CN114501861A - Prepreg tape-out control method - Google Patents
Prepreg tape-out control method Download PDFInfo
- Publication number
- CN114501861A CN114501861A CN202210057408.7A CN202210057408A CN114501861A CN 114501861 A CN114501861 A CN 114501861A CN 202210057408 A CN202210057408 A CN 202210057408A CN 114501861 A CN114501861 A CN 114501861A
- Authority
- CN
- China
- Prior art keywords
- prepreg
- curing
- glue
- flow
- curing adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 37
- 239000003292 glue Substances 0.000 claims abstract description 32
- 239000000853 adhesive Substances 0.000 claims abstract description 22
- 230000001070 adhesive effect Effects 0.000 claims abstract description 20
- 238000005452 bending Methods 0.000 claims abstract description 11
- 238000003825 pressing Methods 0.000 claims abstract description 11
- 239000011248 coating agent Substances 0.000 claims abstract description 5
- 238000000576 coating method Methods 0.000 claims abstract description 5
- 230000001678 irradiating effect Effects 0.000 claims abstract description 5
- 238000007639 printing Methods 0.000 claims abstract description 5
- 238000005507 spraying Methods 0.000 claims abstract description 5
- 230000009471 action Effects 0.000 claims abstract description 4
- 238000001723 curing Methods 0.000 claims description 30
- 238000000016 photochemical curing Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 abstract description 12
- 239000002699 waste material Substances 0.000 abstract description 7
- 238000001029 thermal curing Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000002390 adhesive tape Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000008093 supporting effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Moulding By Coating Moulds (AREA)
Abstract
The invention discloses a prepreg gummosis control method, which comprises the following steps: forming a window on a prepreg, spraying, coating or printing curing glue at the window of the prepreg, and primarily curing the curing glue by irradiating light; and pressing the preliminarily cured prepreg through a hot press, and completely curing the primarily cured curing adhesive under the action of heat of the hot press so that the curing adhesive and the laminated plate are combined into a whole. The invention can avoid using low-flow glue or no-flow glue prepreg, and can effectively control glue overflow of the prepreg in the pressing process so as to prevent the flow glue of the prepreg from flowing to the cavity or the bending groove in the pressing process; the curing adhesive and the PCB are combined into a whole, the curing adhesive does not need to be subjected to other special treatment in the pressing and subsequent processes, other wastes are not generated in the operation process, and the curing adhesive is matched with countries and the world to reduce wastes, so that the curing adhesive is green and environment-friendly.
Description
Technical Field
The invention relates to a gummosis control method, in particular to a gummosis control method for a prepreg.
Background
In the prior art, methods such as sticking a high-temperature adhesive tape and placing a gasket are adopted to control the gummosis of the prepreg, the prepreg needs to be cut into a required size by a cutting die, the alignment requirement in the operation process is high, and the thickness of the high-temperature adhesive tape or the gasket greatly limits the stacking design of a PCB product; in the scheme of using the low-flow prepreg or the no-flow prepreg, Coverlay needs to be attached to protect the copper surface and improve the appearance, but the process flow is long, and the material cost, the labor cost and the time cost are increased.
Disclosure of Invention
The invention aims to provide a prepreg gummosis control method, which can avoid using low gummosis or no gummosis prepregs and can effectively control the gummosis of the prepregs in the laminating process so as to prevent the gummosis of the prepregs from flowing to a cavity or a bending groove in the laminating process.
The invention adopts the following technical scheme for realizing the aim of the invention:
the invention provides a prepreg gummosis control method, which comprises the following steps:
windowing on the prepreg;
spraying, coating or printing curing glue at the windowing position of the prepreg, and primarily curing the curing glue by irradiating light;
and pressing the preliminarily cured prepreg through a hot press, and completely curing the primarily cured curing adhesive under the action of heat of the hot press so that the curing adhesive and the laminated plate are combined into a whole.
Furthermore, the prepreg is windowed by adopting a forming machine.
Furthermore, the size of the window on the prepreg is 0.05-0.15mm larger than the single side of the cavity or the bending groove.
Further, UV light is adopted to irradiate the curing glue to enable the curing glue to be primarily cured.
Furthermore, the curing glue is light-curing type curing glue or light-heat-curing type curing glue.
Furthermore, an FR4 prepreg is selected as the prepreg.
And further, spraying, coating or printing a curing adhesive at the windowing position of the prepreg until the section at the windowing position is completely coated.
The invention has the beneficial effects that:
compared with the traditional prepreg which uses low-flow glue or no-flow glue, the prepreg has the advantages that the width of the flow glue is more effectively controlled, the resin is prevented from flowing to the cavity or the bending groove in the pressing process, the size control precision of the cavity and the bending groove is high, the alignment procedure is simplified, the collapse of the open-window edge circuit can be reduced, and the product reliability is improved;
the curing adhesive and the PCB are combined into a whole, the curing adhesive does not need to be subjected to other special treatment in the pressing and subsequent processes, other wastes are not generated in the operation process, and the curing adhesive is matched with countries and the world to reduce wastes, so that the curing adhesive is green and environment-friendly;
according to the invention, the low-flow-adhesive prepreg or the no-flow-adhesive prepreg is not needed, the photo-thermal curing adhesive is directly sprayed, printed or coated on the windowing interface of the prepreg, the manufacturing process is simple, the production cost is low, no special requirements are required for the graphic design of the product, and more space is reserved for PCB wiring.
Drawings
Fig. 1 is a top view of a prepreg molding windowing in a prepreg tape-out control method according to an embodiment of the present invention;
FIG. 2 is a front view of photo-thermal curing glue sprayed, coated or printed at a window in a prepreg flow control method according to an embodiment of the present invention;
FIG. 3 is a front view of a photo-thermal curing adhesive irradiated by UV light according to a prepreg flow control method according to an embodiment of the present invention for primary curing;
fig. 4 is a front view (corresponding to a cavity) of a pressing effect after controlling the flow in the prepreg flow control method according to an embodiment of the present invention;
fig. 5 is a front view of the cover opening (corresponding to the bending groove) after controlling the gummosis in the method for controlling the gummosis of the prepreg according to the embodiment of the present invention;
fig. 6 is a front view of a prepreg tape-out control method according to an embodiment of the present invention.
Detailed Description
The invention is further described below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
The invention provides a prepreg gummosis control method, which comprises the following steps:
preparing a common FR4 prepreg, and windowing the prepreg by using a forming machine, wherein the windowing size is 0.05-0.15mm larger than the single side of the cavity or the bending groove. As shown in fig. 1.
And (3) spraying and printing photo-thermal curing glue with proper thickness and width at the windowing position of the prepreg to achieve the function of preventing glue flowing, and completely coating the cross section at the windowing position as shown in figure 2.
The photo-thermal curing adhesive was primarily cured by irradiating it with UV light, as shown in FIG. 3.
The primarily cured prepreg is pressed through a hot press, the primarily cured curing glue is completely cured under the heat of the hot press, the glue flowing of the prepreg is effectively controlled to flow to the cavity or the bending groove in the pressing process, as shown in fig. 4, and a certain supporting effect is exerted on the edge of the circuit layer, so that collapse is avoided.
The photo-thermal curing adhesive and the laminated plate are combined into a whole, special treatment is not needed after lamination, no other waste is generated, and uncapping (shown in figure 5) or production of other subsequent flow steps can be directly carried out.
The prepreg may or may not contain a glass cloth.
Fig. 6 is a front view of the prepreg tape-out control method without controlling the prepreg tape-out.
According to the invention, the common FR4 prepreg is used, the non-gummosis prepreg and the low-gummosis prepreg are not needed, the photo-curing glue is directly sprayed, printed or coated on the windowing interface of the prepreg, the manufacturing process is simple, and the production cost is low.
The invention directly carries out the gumming control action on the prepreg, does not influence the graphic design of the product and reserves more space for the PCB wiring.
The invention effectively controls the glue flow, has high control precision of the sizes of the cavity and the bending groove, and does not influence the service performance of the product.
The invention has certain supporting effect on the circuit layer and reduces the collapse phenomenon of the side wall of the cavity or the bending groove.
The invention does not need to introduce other glue-blocking substances which need to be removed after pressing.
The operation flow of the invention does not generate other wastes, reduces wastes in cooperation with the country and the world, and is green and environment-friendly.
While the preferred embodiments of the present invention have been illustrated and described, it will be appreciated that the invention may be embodied otherwise than as specifically described and that equivalent alterations and modifications, which may be effected thereto by those skilled in the art without departing from the spirit of the invention, are deemed to be within the scope and spirit of the invention.
Claims (7)
1. A prepreg flow control method, characterized in that the method comprises:
windowing on the prepreg;
spraying, coating or printing curing glue at the windowing position of the prepreg, and primarily curing the curing glue by irradiating light;
and pressing the preliminarily cured prepreg through a hot press, and completely curing the primarily cured curing adhesive under the action of heat of the hot press so that the curing adhesive and the laminated plate are combined into a whole.
2. The method for controlling the running glue of the prepregs according to claim 1, wherein the prepregs are windowed by a forming machine.
3. The method for controlling the flow of the prepreg according to claim 1, wherein the curing adhesive is primarily cured by irradiating UV light.
4. The method as claimed in claim 1, wherein the curing glue is selected from a photo-curing type curing glue or a photo-curing type curing glue.
5. The method for controlling the running of the prepreg according to claim 1, wherein an FR4 prepreg is selected as the prepreg.
6. The method for controlling the flow of the glue on the prepreg according to claim 1, wherein the curing glue is sprayed, coated or printed on the windowed portion of the prepreg until the cross section of the windowed portion is completely coated.
7. The method for controlling the flow of the prepreg according to claim 1, wherein the size of the window on the prepreg is 0.05-0.15mm larger than the single edge of the cavity or the bending groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210057408.7A CN114501861A (en) | 2022-01-19 | 2022-01-19 | Prepreg tape-out control method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210057408.7A CN114501861A (en) | 2022-01-19 | 2022-01-19 | Prepreg tape-out control method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114501861A true CN114501861A (en) | 2022-05-13 |
Family
ID=81473152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210057408.7A Pending CN114501861A (en) | 2022-01-19 | 2022-01-19 | Prepreg tape-out control method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114501861A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115643673A (en) * | 2022-12-23 | 2023-01-24 | 惠州市金百泽电路科技有限公司 | PCB glue-blocking structure and accurate glue-blocking control method thereof |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001308522A (en) * | 2000-04-19 | 2001-11-02 | Elna Co Ltd | Method for manufacturing multilayered printed wiring board and prepreg |
| CN101351078A (en) * | 2008-08-15 | 2009-01-21 | 东莞生益电子有限公司 | Method for processing step ladder PCB plate |
| CN101784164A (en) * | 2010-02-08 | 2010-07-21 | 沪士电子股份有限公司 | Making method of groove type printed circuit board |
| JP2015083635A (en) * | 2013-10-25 | 2015-04-30 | 王子ホールディングス株式会社 | Adhesive sheet and laminated adhesive sheet |
| CN105530770A (en) * | 2015-12-30 | 2016-04-27 | 东莞生益电子有限公司 | Manufacturing method of PCB |
| TWI655888B (en) * | 2017-09-21 | 2019-04-01 | 采悅科技股份有限公司 | Circuit board alignment hot pressing cushion setting method |
| CN111315138A (en) * | 2020-02-27 | 2020-06-19 | 长沙牧泰莱电路技术有限公司 | PCB glue blocking process method of stepped groove |
| CN112074104A (en) * | 2020-08-18 | 2020-12-11 | 鹤山市中富兴业电路有限公司 | Thick copper circuit board inner layer resin filling process |
-
2022
- 2022-01-19 CN CN202210057408.7A patent/CN114501861A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001308522A (en) * | 2000-04-19 | 2001-11-02 | Elna Co Ltd | Method for manufacturing multilayered printed wiring board and prepreg |
| CN101351078A (en) * | 2008-08-15 | 2009-01-21 | 东莞生益电子有限公司 | Method for processing step ladder PCB plate |
| CN101784164A (en) * | 2010-02-08 | 2010-07-21 | 沪士电子股份有限公司 | Making method of groove type printed circuit board |
| JP2015083635A (en) * | 2013-10-25 | 2015-04-30 | 王子ホールディングス株式会社 | Adhesive sheet and laminated adhesive sheet |
| CN105530770A (en) * | 2015-12-30 | 2016-04-27 | 东莞生益电子有限公司 | Manufacturing method of PCB |
| TWI655888B (en) * | 2017-09-21 | 2019-04-01 | 采悅科技股份有限公司 | Circuit board alignment hot pressing cushion setting method |
| CN111315138A (en) * | 2020-02-27 | 2020-06-19 | 长沙牧泰莱电路技术有限公司 | PCB glue blocking process method of stepped groove |
| CN112074104A (en) * | 2020-08-18 | 2020-12-11 | 鹤山市中富兴业电路有限公司 | Thick copper circuit board inner layer resin filling process |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115643673A (en) * | 2022-12-23 | 2023-01-24 | 惠州市金百泽电路科技有限公司 | PCB glue-blocking structure and accurate glue-blocking control method thereof |
| CN115643673B (en) * | 2022-12-23 | 2023-06-13 | 惠州市金百泽电路科技有限公司 | PCB glue blocking structure and accurate glue blocking control method thereof |
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