CN114624892A

CN114624892A - VR display device and head-mounted VR equipment

Info

Publication number: CN114624892A
Application number: CN202210392678.3A
Authority: CN
Inventors: 马海冰; 卞振峰
Original assignee: Qingdao Virtual Reality Research Institute Co ltd
Current assignee: Qingdao Virtual Reality Research Institute Co ltd
Priority date: 2022-04-14
Filing date: 2022-04-14
Publication date: 2022-06-14

Abstract

The invention discloses a VR display device and a head-mounted VR device, the VR display device includes: a housing provided with an accommodating cavity; a heat conducting member disposed adjacent to a sidewall of the housing; the mainboard is arranged in the accommodating cavity and is arranged at intervals with the heat conducting piece; the thermoelectric conversion piece is arranged in the accommodating cavity and connected between the heat conducting piece and the main board; and the electricity storage piece is arranged in the accommodating cavity and is electrically connected with the thermoelectric conversion piece. According to the technical scheme, the heat emitted by the main board can be fully and effectively utilized, and the main board can be rapidly cooled without additionally arranging a fan.

Description

VR display device and head-mounted VR equipment

Technical Field

The invention relates to the technical field of intelligent electronic equipment, in particular to a VR display device and head-mounted VR equipment.

Background

Virtual Reality technology (VR) also called Virtual environment, smart environment or artificial environment refers to a technology for generating a Virtual world that can directly apply visual, auditory and tactile feelings to participants and allow them to interactively observe and operate by using a computer. Currently, a head-mounted VR device (e.g., VR glasses) on the market generally seals the vision and hearing of a person to the outside, guides a user to generate a feeling of the user in a virtual environment, respectively displays images of left and right eyes by using left and right eye screens of a VR display device, and generates a stereoscopic impression in the mind after the human eyes acquire such information with differences.

Among the correlation technique, integrated a large amount of electronic components on the display device's of VR equipment the mainboard, when the operation of VR equipment, can produce a large amount of heats, this heat can't obtain effective utilization, causes the energy waste, still need set up special fan on the mainboard simultaneously and carry out cooling to the mainboard.

Disclosure of Invention

The invention mainly aims to provide a VR display device, aiming at fully and effectively utilizing heat emitted by a main board and realizing rapid cooling of the main board without additionally arranging a fan.

To achieve the above object, the present invention provides a VR display device including:

a housing provided with an accommodating cavity;

a heat conducting member disposed adjacent to a sidewall of the housing;

the mainboard is arranged in the accommodating cavity and is arranged at intervals with the heat conducting piece;

the thermoelectric conversion piece is arranged in the accommodating cavity and connected between the heat conducting piece and the main board; and

and the electricity storage piece is arranged in the accommodating cavity and is electrically connected with the thermoelectric conversion piece.

In one embodiment, the thermoelectric conversion element has a first connection end connected with the heat conducting element and a second connection end connected with the main board, and the first connection end and/or the second connection end are/is provided with heat conducting glue.

In one embodiment, the heat conducting member is disposed in the accommodating cavity and attached to a sidewall of the housing, and a through hole for communicating the accommodating cavity with the outside is disposed on the sidewall of the housing.

In one embodiment, the heat conducting member is embedded in the side wall of the housing, and the outer side surface of the heat conducting member is in contact with the outside.

In one embodiment, the electric storage element has a first electrode terminal electrically connected to one end of the thermoelectric conversion element through a first wire, and a second electrode terminal electrically connected to the other end of the thermoelectric conversion element through a second wire.

In one embodiment, the power storage member is a battery.

In one embodiment, the power storage part is electrically connected with a control circuit of the VR display device through a power transmission line, and the power storage part is used for supplying power to the control circuit.

In one embodiment, the transmission line is provided with a voltage stabilizer or a voltage booster.

In one embodiment, the thermoelectric conversion member includes a plurality of thermoelectric conversion units connected in series.

The invention also provides head-mounted VR equipment which comprises a head-mounted assembly and the VR display device connected with the head-mounted assembly.

According to the technical scheme, the heat conducting piece is arranged close to the side wall of the shell, and the thermoelectric conversion piece is connected between the heat conducting piece and the mainboard. The main board generates a large amount of heat during working, a large temperature gradient difference is generated between the main board and the heat conducting piece, the thermoelectric conversion piece converts the temperature gradient difference between the heat conducting piece and the main board into an electric potential difference by utilizing the Seebeck effect of thermoelectric materials, and the electric potential difference can be transmitted to the electricity storage piece for storage. The electric energy of electricity storage piece storage can be used to realize the recovery of the energy and recycle for the power supply of other electronic components, has prolonged the time of endurance of wear-type VR equipment. So for the heat that the mainboard gived off can obtain abundant effective utilization, just can realize the rapid cooling of mainboard under the condition that need not additionally to set up the fan.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a head-mounted VR device according to an embodiment of the present invention;

fig. 2 is a schematic cross-sectional view of the head-mounted VR device of fig. 1;

fig. 3 is a schematic cross-sectional view of the VR display of fig. 2.

The reference numbers indicate:

reference numerals	Name (R)	Reference numerals	Name (R)
				100	Wear-type VR equipment	15	Electricity storage part
10	VR display device	16	Heat-conducting glue
				11	Shell body	17	First conductive line
12	Heat conducting member	18	Second conductive line
				13	Main board	20	Binding band
14	Thermoelectric converter	30	Glasses legs

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture, and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, if the meaning of "and/or" and/or "appears throughout, the meaning includes three parallel schemes, for example," A and/or B "includes scheme A, or scheme B, or a scheme satisfying both schemes A and B. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

The invention provides a VR display device 10.

Referring to fig. 1 to 3, in an embodiment of the invention, the VR display device 10 includes a housing 11, a heat conducting member 12, a main board 13, a thermoelectric conversion element 14, and an electric storage element 15. Wherein, the shell 11 is provided with an accommodating cavity; the heat-conducting member 12 is disposed adjacent to a side wall of the housing 11; the main board 13 is arranged in the accommodating cavity and is spaced from the heat conducting piece 12; the thermoelectric conversion piece 14 is arranged in the accommodating cavity, and the thermoelectric conversion piece 14 is connected between the heat conducting piece 12 and the main board 13; the electricity storage part 15 is arranged in the accommodating cavity, and the electricity storage part 15 is electrically connected with the thermoelectric conversion part 14.

Specifically, as shown in fig. 1, the VR display device 10 can be used as a VR display of a head-mounted VR apparatus 100, and the VR display device 10 can be worn on the head of a user through a head-mounted assembly. Taking VR glasses as an example, VR glasses comprise a glasses main body, a binding band 20 and two temples 30; the two temples 30 are respectively attached to the left and right sides of the glasses main body, and the band 20 includes a rear side band connected between the two temples 30, and a top band connected between the glasses main body and the rear side band. Wherein, the glasses main body is VR display device 10, and bandage 20 and mirror leg 10 make up into the subassembly of wearing. A main board 13, a battery, a circuit, an optical lens, a microphone assembly, and the like are provided in a housing 11 of the VR display device 10. An acoustic external module is arranged in the temple 30.

The housing 11 of the VR display device 10 is generally made of a plastic material, and the heat conducting member 12 is made of a heat conducting material (e.g., copper, graphene, etc.) with good heat conducting property. The casing 11 is directly exposed to the external environment, and the heat conducting member 12 is arranged adjacent to the side wall of the casing 11, and the heat conducting member 12 has good heat conducting performance, so that the temperature of the heat conducting member 12 is close to the external environment temperature, and the overall temperature is low. Mainboard 13 sets up in the holding chamber of casing 11, and the integration has a large amount of electronic components on mainboard 13, can produce a large amount of heats when mainboard 13 moves for mainboard 13's temperature is higher. The thermoelectric conversion element 14 is made of a thermoelectric conversion material, which is a functional material capable of converting thermal energy and electric energy to each other, and the ideal characteristics of the thermoelectric material generally require low internal resistance to reduce the loss (heat generation) caused by internal current; a lower thermal conductivity (thermal conductivity) to reduce heat conduction from the high temperature end to the low temperature end; while having a high thermal electromotive force (open circuit). In order to ensure the thermoelectric conversion efficiency, the thermoelectric conversion element 14 is optionally made of a semiconductor material, such as lead telluride, silicon-germanium alloy, germanium telluride, bismuth telluride, and alloys, and the like, and the thermoelectric conversion efficiency of the thermoelectric conversion element 14 made of the semiconductor material can reach about 10%. The thermoelectric conversion element 14 is connected between the heat conducting element 12 and the main board 13, wherein the heat conducting element 12 can be used as the cold side of the thermoelectric conversion element 14 when the temperature is low, the main board 13 can be used as the hot side of the thermoelectric conversion element 14 when the temperature is high, and a temperature gradient difference is formed between the cold side and the hot side of the thermoelectric conversion element 14 and generates a potential difference through the seebeck effect of the thermoelectric conversion element 14. The Seebeck effect (Seebeck effect), also called the first thermoelectric effect, refers to a thermoelectric phenomenon in which a voltage difference between two substances is caused by a temperature difference between two different electrical conductors or semiconductors. The electric storage element 15 is electrically connected to the thermoelectric conversion element 14, which may be a wired electrical connection or a wireless (e.g., electromagnetic coil) electrical connection, the thermoelectric conversion element 14 converts the temperature gradient difference between the heat conduction element 12 and the main board 13 into an electric potential difference, and the electric potential difference is transmitted to the electric storage element 15 for storage.

The present invention is configured such that the heat conducting member 12 is disposed close to the side wall of the case 11, and the thermoelectric conversion member 14 is connected between the heat conducting member 12 and the main board 13. When the main board 13 works, a large amount of heat is generated, a large temperature gradient difference is generated between the main board 13 and the heat conducting member 12, the thermoelectric conversion member 14 converts the temperature gradient difference between the heat conducting member 12 and the main board 13 into an electric potential difference by utilizing the seebeck effect of the thermoelectric material, and the electric potential difference can be transmitted to the electric storage member 15 for storage. The electric energy stored by the electricity storage part 15 can be used for supplying power to other electronic components, and the energy is recycled. So for the heat that mainboard 13 gived off can obtain abundant effective utilization, just can realize mainboard 13's rapid cooling under the condition that need not additionally to set up the fan.

In order to ensure the efficiency of the heat conduction between the thermoelectric conversion element 14 and the heat conducting element 12 and the main board 13, in one embodiment, the thermoelectric conversion element 14 has a first connection end connected to the heat conducting element 12 and a second connection end connected to the main board 13, and the first connection end and/or the second connection end is/are provided with a heat conducting paste 16. Usually, the surface of the main board 13 generally has many pits, and the heat conducting glue 16 is disposed at the connection portion between the thermoelectric conversion element 14 and the main board 13, so that the pits can be filled with the heat conducting glue 16, the connection between the thermoelectric conversion element 14 and the main board 13 is more compact and reliable, and the heat conduction efficiency between the thermoelectric conversion element 14 and the main board 13 can be effectively improved. Similarly, the heat-conducting silica gel is disposed between the thermoelectric conversion element 14 and the heat-conducting element 12, so that the connection between the thermoelectric conversion element 14 and the heat-conducting element 12 is more compact and reliable, and the heat conduction efficiency between the thermoelectric conversion element and the heat-conducting element is effectively improved. The thermally conductive adhesive 16 may be specifically a thermally conductive silicone adhesive.

In order to generate a larger temperature gradient difference between the heat conducting member 12 and the main board 13 as much as possible to improve the thermoelectric conversion efficiency, in one embodiment, as shown in fig. 3, the heat conducting member 12 is disposed in the accommodating cavity and attached to a sidewall of the housing 11, and a through hole for communicating the accommodating cavity with the outside is disposed on the sidewall of the housing 11. Specifically, can buckle into the shape with the internal face profile looks adaptation of casing 11 with heat-conducting piece 12, in order to guarantee that heat-conducting piece 12 closely links to each other with the internal face of casing 11, set up the less through-hole in a plurality of apertures in the lateral wall of casing 11 and the corresponding position of heat-conducting piece 12 simultaneously, make the outside air contact with the surface of heat-conducting piece 12 via the through-hole, thereby make the temperature of heat-conducting piece 12 more be close to external environment temperature, thereby guarantee to have great temperature gradient difference between heat-conducting piece 12 (cold junction) and mainboard 13 (hot junction), thereby can effectively promote thermoelectric conversion efficiency, also can promote mainboard 13's cooling effect.

Of course, in other embodiments, the heat conducting member 12 may be embedded in the side wall of the housing 11, and the outer side surface of the heat conducting member 12 contacts with the outside. For example, the lateral wall of casing 11 is equipped with the opening with heat conduction 12 shape looks adaptation, the inside and outside both sides of casing 11 are run through respectively to the open-ended both ends, heat conduction 12 inlays and locates in the opening, the medial surface of heat conduction 12 is connected with thermoelectric conversion piece 14, the lateral surface of heat conduction 12 directly contacts with the outside air, make heat conduction 12 bigger with external area of contact, the temperature of heat conduction 12 more is close to external environment temperature, thereby further guarantee to have great temperature gradient difference between heat conduction 12 (cold junction) and mainboard 13 (hot junction), thereby can effectively promote thermoelectric conversion efficiency, also can promote mainboard 13's cooling effect. In other embodiments, the heat conducting member 12 may be directly formed on the side wall of the housing 11 as a part of the housing 11.

The thermoelectric conversion element 14 converts the thermal energy into electric energy, and then the electric energy can be transmitted to the electric storage element 15 in a wired or wireless manner for storage. As shown in fig. 3, in one embodiment, the electric storage element 15 has a first electrode terminal electrically connected to one end of the thermoelectric conversion element 14 through a first lead wire 17 and a second electrode terminal electrically connected to the other end of the thermoelectric conversion element 14 through a second lead wire 18. Specifically, the hot side of the thermoelectric conversion element 14 is connected to the first electrode side of the electric storage element 15 through the first wire 17, the cold side of the thermoelectric conversion element 14 is connected to the second electrode side of the electric storage element 15 through the second wire 18, and a potential difference is formed between the hot side and the cold side of the thermoelectric conversion element 14, thereby enabling charging of the electric storage element 15. The first and second

conductive wires

17 and 18 are preferably made of copper or aluminum, which has good electrical conductivity.

Further, the electric storage device 15 is a storage battery. For example, the power storage element 15 may be a rechargeable lithium battery. The battery may be an original battery of the VR display device 10 or may be a newly added backup battery. The heat generated by the operation of the main board 13 is converted into electric energy by the thermoelectric conversion element 14 and stored in the storage battery, so that enough electric energy is reserved for the use of the VR display device 10, and the cruising ability of the VR display device 10 can be effectively improved.

In one embodiment, the power storage device 15 is electrically connected to the control circuit of the VR display device 10 through a power transmission line, and the power storage device 15 is configured to supply power to the control circuit. The heat generated by the operation of the main board 13 is converted into electric energy by the thermoelectric conversion element 14 and stored in the electric storage element 15, and the electric storage element 15 can supply power to the control circuit of the VR display device 10 through the power transmission line, so that the cruising ability of the VR display device 10 can be effectively improved.

In order to ensure that the electricity storage 15 can stably supply power to the control circuit via the transmission line, the transmission line is provided with a voltage stabilizer. For example, when the supply voltage is low, the voltage can be increased by the voltage stabilizer, and when the supply voltage is high, the voltage can be decreased by the voltage stabilizer, so that the supply voltage is stable. In order to ensure that the supply can also take place in the case of low heat fluxes, the transmission line is provided with a booster.

On the basis of the above-mentioned embodiment, in order to further improve the thermoelectric conversion efficiency and ensure the cooling effect of the main board 13, the thermoelectric conversion element 14 includes a plurality of thermoelectric conversion units connected in series.

Referring to fig. 1 and fig. 2, the invention further provides a head-mounted VR device 100, where the head-mounted VR device 100 includes a head-mounted assembly and a VR display device 10 connected to the head-mounted assembly. The specific structure of the VR display device 10 refers to the above embodiments, and since the head-mounted VR equipment 100 adopts all technical solutions of all the above embodiments, at least all beneficial effects brought by the technical solutions of the above embodiments are achieved, and no further description is given here. Specifically, the VR display device 10 is worn on the head of the user by a head mount assembly. Taking VR glasses as an example, the VR glasses include a glasses main body (i.e., VR display device 10), a strap 20, and two temples 30 (forming a head-mounted assembly). The two temples 30 are respectively connected to the left and right sides of the glasses body, and acoustic external modules and the like are provided in the temples 30. To ensure wearing comfort and stability, the band 20 includes a rear side band connected between the two temples 30, and a top band connected between the main body of the glasses and the rear side band.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. A VR display device comprising:

a housing provided with an accommodating cavity;

a heat conducting member disposed adjacent to a sidewall of the housing;

2. The VR display device of claim 1, wherein the thermoelectric conversion element has a first connection end connected to the thermal conduction member and a second connection end connected to the main board, and the first connection end and/or the second connection end are provided with a thermal conductive paste.

3. The VR display device of claim 1, wherein the thermal conductor is disposed in the receiving cavity and attached to a sidewall of the casing, and the sidewall of the casing has a through hole for communicating the receiving cavity with the outside.

4. The VR display device of claim 1, wherein the thermal conductor is embedded in a sidewall of the housing, and an outer side of the thermal conductor contacts an outside.

5. The VR display device of claim 1, wherein the electric storage has a first electrode terminal and a second electrode terminal, the first electrode terminal is electrically connected to one terminal of the thermoelectric conversion element through a first wire, and the second electrode terminal is electrically connected to the other terminal of the thermoelectric conversion element through a second wire.

6. The VR display device of claim 5, wherein the electrical storage member is a battery.

7. The VR display of claim 1, wherein the power storage is electrically connected to a control circuit of the VR display via a power transmission line, and the power storage is configured to supply power to the control circuit.

8. The VR display of claim 7, wherein the power transmission line is provided with a voltage regulator or booster.

9. The VR display device of any one of claims 1 to 8, wherein the thermoelectric conversion element includes a plurality of thermoelectric conversion units connected in series.

10. A head-mounted VR device comprising a head-mounted assembly and the VR display of any one of claims 1 to 9 coupled to the head-mounted assembly.