CN114340196A - Method for preventing oil spilling of solder-resisting intersecting hole, PCB and application - Google Patents
Method for preventing oil spilling of solder-resisting intersecting hole, PCB and application Download PDFInfo
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- CN114340196A CN114340196A CN202210028703.XA CN202210028703A CN114340196A CN 114340196 A CN114340196 A CN 114340196A CN 202210028703 A CN202210028703 A CN 202210028703A CN 114340196 A CN114340196 A CN 114340196A
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Abstract
The invention belongs to the technical field of PCB manufacturing, and discloses a method for preventing oil spilling of solder-resisting intersecting holes, a PCB and application. And carrying out UV light curing on the surface layer wet ink exposed in the developed intersecting hole by using UV light. In the baking process after solder mask, the wet ink in the hole is blocked by the UV-cured ink, so that the wet ink is prevented from overflowing to the bonding pad due to high-temperature thermal expansion. The invention innovatively cures part of the ink exposed in the crossed hole through solder resist exposure (secondary), and avoids the ink from overflowing onto the bonding pad due to high-temperature heating expansion in the post-baking high-temperature process. The method effectively improves the cost of bad scrap in production, reduces the waste production efficiency of equipment, delays the product delivery time and wastes the use amount cost of industrial electricity due to the adoption of the method of reducing the temperature of the post-baking starting point and prolonging the baking time.
Description
Technical Field
The invention belongs to the technical field of Printed Circuit Board (PCB) manufacturing, and discloses a method for preventing solder resist intersection holes from spilling oil, a PCB, a controller, a vehicle-mounted terminal, an electronic device product and a PCB production line.
Background
At present, the solution for solving the problem of oil spilling of intersecting holes in the solder mask process of Printed Circuit Boards (PCBs) in the industry is to lower the temperature of the post-solder mask baking step point and prolong the baking time.
In the prior art, the reasons for oil spilling of intersecting holes are as follows:
1) after the intersecting hole is designed in the solder mask pre-baking process, the ink in the hole is not completely semi-cured due to the pre-baking process, mainly due to the fact that the ink in the hole is too deep and too much.
2) The intersecting hole is designed in such a way that the ink in the hole is not sensitive after exposure to achieve the curing effect, and mainly the irradiation depth of an exposure light source cannot reach the hole.
3) And after the solder mask is developed, the ink in the intersected hole is exposed and the original wet state is kept.
4) In the process of baking after solder resist, wet ink in the crossed hole can boil due to high temperature, so that the ink overflows from the bonding pad, and the oil overflow problem occurs.
In order to solve the technical problems, a manufacturing method for improving solder resist plug hole oil spilling in the prior art, CN108055776A, is disclosed: a manufacturing method for improving solder mask plug hole oil spilling is characterized by comprising the following steps: the method comprises the following steps:
1) resistance welding pretreatment: performing front baking plate treatment before resistance welding pretreatment, wherein the baking plate treatment specifically comprises the following steps: when holes to be plugged on the circuit board comprise back drilled holes, performing pre-baking board treatment before the pre-treatment step of solder resistance, and/or performing post-baking board treatment after the pre-treatment step of solder resistance; when the holes to be plugged on the circuit board are through holes with high thickness-to-diameter ratio, performing post-baking board treatment after the pre-welding treatment step, and baking the board for 60-120 min at the temperature of 150 +/-5 ℃ during pre-baking board treatment; when post-baking treatment is carried out, the temperature of 75 +/-5 ℃ is kept for baking the plate for 10-30 min; then removing oxides, oil stains and impurities on the wall of the through hole, and roughening the surface of the copper layer; the circuit board is provided with a through hole; copper plating the surface of the circuit board and the hole wall of the through hole to a specified thickness at one time to form a copper layer;
2) plugging holes before solder welding: carrying out hole plugging treatment on holes to be plugged on the circuit board; firstly, screen printing ink: printing ink on the surface of the circuit board in a silk-screen mode; then, exposure: aligning the negative film with the circuit board and exposing the circuit board; the negative plate is a double-sided windowing negative plate, the position of the negative plate corresponding to the through hole is provided with a blocking point, the size of the blocking point is the same as that of the through hole, and the blocking point is provided with uniformly distributed photosites; and finally, developing: placing the circuit board in a developing solution for developing; carrying out final curing treatment on the circuit board; the final curing treatment of the circuit board specifically comprises the following steps: a segmented curing mode is adopted, the number of segmented curing sections is set to be 3-9, and the total curing time of a low-temperature curing section is set to be more than or equal to 150min, wherein the low-temperature curing section is a section with the temperature of less than or equal to 100 ℃, the segmented curing mode comprises a first stage, a second stage, a third stage, a fourth stage and a fifth stage, the first stage is curing for 90min +/-10 min by keeping the temperature of 50 +/-5 ℃, the second stage is curing for 60min +/-10 min by keeping the temperature of 70 +/-5 ℃, the third stage is curing for 30min +/-10 min by keeping the temperature of 90 +/-5 ℃, the fourth stage is curing for 30min +/-10 min by keeping the temperature of 120 +/-5 ℃, and the fifth stage is curing for 60min +/-10 min by keeping the temperature of 150 +/-5 ℃;
3) resistance welding: firstly, polishing the surface of the circuit board, and removing impurities stuck on the surface of the circuit board; then, a dry film photoresist is pasted on the surface of the circuit board, and a preset circuit pattern is transferred to the surface of the circuit board; then, under the protection of the dry film photoresist, etching the exposed copper on the copper surface of the circuit board by adopting an acidic etching solution; and then, detecting the circuit board etched by the outer layer through automatic optical detection of the outer layer, and finally coating the circuit board etched by the outer layer with a solder resist.
The prior art-CN 110798983A-an improvement method applied to a PCB semi-plug hole oil spilling upper bonding pad-discloses an improvement method applied to a PCB semi-plug hole oil spilling upper bonding pad, which is characterized by comprising the following steps:
(1) confirming that a half plug hole design exists in a PCB product;
(2) aiming at the half plug hole position of the PCB product, the exposure data is made as follows: confirming the position of the half plug hole, designing a cross-shaped non-windowing at the hole center position of the half plug hole for the welding-proof windowing surface times of the half plug hole, and designing the position of the half plug hole as the non-windowing for the welding-proof non-windowing surface times of the half plug hole;
(3) using the exposure data in the step (2) to manufacture an exposure film;
(4) carrying out conventional exposure on the PCB product by using the exposure film manufactured in the step (3);
(5) normally developing the PCB product exposed in the step (4), and controlling the temperature of a developing water washing tank to be between 10 and 20 ℃.
Three CN 105208788A-method for improving contraposition precision of solder mask and solder mask in prior art-public
The method for improving the alignment precision of the solder mask and the solder mask is characterized by comprising a first solder mask flow and a second solder mask flow, wherein the first solder mask flow comprises the following steps:
a1 former process;
b1 pretreatment, removing impurities on the board surface and oxidizing;
c1 solder mask silk-screen printing of the first layer of ink;
d1 prebaking to make the ink preliminarily hardened;
e1 exposure, namely, taking an outer layer etching target as an exposure counterpoint, pasting an exposure film on the board surface for exposure, wherein the exposure film needs to be provided with a corresponding solder mask windowing target at the position of a copper area on the edge of a produced product board;
f1, developing, and washing off the ink in the shading area on the exposed film in the step e 1;
g1 post-curing to improve the surface hardness of the ink to obtain a first solder mask layer;
the second solder resist comprises the following steps:
a2 former process;
b2 pretreatment, removing impurities on the board surface and oxidizing;
c2 solder mask silk-screen printing of a second layer of ink;
d2 prebaking to make the ink preliminarily hardened;
e2 exposure, namely, adopting the solder mask windowing target in the step e1 as an exposure counterpoint, and pasting an exposure film on the board surface for exposure;
f2, developing, and washing off the ink in the shading area of the exposure film in the step e 2;
g2 post-curing to increase the ink surface hardness to obtain a second solder mask.
In the prior art and in the first to third prior arts, the method for reducing the temperature of the post-solder-resist baking step point and prolonging the baking time is adopted to solve the problem of oil spill of intersecting holes in the solder-resist process, and the defects are as follows:
(1) by reducing the temperature of the post-solder-resist baking step point, the problem of oil spilling of intersecting holes cannot be completely solved by prolonging the baking time, and the bad proportion is 10%.
(2) The method reduces the temperature of the post-welding-resistance baking step point, prolongs the baking time, seriously wastes the production efficiency of equipment, reduces the production flow rate and delays the product delivery time. And wastes the cost of the usage of industrial electricity.
The difficulty in solving the above problems and defects is: the content of the ink in a semi-fluid state after the development in the intersecting holes is greatly influenced by the hole diameter and the plate thickness of the plug hole, and the change of the capability of removing the ink in the holes by the development parameters is large, so that the time is prolonged, and the temperature of a curing starting point is reduced to prevent the oil spilling of the intersecting holes from being stopped by 99%; because the temperature uniformity of post-curing and the air draft cycle are constantly changing, the control is difficult.
The significance of solving the problems and the defects is as follows: therefore, the secondary solder mask exposure method improves the uniform UV photopolymerization curing reaction of the semi-fluid surface layer in the intersecting holes, and prevents the oil spilling problem caused by the boiling of the heated ink. Finally, the quality problem of the design of the intersecting holes is improved, the post-curing time is shortened, and the industrial electricity cost is saved.
Disclosure of Invention
In order to overcome the problems in the related art, the disclosed embodiments of the present invention provide a method for preventing oil spilling in a solder resist intersection hole, a PCB, a controller, a vehicle-mounted terminal, an electronic device product, and a PCB production line. In particular to a method for preventing oil spilling of a windowing surface resistance welding intersection hole in the design that one side of a PCB resistance welding hole is plugged and the other side is windowed.
The technical scheme is as follows: the method for preventing the solder mask intersecting hole from oil spilling utilizes secondary solder mask exposure to carry out secondary exposure reaction on the ink, so that the ink in the semi-fluid state in the hole is further cured, and the cured ink is utilized to prevent the other part of wet ink in the semi-fluid state in the deep part of the hole from being heated and expanding to spill out of the intersecting hole.
In one embodiment, the ink is subjected to secondary exposure reaction by using one exposure mode of manual exposure, semi-automatic exposure, full-automatic exposure, solder mask DI machine exposure and UV machine exposure.
In one embodiment, the exposure energy setting range of the exposure UV machine is 600mj to 1000 mj.
In one embodiment, the second solder resist exposure is followed by curing, and the curing procedure is as follows:
firstly, setting the curing temperature to be 75 ℃ and the curing time to be 60 +/-10 minutes;
secondly, setting the curing temperature to be 85 ℃ and the curing time to be 15 +/-5 minutes;
thirdly, setting the curing temperature to be 135 ℃ and the curing time to be 15 +/-5 minutes;
fourthly, setting the curing temperature to be 150 ℃ and the curing time to be 60 +/-10 minutes.
In one embodiment, the method for preventing oil spilling of the solder resist intersection hole specifically comprises the following steps:
pretreatment: pozzolans, needle brushing, or super-roughening;
plugging holes with aluminum sheets: screen plug holes or PP sheet plug holes;
printing a blank screen plate and a stop point screen plate;
pre-baking: tunnel ovens or vertical ovens;
exposure: manual exposure, semi-automatic exposure, full-automatic exposure or exposure of a solder mask DI machine;
developing;
secondary solder resist exposure: manual exposure, semi-automatic exposure, full-automatic exposure, solder mask DI machine exposure or UV machine exposure;
post-baking: tunnel post cure ovens and vertical post cure ovens.
Another object of the present invention is to provide a PCB board manufactured according to the method for preventing oil spilling of solder resist intersection holes.
Another object of the present invention is to provide a controller, wherein the controller is mounted on the PCB.
Another object of the present invention is to provide a vehicle-mounted terminal equipped with the controller.
Another object of the present invention is to provide an electronic device product, wherein the PCB board is disposed on the electronic device product.
Another object of the present invention is to provide a PCB production line implementing the method for preventing oil spilling of the solder resist intersection hole.
By combining all the technical schemes, the invention has the advantages and positive effects that:
(1) the invention provides a solution for solving the problem of oil spilling of an intersecting hole formed after a Printed Circuit Board (PCB) is subjected to solder resist baking.
(2) The invention utilizes the solder resist secondary exposure to solidify the printing ink in the holes designed by the intersection holes, thereby avoiding oil spill after post-baking.
(3) The invention innovatively cures part of the ink exposed in the crossed hole through solder resist exposure (secondary), and avoids the ink overflowing onto the bonding pad due to high temperature in the post-baking high-temperature process. The method effectively improves the cost of bad scrap in production, reduces the waste production efficiency of equipment, delays the product delivery time and wastes the use amount cost of industrial electricity due to the adoption of the method of reducing the temperature of the post-baking starting point and prolonging the baking time.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.
Fig. 1 is a flowchart of a method for preventing oil spilling of a solder resist intersection hole according to an embodiment of the present invention.
Fig. 2 is a schematic diagram of a secondary solder mask exposure provided by an embodiment of the present invention.
FIG. 3 is a diagram of a cell layout in a data pattern for making intersecting holes according to an embodiment of the present invention.
FIG. 4 is a PNL layout diagram in a data pattern for making intersecting holes according to an embodiment of the present invention.
In the figure: 1. UV light; 2. the surface is solidified with solder resist oil; 3. a copper plate; 4. metallizing the hole; 5. uncured semi-fluid state oil.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather should be construed as broadly as the present invention is capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Examples
As shown in fig. 1, the method for preventing oil spilling of the solder resist intersection hole provided by the invention comprises the following steps: pre-treatment of solder resist; solder resist printing; solder resist pre-baking; solder mask exposure; solder mask development; secondary solder resist exposure or secondary light curing by a UV machine; baking after solder resisting. According to the method for preventing oil spilling of the solder resist intersection hole, UV light 1 and the ink are used for carrying out secondary photoreaction, so that the ink in a semi-fluid state in the hole is further cured, and the poor scrapping caused by the fact that the other part of wet ink in the deep part of the hole expands and overflows due to heating is prevented.
Specifically, the method for preventing oil spilling of the solder resist intersection hole provided by the invention specifically comprises the following steps:
pre-treatment (volcanic ash/needle brushing/super-roughening), aluminum sheet plugging (screen plugging/PP sheet plugging), various blank screen and stop screen printing, pre-baking (tunnel oven/vertical oven), exposure (manual exposure/semi-automatic exposure/full-automatic exposure/solder resist DI machine exposure), development, secondary solder resist exposure (manual exposure/semi-automatic exposure/full-automatic exposure/solder resist DI machine exposure/UV machine exposure), post-baking (tunnel post-curing oven/vertical post-curing oven), and turning to the following procedures, wherein specific parameters can be specifically used following the design of the PCB.
The traditional method is that the ink solidification in the crossed hole adopts the post-solidification parameters of delaying the low-temperature time to slowly solidify the uncured semi-fluid state oil 5 in the hole: 60 ℃ X60. + -.10 min +75 ℃ X60. + -.10 min +85 ℃ X7.5. + -.3 min +95 ℃ X7.5. + -.3 min +105 ℃ X7.5. + -.3 min +120 ℃ X7.5. + -.3 min +135 ℃ X7.5. + -.3 min +155 ℃ X60. + -.20 min, the total prebaking time being: 225 minutes
The secondary solder mask exposure parameters of the invention are as follows: the exposure of a negative film or corresponding DI machine data is not needed, only the exposure of a plate surface is needed, and the UV lamp of the exposure machine is set to be 600mj-1000mj of exposure energy.
In the post-baking process (post-curing parameters of secondary solder mask exposure: 75 ℃, 60 +/-10 minutes, 85 ℃ for 15 +/-5 minutes, 135 ℃ for 15 +/-5 minutes and 150 ℃ for 60 +/-10 minutes), the cured partial ink blocks the wet partial ink in the hole and prevents the wet partial ink from overflowing onto the bonding pad due to high-temperature boiling. The post-curing time is shortened, the electricity cost is saved, and the quality of the crossed holes is improved.
Resistance welding pretreatment: acid washing (sulfuric acid concentration is 3.0-4.0%), water washing, needle brushing and grinding plates, volcanic ash grinding plates (concentration is 25% +/-5%), water washing, ultrasonic water washing, high-pressure water washing, DI water washing, strong wind blowing, hot wind blowing (temperature is 88 +/-5 ℃), cooling and plate collection;
solder resist printing: aluminum sheet plugging by a plugging machine, manual printing, three-machine continuous printing (43T/36T nail bed printing)/spraying line and standing;
solder resist pre-baking: pre-baking the tunnel oven/vertical oven at 75 ℃ for 45 minutes;
solder resist exposure: the exposure scale of the UV lamp full-automatic negative film exposure machine is 10-11 levels, or the exposure of a DI machine or an LED-UV semi-automatic exposure machine is adopted;
solder resist development: developing 1, developing 2, washing with fresh liquid, washing with water (1-9 sections), and drying with strong wind, wherein the developing concentration is 1.0 +/-0.2.
As shown in the principle of the secondary solder mask exposure flow of fig. 2, the surface-cured solder mask oil 2 is irradiated by UV light 1, so that the uncured semi-fluid state oil 5 in the hole of the metallized hole 4 is cured; the copper plate 3 on the PCB is positioned at one side of the metallized hole 4;
the secondary solder mask exposure is to cure part of the ink exposed in the holes of the developed intersecting holes (metallized holes 4) through the UV light 1, so that the wet ink in the holes is prevented from boiling and overflowing to the bonding pads during post baking.
The purpose of secondary solder mask exposure is to cure part of ink exposed in the developed intersected hole by using UV light 1, and in the post-baking process, the cured part of ink can block wet part of ink in the hole, so that the wet part of ink is prevented from overflowing onto a bonding pad due to high-temperature boiling. The second exposure may be performed with a film negative specially designed to have intersecting holes windowed, or may be performed without using a film negative. The secondary solder resist exposure may also be performed by secondary photocuring of the ink in the intersecting holes using a UV energy machine.
The positive effects of the invention are further described below in connection with test experiments, simulation tests and comparative tests:
the low temperature is prolonged, and the oil spilling test data of the intersection hole of the starting point baking plate temperature (the test flow I in the prior art) and the test data of the secondary solder mask exposure mode (the test flow II in the technical scheme of the invention) are reduced.
The test method is as follows: the data pattern of the intersecting holes is shown in FIG. 3 (cell layout) and FIG. 4PNL layout: the distance between the holes is 2.0MM, the holes are arranged from large to small according to the size of the hole diameter and are 0.65 MM-0.20 MM, and the thickness of the plate is 1.6MM and the thickness of the plate is 3.0MM respectively, and the plates are 10pnl respectively.
The prior art test process is as follows: sequentially comprises the following steps: pretreatment, aluminum sheet hole plugging, 43T screen printing, prebaking, exposure, development, post-baking and inspection of oil spilling defects of crossed holes.
The technical scheme of the invention is utilized for a second test process: pretreatment, aluminum sheet hole plugging, 43T screen printing, prebaking, exposure, development, secondary exposure, post-baking and inspection of oil spilling defects of crossed holes.
Design of experiments
The data show that: the secondary solder mask exposure mode obviously improves the yield when the intersecting holes are designed, and particularly shows outstanding performance on large aperture.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure should be limited only by the attached claims.
Claims (10)
1. The method for preventing the oil spilling of the solder mask intersecting hole is characterized in that secondary exposure reaction is carried out on ink by utilizing secondary solder mask exposure, so that the ink in a semi-fluid state in the hole is further cured, and the cured ink is utilized to prevent wet ink in another semi-fluid state in the deep part of the hole from being heated and swelling to spill out of the intersecting hole.
2. The method for preventing oil spilling of solder mask intersection holes as claimed in claim 1, wherein the ink is subjected to a secondary exposure reaction by one of manual exposure, semi-automatic exposure, full-automatic exposure, exposure of solder mask DI machine and exposure of UV machine.
3. The method for preventing oil spilling at solder resist intersection holes according to claim 2, wherein the exposure energy setting range of the exposure UV machine is 600mj to 1000 mj.
4. The method for preventing solder mask intersection holes from oil spilling as claimed in claim 1, wherein the curing is performed after the second solder mask exposure, and the curing procedure is as follows:
firstly, setting the curing temperature to be 75 ℃ and the curing time to be 60 +/-10 minutes;
secondly, setting the curing temperature to be 85 ℃ and the curing time to be 15 +/-5 minutes;
thirdly, setting the curing temperature to be 135 ℃ and the curing time to be 15 +/-5 minutes;
fourthly, setting the curing temperature to be 150 ℃ and the curing time to be 60 +/-10 minutes.
5. The method for preventing solder resist intersection hole oil spilling according to claim 1, wherein the method for preventing solder resist intersection hole oil spilling specifically comprises the following steps:
pretreatment: pozzolans, needle brushing, or super-roughening;
plugging holes with aluminum sheets: screen plug holes or PP sheet plug holes;
printing a blank screen plate and a stop point screen plate;
pre-baking: tunnel ovens or vertical ovens;
exposure: manual exposure, semi-automatic exposure, full-automatic exposure or exposure of a solder mask DI machine;
developing;
secondary solder resist exposure: manual exposure, semi-automatic exposure, full-automatic exposure, solder mask DI machine exposure or UV machine exposure;
post-baking: tunnel post cure ovens and vertical post cure ovens.
6. A PCB board manufactured according to the method for preventing oil spilling of solder resist intersection holes of any one of claims 1 to 4.
7. A controller carrying the PCB of claim 6.
8. A vehicle-mounted terminal characterized by being equipped with the controller of claim 7.
9. An electronic device product, characterized in that the electronic device product carries the PCB of claim 6.
10. A PCB production line is characterized in that the PCB production line implements the method for preventing the solder resist intersection hole from oil spilling as claimed in any one of claims 1 to 4.
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| CN202210028703.XA CN114340196A (en) | 2022-01-11 | 2022-01-11 | Method for preventing oil spilling of solder-resisting intersecting hole, PCB and application |
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| CN202210028703.XA CN114340196A (en) | 2022-01-11 | 2022-01-11 | Method for preventing oil spilling of solder-resisting intersecting hole, PCB and application |
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| EP0433721A2 (en) * | 1989-12-22 | 1991-06-26 | Siemens Aktiengesellschaft | Method of applying a solder stop coating on printed circuit boards |
| JP2013207025A (en) * | 2012-03-28 | 2013-10-07 | Panasonic Corp | Method of manufacturing printed wiring board |
| CN105101661A (en) * | 2014-05-21 | 2015-11-25 | 深圳崇达多层线路板有限公司 | Manufacturing method of printed circuit board ink plug hole |
| CN107124826A (en) * | 2017-06-20 | 2017-09-01 | 广州兴森快捷电路科技有限公司 | Improve the method for wiring board welding resistance consent bleed |
| CN112752417A (en) * | 2020-11-06 | 2021-05-04 | 龙南骏亚电子科技有限公司 | Method for manufacturing circuit board resistance welding double-sided windowing small hole without allowing ink to enter hole |
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2022
- 2022-01-11 CN CN202210028703.XA patent/CN114340196A/en active Pending
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| EP0433721A2 (en) * | 1989-12-22 | 1991-06-26 | Siemens Aktiengesellschaft | Method of applying a solder stop coating on printed circuit boards |
| JP2013207025A (en) * | 2012-03-28 | 2013-10-07 | Panasonic Corp | Method of manufacturing printed wiring board |
| CN105101661A (en) * | 2014-05-21 | 2015-11-25 | 深圳崇达多层线路板有限公司 | Manufacturing method of printed circuit board ink plug hole |
| CN107124826A (en) * | 2017-06-20 | 2017-09-01 | 广州兴森快捷电路科技有限公司 | Improve the method for wiring board welding resistance consent bleed |
| CN112752417A (en) * | 2020-11-06 | 2021-05-04 | 龙南骏亚电子科技有限公司 | Method for manufacturing circuit board resistance welding double-sided windowing small hole without allowing ink to enter hole |
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