Disclosure of Invention
In view of the above problems, the present invention is proposed to provide a temperature reduction and preservation device, a method and an application thereof, and a temperature reduction and preservation system for downhole circuits, which overcome or at least partially solve the above problems.
The embodiment of the invention provides a cooling and heat-preserving device, which comprises:
the temperature control device comprises a heat insulation shell and low-melting-point alloy filled in the heat insulation shell and is used for placing a protected object;
the cooling device is provided with a cold end and a hot end and is used for refrigerating;
the cold end heat transfer device is positioned in the temperature control device, is connected with the cold end of the cooling device, and is used for transferring the cold energy generated by the refrigeration of the cooling device to the protected object and transferring the heat absorbed from the protected object to the hot end;
and the hot end heat transfer device is positioned at the hot end of the cooling device and used for dissipating the heat generated by the refrigeration of the cooling device and the heat absorbed from the protected object to the external environment.
In some optional embodiments, the cooling device comprises: the cooling unit and the energy supply unit;
the cooling unit comprises the hot end and the cold end which are connected through a conduit;
the energy supply unit is used for providing energy for refrigeration so that the cold end generates cold, and heat generated in the refrigeration process is transferred to the hot end.
In some optional embodiments, the power supply unit includes: a motor and a transmission assembly;
the motor is used for driving the transmission assembly to move, and mechanical energy is input into the cooling unit to enable the cooling unit to refrigerate.
In some optional embodiments, the cooling unit is a high-pressure closed system, and the transmission assembly and the cooling unit transfer energy by using a non-contact magnetic transfer technology.
In some optional embodiments, the cooling unit is filled with a high-pressure gas refrigerant, and the high-pressure gas refrigerant is cooled by adopting a gas regenerative cooling principle.
In some alternative embodiments, the high pressure gas refrigerant is helium.
In some optional embodiments, the power supply unit further includes:
and the supporting bearing is used for supporting the transmission assembly, so that the transmission assembly can rotate under the driving of the motor.
In some optional embodiments, the hot side heat transfer device is a copper foil attached to the hot side of the cooling device.
In some optional embodiments, the cold end heat transfer device is a shaped copper plate attached to the protected object.
In some optional embodiments, the cold end heat transfer device is in a U-shaped structure or an L-shaped structure.
In some alternative embodiments, the low melting point alloy has a phase transition temperature below the limit temperature that the protected object can withstand.
In some optional embodiments, the apparatus further comprises: and the heat insulation material is positioned outside the heat insulation shell.
The embodiment of the invention also provides a cooling and heat-preserving system for the underground circuit, which is characterized by comprising the following components: the drill collar, the circuit component used as a protected object and the cooling and heat-preserving device are arranged on the drill collar;
a cabin body is arranged on the side wall of the drill collar;
the cooling and heat-preserving device is arranged in the cabin body;
the circuit component is positioned in a heat-insulating shell of the temperature control device.
In some alternative embodiments, the enclosure comprises a hot side enclosure and a cold side enclosure connected by a through-hole;
the cooling device and the hot end heat transfer device are arranged in the hot end cabin;
the temperature control device, the cold end heat transfer device and the circuit assembly are located in the cold end compartment;
and the pipe connecting the cold end and the hot end is positioned in the through hole.
In some alternative embodiments, the void between the temperature control device and the drill collar is filled with a thermal insulation material.
The embodiment of the invention provides a cooling and heat-preserving method, which is realized based on the cooling and heat-preserving device and comprises the following steps:
and the cold energy generated by the cold end of the cooling device maintains the low-melting-point alloy in the temperature control device in a solid state, so that the temperature of the protected object is not higher than the limit temperature which can be borne by the protected object.
In some optional embodiments, the cold energy generated by the cold end of the cooling device maintains the low-melting-point alloy in the temperature control device in a solid state, so that the temperature of the protected object is not higher than the limit temperature which can be borne by the protected object, and the method comprises the following steps:
after part of the low-melting-point alloy in the low-melting-point alloy is converted into liquid, the cooling device works, and the cold end generates cold energy to re-solidify the liquid low-melting-point alloy.
In some optional embodiments, the method further comprises:
after all the low-melting point alloys in the low-melting point alloys are converted into liquid, ending the temperature control time; the temperature control time is determined according to the volume of the low-melting-point alloy.
The embodiment of the invention provides application of the cooling and heat-preserving device in cooling and heat-preserving of an underground circuit.
The technical scheme provided by the embodiment of the invention has the beneficial effects that at least:
the temperature of the low-melting-point alloy can be transmitted in time, the occurrence of phase change can be avoided as much as possible, the temperature in the temperature control device is ensured not to be higher than the phase change temperature of the low-melting-point alloy, the temperature in the temperature control device is not higher than the phase change temperature of the low-melting-point alloy, so that the temperature of the protected object is reduced and kept, the temperature of the protected object is not higher than the bearable limit temperature, and the high-temperature resistance of the protected object is improved; the drill collar is compact in structure, and can be installed in the drill collar body while drilling when used for an underground circuit, so that the underground circuit is protected, and the normal operation of construction is ensured.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
The technical solution of the present invention is further described in detail by the accompanying drawings and embodiments.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In order to solve the problems that the underground circuit is easy to damage during working at high temperature and needs to be cooled and insulated in the prior art, the embodiment of the invention provides a cooling and insulating device and a method and application thereof in cooling and insulating the underground circuit, which can effectively realize cooling and insulating of the underground circuit and ensure safe operation of the underground circuit. The following is a detailed description by way of specific examples.
An embodiment of the present invention provides a cooling and warming device, whose structure is shown in fig. 1 and fig. 2a and fig. 2b, where fig. 1 is a schematic perspective structure, fig. 2a is a front view of the device, and fig. 2b is a sectional view taken along a line a-a of fig. 2a, the cooling and warming device includes:
the temperature control device 1 comprises a heat preservation shell 11 and a low-melting-point alloy 12 filled in the heat preservation shell and used for placing a protected object 5.
The cooling device 2 is provided with a cold end 211 and a hot end 212 for refrigeration.
And the cold end heat transfer device 3 is positioned in the temperature control device 1, is connected with the cold end of the cooling device 2, and is used for transferring the cold energy generated by the refrigeration of the cooling device 2 to the protected object and transferring the heat absorbed from the protected object to the hot end.
And the hot end heat transfer device 4 is positioned at the hot end of the cooling device 2 and is used for dissipating the heat generated by the refrigeration of the cooling device 2 and the heat absorbed from the protected object to the external environment.
Optionally, the structure of the temperature control device 1 may be as shown in fig. 3, where the temperature control device 1 includes a thermal insulation casing 11, a low melting point alloy 12 filled in the thermal insulation casing 11, and may further include a thermal insulation material 13 located outside the thermal insulation casing 11. The thermal insulating means is a closed device, such as a dewar or the like, in which the protected object is placed, protected from the high temperature environment. Cold junction heat transfer unit 3 is located heat preservation casing 11 of heat preservation device, and cold junction 212 part of heat sink stretches into temperature control device 1, and cold volume transmission to the protected object that produces the cold junction is realized to cold junction heat transfer unit 3 and heat sink's cold junction 212.
The thermal insulation shell 11 and the low melting point alloy 12 act together, so that the thermal interference of the external high-temperature environment can be reduced, and the temperature of the protected object can be controlled. The phase transition temperature of the low melting point alloy 12 used in the temperature control device 1 is lower than the limit temperature that the protected object 5 can withstand. The low-melting-point alloy in the temperature control device may be a layer of low-melting-point alloy attached to the heat-insulating housing 11, as shown in fig. 3, or may be filled in the heat-insulating housing 11 to fill the space in the housing, as shown in fig. 2. The low-melting point alloy is subjected to phase change when the temperature is increased to be higher than the phase change temperature of the low-melting point alloy, the low-melting point alloy is converted from a solid state to a liquid state, and at the moment, the cooling device can start to work to transfer cold energy to enable the low-melting point alloy to recover the solid state. The low-melting point alloy is a metal having a melting point of not higher than a predetermined temperature and an alloy thereof, and may be, for example, a metal having a melting point of not higher than 300 ℃ and an alloy thereof, and includes low-melting point metal elements such as Bi, Sn, Pb, and In.
Optionally, the cooling device 2 is used to generate the cooling capacity required to reduce the temperature of the protected object. The structure of the cooling device 2 can be as shown in fig. 4, and includes a cooling unit 21 and an energy supply unit 22; the cooling unit 21 comprises a hot end 211 and a cold end 212 connected by a conduit 213; and the energy supply unit 22 is used for supplying energy for refrigeration so that cold energy is generated at the cold end 212, and heat generated in the refrigeration process is transferred to the hot end 211. The cold end 212 in the cooling unit 21 absorbs the heat of the protected object through the cold end heat transfer device 3, so that the temperature of the protected object is reduced; the heat absorbed by the hot end 211 in the cooling unit 21 and the heat generated by the cooling and heat preserving device are dissipated to the external environment through the hot end heat transfer device 4. In fig. 4, the hot end 211 and the cold end 212 are schematically shown, and the specific internal structure thereof is not shown.
The energy supply unit 22 comprises a motor 221 and a transmission assembly 222; the motor 221 is used for driving the transmission assembly 222 to move, and inputting mechanical energy to the cooling unit 21 to cool the cooling unit. High-pressure gas refrigerating working media are filled in the cooling unit 21, and refrigeration is performed by adopting a gas regenerative refrigeration principle, so that the cooling unit 21 is a high-pressure closed system, the motor 221 transmits power through the transmission assembly 222, and energy is transmitted between the transmission assembly 222 and the cooling unit 21 by adopting a non-contact magnetic transmission technology. Wherein the high-pressure gas refrigeration working medium is helium.
The power supply unit 22 further comprises a support bearing 223 for supporting the transmission assembly 222, so that the transmission assembly 222 can rotate under the driving of the motor 221.
The cold end heat transfer device 3 in the cooling and heat insulation device is a special-shaped copper plate attached to the protected object 5, and is completely attached to the protected object after insulation treatment, so that an integral cooling strategy is realized. The cold end heat transfer device 3 is of an L-shaped structure or a U-shaped structure so as to efficiently transfer cold. The cold end heat transfer device 3 with the L-shaped structure is shown in fig. 5, the cold end heat transfer device 3 with the U-shaped structure is shown in fig. 6, one end of the cold end heat transfer device 3 with the L-shaped structure or the U-shaped structure is provided with a sunken circular hole surface or a sunken step hole, and the cold end 212 of the cooling device 2 can be arranged on the sunken circular hole surface or the sunken step hole to realize the connection of the two.
The hot end heat transfer device 4 in the cooling and heat preserving device is made of copper foil and is attached to the hot end 211 of the cooling device 2.
The protected object 5 may be a downhole circuit or other circuit components, a parameter measurement while drilling system, or the like, or may be another object requiring heat preservation and temperature reduction, and is placed in the temperature control device 1, and specifically may be placed in an enclosed area of the cold-end heat transfer device 3 located in the temperature control device 1.
Based on the same inventive concept, an embodiment of the present invention further provides a downhole circuit cooling and heat preserving system, which has a structure shown in fig. 7 and 8, wherein fig. 7 is a schematic perspective structure diagram, fig. 8 is a schematic sectional structure diagram, and the system includes: a cooling and heat-preserving device, a drill collar 6 and a circuit component 5 as a protected object. Wherein:
a cabin body is arranged on the side wall of the drill collar 6;
the cooling and heat-preserving device is arranged in the cabin body;
the circuit assembly 5 is located in a heat-insulating housing 11 of the temperature control device 1.
Optionally, a cabin body is arranged on the side wall of the drill collar 6, as shown in fig. 7 and 8, and may be a receiving groove formed in the side wall, and a cabin cover 64 may be further arranged on the receiving groove, so that after the cooling and heat preserving device is placed in the cabin body, the cabin cover 64 may be covered to protect the cooling and heat preserving device, and the cooling and heat preserving device is prevented from being corroded by external mud, dust, or other substances.
The temperature control device 1, the temperature reduction device 2, the cold end heat transfer device 3, the hot end heat transfer device 4 and the protected circuit component 5 which are included in the temperature reduction and heat preservation device can be placed in the cabin body. The cabin body comprises a hot end cabin 61 and a cold end cabin 62 which are connected through a through hole 63; the cooling device 2 and the hot end heat transfer device 4 are arranged in a hot end chamber 61; the temperature control device 1, the cold-end heat transfer device 3 and the circuit assembly 5 are positioned in the cold-end cabin 62; a conduit 213 connecting the cold end 212 and the hot end 211 is located in the through bore 63. The circuit assembly 5 may be a downhole circuit for controlling or measuring various drilling engineering parameters, such as drilling pressure, torque, annular water pressure, temperature, etc. near the drill bit downhole, and storing data of the involved circuits or sensors.
After the cooling and heat-preserving device is arranged in the drill collar 6, the drill collar can also be used as a part of the hot-end heat transfer device 4, namely the hot-end heat transfer device 4 comprises a copper foil and the drill collar 6, a gap is inevitably formed between the hot end 211 of the cooling device and the drill collar 6 in the assembling process, the gap is filled with the copper foil in order to quickly dissipate heat to the external environment, and the air gap on a heat transfer path is eliminated and the heat transfer effect is enhanced by virtue of the thin and soft characteristic of the copper foil; meanwhile, the drill collar 6 is made of metal, has high self-thermal conductivity and is regarded as a large radiator, and the heat of the hot end 211 of the cooling device 2 is dissipated to the external environment in time in the high-speed flushing process of the drilling fluid. Specifically, heat generated by the hot end of the cooling device 2 is transferred to the drill collar body through the hot end heat transfer device, and when drilling fluid passes through the drill collar body at a high speed, heat exchange is carried out between the drilling fluid and the drill collar body, so that the heat generated by the cooling device 2 and the heat absorbed by the underground circuit are transferred to the external environment.
In addition, in order to improve the heat preservation effect of the temperature control device and prevent cold energy from being dissipated to the external environment from the drill collar 6, a heat preservation material 13 can be filled in a hole between the temperature control device 1 and the drill collar 6. The heat preservation unit 11 in the temperature control device 1 adopts a Dewar flask, and a downhole circuit is arranged in the heat preservation unit so as to reduce the thermal interference of the external high-temperature environment; meanwhile, a gap is inevitably generated in the process of assembling the Dewar flask and the drill collar 6, and a heat insulation material is filled in the gap, so that on one hand, the thermal interference of the external high-temperature environment is reduced, and the heat insulation effect is achieved; on the other hand, the heat insulation material has elasticity and plays a role in shock absorption to a certain degree.
The low-melting-point alloy in the temperature control device 1 is placed in the Dewar flask, the low-melting-point alloy can absorb cold energy to control the temperature in the Dewar flask, and the interior of the Dewar flask is vacuumized to reduce the thermal interference of the external high-temperature environment. The phase transition temperature of the low melting point alloy is below the upper temperature limit (also referred to as the limiting temperature) that the downhole circuitry can withstand. When the cooling device works, the generated cold energy enables the low-melting-point alloy to be maintained in a solid state, and the temperature in the Dewar flask is lower than the phase transition temperature of the low-melting-point alloy, namely the temperature of an underground circuit is lower than the limit temperature of the underground circuit; when the temperature reduction device does not work, external heat enters the Dewar flask, the low-melting-point alloy absorbs the heat and is gradually changed from solid to liquid, and the temperature in the Dewar flask is equal to the phase change temperature of the low-melting-point alloy in the process, namely the temperature of an underground circuit is lower than the limit temperature of the underground circuit; when the cooling device works again, the liquid low-melting-point alloy is re-solidified by cold energy, and the temperature in the Dewar flask is equal to the phase transition temperature of the low-melting-point alloy in the process, namely the temperature of the underground circuit is lower than the limit temperature of the underground circuit; when the low-melting-point alloy is completely changed into liquid from solid, the temperature control time is over, and when the cooling device does not work or works but the low-melting-point alloy is in a solid state due to the existence of various reasons such as overhigh external temperature and the like, the cold energy generated by the cooling device is not enough to ensure that the low-melting-point alloy is completely changed into liquid; the temperature control time can be calculated from the volume of the low melting point alloy.
The working principle of the cooling and heat-preserving system comprises: in the drilling process, the underground motor drives the transmission assembly to rotate, mechanical energy is input into the cooling device, and heat is generated at the hot end of the cooling device and cold is generated at the cold end of the cooling device through function conversion. On one hand, the heat of the hot end of the cooling device is transferred to the drill collar through a hot end heat transfer device, and then is transferred to the external environment through circulation of the drilling fluid; on the other hand, the cold end of the cooling device transmits cold energy to the underground circuit through the cold end heat transfer device. The cold end of the cooling device, the cold end heat transfer device and the underground circuit are arranged in a Dewar flask of the temperature control device and used for reducing the thermal interference of the external high-temperature environment; the low-melting-point alloy (the phase change temperature of which is lower than the limit temperature of the downhole circuit) in the temperature control device is used for absorbing cold, and when the temperature reduction device is in a working state, the low-melting-point alloy is in a solid state, so that the temperature of the downhole circuit is lower than the limit temperature of the downhole circuit; when the cooling device does not work, the low-melting-point alloy is subjected to phase change due to the entering of external heat and begins to melt, and the temperature of the underground circuit is still lower than the limit temperature of the low-melting-point alloy; and when the phase change of the low-melting-point alloy is finished, the temperature of the underground circuit exceeds the limit temperature, and the temperature control is finished. The whole temperature control time is determined by the volume of the low melting point alloy. The high temperature resistance of the underground circuit is realized by controlling the running state of the cooling device in the drilling process and designing the capacity of the low-melting-point alloy.
Based on the same conception, the embodiment of the invention also provides a cooling and heat-preserving method which is realized based on the cooling and heat-preserving device and comprises the step of maintaining the low-melting-point alloy in the temperature control device in a solid state through cold energy generated by the cold end of the cooling device so that the temperature of a protected object is not higher than the limit temperature which can be borne by the protected object.
When the method is used for cooling and insulating the underground circuit, the temperature control device 1, the temperature reduction device 2, the cold end heat transfer device 3, the hot end heat transfer device 4 and the protected circuit component 5 which are included in the temperature reduction and insulation device can be placed in a cabin body on the side wall of a drill collar 6; the cold energy generated by the cold end 212 of the cooling device 2, the cold energy efficiently transmitted by the cold end heat transfer device 3 and the temperature control device 1 jointly act to control the temperature of the underground circuit, so that the temperature reduction and the heat preservation of the underground circuit are realized.
In this method, the state of the low melting point alloy can be detected to determine whether to activate the temperature reducing device 1. That is, whether the cooling device needs to work or not can be determined according to the state of the low-melting-point alloy. Specifically, the cooling device does not work when the low-melting-point alloy is in a solid state; after part of the low-melting-point alloy in the low-melting-point alloy is converted into liquid, the cooling device works, the cold end generates cold energy to re-solidify the liquid low-melting-point alloy, wherein the degree of partial melting of the low-melting-point alloy can be set according to requirements, for example, the cooling device starts to work as long as the liquid low-melting-point alloy is detected; or detecting the existence of a certain amount of liquid low-melting-point alloy, and starting the cooling device, and the like.
In addition, when the cooling device does not work or the cooling device works but the cooling capacity generated by the cooling device is insufficient to maintain the low-melting-point alloy in a solid state due to various reasons such as overhigh external temperature and the like, the time for which the temperature control device can effectively control the temperature can be determined according to the volume of the low-melting-point alloy, namely the temperature control time is related to the volume of the low-melting-point alloy. In addition, the temperature control time is also related to the external environment temperature, the temperature control time can be determined according to the volume of the low-melting-point alloy under the condition that the external temperature is stable, and when the external environment temperature is unstable, the influence of the external temperature needs to be considered for determining the temperature control time. In short, the temperature control time is the time for maintaining the low melting point alloy to be completely transformed into liquid when the cooling device does not work. And (4) finishing the temperature control time after all the low-melting-point alloy is converted into the liquid state.
Based on the same inventive concept, the embodiment of the invention also provides the application of the cooling and heat-preserving device in the cooling and heat-preserving of the underground circuit.
With regard to the temperature reduction and preservation device, the method and the related system in the above embodiments, the related contents have already been described in one part, and will not be elaborated in another part.
The method, the system and the device solve the problem that the existing underground circuit cannot resist high temperature, refrigeration quantity is generated by a temperature reduction device while drilling in a high-temperature and ultra-high-temperature stratum, cold quantity is efficiently transmitted to the underground circuit through a cold-end heat transfer device, thermal interference of an external high-temperature environment is reduced through a temperature control device, phase change is generated at a set temperature by a low-melting-point alloy, the temperature in the temperature control device is controlled by the characteristic of heat absorption, the temperature of the underground circuit is maintained below the limit temperature which can be born by the underground circuit, the high-temperature resistance of the underground circuit is improved, the safe and efficient drilling technical level of a deep well is improved, normal construction is guaranteed, and quality and efficiency improvement are realized.
Unless specifically stated otherwise, terms such as processing, computing, calculating, determining, displaying, or the like, may refer to an action and/or process of one or more processing or computing systems or similar devices that manipulates and transforms data represented as physical (e.g., electronic) quantities within the processing system's registers and memories into other data similarly represented as physical quantities within the processing system's memories, registers or other such information storage, transmission or display devices. Information and signals may be represented using any of a variety of different technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be referenced throughout the above description may be represented by voltages, currents, electromagnetic waves, magnetic fields or particles, optical fields or particles, or any combination thereof.
It should be understood that the specific order or hierarchy of steps in the processes disclosed is an example of exemplary approaches. Based upon design preferences, it is understood that the specific order or hierarchy of steps in the processes may be rearranged without departing from the scope of the present disclosure. The accompanying method claims present elements of the various steps in a sample order, and are not intended to be limited to the specific order or hierarchy presented.
In the foregoing detailed description, various features are grouped together in a single embodiment for the purpose of streamlining the disclosure. This method of disclosure is not to be interpreted as reflecting an intention that the claimed embodiments of the subject matter require more features than are expressly recited in each claim. Rather, as the following claims reflect, invention lies in less than all features of a single disclosed embodiment. Thus, the following claims are hereby expressly incorporated into the detailed description, with each claim standing on its own as a separate preferred embodiment of the invention.
What has been described above includes examples of one or more embodiments. It is, of course, not possible to describe every conceivable combination of components or methodologies for purposes of describing the aforementioned embodiments, but one of ordinary skill in the art may recognize that many further combinations and permutations of various embodiments are possible. Accordingly, the embodiments described herein are intended to embrace all such alterations, modifications and variations that fall within the scope of the appended claims. Furthermore, to the extent that the term "includes" is used in either the detailed description or the claims, such term is intended to be inclusive in a manner similar to the term "comprising" as "comprising" is interpreted when employed as a transitional word in a claim. Furthermore, any use of the term "or" in the specification of the claims is intended to mean a "non-exclusive or".