2, characterized in that a first elastic sealing (12) is provided between the first support (2) and the connecting assembly, and a second elastic sealing (13) is provided between the connecting assembly and the pressure member (5).
5. The polishing head according to claim 4, wherein said first elastomeric seal (12) is an annular boss structure.
6. The polishing head according to claim 1 or 2, characterized in that the difference in filling pressure in the first and second soft membrane chambers (1, 4) is less than or equal to 2psi.
7. The polishing head according to claim 6, wherein the first membrane chamber (1) is filled with a pressure of 3.5-6.5psi and the second membrane chamber (4) is filled with a pressure of 1.5-4.5psi.
8. A wafer polishing apparatus comprising the polishing head of any one of claims 1-7.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210279801.0A CN114654379B (en) | 2022-03-21 | 2022-03-21 | Grinding head and wafer grinding device with same |
| TW111131284A TWI837778B (en) | 2022-03-21 | 2022-08-19 | Grinding head and wafer grinding device having the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210279801.0A CN114654379B (en) | 2022-03-21 | 2022-03-21 | Grinding head and wafer grinding device with same |
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| Publication Number | Publication Date |
|---|---|
| CN114654379A CN114654379A (en) | 2022-06-24 |
| CN114654379B true CN114654379B (en) | 2023-04-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210279801.0A Active CN114654379B (en) | 2022-03-21 | 2022-03-21 | Grinding head and wafer grinding device with same |
Country Status (2)
| Country | Link |
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| CN (1) | CN114654379B (en) |
| TW (1) | TWI837778B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116038552A (en) * | 2023-02-10 | 2023-05-02 | 北京晶亦精微科技股份有限公司 | Polishing head, substrate polishing device and polishing method |
| CN116372775B (en) * | 2023-03-01 | 2024-01-30 | 北京晶亦精微科技股份有限公司 | Polishing head and wafer polishing device with same |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW476691B (en) * | 1999-09-02 | 2002-02-21 | Mitsubishi Materials Corp | Polishing head, polishing apparatus using polishing head, and method for sensing polished surface state |
| JP3683149B2 (en) * | 2000-02-01 | 2005-08-17 | 株式会社東京精密 | Structure of polishing head of polishing apparatus |
| TW523443B (en) * | 2002-01-28 | 2003-03-11 | Mitsubishi Materials Corp | Polishing head, polishing device and polishing method |
| US7750657B2 (en) * | 2007-03-15 | 2010-07-06 | Applied Materials Inc. | Polishing head testing with movable pedestal |
| CN108145593A (en) * | 2017-12-28 | 2018-06-12 | 德淮半导体有限公司 | Wafer processing apparatus and its method of work |
-
2022
- 2022-03-21 CN CN202210279801.0A patent/CN114654379B/en active Active
- 2022-08-19 TW TW111131284A patent/TWI837778B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI837778B (en) | 2024-04-01 |
| TW202337632A (en) | 2023-10-01 |
| CN114654379A (en) | 2022-06-24 |
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