CN114552976B - Full GaN gate drive circuit with high conversion rate - Google Patents
Full GaN gate drive circuit with high conversion rate Download PDFInfo
- Publication number
- CN114552976B CN114552976B CN202210203639.4A CN202210203639A CN114552976B CN 114552976 B CN114552976 B CN 114552976B CN 202210203639 A CN202210203639 A CN 202210203639A CN 114552976 B CN114552976 B CN 114552976B
- Authority
- CN
- China
- Prior art keywords
- gan
- tube
- source
- gan tube
- drain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000006243 chemical reaction Methods 0.000 title abstract description 6
- 239000003990 capacitor Substances 0.000 claims abstract description 85
- RDYMFSUJUZBWLH-UHFFFAOYSA-N endosulfan Chemical compound C12COS(=O)OCC2C2(Cl)C(Cl)=C(Cl)C1(Cl)C2(Cl)Cl RDYMFSUJUZBWLH-UHFFFAOYSA-N 0.000 claims 1
- 230000000630 rising effect Effects 0.000 abstract description 18
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 14
- 230000003068 static effect Effects 0.000 description 13
- 230000003071 parasitic effect Effects 0.000 description 6
- 238000004088 simulation Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000008186 active pharmaceutical agent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of DC power input into DC power output
- H02M3/02—Conversion of DC power input into DC power output without intermediate conversion into AC
- H02M3/04—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters
- H02M3/06—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using resistors or capacitors, e.g. potential divider
- H02M3/07—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode, e.g. charge pumps
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/08—Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
- H02M1/088—Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters for the simultaneous control of series or parallel connected semiconductor devices
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of DC power input into DC power output
- H02M3/02—Conversion of DC power input into DC power output without intermediate conversion into AC
- H02M3/04—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters
- H02M3/10—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M3/145—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
- H02M3/155—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
- H02M3/156—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
- H02M3/158—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/01—Modifications for accelerating switching
- H03K19/017—Modifications for accelerating switching in field-effect transistor circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B70/00—Technologies for an efficient end-user side electric power management and consumption
- Y02B70/10—Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Computing Systems (AREA)
- General Engineering & Computer Science (AREA)
- Mathematical Physics (AREA)
- Inverter Devices (AREA)
- Amplifiers (AREA)
Abstract
本发明属于电源管理技术领域,涉及集成电路设计技术,具体涉及一种具有高转换速率的全GaN栅驱动电路。本发明提出的全GaN栅驱动电路在传统全GaN自举反向器中加入交叉耦合电荷泵,实现了自举电容轨到轨的充电电压,在提升自举反向器输出上升速度的同时实现了输出上升速度和下降速度之间更高的匹配性。在驱动GaN功率管的传统两级结构自举反相器中加入电源提升模块将偏置级的输出电压提升为三倍电源电压,提高了GaN功率管的栅极上升速度,降低了栅极上升斜率和下降斜率的不匹配性,实现了高速高转换速率驱动。采用四级自举反向器级联的方式实现了GaN功率管开启延时和关断延时之间良好的匹配性。
The invention belongs to the technical field of power supply management and relates to integrated circuit design technology, in particular to an all-GaN gate drive circuit with high conversion rate. The all-GaN gate drive circuit proposed by the present invention adds a cross-coupled charge pump to the traditional all-GaN bootstrap inverter to realize the rail-to-rail charging voltage of the bootstrap capacitor, and realize A higher matching between the output rising speed and falling speed is achieved. Adding a power boost module to the traditional two-stage structure bootstrap inverter that drives GaN power transistors increases the output voltage of the bias stage to three times the power supply voltage, improves the gate rise speed of GaN power transistors, and reduces the gate rise The mismatch between slope and falling slope realizes high-speed and high-slew-rate driving. A good match between the turn-on delay and turn-off delay of the GaN power transistor is achieved by cascading four-stage bootstrap inverters.
Description
技术领域technical field
本发明属于电源管理技术领域,具体涉及一种具有高转换速率的全GaN栅驱动电路。The invention belongs to the technical field of power management, and in particular relates to an all-GaN gate drive circuit with high conversion rate.
背景技术Background technique
GaN功率器件相比于Si MOSFET功率器件具有更小的导通电阻和寄生电容。相比于Si MOSFET功率器件,将GaN功率器件应用在功率转换系统中可以实现更高的工作频率,更高的功率密度和更高的效率。因此,GaN功率器件被认为是提升功率转换系统性能的理想选择。在系统中应用时,增强型GaN器件相比于耗尽型GaN器件驱动方式更简单,无需产生额外负电压,在降低驱动复杂度的同时可以实现更少的功率消耗。因此,增强型GaN器件通常是功率转换系统应用中的优选。GaN power devices have smaller on-resistance and parasitic capacitance than Si MOSFET power devices. Compared with Si MOSFET power devices, the application of GaN power devices in power conversion systems can achieve higher operating frequency, higher power density and higher efficiency. Therefore, GaN power devices are considered ideal for improving the performance of power conversion systems. When applied in the system, the enhancement mode GaN device is simpler to drive than the depletion mode GaN device, without the need to generate additional negative voltage, and can achieve less power consumption while reducing the driving complexity. Therefore, enhancement mode GaN devices are usually the first choice in power conversion system applications.
目前,GaN功率器件及其驱动电路大多采用分立式结构或者SIP结构,即GaN栅驱动电路采用Si基集成,并且与GaN功率器件在PCB板上进行连接或者通过金线连接后再整体封装。PCB走线或者金线上的寄生电感存在于栅驱动回路中,当快速开关GaN器件时,栅驱动回路中较大的源极寄生串联电感会衰减GaN功率器件的开关速度,进而限制栅驱动的最大工作频率;栅极寄生串联电感在开启GaN功率器件过程中容易造成GaN功率器件栅极过冲,引起器件栅极过压,在关断GaN功率器件后容易造成器件误开启。传统分立式结构或SIP结构的栅驱动电路中通常采用栅极串联电阻或者可编程驱动电流抑制栅极过冲,但是随之会引起GaN功率器件开关损耗增加并且限制栅驱动的最大工作频率。因此,分立式结构或者SIP结构的GaN栅驱动电路的驱动回路中较大的寄生电感会限制驱动电路的工作频率并且引起GaN功率器件的可靠性问题。At present, GaN power devices and their driving circuits mostly adopt a discrete structure or a SIP structure, that is, GaN gate driving circuits are integrated on a Si basis, and are connected to GaN power devices on PCB boards or through gold wires before being packaged as a whole. The parasitic inductance of PCB traces or gold wires exists in the gate drive loop. When GaN devices are switched quickly, the large source parasitic series inductance in the gate drive loop will attenuate the switching speed of GaN power devices, thereby limiting the gate drive. Maximum operating frequency; the parasitic series inductance of the gate may easily cause the gate overshoot of the GaN power device during the process of turning on the GaN power device, causing overvoltage on the gate of the device, and it is easy to cause the device to be turned on by mistake after the GaN power device is turned off. In the gate drive circuit of the traditional discrete structure or SIP structure, gate series resistance or programmable drive current is usually used to suppress gate overshoot, but this will increase the switching loss of GaN power devices and limit the maximum operating frequency of the gate drive. Therefore, the large parasitic inductance in the drive loop of the GaN gate drive circuit with discrete structure or SIP structure will limit the operating frequency of the drive circuit and cause reliability problems of GaN power devices.
采用硅基GaN工艺将GaN功率器件和GaN栅驱动单片集成,栅驱动回路中的寄生电感可以缩小到接近零,GaN功率管栅极开关速度和栅极可靠性的折衷问题可以得到完美解决,实现高频和高可靠性的开关操作。目前由于p型GaN晶体管的迁移率远远小于n型GaN晶体管,硅基GaN集成电路中的有源器件仍然只采用n型GaN管。附图1所示为全GaN栅驱动集成电路中传统的两级结构自举反相器,其中的晶体管均为n型增强型GaN管。通过偏置级与驱动级级联,提高了输出上升速率。偏置级中通过电阻R减小了输出下拉时的静态功耗。但是,自举电容CT0和CT1两端的电压无法充电到电源电压VCC,存在一个阈值电压的损失,衰减了ET2和ET6的上拉能力。CT1通过ET9对ET6的栅源电容充电时,ET9工作在饱和区,导通电阻较大,当ET6的宽长比较大时,输出上升速率下降,输出上升速率和下降速率会出现严重不匹配。GaN power devices and GaN gate drivers are monolithically integrated using silicon-based GaN technology, the parasitic inductance in the gate drive loop can be reduced to close to zero, and the trade-off between the gate switching speed and gate reliability of GaN power transistors can be perfectly solved. Realize high frequency and high reliability switching operation. At present, because the mobility of p-type GaN transistors is much smaller than that of n-type GaN transistors, active devices in silicon-based GaN integrated circuits still only use n-type GaN transistors. Figure 1 shows a traditional two-stage structure bootstrap inverter in an all-GaN gate drive integrated circuit, in which the transistors are all n-type enhancement GaN transistors. By cascading the bias stage and the driver stage, the output rise rate is improved. The static power consumption when the output is pulled down is reduced by the resistor R in the bias stage. However, the voltage at both ends of the bootstrap capacitors C T0 and C T1 cannot be charged to the power supply voltage VCC, and there is a threshold voltage loss, which attenuates the pull-up capability of ET2 and ET6 . When C T1 charges the gate-source capacitance of E T6 through E T9 , E T9 works in the saturation region, and the on-resistance is relatively large. When the ratio of width and length of E T6 is large, the output rising rate decreases, and the output rising rate and falling rate will change. A serious mismatch has occurred.
发明内容Contents of the invention
本发明的目的:针对上述传统全GaN栅驱动中存在的问题,设计一种具有高转换速率的全GaN栅驱动电路,能够充分发挥GaN功率管的高频特性。其电路结构包括四级自举反向器,交叉耦合电荷泵,电源提升电路,偏置级和驱动级。The purpose of the present invention is to design an all-GaN gate drive circuit with a high slew rate for the above-mentioned problems existing in the traditional all-GaN gate drive, which can give full play to the high-frequency characteristics of the GaN power tube. Its circuit structure includes a four-stage bootstrap inverter, a cross-coupled charge pump, a power boost circuit, a bias stage and a driver stage.
本发明技术方案为:附图2所示为本发明的全GaN栅驱动的系统结构图。驱动链上采用四级自举反相器级联,实现高匹配性的开启和关断延时。第一级和第二级自举反相器之间,第三级和第四级自举反相器之间均采用交叉耦合电荷泵实现自举反相器中的自举电容的轨到轨的充电电压,进而提升自举反相器的输出上升速率。第三级自举反相器中采用偏置级和驱动级级联的方式,偏置级为驱动级提供两倍电源电压的偏置电压,提升自举反相器的输出上升速率。第四级自举反相器中在偏置级和驱动级级联的基础上,采用电源提升电路将偏置级的电源电压提升到栅驱动电源电压的两倍,进而为驱动级提供三倍电源电压的偏置电压,提升第四级自举反向器的输出上升速率The technical solution of the present invention is as follows: FIG. 2 is a structural diagram of the full GaN gate drive system of the present invention. Four-level bootstrap inverters are cascaded in the drive chain to achieve highly matched turn-on and turn-off delays. Between the first-stage and second-stage bootstrap inverters, and between the third-stage and fourth-stage bootstrap inverters, cross-coupled charge pumps are used to achieve rail-to-rail switching of the bootstrap capacitors in the bootstrap inverters. charging voltage, thereby increasing the output rise rate of the bootstrap inverter. In the third-stage bootstrap inverter, the bias stage and the driver stage are cascaded. The bias stage provides the driver stage with a bias voltage twice the power supply voltage to increase the output rise rate of the bootstrap inverter. In the fourth-stage bootstrap inverter, on the basis of cascading the bias stage and the driver stage, a power boost circuit is used to increase the power supply voltage of the bias stage to twice the gate drive power supply voltage, thereby providing three times the power supply voltage for the driver stage. The bias voltage of the power supply voltage increases the output rise rate of the fourth-stage bootstrap inverter
具体的,所述第一级自举反相器包括第一GaN管、第二GaN管、第三GaN管、第四GaN管、第五GaN管、第一电阻、第二电阻、第三电阻、第四电阻和第一电容,所述第二级自举反相器包括第六GaN管、第七GaN管、第八GaN管、第九GaN管、第十GaN管、第四电阻和第二电容;其中,第一GaN管和第二GaN管的栅极接PWM信号,第一GaN管的漏极通过第一电阻后接第四GaN管的源极,第一GaN管的源极接地,第二GaN管的漏极接第三 GaN管的源极,第二GaN管的源极接地;第三GaN管的漏极接电源,其栅极通过第一电阻后接第四GaN管的源极;第四GaN管的漏极接电源,其栅极接第九GaN管的源极;第四GaN 管的源极和第一电阻的连接点接第一电容的一端,第一电容的另一端接第三GaN管的源极和第二电阻的一端,第二电阻的另一端接电源;第五GaN管的漏极通过第三电阻后接PWM信号,其栅极接第二电阻的一端,其源极接地;第六GaN管的漏极通过第四电阻后接第十GaN 管的源极,第六GaN管的栅极接第二电阻的一端,其源极接地;第七GaN管的漏极接第八 GaN管的源极,第七GaN管的栅极接第二电阻的一端,其源极接地;第八GaN管的漏极接电源,其栅极通过第四电阻后接第十GaN管的源极;第九GaN管的漏极接电源,其栅极接第四GaN管的源极,第九GaN管的源极接第十GaN管的源极和第二电容的一端,第二电容的另一端接第八GaN管的源极;第十GaN管的漏极接电源,其栅极与漏极互连;第八GaN 管的源极为第二级自举反相器的输出端;其中第四GaN管、第八GaN管、第一电容和第二电容构成第一级自举反相器与第二级自举反相器之间的交叉耦合电荷泵;Specifically, the first-stage bootstrap inverter includes a first GaN transistor, a second GaN transistor, a third GaN transistor, a fourth GaN transistor, a fifth GaN transistor, a first resistor, a second resistor, and a third resistor , a fourth resistor and a first capacitor, and the second-stage bootstrap inverter includes a sixth GaN transistor, a seventh GaN transistor, an eighth GaN transistor, a ninth GaN transistor, a tenth GaN transistor, a fourth resistor and a sixth GaN transistor. Two capacitors; wherein, the gates of the first GaN tube and the second GaN tube are connected to the PWM signal, the drain of the first GaN tube is connected to the source of the fourth GaN tube through the first resistor, and the source of the first GaN tube is grounded , the drain of the second GaN tube is connected to the source of the third GaN tube, and the source of the second GaN tube is grounded; the drain of the third GaN tube is connected to the power supply, and its gate is connected to the fourth GaN tube through the first resistor source; the drain of the fourth GaN tube is connected to the power supply, and its gate is connected to the source of the ninth GaN tube; the connection point between the source of the fourth GaN tube and the first resistor is connected to one end of the first capacitor, and the connection point of the first capacitor is The other end is connected to the source of the third GaN tube and one end of the second resistor, and the other end of the second resistor is connected to the power supply; the drain of the fifth GaN tube is connected to the PWM signal after passing through the third resistor, and its gate is connected to the second resistor One end, its source is grounded; the drain of the sixth GaN tube is connected to the source of the tenth GaN tube through the fourth resistor, the gate of the sixth GaN tube is connected to one end of the second resistor, and its source is grounded; the seventh GaN tube The drain of the tube is connected to the source of the eighth GaN tube, the gate of the seventh GaN tube is connected to one end of the second resistor, and the source is grounded; the drain of the eighth GaN tube is connected to the power supply, and the gate of the eighth GaN tube is connected to the fourth resistor. Connect the source of the tenth GaN tube; the drain of the ninth GaN tube is connected to the power supply, the gate is connected to the source of the fourth GaN tube, the source of the ninth GaN tube is connected to the source of the tenth GaN tube and the second capacitor One end of the second capacitor, the other end of the second capacitor is connected to the source of the eighth GaN tube; the drain of the tenth GaN tube is connected to the power supply, and its gate and drain are interconnected; the source of the eighth GaN tube is the second stage bootstrap inverter The output terminal of the phase device; wherein the fourth GaN transistor, the eighth GaN transistor, the first capacitor and the second capacitor constitute a cross-coupled charge pump between the first-stage bootstrap inverter and the second-stage bootstrap inverter;
所述第三级自举反相器包括第十一GaN管、第十二GaN管、第十三GaN管、第十四GaN管、第十五GaN管、第十六GaN管、第十七GaN管、第十八GaN管、第十九GaN管、第五电阻、第六电阻、第七电阻、第三电容和第四电容,第十一GaN管、第十二GaN管、第十三GaN管、第十四GaN管、第三电容和第五电阻构成偏置级,第十五GaN管、第十六GaN 管、第十七GaN管、第十八GaN管、第十九GaN管、第六电阻、第七电阻和第四电容构成驱动级;所述第四级自举反相器包括第二十GaN管、第二十一GaN管、第二十二GaN管、第二十三GaN管、第二十四GaN管、第二十五GaN管、第二十六GaN管、第二十七GaN 管、第二十八GaN管、第二十九GaN管、第三十GaN管、第三十一GaN管、第三十二GaN 管、第三十三GaN管、第三十四GaN管、第三十五GaN管、第三十六GaN管、第三十七 GaN管、第三十八GaN管、第三十九GaN管、第八电阻、第九电阻、第十电阻、第十一电阻、第五电容、第六电容、第七电容和第八电容,第二十GaN管、第二十一GaN管、第二十二GaN管、第二十三GaN管、第二十四GaN管、第二十五GaN管、第二十六GaN管、第二十七GaN管、第二十八GaN管、第二十九GaN管、第五电容、第六电容、第八电阻构成电源提升,第三十GaN管、第三十一GaN管、第三十二GaN管、第三十三GaN管、第三十四GaN管、第九电阻、第七电容构成偏置级,第三十五GaN管、第三十六GaN管、第三十七GaN管、第三十八GaN管、第三十九GaN管、第八电容和第十一电阻构成驱动级;其中,The third-level bootstrap inverter includes an eleventh GaN transistor, a twelfth GaN transistor, a thirteenth GaN transistor, a fourteenth GaN transistor, a fifteenth GaN transistor, a sixteenth GaN transistor, a seventeenth GaN transistor GaN tube, eighteenth GaN tube, nineteenth GaN tube, fifth resistor, sixth resistor, seventh resistor, third capacitor, and fourth capacitor, eleventh GaN tube, twelfth GaN tube, thirteenth GaN tube The GaN tube, the fourteenth GaN tube, the third capacitor and the fifth resistor form a bias stage, the fifteenth GaN tube, the sixteenth GaN tube, the seventeenth GaN tube, the eighteenth GaN tube, and the nineteenth GaN tube , the sixth resistor, the seventh resistor and the fourth capacitor constitute the driving stage; the fourth-stage bootstrap inverter includes a twenty-first GaN tube, a twenty-first GaN tube, a twenty-second GaN tube, a twenty-second GaN tube, and a twenty-second GaN tube. Three GaN tubes, twenty-fourth GaN tubes, twenty-fifth GaN tubes, twenty-sixth GaN tubes, twenty-seventh GaN tubes, twenty-eighth GaN tubes, twenty-ninth GaN tubes, and thirty GaN tubes tube, thirty-first GaN tube, thirty-second GaN tube, thirty-third GaN tube, thirty-fourth GaN tube, thirty-fifth GaN tube, thirty-sixth GaN tube, thirty-seventh GaN tube , the thirty-eighth GaN tube, the thirty-ninth GaN tube, the eighth resistor, the ninth resistor, the tenth resistor, the eleventh resistor, the fifth capacitor, the sixth capacitor, the seventh capacitor and the eighth capacitor, the second Ten GaN tubes, twenty-first GaN tubes, twenty-second GaN tubes, twenty-third GaN tubes, twenty-fourth GaN tubes, twenty-fifth GaN tubes, twenty-sixth GaN tubes, twenty-seventh GaN tubes The GaN tube, the twenty-eighth GaN tube, the twenty-ninth GaN tube, the fifth capacitor, the sixth capacitor, and the eighth resistor form a power booster, the thirty-first GaN tube, the thirty-first GaN tube, and the thirty-second GaN tube tube, the thirty-third GaN tube, the thirty-fourth GaN tube, the ninth resistor, and the seventh capacitor form a bias stage, the thirty-fifth GaN tube, the thirty-sixth GaN tube, the thirty-seventh GaN tube, the The thirty-eighth GaN tube, the thirty-ninth GaN tube, the eighth capacitor, and the eleventh resistor constitute the driving stage; wherein,
第十一GaN管的漏极通过第五电阻后接第十四GaN管的源极,第十一GaN管的栅极接第八GaN管的源极,第十一GaN管的源极接地;第十二GaN管的漏极接第十三GaN管的源极,第十二GaN管的栅极接第八GaN管的源极,第十二GaN管的源极接地;第十三GaN管的漏极接电源,其栅极通过第五电阻后接第十四GaN管的源极;第十四GaN管的漏极接电源,其源极和第五电阻的连接点接第三电容的一端,第三电容的另一端接第十三GaN管的源极;第十五GaN管的漏极接第十九GaN管的源极,第十五GaN管的栅极接第十三GaN管的源极,第十五GaN管的源极接地;第十六GaN管的漏极接第十七GaN管的源极,第十六GaN 管的栅极接第十三GaN管的源极,第十六GaN管的源极接地;第十七GaN管的漏极接电源,其栅极接第十九GaN管的源极;第十八GaN管的漏极接电源,其栅极接第二十三GaN管的源极,第十八GaN管的源极接第十九GaN管的漏极和第四电容的一端,第四电容的另一端接第十七GaN管的源极;第十九GaN管的漏极和源极之间还连接有第六电阻;第十七GaN 管的源极接第七电阻的一端,第七电阻的另一端接电源;The drain of the eleventh GaN tube is connected to the source of the fourteenth GaN tube through the fifth resistor, the gate of the eleventh GaN tube is connected to the source of the eighth GaN tube, and the source of the eleventh GaN tube is grounded; The drain of the twelfth GaN tube is connected to the source of the thirteenth GaN tube, the gate of the twelfth GaN tube is connected to the source of the eighth GaN tube, and the source of the twelfth GaN tube is grounded; the thirteenth GaN tube The drain of the GaN tube is connected to the power supply, and the grid is connected to the source of the fourteenth GaN tube through the fifth resistor; the drain of the fourteenth GaN tube is connected to the power supply, and the connection point between the source and the fifth resistor is connected to the third capacitor One end, the other end of the third capacitor is connected to the source of the thirteenth GaN tube; the drain of the fifteenth GaN tube is connected to the source of the nineteenth GaN tube, and the gate of the fifteenth GaN tube is connected to the thirteenth GaN tube The source of the fifteenth GaN tube is grounded; the drain of the sixteenth GaN tube is connected to the source of the seventeenth GaN tube, the gate of the sixteenth GaN tube is connected to the source of the thirteenth GaN tube, The source of the sixteenth GaN tube is grounded; the drain of the seventeenth GaN tube is connected to the power supply, and the gate is connected to the source of the nineteenth GaN tube; the drain of the eighteenth GaN tube is connected to the power supply, and the gate is connected to the first GaN tube. The source of the twenty-third GaN tube, the source of the eighteenth GaN tube is connected to the drain of the nineteenth GaN tube and one end of the fourth capacitor, and the other end of the fourth capacitor is connected to the source of the seventeenth GaN tube; A sixth resistor is connected between the drain and source of the nineteenth GaN tube; the source of the seventeenth GaN tube is connected to one end of the seventh resistor, and the other end of the seventh resistor is connected to a power supply;
第二十GaN管的漏极通过第八电阻后接第二十四GaN管的源极,第二十GaN管的栅极接第七电阻的一端,其源极接地;第二十一GaN管的漏极接第二十二GaN管的源极,第二十一GaN管的栅极接第七电阻的一端,其源极接地;第二十二GaN管的漏极接电源,其栅极通过第八电阻接第二十四GaN管的源极;第二十三GaN管的漏极接电源,其栅极接第十八GaN管的源极,第二十三GaN管的源极接第二十四GaN管的源极和第五电容的一端,第五电容的另一端接第二十二GaN管的源极;第二十四GaN管的漏极接电源,其栅极和漏极互连;第二十五GaN管的漏极、栅极和源极均接电源;第二十六GaN管的漏极和源极接电源,其栅极接第十八GaN管的源极;第二十七GaN管的栅极和源极接电源,其漏极接第二十八GaN管的漏极;第二十八GaN管的源极接电源,其栅极接第十八GaN管的源极;第六电容的一端接电源,另一端接第二十二GaN管的源极;第二十九GaN管的漏极通过第九电阻后接第二十八GaN管的漏极、第七电容的一端、第三十二GaN管的栅极、第三十三GaN 管的栅极,第二十九GaN管的栅极接第七电阻的一端,其源极接地;第三十GaN管的漏极接第三十三GaN管的源极,第三十GaN管的栅极接第七电阻的一端,其源极接地;第三十一GaN管的漏极接第三十二GaN管的源极,第三十一GaN管的栅极接第七电阻的一端,其源极接地;第三十二GaN管的漏极接电源,其漏极和源极之间具有第十电阻;第七电容的另一端接第三十三GaN管的源极,第三十三GaN管的漏极接电源;第三十四GaN管的漏极接第三十九GaN管的源极,第三十四GaN管的栅极接第七电阻的一端,其源极接地;第三十五GaN管的漏极接第三十六GaN管的源极,第三十五GaN管的栅极通过第十一电阻后接第七电阻的一端,其源极接地;第三十六GaN管的漏极接电源,其栅极接第三十九GaN管的源极;第三十七GaN管的漏极接电源,其栅极接第十八GaN管的源极,第三十七GaN管的漏极接第三十八GaN管的源极和第八电容的一端;第八电容的另一端接第三十六GaN管的源极;第三十八GaN管的漏极接电源,其栅极和漏极互连;第三十九GaN管的漏极接第三十八GaN管的源极,第三十九GaN管的栅极接第三十二GaN管的源极;第三十六GaN管的漏极为输出端,连接GaN功率管的栅极。The drain of the twentieth GaN tube is connected to the source of the twenty-fourth GaN tube through the eighth resistor, the gate of the twenty-first GaN tube is connected to one end of the seventh resistor, and the source is grounded; the twenty-first GaN tube The drain of the twenty-second GaN tube is connected to the source of the twenty-second GaN tube, the gate of the twenty-first GaN tube is connected to one end of the seventh resistor, and the source is grounded; the drain of the twenty-second GaN tube is connected to the power supply, and the gate Connect the source of the twenty-fourth GaN tube through the eighth resistor; the drain of the twenty-third GaN tube is connected to the power supply, the grid is connected to the source of the eighteenth GaN tube, and the source of the twenty-third GaN tube is connected to The source of the twenty-fourth GaN tube and one end of the fifth capacitor, the other end of the fifth capacitor is connected to the source of the twenty-second GaN tube; the drain of the twenty-fourth GaN tube is connected to the power supply, and its grid and drain The drain, gate and source of the twenty-fifth GaN tube are all connected to the power supply; the drain and source of the twenty-sixth GaN tube are connected to the power supply, and the gate is connected to the source of the eighteenth GaN tube ; The grid and source of the twenty-seventh GaN tube are connected to the power supply, and the drain is connected to the drain of the twenty-eighth GaN tube; the source of the twenty-eighth GaN tube is connected to the power supply, and its grid is connected to the eighteenth GaN tube. The source of the tube; one end of the sixth capacitor is connected to the power supply, and the other end is connected to the source of the twenty-second GaN tube; the drain of the twenty-ninth GaN tube is connected to the drain of the twenty-eighth GaN tube through the ninth resistor , one end of the seventh capacitor, the grid of the thirty-second GaN tube, the grid of the thirty-third GaN tube, the grid of the twenty-ninth GaN tube is connected to one end of the seventh resistor, and its source is grounded; the third The drain of the tenth GaN tube is connected to the source of the thirty-third GaN tube, the gate of the thirty-third GaN tube is connected to one end of the seventh resistor, and the source is grounded; the drain of the thirty-first GaN tube is connected to the thirty-first GaN tube. The source of the second GaN tube, the gate of the thirty-first GaN tube is connected to one end of the seventh resistor, and the source is grounded; the drain of the thirty-second GaN tube is connected to the power supply, and the drain and the source are connected to the first end of the resistor. Ten resistors; the other end of the seventh capacitor is connected to the source of the thirty-third GaN tube, the drain of the thirty-third GaN tube is connected to the power supply; the drain of the thirty-fourth GaN tube is connected to the source of the thirty-ninth GaN tube pole, the gate of the thirty-fourth GaN tube is connected to one end of the seventh resistor, and its source is grounded; the drain of the thirty-fifth GaN tube is connected to the source of the thirty-sixth GaN tube, and the source of the thirty-fifth GaN tube The gate is connected to one end of the seventh resistor after passing through the eleventh resistor, and its source is grounded; the drain of the thirty-sixth GaN tube is connected to the power supply, and its gate is connected to the source of the thirty-ninth GaN tube; the thirty-seventh GaN tube is connected to the source; The drain of the GaN tube is connected to the power supply, the grid is connected to the source of the eighteenth GaN tube, the drain of the thirty-seventh GaN tube is connected to the source of the thirty-eighth GaN tube and one end of the eighth capacitor; the eighth capacitor The other end of the tube is connected to the source of the thirty-sixth GaN tube; the drain of the thirty-eighth GaN tube is connected to the power supply, and its gate and drain are interconnected; the drain of the thirty-ninth GaN tube is connected to the thirty-eighth GaN tube The source of the tube, the grid of the thirty-ninth GaN tube is connected to the source of the thirty-second GaN tube; the drain of the thirty-sixth GaN tube is the output terminal, connected to the grid of the GaN power tube.
本发明的有益效果为:采用交叉耦合电荷泵实现了传统自举反向器中自举电容的轨到轨充电电压,在提升自举反向器输出上升速度的同时实现了输出上升速度和下降速度之间更高的匹配性。在驱动GaN功率管的传统两级结构自举反相器中加入电源提升模块将偏置级的输出电压提升为三倍电源电压,提高了驱动级的输出电压上升速度,减小了GaN功率管栅极上升斜率和下降斜率的不匹配性,同时减小了驱动链延时,有利于实现GaN功率管更短的导通时间。采用四级自举反向器级联,提高了GaN功率管开启延时和关断延时之间的匹配性。The beneficial effects of the present invention are as follows: the cross-coupled charge pump is used to realize the rail-to-rail charging voltage of the bootstrap capacitor in the traditional bootstrap inverter, and the output rising speed and falling speed are realized while increasing the output rising speed of the bootstrap inverter Higher matching between speeds. Adding a power boost module to the traditional two-stage structure bootstrap inverter driving GaN power transistors increases the output voltage of the bias stage to three times the power supply voltage, increases the output voltage rise speed of the driver stage, and reduces the GaN power transistor The mismatch between the rising slope and falling slope of the gate reduces the delay of the drive chain, which is conducive to realizing a shorter turn-on time of the GaN power transistor. The four-level bootstrap inverter cascade is used to improve the matching between the turn-on delay and turn-off delay of the GaN power tube.
附图说明Description of drawings
图1全GaN栅驱动集成电路中传统的两级结构自举反相器示意图。Fig. 1 Schematic diagram of a traditional two-stage structure bootstrap inverter in an all-GaN gate drive integrated circuit.
图2本发明提出的一种高转换速率全GaN栅驱动系统框图。FIG. 2 is a block diagram of a high-slew-rate all-GaN gate drive system proposed by the present invention.
图3本发明提出的一种高转换速率全GaN栅驱动电路结构图。FIG. 3 is a structure diagram of a high-slew-rate all-GaN gate drive circuit proposed by the present invention.
图4为本发明提出的一种高转换速率全GaN栅驱动开启GaN功率管时的工作原理图Fig. 4 is a working principle diagram when the GaN power tube is turned on by a high-slew-rate full-GaN gate driver proposed by the present invention
图5为本发明提出的一种高转换速率全GaN栅驱动关断GaN功率管时的工作原理图。FIG. 5 is a working principle diagram of a high-slew-rate all-GaN gate drive proposed by the present invention when the GaN power transistor is turned off.
图6为本发明提出的一种高转换速率全GaN栅驱动开关GaN功率管时的仿真图,其中 (a)为传输延时仿真示意图,(b)为GaN功率管栅源电压的仿真示意图。6 is a simulation diagram of a high-slew-rate full GaN gate-driven switching GaN power tube proposed by the present invention, wherein (a) is a simulation diagram of transmission delay, and (b) is a simulation diagram of GaN power transistor gate-source voltage.
具体实施方式Detailed ways
下面结合附图对本发明的工作原理进行详细的说明。The working principle of the present invention will be described in detail below in conjunction with the accompanying drawings.
附图3显示了本发明提出的一种高转换速率全GaN栅驱动电路的电路结构图,该电路中的晶体管均采用增强型GaN晶体管,其中GaN功率管为高压管,其余GaN管为低压管。Accompanying drawing 3 has shown the circuit structure diagram of a kind of high slew rate all-GaN gate drive circuit proposed by the present invention, the transistors in this circuit all adopt enhancement mode GaN transistor, wherein GaN power tube is high-voltage tube, and other GaN tubes are low-voltage tube .
第一级与第二级自举反相器中,GaN管E4、E9和电容C1、C2组成第一级与第二级自举反相器之间的交叉耦合电荷泵。第一级自举反相器由GaN管E1、E2、E3、E4、E5,电阻R1、 R2、R3和电容C2构成;E2为自举反向器输出下拉管,E3为自举反向器输出上拉管,E1用于关断E3,减小静态功耗;R1确定C1两端的充电电压并且决定静态功耗;R2、R3和E5为第一级输入和第二级输入提供初始化状态,PWM信号为高时,E5关断,不消耗额外静态功耗。第二级自举反相器由GaN管E6、E7、E8、E9、E10,电阻R4和电容C2构成;E7为自举反向器输出下拉管,E8为自举反向器输出上拉管,E6用于关断E8,减小静态功耗;R4确定C2两端的充电电压并且决定静态功耗;E10为C2提供初始化状态,使C2两端初始电压高于低压GaN 管阈值电压。In the first-stage and second-stage bootstrap inverters, GaN transistors E 4 , E 9 and capacitors C 1 , C 2 form a cross-coupled charge pump between the first-stage and second-stage bootstrap inverters. The first-stage bootstrap inverter is composed of GaN tubes E 1 , E 2 , E 3 , E 4 , E 5 , resistors R 1 , R 2 , R 3 and capacitor C 2 ; E 2 is the output of the bootstrap inverter Pull-down tube, E 3 is the bootstrap inverter output pull-up tube, E 1 is used to turn off E 3 to reduce static power consumption; R 1 determines the charging voltage at both ends of C 1 and determines the static power consumption; R 2 , R 3 and E5 provide the initialization state for the first-level input and the second-level input. When the PWM signal is high, E5 is turned off without consuming additional static power consumption. The second-stage bootstrap inverter is composed of GaN tubes E 6 , E 7 , E 8 , E 9 , E 10 , resistor R 4 and capacitor C 2 ; E 7 is the output pull-down tube of the bootstrap inverter, and E 8 is The bootstrap inverter outputs a pull-up tube, E 6 is used to turn off E 8 to reduce static power consumption; R 4 determines the charging voltage at both ends of C 2 and determines the static power consumption; E 10 provides initialization status for C 2 , so that The initial voltage across C 2 is higher than the threshold voltage of the low-voltage GaN tube.
第三级与第四级自举反相器中,GaN管E14、E18、E23、E26、E27、E37和电容C3、C4、C5、 C6、C7、C8组成第三级与第四级自举反相器之间的交叉耦合电荷泵。第三级自举反相器中,偏置级由GaN管E20、E21、E22、E23,电阻R5和电容C4构成,驱动级由GaN管E24、E25、 E26、E27、E28,电阻R6和电容C5构成;其中E21、E25为偏置级和驱动级中的自举反相器输出下拉管,E22和E26为偏置级和驱动级中的自举反相器输出上拉管,E20和E24用于关断E22、 E26和E28,减小静态功耗;电阻R5和R6确定C4和C5两端的充电电压并且决定静态功耗,电阻R7为初始化电阻;E19用于加速C4对E17栅源电容的充电速度,提高第三级自举反向器的输出上升速度。第四级自举反相器中,电源提升模块由GaN管E20、E21、E22、E23、E24、E25、E26、E27、E28,电阻R8和电容C5、C6构成;其中E21和E22分别为为电源提升模块中的自举反相器的输出下拉管和输出上拉管,E20用于关断E22,减小静态功耗;电阻R8确定C5两端的充电电压并且决定静态功耗;E24,E25,E28分别为C5、C6、C7提供初始化状态,使C5、 C6和C7两端电压高于低压GaN管阈值电压;偏置级由GaN管E29、E30、E31、E32、E33,电阻R9、R10和电容C7组成,其中E30为偏置级自举反向器输出下拉管,E31为偏置级自举反向器输出上拉管,E29用于关断E31和E33,E32用于关断后级充电管E39,减小静态功耗;电阻 R9、R10确定C7两端的充电电压并且决定静态功耗;驱动级由GaN管E34、E35、E36、E37、E38、E39,电阻R11和电容C8组成;其中E35为驱动级自举反相器输出下拉管,E36为驱动级自举反相器输出上拉管,E34用于关断E36,实现驱动级零静态功耗;采用工作在线性区的GaN 管E39代替电阻,提高驱动级输出上升速率;E38为C8提供初始化状态,使C8两端电压高于低压GaN管阈值电压;R11在开启和关断E35和E36之间产生死区时间,避免E35和E36同时导通。In the third and fourth stage bootstrap inverters, GaN transistors E 14 , E 18 , E 23 , E 26 , E 27 , E 37 and capacitors C 3 , C 4 , C 5 , C 6 , C 7 , C 8 forms the cross-coupled charge pump between the third and fourth stage bootstrap inverters. In the third-stage bootstrap inverter, the bias stage is composed of GaN transistors E 20 , E 21 , E 22 , E 23 , resistor R 5 and capacitor C 4 , and the driver stage is composed of GaN transistors E 24 , E 25 , and E 26 , E 27 , E 28 , resistor R 6 and capacitor C 5 ; where E 21 , E 25 are the bootstrap inverter output pull-down tubes in the bias stage and the driver stage, and E 22 and E 26 are the bias stage and The bootstrap inverter output pull-up tube in the driver stage, E 20 and E 24 are used to turn off E 22 , E 26 and E 28 to reduce static power consumption; resistors R 5 and R 6 determine C 4 and C 5 The charging voltage at both ends determines the static power consumption. Resistor R 7 is the initialization resistor; E 19 is used to accelerate the charging speed of C 4 to the gate-source capacitance of E 17 , and increase the output rising speed of the third-stage bootstrap inverter. In the fourth-stage bootstrap inverter, the power boosting module consists of GaN tubes E 20 , E 21 , E 22 , E 23 , E 24 , E 25 , E 26 , E 27 , E 28 , resistor R 8 and capacitor C 5 , C 6 ; E 21 and E 22 are the output pull-down tube and output pull-up tube of the bootstrap inverter in the power boost module respectively, and E 20 is used to turn off E 22 to reduce static power consumption; the resistor R 8 determines the charging voltage at both ends of C 5 and determines the static power consumption; E 24 , E 25 , and E 28 provide initialization states for C 5 , C 6 , and C 7 respectively, so that the voltages at both ends of C 5 , C 6 , and C 7 are high The threshold voltage of the low-voltage GaN tube; the bias stage is composed of GaN tubes E 29 , E 30 , E 31 , E 32 , E 33 , resistors R 9 , R 10 and capacitor C 7 , where E 30 is the bootstrap inverter of the bias stage Inverter output pull-down tube, E 31 is the bias stage bootstrap inverter output pull-up tube, E 29 is used to turn off E 31 and E 33 , E 32 is used to turn off the subsequent charging tube E 39 , reducing the static Power consumption; resistors R 9 and R 10 determine the charging voltage across C 7 and determine static power consumption; the driver stage consists of GaN tubes E 34 , E 35 , E 36 , E 37 , E 38 , E 39 , resistor R 11 and capacitor Composed of C 8 ; where E 35 is the output pull-down tube of the driver stage bootstrap inverter, E 36 is the output pull-up tube of the driver stage bootstrap inverter, and E 34 is used to turn off E 36 to realize zero static power consumption of the driver stage ; Use the GaN tube E 39 working in the linear region to replace the resistor to increase the output rise rate of the driver stage; E 38 provides an initialization state for C 8 , so that the voltage at both ends of C 8 is higher than the threshold voltage of the low-voltage GaN tube; R 11 is turned on and off A dead time is generated between E35 and E36 to prevent E35 and E36 from being turned on at the same time.
电路的具体工作原理如附图4,附图5所示。The specific working principle of the circuit is shown in accompanying drawing 4 and accompanying drawing 5.
附图4为本发明提出的一种高转换速率全GaN栅驱动开启GaN功率管时的工作原理图。在自举电容C1N、C3N和C4N还未被充电的情况下,当PWM信号为逻辑低时,栅漏短接的GaN管E10N、E24N、E28N和E38N分别将自举电容C2N、C5N、C6N和C8N两端电压充电到VCC-VTH,栅源短接的GaN管E25N将C7N两端电压充电到VCC-VTH(VTH为低压GaN管的阈值电压),实现C2N、C5N、C6N、C7N和C8N两端电压的初始化。当PWM从逻辑低翻转为逻辑高时,第一级自举反向器输出VO1N被E2N快速拉低为GND;第二级自举反向器中,因为自举电容C2N上存在初始化电压VCC-VTH,输出VO2N被E8N拉高到VCC。通过第一级和第二级自举反向器之间的交叉耦合电荷泵,E4N的栅极电位上升到2VCC-VTH,E4N工作在深线性区,当R1N远大于E4N的导通电阻时,C1N两端电压被E4N充电到VCC。第三级自举反相器输出VO3N被E16N快速拉低到GND。第四级自举反相器中,C5N、C6N、C7N和C8N上存在初始化电压VCC-VTH,电源提升模块中自举反相器输出VO41N被E22N上拉到VCC。通过第三级和第四级自举反向器之间的交叉耦合电荷泵,E14N和E18N的栅极电位上升到2VCC-VTH,E14N和E18N工作在深线性区,当R5N和R6N远大于E14N和E18N的导通电阻时,C3N和C4N两端电压分别被E14N和E18N充电到VCC。通过自举电容C6N,第四级自举反向器的偏置级的电源轨升高为2VCC-VTH。偏置级中的自举反相器输出VO42N被E31N上拉到2VCC-VTH,C7N上极板电位为3VCC-2VTH。通过R9N驱动E33N,E33N和R10N并联驱动E39N,E39N的栅极电压最终上升到3VCC-2VTH。E39N开启后一直工作在线性区,导通电阻较小,C8N通过工作在线性区的E39N驱动E36N,可以快速开启E36N,提高GaN功率管栅端VGN的上升速度。Accompanying drawing 4 is the working principle diagram when a GaN power tube is turned on by a high-slew-rate all-GaN gate driver proposed by the present invention. In the case that the bootstrap capacitors C 1N , C 3N and C 4N have not been charged, when the PWM signal is logic low, the GaN transistors E 10N , E 24N , E 28N and E 38N with the gate-to-drain short circuit will bootstrap The voltage across capacitors C 2N , C 5N , C 6N and C 8N is charged to VCC-V TH , and the gate-to-source GaN tube E 25N charges the voltage across C 7N to VCC-V TH (V TH is a low-voltage GaN tube The threshold voltage of C 2N , C 5N , C 6N , C 7N and C 8N are initialized. When the PWM flips from logic low to logic high, the output V O1N of the first-stage bootstrap inverter is quickly pulled down to GND by E 2N ; in the second-stage bootstrap inverter, because there is initialization on the bootstrap capacitor C 2N Voltage VCC-V TH , the output V O2N is pulled up to VCC by E 8N . Through the cross-coupled charge pump between the first-stage and second-stage bootstrap inverters, the gate potential of E 4N rises to 2VCC-V TH , and E 4N works in the deep linear region. When R 1N is much larger than that of E 4N When turning on the resistance, the voltage across C 1N is charged to VCC by E 4N . The third-stage bootstrap inverter output V O3N is quickly pulled down to GND by E 16N . In the fourth-stage bootstrap inverter, there is an initialization voltage VCC-V TH on C 5N , C 6N , C 7N and C 8N , and the output V O41N of the bootstrap inverter in the power boost module is pulled up to VCC by E 22N . Through the cross-coupled charge pump between the third-stage and fourth-stage bootstrap inverters, the gate potential of E 14N and E 18N rises to 2VCC-V TH , E 14N and E 18N work in the deep linear region, when R When 5N and R 6N are much larger than the on-resistance of E 14N and E 18N , the voltages across C 3N and C 4N are charged to VCC by E 14N and E 18N respectively. Through the bootstrap capacitor C 6N , the power rail of the bias stage of the fourth-stage bootstrap inverter is raised to 2VCC-V TH . The bootstrap inverter output V O42N in the bias stage is pulled up to 2VCC-V TH by E 31N , and the upper plate potential of C 7N is 3VCC-2V TH . E 33N is driven by R 9N , and E 39N is driven by E 33N and R 10N in parallel, and the gate voltage of E 39N finally rises to 3VCC-2V TH . After E 39N is turned on, it has been working in the linear region, and the on-resistance is small. C 8N drives E 36N through E 39N working in the linear region, which can quickly turn on E 36N and increase the rising speed of V GN at the gate terminal of the GaN power tube.
在自举电容C1N、C3N和C4N两端电压已经被充电到VCC的情况下,当PWM信号为逻辑低时,通过第一级与第二级自举反相器和第三级与第四级自举反相器之间的交叉耦合电荷泵,C2N、C5N、C6N、C7N和C8N两端电压分别被工作在线性区的E9N、E23N、E27N、E26N和E37N充电到VCC,此时栅驱动中所有的自举电容两端的电压均为VCC,不存在阈值电压的损失。当PWM从逻辑低翻转为逻辑高时,VO1N可以被E2N快速拉低到GND,VO2N可以被E8N快速拉高到VDD,VO3N可以被E16N快速拉低到GND。第四级自举反相器中,电源提升模块将偏置级的电源轨提升为2VCC,偏置级将E39N的栅极电压最终提升到3VCC。通过从R9N经E33N到E39N逐级驱动的方式以及对E39N栅极电位的提升,大幅提升了E39N对E36N的驱动能力,减小了从VO3N下降到VGN上升的延时。在E36N的宽长比远高于E17N的情况下,可以保证VGN和VO3N的上升速度接近,提高栅驱动上升沿传输延时和下降沿传输延时之间的匹配性。When the voltage across the bootstrap capacitors C 1N , C 3N and C 4N has been charged to VCC, when the PWM signal is logic low, the first and second bootstrap inverters and the third and third The cross-coupled charge pump between the fourth-stage bootstrap inverters, the voltages at both ends of C 2N , C 5N , C 6N , C 7N and C 8N are respectively operated in the linear region of E 9N , E 23N , E 27N , E 26N and E 37N are charged to VCC. At this time, the voltage across all bootstrap capacitors in the gate drive is VCC, and there is no loss of threshold voltage. When PWM turns from logic low to logic high, V O1N can be quickly pulled down to GND by E 2N , V O2N can be quickly pulled up to VDD by E 8N , and V O3N can be quickly pulled down to GND by E 16N . In the fourth-stage bootstrap inverter, the power boost module boosts the power rail of the bias stage to 2VCC, and the bias stage boosts the gate voltage of the E 39N to 3VCC. Through step-by-step driving from R 9N through E 33N to E 39N and increasing the gate potential of E 39N , the driving ability of E 39N to E 36N is greatly improved, and the delay from V O3N falling to V GN rising hour. In the case that the aspect ratio of E 36N is much higher than that of E 17N , it can ensure that the rising speed of V GN and V O3N is close, and improve the matching between the rising edge transmission delay and the falling edge transmission delay of the gate drive.
附图5为本发明提出的一种高转换速率全GaN栅驱动关断GaN功率管时的工作原理图。当PWM信号为逻辑高时,通过交叉耦合电荷泵,C1F、C3F和C4F被充电到VCC。当PWM 从逻辑高翻转为逻辑低时,VO1F被E3F快速拉高到VDD,VO2F被E7F快速拉低到GND,工作在深线性区的E9F将C2F两端电压充电到VCC,E10F关断。第三级自举反向器的偏置级通过驱动E19F,可以快速开启E17F,提高VO3F的上升速度,VO3F最终被E17F上拉到VCC。在第四级自举反相器中,E23F、E26F、E27F和E37F工作在深线性区,E24F、E25F、E28F和E38F关断,C5F、 C6F、C7F和C8F两端的电压被充电到VCC,偏置级电源电压为VCC。E35F可以快速关断GaN 功率管。E25F和E26F采用漏端对C7F充电,避免C7F上极板电位自举到3VCC时低压GaN器件栅氧击穿的风险。Accompanying drawing 5 is a working principle diagram of a high-slew-rate all-GaN gate driver of the present invention when the GaN power tube is turned off. When the PWM signal is logic high, C 1F , C 3F and C 4F are charged to VCC through the cross-coupled charge pump. When PWM flips from logic high to logic low, V O1F is quickly pulled up to VDD by E 3F , V O2F is quickly pulled down to GND by E 7F , and E 9F working in the deep linear region charges the voltage across C 2F to VCC , E 10F off. The bias stage of the third-stage bootstrap inverter drives E 19F to quickly turn on E 17F to increase the rising speed of V O3F , and V O3F is finally pulled up to VCC by E 17F . In the fourth-stage bootstrap inverter, E 23F , E 26F , E 27F and E 37F work in the deep linear region, E 24F , E 25F , E 28F and E 38F are turned off, and C 5F , C 6F , C 7F The voltage across 8F and C is charged to VCC, the bias stage supply voltage is VCC. E 35F can turn off GaN power tube quickly. E 25F and E 26F use the drain to charge C 7F to avoid the risk of gate oxide breakdown of low-voltage GaN devices when the upper plate potential of C 7F is bootstrapped to 3VCC.
附图6(a)为本发明提出的全GaN栅驱动电路的传输延时的仿真结果图。从PWM输入上升50%到GaN功率管栅端(VGS)上升50%的延时为12.9ns,从PWM输入下降50%到GaN 功率管栅端下降50%的延时为14.1ns。开启和关断GaN功率管栅端的延时差为1.2ns。从PWM 输入上升50%到GaN功率管漏端电压(VDS)下降至90%的开启延时为13.8ns,从PWM输入下降50%到GaN功率管漏端电压上升至10%的关断延时为13.6ns。开启和关断GaN功率管漏端的延时差为0.2ns。本发明提出的全GaN栅驱动电路具有低驱动延时和良好的延迟匹配性。Figure 6(a) is a simulation result diagram of the transmission delay of the all-GaN gate drive circuit proposed by the present invention. The delay from PWM input rising 50% to GaN power transistor gate (V GS ) rising 50% is 12.9ns, and the delay from PWM input falling 50% to GaN power transistor gate falling 50% is 14.1ns. The delay difference between turning on and off the gate terminal of the GaN power transistor is 1.2ns. The turn-on delay from PWM input rising 50% to GaN power transistor drain voltage (V DS ) falling to 90% is 13.8ns, and the turn-off delay from PWM input falling 50% to GaN power transistor drain voltage rising to 10% The time is 13.6ns. The delay difference between turning on and off the drain of the GaN power transistor is 0.2ns. The all-GaN gate drive circuit proposed by the present invention has low driving delay and good delay matching.
附图6(b)为本发明提出的全GaN栅驱动电路中GaN功率管栅源电压的仿真结果图。GaN功率管栅极电压从10%上升到90%的时间为2.2ns,栅极电压从90%下降到10%的时间为2.3ns。GaN功率管栅端具有高的开启和关断速度,并且栅端上升斜率和下降斜率具有良好的匹配性。Accompanying drawing 6 (b) is the simulation result diagram of the GaN power tube gate-source voltage in the all-GaN gate drive circuit proposed by the present invention. The time for the gate voltage of the GaN power tube to rise from 10% to 90% is 2.2ns, and the time for the gate voltage to drop from 90% to 10% is 2.3ns. The GaN power transistor gate has high turn-on and turn-off speeds, and the rising slope and falling slope of the gate have good matching.
综上所述,本发明提出的全GaN栅驱动电路在传统全GaN自举反向器中加入交叉耦合电荷泵,实现了自举电容轨到轨的充电电压,提高了自举反相器的输出上升速度,同时提高了自举反相器输出上升斜率和下降斜率的匹配性。在驱动GaN功率管栅端的传统两级结构自举反相器中加入电源提升模块将偏置级的输出电压提升为三倍电源电压,提高了GaN功率管的栅极上升速度,降低了栅极上升斜率和下降斜率的不匹配性,实现了高速高转换速率驱动。采用偶数级(四级)自举反向器级联的方式实现了GaN功率管开启延时和关断延时之间良好的匹配性。In summary, the all-GaN gate drive circuit proposed by the present invention adds a cross-coupled charge pump to the traditional all-GaN bootstrap inverter, which realizes the charging voltage of the bootstrap capacitor rail-to-rail and improves the bootstrap inverter. The output rise speed is improved, and the matching of the bootstrap inverter output rise slope and fall slope is improved at the same time. A power boost module is added to the traditional two-stage structure bootstrap inverter that drives the gate terminal of GaN power transistors to increase the output voltage of the bias stage to three times the power supply voltage, which improves the gate rise speed of GaN power transistors and reduces the gate voltage. The mismatch between rising slope and falling slope realizes high-speed and high-slew-rate driving. The even-numbered (four-stage) bootstrap inverter cascading method achieves good matching between the turn-on delay and turn-off delay of the GaN power transistor.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210203639.4A CN114552976B (en) | 2022-03-02 | 2022-03-02 | Full GaN gate drive circuit with high conversion rate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210203639.4A CN114552976B (en) | 2022-03-02 | 2022-03-02 | Full GaN gate drive circuit with high conversion rate |
Publications (2)
Publication Number | Publication Date |
---|---|
CN114552976A CN114552976A (en) | 2022-05-27 |
CN114552976B true CN114552976B (en) | 2023-05-26 |
Family
ID=81661334
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202210203639.4A Active CN114552976B (en) | 2022-03-02 | 2022-03-02 | Full GaN gate drive circuit with high conversion rate |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN114552976B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115426600B (en) * | 2022-07-29 | 2025-03-11 | 荣成歌尔微电子有限公司 | Microphone bias circuits, microphones and electronics |
TWI857447B (en) * | 2022-12-30 | 2024-10-01 | 瑞昱半導體股份有限公司 | Charging/discharging control circuit |
CN118677218B (en) * | 2024-06-05 | 2025-01-24 | 重庆邮电大学 | High noise immunity, low latency level shift circuit for GaN half-bridge driver IC |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104022776A (en) * | 2014-06-27 | 2014-09-03 | 东南大学 | Bootstrapping diode artificial circuit in half-bridge driving circuit |
CN109905111A (en) * | 2019-03-06 | 2019-06-18 | 电子科技大学 | Level-shift circuit for GaN high-speed gate driver circuits |
CN109951178A (en) * | 2019-04-03 | 2019-06-28 | 电子科技大学 | A system protection method for GaN gate drive circuit |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6486602B2 (en) * | 2014-03-28 | 2019-03-20 | ラピスセミコンダクタ株式会社 | Boost circuit, semiconductor device, and control method of boost circuit |
CN106712497B (en) * | 2016-12-30 | 2019-10-11 | 中国科学院上海高等研究院 | A Cross-Coupled Charge Pump |
US10715137B2 (en) * | 2017-10-23 | 2020-07-14 | Taiwan Semiconductor Manufacturing Company Limited | Generating high dynamic voltage boost |
CN108809061B (en) * | 2018-06-15 | 2019-12-27 | 电子科技大学 | Switch MOS bootstrap charging circuit suitable for high-speed GaN power device grid drive |
CN109039029B (en) * | 2018-08-15 | 2020-02-04 | 电子科技大学 | Bootstrap charging circuit suitable for GaN power device gate drive circuit |
US10367506B1 (en) * | 2018-12-07 | 2019-07-30 | Sony Corporation | Digital circuit based on a modified tristate circuit |
CN111509973B (en) * | 2020-05-15 | 2022-04-19 | 中南民族大学 | Charge pump capable of reducing output voltage ripple |
CN113541453B (en) * | 2021-07-05 | 2023-02-03 | 无锡安趋电子有限公司 | High-side bootstrap power supply control system in GaN power tube half-bridge drive |
-
2022
- 2022-03-02 CN CN202210203639.4A patent/CN114552976B/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104022776A (en) * | 2014-06-27 | 2014-09-03 | 东南大学 | Bootstrapping diode artificial circuit in half-bridge driving circuit |
CN109905111A (en) * | 2019-03-06 | 2019-06-18 | 电子科技大学 | Level-shift circuit for GaN high-speed gate driver circuits |
CN109951178A (en) * | 2019-04-03 | 2019-06-28 | 电子科技大学 | A system protection method for GaN gate drive circuit |
Also Published As
Publication number | Publication date |
---|---|
CN114552976A (en) | 2022-05-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN114552976B (en) | Full GaN gate drive circuit with high conversion rate | |
CN101561687B (en) | Synchronous booster circuit with active negative current modulation and control method thereof | |
CN108768145B (en) | High-speed half-bridge gate driver circuit for GaN power switching devices | |
CN102497145B (en) | H-bridge driving circuit | |
CN101345475B (en) | Charge pump drive circuit | |
CN101895281B (en) | Novel MOS tube drive circuit for switch power supply | |
CN108155903A (en) | High speed and high pressure level shifting circuit applied to GaN gate drivings | |
CN105187047B (en) | A kind of extra-high voltage level displacement circuit for IGBT driving chips | |
JPWO2014171190A1 (en) | Level shift circuit | |
EP2104979A2 (en) | Power amplifier | |
CN110943722B (en) | Driving circuit | |
CN111555595A (en) | A GaN power transistor gate driver circuit with controllable turn-on rate | |
CN106452076B (en) | Voltage control method, three segment drivers and driving circuit | |
CN102307001A (en) | High-voltage gate driving circuit module with resistance to interference of common mode power noises | |
CN116961412A (en) | Charge pump structure | |
CN113179095B (en) | Output stage circuit based on gallium nitride process integrated circuit and cascade application thereof | |
WO2016003823A1 (en) | Glitch suppression in an amplifier | |
CN206099773U (en) | Three sectional drive ware and drive circuit | |
CN112713890B (en) | Driver inverter circuit | |
CN107579728A (en) | Driving Circuit of Power Field Effect Transistor Using Charge Pump | |
US11552558B2 (en) | Series-parallel charge pump with NMOS devices | |
CN118868913B (en) | Level shifters, half-bridge converter circuits and electronics | |
CN118100882B (en) | Driving circuit of normally-open depletion type switching device | |
CN118920858B (en) | A built-in high-side charge pump circuit | |
CN211481134U (en) | Capacity expansion circuit |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |