CN114392631A - Exhaust gas treatment efficiency adjustment method and exhaust gas treatment equipment - Google Patents
Exhaust gas treatment efficiency adjustment method and exhaust gas treatment equipment Download PDFInfo
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Abstract
The invention relates to the technical field of waste gas treatment, and provides a waste gas treatment efficiency adjusting method and waste gas treatment equipment. The exhaust gas treatment efficiency adjustment method includes: acquiring gas flow of a gas inlet, gas flow of a gas outlet, gas inlet concentration of a target substance, gas outlet concentration of the target substance and a concentration ratio of the gas outlet concentration of the target substance to the gas inlet concentration of the target substance of the waste gas treatment equipment; determining an adjusting coefficient as a ratio of the gas flow of the gas outlet to the gas flow of the gas inlet; determining the calculation processing efficiency of the target substance according to the product of the concentration ratio and the adjustment coefficient; acquiring the target processing efficiency of the target substance, and determining that the calculated processing efficiency of the target substance is lower than the target processing efficiency of the target substance; the control target substance is controlled to have a reduced concentration of the discharged gas and/or a smaller control adjustment coefficient. The method for adjusting the waste gas treatment efficiency adjusts the calculation of the calculation treatment efficiency through the adjustment coefficient so that the waste gas treatment effect meets the requirement of the actual treatment effect.
Description
Technical Field
The invention relates to the technical field of waste gas treatment, in particular to a waste gas treatment efficiency adjusting method and waste gas treatment equipment.
Background
In the industrial production process, waste gas is generated and needs to be treated by waste gas treatment equipment so as to meet the gas emission requirement.
In the production process of the semi-conductor industry, a large amount of chemicals and special gases are used, and a large amount of process waste gas of toxic and harmful gases is continuously generated in the production link. The process waste gas needs to be collected, treated and discharged synchronously with the production process, a waste gas treatment system and equipment are integral parts of the production process, and the safety and stability of the waste gas treatment system and equipment are directly related to the productivity utilization rate, the product yield, the occupational health of workers and the ecological environment. Therefore, exhaust gas treatment equipment is already used in the production line (e.g., 8-inch and 12-inch wafer production lines) to treat the exhaust gas generated by the various processes in the production line.
At present, for satisfying the requirement of exhaust-gas treatment equipment's exhaust-gas treatment efficiency, need adjust exhaust-gas treatment equipment's parameter, nevertheless there is the gap through the direct exhaust-gas treatment efficiency that reachs of sampling analysis and actual treatment efficiency, and the requirement of actual treatment effect is difficult to satisfy to the exhaust-gas treatment effect.
Disclosure of Invention
The invention provides a waste gas treatment efficiency adjusting method, which is used for solving the defect that the waste gas treatment effect in the prior art is difficult to meet the requirement of the actual treatment effect.
The invention provides a method for adjusting waste gas treatment efficiency, which comprises the following steps:
acquiring gas flow of a gas inlet, gas flow of a gas outlet, gas inlet concentration of a target substance, gas outlet concentration of the target substance and a concentration ratio of the gas outlet concentration of the target substance to the gas inlet concentration of the target substance of waste gas treatment equipment;
determining an adjustment coefficient, wherein the adjustment coefficient is the ratio of the gas flow of the gas outlet to the gas flow of the gas inlet;
determining the calculation processing efficiency of the target substance according to the product of the concentration ratio and the adjustment coefficient;
obtaining a target treatment efficiency of a target substance, and determining that the calculated treatment efficiency of the target substance is lower than the target treatment efficiency of the target substance;
controlling the outlet gas concentration of the target substance to be reduced and/or controlling the regulating coefficient to be smaller.
According to the exhaust gas treatment efficiency adjusting method provided by the invention, the step of acquiring the gas flow rate of the gas outlet of the exhaust gas treatment equipment comprises the following steps,
and acquiring the gas inlet flow of the auxiliary gas added between the gas inlet and the gas outlet, and determining that the gas outlet flow is the sum of the gas inlet flow of the auxiliary gas and the gas inlet flow of the gas inlet.
According to the exhaust gas treatment efficiency adjusting method provided by the invention, the step of acquiring the intake gas flow rate of the auxiliary gas added between the gas inlet and the gas outlet comprises the steps of,
the method comprises the steps of obtaining the gas inlet flow of the auxiliary gas introduced into the waste gas treatment equipment and the reaction gas flow reduced after the auxiliary gas participates in the reaction, and obtaining the difference value between the gas inlet flow of the auxiliary gas and the reaction gas flow, wherein the gas inlet flow of the auxiliary gas is the difference value.
According to the exhaust gas treatment efficiency adjusting method provided by the present invention, in the step of controlling the adjustment coefficient to become smaller,
controlling the inlet gas flow of the secondary gas to decrease and/or controlling the inlet gas flow to increase.
According to the method for adjusting the waste gas treatment efficiency, the waste gas is the waste gas in the semiconductor manufacturing process, and the flow of the nitrogen gas introduced from the gas inlet is controlled to be increased.
According to the waste gas treatment efficiency adjusting method provided by the invention, the waste gas is semiconductor process waste gas, the flow of the inlet gas of the gas for cleaning added between the gas inlet and the gas outlet is controlled to be reduced, and/or the flow of the gas for providing heat added between the gas inlet and the gas outlet is controlled to be reduced.
According to the waste gas treatment efficiency adjusting method provided by the invention, the gas for providing heat comprises combustible gas and combustion-supporting gas.
According to the exhaust gas treatment efficiency adjusting method provided by the invention, the gas flow of the gas inlet is the sum of the flows of all pipelines which are introduced into the exhaust gas treatment equipment before the intake concentration sampling point of the target substance.
According to the waste gas treatment efficiency adjusting method provided by the invention, the gas flow at the gas outlet is the sum of the flows of all pipelines which are introduced into the waste gas treatment equipment before the gas outlet concentration sampling point of the target substance.
The present invention provides an exhaust gas treatment apparatus for performing the exhaust gas treatment efficiency adjustment method as described above, the exhaust gas treatment apparatus being provided with a gas inlet sample collection device and a gas outlet gas collection device.
The waste gas treatment equipment provided by the invention comprises a first air inlet pipeline positioned at the upstream of the air inlet sample collection device and a second air inlet pipeline positioned between the air inlet sample collection device and the air outlet sample collection device, wherein the second air inlet pipeline is used for providing auxiliary gas, and the first air inlet pipeline and the second air inlet pipeline are both provided with flow meters.
The invention also provides an electronic device, which comprises a memory, a processor and a computer program stored on the memory and capable of running on the processor, wherein the processor executes the program to realize the steps of the exhaust gas treatment efficiency adjusting method.
The present invention also provides a non-transitory computer-readable storage medium having stored thereon a computer program which, when executed by a processor, implements the steps of the exhaust treatment efficiency adjustment method as recited in any one of the above.
The present invention also provides a computer program product comprising a computer program which, when executed by a processor, carries out the steps of the exhaust gas treatment efficiency adjustment method according to any one of the above.
According to the method for adjusting the waste gas treatment efficiency, the adjustment coefficient is introduced in the calculation process of the calculation treatment efficiency of waste gas treatment, the calculation of the calculation treatment efficiency of waste gas treatment is adjusted by considering the influence of dilution of waste gas in waste gas treatment equipment by auxiliary gas, so that the calculation treatment efficiency obtained by calculation is closer to the actual treatment efficiency, and the waste gas treatment effect meets the requirement of the actual treatment effect.
Drawings
In order to more clearly illustrate the technical solutions of the present invention or the prior art, the drawings needed for the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 is a schematic flow diagram of an exhaust treatment efficiency adjustment method provided by the present invention;
FIG. 2 is a schematic view of the structure of an exhaust gas treatment apparatus provided by the present invention;
fig. 3 is a schematic structural diagram of an electronic device provided in the present invention.
Reference numerals:
1. a sampling pump; 2. a sampling bag; 3. an air inlet sample collection device; 4. gas outlet sample collection device.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In addition, in the description of the present invention, "a plurality", and "a plurality" mean two or more unless otherwise specified.
In an embodiment of the first aspect of the present invention, as shown in fig. 1, there is provided an exhaust gas treatment efficiency adjusting method, including:
the waste gas treatment equipment can be used for treating various waste gases, the waste gases carry components which cannot be directly discharged, and the waste gases are treated in the waste gas treatment equipment to remove the components which cannot be directly discharged, so that the emission requirements are met and then the waste gases are discharged. The target substance may be one or more substances in the exhaust gas, the target substance may also be one or more types of substances, and the specific composition of the target substance is not limited herein. The state of the target substance may be gaseous, liquid or solid. In some cases, the target species is in a gaseous state. When the exhaust gas treatment device is used for semiconductor exhaust gas treatment, the target substance may be SiH 4.
The mass flow rates of the gas inlet flow rate Q1 and the gas outlet flow rate Q2 can be selected.
The inlet gas concentration C1 of the target substance and the outlet gas concentration C2 of the target substance are detected by a concentration analyzer, and a is C2/C1.
the adjustment coefficient b is Q2/Q1, and is used to represent the proportion of the increased gas flow rate at the outlet end of the exhaust gas treatment device relative to the inlet end, and may also be understood as the degree of dilution of the exhaust gas at the outlet end relative to the inlet end, and may also be referred to as a dilution coefficient. Dilution is understood to mean that, during the treatment of the exhaust gas, the gas added to the exhaust gas reduces the proportion of exhaust gas in the total gas.
the calculated treatment efficiency Y1 is 1 minus the product of the concentration ratio a and the adjustment factor b, i.e. the calculated treatment efficiency Y1 ═ 1-a ═ b ═ 1-b ═ C2/C1 ═ 1- (Q2 × C2)/(C1 × Q1).
the target process efficiency Y2 is generally a set value, such as the target process efficiency Y2 is set to 99.5%. If the calculated treatment efficiency Y1 is determined to be lower than the target treatment efficiency Y2, the treatment effect cannot meet the requirement, and the exhaust gas treatment process needs to be adjusted so that the calculated treatment efficiency Y1 is greater than or equal to the target treatment efficiency Y2 to meet the emission requirement.
And 150, controlling the outlet gas concentration C2 of the target substance to be reduced and/or controlling the regulating coefficient b to be smaller.
And according to the calculated processing efficiency Y1, namely 1-a, b, namely 1-b, C2/C1, controlling at least one of the concentration ratio a and the adjusting coefficient b to be reduced, calculating the processing efficiency Y1 until the calculated processing efficiency Y1 is greater than or equal to the target processing efficiency Y2. The intake concentration C1 of the target substance is generally not regulated depending on the composition of the exhaust gas. The outlet gas concentration C2 and the regulating coefficient b of the target substance are related to the waste gas treatment process, and can be adjusted through the waste gas treatment process, so that the outlet gas concentration C2 of the target substance can be controlled to be reduced and/or the regulating coefficient b can be controlled to be reduced, the calculation treatment efficiency Y1 can be increased, the calculation treatment efficiency Y1 is greater than or equal to the target treatment efficiency Y2, and the treated waste gas meets the emission requirement.
According to the method for adjusting the waste gas treatment efficiency, the adjustment coefficient b is added in the calculation process of calculating the treatment efficiency Y1, and compared with the treatment efficiency obtained by directly adopting a calculation mode of subtracting the concentration ratio a from 1 (namely, the influence of the dilution of waste gas by other gases on the treatment efficiency is not considered), the calculated treatment efficiency Y1 obtained in the embodiment is closer to the actual treatment efficiency, so that the problem that the waste gas treatment efficiency calculated by sampling analysis cannot meet the actual treatment efficiency is solved. The method for adjusting the waste gas treatment efficiency is suitable for various waste gas treatment processes, such as treatment of waste gas generated in a semiconductor production process.
It is understood that, in step 110, the step of obtaining the gas flow Q2 of the outlet of the exhaust gas treatment device includes,
and 210, acquiring the intake air flow Q3 of the auxiliary air added between the air inlet and the air outlet, and determining that the air outlet air flow Q2 is the sum of the intake air flow Q3 of the auxiliary air and the air inlet air flow Q1.
The gas flow Q2 of the gas outlet is obtained by calculation, that is, the gases introduced into the waste gas treatment equipment are added, so that the gas flow Q2 of the gas outlet is obtained, the gas flow Q2 of the gas outlet does not need to be additionally measured, and the gas flow detection work at the gas outlet end is not needed.
It should be noted that, in some cases, before the gas introduced into the exhaust gas treatment device is summed, the data needs to be sorted to avoid interference of external factors on the flow in each pipeline, so as to ensure the accuracy of the calculation result.
Of course, a flowmeter may be disposed at the air outlet end of the waste gas treatment device to detect the gas flow Q2 at the air outlet, and the gas flow Q2 at the air outlet is obtained through detection. The detected gas flow Q2 of the gas outlet and the calculated gas flow Q2 of the gas outlet can be mutually verified.
It is understood that, in step 210, the step of obtaining the increased inlet gas flow rate of the secondary gas between the gas inlet and the gas outlet includes,
the method comprises the steps of obtaining the air inlet flow of auxiliary gas introduced into the waste gas treatment equipment and the reaction gas flow reduced after the auxiliary gas participates in the reaction, and obtaining the difference value between the air inlet flow of the auxiliary gas and the reaction gas flow, wherein the air inlet flow of the auxiliary gas is the difference value.
The reaction gas flow reduced after reaction is subtracted from the gas inlet flow of the auxiliary gas introduced between the gas inlet and the gas outlet, so that the calculation of the gas inlet flow of the auxiliary gas is more accurate, and the calculation precision of the calculation processing efficiency is improved.
In some cases, the gas flow rate involved in the reaction may be used as the reaction gas flow rate decreased after the reaction, and if oxygen and hydrogen participate in the reaction, the flow rate of oxygen and the flow rate of natural gas introduced between the gas inlet and the gas outlet are removed, and the sum of the flow rates of other gases introduced between the gas inlet and the gas outlet is used as the gas inlet flow rate of the auxiliary gas.
In some cases, when the reaction gas is converted into a liquid or solid state after the reaction, the reduced flow rate of the reaction gas may be calculated according to the ratio of the reaction gas, and if the hydrogen gas and the oxygen gas are converted into water after the reaction, the ratio of the oxygen gas in the compressed air is calculated to obtain the flow rate of the oxygen gas, and the difference between the intake flow rate of the auxiliary gas and the flow rate of the reaction gas is obtained by subtracting the flow rate of the oxygen gas from the flow rate of the compressed air.
When the reaction gas reacts to obtain a substance, one part of the substance is in a gaseous state, and the other part of the substance is in a liquid state or a solid state, the reduced gas proportion can be calculated according to a specific reaction formula, and the difference value between the gas inlet flow of the auxiliary gas and the reaction gas flow is obtained. If the oxygen and the methane react, carbon dioxide and water are generated, the reduced reaction gas flow is equal to the gas flow which participates in subtracting the newly generated gas flow, so that the calculation of the intake gas flow of the auxiliary gas is more accurate, and the calculation precision of the calculation processing efficiency is improved.
It is understood that, in step 150, in the step of controlling the adjustment coefficient b to be smaller,
the control assist gas intake gas flow rate Q3 is decreased.
Since the adjustment coefficient b is the ratio of the outlet gas flow rate Q2 to the inlet gas flow rate Q1, that is, the adjustment coefficient b is Q2/Q1. Based on the fact that the gas flow rate Q2 of the gas outlet is equal to the sum of the gas flow rate Q1 of the gas inlet and the gas flow rate Q3 of the auxiliary gas, the adjustment coefficient b can be reduced by reducing the gas flow rate Q3 of the auxiliary gas, and the calculation processing efficiency Y1 is further increased, so that the waste gas processing efficiency meets the requirement of actual processing efficiency.
When the waste gas is the semiconductor processing waste gas, the flow of the inlet gas of the nitrogen added between the gas inlet and the gas outlet is controlled to be reduced, the performance of the nitrogen is stable, and the influence on the environment after the nitrogen is discharged is small.
The nitrogen gas added between the gas inlet and the gas outlet is generally used for blowing or heating, reduces the gas inlet flow of the nitrogen gas, has small influence on the treatment process of the waste gas by waste gas treatment equipment, and can also ensure the stable operation of the waste gas treatment equipment.
It is understood that, in step 150, in the step of controlling the adjustment coefficient b to be smaller,
the control inlet gas flow rate Q1 is increased.
Based on the fact that the outlet gas flow rate Q2 is equal to the sum of the inlet gas flow rate Q1 and the inlet gas flow rate Q3 of the auxiliary gas, and the adjustment coefficient b is the ratio of the outlet gas flow rate Q2 to the inlet gas flow rate Q1, that is, the adjustment coefficient b is (Q1+ Q3)/Q1, the adjustment coefficient b can be reduced by increasing the inlet gas flow rate Q1 of the auxiliary gas, and the calculation processing efficiency Y1 is increased, so that the waste gas processing efficiency meets the requirement of the actual processing efficiency.
When the waste gas is the waste gas in the semiconductor manufacturing process, the flow of the inlet gas for cleaning gas added between the gas inlet and the gas outlet is controlled to be reduced, and the gas for cleaning can be properly reduced under the condition of not influencing the operation of equipment.
The gas used for cleaning is generally a purge gas, which purges dust in the equipment.
When the waste gas is the semiconductor process waste gas, the flow of the inlet gas of the nitrogen introduced into the gas inlet is controlled to be increased, the nitrogen is used for heating the waste gas or blowing dust in the equipment, the nitrogen performance is stable, and the influence on the environment after the nitrogen is discharged is small.
When the waste gas is the semiconductor process waste gas, the gas flow of the gas which is added between the gas inlet and the gas outlet and used for providing heat is controlled to be reduced, and under the condition that the temperature requirement in the waste gas treatment equipment is not high, the gas flow of the gas used for providing heat is reduced, and the waste gas treatment effect is not influenced or the influence is small.
The gas for providing heat can be hot nitrogen or the combination of combustible gas and combustion-supporting gas, the hot nitrogen carries heat, and the combustible gas and the combustion-supporting gas are matched to burn to generate heat. Such as reducing the gas flow of nitrogen, or reducing the gas flow of combustible gas and combustion supporting gas.
It is understood that in step 110, the inlet gas flow rate Q1 is the sum of the flow rates of the respective pipelines leading to the exhaust gas treatment device before the inlet concentration sampling point of the target substance.
The intake concentration of the target substance is the concentration of the target substance in the mixed gas, and the mixed gas is the gas mixed by the gas introduced into each pipeline in front of the sampling point.
Before gas sampling of the gas inlet is carried out, all gas flow rates before the gas inlet sampling point are recorded, such as nitrogen flow rate of a vacuum pump before the gas inlet sampling point of semiconductor waste gas treatment equipment, hot nitrogen purging flow rate on a connecting pipeline, nitrogen purging flow rate of a gas inlet pipeline and the like.
It is understood that, in step 110, the outlet gas flow rate Q2 is the sum of the flow rates of the pipelines leading to the exhaust gas treatment device before the outlet concentration sampling point of the target substance.
According to the conservation of mass, the gas introduced into the waste gas treatment equipment before the gas outlet is discharged through the gas outlet. At this time, it is assumed that all the gas introduced into the exhaust gas treatment device is discharged in a gaseous state.
Before sampling gas at the gas outlet, recording all gas flows before and after the gas outlet sampling point, such as gas flow, compressed air flow, cavity purging flow and the like of semiconductor waste gas treatment equipment.
It can be understood that, the sum of the flow rates of the pipelines leading to the waste gas treatment equipment before the sampling point of the outlet gas concentration of the target substance,
the gas flow rate reduced by the participation reaction is removed.
In this case, a part of the gas is converted into a non-gaseous state after the reaction, and the total amount of the gas discharged through the gas outlet is determined by subtracting the part of the reaction gas.
Next, the adjustment of the processing efficiency of silane SiH4 will be described by taking as an example the application of the above-described exhaust gas processing efficiency adjustment method to a semiconductor manufacturing process.
The flow of gas at the gas inlet is equal to the flow of waste gas, the flow of nitrogen of the vacuum pump, the flow of hot nitrogen purging on the connecting pipeline, the flow of nitrogen purging on the gas inlet pipeline and the like
The gas flow of the gas outlet is equal to the waste gas flow, the nitrogen flow of the vacuum pump, the hot nitrogen purging flow on the connecting pipeline, the nitrogen purging flow of the gas inlet pipeline and the like, the gas flow, the compressed air flow, the cavity purging flow, the gas flow reduced after the natural gas and the compressed air participate in the combustion reaction
It should be noted that when the proportion of the exhaust gas at the intake end is small to some extent, the exhaust gas flow rate can be ignored in the calculation process. For example, the flow rate of the exhaust gas at the inlet is 0.5slm, and the flow rate of the other gas at the inlet is 100 slm.
Specifically, the gas flow Q1 at the gas inlet is 134slm, the total amount of the auxiliary gas at the rear end of the gas inlet sampling port and the front end of the gas outlet sampling port of the exhaust gas treatment device is 150+15+40 205slm, the amount of the natural gas and the compressed air participating in the combustion reaction is 150+ 21% (oxygen in the compressed air accounts for 21%) +15+ 95% (95% purity in the natural gas is methane) -15% 95% (carbon dioxide produced by the reaction) 31.5slm, the gas flow Q3 at the gas inlet is 205-31.5 173.5slm, and the gas flow Q2 at the gas outlet is 134+173.5 307.5 slm.
The feed gas concentration of the target substance C1, the feed gas concentration of SiH4 was 2940ppm, the outlet gas concentration of the target substance C2, and the outlet gas concentration of SiH4 was 11 ppm.
The regulating coefficient b is Q2/Q1 is 307.5/173.5 is 1.772.
The calculated processing efficiency of silane SiH4, Y1 ═ 1-C2 × b/C1 ═ 100 ═ 99.34% (1-11 × 1.772/2940) × 100%.
If the adjustment coefficient is not considered, the processing efficiency of the silane SiH4 is (1-C2/C1) × 100%, (1-11/2940) × 100%, (99.63%), and in this case, the processing efficiency of the silane SiH4 is 0.3% higher than the calculated processing efficiency Y1 in consideration of the adjustment coefficient, and the processing efficiency in consideration of the adjustment coefficient is more suitable for the actual processing efficiency.
In the above calculation method, in order to make the exhaust gas treatment efficiency meet the emission requirement, the variable parameters need to be adjusted to obtain the output according with the result.
The flow rates of the natural gas and the compressed air can be reduced to obtain smaller sampling concentration of the air outlet or smaller regulating coefficient to obtain higher waste gas treatment efficiency. The inlet gas flow rate may also be increased to achieve a smaller turndown factor and higher exhaust treatment efficiency. The gas flow of the gas outlet can be reduced to obtain a smaller regulating coefficient and obtain higher waste gas treatment efficiency.
When inflammable, combustible and combustion-supporting waste gas is treated, the waste gas treatment is insensitive to combustion temperature, has small dependence on heat generated by combustion of natural gas and compressed air, and can use a mode of reducing the flow rate of the natural gas and the compressed air; the waste gas which is easy to dissolve in water or the waste gas which reacts with water can be treated by a mode of reducing the regulating coefficient; for waste gas containing carbon and fluorine in perfluorinated compounds (PFC), the treatment of the waste gas is sensitive to the combustion temperature, the treatment efficiency of the waste gas is obviously influenced by low temperature, heat is provided by combustion of natural gas and compressed air, and the flow of the natural gas and the compressed air cannot be reduced.
In combination with the above, the adjustment method for reducing the flow rate of the natural gas and the compressed air and reducing the adjustment coefficient can be applied to the thin film process and the diffusion process in the semiconductor process for adjustment; the method for reducing the flow of natural gas and compressed air is not completely applicable to the etching process in the semiconductor process.
An embodiment of a second aspect of the present invention, shown in fig. 1 and 2, provides an exhaust gas treatment apparatus for performing the exhaust gas treatment efficiency adjustment method of the above embodiment, the exhaust gas treatment apparatus being provided with a gas inlet sample collection device 3 and a gas outlet gas collection device 4.
The structure of air inlet sample collection device 3 and gas outlet sample collection device 4 can be the same, refer to fig. 2 and show, sample collection device includes sampling pump 1 and sampling bag 2, and through sampling pump 1 with the waste gas suction in the exhaust-gas treatment equipment to sampling bag 2 in, sampling bag 2 is connected with the concentration analysis appearance, reachs gas concentration.
In fig. 2, Process Gas may be understood as Process exhaust Gas introduced into an Inlet of an exhaust Gas treatment apparatus, Inlet N2 Purge is nitrogen Gas introduced into an Inlet, and Waste Gas may be understood as Gas discharged from an outlet of the exhaust Gas treatment apparatus.
In some cases, the gas inlet sample collection device is connected with a first concentration analyzer, the gas outlet sample collection device is connected with a second concentration analyzer, the first concentration analyzer and the second concentration analyzer are used for analyzing the concentration of the target substance, and the waste gas in the sampling bag can be directly subjected to concentration analysis. Of course, the concentration analyzer may be a separate device, and the operator may remove the sampling bag 2 and carry the sampling bag 2 to be analyzed by the concentration analyzer.
It can be understood that the exhaust gas treatment device comprises a first air inlet pipeline located upstream of the air inlet sample collection device and a second air inlet pipeline located between the air inlet sample collection device 3 and the air outlet sample collection device 4, the second air inlet pipeline is used for providing auxiliary gas, and the first air inlet pipeline and the second air inlet pipeline are both provided with flow meters.
And measuring the air inlet flow of each pipeline through flow meters on the first air inlet pipeline and the second air inlet pipeline so as to calculate the air inlet gas flow and the air outlet gas flow.
It should be noted that the number of the first intake pipes and the number of the second intake pipes are not limited herein, and the number of the first intake pipes is the same as the number of the intake pipes at the air inlet, and the number of the second intake pipes is the same as the number of the pipes for supplying the auxiliary gas.
Fig. 3 illustrates a physical structure diagram of an electronic device, which may include, as shown in fig. 3: a processor (processor)810, a communication Interface 820, a memory 830 and a communication bus 840, wherein the processor 810, the communication Interface 820 and the memory 830 communicate with each other via the communication bus 840. The processor 810 may invoke logic instructions in the memory 830 to perform the above-described exhaust treatment efficiency adjustment method.
In addition, the logic instructions in the memory 830 may be implemented in software functional units and stored in a computer readable storage medium when the logic instructions are sold or used as independent products. Based on such understanding, the technical solution of the present invention may be embodied in the form of a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
In another aspect, the present invention also provides a computer program product comprising a computer program, the computer program being stored on a non-transitory computer-readable storage medium, wherein when the computer program is executed by a processor, the computer is capable of executing the exhaust gas treatment efficiency adjustment method provided by the above methods.
In yet another aspect, the present disclosure also provides a non-transitory computer readable storage medium having stored thereon a computer program that, when executed by a processor, is implemented to perform the methods described above to provide an exhaust treatment efficiency adjustment method.
The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.
Through the above description of the embodiments, those skilled in the art will clearly understand that each embodiment can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware. With this understanding in mind, the above-described technical solutions may be embodied in the form of a software product, which can be stored in a computer-readable storage medium such as ROM/RAM, magnetic disk, optical disk, etc., and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the methods described in the embodiments or some parts of the embodiments.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. An exhaust gas treatment efficiency adjustment method, characterized by comprising:
acquiring gas flow of a gas inlet, gas flow of a gas outlet, gas inlet concentration of a target substance, gas outlet concentration of the target substance and a concentration ratio of the gas outlet concentration of the target substance to the gas inlet concentration of the target substance of waste gas treatment equipment;
determining an adjustment coefficient, wherein the adjustment coefficient is the ratio of the gas flow of the gas outlet to the gas flow of the gas inlet;
determining the calculation processing efficiency of the target substance according to the product of the concentration ratio and the adjustment coefficient;
obtaining a target treatment efficiency of a target substance, and determining that the calculated treatment efficiency of the target substance is lower than the target treatment efficiency of the target substance;
controlling the outlet gas concentration of the target substance to be reduced and/or controlling the regulating coefficient to be smaller.
2. The exhaust gas treatment efficiency adjusting method according to claim 1, wherein the step of obtaining the gas flow rate at the gas outlet of the exhaust gas treatment device includes,
and acquiring the gas inlet flow of the auxiliary gas added between the gas inlet and the gas outlet, and determining that the gas outlet flow is the sum of the gas inlet flow of the auxiliary gas and the gas inlet flow of the gas inlet.
3. The exhaust gas treatment efficiency adjusting method according to claim 2, wherein the step of acquiring an intake gas flow rate of the assist gas that increases between the gas inlet and the gas outlet includes,
the method comprises the steps of obtaining the gas inlet flow of the auxiliary gas introduced into the waste gas treatment equipment and the reaction gas flow reduced after the auxiliary gas participates in the reaction, and obtaining the difference value between the gas inlet flow of the auxiliary gas and the reaction gas flow, wherein the gas inlet flow of the auxiliary gas is the difference value.
4. The exhaust gas treatment efficiency adjustment method according to claim 2, wherein in the step of controlling the adjustment coefficient to become smaller,
controlling the inlet gas flow of the secondary gas to decrease and/or controlling the inlet gas flow to increase.
5. The exhaust gas treatment efficiency adjusting method according to claim 4, wherein the exhaust gas is a semiconductor process exhaust gas, and the flow rate of the nitrogen gas introduced through the gas inlet is controlled to be increased.
6. The exhaust gas treatment efficiency adjusting method according to claim 4, wherein the exhaust gas is a semiconductor process exhaust gas, and the flow rate of the gas introduced between the gas inlet and the gas outlet for cleaning is controlled to be reduced, and/or the flow rate of the gas introduced between the gas inlet and the gas outlet for supplying heat is controlled to be reduced.
7. The exhaust gas treatment efficiency adjusting method according to claim 6, wherein the gas for supplying heat includes a combustible gas and a combustion-supporting gas.
8. The exhaust gas treatment efficiency adjustment method according to any one of claims 1 to 7,
the gas flow of the gas inlet is the sum of the flows of all pipelines which are introduced into the waste gas treatment equipment before the gas inlet concentration sampling point of the target substance;
and/or the gas flow of the gas outlet is the sum of the flows of all pipelines which are introduced into the waste gas treatment equipment before the gas outlet concentration sampling point of the target substance.
9. An exhaust gas treatment apparatus for carrying out the exhaust gas treatment efficiency adjustment method according to any one of claims 1 to 8, the exhaust gas treatment apparatus being provided with a gas inlet sample collection device and a gas outlet gas collection device.
10. The exhaust gas treatment apparatus of claim 9, comprising a first inlet line upstream of the inlet sample collection device and a second inlet line between the inlet sample collection device and the outlet sample collection device for providing an auxiliary gas, wherein both the first inlet line and the second inlet line are provided with a flow meter.
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