CN114460773A - Display panel to be cut, display panel and display device - Google Patents
Display panel to be cut, display panel and display device Download PDFInfo
- Publication number
- CN114460773A CN114460773A CN202210102963.7A CN202210102963A CN114460773A CN 114460773 A CN114460773 A CN 114460773A CN 202210102963 A CN202210102963 A CN 202210102963A CN 114460773 A CN114460773 A CN 114460773A
- Authority
- CN
- China
- Prior art keywords
- metal layer
- cut
- area
- display panel
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 211
- 239000002184 metal Substances 0.000 claims abstract description 211
- 210000000746 body region Anatomy 0.000 claims abstract description 46
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 239000000463 material Substances 0.000 claims description 12
- 238000009826 distribution Methods 0.000 claims description 11
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims 1
- 238000005520 cutting process Methods 0.000 abstract description 35
- 230000000694 effects Effects 0.000 abstract description 15
- 239000010410 layer Substances 0.000 description 251
- 101100008049 Caenorhabditis elegans cut-5 gene Proteins 0.000 description 13
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000004904 shortening Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The application discloses a display panel to be cut, a display panel and a display device, wherein the display panel to be cut is provided with a binding area and an area to be cut; the bonding region comprises a plurality of pad regions; each pad area comprises a main body area and an extension area extending from the main body area towards the direction of the area to be cut; the display panel to be cut comprises a substrate positioned in a binding region, a first insulating layer, a first metal layer and a second metal layer, wherein the first insulating layer and the first metal layer are positioned in a main body region and an extension region and are sequentially arranged on the substrate, and the second metal layer is positioned in the main body region and is positioned between the substrate and the first insulating layer; the first metal layer is electrically connected with the second metal layer, and the stability of the first metal layer is greater than that of the second metal layer; the distance between the main body area and the area to be cut is greater than or equal to a preset safety distance, and the distance between the extension area and the area to be cut is greater than or equal to 0 and less than the preset safety distance. The narrow frame can be achieved on the basis that the cutting risk is not increased, and the binding effect is improved.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel to be cut, a display panel and a display device.
Background
In the production process of the display panel, a large substrate is usually cut for the first time to form a plurality of small display panels to be cut, and then the small display panels to be cut are cut for the second time to form the display panel capable of being bound with the external circuit board.
Because the binding area of the display panel to be cut is adjacent to the area to be cut, and the cutting line is positioned between the binding area and the area to be cut, when the second cutting is carried out, in order to prevent the pad structure of the binding area from being damaged due to the influence of cutting precision and relevant cutting defects (such as cracks) and the like, a preset safety distance is usually kept between the whole pad structure and the cutting line, and the design is not beneficial to realizing a narrow frame and improving the binding effect.
Disclosure of Invention
The application provides a treat and cut display panel, display panel and display device can realize narrow frame on the basis that does not increase the cutting risk to and improve and bind the effect.
The application provides a display panel to be cut, which is provided with a binding area and a region to be cut adjacent to the binding area; the binding area comprises a plurality of pad areas which are sequentially arranged at intervals; each pad area comprises a main body area and an extension area extending from the main body area towards the direction of the area to be cut;
the display panel to be cut comprises a substrate positioned in the binding region, a first insulating layer, a first metal layer and a second metal layer, wherein the first insulating layer and the first metal layer are positioned in the main body region and the extension region and are sequentially arranged on the substrate, and the second metal layer is positioned in the main body region and is positioned between the substrate and the first insulating layer; the first metal layer is electrically connected with the second metal layer, and the stability of the first metal layer is greater than that of the second metal layer;
the distance between the main body area and the area to be cut is greater than or equal to a preset safety distance, and the distance between the extension area and the area to be cut is greater than or equal to 0 and smaller than the preset safety distance.
Optionally, the display panel to be cut further includes a second insulating layer located in the extension region and located between the first insulating layer and the substrate.
Optionally, the display panel to be cut further includes a second insulating layer located in the main body region and the extension region and located on a side of the second metal layer away from the first insulating layer, and a third metal layer located in the main body region and located between the second insulating layer and the substrate;
the second metal layer is electrically connected to the third metal layer.
Optionally, the display panel to be cut further includes a filling metal layer located in the extension region and located between the first insulating layer and the substrate; the filling metal layer and the second metal layer are arranged in an insulating mode, and the stability of the filling metal layer is larger than that of the second metal layer.
Optionally, a plurality of first through holes are formed in the first insulating layer in the body region, and the first metal layer is electrically connected to the second metal layer through the plurality of first through holes;
and a plurality of second through holes are formed in the first insulating layer in the extension area, and the first metal layer is also positioned in the second through holes.
Optionally, the first through holes and the second through holes have the same aperture, and the distribution density of the first through holes is the same as that of the second through holes.
Optionally, at least a part of the extension area close to the area to be cut in the extension area has a width smaller than that of the body area.
Optionally, the material of the first metal layer includes indium tin oxide, and the material of the second metal layer includes any one of molybdenum and aluminum.
The application also provides a display panel, which comprises the structure of the display panel to be cut in the area to be cut.
The application also provides a display device, which comprises the display panel and the circuit board; the circuit board is in binding connection with the first metal layer located in the binding region.
In the display panel to be cut, the display panel and the display device provided by the application, the pad structure of the binding region at least consists of a first metal layer, a first insulating layer and a second metal layer which are positioned in the pad region, wherein the first metal layer is positioned in a main body region and an extension region of the pad region, the second metal layer is only positioned in the main body region of the pad region, and the stability of the first metal layer is greater than that of the second metal layer; because the distance between the main body area and the area to be cut is greater than or equal to the preset safety distance, and the distance between the extension area and the area to be cut is greater than or equal to 0 and less than the preset safety distance, compared with the traditional structure, the distance between the first metal layer with stronger stability and the area to be cut is reduced; due to the fact that the stability of the first metal layer is strong, the cutting risk cannot be increased by properly shortening the distance between the first metal layer and the area to be cut, and narrow frames can be realized; in addition, the first metal layer extends towards the to-be-cut area relative to the second metal layer and the third metal layer, so that the area of the first metal layer is increased, namely, the binding area is increased, and the binding effect is favorably improved.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of a display panel to be cut according to an embodiment of the present disclosure.
Fig. 2 is a top view of a pad area of a display panel to be cut according to an embodiment of the present disclosure.
Fig. 3 is a schematic cross-sectional view illustrating a pad area of a display panel to be cut according to an embodiment of the present disclosure.
Fig. 4 is a top view of a pad area of a display panel to be cut according to a second embodiment of the present application.
Fig. 5 is a schematic cross-sectional view illustrating a pad area of a display panel to be cut according to a second embodiment of the present application.
Fig. 6 is a schematic cross-sectional view illustrating a pad area of a display panel to be cut according to a third embodiment of the present application.
Fig. 7 is a schematic cross-sectional view illustrating a pad area of a display panel to be cut according to a fourth embodiment of the present application.
Fig. 8 is a top view of a pad area of a display panel to be cut according to a fifth embodiment of the present application.
Fig. 9 is a schematic cross-sectional view illustrating a pad area of a display panel to be cut according to a fifth embodiment of the present application.
Fig. 10 is a top view of a pad area of a display panel to be cut according to a sixth embodiment of the present application.
Fig. 11 is a schematic structural diagram of a display panel according to a seventh embodiment of the present application.
Fig. 12 is a schematic structural diagram of a display device according to an eighth embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the present application and to simplify the description, and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed in a particular orientation, and be operated in a particular orientation, and thus are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
Example one
Referring to fig. 1 to 3, an embodiment of the present application provides a display panel 1 to be cut. As shown in fig. 1, the display panel 1 to be cut has a display area 2 and a non-display area 3 disposed around the display area 2, wherein the non-display area 3 of the display panel 1 to be cut includes a binding area 4 and a to-be-cut area 5 adjacent to the binding area 4, and the display area 2 is located on a side of the binding area 4 away from the to-be-cut area 5. It can be understood that the edge of the area to be cut 5 adjacent to the binding area 4 is a cutting edge, and the straight line where the cutting edge is located is a cutting line L.
As shown in fig. 1 and 2, the binding region 4 includes a plurality of pad regions 6 sequentially arranged at intervals, and each pad region 6 includes a body region 7 and an extension region 8 extending from the body region 7 toward the to-be-cut region 5 (or the cutting line L); the distance D1 between the main body region 7 and the region to be cut 5 (or the cutting line L) is greater than or equal to the preset safety distance, and the distance D2 between the extension region 8 and the region to be cut 5 is greater than or equal to 0 and less than the preset safety distance. As can be appreciated, the pad region 6 is used to form a pad structure.
It should be noted that the preset safety distance may refer to a safety distance between the pad of the bonding area 4 and the cutting line L in the prior art, and is used to prevent the metal layer in the pad from being damaged when the area to be cut 5 is cut.
As shown in fig. 3, the display panel 1 to be cut includes a substrate 14 located in the body region 7 and the extension region 8 of the bonding region, a first insulating layer 9 and a first metal layer 10 located in the body region 7 and the extension region 8 and sequentially stacked on the substrate 14, a second metal layer 11 located in the body region 7 and between the first insulating layer 9 and the substrate 14, a second insulating layer 12 located in the body region 7 and the extension region 8 and between the second metal layer 11 and the substrate 14, and a third metal layer 13 located in the body region 7 and between the second insulating layer 12 and the substrate 14; the first metal layer 10 is electrically connected to the second metal layer 11, and the second metal layer 11 is electrically connected to the third metal layer 13.
It is understood that the third metal layer 13, the second insulating layer 12, the second metal layer 11, the first insulating layer 9, and the first metal layer 10 are stacked on the substrate 14 in this order from bottom to top. The substrate 14 may be located throughout the display region 2 and the non-display region 3, the second metal layer 11 and the third metal layer 13 may extend in the direction of the display region 2, and the first insulating layer 9 and the second insulating layer 12 are also located between the adjacent pad regions 6; in the embodiment of the present application, the structure of the pad region 6 is described with emphasis, and the structures of other regions are not described in detail.
In a specific embodiment, the display panel 1 to be cut further comprises a buffer layer 15 between the third metal layer 13 and the substrate 14. Of course, other insulating layers, such as a gate insulating layer extending from the display region 2, may be disposed between the buffer layer 15 and the third metal layer 13, which is not limited herein.
Specifically, the stability of the first metal layer 10 is greater than the stability of the second metal layer 11 and the third metal layer 13. Specifically, the material of the first metal layer 10 includes Indium Tin Oxide (ITO), and the materials of the second metal layer 11 and the third metal layer 13 include molybdenum (Mo) or aluminum (Al), etc.
Specifically, the first metal layer 10, the first insulating layer 9 and the second insulating layer 12 located in the body region 7 and the extension region 8, and the second metal layer 11 and the third metal layer 13 located in the body region 7 together form a pad structure for binding and connecting with an external circuit board. It is understood that the first metal layer 10 is a surface structure of the pad structure, and can be bound and connected with the circuit board by the conductive adhesive covering the first metal layer 10.
Since the first metal layer 10 is located in the main body region 7 and the extension region 8 of the pad region 6, the distance D2 between the first metal layer 10 and the region to be cut 5 is greater than or equal to 0 and less than the preset safety distance. Since the second metal layer 11 and the third metal layer 13 are located in the body region 7 of the pad region 6, the distance D1 between the second metal layer 11 and the third metal layer 13 and the region to be cut 5 is greater than or equal to the preset safety distance.
In a specific embodiment, the distance D1 between the second metal layer 11 and the third metal layer 13 and the cutting line L can be kept as a preset safety distance, and the first metal layer 10 with stronger stability is extended toward the cutting line L relative to the second metal layer 11 and the third metal layer 13, so that the area of the first metal layer 10 can be increased without increasing the cutting risk, thereby increasing the binding contact area and being beneficial to improving the binding effect.
In another embodiment, the distance between the first metal layer 10 and the cutting line L may be shortened, and the distances between the second metal layer 11 and the cutting line L and between the third metal layer 13 and the cutting line L may be increased, so that the distance D2 between the first metal layer 10 with stronger stability and the cutting line L is less than the preset safety distance, and the distance D1 between the second metal layer 11 and the third metal layer 13 and the region to be cut 5 is greater than the preset safety distance. This embodiment also facilitates the realization of a narrow bezel without increasing the risk of cutting.
Specifically, as shown in fig. 2 and 3, a plurality of first vias 16 penetrating through the first insulating layer 9 are disposed on the first insulating layer 9 in the body region 7, and the first metal layer 10 is electrically connected to the second metal layer 11 through the plurality of first vias 16. The second insulating layer 12 in the body region 7 is provided with a plurality of third vias 18 penetrating through the second insulating layer 12, and the second metal layer 11 is electrically connected to the third metal layer 13 through the plurality of third vias 18. In a specific embodiment, as shown in fig. 2, the distribution areas of the plurality of third through holes 18 and the distribution areas of the plurality of first through holes 16 are not overlapped, so that a small concave structure uniformly distributed on the surface of the first metal layer 10 is formed, and the conductive adhesive is uniformly distributed on the surface of the first metal layer 10 and firmly bonded during the bonding, thereby improving the bonding effect. In a specific embodiment, the distribution density of the first through holes 16 is the same as the distribution density of the third through holes 18, and the aperture of the first through holes 16 is equal to the aperture of the third through holes 18.
It is to be understood that fig. 2 shows only one distribution positional relationship of the first through hole 16 and the third through hole 18, and is not limited thereto; and the first via hole 16 and the third via hole 18 are different layer structures.
Specifically, the display panel 1 to be cut further includes a substrate 14 located at the display area 2 and a driving layer (not shown) sequentially disposed on the substrate 14. In a specific embodiment, the driving layer includes a pixel electrode and/or a common electrode and/or a touch electrode disposed on the same layer as the first metal layer 10, a source/drain electrode and a data line disposed on the same layer as the second metal layer 11, and a gate electrode and a scan line disposed on the same layer as the third metal layer 13. It is understood that the first insulating layer 9 and the second insulating layer 12 are also located in the display region 2, the first insulating layer 9 may be a flat layer, and the second insulating layer 12 may be an interlayer insulating layer. Of course, the specific film structure of the driving layer depends on the structure of the thin film transistor, and is not limited herein.
Specifically, the display panel 1 to be cut may be a liquid crystal display panel to be cut, or may also be an OLED display panel to be cut, which is not limited herein. When the display panel 1 to be cut is a liquid crystal display panel to be cut, the display panel 1 to be cut also comprises a liquid crystal layer and a color film substrate which are positioned on one side of the driving layer, which is far away from the substrate 14; when the display panel 1 to be cut is an OLED display panel to be cut, the display panel 1 to be cut further includes an organic display layer and an encapsulation layer on the side of the driving layer away from the substrate 14.
Specifically, the display panel 1 to be cut can form a display panel to be bound after the display panel to be cut 5 is cut by a cutting process.
In this embodiment, the pad structure of the bonding region 4 is composed of a first metal layer 10, a first insulating layer 9, a second metal layer 11, a second insulating layer 12 and a third metal layer 13 located in the pad region 6, wherein the first metal layer 10 is located in the body region 7 and the extension region 8 of the pad region 6, the second metal layer 11 and the third metal layer 13 are only located in the body region 7 of the pad region 6, and the stability of the first metal layer 10 is greater than that of the second metal layer 11 and the third metal layer 13; since the distance D1 between the main body region 7 and the region to be cut 5 is greater than or equal to the preset safety distance, and the distance D2 between the extension region 8 and the region to be cut 5 is greater than or equal to 0 and less than the preset safety distance, the distance between the first metal layer 10 with higher stability and the region to be cut 5 is smaller than that of the conventional structure; due to the fact that the stability of the first metal layer 10 is strong, the cutting risk cannot be increased by properly shortening the distance between the first metal layer 10 and the area to be cut 5, and narrow frames can be realized; in addition, the first metal layer 10 extends towards the region to be cut 5 relative to the second metal layer 11 and the third metal layer 13, so that the area of the first metal layer 10 is increased, namely, the binding area is increased, and the binding effect is favorably improved.
Example two
As shown in fig. 4 and fig. 5, the present embodiment further provides a display panel 1 to be cut, which is different from the previous embodiment in that the present embodiment hollows out the third metal layer 13 and the second insulating layer 12 in the body region 7 of the pad region 6, so that the pad structure is only composed of the first metal layer 10 and the first insulating layer 9 in the body region 7 and the extension region 8, and the second metal layer 11 in the body region 7. That is to say, in the second embodiment of the present application, the display panel 1 to be cut includes the first insulating layer 9 and the first metal layer 10 located in the main body region 7 and the extension region 8 and sequentially disposed on the substrate 14, the second metal layer 11 located in the main body region 7 and located between the first insulating layer 9 and the substrate 14, and the second insulating layer 12 located in the extension region 8 and located between the first insulating layer 9 and the substrate 14; the first metal layer 10 is electrically connected to the second metal layer 11, and the stability of the first metal layer 10 is greater than that of the second metal layer 11.
In the first embodiment, since there is no metal layer under the first metal layer 10 of the extension region 8, the height of the first metal layer 10 located in the extension region 8 (i.e. the distance between the first metal layer 10 and the substrate 14) is lower than the height of the first metal layer 10 located in the body region 7, so that the surface of the pad structure is not flat, which may affect the bonding effect. In the embodiment of the present application, the third metal layer 13 and the second insulating layer 12 in the body region 7 are removed, and the second insulating layer 12 in the extension region 8 is remained, so that the height of the first metal layer 10 in the extension region 8 is equivalent to the height of the first metal layer 10 in the body region 7, thereby improving the surface flatness of the pad structure and effectively improving the bonding effect.
It can be understood that when the thickness of the second insulating layer 12 is the same as the thickness of the second metal layer 11, the height of the first metal layer 10 in the extension region 8 is the same as the height of the first metal layer 10 in the body region 7; when there is a thickness difference between the thickness of the second insulating layer 12 and the thickness of the second metal layer 11, the height difference between the first metal layer 10 in the extension region 8 and the first metal layer 10 in the body region 7 is equal to the thickness difference, but the height difference between the first metal layer 10 in the extension region 8 and the first metal layer 10 in the body region 7 can be effectively reduced compared to the first embodiment.
EXAMPLE III
As shown in fig. 6, the present embodiment further provides a display panel 1 to be cut, which is different from the previous embodiment in that the display panel 1 to be cut further includes a filling metal layer 19 located between the first insulating layer 9 and the substrate 14 (or the buffer layer 15) and located in the extension region 8; the filling metal layer 19 is insulated from the second metal layer 11, and the stability of the filling metal layer 19 is greater than that of the second metal layer 11.
Specifically, the filling metal layer 19 may be disposed on the same layer as the second metal layer 11, or on the same layer as the third metal layer 13, and the thickness of the filling metal layer 19 is equivalent to the sum of the thicknesses of the second metal layer 11 and the third metal layer 13, so as to compensate for a height difference between the first metal layer 10 located in the body region 7 and the first metal layer 10 located in the extension region 8, improve the surface flatness of the pad structure, and thus improve the bonding effect.
Specifically, the material of the filling metal layer 19 may be the same as the material of the first metal layer 10, such as indium tin oxide.
Example four
As shown in fig. 7, the present embodiment further provides a display panel 1 to be cut, which is different from the second embodiment in that the display panel 1 to be cut further includes a metal filling layer 19 located between the first insulating layer 9 and the second insulating layer 12 and located in the extension region 8; the filling metal layer 19 is insulated from the second metal layer 11, and the stability of the filling metal layer 19 is greater than that of the second metal layer 11.
Specifically, the sum of the thicknesses of the filling metal layer 19 and the second insulating layer 12 in the extension region 8 is equal to the thickness of the second metal layer 11, so that the height of the first metal layer 10 in the extension region 8 is equal to the height of the first metal layer 10 in the body region 7, which can effectively improve the surface flatness of the pad structure, thereby effectively improving the bonding effect.
Specifically, the material of the filling metal layer 19 may be the same as the material of the first metal layer 10, such as indium tin oxide.
EXAMPLE five
As shown in fig. 8 and 9, an embodiment of the present application further provides a display panel 1 to be cut, which is different from any one of the first embodiment, the second embodiment, the third embodiment and the fourth embodiment in that a plurality of second through holes 17 are provided on the first insulating layer 9 located in the extension region 8, and the first metal layer 10 is further located in the second through holes 17.
It should be noted that, in the embodiment of the present application, only fig. 9 (modified from embodiment two) is taken as an example for schematic description, and the second through hole 17 in the embodiment of the present application may also be provided in addition to embodiment one, embodiment three, or embodiment four.
In one embodiment, the first through holes 16 and the second through holes 17 have the same pore diameter, and the distribution density of the first through holes 16 is the same as the distribution density of the second through holes 17.
Since the first insulating layer 9 of the body region 7 is provided with the plurality of first through holes 16 (for example, the first through fourth embodiments), and the second insulating layer 12 is provided with the plurality of third through holes 18 (for example, the first embodiment), a small recess structure is formed at a position of the first metal layer 10 corresponding to the first through hole 16 and the third through hole 18, which is beneficial to improving the binding effect. According to the embodiment of the application, the second through holes 17 with the same pore diameter and distribution density as the first through holes 16 are formed in the first insulating layer 9 of the extension area 8, so that small concave structures are formed at positions, corresponding to the second through holes 17, of the first metal layer 10 located in the extension area 8, the surface structures of the first metal layer 10 located in the extension area 8 and the surface structure of the first metal layer 10 located in the main body area 7 are the same, the uniformity is improved, and the binding effect is favorably improved.
EXAMPLE six
As shown in fig. 10, the present embodiment further provides a display panel 1 to be cut, which is different from any one of the first embodiment, the second embodiment, the third embodiment, the fourth embodiment and the fifth embodiment in that the width of at least a part of the extension region 8 close to the region 5 to be cut in the extension region 8 is smaller than the width of the body region 7. It should be noted that fig. 10 is only an exemplary illustration.
In one embodiment, the width of the entire extension region 8 is narrowed; in another embodiment, only the part of the extension 8 near the zone 5 to be cut is narrowed in width. Specifically, a single side of each extension region 8 may be hollowed out to achieve narrowing of the extension region 8, and a double side of each extension region 8 may be hollowed out to achieve narrowing of the extension region 8.
Because the extension zone 8 is close with the distance between the district 5 of waiting to cut, if the distance of the first metal layer 10 of adjacent extension zone 8 is too close, when treating the cutting district 5 and cutting, appear risks such as short circuit easily, this application embodiment narrows down the width of extension zone 8 for distance between the first metal layer 10 of adjacent extension zone 8 increases, causes the short circuit when avoiding cutting.
EXAMPLE seven
As shown in fig. 11, an embodiment of the present application further provides a display panel 20, where the display panel 20 includes a structure of the display panel 1 to be cut in the region 5 to be cut according to any of the foregoing embodiments.
It is understood that the display panel 20 in this embodiment does not have a region to be cut, and other structures refer to the description in the foregoing embodiments and are not described herein again.
In the display panel 20 provided in this embodiment, compared with the conventional structure, the distance between the first metal layer 10 with stronger stability and the edge of the cutting line is reduced; due to the fact that the stability of the first metal layer 10 is strong, the cutting risk cannot be increased by properly shortening the distance between the first metal layer 10 and the cutting edge, and narrow frames are facilitated to be achieved; in addition, the first metal layer 10 extends towards the cutting line side relative to the second metal layer 11 and the third metal layer 13, so that the area of the first metal layer 10 is increased, namely, the binding area is increased, and the binding effect is favorably improved.
Example eight
As shown in fig. 11 and 12, the present embodiment further provides a display device 21, including the display panel 20 and the circuit board 22 described in the seventh embodiment; wherein the circuit board 22 is bonded to the first metal layer in the bonding region 4.
Specifically, the circuit board 22 may be a flexible circuit board (FPC) or a Chip On Film (COF).
Specifically, the circuit board 22 and the first metal layer of the bonding region are bonded and connected by a conductive adhesive (e.g., ACF adhesive).
In the embodiment, compared with the traditional structure, the distance between the first metal layer with stronger stability and the cutting edge is reduced; due to the fact that the stability of the first metal layer is strong, the cutting risk cannot be increased by properly shortening the distance between the first metal layer and the cutting edge, and narrow frames are facilitated to be achieved; in addition, the first metal layer extends towards the cutting edge relative to the second metal layer and the third metal layer, so that the area of the first metal layer is increased, namely, the binding area is increased, and the binding effect is favorably improved.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The to-be-cut display panel, the display panel and the display device provided by the embodiment of the present application are introduced in detail, a specific example is applied in the present application to explain the principle and the implementation manner of the present application, and the description of the above embodiment is only used to help understanding the technical scheme and the core idea of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.
Claims (10)
1. A display panel to be cut is characterized by comprising a binding area and a to-be-cut area adjacent to the binding area; the binding area comprises a plurality of pad areas which are sequentially arranged at intervals; each pad area comprises a main body area and an extension area extending from the main body area towards the direction of the area to be cut;
the display panel to be cut comprises a substrate positioned in the binding region, a first insulating layer, a first metal layer and a second metal layer, wherein the first insulating layer and the first metal layer are positioned in the main body region and the extension region and are sequentially arranged on the substrate, and the second metal layer is positioned in the main body region and is positioned between the substrate and the first insulating layer; the first metal layer is electrically connected with the second metal layer, and the stability of the first metal layer is greater than that of the second metal layer;
the distance between the main body area and the area to be cut is greater than or equal to a preset safety distance, and the distance between the extension area and the area to be cut is greater than or equal to 0 and smaller than the preset safety distance.
2. A display panel to be cut as claimed in claim 1 further comprising a second insulating layer located in the extension region and between the first insulating layer and the substrate.
3. The display panel to be cut according to claim 1, wherein the display panel to be cut further comprises a second insulating layer located in the main body region and the extension region and located on a side of the second metal layer away from the first insulating layer, and a third metal layer located in the main body region and located between the second insulating layer and the substrate;
the second metal layer is electrically connected to the third metal layer.
4. A display panel to be cut as claimed in claim 1, further comprising a filler metal layer located in the extension region and between the first insulating layer and the substrate; the filling metal layer and the second metal layer are arranged in an insulating mode, and the stability of the filling metal layer is larger than that of the second metal layer.
5. The display panel to be cut according to claim 1, wherein a plurality of first through holes are formed in the first insulating layer in the body region, and the first metal layer is electrically connected to the second metal layer through the plurality of first through holes;
and a plurality of second through holes are formed in the first insulating layer in the extension area, and the first metal layer is also positioned in the second through holes.
6. A display panel to be cut according to claim 5, wherein the first through holes and the second through holes have the same aperture, and the distribution density of the first through holes is the same as the distribution density of the second through holes.
7. A display panel as claimed in claim 1, characterized in that the width of at least the part of the extension area close to the area to be cut is smaller than the width of the body area.
8. The display panel to be cut according to claim 1, wherein the material of the first metal layer comprises indium tin oxide, and the material of the second metal layer comprises any one of molybdenum and aluminum.
9. A display panel comprising a structure of the display panel to be cut according to any one of claims 1 to 8 after the display panel to be cut is cut in the region to be cut.
10. A display device comprising the display panel according to claim 9 and a circuit board; the circuit board is bound and connected with the first metal layer located in the binding area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210102963.7A CN114460773B (en) | 2022-01-27 | 2022-01-27 | Display panel to be cut, display panel and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210102963.7A CN114460773B (en) | 2022-01-27 | 2022-01-27 | Display panel to be cut, display panel and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114460773A true CN114460773A (en) | 2022-05-10 |
| CN114460773B CN114460773B (en) | 2023-09-26 |
Family
ID=81410696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210102963.7A Active CN114460773B (en) | 2022-01-27 | 2022-01-27 | Display panel to be cut, display panel and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114460773B (en) |
Citations (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07169447A (en) * | 1994-08-19 | 1995-07-04 | Seiko Electronic Components Ltd | Manufacture of flat type battery |
| KR20000037893A (en) * | 1998-12-03 | 2000-07-05 | 윤종용 | Liquid crystal display |
| JP2000193986A (en) * | 1998-12-28 | 2000-07-14 | Seiko Epson Corp | Method and device for manufacturing liquid crystal device |
| US20080099763A1 (en) * | 2006-10-27 | 2008-05-01 | Hannstar Display Corp. | Display panel |
| CN108227318A (en) * | 2018-01-15 | 2018-06-29 | 武汉华星光电技术有限公司 | The method for preventing the short circuit of flexible PCB pin |
| CN108352139A (en) * | 2015-11-06 | 2018-07-31 | 夏普株式会社 | The manufacturing method of display base plate, display device and display base plate |
| CN108873422A (en) * | 2018-08-29 | 2018-11-23 | 厦门天马微电子有限公司 | Array substrate, display panel and its cutting method |
| CN109307961A (en) * | 2018-10-29 | 2019-02-05 | 武汉华星光电技术有限公司 | Display panel circuit structure |
| CN208999706U (en) * | 2018-08-27 | 2019-06-18 | 惠科股份有限公司 | Display panel and display device |
| CN110796980A (en) * | 2019-11-29 | 2020-02-14 | 上海天马有机发光显示技术有限公司 | Display panel and display device |
| CN211506123U (en) * | 2019-12-19 | 2020-09-15 | 北京京东方技术开发有限公司 | Array substrate, display panel and display device |
| CN111755624A (en) * | 2020-06-24 | 2020-10-09 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| CN111900174A (en) * | 2020-07-27 | 2020-11-06 | 滁州惠科光电科技有限公司 | Array substrate, manufacturing method thereof and display device |
| CN111915984A (en) * | 2019-05-09 | 2020-11-10 | 上海和辉光电有限公司 | Display device |
| WO2020233339A1 (en) * | 2019-05-17 | 2020-11-26 | 京东方科技集团股份有限公司 | Display device and manufacturing method thereof |
| CN212135113U (en) * | 2020-05-15 | 2020-12-11 | 京东方科技集团股份有限公司 | Array substrate, liquid crystal display panel and display device |
| CN112289814A (en) * | 2020-10-29 | 2021-01-29 | 昆山国显光电有限公司 | Array substrate, preparation method thereof and display device |
| CN113156727A (en) * | 2021-04-29 | 2021-07-23 | 惠科股份有限公司 | Array substrate, liquid crystal display panel and liquid crystal display device |
| WO2021164360A1 (en) * | 2020-02-21 | 2021-08-26 | 华为技术有限公司 | Display module and display apparatus |
| CN113436541A (en) * | 2021-07-14 | 2021-09-24 | 武汉华星光电技术有限公司 | Display panel and display device |
| CN113556867A (en) * | 2021-06-21 | 2021-10-26 | 昆山工研院新型平板显示技术中心有限公司 | Flexible circuit board, display panel and preparation method of display panel |
| CN113763816A (en) * | 2021-09-07 | 2021-12-07 | 京东方科技集团股份有限公司 | Display panel, manufacturing method thereof and display device |
| CN113793862A (en) * | 2021-09-13 | 2021-12-14 | 京东方科技集团股份有限公司 | Display panel, display module and preparation method thereof |
-
2022
- 2022-01-27 CN CN202210102963.7A patent/CN114460773B/en active Active
Patent Citations (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07169447A (en) * | 1994-08-19 | 1995-07-04 | Seiko Electronic Components Ltd | Manufacture of flat type battery |
| KR20000037893A (en) * | 1998-12-03 | 2000-07-05 | 윤종용 | Liquid crystal display |
| JP2000193986A (en) * | 1998-12-28 | 2000-07-14 | Seiko Epson Corp | Method and device for manufacturing liquid crystal device |
| US20080099763A1 (en) * | 2006-10-27 | 2008-05-01 | Hannstar Display Corp. | Display panel |
| CN108352139A (en) * | 2015-11-06 | 2018-07-31 | 夏普株式会社 | The manufacturing method of display base plate, display device and display base plate |
| CN108227318A (en) * | 2018-01-15 | 2018-06-29 | 武汉华星光电技术有限公司 | The method for preventing the short circuit of flexible PCB pin |
| CN208999706U (en) * | 2018-08-27 | 2019-06-18 | 惠科股份有限公司 | Display panel and display device |
| CN108873422A (en) * | 2018-08-29 | 2018-11-23 | 厦门天马微电子有限公司 | Array substrate, display panel and its cutting method |
| CN109307961A (en) * | 2018-10-29 | 2019-02-05 | 武汉华星光电技术有限公司 | Display panel circuit structure |
| CN111915984A (en) * | 2019-05-09 | 2020-11-10 | 上海和辉光电有限公司 | Display device |
| WO2020233339A1 (en) * | 2019-05-17 | 2020-11-26 | 京东方科技集团股份有限公司 | Display device and manufacturing method thereof |
| CN110796980A (en) * | 2019-11-29 | 2020-02-14 | 上海天马有机发光显示技术有限公司 | Display panel and display device |
| CN211506123U (en) * | 2019-12-19 | 2020-09-15 | 北京京东方技术开发有限公司 | Array substrate, display panel and display device |
| WO2021164360A1 (en) * | 2020-02-21 | 2021-08-26 | 华为技术有限公司 | Display module and display apparatus |
| CN212135113U (en) * | 2020-05-15 | 2020-12-11 | 京东方科技集团股份有限公司 | Array substrate, liquid crystal display panel and display device |
| CN111755624A (en) * | 2020-06-24 | 2020-10-09 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| CN111900174A (en) * | 2020-07-27 | 2020-11-06 | 滁州惠科光电科技有限公司 | Array substrate, manufacturing method thereof and display device |
| CN112289814A (en) * | 2020-10-29 | 2021-01-29 | 昆山国显光电有限公司 | Array substrate, preparation method thereof and display device |
| CN113156727A (en) * | 2021-04-29 | 2021-07-23 | 惠科股份有限公司 | Array substrate, liquid crystal display panel and liquid crystal display device |
| CN113556867A (en) * | 2021-06-21 | 2021-10-26 | 昆山工研院新型平板显示技术中心有限公司 | Flexible circuit board, display panel and preparation method of display panel |
| CN113436541A (en) * | 2021-07-14 | 2021-09-24 | 武汉华星光电技术有限公司 | Display panel and display device |
| CN113763816A (en) * | 2021-09-07 | 2021-12-07 | 京东方科技集团股份有限公司 | Display panel, manufacturing method thereof and display device |
| CN113793862A (en) * | 2021-09-13 | 2021-12-14 | 京东方科技集团股份有限公司 | Display panel, display module and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114460773B (en) | 2023-09-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111768700B (en) | Display panel and display device | |
| US10692943B2 (en) | Touch organic light-emitting display device and in-cell touch organic light-emitting display device | |
| KR101936109B1 (en) | Display device with micro cover layer and manufacturing method for the same | |
| KR101862529B1 (en) | Flexible display device with wire having reinforced portion and manufacturing method for the same | |
| US10824256B2 (en) | Flexible display and method of manufacturing the same | |
| KR100691589B1 (en) | Display device and method of manufacturing the display device | |
| US9276047B2 (en) | Method for manufacturing flexible display device | |
| US9485857B2 (en) | Flat panel display apparatus and method for manufacturing the same | |
| JP2015002177A (en) | Array substrate, and organic light-emitting display device including the same | |
| US11139363B2 (en) | Display device for preventing cracks caused by bending stress and apparatus for manufacturing the same for reducing number of mask process | |
| US20220005908A1 (en) | Display panel | |
| CN111261643A (en) | Flexible display panel and preparation method | |
| US20210175313A1 (en) | Organic light-emitting diode display panel | |
| CN112951849B (en) | Display panel and preparation method thereof | |
| CN114460773A (en) | Display panel to be cut, display panel and display device | |
| US12068214B2 (en) | Display panel with grooves and manufacturing method thereof | |
| US10693087B2 (en) | Display panel with a metal wire array disposed on the bending region of a flexible substrate | |
| CN113424247A (en) | Device having resin substrate and method for manufacturing the same | |
| CN111341790B (en) | Display device and manufacturing method thereof | |
| US9904087B2 (en) | Liquid crystal display | |
| KR20170076204A (en) | Flexible Display Device and Method for Manufacturing the Same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |