CN114400190B - Device for omnibearing detecting wafers in wafer cassette - Google Patents
Device for omnibearing detecting wafers in wafer cassette Download PDFInfo
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- CN114400190B CN114400190B CN202210299267.XA CN202210299267A CN114400190B CN 114400190 B CN114400190 B CN 114400190B CN 202210299267 A CN202210299267 A CN 202210299267A CN 114400190 B CN114400190 B CN 114400190B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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Abstract
The invention relates to a device for detecting wafers in a wafer cassette in an all-round way, which comprises a placing platform capable of placing wafer cassettes with different sizes, and a top camera assembly fixed on the upper side of the placing platform through a supporting rod; four side camera assemblies are arranged on the placing platform in a square shape, each side camera assembly comprises a camera platform, a side camera is arranged on each camera platform, and the camera platforms can drive the side cameras to move; buckles are arranged among the four side camera modules in a staggered mode and can move towards or away from the center of the placing platform so as to fix the wafer boat boxes with different sizes; a code scanning gun is arranged on one side of the side camera shooting assembly; the top camera, the point position camera, the side camera and the code scanning gun are all connected to the MES system processing center; the invention carries out omnibearing automatic detection on the wafer placement condition in the wafer boat box by an image recognition technology, improves the safety in the wafer production process and reduces the defective rate.
Description
Technical Field
The invention belongs to the technical field of semiconductor wafer detection, and particularly relates to a device for detecting wafers in a wafer cassette in an all-directional manner.
Background
The semiconductor test includes CP (circuit probe) test, also called wafer test, which is the first step of the next packaging test of semiconductor devices and aims at selecting out the bad chips in the wafer. In the wafer testing process, the manipulator in the front end mechanical module of the device is required to take out or load the wafer from the wafer boat box, if the wafer in the wafer boat box is not correctly placed, for example, the wafer is not correctly inserted into the corresponding clamping groove on the wafer boat box, the wafer is inclined, and if the wafer is obliquely placed in the wafer boat box, the manipulator cannot accurately grab the wafer, even damages the wafer. After the wafer is detected, the wafer needs to be placed back into the wafer boat box, and in the process of placing the wafer, the wafer is obliquely inserted into the clamping groove due to improper operation, so that when the wafer is taken in subsequent operations such as testing and packaging, the wafer is taken abnormally, even the wafer is damaged, defective products occur, and even the wafer cannot be reused, so that economic loss is caused.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide the device for comprehensively detecting the wafers in the wafer boat box, which can carry out comprehensive automatic detection on the wafer placing condition in the wafer boat box, improve the safety in the wafer production process and reduce the defective rate.
The technical scheme of the invention is as follows:
one technical solution of the present invention is to provide an apparatus for omni-directionally detecting a wafer in a cassette, comprising:
the placing platform can place wafer boats with different sizes;
the top camera shooting assembly is fixed on the upper side of the placing platform through a supporting rod positioned on one side of the placing platform; the top camera assembly at least comprises a top camera and a point camera, and the point camera and the top camera can move back and forth at the end part of the supporting rod;
the four side camera modules are arranged on the placing platform in a square shape, each side camera module at least comprises a side camera and a camera platform for mounting the side camera, and the camera platform can drive the side camera to move;
the four buckles and the four side camera modules are arranged in a staggered mode, and the buckles can move towards or away from the center of the placing platform so as to fix the wafer boat boxes with different sizes;
the code scanning gun is arranged on one side of any side camera shooting assembly;
the top camera and the side camera are respectively provided with a processor, the processors are connected to an MES system processing center of a wafer production line, the top camera and the side camera respectively capture images of five directions of the wafer boat box placed on the placing platform and feed back the images to the MES system processing center through the processors, and the MES system processing center performs anomaly detection on the wafer boat box;
the point location camera is in communication connection with the MES system processing center, scans the two-dimensional code information on the wafer boat box to acquire the specification information of the wafers in the wafer boat box, and feeds the specification information back to the MES system processing center, and the MES system processing center calls the standard wafer configuration information with corresponding specification according to the specification information.
Further, the top subassembly of making a video recording includes U type curb plate, connecting rod, drive assembly is including setting up first threaded rod on the U type curb plate and being located the guide arm of first threaded rod one side, the one end of first threaded rod is connected with to be fixed the first driving motor of U type curb plate a side, the connecting rod is worn to establish on first threaded rod and the guide arm, connecting rod and first threaded rod threaded connection, top camera and point camera set up on the connecting rod, just top camera and point camera can along connecting rod round trip movement.
Further, a telescopic rod is arranged on the connecting rod, a rotating motor is arranged on an output shaft of the telescopic rod, an output shaft of the rotating motor is connected with a connecting portion, and the top camera and the point position camera are fixed on the connecting portion.
Furthermore, a C-shaped plate is fixed to the side face of the telescopic rod and connected to the connecting rod in a clamped mode, a third driving motor is fixed to the C-shaped plate, a gear is connected to an output shaft of the third driving motor, and the gear portion is meshed with teeth on the connecting rod through holes in the C-shaped plate.
Further, the platform of making a video recording includes the diaphragm and fixes the lift cylinder of diaphragm downside, the output shaft and the diaphragm fixed connection of lift cylinder, the lift cylinder is fixed on placing platform.
Furthermore, the connecting lines of the axes of the lens of every two opposite side cameras in the four side cameras are mutually vertical.
Further, the buckle is including being located the cardboard of place the platform side and extending to the connecting plate of place the platform downside, the last bar hole of having seted up of place the platform, the connecting plate certainly the bar hole extends place the platform's downside, place the platform's downside is fixed with second driving motor, be connected with the second threaded rod on second driving motor's the output shaft, the second threaded rod with connecting plate threaded connection.
Further, the strip-shaped hole coincides with the track of the central axis of the placing platform, so that the buckle can move towards or away from the center of the placing platform; the initial position of buckle is located the one end that the central point of place the platform was kept away from to the bar hole.
Further, the processor is connected with a GPIB port arranged on the placement platform, the GPIB port is in communication connection with the MES system processing center, and the top camera and the point position camera are in communication connection with one GPIB port.
Further, the working process of the device for omnibearing detection of the wafers in the wafer cassette is as follows:
s1, conveying the wafer boat box with the wafers to one side of the placing platform, scanning a two-dimensional code label on the wafer boat box through a code scanning gun, reading information on the two-dimensional code label, feeding the information on the two-dimensional code label back to an MES system processing center, and obtaining the size information of the wafers in the wafer boat box and the reference information of the wafer storing positions by the MES system processing center according to the received information;
s2, placing the wafer boat box among the four buckles on the placing platform, shooting a first image of the wafer boat box by the point-to-point camera, feeding the first image back to an MES system processing center, and extracting and analyzing feature points of the first image by the MES system processing center to obtain the size information of the wafer in the wafer boat box at present;
s3, when the size information of the wafers in the S1 and the S2 are consistent, the MES system processing center determines the preset position of the current wafer boat box on the placing platform according to the size information of the wafers in the current wafer boat box, and the MES system processing center starts four second driving motors to drive the buckles to reach the preset position corresponding to the current wafer boat box from the initial positions of the buckles;
s3, when the MES system processing center determines the pre-storage position of the wafer cassette on the placement platform according to the size information of the wafer in the wafer cassette, determining the preset focal lengths of the top camera and the side camera, and adjusting the top camera and the side camera to the preset positions of the cameras by the MES system processing center according to the determined preset focal lengths;
s4, after the top camera and the side cameras reach the preset positions of the cameras, photographing the wafer boat box to obtain a second image, and uploading the second image to the MES system processing center through a GPIB port;
s5, the MES system processing center processes the received second image and compares the processed second image with the reference information of the wafer storage position acquired by the MES system processing center;
s6, when the characteristic information of the second image is inconsistent with the reference information in the step S5, the MES system processing center sends out an alarm signal; and when all the characteristic information of the second image is consistent with the reference information, the MES system processing center sends out an operation ending instruction, and the first image and the second image are packaged and stored.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, the images of the wafer boat box with the wafers are shot by the top camera and the four side cameras, the shot images are fed back to the MES system processing center, and the MES system processing center is compared with the images of the standard wafer boat box preset in the MES system processing center so as to detect the accuracy of the wafer placement position in the detected wafer boat box and effectively ensure the accuracy of the subsequent processing of the subsequent wafers;
2. according to the invention, through the double cooperation of the code scanning gun and the point position camera, the accuracy of the reference information of the wafer in the standard cassette corresponding to the wafer placed in the current cassette taken by the MES system processing center is ensured, so that the accuracy of the test process is effectively ensured;
3. the wafer boat box is positioned and fixed through the four movable buckles, the preset position of the wafer boat box is determined according to the size information of the loaded wafer, and the wafer boat box is fixed on the preset point position through the buckles, so that the top camera and the side camera are ensured to accurately shoot corresponding image information of the wafer boat box after being adjusted to the preset position;
in a word, the invention carries out omnibearing automatic detection on the wafer arrangement condition in the wafer boat box by an image recognition technology, improves the safety in the wafer production process and reduces the defective rate.
Drawings
FIG. 1 is a schematic top view of the present invention;
FIG. 2 is a side view of the present invention;
FIG. 3 is a schematic view of a buckle structure according to the present invention;
FIG. 4 is a schematic view of a top camera assembly of the present invention;
in the figure, 1, a placing platform, 2, a support rod, 3, a top camera, 4, a point position camera, 5, a side camera, 6, a buckle, 601, a clamping plate, 602, a connecting plate, 7, a connecting rod, 8, a first threaded rod, 9, a guide rod, 10, a first driving motor, 11, a telescopic rod, 12, a rotating motor, 13, a connecting part, 14, a transverse plate, 15, a U-shaped side plate, 16, a C-shaped plate, 17, a GPIB port, 18, a processor, 20, a strip-shaped hole, 21, a second driving motor, 22, a second threaded rod, 24, a code scanning gun, 25 and a lifting cylinder.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, an apparatus for omni-directionally detecting wafers in a cassette comprises:
a placing platform 1, which can place wafer boats with different sizes;
the top camera shooting assembly is fixed on the upper side of the placing platform 1 through a supporting rod 2 positioned on one side of the placing platform 1; the top camera assembly at least comprises a top camera 3 and a point location camera 4, and the point location camera 4 and the top camera 3 can move back and forth at the end part of the supporting rod 2;
the device comprises four side camera components which are arranged on the placing platform 1 in a square shape, wherein the side camera components at least comprise a side camera 5 and a camera platform for mounting the side camera 5, and the camera platform can drive the side camera 5 to move;
the four buckles 6 are arranged in a staggered mode with the four side camera modules, and the buckles 6 can move towards or away from the center of the placing platform so as to fix the wafer boat boxes with different sizes;
a code scanning gun 24, wherein the code scanning gun 24 is arranged on one side of any side camera shooting component;
the top camera 3 and the side camera 5 are respectively provided with a respective processor 18, the processors 18 are connected to an MES system processing center of a wafer production line, the top camera 3 and the side camera 5 respectively capture images of five directions of the wafer boat box placed on the placing platform 1, the images are fed back to the MES system processing center through the processors 18, and the MES system processing center performs anomaly detection on the wafer boat box;
the point location camera 4 with MES system processing center communication connection, point location camera 4 scans two-dimensional code information on the wafer boat box to acquire the specification information of wafer in the wafer boat box, and will specification information feedback extremely MES system processing center, MES system processing center according to the standard wafer configuration information of corresponding specification (standard wafer configuration information includes but is not limited to wafer boat box characteristic point information, the size information of wafer boat box, the quantity of draw-in grooves in the wafer boat box, the distance between two adjacent draw-in grooves in the wafer boat box of corresponding size wafer).
As shown in fig. 1, 2 and 4, the top camera assembly includes a U-shaped side plate 15, a connecting rod 7 and a driving assembly, the driving assembly includes a first threaded rod 8 disposed on the U-shaped side plate 15 and a guide rod 9 located on one side of the first threaded rod 8, one end of the first threaded rod 8 is connected to a first driving motor 10 fixed on one side surface of the U-shaped side plate 15, the connecting rod 7 is disposed on the first threaded rod 8 and the guide rod 9 in a penetrating manner, the connecting rod 7 is connected with the first threaded rod 8 in a threaded manner, the top camera 3 and the point location camera 4 are disposed on the connecting rod 7, and the top camera 3 and the point location camera 4 can move back and forth along the connecting rod 7;
a telescopic rod 11 is arranged on the connecting rod 7, an output shaft of the telescopic rod 11 is provided with a rotating motor 12, an output shaft of the rotating motor 12 is connected with a connecting part 13, and the top camera 3 and the point position camera 4 are fixed on the connecting part 13;
a C-shaped plate 16 is fixed on the side face of the telescopic rod 11, the end face, with an opening, of the C-shaped plate 16 is fixed on the telescopic rod 11, the C-shaped plate 16 is connected to the connecting rod 7 in a clamping mode, specifically, the connecting rod 7 penetrates through a rectangular hole formed after the C-shaped plate 16 and the telescopic rod 11 are fixed, the C-shaped plate 16 can slide back and forth along the connecting rod 7, a third driving motor is fixed on the C-shaped plate 16, a gear is connected to an output shaft of the third driving motor, and the gear is partially meshed with teeth on the connecting rod 7 through a hole in the C-shaped plate 16; under the drive of a third drive motor, the C-shaped plate 16 is driven to move horizontally along the connecting rod 7 through the meshing of the gear and the teeth on the connecting rod 7, so that the telescopic rod 11, the top camera 3 and the point camera 4 are driven to move horizontally;
when the positions of the top camera 3 and the point location camera 4 need to be adjusted, the guide rod 9 is driven by the first driving motor 10 to rotate forwards and backwards to move transversely along the U-shaped side plate 15, the C-shaped plate 16 is driven by the operation of the third driving motor on the C-shaped plate 16 to move horizontally along the connecting rod 7 in the direction perpendicular to the U-shaped side plate 15, so that the top camera 3 and the point location camera 4 are driven to the preset position in the horizontal direction, and the telescopic rod 11 stretches and retracts to drive the top camera 3 and the point location camera 4 to the preset height; specifically, a distance sensor may be disposed on the connecting portion 13 to detect the distance between the connecting portion 13 and the placing platform 1, so as to drive the top camera 3 at the point camera 4 to a preset height.
As shown in fig. 2, the image pickup platform comprises a transverse plate 14 and a lifting cylinder 25 fixed on the lower side surface of the transverse plate 14, an output shaft of the lifting cylinder 25 is fixedly connected with the transverse plate 14, the lifting cylinder 25 is fixed on the placing platform 1, the lifting cylinder 25 adopts a double-rod TDA double-shaft cylinder, and the side camera 5 is driven to lift through the work of the lifting cylinder 25; the connecting lines of the lens axes of every two opposite side cameras 5 in the four side cameras 5 are mutually vertical, and the intersection point of the connecting lines of the lens axes is electrically superposed with the center of the placing platform 1.
As shown in fig. 3, the buckle 6 includes a clamping plate 601 located on the upper side of the placing platform 1 and a connecting plate 602 extending to the lower side of the placing platform 1, a strip-shaped hole 20 is formed in the placing platform 1, the connecting plate 602 extends out of the lower side of the placing platform 1 from the strip-shaped hole 20, a second driving motor 21 is fixed on the lower side of the placing platform 1, a second threaded rod 22 is connected to an output shaft of the second driving motor 21, and the second threaded rod 22 is in threaded connection with the connecting plate 602;
the strip-shaped hole 20 coincides with the track of the central axis of the placing platform 1, so that the buckle 6 can move towards or away from the center of the placing platform 1; the initial position of the buckle 6 is located at one end of the strip-shaped hole 20 far away from the central point of the placing platform 1;
when the sizes of the wafers in the wafer boat box are determined, the sizes of the corresponding wafer boat box are determined, the preset placing position of the wafer boat box corresponding to the wafers with the sizes on the placing platform is determined, and the buckle 6 is driven to the preset position under the driving of the second driving motor 21 so as to fix the wafer boat box.
In the invention, the processor 18 is connected with a GPIB port 17 arranged on the placing platform 1, the GPIB port 17 is in communication connection with the MES system processing center, and the top camera 3 and the point-to-point camera 4 are in communication connection with one GPIB port 17.
In the implementation of the invention, the first driving motor 10, the second driving motor 21, the third driving motor and the rotating motor 12 are all stepping motors, and the top camera 3, the side camera, the buckle 6 and the point position camera 4 can be driven to preset positions according to the instruction of the MES system processing center; the working requirement of the rotating motor 12 is that when the point position camera 4 cannot accurately capture the point position of the wafer boat box, the rotating motor 12 drives the point position camera 4 to rotate through positive and negative rotation so as to reach the characteristic point position capable of accurately capturing the wafer boat box; the top camera 3, the point position camera 4 and the side camera 5 are all high-definition cameras.
The working process of the device for omnibearing detection of the wafers in the wafer boat box is as follows:
s1, conveying the wafer boat box with the wafers to one side of the placing platform 1, scanning the two-dimensional code label on the wafer boat box through the code scanning gun 24, reading information on the two-dimensional code label, feeding the information on the two-dimensional code label back to an MES system processing center, and obtaining the size information of the wafers in the wafer boat box and the reference information of the wafer storing positions by the MES system processing center according to the received information;
s2, placing the wafer boat box among the four buckles 6 on the placing platform 1, shooting a first image of the wafer boat box by the point position camera 4, feeding the first image back to an MES system processing center, and extracting and analyzing feature points of the first image by the MES system processing center to obtain the size information of the wafer in the wafer boat box at present;
s3, when the size information of the wafers in the S1 and the S2 are consistent, the MES system processing center determines the preset position of the current wafer boat box on the placing platform 1 according to the size information of the wafers in the current wafer boat box, and starts four second driving motors 21 to drive the buckle 6 to reach the preset position corresponding to the current wafer boat box from the initial position;
s3, when the MES processing center determines the pre-storage position of the wafer cassette on the placement platform 1 according to the size information of the wafer in the wafer cassette, determining the preset focal lengths of the top camera 3 and the side camera 5, and adjusting the top camera 3 and the side camera 5 to the preset camera positions by the MES processing center according to the determined preset focal lengths;
s4, after the top camera 3 and the side camera 5 reach the preset positions of the cameras, photographing the wafer boat box to obtain a second image, and uploading the second image to the MES system processing center through the GPIB port 17;
s5, the MES system processing center processes the received second image and compares the processed second image with the reference information of the wafer storage position acquired by the MES system processing center;
s6, when the characteristic information of the second image is inconsistent with the reference information in the step S5, the MES system processing center sends out an alarm signal; and when all the characteristic information of the second image is consistent with the reference information, the MES system processing center sends out an operation ending instruction, and the first image and the second image are packaged and stored.
The MES system processing center stores the following information: the wafer size monitoring system comprises 8-inch wafers, characteristic point information of corresponding wafer boat boxes corresponding to 12-inch wafers, storage position characteristic point reference information of all wafers in the wafer boat boxes, pre-placed positions of the wafer boat boxes corresponding to the wafers with corresponding sizes on a placing platform, top cameras 3 and side cameras 5 when the wafer boat boxes corresponding to the wafers with corresponding sizes are photographed, so that the MES system processing center can call related information under the wafers with the sizes according to the wafer size conditions obtained by a code scanning gun 24 and a point camera 4, and the MES system processing center can control the corresponding top cameras 3, the side cameras 5 and buckles 6 to reach the pre-placed positions.
In step S2, the first image is analyzed by the MES system processing center by segmenting the first image, extracting feature points of each unit by the MES system processing center after segmenting the first image, comparing the extracted feature points with feature point information corresponding to 8-inch wafers and 12-inch wafers stored inside the MES system processing center one by the MES system processing center, and determining the size of the wafer after matching the corresponding feature point information.
In step S4, the second image includes the top of the pod and the side view direction pictures of the front, rear, left and right directions taken by the top camera 3 and the four side cameras 5.
In step S5, the second image processing procedure is that the MES system processing center extracts the characteristics of the preset points according to the condition of the cassette of the wafer of the current size; the MES system processing center determines the number of the current card slots in the wafer boat box and the distance between adjacent card slots according to the height of the wafer boat box of the wafer with the current size, so that the MES system processing center can extract and identify the characteristic points of the wafer information placed in the card slots according to the top-down sequence of the wafer boat box on the side view direction picture;
taking the pictures taken by the left and right side cameras 5 as an example:
defining a left view as A (the order of the card slots from top to bottom is A1, A2, A3 and A4 … …) and a right view as B (the order of the card slots from top to bottom is B1, B2, B3 and B4 … …) in the reference information of the wafer boat box corresponding to the wafer with the size;
define the image taken by the left side camera 5 as a graph A1(the card slots are in the order of A from top to bottom11、A12、A13、A14 … …) the image captured by the right side camera 5 is B1(the card slots are in the order of B from top to bottom11、B 12、B 13、B14……）；
The MES system processing center displays the image A shot by the left side camera 51Comparing the reference information with A in the reference information of the wafer boat box of the wafer from top to bottom one by one, if A is11 and A1, A12 and A2, A13 and A3, A14 is consistent with A4 … …, which means that all the card slots in the current view are inserted by the wafer;
the MES system processing center makes a video recording of the right sidePicture B taken by machine 51Comparing the reference information with B in the cassette reference information of the wafer of the size from top to bottom one by one, if B is not the same as B11 is identical to B1, B 12 does not correspond to B2, B 13 corresponds to B3, B14 is consistent with B4, and the other corresponding characteristics are consistent, which represents that the second wafer is placed obliquely;
similarly, when the MES system processing center compares the pictures shot by the front and rear side cameras 5, a wafer is not inserted into a slot in the picture shot by one side camera 5, which represents that the wafer corresponding to the current slot is inclined;
and sending alarm information by the MES system processing center until all the wafers in the wafer cassette are checked, and synchronously prompting the specific tilted wafer information.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the invention can be made, and equivalents and modifications of some features of the invention can be made without departing from the spirit and scope of the invention.
Claims (10)
1. The utility model provides an all-round device that detects wafer in wafer boat box which characterized in that includes:
the placing platform can place wafer boats with different sizes;
the top camera shooting assembly is fixed on the upper side of the placing platform through a supporting rod positioned on one side of the placing platform; the top camera assembly at least comprises a top camera and a point camera, and the point camera and the top camera can move back and forth at the end part of the supporting rod;
the four side camera modules are arranged on the placing platform in a square shape, each side camera module at least comprises a side camera and a camera platform for mounting the side camera, and the camera platform can drive the side camera to move;
the four buckles and the four side camera modules are arranged in a staggered mode, and the buckles can move towards or away from the center of the placing platform so as to fix the wafer boat boxes with different sizes;
the code scanning gun is arranged on one side of any side camera shooting assembly;
the top camera and the side camera are respectively provided with a processor, the processors are connected to an MES system processing center of a wafer production line, the top camera and the side camera respectively capture images of five directions of the wafer boat placed on the placing platform, the images are fed back to the MES system processing center through the processors, and the MES system processing center performs anomaly detection on the wafer boat;
the point location camera is in communication connection with the MES system processing center, scans the two-dimensional code information on the wafer boat box to acquire the specification information of the wafers in the wafer boat box, and feeds the specification information back to the MES system processing center, and the MES system processing center calls the standard wafer configuration information with corresponding specification according to the specification information.
2. The apparatus of claim 1, wherein the wafer cassette comprises: the top subassembly of making a video recording includes U type curb plate, connecting rod, drive assembly is including setting up first threaded rod on the U type curb plate and being located the guide arm of first threaded rod one side, the one end of first threaded rod is connected with fixes the first driving motor of U type curb plate side, the connecting rod is worn to establish on first threaded rod and the guide arm, connecting rod and first threaded rod threaded connection, top camera and point camera set up on the connecting rod, just top camera and point camera can along connecting rod round trip movement.
3. The apparatus of claim 2, wherein the wafer cassette comprises: the camera comprises a connecting rod, and is characterized in that a telescopic rod is arranged on the connecting rod, a rotating motor is arranged on an output shaft of the telescopic rod, an output shaft of the rotating motor is connected with a connecting part, and a top camera and a point position camera are fixed on the connecting part.
4. The apparatus of claim 3, wherein the wafer cassette comprises: the side of telescopic link is fixed with the C template, the C template joint is in on the connecting rod, be fixed with third driving motor on the C template, be connected with the gear on third driving motor's the output shaft, the gear part pass through the hole on the C template with tooth on the connecting rod meshes mutually.
5. The apparatus of claim 1, wherein the wafer cassette comprises: the camera shooting platform comprises a transverse plate and a lifting cylinder fixed on the lower side surface of the transverse plate, an output shaft of the lifting cylinder is fixedly connected with the transverse plate, and the lifting cylinder is fixed on the placing platform.
6. The apparatus of claim 1, wherein the wafer cassette comprises: and connecting lines of the lens axes of every two opposite side cameras in the four side cameras are mutually vertical.
7. The apparatus of claim 1, wherein the wafer cassette comprises: the buckle is including being located the cardboard of place the platform side and extending to the connecting plate of place the platform downside, the last bar hole of having seted up of place the platform, the connecting plate certainly the bar hole extends place the platform's downside, place the platform's downside is fixed with second driving motor, be connected with the second threaded rod on second driving motor's the output shaft, the second threaded rod with connecting plate threaded connection.
8. The apparatus of claim 7, wherein the wafer cassette comprises: the strip-shaped hole is coincided with the track of the central axis of the placing platform, so that the buckle can move towards or away from the center of the placing platform; the initial position of buckle is located the one end that the central point of place the platform was kept away from to the bar hole.
9. The apparatus according to any of claims 1-8, wherein: the processor is connected with a GPIB port arranged on the placing platform, the GPIB port is in communication connection with the MES system processing center, and the top camera and the point position camera are in communication connection with one GPIB port.
10. The apparatus of claim 9, wherein the wafer cassette further comprises: the working process of the device for omnibearing detection of the wafers in the wafer boat box is as follows:
s1, conveying the wafer boat box with the wafers to one side of the placing platform, scanning a two-dimensional code label on the wafer boat box through a code scanning gun, reading information on the two-dimensional code label, feeding the information on the two-dimensional code label back to an MES system processing center, and obtaining the size information of the wafers in the wafer boat box and the reference information of the wafer storing positions by the MES system processing center according to the received information;
s2, placing the wafer boat box among the four buckles on the placing platform, shooting a first image of the wafer boat box by the point-to-point camera, feeding the first image back to an MES system processing center, and extracting and analyzing feature points of the first image by the MES system processing center to obtain the size information of the wafer in the wafer boat box at present;
s3, when the size information of the wafers in the S1 and the S2 are consistent, the MES system processing center determines the preset position of the current wafer boat box on the placing platform according to the size information of the wafers in the current wafer boat box, and the MES system processing center starts four second driving motors to drive the buckles to reach the preset position corresponding to the current wafer boat box from the initial positions of the buckles;
s3, when the MES system processing center determines the pre-storage position of the wafer cassette on the placement platform according to the size information of the wafer in the wafer cassette, determining the preset focal lengths of the top camera and the side camera, and adjusting the top camera and the side camera to the preset positions of the cameras by the MES system processing center according to the determined preset focal lengths;
s4, after the top camera and the side cameras reach the preset positions of the cameras, photographing the wafer boat box to obtain a second image, and uploading the second image to the MES system processing center through a GPIB port;
s5, the MES system processing center processes the received second image and compares the processed second image with the reference information of the wafer storage position acquired by the MES system processing center;
s6, when the characteristic information of the second image is inconsistent with the reference information in the step S5, the MES system processing center sends out an alarm signal; and when all the characteristic information of the second image is consistent with the reference information, the MES system processing center sends out an operation ending instruction, and the first image and the second image are packaged and stored.
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| CN115026964A (en) * | 2022-07-05 | 2022-09-09 | 浙江金瑞泓科技股份有限公司 | Automatic system for removing crystal points of silicon wafer |
| CN115332114A (en) * | 2022-08-04 | 2022-11-11 | 浙江金瑞泓科技股份有限公司 | Automatic control system for identifying silicon wafers in wafer cassette and operation method thereof |
| CN117747530B (en) * | 2023-12-29 | 2024-06-07 | 无锡芯启博科技有限公司 | Wafer CP testing device |
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