CN114334929A - LED packaging structure, packaging device and packaging method - Google Patents
LED packaging structure, packaging device and packaging method Download PDFInfo
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- CN114334929A CN114334929A CN202111655041.0A CN202111655041A CN114334929A CN 114334929 A CN114334929 A CN 114334929A CN 202111655041 A CN202111655041 A CN 202111655041A CN 114334929 A CN114334929 A CN 114334929A
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Abstract
An LED packaging structure, a packaging device and a packaging method are provided, wherein the LED packaging structure comprises a substrate, a light emitting diode unit, a light conversion layer, a first packaging layer and a second packaging layer; the number of the light emitting diode units is two or more, and the light emitting diode units are independently arranged on the surface of the substrate; the light conversion layers are correspondingly arranged above the light emitting diode units, and a flow channel is formed between every two adjacent light conversion layers; the first packaging layer is arranged between the adjacent light emitting diode units; the second packaging layer is arranged in the flow channel. Through multilayer point gluing, silica gel materials with different reflectivity and transmittance are used, the brightness is improved, and meanwhile, black walls are formed on light absorption layers filled on the surfaces of the matrixes, so that the contrast can be effectively improved.
Description
Technical Field
The invention belongs to the technical field of LEDs, and particularly relates to an LED packaging structure, a packaging device and a packaging method.
Background
With the development of lighting technology, the pixelation of LED light sources, the smart matrix lighting and display become the development trend, and the introduction of light source devices with high dynamic contrast is urgently needed, and especially in the field of automotive intelligent lighting and display, the requirements of higher brightness and better contrast effect are provided for light sources. In the prior art, a plurality of chips are respectively and independently packaged and then attached to a PCB, and then are isolated by using a black shading material, or the black shading material is directly filled between different pixels to improve the contrast. The current scheme has the following disadvantages:
1. the plurality of chips are packaged independently and then are attached to the PCB, so that on one hand, the size of the whole PCB is limited due to the large structure size of the packaged LED; on the other hand, after mounting, the distance between different pixels is large, high-resolution pixel display is difficult to realize, and light emission is not uniform.
2. The black shading material is directly filled, and the packaging brightness is greatly reduced due to the light absorption effect of the black material.
Disclosure of Invention
In order to overcome the above disadvantages of the prior art, an object of the present invention is to provide an LED package structure, an LED package device, and an LED package method, which are used to solve the problems of large package size and low package brightness in the prior art.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
an LED package structure comprising:
the LED packaging structure comprises a substrate, an LED unit, a light conversion layer, a first packaging layer and a second packaging layer;
the number of the light emitting diode units is two or more, and the light emitting diode units are independently arranged on the surface of the substrate;
the light conversion layers are correspondingly arranged above the light emitting diode units, and a flow channel is formed between every two adjacent light conversion layers;
the first packaging layer is arranged between the adjacent light emitting diode units;
the second packaging layer is arranged in the flow channel.
Preferably, the light conversion layer is of an inverted trapezoidal structure, and the flow channel is of a trapezoidal structure.
Preferably, the light conversion layers are in direct contact with the surfaces directly above the light emitting diode units, and the adjacent light conversion layers are not in contact with each other and are independently disposed.
Preferably, the distance between adjacent light emitting diode units is 0.02-2 mm.
Preferably, the height of the first encapsulation layer is consistent with the height of the light emitting diode unit, and the height of the second encapsulation layer is consistent with the height of the light conversion layer.
Preferably, the light-emitting diode module further comprises a wall glue, wherein the wall glue is arranged on the substrate and surrounds the light-emitting diode unit.
Preferably, a third encapsulation layer is arranged between the light emitting diode unit and the light conversion layer.
Preferably, the first encapsulating layer is a thermosetting silica gel with a high-reflectivity additive, and the second encapsulating layer is a thermosetting silica gel with a high-light-resistance additive.
The invention also discloses a packaging device, which comprises a plurality of pixel points consisting of the light-emitting diode units and the light conversion layer, wherein the pixel points are provided with the LED packaging structure as claimed in any one of claims 1 to 8.
The invention also discloses a packaging method, which is applied to the LED packaging structure and comprises the following steps:
s1, fixing the light-emitting diode units on the substrate;
s2, fixing the enclosure glue on the substrate in an enclosure dam mode to form a rectangular enclosure and surround all the light-emitting diode units;
s3, filling the first packaging layer around the light-emitting diode unit in a dispensing manner, wherein the height of the first packaging layer is flush with that of the light-emitting diode unit;
s4, covering the light conversion layer above the light emitting diode unit in a spraying or dispensing manner;
s5, cutting the light conversion layer above the light emitting diode units at different positions into flow channels in a cutting mode;
and S6, filling the second packaging layer in the flow channel in a dispensing manner.
Compared with the prior art, the invention has the beneficial effects that:
according to the LED packaging structure, the LED packaging device and the LED packaging method, the light absorption layer filled on the surface of the matrix forms the black wall while the brightness is improved by using the silica gel materials with different reflectivity and transmittance through multilayer dispensing, and the contrast can be effectively improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic top view of a first embodiment of the present invention.
Fig. 2 is a structural sectional view of the first embodiment of the present invention.
Fig. 3 is a structural sectional view of a second embodiment of the present invention.
Fig. 4 is a step diagram of a packaging method according to a first embodiment of the invention.
Description of reference numerals:
1-substrate, 2-wall glue, 3-light emitting diode unit, 4-light conversion layer, 5-first packaging layer, 6-second packaging layer and 7-third packaging layer.
Detailed Description
In order to make the technical problems solved, technical solutions adopted, and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention are described in further detail below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The first embodiment is as follows:
as shown in fig. 1 to 2, an LED package structure includes a substrate 1, a sealant 2, a light emitting diode unit 3, a light conversion layer 4, a first package layer 5, and a second package layer 6;
the number of the light-emitting diode units 3 is two or more, the light-emitting diode units are mutually independently arranged on the surface of the substrate 1, and the enclosure glue 2 is arranged on the substrate 1 and surrounds the light-emitting diode units 3;
the light conversion layers 4 are in direct contact with the surfaces right above the light emitting diode units 3, the adjacent light conversion layers 4 are not in contact with each other and are independently arranged, and a flow channel is formed between the adjacent light conversion layers 4, specifically, the light conversion layers 4 are in an inverted trapezoidal structure, and the flow channel is in a trapezoidal structure;
the first encapsulating layers 5 are arranged between the adjacent light emitting diode units 3, the height of the first encapsulating layers 5 is consistent with that of the light emitting diode units 3, and the height of the second encapsulating layers 6 is consistent with that of the light conversion layer 4.
The distance between adjacent light emitting diode units 3 is 0.02-2mm, the first encapsulating layer 5 is thermosetting silica gel with high-reflectivity additive, and the second encapsulating layer 6 is thermosetting silica gel with high-light-resistance additive.
As shown in fig. 4, the method for packaging an LED package structure according to the first embodiment includes the following steps:
s1, fixing the plurality of light emitting diode units 3 on the substrate 1;
s2, fixing the enclosure glue 2 on the substrate 1 in an enclosure dam mode to form a rectangular enclosure and surround all the light-emitting diode units 3;
s3, filling the first encapsulation layer 5 around the led unit 3 by dispensing, wherein the height of the first encapsulation layer 5 is equal to the height of the led unit 3;
s4, covering the light conversion layer 44 on the light emitting diode unit 3 by spraying or dispensing;
s5, cutting the light conversion layer 4 above the light emitting diode units 3 at different positions into flow channels in a cutting mode;
s6, filling the second package layer 6 in the flow channel by dispensing.
Example two:
as shown in fig. 3, an LED package structure includes a substrate 1, a sealant 2, a light emitting diode unit 3, a light conversion layer 4, a first package layer 5, a second package layer 6, and a third package layer 7;
the number of the light-emitting diode units 3 is two or more, the light-emitting diode units are mutually independently arranged on the surface of the substrate 1, and the enclosure glue 2 is arranged on the substrate 1 and surrounds the light-emitting diode units 3;
the light conversion layer 4 is arranged right above the light emitting diode unit 3, the third packaging layer 7 is arranged between the light emitting diode unit 3 and the light conversion layer 4, the adjacent light conversion layers 4 are not in contact with each other and are arranged independently, and a flow channel is formed between the adjacent light conversion layers 4, specifically, the light conversion layer 4 is of an inverted trapezoidal structure, and the flow channel is of a trapezoidal structure;
the first encapsulating layers 5 are arranged between the adjacent light emitting diode units 3, the height of the first encapsulating layers 5 is consistent with that of the light emitting diode units 3, and the height of the second encapsulating layers 6 is consistent with that of the light conversion layer 4.
The distance between adjacent light emitting diode units 3 is 0.02-2mm, the first encapsulating layer 5 is thermosetting silica gel with high-reflectivity additive, and the second encapsulating layer 6 is thermosetting silica gel with high-light-resistance additive.
The packaging method of the LED packaging structure of the second embodiment comprises the following steps:
s1, fixing the plurality of light emitting diode units 3 on the substrate 1;
s2, fixing the enclosure glue 2 on the substrate 1 in an enclosure dam mode to form a rectangular enclosure and surround all the light-emitting diode units 3;
s3, filling the first encapsulation layer 5 around the led unit 3 by dispensing, wherein the height of the first encapsulation layer 5 is equal to the height of the led unit 3;
s4, coating or dispensing the third encapsulation layer 7 on the light emitting diode unit 3, and coating or dispensing the light conversion layer 4 on the third encapsulation layer 7;
s5, cutting the light conversion layer 4 above the light emitting diode units 3 at different positions into flow channels in a cutting mode;
s6, filling the second package layer 6 in the flow channel by dispensing.
The present invention also includes a packaged device comprising a plurality of pixel points composed of light emitting diode units 3 and a light conversion layer 4, the pixel points having the above-mentioned LED package structures of the first and second embodiments.
The embodiment disclosed by the invention is different from the scheme that a chip LED is packaged on a PCB, different light-emitting units are isolated by a dispensing mode, the light mixing phenomenon of two adjacent light-emitting units is reduced, the uniform uniformity of a surface light source is ensured, and high pixel packaging with small spacing can be realized.
In the gaps among different pixels, the white glue reflecting layer is filled in the chip layer, the black glue light absorption layer is filled in the light conversion layer 4, the light conversion layer 4 is of an inverted trapezoidal structure, and meanwhile, through multi-layer glue dispensing and the use of silica gel materials with different reflectivity and transmittance, the light absorption layer filled in the matrix surface forms a black wall while the brightness is improved, so that the contrast can be effectively improved.
The packaging can be realized by using the existing packaging process without an additional molding process, and the packaging process has the advantages of simple process and low cost.
In the description herein, it is to be understood that the terms "upper," "lower," "left," "right," and the like are used in an orientation or positional relationship merely for convenience in description and simplicity of operation, and do not indicate or imply that the referenced device or element must have a particular orientation, configuration, and operation in a particular orientation, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used merely for descriptive purposes and are not intended to have any special meaning.
In the description herein, references to the description of "an embodiment," "an example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be appropriately combined to form other embodiments as will be appreciated by those skilled in the art.
The technical principle of the present invention is described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive effort, which would fall within the scope of the present invention.
Claims (10)
1. An LED package structure, comprising:
the LED packaging structure comprises a substrate, an LED unit, a light conversion layer, a first packaging layer and a second packaging layer;
the number of the light emitting diode units is two or more, and the light emitting diode units are independently arranged on the surface of the substrate;
the light conversion layers are correspondingly arranged above the light emitting diode units, and a flow channel is formed between every two adjacent light conversion layers;
the first packaging layer is arranged between the adjacent light emitting diode units;
the second packaging layer is arranged in the flow channel.
2. The LED package structure of claim 1, wherein the light conversion layer has an inverted trapezoidal structure and the flow channel has a trapezoidal structure.
3. The LED package structure of claim 2, wherein the light conversion layers are in direct contact with the surface directly above the LED units, and the adjacent light conversion layers are not in contact with each other and are independently disposed.
4. The LED package structure of claim 1, wherein a pitch between adjacent light emitting diode units is 0.02-2 mm.
5. The LED package structure of claim 1, wherein the first encapsulation layer has a height corresponding to a height of the light emitting diode unit, and the second encapsulation layer has a height corresponding to a height of the light conversion layer.
6. The LED package structure of claim 1, further comprising a dam paste disposed on the substrate and surrounding the LED unit.
7. The LED package structure of claim 1, wherein a third packaging layer is disposed between the LED unit and the light conversion layer.
8. The LED package structure of claim 1, wherein the first encapsulant layer is a thermosetting silicone gel with a high reflectivity additive and the second encapsulant layer is a thermosetting silicone gel with a high light blocking additive.
9. A packaged device comprising a plurality of pixels each composed of a light emitting diode unit and a light conversion layer, the pixels having the LED package structure according to any one of claims 1 to 8.
10. An encapsulation method applied to the LED encapsulation structure of any one of claims 1 to 8, comprising the following steps:
s1, fixing the light-emitting diode units on the substrate;
s2, fixing the enclosure glue on the substrate in an enclosure dam mode to form a rectangular enclosure and surround all the light-emitting diode units;
s3, filling the first packaging layer around the light-emitting diode unit in a dispensing manner, wherein the height of the first packaging layer is flush with that of the light-emitting diode unit;
s4, covering the light conversion layer above the light emitting diode unit in a spraying or dispensing manner;
s5, cutting the light conversion layer above the light emitting diode units at different positions into flow channels in a cutting mode;
and S6, filling the second packaging layer in the flow channel in a dispensing manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111655041.0A CN114334929A (en) | 2021-12-30 | 2021-12-30 | LED packaging structure, packaging device and packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111655041.0A CN114334929A (en) | 2021-12-30 | 2021-12-30 | LED packaging structure, packaging device and packaging method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114334929A true CN114334929A (en) | 2022-04-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111655041.0A Pending CN114334929A (en) | 2021-12-30 | 2021-12-30 | LED packaging structure, packaging device and packaging method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114334929A (en) |
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- 2021-12-30 CN CN202111655041.0A patent/CN114334929A/en active Pending
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