CN114535827B - Motion control method and motion control system for laser head and laser processing machine - Google Patents
Motion control method and motion control system for laser head and laser processing machine Download PDFInfo
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- CN114535827B CN114535827B CN202210143072.6A CN202210143072A CN114535827B CN 114535827 B CN114535827 B CN 114535827B CN 202210143072 A CN202210143072 A CN 202210143072A CN 114535827 B CN114535827 B CN 114535827B
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- 230000005540 biological transmission Effects 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 description 8
- 238000004891 communication Methods 0.000 description 4
- 238000003698 laser cutting Methods 0.000 description 4
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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Abstract
The invention relates to a motion control method and a motion control system of a laser head and a laser processing machine, wherein the motion control method comprises the following steps: the controller obtains the target following height, the processing path and the actual vertical distance between the laser head and the processed workpiece; determining a motion control amount of the laser head according to the actual vertical distance, the target following height and the processing path; the controller controls the laser head to perform vertical movement, horizontal movement and rotational movement based on the movement control amount. The same controller realizes the joint control of vertical movement, horizontal movement and rotary movement, and improves the control efficiency and accuracy.
Description
Technical Field
The present application relates generally to the field of electrical control. More particularly, the present application relates to a motion control method of a laser head, a motion control system, and a laser processing machine.
Background
In laser cutting, the maximum power at the cut needs to be ensured to ensure the cutting quality, and the cut plates/pipes are usually not horizontal, and have the conditions of cambered surface, deformation and the like. Therefore, the laser focus position needs to be ensured in real time in the cutting process, namely the distance between the cutting head and the plate is kept constant. In the conventional cutting head height adjustment method, an independent height adjuster is used for controlling the upper shaft and the lower shaft so as to ensure the height of the cutting head, and other shafts are controlled by a motion control card or a numerical control system so as to control the cutting path.
In the method, two systems are separated to control different shafts of the same machine tool, so that the control right conflict problem exists; the operator needs to control two control interfaces to operate at the same time, so that the operation is complicated and inconvenient; because of the separation of the system, the system has limited expansibility and universality, and can not exchange data with the cutting system in real time, so that the application of some advanced functions is limited; the traditional height adjuster cannot be used as an interpolation shaft, and a fixed height mode cannot be used, so that the traditional height adjuster cannot be applied to a precise workpiece; in addition, in the pipe cutting process, the vertical change is large, and the problem that the traditional method is easy to cause frequent plate collision due to untimely following is solved; the traditional pulse type servo is used, wiring is complicated, and AD transmission speed signals are generally used for servo execution, so that the servo is easy to interfere.
Disclosure of Invention
The application provides a motion control method, a motion control system and a laser processing machine of a laser head, which are used for solving the problem that the vertical control and the horizontal control of the existing laser head are mutually separated and cannot be jointly planned and controlled.
In order to solve the technical problems, the invention provides a motion control method of a laser head, comprising the following steps: the controller obtains the target following height, the processing path and the actual vertical distance between the laser head and the processed workpiece; the controller determines the motion control amount of the laser head according to the actual vertical distance, the target following height and the processing path; the controller controls the laser head to perform vertical movement, horizontal movement and rotary movement based on the movement control amount.
In one embodiment, the controller determines the motion control amount of the laser head according to the actual vertical distance, the target following height, and the processing path, including: performing speed planning based on the processing path to determine the current speed of the laser head, and calculating the following deviation of the actual vertical distance and the target following height; if the following deviation is smaller than or equal to a threshold value, determining the motion control amount according to the following deviation and the current speed of the laser head; and if the following deviation is larger than a threshold value, performing speed planning according to the following deviation so as to determine the motion control quantity.
In one embodiment, the controller obtains an actual vertical distance of the laser head from a workpiece to be processed, comprising: the controller acquires an actual capacitance signal between the laser head and the processed workpiece through a sensor; and obtaining the actual vertical distance according to the distance capacitance calibration function relation and the actual capacitance signal.
In one embodiment, the motion control method further comprises: controlling the laser head to move to different calibration vertical distances so as to acquire calibration capacitance signals corresponding to the calibration vertical distances; and fitting the calibrated vertical distance and the calibrated capacitance signal to obtain the distance capacitance calibration function relation.
In one embodiment, the controller obtaining, via a sensor, an actual capacitance signal between the laser head and the workpiece to be processed comprises: the controller detects an actual capacitance signal via a sensor and obtains the actual capacitance signal using bus transmissions between the sensor and the controller.
In order to solve the above technical problems, the present invention provides a motion control system of a laser head, including: the controller is used for acquiring the target following height and the processing path of the processed workpiece and the actual vertical distance between the laser head and the processed workpiece; determining a motion control amount of the laser head according to the actual vertical distance, the target following height and the processing path; and controlling the laser head to perform vertical movement, horizontal movement and rotary movement based on the movement control quantity.
In one embodiment, the motion control system further comprises: the sensor is connected with the controller and used for detecting an actual capacitance signal between the laser head and the processed workpiece; the controller is used for obtaining the actual vertical distance according to the distance capacitance calibration function relation and the actual capacitance signal.
In one embodiment, the controller and the sensor are connected by a bus.
In one embodiment, the motion control system further comprises: the transmitter is connected between the sensor and the controller and comprises an FPGA collector, a filter and an EtherCAT bus slave module; the controller comprises an EtherCAT bus main module; and the driver is connected with the controller and used for receiving the motion control quantity of the controller so as to drive the laser head to vertically move.
In order to solve the technical problems, the invention provides a laser processing machine, which comprises a laser head and the motion control system.
Different from the prior art, in the motion control method, a controller acquires the target following height and the processing path of a processed workpiece and the actual vertical distance between the laser head and the processed workpiece, and determines the motion control quantity of the laser head according to the actual vertical distance, the target following height and the processing path; and simultaneously controlling the laser head to perform vertical movement, horizontal movement and rotary movement based on the movement control quantity. Therefore, the vertical movement, the horizontal movement and the rotary movement of the laser head are simultaneously controlled and realized by one controller, thereby being convenient for the integral movement control planning and improving the efficiency and the accuracy of the movement control.
Drawings
The above, as well as additional purposes, features, and advantages of exemplary embodiments of the present disclosure will become readily apparent from the following detailed description when read in conjunction with the accompanying drawings. Several embodiments of the present disclosure are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which like reference numerals refer to similar or corresponding parts and in which:
fig. 1 is a flow chart of a method of motion control of a laser head according to an embodiment of the application;
Fig. 2 is another flow chart of a method of motion control of a laser head according to an embodiment of the application;
FIG. 3 is a schematic flow chart of obtaining calibration function relationships in a motion control method of a laser head according to an embodiment of the application;
fig. 4 is a schematic diagram of a motion control system of the laser head according to an embodiment of the present application;
fig. 5 is a schematic view of a structure of a laser processing machine according to an embodiment of the present application.
Detailed Description
The following description of the technical solutions in the embodiments of the present disclosure will be made clearly and completely with reference to the accompanying drawings in the embodiments of the present disclosure, and it is apparent that the described embodiments are some embodiments of the present disclosure, but not all embodiments. Based on the embodiments in this disclosure, all other embodiments that a person skilled in the art would obtain without making any inventive effort are within the scope of protection of this disclosure.
Specific embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.
Referring to fig. 1, fig. 1 is a flow chart of a motion control method of a laser head according to an embodiment of the application. The motion control method of the laser head is mainly used for controlling the laser head to move, and in a laser process, the laser head relates to vertical motion, horizontal motion, rotation and other motions with a workpiece, wherein the vertical motion corresponds to a laser focus, namely the processing power of laser, and the horizontal motion, the rotation and other motions correspond to the processing path of the laser. In this embodiment, the horizontal and vertical movement control of the laser head is controlled by the controller. The main process of motion control is as follows.
S11: and acquiring a processing path of the processed workpiece, a target following height and an actual vertical distance between the laser head and the processed workpiece.
The controller of the embodiment realizes the linkage control of vertical, horizontal and rotation. Firstly, processing information is acquired, wherein the processing information comprises a processing path for processing a workpiece, the processing path refers to horizontal and rotary movement of a laser head, and the target following height refers to the following height of the laser head relative to the processing workpiece along the processing path.
The motion control of the laser head includes controlling according to the processing path, and controlling and adjusting the vertical distance between the laser head and the processed workpiece, and in this step S11, the actual vertical distance between the laser head and the processed workpiece is also obtained. The specific acquisition method can use a distance sensor and can also use electric signal conversion calculation.
In the embodiment, an electric signal conversion calculation method is adopted, specifically, a controller obtains an actual capacitance signal between a laser head and a processed workpiece through a sensor, and then an actual vertical distance is obtained according to a distance capacitance calibration function relation and the actual capacitance signal.
The distance capacitance calibration function relationship can be preset in the controller, and can also be obtained after calibration calculation is performed on the same type of processed workpieces, and the relationship is represented by the relationship between capacitance and distance, so that the actual vertical distance can be determined by using the calibration function relationship after the actual capacitance signal is obtained in actual application.
The sensor and the controller are connected by a bus, and the stable interference-free communication is realized by using an EtherCAT bus and also adopting an EtherCAT communication mode.
S12: and determining the motion control quantity of the laser head according to the actual vertical distance, the target following height and the processing path.
After the information in the vertical direction and the information in the horizontal direction are determined, the movement of the laser head can be controlled according to the information, the information in the vertical direction comprises the actual vertical height and the target following height, and the information in the horizontal direction comprises the processing path. In this embodiment, when processing is performed, a corresponding target tracking height, that is, a relative control height of the laser head and the processed workpiece, is set for the processed workpiece, and the laser head tracks the processed workpiece by the target tracking height, that is, the control height of the laser head during process design.
In the control of the embodiment, the actual vertical distance is detected, and the motion control amount of the laser head is determined based on the target tracking height while considering the processing path, so that the laser head can track and process the processed workpiece according to the target tracking height as much as possible.
S13: and controlling the laser head to perform vertical movement, horizontal movement and rotary movement based on the movement control quantity.
After the motion control amount is determined, the laser head is controlled to perform the motion in the vertical direction and the horizontal direction based on the motion control amount.
In the motion control method of the embodiment, the actual vertical distance between the laser head and the processed workpiece is obtained by a controller, and the motion control quantity of the laser head is determined according to the actual vertical distance, the target following height and the processing path; and controlling the laser head to perform vertical movement, horizontal movement, rotation and the like based on the movement control quantity. Namely, the vertical movement, horizontal movement, rotation and other movements of the laser head are realized by one controller, so that the overall movement control planning is facilitated, and the efficiency and accuracy of movement control are improved. Moreover, the same controller is utilized, so that the configuration, zero return, inching, calibration and other operations can be conveniently completed for a user. In addition, the bus is adopted for signal transmission, so that the interference of analog quantity is avoided, and complicated wiring is omitted.
Referring to fig. 2, fig. 2 is another flow chart of a motion control method of a laser head according to an embodiment of the application. The motion control method of this embodiment is similar to the embodiment shown in fig. 1, in which the specific control process based on the motion control amount is further optimized.
S21: and acquiring a processing path of the processed workpiece, a target following height and an actual vertical distance between the laser head and the processed workpiece.
Step S21 in this embodiment is similar to step S11 in the embodiment shown in fig. 1, and detailed description thereof will be omitted.
S22: and calculating the following deviation of the actual vertical distance and the target following height.
After the actual vertical distance is obtained, calculating the following deviation of the actual vertical distance and the target following height, namely the difference value of the actual vertical distance and the target following height, and representing the difference value of the current height of the laser head and the process design height. After the following deviation is determined, the laser head can be adjusted based on the following deviation.
S23: whether the follow-up deviation is greater than a threshold is compared.
If the following deviation obtained in the step S22 is larger, the height of the laser head to be adjusted is larger; if the following deviation is smaller, the height of the laser head which needs to be adjusted is smaller.
In this embodiment, the height adjustment may be performed in different manners, and if the height to be adjusted is large, the interpolation mode may be used, and if the height to be adjusted is small, the following mode may be used. The interpolation mode represents determining interpolation points in the path based on the current position and the adjustment position, and re-planning the interpolation motion speed. The follow mode means that the motion is continued at the current speed without re-planning.
Based on this, a threshold is set for the following deviation in the present embodiment, the threshold involving adjustment of the laser height, i.e., adjustment of the laser focal length. In this embodiment, the following deviation is set to be 1mm, when the following deviation is greater than 1mm, if the following mode is directly adopted, the problem of overshoot easily occurs, and jitter is caused, so that interpolation is performed first, and after the interpolation is in place, the following mode is switched to perform real-time following.
If the following deviation is larger than the threshold value, the height to be adjusted is larger. Step S24 is entered to perform interpolation speed planning.
If the following deviation is less than or equal to the threshold value, the process proceeds to step S25, where the deviation gain is calculated.
S24: interpolation speed planning.
In the step, speed planning and position interpolation of a variable target position are carried out according to the following deviation and the processing path, namely the target position is periodically adjusted according to the following deviation, speed planning is carried out on the current position and the target position periodically, and then the position interpolation is carried out to calculate the motion control quantity.
S25: the offset gain is calculated.
In the step, the deviation gain is calculated according to the following deviation and the current speed of the laser head, and then the motion control quantity is determined. The current speed of the laser head is obtained based on the machining path plan.
S26: the motion control amount is calculated.
In machining, pulse servo control can be used, i.e. pulse control is used for a servo motor driving a laser head to move. The process of calculating the motion control amount according to the present embodiment is thus: after step S24, the pulse control amount is calculated from the interpolation point real-time speed. From the deviation gain, the pulse control amount can be determined after step S25. Finally, the pulse control quantity can be used for controlling the servo motor to move, and then the laser head is driven to move vertically, horizontally and rotationally.
The embodiment discloses a following control process for controlling a laser head to perform laser processing by utilizing the motion control method. The laser head can realize interpolation mode and following mode in the process, improves the adjustment precision of laser processing, and widens the application range of laser cutting.
The calibration function relationship in the above embodiment may be obtained by calibration at the beginning of processing, and referring to fig. 3 specifically, fig. 3 is a schematic flow chart of obtaining the calibration function relationship in the motion control method of the laser head according to an embodiment of the present application.
S31: and controlling the laser head to move upwards to a calibration vertical position, and periodically acquiring a calibration vertical distance and a calibration capacitance signal in the process of calibrating the vertical position.
Firstly, a user can manually move the laser head to a preset distance above a processed workpiece, and the position of the laser head is taken as a calibrated vertical position. The preset distance above can be specifically set to be 1 mm-10 mm.
And then the controller controls the laser head to slowly move downwards, and after the laser head collides with a processed workpiece, the controller controls the laser head to move upwards to a calibrated vertical position. Whether the laser head collides with the processed workpiece or not can be judged by using the fact that the capacitance is 0 or the capacitance reaches a change threshold value. In the process, the capacitance signal and the corresponding coordinates are periodically obtained, namely, the calibration vertical distance and the corresponding calibration capacitance signal are periodically obtained.
S32: and fitting the calibration vertical distance and the calibration capacitance signal to obtain a distance capacitance calibration function relation.
In step S31, a plurality of calibration vertical distances and corresponding calibration capacitance signals are obtained, so that they can be fitted, and then a functional relationship is obtained. In the step, a least square method is adopted to fit a plurality of sections of high-order polynomial fitting. y=a 0+a1x+...+akxk, and the coefficient of a 0,a1...ak can be calculated by using the least square method. x is the calibration capacitance signal, and y is the calibration vertical distance.
The calibration function relation can be calibrated periodically by a user, and can also be calibrated again when the type of the processed workpiece is replaced and the laser head is replaced.
Referring to fig. 4, fig. 4 is a schematic diagram of a motion control system of a laser head according to an embodiment of the application. The motion control system of the present embodiment is a hardware structure for implementing the motion control method described above.
The motion control system 100 of the present embodiment includes a controller 11, a sensor 12, a transmitter 13, a driver 14, and an amplifier 15.
The controller 11 is used for acquiring the actual vertical distance between the laser head and the processed workpiece; determining a motion control amount of the laser head according to the actual vertical distance and the target following height of the processed workpiece and the processing path; and controlling the laser head to perform vertical movement, horizontal movement, rotation and the like based on the movement control quantity.
The controller 11 specifically includes an EtherCAT bus main module 111 and a motion control unit 112. The distance between the laser head and the surface of the workpiece can be obtained according to the capacitance signal by receiving the frequency signal transmitted by the EtherCAT bus, namely the capacitance signal, so that real-time following is performed, namely the controller can adjust the upper shaft and the lower shaft in real time according to the distance so as to keep the distance between the laser head and the surface of the workpiece.
The sensor 12 is connected to the controller 11 for detecting an actual capacitance signal between the laser head and the workpiece being processed. The controller 11 is configured to obtain an actual vertical distance according to the distance capacitance calibration function relationship and the actual capacitance signal.
The transmitter 13 is used for collecting the frequency signal, filtering the frequency signal, and transmitting the frequency signal to the controller 11 through the EtherCAT bus. The transmitter 13 specifically includes an FPGA collector 131, a filter 132, an EtherCAT bus slave module 133, and a signal receiving circuit 134.
The driver 14 is used to drive a transmission mechanism, for example a servo motor. It can be arranged in the control system or on the transmission mechanism.
The amplifier 15 is used for converting the capacitance signal into a frequency signal, and enhancing the anti-interference capability.
Sensor 12 is a capacitive sensor and may be provided on the laser head. The sensor 12 is connected with an amplifier 15; the signal is converted into a frequency signal through an amplifier 15 and is amplified and then is connected into a transmitter 13; the signal is received by a signal receiving circuit 134 in the transmitter 13, is collected at a high speed in real time by an FPGA collector 131, and is sent out in a PDO mode by an EtherCAT bus slave module 133 after being subjected to sliding average filtering by a filter 132; the controller 11 is connected to the controller 11, and the controller 11 acquires this signal every 1ms through the EtherCAT bus master module 111. The controller 11 can perform fitting calibration on the signal by using a piecewise least square method, establish the relation between the capacitance signal and the position, and obtain a real-time distance signal between the laser cutting head and the surface of the processed workpiece after the calibration is completed. The motion control unit 112 of the controller 11 outputs a corresponding pulse to the driver 14 to implement servo execution according to the deviation of the distance signal acquired in real time from the set distance.
When the motion control system of the embodiment realizes the functions, basic configuration work is firstly carried out. Comprising the following steps: configuring an EtherCAT bus: the EtherCAT master module 111 of the controller 11 imports a bus profile (i.e., etherCAT slave profile) of the signal processor and transmitter. Connection EtherCAT bus: real-time communication of the controller 11 with the transmitter 13 is established.
And then calibrating the capacitance signal and the vertical distance, and determining the functional relation of the capacitance signal and the vertical distance. And finally, the current vertical distance between the laser head and the workpiece can be obtained in real time, and then tracking processing is realized.
Besides the beneficial effects in the control method, the application of the electronic element further improves the instantaneity, the control performance and the laser processing quality and efficiency.
Referring to fig. 5, fig. 5 is a schematic structural diagram of a laser processing machine according to an embodiment of the application. The laser processing machine 200 includes a laser head 21, the motion control system 22 described above, and a transmission mechanism 23.
The motion control system 22 of the present embodiment is similar to the motion control system 100 described above, and detailed descriptions thereof are omitted. The laser processing machine 200 of the present embodiment may be a laser cutting machine, or a laser printer or the like that employs laser processing. It can realize high-quality and high-efficiency laser processing.
In the foregoing description of the present specification, the terms "fixed," "mounted," "connected," or "connected" are to be construed broadly, unless explicitly stated or limited otherwise. For example, in terms of the term "coupled," it may be fixedly coupled, detachably coupled, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or in communication with each other or in interaction with each other. Therefore, unless otherwise specifically defined in the specification, a person skilled in the art can understand the specific meaning of the above terms in the present invention according to the specific circumstances.
Those skilled in the art will also appreciate from the foregoing description that terms such as "upper," "lower," "front," "rear," "left," "right," "length," "width," "thickness," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," "circumferential," "center," "longitudinal," "transverse," "clockwise," or "counterclockwise" and the like are used herein for the purpose of facilitating description and simplifying the description of the present invention, and thus do not necessarily have to have, configure, or operate in, the specific orientations, and thus are not to be construed or construed as limiting the present invention.
In addition, the terms "first" or "second" and the like used in the present specification to refer to the numbers or ordinal numbers are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present specification, the meaning of "plurality" means at least two, for example, two, three or more, etc., unless explicitly defined otherwise.
While various embodiments of the present invention have been shown and described herein, it will be obvious to those skilled in the art that such embodiments are provided by way of example only. Many modifications, changes, and substitutions will now occur to those skilled in the art without departing from the spirit and scope of the invention. It should be understood that various alternatives to the embodiments of the invention described herein may be employed in practicing the invention. The appended claims are intended to define the scope of the invention and to cover such modular compositions, equivalents, or alternatives falling within the scope of the claims.
Claims (9)
1. A method of motion control of a laser head, the method comprising:
The controller obtains the target following height, the processing path and the actual vertical distance between the laser head and the processed workpiece;
The controller determines the motion control amount of the laser head according to the actual vertical distance, the target following height and the processing path;
the controller controls the laser head to perform vertical movement, horizontal movement and rotary movement based on the movement control quantity;
the controller determining a motion control amount of the laser head according to the actual vertical distance, the target following height and the processing path, comprising:
performing speed planning based on the processing path to determine the current speed of the laser head, and calculating the following deviation of the actual vertical distance and the target following height;
if the following deviation is smaller than or equal to a threshold value, determining the motion control amount according to the following deviation and the current speed of the laser head;
and if the following deviation is larger than a threshold value, performing speed planning according to the following deviation so as to determine the motion control quantity.
2. The motion control method of claim 1, wherein the controller obtaining an actual vertical distance of the laser head from a workpiece being processed comprises:
The controller acquires an actual capacitance signal between the laser head and the processed workpiece through a sensor;
and obtaining the actual vertical distance according to the distance capacitance calibration function relation and the actual capacitance signal.
3. The motion control method according to claim 2, characterized in that the motion control method further comprises:
Controlling the laser head to move upwards to a calibration vertical position, and periodically acquiring a calibration vertical distance and a calibration capacitance signal in the process of obtaining the calibration vertical position;
and fitting the calibrated vertical distance and the calibrated capacitance signal to obtain the distance capacitance calibration function relation.
4. The motion control method of claim 2, wherein the controller acquiring, via a sensor, an actual capacitance signal between the laser head and the work piece comprises:
The controller detects an actual capacitance signal via a sensor and obtains the actual capacitance signal using bus transmissions between the sensor and the controller.
5. A motion control system for a laser head, the motion control system comprising:
The controller is used for acquiring the target following height, the processing path and the actual vertical distance between the laser head and the processed workpiece; determining a motion control amount of the laser head according to the actual vertical distance, the target following height and the processing path; controlling the laser head to perform vertical movement, horizontal movement and rotary movement based on the movement control quantity;
The controller is further configured to: performing speed planning based on the processing path to determine the current speed of the laser head, and calculating the following deviation of the actual vertical distance and the target following height;
if the following deviation is smaller than or equal to a threshold value, determining the motion control amount according to the following deviation and the current speed of the laser head;
and if the following deviation is larger than a threshold value, performing speed planning according to the following deviation so as to determine the motion control quantity.
6. The motion control system of claim 5, further comprising:
the sensor is connected with the controller and used for detecting an actual capacitance signal between the laser head and the processed workpiece;
The controller is used for obtaining the actual vertical distance according to the distance capacitance calibration function relation and the actual capacitance signal.
7. The motion control system of claim 6, wherein the controller and the sensor are connected by a bus.
8. The motion control system of claim 6, further comprising:
The transmitter is connected between the sensor and the controller and comprises an FPGA collector, a filter and an EtherCAT bus slave module;
the controller comprises an EtherCAT bus main module;
And the driver is connected with the controller and used for receiving the motion control quantity of the controller so as to drive the laser head to perform vertical motion, horizontal motion and rotation motion.
9. A laser processing machine comprising a laser head and a motion control system according to any one of claims 5-8.
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