CN114392937A - Material distribution method, control device and computer equipment of semiconductor test sorting machine - Google Patents
Material distribution method, control device and computer equipment of semiconductor test sorting machine Download PDFInfo
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- 238000012360 testing method Methods 0.000 title claims abstract description 209
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/38—Collecting or arranging articles in groups
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C2301/00—Sorting according to destination
- B07C2301/0008—Electronic Devices, e.g. keyboard, displays
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Abstract
The disclosure relates to the technical field of automatic testing of semiconductors, in particular to a material distribution method, a control device and computer equipment of a semiconductor testing sorting machine, which comprises the steps of obtaining batch testing results and material distribution disc information of batch chips; determining grading zone information according to the batch test result and the distribution disc information; obtaining a test result of chips to be distributed in the batch of chips; and moving the chip to be distributed to a corresponding position in the distribution disc according to the test result of the chip to be distributed, the grade partition information and the use information of the distribution disc. By adopting the material distribution method of the semiconductor test separator, the expansion of the classification of the separator can be realized under the condition of not changing hardware, the original functions are ensured, the flexibility of the blanking classification of the separator can be greatly improved, and the hardware cost of equipment is reduced. Meanwhile, the material distribution disc can be utilized to the maximum extent under the condition that the operation difficulty of the equipment is not increased.
Description
Technical Field
The invention relates to the technical field of automatic testing of semiconductors, in particular to a material distribution method, a control device and computer equipment of a semiconductor testing sorting machine.
Background
With the increasing automation degree in the field of semiconductor package testing, many testing operations originally completed by manual or semi-automatic jigs are gradually changed to be completed by full-automatic testing machines. Material separation is an important environment for the automation process of the packaging test process, so that the sorting machine becomes an indispensable standard automation device in a full-automatic test system.
The versatility and sorting efficiency of a sorting machine are important indicators in measuring automated equipment. Due to the variety of packaging types of semiconductor products, the packaging test processes of different types of products and the same type of products of different manufacturers are different, so that a sorter equipment manufacturer needs to continuously improve a mechanical structure according to the requirements of users to meet the requirements of different packaged products and processes.
Disclosure of Invention
Based on this, it is necessary to provide a material distribution method, a control device, and a computer device for a semiconductor test handler, aiming at the problem of how to meet the requirements of different packaged products and processes without changing hardware devices.
A material distribution method of a semiconductor test separator comprises the steps of obtaining batch test results and material distribution disc information of batch chips; determining grading zone information according to the batch test result and the distribution disc information; obtaining a test result of chips to be distributed in the batch of chips; and moving the chip to be distributed to a corresponding position in the distribution disc according to the test result of the chip to be distributed, the grade partition information and the use information of the distribution disc.
In one embodiment, the batch test result includes a grade number and a grade ratio of the batch chips, the distribution tray information includes a distribution tray number and a distribution tray capacity, the determining of grade partition information according to the batch test result and the distribution tray information includes determining a behavior basic unit corresponding to the grade number in the distribution tray according to the grade number, the grade ratio, the distribution tray number and the distribution tray capacity, and the grade partition information includes a correspondence between the grade number and the behavior basic unit in the distribution tray.
In one embodiment, the moving the chips to be distributed to the corresponding positions in the distribution disc according to the test results of the chips to be distributed, the grade partition information and the use information of the distribution disc comprises determining a target distribution disc corresponding to the chips to be distributed according to the test results of the chips to be distributed and the grade partition information; calculating the moving coordinate of the chip to be distributed according to the target distribution disc and the use information of the distribution disc; and moving the chip to be distributed to a corresponding position in the distribution disc according to the moving coordinate.
In one embodiment, after the chips to be distributed are moved to corresponding positions in the distribution disc according to the test result of the chips to be distributed, the grade partition information and the use information of the distribution disc, the method further comprises the step of judging whether behavior basic units in the distribution disc are full; and when the behavior basic unit in the distribution plate is full, replacing the distribution plate according to a plate replacing mode corresponding to the distribution plate.
A material distribution control device for semiconductor testing comprises a test discharging platform, a material distribution control device and a material distribution control device, wherein the test discharging platform is used for conveying batch chips; the blanking distribution module is used for acquiring batch test results and distribution plate information of batch chips and distributing grade partition information according to the batch test results and the distribution plate information; the blanking control module is connected with the blanking distribution module, is used for acquiring the test result of chips to be distributed in the batch of chips, and is also used for outputting a grabbing instruction according to the grade partition information corresponding to the test result of the chips to be distributed and the use information of the distribution disc; and the automatic grabbing module is connected with the discharging control module and used for grabbing the chips to be distributed from the batch of chips transmitted by the test discharging platform according to the grabbing instruction and moving the chips to be distributed to the corresponding positions in the distribution disc.
In one embodiment, the blanking distribution module comprises a data acquisition unit, which is used for acquiring batch test results of the batch chips and the distribution plate information, wherein the batch test results comprise grade numbers and grade ratios of the batch chips, and the distribution plate information comprises the number of the distribution plates and the capacity of the distribution plates; and the data processing unit is connected with the data acquisition unit and is used for determining a corresponding behavior basic unit of the grade number in the distribution disc according to the grade number, the grade ratio, the number of the distribution discs and the capacity of the distribution disc, and the grade partition information comprises a corresponding relation between the grade number and the behavior basic unit in the distribution disc.
In one embodiment, the blanking control module comprises a material distribution disc determining unit, which is used for determining a target material distribution disc corresponding to the chip to be distributed according to the test result of the chip to be distributed and the grade partition information; the mobile coordinate calculation unit is connected with the distribution plate determination unit and used for calculating the mobile coordinates of the chips to be distributed according to the target distribution plate and the use information of the distribution plate; and the control instruction output unit is connected with the mobile coordinate calculation unit and used for outputting a grabbing instruction according to the mobile coordinate.
In one embodiment, the material distribution control device for the semiconductor test further comprises a judging module, a judging module and a control module, wherein the judging module is used for judging whether the behavior basic units in the material distribution disc are full; and the distribution plate replacing module is connected with the judging module and used for replacing the distribution plate according to a plate replacing mode corresponding to the distribution plate when the behavior basic unit in the distribution plate is full of materials.
A computer device comprising a memory storing a computer program and a processor implementing the steps of the material dividing method of the semiconductor test handler according to any one of the above embodiments when the processor executes the computer program.
A computer-readable storage medium on which a computer program is stored, the computer program, when executed by a processor, implementing the steps of the material dividing method of the semiconductor test handler according to any one of the above embodiments.
A computer program product comprising a computer program which, when executed by a processor, implements the steps of the material sorting method of the semiconductor test handler according to any one of the above embodiments.
According to the material distribution method of the semiconductor test sorting machine, the material distribution discs are divided according to the batch test results of batch chips and the conditions of the material distribution discs, and the material distribution discs are divided into material distribution areas for accommodating different grades. And moving the chips to be distributed to corresponding positions in the distribution disc according to the grade partition condition and the test result of the chips to be distributed in the batch of chips. By adopting the material distribution method of the semiconductor test separator, the expansion of the classification of the separator can be realized under the condition of not changing hardware, the original functions are ensured, the flexibility of the blanking classification of the separator can be greatly improved, and the hardware cost of equipment is reduced. Meanwhile, the material distribution disc can be utilized to the maximum extent under the condition that the operation difficulty of the equipment is not increased.
Drawings
In order to more clearly illustrate the embodiments of the present specification or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the specification, and other drawings can be obtained by those skilled in the art without inventive labor.
FIG. 1 is a schematic flow chart illustrating a method for distributing materials in a semiconductor test handler according to one embodiment of the present disclosure;
FIG. 2 is a diagram illustrating a hardware configuration of a semiconductor test handler according to an embodiment of the present disclosure;
FIG. 3 is a schematic diagram illustrating a partitioning condition of the distribution plate according to an embodiment of the present disclosure;
FIG. 4 is a schematic flow chart illustrating a method for moving a chip to be separated according to an embodiment of the disclosure;
FIG. 5 is a schematic flow chart illustrating a method for changing a full distribution tray according to one embodiment of the present disclosure;
FIG. 6 is a schematic structural diagram of a material distribution control apparatus for semiconductor testing according to an embodiment of the present disclosure;
FIG. 7 is a schematic block diagram of a split control system for semiconductor testing in one embodiment of the present disclosure;
fig. 8 is a schematic diagram of an internal structure of a computer device in an embodiment of the present disclosure.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the terms "vertical," "horizontal," "left," "right," "upper," "lower," "front," "rear," "circumferential," and the like are based on the orientation or positional relationship shown in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The current types of separators can be classified into a translational separator, a gravity separator and a turret separator according to different transmission modes. In practical applications, the application of the translational separator is the largest. Tray trays are typically used as carriers for chips in the blanking section of a translating sorter. Depending on the test results, different grades of chips can be placed in different Tray trays, a sorting process also referred to as bin (bin means bin, box, in the semiconductor manufacturing industry "bin" means "Tray"). When bin splitting operation is performed in a conventional operation flow, chips of different grades are usually placed on different trays according to different detection results.
To save space, most translatory sorters are designed to feed automatic bin + fixed bin. Chips corresponding to the test grades which account for a larger proportion in the chip test results are put into the Tray disc corresponding to the automatic bin, and the Tray disc corresponding to the automatic bin is automatically replaced by the conveyor belt after the Tray disc is full of materials; and (4) placing the chip corresponding to the test grade with a smaller percentage in the chip test result into the Tray disc corresponding to the fixed bin, and manually replacing the Tray disc corresponding to the fixed bin after the Tray disc corresponding to the fixed bin is full. The number of Tray disks of the automatic bin and the fixed bin in the translational separator can be combined at will according to the test process. The combinations common in practical ease of use are: 3 automatic bins +3 fixed bins are set. However, when the product is changed in model or the customer needs, different numbers of test results may appear in the test results, so that the number of Tray disks does not correspond to the number of test results, and high-efficiency bin allocation cannot be realized. The problem of increased subbin quantity caused by product model change or customer requirement change can not be solved by only increasing the quantity of Tray disks corresponding to different subbin modes.
In order to solve the problems, the disclosure provides a material distribution method based on a translational separator, which can expand the number of bins of the separator without changing hardware and has a wide application prospect.
Fig. 1 is a schematic flow chart of a method of distributing materials of a semiconductor test handler according to one embodiment of the present disclosure, in which the method of distributing materials of a semiconductor test handler may include the following steps S100 to S400.
Step S100: and acquiring batch test results and distribution disc information of the batch chips.
The hardware equipment which can be used for realizing the material distribution method of the semiconductor test separator comprises a test discharging platform, an automatic grabbing module and at least one discharging tray. The sorting machine can move the chips which are subjected to the semiconductor performance test to a sorting and blanking area by using the test discharging platform. The automatic grabbing module can be controlled to grab the chip to be distributed on the test discharging platform and move the chip to be distributed to the corresponding position.
After the semiconductor performance test for the batch of chips is completed, the batch test result of the batch of chips can be obtained. For example, different chips may be classified into different classes according to their performance. The batch test results may include test result information such as the number of levels present in the chips of the batch, the level number, the approximate proportion of chips of different levels, etc.
Meanwhile, the information of the material distribution disc arranged in the semiconductor test sorting machine is obtained. Since different distribution trays may be provided for the sorting machine in different semiconductor production test plans. The distribution plate information can comprise the number of distribution plates arranged in the semiconductor test separator, the capacity information of chips contained in each distribution plate, the distribution plates corresponding to automatic bins, the distribution plates corresponding to fixed bins and the like.
Step S200: and determining grading zone information according to the batch test result and the material distribution plate information.
The test result condition obtained in the semiconductor performance test aiming at the batch chips and the distribution plate condition arranged in the semiconductor test sorting machine are comprehensively considered, and a corresponding bin distribution method can be individually formulated aiming at the batch chips. The grade partition information can be used for representing the distribution condition of the distribution disc areas correspondingly placed in the sub-bin for the chips with different test results. For example, when it is determined that the lot of chips includes 3 different grades of chips according to the batch test result, and exactly 3 distribution trays are provided in the semiconductor test handler, one distribution tray can be correspondingly distributed in one grade.
Step S300: and obtaining a test result of the chips to be distributed in the batch of chips.
The automatic grabbing module picks up a chip to be distributed from batch chips which are tested in the test discharging platform, and a test result corresponding to the chip to be distributed can be obtained from the test machine.
Step S400: and moving the chip to be distributed to a corresponding position in the distribution disc according to the test result, the grade partition information and the use information of the distribution disc of the chip to be distributed.
The distribution condition of the distribution disc corresponding to the test result can be determined according to the grade partition information, so that the distribution disc corresponding to the chip to be distributed can be determined according to the test result corresponding to the chip to be distributed and the grade partition information. Meanwhile, the capacity for accommodating the chips in the material distribution disc is limited, so that the unoccupied position in the material distribution disc can be judged by acquiring the use information of the material distribution disc before moving, and the corresponding position of the chip to be distributed in the material distribution disc is determined, so that the automatic grabbing module can move the chip to be distributed to the corresponding position in the material distribution disc under the control.
According to the material distribution method of the semiconductor test sorting machine, the material distribution discs are divided according to the batch test results of the batch chips and the conditions of the material distribution discs, and the material distribution discs are divided into material distribution areas for accommodating different grades. And moving the chips to be distributed to corresponding positions in the distribution disc according to the grade partition condition and the test result of the chips to be distributed in the batch of chips. By adopting the material distribution method of the semiconductor test separator, the expansion of the classification of the separator can be realized under the condition of not changing hardware, the original functions are ensured, the flexibility of the blanking classification of the separator can be greatly improved, and the hardware cost of equipment is reduced. Meanwhile, the material distribution disc can be utilized to the maximum extent under the condition that the operation difficulty of the equipment is not increased.
Practical production experience proves that the method can greatly improve the flexibility of the blanking bin dividing method of the sorting machine, and can realize the expansion of any bin dividing quantity of the sorting machine under the condition of not changing hardware. The material distribution method is applied to the semiconductor test sorting machine, and after packaging tests with different process standards are carried out on different manufacturers and different types of products, sorting machine equipment can adaptively distribute the material distribution discs according to test results so as to meet the material distribution requirements of different packaged products and processes, and the material distribution method has wide application prospects.
In one embodiment, in a semiconductor test, the chips are generally classified into different grades according to their different performance performances. The test results of the tested chips are numbered, so that the chips of which grades are included in the batch of chips can be distinguished conveniently. Meanwhile, after the batch of chips are tested, the ratio of each grade in the total amount can be obtained. Thus, the batch test result may include the grade number and grade ratio included in the batch of chips at this time. Similarly, the sorting machines may have different numbers of distribution trays, and different sizes of distribution trays may have different numbers of chips. Therefore, the distribution plate information can be obtained, distribution is carried out based on the number and the capacity of the distribution plates, and the distribution plate information can comprise the number and the capacity of the distribution plates.
When the grade division information is determined according to the batch test result and the distribution plate information, the corresponding behavior basic unit of the grade number in the distribution plate can be determined according to the grade number, the grade ratio, the number of the distribution plates and the capacity of the distribution plate. The grade numbers, the grade ratios, the number of the material trays and the capacity of the material trays are comprehensively considered, and which material tray is used for accommodating which kind of chip or which kinds of chips corresponding to the grade numbers are determined. In some embodiments of the present disclosure, an area of the distribution tray for accommodating a chip corresponding to a class number is defined as a behavior basic unit. The grade partition information can be used for representing the distribution condition of the distribution plate areas correspondingly placed in the bins for the chips with different test results, and the grade partition information can comprise the corresponding relation between the grade numbers and the behavior basic units in the distribution plates.
The charging tray can be utilized most efficiently by acquiring the grade ratio corresponding to each grade number in the batch chips, and the behavior basic units corresponding to each grade number in the charging tray are divided according to the grade ratio corresponding to each grade number. Because the production process of the semiconductor determines that the ratio of each grade in the batch of chips is relatively fixed, the ratio of the grade corresponding to each grade number in the batch of chips can be roughly estimated in the test process. When the grade ratio corresponding to each grade number in the batch chips cannot be roughly estimated in the test process, the grade ratio corresponding to each grade number can also be directly obtained by equally dividing according to the grade number in the batch chips.
In this embodiment, to better describe the step of determining the rank partition information according to the batch test result and the distribution tray information, the test result includes 3 ranks, and the rank numbers are respectively recorded as: the rank ratios for rank 1, rank 2, rank 3, 3 rank numbers are roughly: 60%, 30%, 10%, and the semiconductor test handler includes two Tray disks AB as an example to illustrate the above-mentioned material separating process, but it should not be construed as limiting the scope of the invention.
Referring to fig. 2, fig. 2 is a schematic diagram of a hardware structure of a semiconductor test handler according to an embodiment of the present disclosure. The test discharging platform and the AB two Tray discs are placed on a plane with the same height, wherein the Tester Unit is an area used for storing batch chips in the test discharging platform. An automatic grabbing module capable of freely moving on a plane formed based on an X axis and a Y axis is arranged above the test discharging platform and the two Tray discs, and a suction head of the automatic grabbing module can be used for grabbing a chip. The automatic grabbing module can drive the chip to freely move above the test discharging platform and the two Tray discs.
The method comprises the steps of obtaining a batch test result and distribution disc information of batch chips, wherein the batch test result comprises a grade number and a grade ratio of the batch chips, namely the grade number of the batch chips comprises a grade 1, a grade 2 and a grade 3, the grade ratio corresponding to the grade 1 is 60%, the grade ratio corresponding to the grade 2 is 30%, and the grade ratio corresponding to the grade 3 is 10%. The material distribution plate information comprises the number of material distribution plates and the capacity of the material distribution plates, namely the number of the material distribution plates is 2, and the capacity of the material distribution plates is as follows: each dispensing tray comprises 16 rows, one row comprising 8 chip receiving locations.
In the case where one behavior basic unit is used to accommodate a chip corresponding to one level number, it can be determined that 3 behavior basic units are included in two Tray disks according to the level numbers of the chips in a batch. Considering the level ratios corresponding to the level numbers, the level 1 ratio is known to be the largest, so that the ray A can be separately allocated to the behavior basic unit corresponding to the level 1; the behavior basic unit corresponding to the level 2 and the behavior basic unit corresponding to the level 3 share the track B. And allocating grade numbers to the Tray disks by using the behavior basic units, so that the number of rows of the Tray disks corresponding to each grade corresponds to the proportion of the number of the rows of the Tray disks. Considering that the ratio of the level ratio corresponding to the level 2 to the level ratio corresponding to the level 3 is 3:1, and then integrating the capacity of the distribution Tray, the chip containing positions in 12 rows in Tray B can be allocated to the behavior basic unit corresponding to the level 2, and the chip containing positions in 4 rows in Tray B can be allocated to the behavior basic unit corresponding to the level 3. The grade partition information can be shown in fig. 3, and fig. 3 is a schematic diagram of the partition of the distribution tray in one embodiment of the present disclosure.
According to the material distribution method of the semiconductor test sorting machine, batch test results obtained by testing batch chips are obtained, and according to the grade numbers in the batch test results and the approximate ratio corresponding to each grade number, the information of the material distribution plate in the sorting machine is integrated, and the grade numbers are distributed to the material distribution plate by behavior basic units. When the distribution tray is used, the chips corresponding to different test results can be flexibly distributed in the accommodating areas of the distribution tray according to the test result and the distribution tray condition of each test. Practical production experience proves that the sorting and blanking method can greatly improve the blanking bin flexibility of the sorting machine, so that the expansion of the number of any bins of the sorting machine is realized under the condition of not changing hardware.
Fig. 4 is a schematic flow chart of a method for moving a chip to be separated according to one embodiment of the present disclosure, where in one embodiment, moving the chip to be separated to a corresponding position in a separation tray according to a test result of the chip to be separated, grade partition information, and usage information of the separation tray may include steps S410 to S430 as follows.
Step S410: and determining a target distribution disc corresponding to the chip to be distributed according to the test result and the grade partition information of the chip to be distributed.
And controlling the automatic grabbing module to pick up the chips to be distributed from the batch of chips which are tested in the test discharging platform, and simultaneously obtaining the test result of the chips to be distributed from the testing machine. The test result of the chip to be distributed can be the grade number of the chip to be distributed. Because the grade partition information can be used for indicating the distribution condition of the distribution disc corresponding to the test result, the target distribution disc corresponding to the chip to be distributed can be determined according to the test result corresponding to the chip to be distributed and the grade partition information. For example, when the test result of the chip to be separated is level 1, the target material separating disc corresponding to the level 1 can be determined to be Tray a according to the level partition information. During material distribution, the chip to be distributed can be moved to the behavior basic unit corresponding to the level 1 in Tray a.
Step S420: and calculating the moving coordinate of the chip to be distributed according to the target distribution disc and the use information of the distribution disc.
Meanwhile, the capacity for accommodating the chips in the material distribution disc is limited, so that the unoccupied positions in the material distribution disc can be judged by acquiring the use information of the material distribution disc before moving, and the corresponding target positions of the chips to be distributed in the material distribution disc are further determined. And calculating the moving coordinate of the chip to be distributed according to the target distribution disc and the use information of the distribution disc.
In some embodiments of the present disclosure, the usage information of the distribution tray may include material existence information, origin coordinate information, row-column spacing information, and the like corresponding to each chip accommodation position in the distribution tray. And determining where vacant positions exist in the behavior basic unit corresponding to the chip to be divided according to the use information of the material distribution disc, and selecting one of the vacant positions as a target position. And calculating the moving coordinate when the chip to be distributed is moved to the target position according to the information such as the origin coordinate, the row-column spacing, the target position coordinate and the like.
Step S430: and moving the chip to be distributed to the corresponding position in the distribution disc according to the moving coordinate.
And the moving coordinate is sent to the automatic grabbing module, and the automatic grabbing module can move the chip to be distributed to the target position in the corresponding distribution disc according to the moving coordinate. And after the chips to be distributed are placed into the corresponding distribution disc at the target positions, the bin operation of the single chips of the chips to be distributed can be finished.
According to the material distribution method of the semiconductor test sorting machine, the target position of the chip to be distributed is determined according to the grade partition condition, the test result of the chip to be distributed in the batch of chips and the use condition of the material distribution disc, and the chip to be distributed is moved to the corresponding position in the material distribution disc, so that the containing position of the material distribution disc in the semiconductor test sorting machine can be utilized to the maximum extent, meanwhile, the flexibility of material distribution classification of the sorting machine is expanded under the condition that the operation difficulty of the equipment is not increased, and the hardware cost of the equipment is reduced.
Fig. 5 is a schematic flow chart of a method for changing a full-material distribution tray in one embodiment of the present disclosure, and in one embodiment of the present disclosure, after the chip to be distributed is moved to a corresponding position in the distribution tray according to the test result, the grade partition information, and the usage information of the distribution tray, the method may further include steps S500 to S600 as follows.
Step S500: and judging whether the behavior basic units in the distributing disc are full or not.
Step S600: and when the action basic unit in the distribution disc is full, replacing the distribution disc according to the disc replacing mode corresponding to the distribution disc.
One behavior basic unit in the distribution disc is used for accommodating the chips of the corresponding single class grade numbers. When any behavior basic unit is full, if the disk is not changed in time, and the chip grabbed at the next grabbing time is the chip corresponding to the full behavior basic unit, the chip grabbed at the next grabbing time has no place to accommodate, so that the bin dividing process is influenced. Therefore, after bin dividing operation of a single chip is completed, whether the action basic unit in the material dividing disc is full is judged, and disc changing processing is carried out on the material dividing disc where the full action basic unit is located in time. Because the basic behavior units in each distribution disc are divided according to the grade ratios corresponding to the grade numbers during distribution, when one basic behavior unit is full, other basic behavior units on the distribution disc cannot have great resource waste, and the chip accommodating capacity of the distribution disc can be utilized to the maximum extent.
In one embodiment, the distributing trays used in the semiconductor test handler may include a first distributing tray and a second distributing tray, which may be an automatic bin and a fixed bin, respectively. The tray changing mode corresponding to the first distributing tray is different from the tray changing mode corresponding to the second distributing tray. Therefore, when the full-material behavior basic unit exists, the type corresponding to the distribution disc where the full-material behavior basic unit is located can be judged, and disc changing is carried out according to the disc changing mode corresponding to the type of the distribution disc. For example, the distribution trays used in the semiconductor test handler may include distribution trays corresponding to automatic bins and distribution trays corresponding to fixed bins. Therefore, when the distribution plate with the full-material behavior basic unit is the distribution plate corresponding to the automatic bin, the automatic plate changing can be realized by utilizing the conveying belt; when the full-material distribution plate is the distribution plate corresponding to the fixed bin, prompt information can be sent to prompt an operator to manually change the plate.
In one embodiment, the material distributing method of the semiconductor test handler may further include repeating the steps S100 to S400 when the behavior basic units in all the distributing trays are not full, until the behavior basic units in any one of the distributing trays are full.
In one embodiment, the material distribution method of the semiconductor test handler may further include storing all the acquired data in the above embodiment. For example, data such as batch test results of batch chips, distribution tray information, test results of chips to be distributed in the batch chips, grade partition information, use information of distribution trays and the like are stored, so that the operations of tracing and correcting errors or positioning and tracing the target chip and the like can be conveniently realized according to the stored data during later maintenance.
It should be understood that, although the steps in the flowcharts of the figures in the specification are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and described, and may be performed in other orders, unless explicitly stated otherwise. Moreover, at least a part of the steps in the flowcharts of the figures of the specification may include a plurality of steps or a plurality of stages, which are not necessarily performed at the same time, but may be performed at different times, and the order of performing the steps or the stages is not necessarily sequential, but may be performed alternately or alternately with other steps or at least a part of the steps or the stages in other steps.
Based on the description of the material distribution method embodiment of the semiconductor test separator, the disclosure also provides a material distribution control device for semiconductor test. The semiconductor test distribution control device may include a system (including a distributed system), software (application), a module, a component, a server, a client, and the like, which uses the method according to the embodiment of the present specification, and a device which incorporates necessary hardware for implementation. Based on the same innovative concept, the semiconductor test separation control device in one or more embodiments provided in the embodiments of the present disclosure is as described in the following embodiments. Since the implementation scheme and method for solving the problem of the material distribution control device for semiconductor testing are similar, the implementation of the material distribution control device for semiconductor testing in the embodiments of the present description may refer to the implementation of the foregoing method, and repeated details are not repeated. As used hereinafter, the term "unit" or "module" may be a combination of software and/or hardware that implements a predetermined function. Although the semiconductor test distribution control apparatus described in the following embodiments is preferably implemented in software, implementations in hardware, or a combination of software and hardware are also possible and contemplated.
Fig. 6 is a schematic structural diagram of a material distribution control device for semiconductor testing according to an embodiment of the present disclosure. In one embodiment, the separation control device for semiconductor testing may include a test discharging platform 100, a discharging distribution module 200, a discharging control module 300, and an automatic grabbing module 400.
The test discharging platform 100 can be used for transporting batch chips.
The blanking distribution module 200 may be configured to obtain batch test results and distribution tray information of the batch chips, and may also be configured to distribute grade partition information according to the batch test results and the distribution tray information.
The blanking control module 300, connected to the blanking distribution module 200, may be configured to obtain a test result of chips to be distributed among the chips in batch, and further output a capture instruction according to grade partition information corresponding to the test result of the chips to be distributed and usage information of the distribution tray.
The blanking distribution module 200 and the blanking control module 300 may both be connected to a testing machine to obtain test results from the testing machine.
The automatic grabbing module 400 is connected with the discharging control module 300, can be connected with the discharging control module 300, and can grab the chips to be distributed from the batch chips transmitted by the test discharging platform according to grabbing instructions and move the chips to be distributed to corresponding positions in the distributing disc.
In one embodiment, the blanking distribution module 200 may include a data acquisition unit and a data processing unit.
The data acquisition unit can be used for acquiring batch test results of the batch chips and the distribution plate information, the batch test results comprise grade numbers and grade ratios of the batch chips, and the distribution plate information comprises the quantity of the distribution plates and the capacity of the distribution plates.
And the data processing unit is connected with the data acquisition unit and can be used for determining the corresponding behavior basic units of the grade numbers in the distribution plate according to the grade numbers, the grade ratios, the quantity of the distribution plates and the capacity of the distribution plates, and the grade partition information comprises the corresponding relation between the grade numbers and the behavior basic units in the distribution plates.
In one embodiment, the blanking control module can comprise a distribution plate determining unit, a mobile coordinate calculating unit and a control instruction output unit.
And the material distribution plate determining unit can be used for determining a target material distribution plate corresponding to the chip to be distributed according to the test result and the grade partition information of the chip to be distributed.
And the mobile coordinate calculation unit is connected with the distribution plate determination unit and can be used for calculating the mobile coordinates of the chip to be distributed according to the target distribution plate and the use information of the distribution plate.
And the control instruction output unit is connected with the mobile coordinate calculation unit and can be used for outputting the grabbing instruction according to the mobile coordinate.
In one embodiment, the distribution control device for semiconductor testing can further comprise a judgment module and a distribution disc replacing module.
And the judging module can be used for judging whether the behavior basic units in the distributing disc are full.
And the distribution plate replacing module is connected with the judging module and can be used for replacing the distribution plate according to a plate replacing mode corresponding to the distribution plate when the action basic unit in the distribution plate is full of materials.
In one embodiment, the blanking distribution module 200 and the blanking control module 300 may be both functional units in a server, and the server is used to implement distribution control of semiconductor tests. The server is connected with the testing machine, the grade number of the chip testing results in the testing machine and the approximate ratio of each grade are obtained, grade division information is determined according to the batch testing results and the distributing plate information, grade numbers are distributed to the distributing plates by behavior basic units, and the number of the distributing plates corresponding to each grade corresponds to the ratio of the number of the distributing plates. The server can also realize the control of the automatic grabbing module 400, and control the automatic grabbing module 400 to pick up the chip to be distributed from the test discharging platform 100. The server may also obtain a test result, such as a class number, corresponding to the chip captured by the automatic capture module 400 from the testing machine.
The server can also calculate the discharging position of the chip according to the use information and the grade partition information of the material distribution disc and the captured test result corresponding to the chip to be distributed. The automatic grabbing module 400 puts the chips into the corresponding material placement positions in the material distribution disc according to the material placement positions of the chips calculated by the server under the control of the server, so as to complete the bin distribution work of the single chip to be distributed. And repeating the steps until the behavior basic unit corresponding to a certain grade number in the distribution disc is full. If the full material distribution plate is the distribution plate corresponding to the automatic bin, the automatic plate changing is realized by the conveying belt; and if the full material distribution plate is the distribution plate corresponding to the fixed bin, sending prompt information to prompt an operator to manually change the plate. And repeating the steps until the batch chip distribution operation is completed.
In one embodiment, the server may be further configured to store all the acquired data in the foregoing embodiments. For example, the data such as the batch test result of the batch chips, the distribution disc information, the test result of the chips to be distributed in the batch chips, the grade partition information, the use information of the distribution disc and the like are stored in the database of the server, so that the operations of tracing and correcting the source and the error or positioning and tracing the target chip and the like can be conveniently realized according to the stored data during later maintenance.
The modules in the distribution control device for semiconductor testing can be wholly or partially realized by software, hardware and a combination thereof. The modules can be embedded in a hardware form or independent from a processor in the computer device, and can also be stored in a memory in the computer device in a software form, so that the processor can call and execute operations corresponding to the modules.
The specific manner in which each module performs operations has been described in detail in the embodiments related to the method, and will not be described in detail herein.
It is understood that the embodiments of the method, the semiconductor test material distribution control device, and the like described above are described in a progressive manner, and the same/similar parts of the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. Reference may be made to the description of other method embodiments for relevant points.
Fig. 7 is a schematic block diagram of a distribution control system for semiconductor testing in an embodiment of the present disclosure. Referring to FIG. 7, the distributed control system for semiconductor testing S00 includes a processing component S20 that further includes one or more processors and memory resources, represented by memory S22, for storing instructions, such as applications, executable by the processing component S20. The application program stored in the memory S22 may include one or more modules each corresponding to a set of instructions. Further, the processing component S20 is configured to execute instructions to perform the above-described method.
The dividing control system S00 for semiconductor testing may further include: the power supply module S24 is configured to perform power management of the distributed control system for semiconductor testing S00, the wired or wireless network interface S26 is configured to connect the distributed control system for semiconductor testing S00 to a network, and the input/output (I/O) interface S28. The split control system for semiconductor testing S00 may operate based on an operating system stored in memory S22, such as Windows Server, Mac OS X, Unix, Linux, FreeBSD, or the like.
In an exemplary embodiment, a computer-readable storage medium comprising instructions, such as the memory S22 comprising instructions, executable by a processor of the split material control system for semiconductor testing S00 to perform the above method is also provided. The storage medium may be a computer-readable storage medium, which may be, for example, a ROM, a Random Access Memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, and the like.
In an exemplary embodiment, a computer program product is also provided that includes instructions executable by a processor of the split control system for semiconductor testing S00 to perform the above-described method.
In one embodiment, a computer device is provided, the computer device may be a server, an internal structure diagram of the computer device may be as shown in fig. 8, and fig. 8 is a schematic internal structure diagram of the computer device in one embodiment of the present disclosure. The computer device includes a processor, a memory, a network interface, and a display screen connected by a system bus. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program, and a database. The internal memory provides an environment for the operation of an operating system and computer programs in the non-volatile storage medium. The database of the computer device is used for storing all the acquired data in the above embodiments. The network interface of the computer device is used for communicating with an external terminal through a network connection. The computer program is executed by a processor to implement a material distribution method of a semiconductor test handler.
The display screen of the computer equipment can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer equipment can be a touch layer covered on the display screen, a key, a track ball or a touch pad arranged on the shell of the computer equipment, an external keyboard, a touch pad or a mouse and the like.
Those skilled in the art will appreciate that the architecture shown in fig. 8 is merely a block diagram of some of the structures associated with the disclosed aspects and is not intended to limit the computing devices to which the disclosed aspects apply, as particular computing devices may include more or less components than those shown, or may combine certain components, or have a different arrangement of components.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by hardware instructions of a computer program, which can be stored in a non-volatile computer-readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. Any reference to memory, database, or other medium used in the embodiments provided herein may include at least one of non-volatile and volatile memory. The nonvolatile Memory may include Read-Only Memory (ROM), magnetic tape, floppy disk, flash Memory, optical Memory, high-density embedded nonvolatile Memory, resistive Random Access Memory (ReRAM), Magnetic Random Access Memory (MRAM), Ferroelectric Random Access Memory (FRAM), Phase Change Memory (PCM), graphene Memory, and the like. Volatile Memory can include Random Access Memory (RAM), external cache Memory, and the like. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM), among others. The databases referred to in various embodiments provided herein may include at least one of relational and non-relational databases. The non-relational database may include, but is not limited to, a block chain based distributed database, and the like. The processors referred to in the embodiments provided herein may be general purpose processors, central processing units, graphics processors, digital signal processors, programmable logic devices, quantum computing based data processing logic devices, etc., without limitation.
The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the hardware + program class embodiment, since it is substantially similar to the method embodiment, it is relatively simple to describe, and reference may be made to part of the description of the method embodiment for relevant points.
It should be noted that, the descriptions of the apparatus, the electronic device, the server, and the like according to the method embodiments may also include other embodiments, and specific implementations may refer to the descriptions of the related method embodiments. Meanwhile, the new embodiment formed by the mutual combination of the features of the methods, the devices, the equipment and the server embodiments still belongs to the implementation range covered by the present disclosure, and the details are not repeated herein.
In the description herein, references to the description of "some embodiments," "other embodiments," "desired embodiments," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, a schematic description of the above terminology may not necessarily refer to the same embodiment or example.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A material distribution method of a semiconductor test separator is characterized by comprising the following steps:
obtaining batch test results and distribution disc information of batch chips;
determining grading zone information according to the batch test result and the distribution disc information;
obtaining a test result of chips to be distributed in the batch of chips;
and moving the chip to be distributed to a corresponding position in the distribution disc according to the test result of the chip to be distributed, the grade partition information and the use information of the distribution disc.
2. The material distribution method of the semiconductor test handler of claim 1, wherein the batch test result includes a grade number and a grade ratio of the batch chips, the distribution tray information includes a number of distribution trays and a capacity of the distribution trays, and the determining the grade division information according to the batch test result and the distribution tray information includes:
and determining the corresponding behavior basic units of the grade numbers in the distribution discs according to the grade numbers, the grade ratios, the number of the distribution discs and the capacity of the distribution discs, wherein the grade partition information comprises the corresponding relation between the grade numbers and the behavior basic units in the distribution discs.
3. The material distribution method of the semiconductor test handler according to claim 1 or 2, wherein the moving the chip to be distributed to the corresponding position in the distribution tray according to the test result of the chip to be distributed, the grade division information, and the use information of the distribution tray comprises:
determining a target distribution disc corresponding to the chip to be distributed according to the test result of the chip to be distributed and the grade partition information;
calculating the moving coordinate of the chip to be distributed according to the target distribution disc and the use information of the distribution disc;
and moving the chip to be distributed to a corresponding position in the distribution disc according to the moving coordinate.
4. The material distributing method of the semiconductor test handler according to claim 2, wherein after the chip to be distributed is moved to a corresponding position in the material distributing tray according to the test result of the chip to be distributed, the grade partition information, and the use information of the material distributing tray, the method further comprises:
judging whether the behavior basic units in the distributing disc are full;
and when the behavior basic unit in the distribution plate is full, replacing the distribution plate according to a plate replacing mode corresponding to the distribution plate.
5. The utility model provides a branch material controlling means of semiconductor test which characterized in that includes:
the test discharging platform is used for transmitting batch chips;
the blanking distribution module is used for acquiring batch test results and distribution plate information of batch chips and distributing grade partition information according to the batch test results and the distribution plate information;
the blanking control module is connected with the blanking distribution module, is used for acquiring the test result of chips to be distributed in the batch of chips, and is also used for outputting a grabbing instruction according to the grade partition information corresponding to the test result of the chips to be distributed and the use information of the distribution disc;
and the automatic grabbing module is connected with the discharging control module and used for grabbing the chips to be distributed from the batch of chips transmitted by the test discharging platform according to the grabbing instruction and moving the chips to be distributed to the corresponding positions in the distribution disc.
6. The semiconductor test distribution control device according to claim 5, wherein the blanking distribution module comprises:
the data acquisition unit is used for acquiring batch test results of the batch chips and the distributing disc information, the batch test results comprise grade numbers and grade ratios of the batch chips, and the distributing disc information comprises the quantity and capacity of the distributing discs;
and the data processing unit is connected with the data acquisition unit and is used for determining a corresponding behavior basic unit of the grade number in the distribution disc according to the grade number, the grade ratio, the number of the distribution discs and the capacity of the distribution disc, and the grade partition information comprises a corresponding relation between the grade number and the behavior basic unit in the distribution disc.
7. The semiconductor test distribution control device according to claim 5, wherein the blanking control module comprises:
the distribution plate determining unit is used for determining a target distribution plate corresponding to the chip to be distributed according to the test result of the chip to be distributed and the grade division information;
the mobile coordinate calculation unit is connected with the distribution plate determination unit and used for calculating the mobile coordinates of the chips to be distributed according to the target distribution plate and the use information of the distribution plate;
and the control instruction output unit is connected with the mobile coordinate calculation unit and used for outputting a grabbing instruction according to the mobile coordinate.
8. The semiconductor test distribution control device of claim 6, further comprising:
the judging module is used for judging whether the behavior basic units in the distributing disc are full;
and the distribution plate replacing module is connected with the judging module and used for replacing the distribution plate according to a plate replacing mode corresponding to the distribution plate when the behavior basic unit in the distribution plate is full of materials.
9. A computer apparatus comprising a memory and a processor, the memory storing a computer program, characterized in that the processor implements the steps of the sorting method of the semiconductor test handler of any one of claims 1 to 4 when executing the computer program.
10. A computer-readable storage medium on which a computer program is stored, characterized in that the computer program, when being executed by a processor, implements the steps of the material dividing method of the semiconductor test handler of any one of claims 1 to 4.
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| CN202210011806.5A CN114392937A (en) | 2022-01-06 | 2022-01-06 | Material distribution method, control device and computer equipment of semiconductor test sorting machine |
| PCT/CN2022/126360 WO2023130802A1 (en) | 2022-01-06 | 2022-10-20 | Material distribution method for semiconductor test sorting machine, control apparatus, and computer device |
| TW111148008A TWI838008B (en) | 2022-01-06 | 2022-12-14 | Sorting method of sorting machine for semiconductor testing, control apparatus and computer device |
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| WO2023130802A1 (en) * | 2022-01-06 | 2023-07-13 | 苏州华兴源创科技股份有限公司 | Material distribution method for semiconductor test sorting machine, control apparatus, and computer device |
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| CN116666249B (en) * | 2023-07-28 | 2024-01-26 | 广东长兴半导体科技有限公司 | Wafer testing method |
| CN117810123B (en) * | 2023-12-28 | 2024-06-28 | 聚灿光电科技（宿迁）有限公司 | A binning device and a binning method |
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| WO2023130802A1 (en) | 2023-07-13 |
| TW202331278A (en) | 2023-08-01 |
| TWI838008B (en) | 2024-04-01 |
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