CN114420832A - Substrate module integrated with piezoelectric component - Google Patents

Abstract

The invention provides a substrate module integrated with a piezoelectric component. The piezoelectric ceramic comprises a substrate, at least one functional block and at least one planar piezoelectric component, wherein each functional block is provided with at least one spacing layer adhered to the back surface of the substrate; the at least one planar piezoelectric component can receive a voltage signal output by a signal source and then generate vibration due to the inverse piezoelectric effect so as to drive the substrate to generate vibration, or can be driven by the vibration or strain of the substrate, so that the planar piezoelectric component generates a response signal due to the piezoelectric effect.

Description

Substrate module integrated with piezoelectric component

Technical Field

The present invention relates to a substrate module integrated with a piezoelectric element, and more particularly, to a substrate module integrated with a piezoelectric element for use on a substrate of a mobile device, a notebook computer, a display or other electronic devices.

Background

In order to achieve the purpose of reducing the size of the conventional electronic product, the piezoelectric element is usually integrated on a circuit substrate or a panel module. For example: the panel of the mobile phone is integrated with a piezoelectric speaker, so that the screen of the mobile phone has the function of the speaker.

The principle of the piezoelectric element is to use the piezoelectric material as a speaker, a vibration generator, or a sensor by the characteristic of the piezoelectric effect of the piezoelectric material. However, the conventional technology of integrating the piezoelectric element into the circuit board or the panel has the problems that the integration of the piezoelectric element is not easy and the function of the integrated piezoelectric element is limited.

Disclosure of Invention

The present invention is directed to solve the problem that the conventional piezoelectric element is not easily integrated on a panel or a circuit board.

To solve the above problems, an embodiment of the present invention provides a substrate module for integrating a piezoelectric device, including a substrate having a front surface and a back surface opposite to each other, the substrate being capable of defining at least one functional block, each of the functional blocks having: at least one spacing layer, wherein the spacing layer is attached to the back surface of the substrate; at least one planar piezoelectric component, wherein one side of the planar piezoelectric component facing the substrate is attached to one side of the spacing layer opposite to the substrate; at least one of the planar piezoelectric components can receive a voltage signal output by a signal source and then generate vibration due to the inverse piezoelectric effect to drive the substrate to generate vibration, or can be driven by the vibration or strain of the substrate, so that the planar piezoelectric component generates a response signal due to the piezoelectric effect.

In a preferred embodiment of the present invention, at least one of the planar piezoelectric elements has at least one piezoelectric vibrator, and at least one of the piezoelectric vibrators includes a piezoelectric material layer and two electrode layers, and the two electrode layers are respectively in contact with two opposite side surfaces of the piezoelectric material layer.

In a preferred embodiment of the present invention, the piezoelectric material layer of the piezoelectric vibrator is a piezoelectric resin film or a piezoelectric ceramic film.

In a preferred embodiment of the present invention, each of the planar piezoelectric elements has one of the piezoelectric vibrators, or has a plurality of the piezoelectric vibrators stacked on each other.

In a preferred embodiment of the present invention, two side surfaces of the spacer layer are respectively attached to the back surface of the substrate and the surface of the planar piezoelectric element through a bonding layer.

In a preferred embodiment of the present invention, the substrate is a flexible substrate or a rigid substrate, when the substrate is a flexible substrate, the young's modulus of the spacer layer is greater than the young's modulus of the substrate, and when the substrate is a rigid substrate, the young's modulus of the spacer layer is less than the young's modulus of the substrate.

In a preferred embodiment of the present invention, at least one of the spacer layers may be a foamed rubber layer resin material layer or a polymer piezoelectric film.

The invention has the advantages that the spacer layer can be used as a connecting layer for arranging the planar piezoelectric component on the back surface of the substrate, on one hand, the planar piezoelectric component can be quickly arranged on the back surface of the substrate, on the other hand, the planar piezoelectric component can be used as a vibration transmission medium to generate a buffering effect, or the aim of adjusting the vibration amplitude or the tone quality can be achieved by changing the material density and the elastic coefficient of the spacer layer.

For a better understanding of the features and technical content of the present invention, reference should be made to the following detailed description of the invention and accompanying drawings, which are provided for purposes of illustration and description only and are not intended to limit the invention.

Drawings

Fig. 1 is an exploded perspective view of a substrate module integrated with a piezoelectric device according to a first embodiment of the invention.

Fig. 2 is a schematic diagram illustrating an operation principle of a substrate module integrated with a piezoelectric device according to a first embodiment of the present invention.

Fig. 3 is an exploded perspective view of a substrate module incorporating a piezoelectric device according to a second embodiment of the present invention.

FIG. 4 is a cross-sectional view of a substrate module incorporating a piezoelectric device according to a second embodiment of the present invention.

FIG. 5 is a cross-sectional view of a substrate module integrated with piezoelectric elements according to a second embodiment of the present invention, with the substrate curved.

Fig. 6 is an exploded perspective view of a substrate module incorporating a piezoelectric device according to a third embodiment of the present invention.

Fig. 7 is an exploded perspective view of a substrate module incorporating a piezoelectric device according to a fourth embodiment of the invention.

FIG. 8 is a cross-sectional view of a substrate module incorporating a piezoelectric device according to a fourth embodiment of the present invention.

Fig. 9 is an exploded perspective view of a substrate module incorporating a piezoelectric device according to a fifth embodiment of the invention.

Fig. 10 is an exploded perspective view of a substrate module incorporating a piezoelectric device according to a sixth embodiment of the invention.

Fig. 11 is a schematic cross-sectional view of a substrate module incorporating a piezoelectric device according to a sixth embodiment of the invention.

Fig. 12 is a schematic cross-sectional view of a substrate module incorporating a piezoelectric device according to a seventh embodiment of the invention.

Fig. 13 is a schematic cross-sectional view of a substrate module incorporating a piezoelectric device according to an eighth embodiment of the invention.

Fig. 14 is a cross-sectional view of a ninth embodiment of a substrate module incorporating a piezoelectric device according to the invention.

Detailed Description

The following description is provided for the embodiments of the "substrate module integrated with piezoelectric element" disclosed in the present application, and those skilled in the art will understand the advantages and effects of the present invention from the disclosure of the present application. The invention is capable of other and different embodiments and its several details are capable of modification and various other changes, which can be made in various details within the specification and without departing from the spirit and scope of the invention. The drawings of the present invention are for illustrative purposes only and are not intended to be drawn to scale. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.

It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are used primarily to distinguish one element from another element or from one signal to another signal. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.

As shown in fig. 1 to 2, a substrate module 1 integrated with a piezoelectric device according to a first embodiment of the present invention is provided, in which the substrate module 1 integrated with a piezoelectric device according to the present invention mainly includes: a substrate 10, at least one spacer layer 20 and at least one planar piezoelectric element 30.

The substrate 10 may be a display panel, a display panel back cover, a display protection cover plate, a circuit carrier plate, or other types of substrates. The substrate 10 may be a flexible plate or a rigid substrate. Specifically, in one embodiment of the present invention, the substrate 10 may be a flexible OLED or MICRO LED display panel, and in another embodiment of the present invention, the substrate 10 may be a rigid liquid crystal display panel, or a protective back cover or a protective cover plate of the display panel. Of course, the type of the substrate 10 of the present invention is not limited to the above-mentioned embodiment.

The substrate 10 has opposite front and back surfaces, the present invention arranges the spacer layer 20 on the back surface of the substrate 10, and arranges the planar piezoelectric element 30 on the side of the spacer layer 20 opposite to the substrate 10.

In this embodiment, the spacer layer 20 includes a substrate layer 21, one side of the substrate layer 21 facing the substrate 10 is bonded to the back surface of the substrate 10 through a bonding layer 22, another bonding layer 22 is disposed facing one side of the planar piezoelectric assembly 30, and the planar piezoelectric assembly 30 is bonded to one side of the spacer layer 20 opposite to the substrate 10 through the bonding layer 22.

The substrate layer 21 may be made of a foam material or a resin layer having elasticity, or a composite material of a polymer material and ceramic or metal particles. When the substrate layer 21 is made of a foamed material, materials that can be listed include: ethylene propylene rubber foam, butyl rubber foam, nitrile rubber foam, natural rubber foam, styrene butadiene rubber foam, silicone resin foam, and the like. When the base material layer 21 is made of a resin material, materials that can be listed include: ethylene propylene rubber layers, butyl rubber layers, nitrile rubber layers, natural rubber, silicone, acrylic resin layers, and the like. When the substrate layer 21 is a composite material in which a resin material or a foamed material and metal particles or ceramic particles are mixed, there may be mentioned the above-listed resin material or foamed material and ceramic particles, such as: particulate materials such as alumina, zirconia, silicon carbide, or metal particles: such as: one or more of copper, aluminum, iron, tungsten and the like.

The bonding layers 22 on both sides of the substrate layer 21 are formed by glue layers or adhesive layers coated on both sides of the substrate layer 21, so that the spacer layer 20 can be viewed as a double-sided tape substantially in plan view, and can be conveniently used for attaching the planar piezoelectric element 30 to the back surface of the substrate 10.

The planar piezoelectric element 30 has at least one piezoelectric vibrator 31, the piezoelectric vibrator 31 includes a piezoelectric material layer 311 and two electrode layers 312 disposed on two sides of the piezoelectric material layer 311, and the two electrode layers 312 respectively contact the piezoelectric material layer 311, so that the two electrode layers 312 can form electrical conduction with two sides of the piezoelectric material layer 311.

The piezoelectric material layer 311 of the piezoelectric vibrator 31 can be made of a polymer piezoelectric film or a piezoelectric ceramic film, and when a polymer piezoelectric film is used, the piezoelectric material layer 311 can be made of: polyvinylidene fluoride, nylon, polyvinyl chloride, polymethyl methacrylate, polypropylene, and the like. When the piezoelectric ceramic film is used as the piezoelectric material layer 311, materials including: lead zirconate, lead zirconate titanate, lead lanthanum zirconate titanate, barium titanate, Bi layered compound, tungsten bronze structured compound, and the like.

The two electrode layers 312 are disposed on two sides of the piezoelectric material layer 311 by evaporation, sputtering, deposition, coating, printing, and the like. The two electrode layers 312 can be made of a conductive nano material layer, a nano metal material layer, a metal oxide conductive layer, a conductive polymer material layer, or a conductive adhesive material layer.

When the electrode layer 312 is made of nano-conductive material or nano-metal, the material types that can be selected include: carbon nanotubes, graphene, carbon nanospheres, nanogold, silver nanowires, metal nanowires, and the like. When the electrode layer 312 is a metal oxide conductive layer, it may be an indium tin oxide layer (ITO). In addition, the electrode layer 312 can also be made of a conductive polymer material or a conductive adhesive, wherein the conductive polymer material can be an intrinsic conductive polymer (intrinsic conductive polymer), such as: polyacetylene, PEDOT. Or a polymer material film doped or mixed with conductive particles.

As shown in fig. 2, the working principle of the planar piezoelectric element 30 of the present invention is that the electrode layers 312 on two sides of each piezoelectric vibrator 31 are respectively connected to a signal source 32, when a voltage signal output by the signal source 32 is conducted to the electrode layers 312, two sides of the piezoelectric material layer 311 are provided with electric fields, and the piezoelectric material layer 311 generates vibration due to the inverse piezoelectric principle, so that the planar piezoelectric element 30 generates sound due to vibration or generates feedback vibration. When the planar piezoelectric element 30 vibrates, the spacer layer 20 can drive the substrate 10 to vibrate or deform along the normal direction of the surface of the substrate 10, so that the substrate 10 can become a part of the vibrator, and the substrate 10 can generate sound or vibration waves in a large area.

In another embodiment of the present invention, each piezoelectric vibrator 31 of the planar piezoelectric element 30 can be driven by the vibration or deformation of the substrate 10 when the substrate 10 vibrates or deforms, so that the piezoelectric material layer 311 of the piezoelectric vibrator 31 is bent or strained, and the opposite sides of the piezoelectric material layer 311 are charged due to the piezoelectric effect, so that the piezoelectric vibrator 31 generates a response signal. Therefore, the planar piezoelectric element 30 of the present invention can form one of various piezoelectric elements having different functions, such as a speaker, a receiver, an ultrasonic generator, an ultrasonic sensor, a pressure sensor, a vibration sensor, a deformation sensor, and a vibration generator, by the piezoelectric effect or the inverse piezoelectric effect of the piezoelectric material layer 311.

The planar piezoelectric element 30 is connected to the back surface of the substrate 10 through the spacer layer 20, so that when the planar piezoelectric element 30 vibrates, the vibration of the planar piezoelectric element 30 can be transmitted to the substrate 10 through the spacer layer 20, or when the substrate 10 bends or deforms, the planar piezoelectric element 30 is driven by the spacer layer 20 to vibrate or deform together.

For the purpose of enabling the mutual conduction of vibration or strain between the planar piezoelectric assembly 30 and the substrate 10 through the spacer layer 20, the spacer layer 20 itself must have appropriate rigidity so that the vibration or strain can be transmitted through the spacer layer 20 without causing energy consumption or delay. Specifically, the stiffness of the spacer layer 20 of the present invention can be expressed in terms of the young's modulus of the material of the spacer layer 20 and the material of the substrate 10, and when the substrate 10 is a rigid substrate, the young's modulus of the spacer layer 20 is arranged to be lower than the young's modulus of the substrate 10, and when the substrate 10 is a flexible substrate 10, the young's modulus of the spacer layer 20 is arranged to be higher than the young's modulus of the substrate 10.

In this embodiment, the substrate 10 is configured with at least one functional block 11, and a single spacer layer 20 is disposed in the at least one functional block 11, and the planar piezoelectric element 30 is composed of a single layer of piezoelectric vibrator 31. In more detail, in the present embodiment, in the planar viewing direction, the area of the spacer layer 20 substantially matches the area of the functional block 11 of the substrate 10, so that at least one functional block 11 of the substrate 10 is covered by the spacer layer 20. And the area of the spacer layer 20 is greater than or equal to the area of the planar piezoelectric assembly 30. In other words, the area of the planar piezoelectric element 30 is not larger than the area of the functional block 11.

As shown in fig. 3, in a second embodiment of the substrate module 1 integrating piezoelectric elements according to the present invention, in the present embodiment, the substrate 10 can define a first axial direction D1 and a second axial direction D2 perpendicular to each other from a plane view direction, and in the present embodiment, at least one functional block 11 is configured on the substrate 10, a single spacer layer 20 is disposed in the same functional block 11, a plurality of generally rectangular planar piezoelectric elements 30 are disposed on each spacer layer 20, an area of the plurality of planar piezoelectric elements 30 is smaller than an area of the spacer layer 20, and the plurality of planar piezoelectric elements 30 are disposed on a side of the spacer layer 20 opposite to the substrate 10 and spaced from each other along the first axial direction D1.

As shown in fig. 4 and 5, in the present embodiment, since the plurality of planar piezoelectric elements 30 are spaced from each other, a gap is formed between every two adjacent planar piezoelectric elements 30, so that the substrate 10 and the spacer layer 20 located between every two adjacent planar piezoelectric elements 30 have a bendable space, and when the substrate 10 and the spacer layer 20 are bent, the planar piezoelectric elements 30 are not bent together with the substrate 10, or the bending amplitude of the planar piezoelectric elements 30 is reduced, so that the present embodiment is particularly suitable for being applied to a flexible substrate 10.

As shown in fig. 6, in a third embodiment of the substrate module 1 integrated with piezoelectric elements according to the present invention, the arrangement of the spacer layer 20 and the planar piezoelectric elements 30 in the present embodiment is similar to that in the second embodiment, a single spacer layer 20 is arranged in each functional block 11, and a plurality of planar piezoelectric elements 30 with smaller areas are arranged on the spacer layer 20. The present embodiment is different in that a plurality of planar piezoelectric elements 30 are disposed in a matrix manner on one side of the spacer layer 20 with respect to the substrate 10 along the first axial direction D1 and the second axial direction D2 of the substrate 10, respectively, thereby enabling the substrate 10 of the piezoelectric element integrated substrate module 1 of the present embodiment to be bent along the first axial direction D1 and the second axial direction D2.

As shown in fig. 7, in the fourth embodiment of the substrate module 1 integrated with piezoelectric elements according to the present invention, in order to provide a plurality of spacer layers 20 on the same functional block 11 of the substrate 10, the plurality of spacer layers 20 are substantially rectangular and are disposed in the functional block 11 of the substrate 10 along the first axis D1 of the substrate 10 at intervals. In the present embodiment, the area of the planar piezoelectric assembly 30 is larger than the area of each spacer layer 20, and each planar piezoelectric assembly 30 covers a plurality of spacer layers 20 at the same time, and the planar piezoelectric assembly 30 is bonded to the back surface of the substrate 10 through the plurality of spacer layers 20.

Therefore, as shown in fig. 8, the fourth embodiment of the substrate module 1 integrated with piezoelectric elements according to the present invention forms a sandwich structure in which a plurality of spacer layers 20 are sandwiched between a planar piezoelectric element 30 and a substrate 10, and gaps are formed between the spacer layers 20.

As shown in fig. 9, a fifth embodiment of the substrate module 1 integrated with piezoelectric elements according to the present invention is similar to the fourth embodiment in that a plurality of spacer layers 20 are disposed in each functional block 11, and a planar piezoelectric element 30 is attached to one side of the spacer layers 20 opposite to the substrate 10. The present embodiment is different in that a plurality of spacer layers 20 are disposed in a matrix manner on a side of the spacer layer 20 opposite to the substrate 10 in a first axial direction D1 and a second axial direction D2 of the substrate 10, respectively.

As shown in fig. 10 and 11, the seventh embodiment of the substrate module 1 integrated with piezoelectric elements according to the present invention is different from the previous embodiments in that the arrangement of the spacer layer 20 and the planar piezoelectric element 30 is changed to a plurality of spacer layers 20 in each working region, and the plurality of spacer layers 20 are arranged at intervals along the first axial direction D1 of the substrate 10, or arranged in a matrix manner along the first axial direction D1 and the second axial direction D2 at the back of the substrate 10. And each spacer layer 20 is provided with a planar piezoelectric assembly 30 on one side surface opposite to the substrate 10, and the area of each planar piezoelectric assembly 30 is equal to or smaller than the area of the corresponding spacer layer 20.

In the sixth embodiment of the substrate module 1 integrated with a piezoelectric element according to the present invention, the difference between the present embodiment and the previous embodiments is that the planar piezoelectric element 30 is formed by overlapping a plurality of piezoelectric vibrators 31, so that the vibration intensity of the planar piezoelectric element 30 can be adjusted or enhanced by stacking the piezoelectric vibrators 31.

As shown in fig. 13, an eighth embodiment of the substrate module 1 integrated with piezoelectric elements according to the present invention is different in that the spacer layer 20 includes a polymer piezoelectric film 23, and a conductive layer 231 is disposed on each of two side surfaces of the polymer piezoelectric film 23, so that the spacer layer 20 of the present embodiment can form a piezoelectric element similar to the planar piezoelectric element 30.

In particular, in the present embodiment, the two electrode layers 312 of the spacer layer 20 and the electrode layers of the planar piezoelectric component 30 can be commonly connected to the same signal source or signal receiver, and the same function is performed with the planar piezoelectric component 30, for example, the spacer layer 20 and the planar piezoelectric component 30 of the present embodiment are commonly used to constitute a sound generating unit of a speaker. Alternatively, the two conductive layers 231 of the spacer layer 20 and the electrode layer of the planar piezoelectric component 30 of the present embodiment can be respectively connected to different signal sources or receivers, so that the spacer layer 20 and the planar piezoelectric component 30 respectively perform different functions, such as: the planar piezoelectric element 30 is connected to a signal source to form a speaker or ultrasonic generator, and the two electrode layers 312 of the spacer layer 20 are connected to a signal receiver to form a vibration or sound wave receiver.

Referring to fig. 14, a ninth embodiment of the substrate module 1 integrated with piezoelectric elements according to the present invention is shown, in this embodiment, in order to plan a plurality of different functional blocks 11 on the substrate 10, at least one spacer layer 20 and at least one planar piezoelectric element 30 are respectively disposed in each functional block 11, and the planar piezoelectric elements 30 in each functional block 11 can be planned into a plurality of groups of piezoelectric elements which are independent from each other and respectively used for performing different types of functions, such as: the plurality of different functional blocks 11 can be respectively programmed as: the piezoelectric component comprises one or a combination of various piezoelectric components with different functions, such as a loudspeaker, a receiver, an ultrasonic generator, an ultrasonic sensor, a pressure sensor, a vibration sensor, a deformation sensor, a vibration generator and the like.

[ possible effects of the embodiment ]

In summary, the present invention has the advantages that the spacer layer 20 is used as a connecting layer for disposing the planar piezoelectric element 30 on the back surface of the substrate 10, so that the planar piezoelectric element 30 can be disposed on the back surface of the substrate 10 quickly, and can be used as a medium for vibration transmission to generate a buffering effect, or the material density and the elastic coefficient of the spacer layer 20 are changed to achieve the purpose of adjusting the vibration amplitude or the sound quality.

In addition, the substrate module 1 can integrate piezoelectric components with different functions by the technical means of the invention, thereby reducing the component number of the electronic device and reducing the thickness.

The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, so that all equivalent technical changes made by using the contents of the present specification and the accompanying drawings are included in the scope of the present invention.

Claims (17)

1. A substrate module incorporating a piezoelectric element, comprising:

a substrate having opposing front and back surfaces, the substrate capable of defining at least one functional block, each functional block having therein:

at least one spacing layer, wherein the spacing layer is attached to the back surface of the substrate; and

at least one planar piezoelectric component, wherein one side of the planar piezoelectric component facing the substrate is attached to one side of the spacing layer opposite to the substrate;

at least one of the planar piezoelectric components can receive a voltage signal output by a signal source and then generate vibration due to the inverse piezoelectric effect to drive the substrate to generate vibration, or can be driven by the vibration or strain of the substrate, so that the planar piezoelectric component generates a response signal due to the piezoelectric effect.

2. The substrate module of claim 1, wherein at least one of the planar piezoelectric elements has at least one piezoelectric vibrator, and at least one of the piezoelectric vibrators includes a piezoelectric material layer and two electrode layers, and the two electrode layers are respectively in contact with two opposite sides of the piezoelectric material layer.

3. The piezoelectric device-integrated substrate module according to claim 2, wherein the piezoelectric material layer of the piezoelectric vibrator is a piezoelectric resin film or a piezoelectric ceramic film.

4. The integrated piezoelectric device substrate module of claim 3, wherein each of the planar piezoelectric devices has one of the piezoelectric vibrators or a plurality of the piezoelectric vibrators are stacked on each other.

5. The substrate module of claim 4, wherein two sides of the spacer layer are attached to the back surface of the substrate and the surface of the planar piezoelectric element by a bonding layer.

6. The substrate module of claim 5, wherein the substrate is a flexible substrate or a rigid substrate, and wherein the Young's modulus of the spacer layer is greater than that of the substrate when the substrate is a flexible substrate and less than that of the substrate when the substrate is a rigid substrate.

7. The substrate module of claim 6, wherein at least one of the spacer layers is a foam rubber layer, a resin material layer or a polymer piezoelectric film.

8. The substrate module of claim 7, wherein when the spacer layer is a polymer piezoelectric film, two sides of the polymer piezoelectric film are respectively provided with a conductive layer, and the two conductive layers can respectively apply a voltage to vibrate the polymer piezoelectric film or apply a voltage to the two conductive layers when the polymer piezoelectric film is driven by the substrate to generate strain.

9. The substrate module of any one of claims 7 or 8, wherein each of the functional blocks has a spacer layer, and the spacer layer has a planar piezoelectric element disposed thereon, and the area of the planar piezoelectric element is equal to or smaller than the area of the spacer layer.

10. The substrate module of any one of claims 7 or 8, wherein each of the functional blocks has a spacer layer, and a plurality of the planar piezoelectric elements are disposed on each of the spacer layers, and the area of the plurality of the planar piezoelectric elements is smaller than that of the spacer layer.

11. The integrated piezoelectric device substrate module according to claim 10, wherein the substrate defines a first axial direction and a second axial direction perpendicular to each other, a plurality of the planar piezoelectric devices are arranged on the spacer layer along the first axial direction, and a gap is formed between every two adjacent planar piezoelectric devices.

12. The integrated piezoelectric device substrate module of claim 11, wherein a plurality of the planar piezoelectric devices are disposed on at least one of the spacer layers in a matrix arrangement along the first and second axial directions.

13. The substrate module of any one of claims 7 or 8, wherein the substrate is capable of defining a first axial direction and a second axial direction perpendicular to each other, a plurality of the spacer layers are respectively disposed in each of the functional blocks of the substrate, a plurality of the spacer layers are disposed on the back surface of the substrate in the first axial direction, or a plurality of the spacer layers are disposed on the back surface of the substrate in a matrix manner in the first axial direction and the second axial direction.

14. The integrated piezoelectric device substrate module as claimed in claim 13, wherein at least one of the planar piezoelectric devices is disposed in each of the functional blocks, the area of at least one of the planar piezoelectric devices is larger than the area of the spacer layer, and at least one of the planar piezoelectric devices covers a plurality of the spacer layers simultaneously.

15. The integrated piezoelectric device substrate module of claim 13, wherein each of the spacer layers is disposed with one of the planar piezoelectric devices opposite to one side of the substrate.

16. The integrated piezoelectric device substrate module according to any one of claims 7 or 8, wherein the substrate is capable of defining a plurality of functional blocks, and at least one of the spacer layers and at least one of the planar piezoelectric devices are disposed within each of the functional blocks.

17. The substrate module of claim 16, wherein the planar piezoelectric elements in the functional blocks form one of a speaker, a receiver, an ultrasonic generator, an ultrasonic sensor, a pressure sensor, a vibration sensor, a deformation sensor, a vibration generator, and other piezoelectric elements with different functions.

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