CN114456573A - Low-dielectric-constant modified polyphenyl ether resin and boron nitride composite material - Google Patents
Low-dielectric-constant modified polyphenyl ether resin and boron nitride composite material Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
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Abstract
The invention provides a low dielectric constant modified polyphenyl ether resin and boron nitride composite material, which comprises modified polyphenyl ether resin, boron nitride, an inorganic filler, an antioxidant, a compatilizer and a microporous material as raw materials, wherein the polyphenyl ether resin comprises fluorination modification in the modification process, so that the free volume of a polymer in the material is increased, the dielectric constant of the prepared material is 1.5-2.2, and the structural signal prepared by using the material has the advantages of timely transmission, small noise interference, low power loss and the like. And the fluidity and the sensitivity to temperature of the polyphenylene oxide resin can be greatly improved by modifying the polyphenylene oxide resin, and the tensile strength of the composite material is improved.
Description
Technical Field
The invention belongs to the field of modification of materials for communication, and particularly relates to a low-dielectric-constant modified polyphenyl ether resin and boron nitride composite material.
Background
The low dielectric material is beneficial to better transmission of electromagnetic signals, so that the scientific communities and the industrial communities around the world have realized the importance of the development of the 5G material, and research and development are being focused on the low dielectric and low loss reinforced modified material with high cost performance, environmental friendliness and health.
With the development of the 5G communication technology, the method is widely applied to the fields of smart phones, tablet computers, notebook computers, wearable devices, smart homes, smart home appliances, smart media, smart automobiles, smart traffic and the like. Meanwhile, the demand for low dielectric constant materials matched with 5G communication equipment is urgent. The dielectric constant has a great influence on the signal transmission speed, signal delay, signal loss, etc. of 5G communication centimeter waves, and in the case of 5G high-frequency transmission, a material with a low dielectric constant and low dielectric loss has a great application in the aspect of a cover.
The modified plastic can be used for parts such as an outer frame, a keyboard, a rear cover, a middle frame and a bracket of equipment in the 5G era, and has the functions of coating, decorating, supporting, connecting and the like of a shell, such as a 5G base station antenna housing, a filter, an antenna oscillator, a mobile phone rear cover and a middle frame and the like. The modified plastic used in 5G products has the characteristics of aesthetic design, light weight, high strength, impact resistance, high and low temperature resistance and the like, and also needs to approach or meet the requirement of the industry on the dielectric constant (epsilon) of less than or equal to 3 for 5G communication materials. For a modified material, its dielectric properties such as dielectric constant and dielectric loss are inherent, and are generally determined by the composition of the medium itself and the microstructure of the material. The dielectric constant can be judged according to the polarity of the high polymer material: the epsilon of non-polar or low-polar polypropylene, polyphenylene oxide resin, polyethylene, polystyrene, polytetrafluoroethylene and the like is less than 3; the e of more polar polyamides, polyesters, etc. is generally greater than 3.6.
Polyphenylene oxide resin (PPO) is one of five common engineering plastics in the world. It has the advantages of high rigidity, high heat resistance, high strength, high fire resistance, excellent electrical performance, etc. In addition, PPO also has the advantages of wear resistance, no toxicity, pollution resistance and the like. The dielectric constant and dielectric loss of PPO are one of the smallest varieties in engineering plastics and are hardly influenced by temperature and humidity. Polyphenylene ethers, however, are newtonian-like fluids, have poor flow properties, are relatively temperature sensitive in viscosity, and are highly susceptible to decomposition. Therefore, the processing and molding properties of the polyphenyl ether are extremely poor, and the pure polyphenyl ether cannot be molded by adopting an injection method, so that the application of the polyphenyl ether is limited to a great extent. The fluidity of PPO can be improved to a certain extent by adding fillers such as talcum powder or mica, but the mechanical property and the thermodynamic property of PPO are reduced by the fillers, so that the performance requirements of some fields cannot be met.
Polyphenylene ether resins having low polarity are considered as ideal materials for housings of 5G communication devices because they have low density and low dielectric constant (e.g., 2.58). Patent CN109705284A discloses a polyphenylene ether resin composition with low dielectric constant and prepreg prepared from the same, which is used for Printed Circuit Boards (PCBs), wherein the dielectric constant is less than 4.0, and the dielectric loss is reduced to less than 0.003.
However, low dielectric constant materials typically have a dielectric constant of at least less than 3, and the dielectric constant of the materials of the present invention prepared in my laboratory is between 2.1 and 2.6.
Disclosure of Invention
The invention aims to provide a modified polyphenyl ether resin and boron nitride composite material with low dielectric constant, low dielectric loss and high thermal conductivity aiming at the characteristics that the dielectric constant of materials of a shell, a bracket and a cover plate is higher than 3.0, the dielectric loss is higher than 1 percent and the thermal conductivity is insufficient in the prior art.
In order to achieve the purposes, the specific scheme is as follows:
a low dielectric constant modified polyphenyl ether resin and boron nitride composite material comprises modified polyphenyl ether resin, boron nitride, inorganic filler, antioxidant, compatilizer and microporous material, and the specific formula is as follows:
preferably, the modified polyphenylene ether resin is prepared by preparing polyphenylene ether and polystyrene under the catalysis of a fluoride catalyst, and the specific preparation method comprises the following steps: adding 100 parts by weight of polyphenyl ether, 30-50 parts by weight of polystyrene, 3-5 parts by weight of zinc borate, 1-3 parts by weight of potassium hydrogen fluoride and 5-8 parts by weight of maleic anhydride into a reaction kettle, uniformly stirring, then carrying out temperature programming heating at a heating speed of 5-8 ℃/min to 220-280 ℃, keeping the temperature for 30-45 minutes, stopping heating for 3-5 minutes, rapidly cooling to room temperature at a speed of 8-15 ℃/min, taking out from the reaction kettle and fixing to obtain the modified polyphenyl ether resin.
Preferably, the inorganic filler is a mixture of nano aluminum hydroxide, nano magnesium hydroxide and glass fiber, preferably, the ratio of nano aluminum hydroxide: nano magnesium hydroxide: the mass ratio of the glass fiber is 1: 2-5: 15-26.
The antioxidant comprises a main antioxidant and an auxiliary antioxidant, wherein the main antioxidant is 3, 5-di-tert-butyl-4-hydroxybenzyl methyl ether and accounts for 60-80% of the total mass of the antioxidant, and the auxiliary antioxidant is a tris (2, 4-di-tert-butylphenyl) phosphite ester antioxidant.
Preferably, the microporous material is a nanosilica aerogel material.
Preferably, the compatilizer is prepared by grafting maleic anhydride (PPO-g-MAH) with polyphenyl ether with a grafting rate of 1.0-1.7%.
Preferably, the boron nitride is hexagonal boron nitride.
A preparation method of a low dielectric constant modified polyphenyl ether resin and boron nitride composite material comprises the following steps: a. preparing modified polyphenyl ether resin; b. preparing inorganic filler according to the mixture ratio; c. mixing and stirring the modified polyphenyl ether resin prepared in the step a, boron nitride, the inorganic filler prepared in the step b, an antioxidant, a compatilizer and a microporous material for 5-10 min to obtain a mixed material; d. heating the mixed materials in an environment of 190-230 ℃, wherein the heating time lasts for 30-50 min; and e, extruding strip materials, cooling the extruded strip materials to 60-70 ℃ through a cooling water tank, and then, cutting into granules, then, washing the granules in absolute ethyl alcohol, and drying to obtain the low dielectric constant modified polyphenyl ether resin and boron nitride composite material.
Preferably, in step c, the modified polyphenylene ether resin prepared in step a and the microporous material are mixed to form a material A, the inorganic filler prepared in step B, boron nitride, the antioxidant and the compatilizer are mixed to form a material B, and then the material A and the material B are mixed.
The advantages and the principle of the invention are as follows:
1. according to the invention, the polyphenyl ether resin is modified, so that the fluidity and the temperature sensitivity of the polyphenyl ether resin can be greatly improved, the tensile strength of the prepared composite material is improved, and the flame retardance of the polyphenyl ether resin is improved.
2. The inorganic filler of the invention can not only greatly reduce the polarity of the material, but also improve the flame retardant property and the injection molding property of the material.
3. The main antioxidant and the auxiliary antioxidant are combined, so that the prepared material has prolonged service life, stable performance at the temperature of 0-90 ℃ and strong ageing resistance, and the service life of the material is 1.5-2 times that of a common material.
4. The polyphenylene oxide resin comprises fluorination modification in the modification process, the free volume of a polymer in the material is increased, the dielectric constant of the prepared material is 1.5-2.2, and the structure prepared from the material has the advantages of timely signal transmission, small noise interference, low power loss and the like.
5. The PPO-g-MAH is used as a compatilizer, so that the compatibility of the modified polyphenylene oxide resin, silicon nitride and an inorganic filler is improved, the free volume of a polymer in the prepared material is increased, the dielectric constant of the material is reduced, the mechanical property of the material is improved, and the advantages in the scraping resistance are obvious.
6. The nano-silica aerogel material is adopted as a microporous material to be added into the material, so that the free volume of a polymer in the material is increased, the dielectric constant of the material is reduced, the nano-silica aerogel material is combined with the modified polyphenylene ether resin, the mechanical property of the material is improved, particularly the advantages of extremely high flexural modulus and elongation at break are achieved, and the corresponding confirmation can be obtained through subsequent embodiments.
Detailed Description
The technical solution of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
A first part:
preparation of modified polyphenylene ether resin: adding 100 parts by weight of polyphenyl ether, 30-50 parts by weight of polystyrene, 3-5 parts by weight of zinc borate, 1-3 parts by weight of potassium hydrogen fluoride and 5-8 parts by weight of maleic anhydride into a reaction kettle, uniformly stirring, then carrying out temperature programming heating at a heating speed of 5-8 ℃/min to 220-280 ℃, keeping the temperature for 30-45 minutes, stopping heating for 3-5 minutes, rapidly cooling to room temperature at a speed of 8-15 ℃/min, taking out from the reaction kettle and fixing to obtain the modified polyphenyl ether resin.
Preparing an inorganic filler A: 1 part by weight of nano aluminum hydroxide, 3-4 parts by weight of nano magnesium hydroxide and 18-22 parts by weight of glass fiber, and uniformly mixing.
Preparing an antioxidant combination a: and (2) uniformly mixing 6-8 parts by weight of 3, 5-di-tert-butyl-4-hydroxybenzyl methyl ether and 2-4 parts by weight of tris (2, 4-di-tert-butylphenyl) phosphite to prepare the antioxidant combination a.
Example 1:
the specific formula is as follows:
the preparation method comprises the following steps: 1) mixing and stirring modified polyphenyl ether resin, hexagonal boron nitride, an inorganic filler A, an antioxidant composition a, a compatilizer and a microporous material for 5-10 min to obtain a mixed material; 2) heating the mixed materials in an environment of 190-230 ℃, wherein the heating time lasts for 30-50 min; extruding strip-shaped materials, wherein the section diameter of each strip-shaped material is 2-6mm, and 3) cooling the extruded strip-shaped materials through a cooling water tank to 60-70 ℃, cutting into granules, wherein the particle size is 2-5mm, washing the granules in absolute ethyl alcohol, and drying to obtain the low dielectric constant modified polyphenyl ether resin and boron nitride composite material of the embodiment 1.
Examples 2 to 8 were prepared in the same manner as in example 1 except that the modified polyphenylene ether resin was used in an amount different from that of example 1.
The low dielectric constant modified polyphenylene ether resin and boron nitride composites of examples 1-8 were prepared by the formulations in the following tables:
comparative examples 1 to 8 the formulations and preparation methods corresponding to examples 1 to 8 were the same, but using a general polyphenylene ether resin, the specific formulations were as follows:
the materials prepared in examples 1 to 8 and the materials prepared in comparative examples 1 to 8 were respectively processed into 5G equipment cover plates, the thickness of the cover plates ranged from 0.1 to 12mm, and the performance test results of the cover plates were as follows:
the materials prepared in comparative examples 1-8 were processed into 5G equipment covers and the test results were as follows:
from the data, the material processed by the modified polyphenylene ether resin has obvious advantages in mechanical and mechanical properties compared with the common polyphenylene ether resin. The materials of examples 1-8 were superior in tensile strength, flexural modulus, and elongation at break, and slightly superior in electrical properties, but not quite as significant.
A second part:
preparation of a first group of modified polyphenylene ether resins: adding 100 parts by weight of polyphenyl ether, 30-50 parts by weight of polystyrene, 3-5 parts by weight of zinc borate and 5-8 parts by weight of maleic anhydride into a reaction kettle, uniformly stirring, carrying out programmed heating at a heating speed of 5-8 ℃/min to heat to 220-280 ℃, keeping the temperature for 30-45 minutes, stopping heating for 3-5 minutes, rapidly cooling to room temperature at a speed of 8-15 ℃/min, and taking out from the reaction kettle for fixation to obtain the first group of modified polyphenyl ether resin.
Preparation of a second group of modified polyphenylene ether resins: adding 100 parts by weight of polyphenyl ether and 1-3 parts by weight of potassium hydrogen fluoride into a reaction kettle, uniformly stirring, then carrying out temperature programming heating at the heating speed of 5-8 ℃/min to 220-280 ℃, keeping the temperature for 30-45 minutes, stopping heating for 3-5 minutes, then rapidly cooling to room temperature at the speed of 8-15 ℃/min, taking out from the reaction kettle and fixing to obtain a second group of modified polyphenyl ether resin.
Inorganic filler A and antioxidant combination a are the same as in the first part.
Example 9:
the specific formula is as follows:
the preparation method comprises the following steps: 1) mixing and stirring modified polyphenyl ether resin, hexagonal boron nitride, an inorganic filler A, an antioxidant composition a, a compatilizer and a microporous material for 5-10 min to obtain a mixed material; 2) heating the mixed materials in an environment of 190-230 ℃, wherein the heating time lasts for 30-50 min; extruding strip-shaped materials, wherein the section diameter of each strip-shaped material is 2-6mm, and 3) cooling the extruded strip-shaped materials through a cooling water tank to 60-70 ℃, cutting into granules, wherein the particle size is 2-5mm, washing the granules with absolute ethyl alcohol, and drying to obtain the modified polyphenyl ether resin and boron nitride composite material of the embodiment 9.
Examples 10 to 16 were prepared in the same manner as in example 9 except that the first modified polyphenylene ether resin was used in an amount of hexagonal boron nitride and the PPO-g-MAH was used, and comparative examples 9 to 16 used the second modified polyphenylene ether resin.
The specific formula is as follows:
the materials obtained in examples 9 to 16 and the materials obtained in comparative examples 9 to 16 were processed into 5G outer frames of equipment, respectively, the outer frame thickness ranged from 2 to 8mm, and the outer frame performance test results were as follows:
it can be seen from examples 9 to 16 and comparative examples 9 to 16 that the dielectric constants of examples 9 to 16 are significantly higher than those of comparative examples, and from the results of comparison with the properties of examples 1 to 8, it was found that the materials of examples 1 to 9 and comparative examples 1 to 9 are significantly reduced in mechanical properties and the dielectric loss in electrical properties is significantly increased. As can be understood from the data, the first group of modified polyphenylene ether resins and the second group of modified polyphenylene ether resins had much smaller processability than the modified polyphenylene ether resins in the first part.
And a third part:
by adopting the first part of modified polyphenyl ether resin and antioxidant combination a, the inorganic filler is divided into two different components:
preparing an inorganic filler B: 1 part by weight of nano aluminum hydroxide, 3-4 parts by weight of nano magnesium hydroxide and 3-4 parts by weight of glass fiber, and uniformly mixing.
Preparing an inorganic filler C: 1 part by weight of nano aluminum hydroxide and 3-4 parts by weight of glass fiber are uniformly mixed.
Example 17:
the specific formula is as follows:
the preparation method comprises the following steps: 1) mixing and stirring modified polyphenyl ether resin, hexagonal boron nitride, an inorganic filler B, an antioxidant composition a, a compatilizer and a microporous material for 5-10 min to obtain a mixed material; 2) heating the mixed materials in an environment of 190-230 ℃, wherein the heating time lasts for 30-50 min; extruding strip-shaped materials, wherein the section diameter of each strip-shaped material is 2-6mm, and 3) cooling the extruded strip-shaped materials through a cooling water tank to 60-70 ℃, cutting into granules, wherein the particle size is 2-5mm, washing the granules in absolute ethyl alcohol, and drying to obtain the composite material of the embodiment 17.
Examples 18 to 24 were prepared in the same manner as in example 17 except that the inorganic filler B and the modified polyphenylene ether resin were used in different amounts, and comparative examples 18 to 24 used the inorganic filler C.
The specific formula is as follows:
the materials prepared in examples 17-24 and the materials prepared in comparative examples 17-24 were processed into 5G device racks, respectively, with outer frame thicknesses ranging from 3 to 10mm, and the rack performance test results were as follows:
as can be seen from the test data, the performance of examples 17-24 and comparative examples 17-24 is not significantly different, but is significantly inferior to that of examples 1-8 in terms of mechanical properties, so that the formulation of the inorganic filler has a critical role in material properties.
The fourth part:
the other raw materials used, as the first part, have the following differences in antioxidant combination formula:
an antioxidant combination b: and (2) uniformly mixing 2-4 parts by weight of 3, 5-di-tert-butyl-4-hydroxybenzyl methyl ether and 2-4 parts by weight of tris (2, 4-di-tert-butylphenyl) phosphite to prepare the antioxidant combination b.
An antioxidant combination c: and (3) uniformly mixing 6-8 parts by weight of 3, 5-di-tert-butyl-4-hydroxybenzyl methyl ether and 12-16 parts by weight of tris (2, 4-di-tert-butylphenyl) phosphite to prepare the antioxidant combination c.
Example 25:
the specific formula is as follows:
the preparation method comprises the following steps: 1) mixing and stirring modified polyphenyl ether resin, hexagonal boron nitride, an inorganic filler A, an antioxidant combination b, a compatilizer and a microporous material for 5-10 min to obtain a mixed material; 2) heating the mixed materials in an environment of 190-230 ℃, wherein the heating time lasts for 30-50 min; extruding strip-shaped materials, wherein the section diameter of each strip-shaped material is 2-6mm, and 3) cooling the extruded strip-shaped materials through a cooling water tank to 60-70 ℃, cutting into granules, wherein the particle size is 2-5mm, washing the granules in absolute ethyl alcohol, and drying to obtain the composite material of the embodiment 25.
The preparation methods of examples 26 to 32 were the same as in example 25 except that the antioxidant composition b was used in different amounts of the modified polyphenylene ether resin, and the antioxidant compositions c were used in comparative examples 18 to 24.
The specific formula is as follows:
the materials prepared in examples 25 to 32 and the materials prepared in comparative examples 25 to 32 were processed into 5G equipment covers, respectively, the thickness of the covers ranged from 2 to 5mm, and the results of the performance test on the covers were as follows:
from the fourth test data, the mechanical and electrical properties of examples 25-32 are superior to those of comparative examples 25-32, but the mechanical and electrical properties of examples 1-8 are more advantageous.
The fifth part is that:
examples 33-39 all used the first part of the raw materials, and the different formulations were composed due to the different amounts of the raw materials, the preparation method was the same as example 1, and the specific formulation was as follows:
the materials prepared in examples 33-39 were processed to 5G equipment covers, 0.5-2mm thick, and the properties of the covers were further improved
The results of the row tests are as follows:
the formula of the invention has the advantages that the prepared material has outstanding advantages in mechanical property and electrical property, is superior to the existing PMMA material in scratch resistance, has outstanding convenience in preparing the cover plate, low dielectric constant, low dielectric loss and high thermal conductivity, and can be widely applied to the fields of 5G cover plates, supports and the like.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A low dielectric constant modified polyphenyl ether resin and boron nitride composite material comprises modified polyphenyl ether resin, boron nitride, inorganic filler, antioxidant, compatilizer and microporous material, and the specific formula is as follows:
2. the low dielectric constant modified polyphenylene ether resin and boron nitride composite material according to claim 1, wherein: the modified polyphenyl ether resin is prepared by polyphenyl ether and polystyrene under the catalysis of a fluoride catalyst.
3. The low dielectric constant modified polyphenylene ether resin and boron nitride composite material according to claim 2, wherein: the specific preparation method of the modified polyphenylene ether resin comprises the following steps: adding 100 parts by weight of polyphenyl ether, 30-50 parts by weight of polystyrene, 3-5 parts by weight of zinc borate, 1-3 parts by weight of potassium hydrogen fluoride and 5-8 parts by weight of maleic anhydride into a reaction kettle, uniformly stirring, then carrying out temperature programming heating at a heating speed of 5-8 ℃/min to 220-280 ℃, keeping the temperature for 30-45 minutes, stopping heating for 3-5 minutes, rapidly cooling to room temperature at a speed of 8-15 ℃/min, taking out from the reaction kettle and fixing to obtain the modified polyphenyl ether resin. .
4. The low dielectric constant modified polyphenylene ether resin and boron nitride composite material according to claim 1, wherein: the inorganic filler is a mixture of nano aluminum hydroxide, nano magnesium hydroxide and glass fiber.
5. The low dielectric constant modified polyphenylene ether resin and boron nitride composite material according to claim 4, wherein: nano aluminum hydroxide: nano magnesium hydroxide: the mass ratio of the glass fiber is 1: 2-5: 15-26. .
6. The low dielectric constant modified polyphenylene ether resin and boron nitride composite material according to claim 3, wherein: the antioxidant comprises a main antioxidant and an auxiliary antioxidant, wherein the main antioxidant is 3, 5-di-tert-butyl-4-hydroxybenzyl methyl ether and accounts for 60-80% of the total mass of the antioxidant, and the auxiliary antioxidant is tris (2, 4-di-tert-butylphenyl) phosphite ester.
7. The low dielectric constant modified polyphenylene ether resin and boron nitride composite material according to claim 1, wherein: the microporous material is a nano-silica aerogel material.
8. The low dielectric constant modified polyphenylene ether resin and boron nitride composite material according to claim 1, wherein: the compatilizer is prepared by grafting maleic anhydride (PPO-g-MAH) with polyphenyl ether with the grafting rate of 1.0-1.7%.
9. A method for preparing a low dielectric constant modified polyphenylene ether resin and boron nitride composite material according to any one of claims 1 to 8, characterized in that: the preparation method comprises the following steps: a. preparing modified polyphenyl ether resin; b. preparing inorganic filler according to the mixture ratio; c. mixing and stirring the modified polyphenyl ether resin prepared in the step a, boron nitride, the inorganic filler prepared in the step b, an antioxidant, a compatilizer and a microporous material for 5-10 min to obtain a mixed material; d. heating the mixed materials in an environment of 190-230 ℃, wherein the heating time lasts for 30-50 min; and e, extruding strip-shaped materials, cooling the extruded strip-shaped materials to 60-70 ℃ through a cooling water tank, starting to cut granules, then washing the granules in absolute ethyl alcohol, and drying to obtain the low dielectric constant modified polyphenyl ether resin and boron nitride composite material.
10. A method for preparing a low dielectric constant modified polyphenylene ether resin and boron nitride composite material according to any one of claims 1 to 8, characterized in that: the preparation steps are as follows: a. preparing modified polyphenyl ether resin; b. preparing inorganic filler according to the mixture ratio; c. firstly mixing the modified polyphenyl ether resin prepared in the step a and the microporous material to obtain a material A, mixing the inorganic filler prepared in the step B, boron nitride, an antioxidant and a compatilizer to obtain a material B, and then mixing the material A and the material B; d. heating the mixed materials in an environment of 190-230 ℃, wherein the heating time lasts for 30-50 min; and e, extruding strip materials, cooling the extruded strip materials to 60-70 ℃ through a cooling water tank, and then, cutting into granules, then, washing the granules in absolute ethyl alcohol, and drying to obtain the low dielectric constant modified polyphenyl ether resin and boron nitride composite material.
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| CN118725538A (en) * | 2024-09-02 | 2024-10-01 | 河北省科学院能源研究所 | Low-dielectric heat-conducting polyphenyl ether composite material and preparation method thereof |
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2022
- 2022-01-27 CN CN202210099030.7A patent/CN114456573A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118725538A (en) * | 2024-09-02 | 2024-10-01 | 河北省科学院能源研究所 | Low-dielectric heat-conducting polyphenyl ether composite material and preparation method thereof |
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