CN114426757A - Resin material and preparation method thereof - Google Patents
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- CN114426757A CN114426757A CN202210068459.XA CN202210068459A CN114426757A CN 114426757 A CN114426757 A CN 114426757A CN 202210068459 A CN202210068459 A CN 202210068459A CN 114426757 A CN114426757 A CN 114426757A
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Abstract
The invention relates to the technical field of composite materials, in particular to a high-heat-conductivity high-insulation resin material and a preparation method thereof, wherein the high-heat-conductivity high-insulation resin material comprises 35-50 parts of epoxy resin, 26-40 parts of curing agent, 0.6-1 part of accelerator, 5-20 parts of spherical boron nitride and 5-20 parts of flaky boron nitride, the boron nitride material has excellent insulating property and heat conductivity, two boron nitride fillers with different dimensions can generate synergistic effect, the internal structure of the resin material is designed and adjusted, a heat-conducting network is established, the heat-conducting property of the resin material is improved, and the heat-conducting network can further improve the processing property and the mechanical property of the resin material. The synergistic effect of the two boron nitride fillers can ensure that the performance of the resin material is not deteriorated and improve the heat-conducting property of the resin material, and has wide application prospect.
Description
Technical Field
The invention belongs to the technical field of materials, and particularly relates to a resin material and a preparation method thereof.
Background
Along with the development and production requirements of the society, power equipment is continuously developed towards high voltage and large capacity, the thermal working environment of a switch and a power switch of a high-voltage power distribution cabinet becomes a key factor for damaging the service life of the equipment, and epoxy resin has excellent insulating property and is widely applied to external insulating casting materials. However, due to the disordered molecular structure of the epoxy resin, the thermal conductivity of the epoxy resin is very low, and the thermal management capability is limited; in the process of switching high-voltage equipment frequently, the phenomena of irreversible heat aging and insulation damage of the epoxy resin are serious continuously due to heat accumulation, and the service life of the switching equipment is also seriously influenced.
In the prior art, doping modification is mainly used for improving the heat conductivity of epoxy resin, and ceramic ferroelectric particles, novel nano particles, aluminum oxide, silicon carbide, carbon nano tubes, graphene and the like are introduced, but the improvement performance of the materials on the heat conductivity of the epoxy resin is limited, a large amount of filling is needed to construct an effective heat conducting path, but the processing performance of the epoxy resin is seriously influenced by the large amount of filling; besides excellent heat conductivity, the filler has excellent conductivity, and the heat conductivity of the epoxy resin is improved while the insulation performance of the epoxy resin is reduced. How to improve the thermal conductivity of epoxy resin without affecting the basic properties of the epoxy resin has been the focus of research by those skilled in the art.
Disclosure of Invention
Aiming at the technical problems that epoxy resin in the prior art is poor in thermal conductivity and easy to electrically age, and the conventional thermal conductive modified filler can change the original properties of the epoxy resin, the invention provides a high thermal conductive and high insulating resin material and a preparation method thereof.
In order to achieve the purpose of the invention, the embodiment of the invention adopts the following technical scheme:
on one hand, the embodiment of the invention provides a high-thermal-conductivity high-insulation resin material: the material comprises, by weight, 35-50 parts of epoxy resin, 26-40 parts of a curing agent, 0.6-1 part of an accelerator, 5-20 parts of spherical boron nitride and 5-20 parts of flaky boron nitride.
Compared with the prior art, the high-thermal-conductivity high-insulation resin material provided by the invention takes the epoxy resin as a matrix and takes spherical and flaky boron nitride with different dimensions as fillers. The boron nitride fillers have excellent insulating capacity and heat conductivity coefficient, the extremely large length-diameter ratio of the flaky boron nitride enables the flaky boron nitride and the spherical boron nitride to form more contact points, so that the two fillers are mutually cooperated to reasonably design and regulate the internal structure of the resin material to form more heat conduction paths, and the heat conduction paths can form a dense heat conduction network in the resin material, so that the phonon scattering rate is further reduced, and the heat conduction performance of the epoxy resin is obviously improved under the condition of low filling amount.
In addition, the spherical boron nitride can reduce the viscosity of the resin and optimize the processing performance of the resin; the heat conducting network formed in the resin can further ensure the processing performance and the mechanical performance of the material; the boron nitride can also reduce the free volume of the molecular chain in the epoxy resin and limit the segment movement of the epoxy resin chain, thereby improving the thermal stability and the aging resistance of the epoxy resin. In a word, the synergistic effect of spherical boron nitride and flaky boron nitride can obviously improve the heat-conducting property and the insulating property of the resin material under the condition of small filling amount, and ensure and even improve the thermal stability and the processing property of the resin material.
Preferably, the mass ratio of the spherical boron nitride to the flaky boron nitride is 1: 0.9 to 1.1.
The mass ratio of the spherical boron nitride to the flaky boron nitride is higher than the construction efficiency of the internal heat conduction network of the resin material, and the internal heat conduction path of the resin material has optimal forming efficiency and effect at the optimal ratio, so that the doping ratio of the filler can be further reduced while the same performance is achieved.
Preferably, the particle size of the spherical boron nitride is 50-100 μm, the particle size of the flaky boron nitride is 10-30 μm, and the length-diameter ratio is more than or equal to 100.
The boron nitride material with specific particle size and specific length-diameter ratio can fully exert the synergistic effect of spherical boron nitride and flaky boron nitride, and further reduce the doping proportion of the filler while achieving the same effect.
Preferably, the epoxy resin is one of bisphenol a epoxy resin E51 and bisphenol a epoxy resin E44.
The preferred epoxy resin has outstanding mechanical strength, certain aging resistance and insulating property, and can provide a good basis for the mechanical strength, thermal stability and insulating property of the finally prepared resin material.
Preferably, the curing agent is a polyamide 650 curing agent and the accelerator is a DMP-30 accelerator.
On the other hand, the invention also provides a preparation method of the high-thermal-conductivity high-insulation resin material, which comprises the following steps:
s1: preparing raw materials of the high-thermal-conductivity and high-insulation resin material and 0.8-1.5 parts of regulating and controlling liquid according to the formula amount, and premixing epoxy resin, a curing agent and an accelerator to obtain a resin matrix;
s2: adding spherical boron nitride and flaky boron nitride into the resin matrix obtained in the step S1 under the stirring state, continuing stirring to uniformly disperse the spherical boron nitride and the flaky boron nitride in the resin matrix, adding a regulating liquid, and stirring and dispersing to obtain a high-thermal-conductivity high-insulation resin material to be cured;
s3: and (5) curing the high-thermal-conductivity high-insulation resin material obtained in the step S2 to obtain the high-thermal-conductivity high-insulation resin material.
Compared with the prior art, the preparation method of the high-thermal-conductivity high-insulation resin material provided by the invention has the advantages that the regulating liquid is added in the preparation process, the regulating liquid can regulate and optimize the distribution state of spherical boron nitride and flaky boron nitride fillers in resin, the distribution effect of the fillers is improved, and the construction of a thermal conduction network in the material is facilitated; the specific raw material adding sequence and mixing mode are beneficial to the uniform mixing of all the components and ensure the stability of the properties of the material. The whole preparation process is simple in flow, easy to operate, safe and pollution-free.
Preferably, the control solution is one of acetone and absolute ethyl alcohol.
The optimal regulating liquid can regulate and control the distribution state of spherical boron nitride and flaky boron nitride in the epoxy resin, perfect a heat conducting network formed in the epoxy resin, further improve the heat conducting property of the epoxy resin and improve the thermal stability of the resin.
Preferably, the stirring speed during and after the addition of the spherical boron nitride in the S2 is 300-500 r/min, and the time is 0.8-1.5 h.
Preferably, the curing process of the high-thermal-conductivity and high-insulation resin material is carried out in a vacuum environment, and the specific method is as follows; heating to 60-80 ℃ in a vacuum environment, preserving heat for 20-30 ℃, placing in an environment at 100-120 ℃, preserving heat for 5-7 hours, and cooling to room temperature to obtain the high-thermal-conductivity high-insulation resin material.
Drawings
FIG. 1 is a schematic diagram of example 1 and comparative example 1 of the present invention.
FIG. 2 is a comparison of the thermal conductivity of the resin materials prepared in example 1 of the present invention and comparative examples 1 to 3.
FIG. 3 is a comparison graph of DSC thermo-mechanical stability of the resin materials obtained in example 1 and comparative examples 1 to 3.
FIG. 4 is a graph showing the comparison of the insulating properties of the resin materials obtained in example 1 and comparative examples 1 to 3.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The epoxy resin has excellent insulating property and can be widely applied to external insulating casting materials. With the continuous development of power equipment towards high voltage and high capacity, the thermal working environment of the switch of the high voltage power distribution cabinet and the power switch becomes a key factor for damaging the service life of the equipment, and the defects of low thermal conductivity and limited thermal management capacity of the disordered molecular structure in the epoxy resin exist; this trend is not met, especially in the process of switching high-voltage devices frequently, because the phenomena of irreversible thermal aging and insulation damage of the epoxy resin are increased due to heat accumulation, and the service life of the switching device is also seriously affected.
The ceramic ferroelectric particles and novel nanoparticles are introduced into the epoxy resin, and the materials such as aluminum oxide, silicon carbide, carbon nanotubes and graphene are the most common way in the field to modify the epoxy resin by doping, but the heat conductivity of the materials to the epoxy resin is limited to improve, a large amount of filling is needed to construct an effective heat conducting path, and the processing performance of the epoxy resin is seriously influenced by the large amount of filling; and the filler improves the thermal conductivity of the epoxy resin and simultaneously causes the reduction of the insulating property of the epoxy resin. How to improve the thermal conductivity of epoxy resin without affecting the basic properties of the epoxy resin has been the focus of research by those skilled in the art.
The invention provides a high-thermal-conductivity high-insulation resin material, aiming at solving the technical problem that the conventional thermal-conductivity modified filler can change the original properties of epoxy resin, and improving the thermal conductivity of the epoxy resin while ensuring that the mechanical property and the insulation property of the epoxy resin are not deteriorated. The high-thermal-conductivity high-insulation resin material takes epoxy resin as a matrix and spherical and flaky boron nitride with two different dimensions as fillers. The boron nitride fillers have excellent insulating capacity and heat conductivity coefficient, the extremely large length-diameter ratio of the flaky boron nitride enables the flaky boron nitride and the spherical boron nitride to form more contact points, so that the two fillers are mutually cooperated to reasonably design and regulate the internal structure of the resin material to form more heat conduction paths, and the heat conduction paths can form a dense heat conduction network in the resin material, so that the phonon scattering rate is further reduced, and the heat conduction performance of the epoxy resin is obviously improved under the condition of low filling amount. The viscosity of the resin can be reduced by the spherical boron nitride, and the processing performance of the resin is optimized; the heat conducting network formed in the resin can further ensure the processing performance and the mechanical performance of the material; the boron nitride can also reduce the free volume of the molecular chain in the epoxy resin and limit the segment movement of the epoxy resin chain, thereby improving the thermal stability and the aging resistance of the epoxy resin. In a word, the synergistic effect of spherical boron nitride and flaky boron nitride can obviously improve the heat-conducting property and the insulating property of the resin material under the condition of small filling amount, and ensure and even improve the thermal stability and the processing property of the resin material.
The inventor finds in research that the mass ratio of spherical boron nitride to lamellar boron nitride is the construction efficiency of the internal heat conduction network of the resin material, the forming efficiency and the forming effect of the internal heat conduction path of the resin are optimal, the doping ratio of the filler can be further reduced while the same performance is achieved, and the mass ratio of spherical boron nitride to lamellar boron nitride in the embodiment of the application is 1: 0.9 to 1.1.
In order to fully exert the synergistic effect of spherical boron nitride and lamellar boron nitride and further reduce the doping proportion of the filler while achieving the same effect, the particle size of the spherical boron nitride is 50-100 μm, the particle size of the lamellar boron nitride is 10-30 μm, and the length-diameter ratio is not less than 100 in the embodiment of the application.
The invention also provides a preparation method of the high-thermal-conductivity high-insulation resin material, which comprises the following steps:
s1: preparing raw materials of the high-thermal-conductivity and high-insulation resin material and 0.8-1.5 parts of regulating and controlling liquid according to the formula amount, and premixing epoxy resin, a curing agent and an accelerator to obtain a resin matrix;
s2: adding spherical boron nitride and flaky boron nitride into the resin matrix obtained in the step S1 under the stirring state, continuing stirring to uniformly disperse the spherical boron nitride and the flaky boron nitride in the resin matrix, adding a regulating liquid, and stirring and dispersing to obtain a high-thermal-conductivity high-insulation resin material to be cured;
s3: and (5) curing the high-thermal-conductivity high-insulation resin material obtained in the step S2 to obtain the high-thermal-conductivity high-insulation resin material.
The regulating liquid is added in the preparation process of the high-thermal-conductivity high-insulation resin material, so that the distribution state of spherical boron nitride and flaky boron nitride fillers in the resin can be regulated and optimized, the distribution effect of the fillers is improved, and the construction of a thermal conduction network in the material is facilitated; the specific raw material adding sequence and mixing mode are beneficial to the uniform mixing of all the components and ensure the stability of the properties of the material. The whole preparation process is simple in flow, easy to operate, safe and pollution-free.
In order to regulate and control the distribution state of spherical boron nitride and flaky boron nitride in the epoxy resin, improve a heat conduction network formed in the epoxy resin, further improve the heat conduction performance of the epoxy resin and improve the thermal stability of the resin, the inventor further researches that the preferable regulating and controlling liquid is one of acetone and absolute ethyl alcohol.
The invention is further illustrated below in the following examples.
In the following examples, polyamide 650 curing agent and DMP-30 accelerator were used as the curing agent and accelerator.
Example 1
The embodiment provides a high-thermal-conductivity high-insulation resin material, which comprises the following raw materials in parts by mass: 38.5 parts of curing agent, 30.5 parts of accelerator, 1 part of accelerator, 15 parts of spherical boron nitride and 15 parts of flaky boron nitride, wherein the particle size of the spherical boron nitride is 50-100 mu m, and the length-diameter ratio of the flaky boron nitride is more than or equal to 100;
the preparation method of the high-thermal-conductivity high-insulation resin material specifically comprises the following steps:
s1: weighing the raw materials and 0.9 part of acetone regulating and controlling liquid according to the formula ratio, mixing the epoxy resin, the curing agent and the accelerator, and premixing in a stirring device to obtain a resin matrix;
s2: under the stirring state, spherical boron nitride and flaky boron nitride are inoculated into the resin matrix obtained in S1, and the stirring is carried out for 1h at the rotating speed of 300r/min, so that the spherical boron nitride and the flaky boron nitride are uniformly dispersed in the resin matrix; adding the regulating solution and then continuously stirring for 2min to obtain a resin material with high thermal conductivity and high insulation to be cured;
s3: and (4) heating the resin material with high thermal conductivity and high insulation to be cured obtained in the step (S2) to 70 ℃ in a vacuum environment, preserving the heat for 20min, then placing the resin material in an environment with the temperature of 100 ℃ for preserving the heat for 5h, and cooling to room temperature to obtain the resin material with high thermal conductivity and high insulation.
Example 2
The embodiment provides a high-thermal-conductivity high-insulation resin material, which comprises the following raw materials in parts by mass: 50 parts of curing agent 40 parts, accelerator 1 part, spherical boron nitride 20 parts and flaky boron nitride 20 parts, wherein the particle size of the spherical boron nitride is 50-100 mu m, and the length-diameter ratio of the flaky boron nitride is more than or equal to 100;
the preparation method of the high-thermal-conductivity high-insulation resin material specifically comprises the following steps:
s1: weighing the raw materials and 1.5 parts of absolute ethyl alcohol regulating and controlling liquid according to the formula ratio, mixing the epoxy resin, the curing agent and the accelerator, and premixing in a stirring device to obtain a resin matrix;
s2: under the stirring state, spherical boron nitride and flaky boron nitride are inoculated into the resin matrix obtained in S1, and the stirring is carried out for 1.5h at the rotating speed of 500r/min, so that the spherical boron nitride and the flaky boron nitride are uniformly dispersed in the resin matrix; adding the regulating solution and then continuously stirring for 2min to obtain a resin material with high thermal conductivity and high insulation to be cured;
s3: and (4) heating the to-be-cured high-thermal-conductivity high-insulation resin material obtained in the step (S2) to 80 ℃ in a vacuum environment, preserving heat for 30min, then placing the resin material in an environment at 120 ℃ for heat preservation for 7h, and cooling to room temperature to obtain the high-thermal-conductivity high-insulation resin material.
Comparative example 1
The present comparative example provides a resin material whose raw materials, by mass fraction, include bisphenol a type epoxy resin E44: 38.5 parts of curing agent, 30.5 parts of accelerator and 1 part of accelerator;
the preparation method of the resin material specifically comprises the following steps:
s1: weighing the raw materials according to the formula ratio, mixing the epoxy resin, the curing agent and the accelerator, and stirring for 1h in a stirring device at the rotating speed of 300r/min to obtain the resin to be cured after premixing;
s2: and (3) heating the resin to be cured obtained in the step (S1) to 70 ℃ in a vacuum environment, preserving the heat for 20min, then placing the resin in an environment with the temperature of 100 ℃ for preserving the heat for 5h, and cooling to room temperature to obtain the resin material.
Comparative example 2
The comparative example provides a resin material, which comprises the following raw materials in parts by mass: 38.5 parts of curing agent, 30.5 parts of accelerator and 30 parts of spherical boron nitride, wherein the particle size of the spherical boron nitride is 50-100 mu m;
the preparation method of the high-thermal-conductivity high-insulation resin material specifically comprises the following steps:
s1: weighing the raw materials according to the formula ratio, mixing the epoxy resin, the curing agent and the accelerator, and premixing in a stirring device to obtain a resin matrix;
s2: adding spherical boron nitride into the resin matrix obtained in S1 under the stirring state, and stirring at the rotating speed of 300r/min for 1h to uniformly disperse the spherical boron nitride in the resin matrix to obtain a resin material to be cured;
s3: and (3) heating the resin material to be cured obtained in the step (S2) to 70 ℃ in a vacuum environment, preserving the heat for 20min, then placing the resin material in an environment at 100 ℃ for preserving the heat for 5h, and cooling to room temperature to obtain the resin material.
Comparative example 3
The comparative example provides a resin material, which comprises the following raw materials in parts by mass: 38.5 parts of curing agent, 30.5 parts of accelerator and 30 parts of flaky boron nitride, wherein the length-diameter ratio of the flaky boron nitride is more than or equal to 100;
the preparation method of the high-thermal-conductivity high-insulation resin material specifically comprises the following steps:
s1: weighing the raw materials according to the formula ratio, mixing the epoxy resin, the curing agent and the accelerator, and premixing in a stirring device to obtain a resin matrix;
s2: adding the flaky boron nitride into the resin matrix obtained in the step S1 under the stirring state, and stirring at the rotating speed of 300r/min for 1h to uniformly disperse the flaky boron nitride in the resin matrix to obtain a resin material to be cured;
s3: and (3) heating the resin material to be cured obtained in the step (S2) to 70 ℃ in a vacuum environment, preserving the heat for 20min, then placing the resin material in an environment at 100 ℃ for preserving the heat for 5h, and cooling to room temperature to obtain the resin material.
Example of detection
The appearance and the performance of the resin materials prepared in the embodiments 1 and 2 and the comparative examples 1 to 3 are detected, and the specific detection method and the detection result are as follows:
(1) appearance:
a picture of a resin material obtained in example 1 of the present invention and comparative example 1 is shown in FIG. 1. Wherein the left side of FIG. 1 is a resin material obtained in example 1 of the present invention, and the right side of FIG. 1 is a resin material obtained in comparative example 1 of the present invention
(2) Thermal conductivity:
the thermal conductivity of the resin material is detected by a heat flow method, and the detection result is shown in fig. 2:
wherein the thermal conductivity of the resin materials obtained in the embodiment 1 and the embodiment 2 is similar, and only the detection result of the embodiment 1 is shown in fig. 2.
As can be seen from fig. 2: example 1 has a very significant improvement in thermal conductivity compared to the comparative examples. Under the same doping proportion, the heat conduction network is efficiently built through the optimized proportion, and the thermal conductivity of the heat conduction network is respectively 51.45% and 34.43% higher than that of a single doped sample (comparative example 2 and comparative example 3) without considering the building efficiency of the heat conduction network. Therefore, the internal heat conduction path of the resin material is designed through the boron nitride fillers with different dimensions, the phonon scattering level can be reduced to the maximum extent, and the heat conduction level performance of the resin material is obviously improved.
(3) Mechanical properties and thermal stability:
the temperature-storage modulus curve of the resin material was tested, and the test results are shown in fig. 3:
wherein the thermal conductivity of the resin materials obtained in example 1 and example 2 is similar, and only the detection result of example 1 is shown in fig. 3.
As can be seen from fig. 3: compared with comparative examples 1-3, the storage modulus of example 1 is the highest, which shows that the mechanical strength of the resin material prepared in example 1 is more outstanding; and the thermal failure temperature of the resin material prepared in the embodiment 1 is also obviously higher than that of each comparative example, which also indicates that the resin material prepared in the embodiment 1 has more excellent thermal stability and mechanical strength.
(4) Resistivity of the alloy
The resistivity of the resin material was measured by a high-resistivity meter, and the measurement result is shown in fig. 4.
Wherein the resistivity of the resin materials obtained in example 1 and example 2 is similar, and only the detection result of example 1 is shown in fig. 4.
As can be seen from fig. 4, after the filler is doped, the resistivity of the resin materials obtained in example 1, comparative example 2 and comparative example 3 is better than that of comparative example 1, and it can be seen that the filling of the boron nitride filler can improve the insulation level of the epoxy resin.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. The resin material is characterized by comprising, by weight, 35-50 parts of epoxy resin, 26-40 parts of a curing agent, 0.6-1 part of an accelerator, 5-20 parts of spherical boron nitride and 5-20 parts of flaky boron nitride.
2. The resin material according to claim 1, wherein the spherical boron nitride and the flaky boron nitride are present in a mass ratio of 1: 0.9 to 1.1.
3. The resin material according to claim 1, wherein the spherical boron nitride has a particle size of 50 to 100 μm.
4. The resin material according to claim 1, wherein the flaky boron nitride has a particle size of 10 to 30 μm and an aspect ratio of 100 or more.
5. The resin material according to claim 1, wherein the epoxy resin is bisphenol a type epoxy resin E51 or bisphenol a type epoxy resin E44.
6. The resinous material of claim 1, wherein the curing agent is a polyamide 650 curing agent and the accelerator is a DMP-30 accelerator.
7. The preparation method of the resin material is characterized by comprising the following steps:
s1: preparing raw materials and 0.8-1.5 parts of regulating and controlling liquid according to the formula amount of the resin material as defined in any one of claims 1-6, and premixing epoxy resin, a curing agent and an accelerator to obtain a resin matrix;
s2: adding spherical boron nitride and flaky boron nitride into the resin matrix under the stirring state, and continuing stirring to uniformly disperse the spherical boron nitride and the flaky boron nitride in the resin matrix; adding the regulating solution, stirring and dispersing to obtain a resin material to be cured;
s3: and curing the resin material to be cured to obtain the resin material.
8. The method for preparing a resin material according to claim 7, wherein the conditioning liquid is acetone or absolute ethyl alcohol.
9. The method for preparing a resin material according to claim 7, wherein the spherical boron nitride and the flaky boron nitride are added in S2, and then the stirring speed is 300 to 500r/min, and the time is 0.8 to 1.5 h.
10. The preparation method of the resin material according to claim 7, wherein the curing process of the resin material in S3 is performed in a vacuum environment, and the method specifically comprises the steps of heating to 60-80 ℃ in the vacuum environment, preserving heat for 20-30 min, placing in an environment at 100-120 ℃, preserving heat for 5-7 h, and cooling to room temperature to obtain the resin material.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114836007A (en) * | 2022-05-27 | 2022-08-02 | 四川大学 | High-thermal-conductivity resin insulating material and preparation method thereof |
| CN116444983A (en) * | 2023-04-17 | 2023-07-18 | 金发科技股份有限公司 | Polyamide composite material and preparation method and application thereof |
| CN117209962A (en) * | 2023-10-07 | 2023-12-12 | 四川大学 | Epoxy resin composite material and preparation method thereof |
| CN118389109A (en) * | 2024-05-08 | 2024-07-26 | 上海均达科技发展有限公司 | High-temperature-resistant high-heat-conductivity insulating pouring adhesive and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2024217454A1 (en) * | 2023-04-17 | 2024-10-24 | 金发科技股份有限公司 | Polyamide composite material, preparation method therefor and use thereof |
| CN117209962A (en) * | 2023-10-07 | 2023-12-12 | 四川大学 | Epoxy resin composite material and preparation method thereof |
| CN118389109A (en) * | 2024-05-08 | 2024-07-26 | 上海均达科技发展有限公司 | High-temperature-resistant high-heat-conductivity insulating pouring adhesive and preparation method thereof |
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