CN114363483B - Camera module, electronic equipment and preparation method of camera module - Google Patents

Abstract

A camera module, an electronic device and a method for manufacturing the camera module are disclosed. The camera module comprises: the photosensitive assembly comprises a circuit board and a photosensitive chip electrically connected to the circuit board; a lens assembly including a lens carrier and an optical lens, the optical lens being mounted within the lens carrier, the lens carrier being mounted on the photosensitive assembly; and the heat dissipation assembly comprises a heat dissipation plate and at least one heat conduction bridge, wherein the heat dissipation plate is overlapped on the lower surface of the circuit board, and the at least one heat conduction bridge extends upwards from the heat dissipation plate to the outer surface of the lens carrier, so that heat led out through the heat dissipation plate can be conducted to the outer surface of the lens carrier along the at least one heat conduction bridge and dissipated to the outside through the outer surface of the lens carrier. Therefore, when the camera module is assembled in the electronic equipment, heat generated by the camera module can be emitted by the heat dissipation component.

Description

Camera module, electronic equipment and preparation method of camera module

Technical Field

The application relates to the field of camera modules, in particular to a camera module, electronic equipment and a preparation method of the camera module.

Background

With the popularity of mobile electronic devices, related technologies applied to camera modules of mobile electronic devices for helping users acquire images (e.g., videos or images) have been rapidly developed and advanced.

When the camera module works, parts such as a photosensitive chip and the like can generate heat, if the parts are not timely radiated, the heat is accumulated to a certain extent to cause the related parts and the relation between the parts to be changed, so that the imaging performance of the camera module is influenced, and the service life of the camera module is further influenced. For example, if timely heat dissipation is not obtained, the imaging performance of the photosensitive chip may be affected. Along with the development of the camera module towards the direction of high pixels, the size of the photosensitive chip is gradually increased, so that more and more heat is generated during working, and the heat dissipation problem of the camera module is more and more important.

Based on this, many module manufacturers begin to pay attention to the heat dissipation performance of the camera module, and at present, the commonly used heat dissipation scheme is: a heat sink (e.g., a metal plate is disposed on the back surface of the circuit board or the photosensitive chip) is disposed on the back surface of the circuit board or the photosensitive chip of the camera module, so as to transfer heat to an external space through the heat sink.

Although providing a heat sink on the back side of the circuit board or the photosensitive chip can improve the heat dissipation performance of the camera module, when the camera module is assembled in a terminal device (e.g., a smart phone), the heat dissipation performance is often poor.

Therefore, there is a need for an imaging module with better heat dissipation performance, so that the imaging module still has better heat dissipation performance after being assembled in a terminal device.

Disclosure of Invention

An advantage of the present application is to provide a camera module, an electronic device, and a method for manufacturing the camera module, wherein the camera module is provided with a heat dissipation link extending between a bottom of the camera module and an upper region of the camera module, so that the camera module has relatively better heat dissipation performance after being assembled to the electronic device.

Another advantage of the present application is to provide an image capturing module, an electronic device, and a method for manufacturing an image capturing module, wherein after the image capturing module is assembled to the electronic device, heat generated by the image capturing module can be propagated upward from a bottom of the image capturing module and be dissipated from an upper region of the image capturing module to the outside through the heat dissipating link, in this way, the image capturing module still has relatively better heat dissipating performance after being assembled to the electronic device.

Another advantage of the present application is to provide an image pickup module, an electronic apparatus, and a method of manufacturing an image pickup module, wherein in some examples of the present application, the heat dissipation assembly includes a heat dissipation plate stacked on a lower surface of a circuit board of the image pickup module and an outer surface of a lens carrier extending upward from the heat dissipation plate to the image pickup module, in such a manner that a heat dissipation link extending between a bottom of the image pickup module and an upper region of the image pickup module is formed.

Another advantage of the present application is to provide an image pickup module, an electronic apparatus, and a method of manufacturing an image pickup module, wherein in other examples of the present application, the heat dissipation assembly includes a heat dissipation plate stacked on a lower surface of a circuit board of the image pickup module and an outer bracket extending upward from the heat dissipation plate to the image pickup module, in such a manner that a heat dissipation link extending between a bottom of the image pickup module and an upper region of the image pickup module is formed.

Another advantage of the present application is to provide an image capturing module, an electronic device, and a method for manufacturing an image capturing module, in which the heat dissipation assembly can be disposed in the image capturing module without changing the size and the structural configuration of the original image capturing module, that is, the image capturing module with the heat dissipation assembly according to the embodiment of the present application can be implemented without changing the structure and the size of the existing image capturing module.

Other advantages and features of the application will become apparent from the following description, and may be realized by means of the instrumentalities and combinations particularly pointed out in the claims.

To achieve at least one of the above advantages, the present application provides an image capturing module, comprising:

the photosensitive assembly comprises a circuit board and a photosensitive chip electrically connected to the circuit board;

A lens assembly including a lens carrier and an optical lens, the optical lens being mounted within the lens carrier, the lens carrier being mounted on the photosensitive assembly; and

The heat dissipation assembly comprises a heat dissipation plate and at least one heat conduction bridge, wherein the heat dissipation plate is overlapped on the lower surface of the circuit board, and the at least one heat conduction bridge extends upwards from the heat dissipation plate to the outer surface of the lens carrier, so that heat led out through the heat dissipation plate can be conducted to the outer surface of the lens carrier along the at least one heat conduction bridge and dissipated to the outside through the outer surface of the lens carrier.

In the camera module according to the application, the lens carrier is embodied as a drive element, wherein the drive element comprises a housing which sets an outer surface of the drive element, the housing being made of a metallic material.

In the camera module according to the application, the heat conducting bridge has a first end, a second end opposite to the first end, and a heat conducting bridge body extending between the first end and the second end, wherein the first end is connected to the heat dissipating plate, and the second end extends upward from the first end onto an outer surface of the lens carrier.

In the image pickup module according to the present application, the second end portion is in direct contact with the outer surface of the lens carrier, and is attached to the outer surface of the lens carrier by an adhesive laid on the outer side surface of the second end portion and the outer surface of the lens carrier.

In the image pickup module according to the present application, the second end portion is attached to the outer surface of the lens carrier by an adhesive provided between the inner side surface of the second end portion and the outer surface of the lens carrier.

In the camera module according to the application, the adhesive is implemented as a conductive silver paste.

In the image pickup module according to the present application, the image pickup module further includes an outer bracket for protecting the photosensitive assembly and the lens assembly, the outer bracket having a gap with the lens carrier.

In the camera module according to the present application, the thickness dimension of the heat-conducting bridge is smaller than the dimension of the gap.

In the camera module according to the application, the size of the gap is 100um to 150um, and the thickness of the heat-conducting bridge is 25um to 75um.

In the camera module according to the application, the thickness dimension of the heat dissipation plate is larger than the thickness dimension of the heat conduction bridge.

In the camera module according to the application, the heat-conducting bridge is made of a turnover material, the heat-conducting bridge is turned upwards from the heat-radiating plate to the outer surface of the lens carrier, the heat-conducting bridge forms a bending part, and the bending part has a bending angle.

In the camera module according to the application, the angle of the bending angle is smaller than 90 °.

In the image pickup module according to the present application, the angle of the bending angle is equal to 90 degrees.

In the camera module according to the application, the bending part is abutted against the inner surface of the outer support, so that the inner surface of the outer support provides a biasing force for forcing the heat conduction bridge to be attached to the outer surface of the lens carrier.

In the camera module according to the present application, the outer holder has an opening exposing an upper surface of the lens carrier.

In the camera module according to the present application, the at least one heat conducting bridge includes a first heat conducting bridge, a second heat conducting bridge and a third heat conducting bridge, wherein the first heat conducting bridge, the second heat conducting bridge and the third heat conducting bridge extend from the heat dissipation plate upwards to three side surfaces of the lens carrier, respectively.

In the camera module according to the present application, the circuit board has a slot concavely formed on an upper surface thereof, wherein the photosensitive chip is disposed in the slot.

In the camera module according to the present application, the slit is implemented as a through-slit penetratingly formed between an upper surface of the wiring board and a lower surface thereof, and the photosensitive chip is disposed in the through-slit and directly contacts the heat dissipation plate.

According to another aspect of the present application, there is also provided an image capturing module, including:

An outer bracket;

The photosensitive assembly is arranged in the outer bracket and comprises a circuit board and a photosensitive chip electrically connected with the circuit board;

The lens assembly is arranged in the outer direct part and comprises a lens carrier and an optical lens, wherein the optical lens is arranged in the lens carrier, and the lens carrier is arranged on the photosensitive assembly; and

The heat dissipation assembly comprises a heat dissipation plate and at least one heat conduction bridge, wherein the heat dissipation plate is overlapped on the lower surface of the circuit board, and the at least one heat conduction bridge extends upwards from the heat dissipation plate to the inner surface of the outer support, so that heat led out through the heat dissipation plate can be conducted to the inner surface of the outer support along the at least one heat conduction bridge and dissipated to the outside through the outer support.

In the camera module according to the application, the heat conduction bridge has a first end, a second end opposite to the first end, and a heat conduction bridge body extending between the first end and the second end, wherein the first end is connected to the heat dissipation plate, and the second end extends upward from the first end onto the inner surface of the outer bracket.

In the camera module according to the present application, the second end portion is in direct contact with the inner surface of the outer bracket, and is attached to the inner surface of the outer bracket by an adhesive laid on the outer side surface of the second end portion and the inner surface of the outer bracket.

In the image pickup module according to the present application, the second end portion is attached to the inner surface of the outer bracket by an adhesive provided between the inner side surface of the second end portion and the inner surface of the outer bracket.

In the camera module according to the application, a gap is formed between the outer support and the lens carrier and between the outer support and the photosensitive assembly, and the thickness dimension of the heat-conducting bridge is smaller than the dimension of the gap.

In the camera module according to the application, the size of the gap is 100um to 150um, and the thickness of the heat-conducting bridge is 25um to 75um.

According to still another aspect of the present application, there is also provided an electronic apparatus including the camera module as described above.

According to still another aspect of the present application, there is also provided a method for manufacturing an image capturing module, including:

providing a photosensitive assembly, wherein the photosensitive assembly comprises a circuit board and a photosensitive chip electrically connected to the circuit board;

Mounting a lens assembly to the photosensitive assembly, the lens assembly comprising a lens carrier and an optical lens, the optical lens being mounted within the lens carrier, the lens carrier being mounted on the photosensitive assembly; and providing a heat dissipation assembly, wherein the heat dissipation assembly comprises a heat dissipation plate and a heat conduction bridge extending from the heat dissipation plate;

superposing a heat radiation plate of the heat radiation assembly on the lower surface of the circuit board; and

The heat conducting bridge is folded upwards so that the heat conducting bridge extends to the outer surface of the lens carrier, and heat led out through the heat radiating plate can be conducted to the outer surface of the lens carrier along the at least one heat conducting bridge and radiated to the outside through the outer surface of the lens carrier.

In the manufacturing method according to the present application, after the heat conduction bridge is folded upward so that the heat conduction bridge is extended to the outer surface of the lens carrier, further comprising: the free end of the heat-conducting bridge is fixed to the outer surface of the lens carrier by an adhesive.

In the manufacturing method according to the present application, fixing the free end portion of the heat-conducting bridge to the outer surface of the lens carrier by an adhesive includes: directly contacting the free end of the heat conducting bridge with the outer surface of the lens carrier; and applying an adhesive on an outer side surface of the free end portion and an outer surface of the lens carrier to fix the free end portion of the heat-conducting bridge to the outer surface of the lens carrier by the adhesive.

In the manufacturing method according to the present application, fixing the free end portion of the heat-conducting bridge to the outer surface of the lens carrier by an adhesive includes: an adhesive is applied between an inner side surface of the free end portion of the heat-conducting bridge and an outer surface of the lens carrier to fix the free end portion of the heat-conducting bridge to the outer surface of the lens carrier by the adhesive.

In the production method according to the present application, the production method further comprises: and an outer support is arranged outside the photosensitive assembly and the lens assembly.

In the manufacturing method according to the present application, a gap is formed between the outer support and the lens carrier and between the outer support and the photosensitive member, and the thickness dimension of the heat-conducting bridge is smaller than the dimension of the gap.

In the manufacturing method according to the present application, the gap has a size of 100um to 150um, and the heat-conducting bridge has a thickness size of 25um to 75um.

Further objects and advantages of the present application will become fully apparent from the following description and the accompanying drawings.

These and other objects, features and advantages of the present application will become more fully apparent from the following detailed description, the accompanying drawings and the appended claims.

Drawings

The above and other objects, features and advantages of the present application will become more apparent by describing embodiments of the present application in more detail with reference to the attached drawings. The accompanying drawings are included to provide a further understanding of embodiments of the application and are incorporated in and constitute a part of this specification, illustrate the application and together with the embodiments of the application, and not constitute a limitation to the application. In the drawings, like reference numerals generally refer to like parts or steps.

Fig. 1 illustrates a schematic diagram of an image capturing module according to an embodiment of the present application.

Fig. 2 illustrates a schematic view of the heat dissipating assembly according to an embodiment of the present application.

Fig. 3 illustrates a schematic view of the heat conduction bridge of the heat dissipation assembly being attached to the outer surface of the lens carrier according to an embodiment of the present application.

Fig. 4 illustrates a schematic diagram of a variant implementation in which the heat-conducting bridge of the heat-dissipating component is attached to the outer surface of the lens carrier, according to an embodiment of the present application.

Fig. 5 illustrates a schematic view of the bending part of the heat-conducting bridge of the heat-dissipating component abutting against the inner surface of the outer bracket according to an embodiment of the application.

Fig. 6 illustrates a schematic diagram of a modified embodiment of the camera module according to an embodiment of the present application.

Fig. 7 illustrates a schematic diagram of an image capturing module according to another embodiment of the present application.

Fig. 8A-8B are schematic diagrams illustrating a process of manufacturing the camera module according to an embodiment of the present application.

Fig. 9 illustrates a schematic diagram of an electronic device according to an embodiment of the application.

Fig. 10 illustrates a schematic view of the camera module assembled to the electronic device according to an embodiment of the present application.

Detailed Description

Hereinafter, exemplary embodiments according to the present application will be described in detail with reference to the accompanying drawings. It should be apparent that the described embodiments are only some embodiments of the present application and not all embodiments of the present application, and it should be understood that the present application is not limited by the example embodiments described herein.

Summary of the application

As described above, although providing the heat sink on the back surface of the circuit board or the photosensitive chip can improve the heat dissipation performance of the camera module, the heat dissipation performance is often poor when the camera module is assembled in a terminal device (for example, a smart phone).

More specifically, when the camera module is assembled to the terminal device, the camera module is generally fixed to the terminal device by a limiting member, and a gap is formed between the bottom of the camera module and the terminal device, wherein the heat sink is located in the gap. In this way, the heat generated by the camera module (especially the heat generated by the photosensitive chip) is transferred to the gap through the heat dissipation member.

However, the gap is generally closed, that is, the gap formed by the camera module and the terminal device is a closed space, so that heat is accumulated in the gap, and the heat dissipation performance of the camera module after being assembled to the terminal device is often poor. That is, the existing heat dissipation link of the camera module is: the generated heat is downwards transferred through the heat dissipation part arranged at the bottom of the camera module, and is dissipated to the outside through the heat dissipation part.

With the gradual rise of the performance requirements of the photosensitive chips, the high-performance photosensitive chips bring more heat, and the existing heat dissipation means are difficult to meet the application requirements.

Aiming at the technical problems, the basic conception of the application is as follows: the heat dissipation link extending between the bottom of the camera module and the upper region of the camera module is configured for the camera module, so that after the camera module is assembled in the electronic device, heat generated by the camera module can be propagated upwards from the bottom of the camera module and dissipated from the upper region of the camera module to the outside through the heat dissipation link, and in such a way, the camera module still has relatively good heat dissipation performance after being assembled in the electronic device.

That is, the basic idea of the present application is: and constructing heat dissipation links in other directions for the camera module so as to enrich heat dissipation means and improve heat dissipation performance of the camera module, in particular to heat dissipation performance of the camera module after the camera module is assembled to electronic equipment.

In particular, in an upper region of the camera module relative to its bottom (where the upper region represents all regions of the camera module that are higher than the bottom, but not the top region of the camera module), the outer surface of the lens carrier (especially when the lens carrier is implemented as a driving element) and the outer support of the camera module have good heat conducting properties, so in an embodiment of the application a heat conducting bridge can be constructed between the bottom of the camera module and the outer surface of the lens carrier or between the bottom of the camera module and the outer support, so that heat conducted out of the bottom of the camera module can be transferred to the outer surface of the lens carrier or the outer support by means of the heat conducting bridge and further dissipated to the outside by means of the outer surface of the lens carrier or the outer surface of the outer support.

Based on this, the present application provides an image capturing module, which includes: the photosensitive assembly comprises a circuit board and a photosensitive chip electrically connected to the circuit board; a lens assembly including a lens carrier and an optical lens, the optical lens being mounted within the lens carrier, the lens carrier being mounted on the photosensitive assembly; and the heat dissipation assembly comprises a heat dissipation plate and at least one heat conduction bridge, wherein the heat dissipation plate is overlapped on the lower surface of the circuit board, and the at least one heat conduction bridge extends upwards from the heat dissipation plate to the outer surface of the lens carrier, so that heat led out through the heat dissipation plate can be conducted to the outer surface of the lens carrier along the at least one heat conduction bridge and dissipated to the outside through the outer surface of the lens carrier.

Based on this, the application also provides a camera module, which comprises: an outer bracket; the photosensitive assembly is arranged in the outer bracket and comprises a circuit board and a photosensitive chip electrically connected with the circuit board; the lens component is arranged on the photosensitive path of the photosensitive chip and comprises a lens carrier and an optical lens, wherein the optical lens is arranged in the lens carrier, and the lens carrier is arranged on the photosensitive component; and the heat dissipation assembly comprises a heat dissipation plate and at least one heat conduction bridge, wherein the heat dissipation plate is overlapped on the lower surface of the circuit board, and the at least one heat conduction bridge extends upwards from the heat dissipation plate to the inner surface of the outer bracket so that heat led out through the heat dissipation plate can be conducted to the inner surface of the outer bracket along the at least one heat conduction bridge and dissipated to the outside through the outer bracket.

Having described the basic principles of the present application, various non-limiting embodiments of the present application will now be described in detail with reference to the accompanying drawings.

Exemplary Camera Module and photosensitive Assembly thereof

Fig. 1 illustrates a schematic diagram of an image capturing module according to an embodiment of the present application. As shown in fig. 1, the camera module 100 according to the embodiment of the present application includes: a photosensitive assembly 10 and a lens assembly 20 held in a photosensitive path of the photosensitive assembly 10. For example, the lens assembly 20 is attached to the photosensitive assembly 10 by an adhesive to be held on a photosensitive path of the photosensitive assembly 10.

As shown in fig. 1, the photosensitive assembly 10 includes a circuit board 11, a photosensitive chip 12 electrically connected to the circuit board 11, a lens holder 13 disposed on the circuit board 11, and a filter element 14 held on a photosensitive path of the photosensitive chip 12, wherein the circuit board 11, the lens holder 13, and the filter element 14 form a closed space, and the photosensitive chip 12 is disposed in the closed space. Therefore, when the camera module 100 works, if the heat generated by the photosensitive chip 12 cannot be effectively removed, the heat will be accumulated in the closed space, so that the temperature of the photosensitive assembly 10 is too high, and the working performance of the photosensitive assembly is affected.

As shown in fig. 1, the lens assembly 20 includes a lens carrier 21 and an optical lens 22, wherein the lens carrier 21 is mounted on the photosensitive assembly 10 (for example, the lens carrier 21 is attached to the photosensitive assembly 10 by an adhesive), and the optical lens 22 is carried in the lens carrier 21. Here, in an embodiment of the present application, the lens carrier 21 is implemented as a driving element, such as a voice coil motor, SMA motor, piezoceramic motor, etc., which is capable of carrying and driving the optical lens 22 to move. For example, when the image capturing module 100 is implemented as a live focus image capturing module 100, the driving element can carry the optical lens 22 to move along the photosensitive path set by the photosensitive chip 12 so as to change the relative positional relationship between the optical lens 22 and the photosensitive chip 12; for another example, when the image capturing module 100 is implemented as an optical anti-shake image capturing module 100, the driving element can carry the optical lens 22 to move in a plane perpendicular to the optical axis, so as to implement optical anti-shake.

It will be appreciated by those skilled in the art that typically the drive element comprises an outer housing made of a metallic material which forms the outer surface of the drive element, and thus the outer surface of the drive element has good heat conducting properties.

As shown in fig. 1, in order to improve the heat dissipation performance of the camera module 100, especially, the heat dissipation performance of the camera module 100 after being assembled in an electronic device, in an embodiment of the present application, the camera module 100 further includes a heat dissipation component 30. As shown in fig. 1 and 2, the heat dissipating assembly 30 includes a heat dissipating plate 31 and at least one heat conducting bridge 32, wherein the heat dissipating plate 31 is stacked on the lower surface of the circuit board 11, and the at least one heat conducting bridge 32 extends upward from the heat dissipating plate 31 to the outer surface of the lens carrier 21, so that the heat conducted out through the heat dissipating plate 31 can be conducted to the outer surface of the lens carrier 21 along the at least one heat conducting bridge 32 and dissipated to the outside through the outer surface of the lens carrier 21. It should be noted that the upward extension in the present application is not necessarily limited to be vertically upward in azimuth, and may also mean extending toward the object side substantially along the optical axis direction.

That is, in comparison with the conventional camera module 100, in the embodiment of the present application, the camera module 100 further includes a heat-conducting bridge 32 extending between the heat-dissipating plate 31 and the outer surface of the lens carrier 21, so as to construct a heat-dissipating link for the camera module 100, which extends between the bottom of the camera module 100 and the upper region of the camera module 100, through the heat-conducting bridge 32, such that, after the camera module 100 is assembled to the electronic device, heat generated by the camera module 100 can be propagated upward from the bottom of the camera module 100 through the heat-dissipating link and dissipated from the upper region of the camera module 100 to the outside, in such a way that the camera module 100 has relatively better heat dissipation performance after being assembled to the electronic device.

In the embodiment of the present application, the heat dissipation plate 31 and the heat conduction bridge 32 of the heat dissipation assembly 30 are made of a material having high heat conduction properties, for example, a metal material.

Specifically, in the embodiment of the present application, the heat-conducting bridge 32 has a first end 321 connected to the heat dissipation plate 31, a second end 322 opposite to the first end 321, and a heat-conducting bridge body 323 extending between the first end 321 and the second end 322, wherein the second end 322 of the heat-conducting bridge 32 is a free end of the heat-conducting bridge 32. In the embodiment of the present application, the second end portion 322 of the heat conducting bridge 32 is turned upwards from the first end portion 321 and is attached to the outer surface of the lens carrier 21, in such a way that the heat generated by the photosensitive chip 12 can be conducted out through the first end portion 321 of the heat conducting bridge 32 and propagated upwards to the second end portion 322 by the heat conducting bridge body 323, and further conducted onto the outer surface of the lens carrier 21 by the second end portion 322, so that the heat can be dissipated to the outside by the outer surface of the lens carrier 21.

Here, as shown in fig. 1, in the embodiment of the present application, the outer surface of the lens carrier 21 is formed of the outer case of the driving element, and generally, the outer case of the driving element has a U-shaped structure, that is, the outer surface of the lens carrier 21 includes the top surface and the side surfaces of the driving element. Accordingly, in the embodiment of the present application, the second end portion 322 of the heat conductive bridge 32 may be attached to the side surface of the driving element or the top surface of the driving element (of course, it is preferable to attach the second end portion 322 of the heat conductive bridge 32 to the side surface of the driving element for convenience of implementation), so that heat conducted through the heat conductive bridge 32 can be dissipated to the outside through the top surface and the side surface of the driving element.

It should be noted that the camera module 100 generally further includes an outer bracket 40 for protecting the photosensitive assembly 10 and the lens assembly 20, and the outer bracket 40 covers the photosensitive assembly 10 and the lens assembly 20 and has a gap with the lens carrier 21. It should be noted that the outer bracket 40 generally encloses the side surfaces of the drive element because, in practice, more of the heat conducted through the thermally conductive bridge 32 is dissipated to the outside through the top surface of the drive element.

It should be noted that, in the embodiment of the present application, the contact manner between the heat-conducting bridge 32 and the outer surface of the lens carrier 21 is not limited by the present application, and may be a surface contact, a line contact or a point contact, and, of course, it is preferable to use a surface contact manner, so that not only the heat-conducting area can be increased, but also the bonding strength between the heat-conducting bridge 32 and the outer surface of the lens carrier 21 can be enhanced.

In attaching the second end portion 322 of the heat conductive bridge 32 to the outer surface of the lens carrier 21, the second end portion 322 may be directly contacted to the outer surface of the lens carrier 21 and attached to the outer surface of the lens carrier 21 by an adhesive 50 laid on the outer side surface of the second end portion 322 and the outer surface of the lens carrier 21, as shown in fig. 3. It should be appreciated that by directly contacting the second end portion 322 of the heat conducting bridge 32 to the outer surface of the lens carrier 21, the heat conducted out through the second end portion 322 can be directly conducted to the outer surface of the lens carrier 21, so as to ensure the heat dissipation capability of the heat dissipation component 30.

Of course, in other examples of the application, the second end 322 of the thermally conductive bridge 32 may be attached to the outer surface of the lens carrier 21 in other ways. For example, in the example illustrated in fig. 4, the second end portion 322 is attached to the outer surface of the lens carrier 21 by an adhesive 50 provided between the inner side surface of the second end portion 322 and the outer surface of the lens carrier 21. That is, in this example, the second end 322 of the heat conduction bridge 32 is not in direct contact with the outer surface of the lens carrier 21, but is attached to the outer surface of the lens carrier 21 by the adhesive 50. Preferably, in order to reduce the influence of the adhesive 50 on the heat conductive property, it is preferable that in the embodiment of the present application, an adhesive 50 having a better heat conductive property, for example, an electrically conductive silver paste, is used.

Of course, in other examples of the application, the second end 322 of the heat conducting bridge 32 may be attached to the outer surface of the lens carrier 21 by non-adhesive means, for example by welding, which is not limiting to the application.

It should be understood that, in the embodiment of the present application, the heat-conducting bridge 32 is folded upwards from the heat dissipation plate 31 to the outer surface of the lens carrier 21, so that the heat-conducting bridge 32 forms a bending portion 320, and the bending portion 320 has a bending angle, and the angle of the bending angle is less than or equal to 90 degrees.

Here, when the inflection angle is smaller than 90 degrees, the second end 322 of the heat conduction bridge 32 can be in direct contact with the outer surface of the lens carrier 21 as the heat conduction bridge 32 extends upward, and therefore, when the inflection angle is smaller than 90 degrees, it is preferable to attach the second end 322 of the heat conduction bridge 32 to the outer surface of the lens carrier 21 by disposing an adhesive 50 on the outer side surface of the second end 322 and the outer surface of the lens carrier 21; when the bending angle is equal to 90 degrees, it should be understood that if the heat conduction bridge 32 has sufficient strength and rigidity, the second end portion 322 of the heat conduction bridge 32 cannot be in direct contact with the outer surface of the lens carrier 21, and therefore, it is preferable that the second end portion 322 of the heat conduction bridge 32 is attached to the outer surface of the lens carrier 21 by providing an adhesive 50 between the inner side surface of the second end portion 322 and the outer surface of the lens carrier 21. Of course, it should be readily understood that when the bending angle is smaller than 90 degrees, the second end portion 322 of the heat-conducting bridge 32 may be attached to the outer surface of the lens carrier 21 by providing an adhesive 50 between the inner side surface of the second end portion 322 and the outer surface of the lens carrier 21, which is not limited by the present application.

In a specific implementation, the heat dissipation plate 31 and the heat conduction bridge 32 may be integrally formed, that is, they have an integral structure. Also, in the embodiment of the present application, the heat dissipation plate 31 and the heat conduction bridge 32 have the shape configuration as described above after the pre-forming, that is, the heat conduction bridge 32 extends upward from the heat dissipation plate 31. Thus, in the process of manufacturing the camera module 100, after the photosensitive assembly 10 and the lens assembly 20 are assembled, the entire structure formed by the photosensitive assembly 10 and the lens assembly 20 is sleeved in the heat dissipation assembly 30, so that the heat dissipation plate 31 of the heat dissipation assembly 30 is stacked on the bottom surface of the circuit board 11, and the heat conduction bridge 32 extends to the outer surface of the lens carrier 21.

Of course, in other examples of the application, the shape of the heat sink assembly 30 may be molded during the assembly of the module. For example, in a specific example of the present application, the heat-conducting bridge 32 is made of a turnover material, so that, after the photosensitive assembly 10 and the lens assembly 20 are assembled, the entire structure formed by the photosensitive assembly 10 and the lens assembly 20 is stacked on the upper surface of the heat dissipation plate 31, and the heat-conducting bridge 32 is turned over so that the heat-conducting bridge 32 is extended to the outer surface of the lens carrier 21.

As described above, in the embodiment of the present application, the image capturing module 100 generally includes the outer bracket 40 for protecting the photosensitive assembly 10 and the lens assembly 20, and a gap is provided between the outer bracket 40 and the lens carrier 21. Preferably, in the embodiment of the present application, the thickness dimension of the heat conduction bridge 32 is smaller than the dimension of the gap, so that the heat conduction bridge 32 can be completely accommodated in the gap. That is, in the embodiment of the present application, the overall size of the camera module 100 is not increased, and the external appearance of the camera module 100 is not affected. In other words, the camera module 100 according to the embodiment of the present application can be implemented by modifying the existing camera module 100 without changing the structure and the size configuration of the existing camera module 100, so that the assembly and the preparation of the terminal device are facilitated, i.e. the internal design of the terminal is not required to be changed.

More specifically, in the embodiment of the present application, the size of the gap is 100um to 150um, and the thickness of the heat-conducting bridge 32 is 25um to 75um.

It should be noted that, in the embodiment of the present application, the external bracket 40 may prevent the internal structure of the camera module 100 from being exposed. Currently, the outer brackets 40 are of two types: a waistband type and a surrounding type, wherein the waistband type outer bracket 40 is surrounded by four side walls, which have an opening exposing the upper surface of the lens carrier 21; the surrounding outer support 40 is surrounded by four side walls and a top wall.

Preferably, in order to improve the heat dissipation performance of the camera module 100, in the embodiment of the present application, the waistband type external support 40 is used. It should be appreciated that the waistband type outer mount 40 can expose the upper surface of the lens carrier 21, so that heat conducted to the outer surface of the lens carrier 21 can be sufficiently dissipated to the outside through the exposed upper surface.

Further, in the embodiment of the present application, the heat-conducting bridge 32 extends outwards from the heat dissipation plate 31 and is folded upwards to the outer surface of the lens carrier 21, so that the heat-conducting bridge 32 forms a bending portion 320. In particular, in some examples of the present application, the bending portion 320 can abut against the inner surface of the outer bracket 40, such that the inner surface of the outer bracket 40 provides a biasing force that forces the heat-conducting bridge 32 to adhere to the outer surface of the lens carrier 21, so that the second end 322 of the heat-conducting bridge 32 can be ensured to be always in contact with the outer surface of the lens carrier 21, as shown in fig. 5.

It should be noted that, in order to improve the heat dissipation performance of the heat dissipation assembly 30, although the heat dissipation assembly 30 includes one heat conduction bridge 32 as an example, it should be understood that, in other examples of the present application, the heat dissipation assembly 30 may include a greater number of heat conduction bridges 32, preferably, the number of heat conduction bridges 32 is 3, which respectively extend to three connected sides of the lens carrier 21, wherein the remaining one side is not provided with the heat conduction bridges 32 because it is required to provide a space for avoiding the arrangement of the flexible board connection board of the circuit board 11.

In summary, the camera module 100 according to the embodiment of the application is illustrated, which constructs a heat dissipation link for the camera module 100 through the heat dissipation component 30, wherein the heat dissipation link extends between the bottom of the camera module 100 and the upper region of the camera module 100, so that the camera module 100 has relatively better heat dissipation performance after being assembled to an electronic device.

Fig. 6 illustrates a schematic diagram of a modified embodiment of the camera module 100 according to an embodiment of the present application. As shown in fig. 6, in this modified example, in order to improve the heat radiation performance of the image pickup module 100, the structure of the photosensitive member 10 is adjusted.

Specifically, as shown in fig. 6, in this modified embodiment, the wiring board 11 has a groove 110 formed on an upper surface thereof, wherein the groove 110 may be a recess concavely formed on an upper surface thereof or a through groove penetratingly formed between upper and lower surfaces thereof. The photosensitive chip 12 is disposed in the slot 110 and electrically connected to the circuit board 11.

Preferably, in this modification, the slot 110 is implemented as a through slot, and when the photosensitive chip 12 is placed in the slot 110, the lower surface of the photosensitive chip 12 is directly in contact with the heat dissipation plate 31, so that heat generated by the photosensitive chip 12 can be more sufficiently transferred to the heat dissipation plate 31.

In addition, by such a structural arrangement, the overall height of the photosensitive assembly 10 can be reduced, and the overall height dimension of the image pickup module 100 can be reduced.

Schematic camera module 100

As shown in fig. 7, the camera module 100 according to another embodiment of the present application is illustrated, wherein the camera module 100 as shown in fig. 7 has a general structure similar to the camera module 100 as shown in fig. 1, except for the arrangement position of the heat-conducting bridge 32.

More specifically, as shown in fig. 7, the camera module 100 according to the embodiment of the present application includes: an outer bracket 40; the lens module 20 is arranged in the outer direct part, and the heat dissipation module 30 are arranged in the outer bracket 40, wherein the light sensing module 10 comprises a circuit board 11 and a light sensing chip 12 electrically connected with the circuit board 11; the lens assembly 20 includes a lens carrier 21 and an optical lens 22, the optical lens 22 being mounted within the lens carrier 21, the lens carrier 21 being mounted on the photosensitive assembly 10.

The heat dissipation assembly 30 includes a heat dissipation plate 31 and at least one heat conduction bridge 32, wherein the heat dissipation plate 31 is stacked on the lower surface of the circuit board 11, and the at least one heat conduction bridge 32 extends upward from the heat dissipation plate 31 to the inner surface of the outer bracket 40, so that the heat conducted out through the heat dissipation plate 31 can be conducted to the inner surface of the outer bracket 40 along the at least one heat conduction bridge 32 and dissipated to the outside through the outer bracket 40.

As shown in fig. 7, in the embodiment of the present application, the heat-conducting bridge 32 has a first end 321, a second end 322 opposite to the first end 321, and a heat-conducting bridge body 323 extending between the first end 321 and the second end 322, wherein the first end 321 is connected to the heat dissipation plate 31, and the second end extends upward from the first end to the inner surface of the outer bracket 40.

In one example, the second end 322 is in direct contact with the inner surface of the outer bracket 40 and is attached to the inner surface of the outer bracket 40 by an adhesive 50 that is applied to the outer side of the second end 322 and the inner surface of the outer bracket 40.

In another example, the second end 322 is attached to the inner surface of the outer bracket 40 by an adhesive 50 disposed between the inner side of the second end 322 and the inner surface of the outer bracket 40.

In the embodiment of the present application, a gap is formed between the outer support 40 and the lens carrier 21 and the photosensitive assembly 10, and the thickness dimension of the heat-conducting bridge 32 is smaller than the dimension of the gap. More specifically, in the embodiment of the present application, the size of the gap is 100um to 150um, and the thickness of the heat-conducting bridge 32 is 25um to 75um.

In summary, the camera module 100 according to the embodiment of the application is illustrated, which constructs a heat dissipation link for the camera module 100 through the heat dissipation component 30, wherein the heat dissipation link extends between the bottom of the camera module 100 and the upper region of the camera module 100, so that the camera module 100 has relatively better heat dissipation performance after being assembled to an electronic device.

It should be noted that, in the present invention, the second end portion 322 is disposed on the outer bracket 40, and the camera module 100 may be implemented as a fixed focus module when the heat dissipation performance is improved.

Preparation method of exemplary camera module 100

According to another aspect of the present application, a method for manufacturing the camera module 100 is also provided.

Fig. 8A and 8B are schematic diagrams illustrating a process of manufacturing the camera module 100 according to an embodiment of the present application. As shown in fig. 8A and 8B, the manufacturing process of the camera module 100 according to the embodiment of the application includes the following steps.

Firstly, providing a photosensitive assembly 10, wherein the photosensitive assembly 10 comprises a circuit board 11 and a photosensitive chip 12 electrically connected to the circuit board 11;

Then, a lens assembly 20 is mounted on the photosensitive assembly 10, the lens assembly 20 comprises a lens carrier 21 and an optical lens 22, the optical lens 22 is mounted in the lens carrier 21, and the lens carrier 21 is mounted on the photosensitive assembly 10; and

Next, a heat dissipation assembly 30 is provided, wherein the heat dissipation assembly 30 includes a heat dissipation plate 31 and a heat conduction bridge 32 extending from the heat dissipation plate 31;

then, the heat dissipation plate 31 of the heat dissipation assembly 30 is stacked on the lower surface of the circuit board 11; and

Then, the heat conducting bridge 32 is folded upwards so that the heat conducting bridge 32 is extended to the outer surface of the lens carrier 21, so that the heat led out through the heat dissipating plate 31 can be conducted to the outer surface of the lens carrier 21 along the at least one heat conducting bridge 32 and dissipated to the outside through the outer surface of the lens carrier 21.

That is, in the manufacturing process as illustrated in fig. 8A and 8B, the shape of the heat dissipation assembly 30 may be formed during the process. Specifically, after the photosensitive assembly 10 and the lens assembly 20 are assembled, the entire structure formed by the photosensitive assembly 10 and the lens assembly 20 is stacked on the upper surface of the heat dissipation plate 31, and the heat conduction bridge 32 is folded so that the heat conduction bridge 32 is extended to the outer surface of the lens carrier 21.

In one example, in the manufacturing method according to the present application, after the heat conduction bridge 32 is folded upward so that the heat conduction bridge 32 is extended to the outer surface of the lens carrier 21, further comprising: the free end of the thermally conductive bridge 32 is secured to the outer surface of the lens carrier 21 by an adhesive 50.

In one example, in the manufacturing method according to the present application, fixing the free end portion of the heat conduction bridge 32 to the outer surface of the lens carrier 21 by means of the adhesive 50 includes: the free end of the heat conducting bridge 32 is directly contacted with the outer surface of the lens carrier 21; and applying an adhesive 50 on the outer side surface of the free end portion and the outer surface of the lens carrier 21 to fix the free end portion of the heat conductive bridge 32 to the outer surface of the lens carrier 21 by the adhesive 50.

In one example, in the manufacturing method according to the present application, fixing the free end portion of the heat conduction bridge 32 to the outer surface of the lens carrier 21 by means of the adhesive 50 includes: an adhesive 50 is applied between the inner side of the free end of the heat-conducting bridge 32 and the outer surface of the lens carrier 21 to fix the free end of the heat-conducting bridge 32 to the outer surface of the lens carrier 21 by the adhesive 50.

In one example, in the manufacturing method according to the present application, the manufacturing method further includes mounting an external mount 40 outside the photosensitive assembly 10 and the lens assembly 20.

In one example, in the manufacturing method according to the present application, the outer holder 40 has a gap with the lens carrier 21 and the photosensitive member 10, and the thickness dimension of the heat conduction bridge 32 is smaller than the dimension of the gap.

In one example, in the manufacturing method according to the present application, the size of the gap is 100um to 150um, and the thickness of the heat conductive bridge 32 is 25um to 75um.

In summary, a method for manufacturing the camera module 100 according to an embodiment of the present application is illustrated, which is used to manufacture the camera module 100 as illustrated in fig. 1. It should be noted that, although the preparation method as illustrated in fig. 8A and 8B is taken as an example to prepare the camera module 100 as illustrated in fig. 1, it is needless to say that, if the modification implementation or the equivalent implementation of the camera module 100 is to be prepared, the preparation concept illustrated in fig. 8A and 8B may be adjusted slightly, and thus, a detailed description thereof will be omitted.

Schematic electronic device

As shown in fig. 9, according to another aspect of the present application, there is also provided an electronic device 200 including the camera module 100 as described above, wherein the camera module 100 may be assembled to a front side of the electronic device 200 as a front camera module 100 or to a back side of the electronic device 200 as a back camera module 100. The camera module 100 may also be implemented as a dual-camera or multi-camera module 100, i.e. at least one of the dual-camera or multi-camera modules 100 has the heat dissipation assembly 30.

In particular, when the camera module 100 is assembled to the electronic apparatus 200, a gap exists between the camera module 100 and the electronic apparatus 200. As described above, as shown in fig. 10, the gap is a closed space, and the heat conducted from the bottom of the camera module 100 is stored in the closed space, which is why the conventional camera module 100 does not have a good heat dissipation performance after being assembled to the electronic device 200.

Accordingly, in the embodiment of the present application, the camera module 100 has a heat dissipation link from the bottom thereof from the upper region thereof, and thus, even if the gap thereof is a closed space, the camera module 100 can dissipate heat from the upper region thereof. That is, the camera module 100 according to the embodiment of the application has more heat dissipation links, so that it can still have better heat dissipation performance after being assembled to the electronic device 200.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are by way of example only and are not limiting. The objects of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been shown and described in the examples and embodiments of the invention may be modified or practiced without departing from the principles described.

Claims (13)

1. A camera module, comprising:

the photosensitive assembly comprises a circuit board and a photosensitive chip electrically connected to the circuit board;

A lens assembly including a lens carrier and an optical lens, the optical lens being mounted within the lens carrier, the lens carrier being mounted on the photosensitive assembly; and

The heat dissipation assembly comprises a heat dissipation plate and at least one heat conduction bridge, wherein the heat dissipation plate is overlapped on the lower surface of the circuit board, and the heat conduction bridge extends upwards from the heat dissipation plate to the outer surface of the lens carrier, so that heat led out through the heat dissipation plate can be conducted to the outer surface of the lens carrier along the heat conduction bridge and dissipated to the outside through the outer surface of the lens carrier; and

An outer bracket for protecting the photosensitive assembly and the lens assembly, wherein a gap is formed between the outer bracket and the lens carrier;

the heat conduction bridge is provided with a first end part, a second end part opposite to the first end part and a heat conduction bridge body extending between the first end part and the second end part, wherein the first end part is connected with the heat dissipation plate, and the second end part extends upwards from the first end part to the outer surface of the lens carrier;

No adhesive is arranged between the inner side surface of the second end part and the outer surface of the lens carrier; the second end is attached to the outer surface of the lens carrier by an adhesive laid on the outer side surface of the second end and the outer surface of the lens carrier; so that the second end portion is in direct contact with the outer surface of the lens carrier;

The heat conduction bridge is made of a turnover material, the heat conduction bridge is turned up from the heat dissipation plate to the outer surface of the lens carrier, a bending part is formed at the turned-up position of the heat conduction bridge, the bending part is provided with a bending angle, the angle of the bending angle is smaller than or equal to 90 degrees, and the bending part is abutted against the inner surface of the outer support, so that the inner surface of the outer support provides a biasing force for forcing the heat conduction bridge to be attached to the outer surface of the lens carrier.

2. The camera module of claim 1, wherein the lens carrier is implemented as a drive element, wherein the drive element comprises an outer housing forming an outer surface of the drive element, the outer housing being made of a metallic material.

3. The camera module of claim 1, wherein the adhesive is implemented as conductive silver paste.

4. The camera module of claim 1, wherein a thickness dimension of the heat-conducting bridge is less than a dimension of the gap.

5. The camera module of claim 4, wherein the gap has a dimension of 100um to 150um and the heat-conducting bridge has a thickness dimension of 25um to 75um.

6. The camera module of claim 4, wherein a thickness dimension of the heat dissipation plate is greater than a thickness dimension of the heat conduction bridge.

7. The camera module of claim 4, wherein the outer bracket has an opening exposing an upper surface of the lens carrier.

8. The camera module of claim 1, wherein the thermally conductive bridge comprises a first thermally conductive bridge, a second thermally conductive bridge, and a third thermally conductive bridge, wherein the first, second, and third thermally conductive bridges extend upward from the heat sink plate to three side surfaces of the lens carrier, respectively.

9. The camera module of claim 1, wherein the circuit board has a slot concavely formed in an upper surface thereof, wherein the photosensitive chip is disposed in the slot.

10. The camera module according to claim 9, wherein the slot is implemented as a through slot penetratingly formed between an upper surface of the wiring board and a lower surface thereof, the photosensitive chip being disposed in the through slot and directly contacting the heat dissipation plate.

11. An electronic device comprising a camera module according to any one of claims 1 to 10.

12. The preparation method of the camera module is characterized by comprising the following steps:

providing a photosensitive assembly, wherein the photosensitive assembly comprises a circuit board and a photosensitive chip electrically connected to the circuit board;

mounting a lens assembly to the photosensitive assembly, the lens assembly comprising a lens carrier and an optical lens, the optical lens being mounted within the lens carrier, the lens carrier being mounted on the photosensitive assembly;

An outer bracket is arranged outside the photosensitive assembly and the lens assembly; a gap is formed between the outer support and the lens carrier; and

Providing a heat dissipation assembly, wherein the heat dissipation assembly comprises a heat dissipation plate and a heat conduction bridge extending from the heat dissipation plate;

superposing a heat radiation plate of the heat radiation assembly on the lower surface of the circuit board;

The heat conduction bridge is folded upwards so that the heat conduction bridge is extended to the outer surface of the lens carrier, so that heat led out through the heat dissipation plate can be conducted to the outer surface of the lens carrier along the heat conduction bridge and dissipated to the outside through the outer surface of the lens carrier, wherein the heat conduction bridge forms a bending part at the position where the heat conduction bridge is folded upwards, the bending part is provided with a bending angle, the angle of the bending angle is smaller than or equal to 90 degrees, and the bending part is abutted against the inner surface of the outer support, so that the inner surface of the outer support provides a biasing force for forcing the heat conduction bridge to be attached to the outer surface of the lens carrier; and

Fixing the free end of the heat-conducting bridge to the outer surface of the lens carrier by an adhesive;

Wherein fixing the free end portion of the heat-conducting bridge to the outer surface of the lens carrier by an adhesive comprises:

directly contacting the free end of the heat conducting bridge with the outer surface of the lens carrier; and

An adhesive is applied on an outer side surface of the free end portion and an outer surface of the lens carrier to fix the free end portion of the heat-conducting bridge to the outer surface of the lens carrier by the adhesive.

13. The preparation method according to claim 12, further comprising:

and an outer support is arranged outside the photosensitive assembly and the lens assembly.