CN114334847A

CN114334847A - Packaging structure, manufacturing method thereof, board-level framework and electronic equipment

Info

Publication number: CN114334847A
Application number: CN202111440160.4A
Authority: CN
Inventors: 唐子锴; 蒋然; 张洪武
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2021-11-30
Filing date: 2021-11-30
Publication date: 2022-04-12

Abstract

The application provides a packaging structure, a manufacturing method thereof, a board-level framework and an electronic device, wherein the packaging structure comprises: the device comprises a substrate, at least one first device and at least one connecting line which are positioned on the substrate, and a plastic package structure. The structure formed by the plastic package structure and the substrate surrounds all the first devices on the substrate. The first surface of each first device is connected with one end of the connecting line, and the first surface is the surface of one side of the first device, which is far away from the substrate. The plastic package structure is internally provided with at least one cavity, the cavity is positioned on one side of the first device, which deviates from the substrate, and the position of each cavity corresponds to at least one first device. The first surface of the first device corresponding to the cavity is at least partially exposed in the cavity, and the connecting wire connected with the first device is at least partially positioned in the cavity. Therefore, the plastic package material does not exist on the first surface of the first device, or only a small amount of plastic package material remained due to process errors exists, so that the plastic package material can be prevented from influencing the function of the first device, and the performance of the first device is improved.

Description

Packaging structure, manufacturing method thereof, board-level framework and electronic equipment

Technical Field

The present disclosure relates to the field of chip packaging technologies, and in particular, to a package structure, a method for manufacturing the package structure, a board level architecture, and an electronic device.

Background

With the continuous development of electronic technology, electronic devices are gradually miniaturized and thinned, which requires more functions to be integrated in a smaller space, and thus, chip packaging technology is more and more important.

Plastic cavity packaging is an air-tight packaging technology which is emerging in recent years, has the characteristics of light weight, low dielectric constant and the like, and has remarkable advantages in the aspects of miniaturization, light weight, cost and production cycle. The hermeticity of the plastic cavity package is directly related to the reliability level of the product. In order to improve the packaging reliability, the bare chip is subjected to plastic packaging by adopting a plastic packaging material, and the plastic packaging material on the surface of the bare chip can influence the function of the bare chip.

Disclosure of Invention

The embodiment of the application provides a packaging structure, a manufacturing method thereof, a board-level architecture and electronic equipment, which are used for solving the problem that the function of a bare chip is influenced by a plastic packaging material on the surface of the bare chip in the related technology.

In a first aspect, an embodiment of the present application provides a package structure, where the package structure may include: the device comprises a substrate, at least one first device and at least one connecting line which are positioned on the substrate, and a plastic package structure. The structure formed by the plastic package structure and the substrate surrounds all the first devices on the substrate. The first surface of each first device is connected with one end of the connecting line, and the first surface is the surface of one side of the first device, which is far away from the substrate. The plastic package structure is internally provided with at least one cavity, the cavity is positioned on one side of the first device, which deviates from the substrate, the position of each cavity corresponds to at least one first device, the first surface of the first device, which corresponds to the cavity, is at least partially exposed in the cavity, and the connecting line connected with the first devices is at least partially positioned in the cavity.

In the embodiment of the present application, the first device may be various active devices or passive devices, for example, the first device may be a bare chip, a stand-alone component, a packaged component, or the like.

It is understood that in the embodiments of the present application, that the first surface of the first device is at least partially exposed in the cavity means that a majority of the first surface of the first device is exposed in the cavity, not only the regions of the first surface of the first device other than the respective connection lines may be exposed in the cavity, but also the regions of the first surface of the first device corresponding to the connection lines can be exposed in the cavity. Also, certain process errors may be allowed in the process, for example, the edge of the first surface of the first device may be allowed to have a small amount of mold compound.

In the embodiment of the application, the cavity is arranged in the plastic package structure, and the first surface of the first device at the position of the cavity is at least partially exposed in the cavity, that is, the first surface of the first device does not have a plastic package material (or only has a small amount of plastic package material left due to process errors), so that the plastic package material can be prevented from influencing the function of the first device, the dielectric loss of the first device is reduced, the performance of the first device is improved, and for example, the signal transmission efficiency, the gain and the power of the first device with the radio frequency power amplifier function can be improved.

And, the connecting wire that first device connects, at least part is located the cavity, for example, the part connecting wire that is close to first device is located the cavity, and remaining part wraps up in the plastic envelope structure, can fix the position of connecting wire like this firmly, guarantees that the electric connection effect between connecting wire and the first device is better to play the guard action to the connecting wire. Because at least part of the connecting wire is positioned in the cavity, namely the part of the connecting wire is not wrapped by the plastic package material, the influence of the plastic package material on the signal transmitted by the connecting wire can be reduced, and the signal transmission efficiency of the connecting wire is improved. In addition, the structure formed by the plastic package structure and the substrate surrounds all the first devices on the substrate, so that the sealing performance of the packaging structure is better, and the reliability of the packaging structure is stronger.

In the embodiment of the present application, the position of each cavity corresponds to at least one first device, for example, the position of each cavity may correspond to one, two, or more first devices, and may be set according to actual needs, which is not limited herein.

In the package structure provided by the embodiment of the application, a bonding pad is arranged on the surface of the substrate, one end of at least one connecting line is connected with the first surface of the first device, and the other end of the at least one connecting line is connected with the bonding pad. In some embodiments of the present application, the substrate is provided with a gap at a position between the first device and the pad, for example, the substrate may be a Quad Flat No-lead Package (QFN) substrate. The plastic encapsulation structure may be arranged to fill voids in the substrate. Therefore, the sealing performance of the packaging structure can be ensured to be better, and the air leakage of the packaging structure at the gap of the substrate is prevented. In other embodiments of the present application, no void may be provided in the substrate, and the sealing performance of the package structure is better. For example, the substrate may be a Printed Circuit Board (PCB) or a carrier.

In this application embodiment, can set up the plastic envelope structure into the lateral wall of parcel base plate, like this, can further improve packaging structure's leakproofness to, the bonding area between plastic envelope structure and the base plate is great, makes the combination between plastic envelope structure and the base plate more firm, can further improve packaging structure's reliability. Optionally, the surface of the substrate on the side away from the first device may be flush with the surface of the plastic package structure, so that the bottom surface of the plastic package structure of the first device is relatively flat.

In practical applications, the package structure may also include two, three or more first devices, and the number of the first devices is not limited herein. In addition, the plastic package structure may also include a second device, a cavity is not provided at a position of the second device, and the second device may also be surrounded by a structure formed by the plastic package structure and the substrate. The second device may also be various active devices or passive devices, for example, the second device may be a bare chip, an isolated component, or a packaged component.

In some embodiments of the present application, the connecting wire may electrically connect two components. The surface of the substrate can be provided with a bonding pad, and the first device can be electrically connected with the bonding pad on the surface of the substrate through a connecting wire; or, different first devices may be electrically connected through a connection line, and the first device and the second device may be electrically connected through a connection line; alternatively, different components on the first surface of the same first device may be electrically connected through a connection line.

In specific implementation, the plastic package structure may include: the plastic package portion to and be located the top cap that plastic package portion deviates from base plate one side. One side of the plastic package part close to the top cover is provided with at least one groove, and the groove in the plastic package part and the top cover form a cavity. In the embodiment of the application, the plastic package structure is arranged to comprise the plastic package part and the top cover, a cavity can be formed in the plastic package structure more easily, a groove can be formed in the plastic package part firstly in the manufacturing process, and then the top cover is arranged on the plastic package part, so that the groove in the plastic package part and the top cover form the cavity.

Optionally, the plastic package structure may further include: and the bonding layer is positioned between the plastic packaging part and the top cover. The plastic package part is bonded with the top cover through the bonding layer, so that the sealing performance of the plastic package structure is good. And the bonding area between the plastic package part and the top cover is large, so that the sealing performance and the reliability of the plastic package structure are good.

In the embodiment of the present application, the material of the plastic package portion may be the same as the material of the top cover. Therefore, the thermal expansion coefficients of the plastic package part and the top cover can be matched, and the warping of the package structure caused by the mismatch of the thermal expansion coefficients can be prevented. Of course, the material of the plastic-sealed portion and the top cover may be different, as long as the thermal expansion coefficients of the plastic-sealed portion and the top cover can be matched, and for example, the top cover may be made of a material such as plastic or glass. Alternatively, the material of the plastic package portion may be epoxy resin, liquid crystal polymer, or the like, or other plastic package materials may also be used for the plastic package portion, which is not limited herein.

In a possible implementation manner, the connecting line is an arc-shaped structure which is bent towards a direction away from the substrate, an end portion of the connecting line on a side away from the substrate is located in the plastic package structure, for example, an end portion of the connecting line on a side away from the substrate may be located in the plastic package portion. Like this, the tip that the connecting wire deviates from base plate one side is protected by plastic envelope portion, can prevent that the connecting wire from receiving the damage in the preparation technology process to, most in the connecting wire is wrapped up by plastic envelope portion, can firmly fix the position of connecting wire. In the embodiment of the present application, the connecting line is taken as an example for explanation, and in practical applications, the connecting line may also be in other shapes, which is not limited herein.

In some embodiments of the present application, the first device is fixed on the substrate through a die attach material, and the plastic package structure is connected to a sidewall of the first device. Electrons in the die bonding material can be transmitted to the first surface of the first device through the side wall of the first device, and the plastic packaging structure is connected with the side wall of the first device, so that an electron transfer channel can be blocked, and the electrons in the die bonding material can be prevented from being transmitted to the first surface of the first device to influence the performance of the first device.

In other embodiments of the present application, sidewalls of the first device may also be exposed within the corresponding cavity. For example, when the cavity corresponds to a first device, the sidewall of the first device is exposed in the corresponding cavity, the sidewall of the die attach material may be exposed in the cavity, and a portion of the substrate surface surrounding the first device may be exposed in the cavity. When the cavity corresponds to two or more first devices, the sidewall of each first device corresponding to the cavity may be exposed in the cavity, the sidewall of each die attach material corresponding to the cavity may also be exposed in the cavity, a partial region of the substrate surface surrounding each first device, and a gap between adjacent first devices may also be exposed in the cavity.

In practical applications, the shape of the cavity may have various implementations, and the opening area of the cavity at the end away from the substrate may be smaller than the opening area of the cavity at the end close to the substrate. Wherein, the open area of the cavity deviating from one end of the substrate can mean: the cross-sectional area of the top of the cavity in the direction parallel to the substrate, and the opening area of the cavity at the end close to the substrate may refer to: the cross-sectional area of the bottom of the cavity in a direction parallel to the substrate. For example, the shape of the cross section of the cavity in the direction perpendicular to the substrate may be in the shape of a regular trapezoid, an inverted "V" shape, or the like. Alternatively, the opening area of the cavity at the end away from the substrate may be approximately equal to the opening area of the cavity at the end close to the substrate, i.e. the cavity may have a cylindrical shape, for example, the cavity may have a cylindrical or prismatic shape. Alternatively, the opening area of the cavity at the end away from the base plate may be larger than the opening area of the cavity at the end close to the base plate, for example, the cross section of the cavity in the direction perpendicular to the substrate may have a shape of an inverted trapezoid or a "V" shape.

In an actual process, a protection structure covering the first surface and wrapping a part of the connecting wire can be formed at the position of at least one first device, then a plastic package portion wrapping at least a part of the protection structure and wrapping the connecting wire outside the protection structure is formed, the protection structure can protect the first surface of the first device and the connecting wire, and the first surface of the first device and the part of the connecting wire are not wrapped by the plastic package portion. And removing the protection structure after the plastic packaging part is formed so as to form a groove on the surface of the plastic packaging part and expose the first device and part of the connecting wires. And then, forming a top cover on the plastic packaging part, and enabling the groove in the plastic packaging part and the top cover to form a cavity.

In specific implementation, the protective structure can be made of hydrosol materials, the protective structure can be placed in aqueous solution, the protective structure can be removed, and the process for removing the protective structure is simple. In practice, the aqueous sol material inevitably remains during the process of removing the protective structure. Thus, in the practice of the present application, at least one of the inner wall of the cavity, the first surface of the first device, and the surface of the portion of the connecting wire located within the cavity is provided with an aqueous adhesive material.

In the embodiment of the application, the protection structure is formed at the position of the first device, the protection structure can protect the first surface of the first device and part of the connecting wires from being wrapped by the plastic package part, and after the protection structure is removed subsequently and the top cover is formed, a cavity can be formed at the position of the first device. Thus, the shape of the cavity formed substantially conforms to the shape of the protective structure. Moreover, because the protection structure is made of the hydrosol material which is colloidal, the surface of the protection structure formed after the hydrosol material is solidified is smooth, namely, edges and corners are not easy to form, and therefore, the inner wall of the formed cavity is also a smooth surface.

In a second aspect, an embodiment of the present application further provides a board-level architecture, where the board-level architecture may include: the circuit board, and at least one above-mentioned any packaging structure, every packaging structure can be connected with the circuit board electricity. Because the packaging effect of the packaging structure in the embodiment of the application is good, the plastic packaging material of the packaging structure cannot influence the performance of the first device, and the performance of the first device is good, the performance of a board-level framework comprising the plastic packaging structure is also good. In some embodiments of the present application, the board-level architecture may further include a molding compound, such that the board-level architecture forms a system-in-package. The plastic package body at least wraps the packaging structure in the board level framework. In some application scenes, the plastic package body can also wrap the circuit board and can be arranged according to actual needs.

In a third aspect, an embodiment of the present application further provides an electronic device, where the electronic device may include: any of the above-described package structures, and the housing, the board-level structure may be located inside the housing. The electronic equipment can be a smart phone, a smart television, a notebook computer, wearable equipment and the like.

In a fourth aspect, an embodiment of the present application further provides a manufacturing method of a package structure, where the manufacturing method may include:

adhering at least one first device on the surface of the substrate, and bonding one end of the connecting wire on the first surface of the first device; the first surface is the surface of the first device on the side departing from the substrate;

forming a protective structure covering at least part of the first surface and wrapping part of the connecting wire at the position of at least one first device;

forming a plastic package part wrapping at least part of the protection structure and wrapping the connecting wire outside the protection structure;

removing the protection structure to form a groove on the surface of the plastic package part and expose the first surface of the first device and a part of connecting wires close to the first device;

and forming a top cover on the plastic packaging part, and enabling the groove in the plastic packaging part and the top cover to form a cavity. Optionally, the plastic package portion and the top cover may be bonded by using a bonding layer.

In the manufacturing method provided by the embodiment of the application, the protection structure which covers the first surface and wraps part of the connecting wires is formed at the position of at least one first device, and the protection structure can protect the first surface and part of the connecting wires of the first device, so that the first surface of the first device and part of the connecting wires above the first device are not wrapped by the plastic package part. And after the plastic package part is formed, the protection structure is removed, so that a groove is formed on the surface of the plastic package part, the first device and part of the connecting wires are exposed, and after the top cover is formed on the plastic package part, the groove in the plastic package part and the top cover can form a cavity. Therefore, the plastic package material does not exist on the first surface of at least one first device in the formed packaging structure (or only a small amount of plastic package material remained due to process errors exists), the plastic package material can be prevented from influencing the function of the first device, the dielectric loss of the first device is reduced, and the performance of the first device is improved.

In a possible implementation manner, when the plastic package portion wraps the entire protection structure, after the plastic package portion wrapping at least part of the protection structure and wrapping the connection line outside the protection structure is formed, the protection structure is removed to form a groove on the surface of the plastic package portion, and before the first surface of the first device and the part of the connection line close to the first device are exposed, the method may further include:

and grooving the position of the plastic packaging part corresponding to the protection structure, or grinding the surface of the plastic packaging part to expose the protection structure. In this way, subsequent removal of the protective structure may be facilitated. Taking the protection structure as hydrosol as an example, the protection structure is exposed from the surface of the plastic package part, so that the protection structure can be contacted with the aqueous solution, and the protection structure is convenient to remove.

In addition, when the plastic packaging part wraps part of the protection structure, namely the formed plastic packaging part does not completely cover the protection structure, the protection structure can be exposed from the surface of the plastic packaging part, and therefore the operation of slotting or grinding can be omitted.

In practical processes, taking the material of the protection structure as an example as an aqueous solution adhesive material, a dispensing process or a spraying process and the like can be adopted to form the protection structure on the first surfaces of the first devices with different heights respectively, and then a cavity can be formed on the first surfaces of the first devices with different heights subsequently. Therefore, the manufacturing method in the embodiment of the present application is not limited by the height of the first device, and can be applied to various types of package structures. The height of the first component is understood to be the distance between the first surface of the first component and the surface of the substrate on the side close to the first component.

For example, in the process of manufacturing the protection structure, the protection structure may be formed on the surface of the at least one first device by using a dispensing process or a spraying process, and then the formed protection structure is cured. The protection structure is formed by adopting the hydrosol material, the manufacturing process is simple, the protection structure can be removed by placing the protection structure in the aqueous solution, and the process for removing the protection structure is simple. In specific implementation, the material of the protection structure is taken as an example of a hydrosol material, the hydrosol may be a hydrosol cleaned at normal temperature, and the substrate may be placed in normal-temperature clean water to remove the protection structure. Or the hydrosol can be warm water cleaning hydrosol, and the substrate can be placed in warm water with the temperature of 40-80 ℃ to remove the protection structure. Alternatively, the hydrosol may be an ultrasonic cleaning hydrosol, and the substrate may be placed in an aqueous solution to which ultrasonic waves are applied to remove the protective structure.

Optionally, the shape of the protection structure may also have various implementation manners corresponding to the shape of the cavity, and the opening area of the cavity at the end away from the substrate may be smaller than the opening area of the cavity at the end close to the substrate. Of course, the opening area of the cavity at the end away from the substrate may be equal to or larger than the opening area of the cavity at the end close to the substrate. In the actual process, various shapes of protective structures can be formed in a mode of combining a plurality of times of dispensing processes and a plurality of times of curing processes.

Of course, other materials may also be used to fabricate the protection structure, for example, an organic material may be used to fabricate the protection structure, and the protection structure may be removed by laser irradiation, where the material of the protection structure is not limited herein.

In practice, during the process of removing the protection structure, the aqueous solution adhesive material inevitably remains, and thus, in the embodiment of the present application, at least one of the inner wall of the cavity, the first surface of the first device, and the surface of the portion of the connection line located in the cavity has the aqueous solution adhesive material.

In the embodiment of the application, the protection structure is formed at the position of the first device, and the protection structure can protect the first surface of the first device and part of the connecting line from being wrapped by the plastic package part. After subsequent removal of the protective structure and formation of the cap, a cavity may be formed at the location of the first device. Thus, the shape of the cavity formed substantially conforms to the shape of the protective structure. Moreover, because the protection structure is made of the hydrosol material which is colloidal, the surface of the protection structure formed after the hydrosol material is solidified is smooth, namely, edges and corners are not easy to form, and therefore, the inner wall of the formed cavity is also a smooth surface.

Drawings

Fig. 1 is a schematic diagram of a package structure provided in an embodiment of the present application;

fig. 2 is another schematic diagram of a package structure according to an embodiment of the disclosure;

FIG. 3 is another schematic structural diagram of a package structure according to an embodiment of the present application;

FIG. 4 is a schematic diagram of another package structure according to an embodiment of the present disclosure;

FIG. 5 is a schematic diagram of another package structure according to an embodiment of the present disclosure;

FIG. 6 is a schematic diagram of another package structure according to an embodiment of the present disclosure;

FIG. 7 is a schematic diagram of another package structure according to an embodiment of the present application;

FIG. 8 is a schematic structural diagram of a package structure according to an embodiment of the present application;

fig. 9 is a schematic structural diagram of a board-level architecture according to an embodiment of the present application;

fig. 10 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

fig. 11 is a flowchart of a method for manufacturing a package structure according to an embodiment of the present disclosure;

fig. 12 to 16 are schematic structural diagrams corresponding to steps in the manufacturing method in the embodiment of the present application.

Reference numerals:

10-a substrate; 11-a first device; 12-a connecting line; 13-plastic packaging structure; 131-a plastic package part; 132-a top cover; 133-a tie layer; 14-a die bond material; 15-a pad; 16-a protective structure; 17-a second device; 100-a package structure; 200-a circuit board; 31-board level architecture; 32-a housing; q-cavity; a U-groove; w-voids; s-a first surface.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more clear, the present application will be further described in detail with reference to the accompanying drawings.

It should be noted that the same reference numerals in the drawings of the present application denote the same or similar structures, and thus, a repetitive description thereof will be omitted. The words used in this application to describe positions and orientations are provided by way of example in the drawings and can be changed as desired and are intended to be encompassed by the present application. The drawings of the present application are for illustrating relative positional relationships only and do not represent true scale.

In the related art, in order to improve the reliability of the package, the bare chip is packaged by using a plastic package material, but the plastic package material exists on the surface of the chip. Because some components are generally arranged on the surface of the bare chip, for example, components such as a capacitor and an inductor are arranged on the surface of the bare chip with the radio frequency power amplification function, if plastic package materials exist on the surface of the bare chip, the plastic package materials influence the distribution of a magnetic field and an electric field, so that the signal transmission efficiency is reduced, and the higher the frequency band of the signal is, the greater the influence on the transmission efficiency of the signal is. Therefore, the molding compound on the surface of the die may affect the function of the die.

Based on this, in order to solve the problem that the function of the bare chip can be influenced by the plastic packaging material existing on the surface of the bare chip in the related art. The embodiment of the application provides a packaging structure, a manufacturing method thereof, a board-level framework and electronic equipment. The first device may be various active devices or passive devices, for example, the first device may be a bare chip, a stand-alone component, a packaged component, or the like. The packaging structure in the embodiment of the present application may be applied to various types of electronic devices, for example, the electronic devices may be smart phones, smart televisions, notebook computers, wearable devices, and the like.

Fig. 1 is a schematic view of a package structure provided in an embodiment of the present application, and as shown in fig. 1, the package structure provided in the embodiment of the present application may include: the semiconductor device comprises a substrate 10, at least one first device 11 and at least one connecting line 12 which are positioned on the substrate 10, and a plastic package structure 13. The structure formed by the plastic package structure 13 and the substrate 10 surrounds all the first devices 11 on the substrate 10, a first surface S of the first device 11 is connected to one end of the connection line 12, and the first surface S is a surface of the first device 11 on a side away from the substrate 10. The plastic package structure 13 is provided with at least one cavity Q inside, the cavity Q is located on one side of the first device 11 away from the substrate 10, and the position of each cavity Q corresponds to at least one first device 11. The first surface S of the first device 11 corresponding to the cavity Q is at least partially exposed in the cavity Q, and the connection line 12 connected to the first device 11 is at least partially located in the cavity Q.

In the embodiment of the present application, the first device 11 may be various active devices or passive devices, for example, the first device 11 may be a bare chip, a stand-alone component, a packaged component, or the like.

It is understood that, in the embodiment of the present application, the first surface S of the first device 11 is at least partially exposed in the cavity Q, which means that most of the first surface S of the first device 11 is exposed in the cavity Q, not only the region of the first surface S of the first device 11 except for the respective connection lines 12 can be exposed in the cavity Q, but also the region of the first surface S of the first device 11 corresponding to the connection line 11 can be exposed in the cavity Q. Also, certain process errors may be allowed during the process, for example, the edge of the first surface S of the first device 11 may be allowed to have a small amount of molding compound.

In the embodiment of the present application, by providing the cavity Q in the plastic package structure 13, the first surface S of the first device 11 at the position of the cavity Q is at least partially exposed in the cavity Q, that is, the first surface S of the first device 11 does not have a plastic package material (or only has a small amount of plastic package material remaining due to a process error), so that the plastic package material can be prevented from affecting the function of the first device 11, the dielectric loss of the first device 11 is reduced, the performance of the first device 11 is improved, and for example, the signal transmission efficiency, the gain and the power of the first device 11 having a radio frequency power amplifier function can be improved.

Moreover, at least part of the connection line 12 connected to the first device 11 is located in the cavity Q, for example, part of the connection line 12 close to the first device 11 is located in the cavity Q, and the rest of the connection line 12 is wrapped in the plastic package structure 13, so that the position of the connection line 12 can be firmly fixed, the electrical connection effect between the connection line 12 and the first device 11 is ensured to be good, and the connection line 12 is protected. Because at least part of the connecting wire 12 is located in the cavity Q, that is, the connecting wire 12 is not wrapped by the plastic package material, the influence of the plastic package material on the signal transmitted by the connecting wire 12 can be reduced, and the signal transmission efficiency of the connecting wire 12 is improved. In addition, the structure formed by the plastic-encapsulated structure 13 and the substrate 10 surrounds all the first devices 11 on the substrate 10, so that the sealing performance of the package structure is good, and the reliability of the package structure is high.

In the embodiment of the present application, each cavity is located corresponding to at least one first device, for example, in fig. 1, the cavity Q is located corresponding to one first device 12. Fig. 2 is another schematic diagram of the package structure provided in the embodiment of the present application, and as shown in fig. 2, the positions of the cavities Q may also correspond to two first devices 12. Of course, the position of each cavity may also correspond to three, four or more first devices, and may be set according to actual needs, which is not limited herein.

As shown in fig. 1, in the package structure provided in the embodiment of the present application, a pad 15 is disposed on a surface of a substrate 10, one end of at least one connection line 12 is connected to a first surface S of a first device 11, and the other end is connected to the pad 15. In some embodiments of the present application, the substrate 10 is provided with a gap W at a position between the first device 11 and the pad 15, for example, the substrate 10 may be a Quad Flat No-lead Package (QFN) substrate. The plastic package structure 13 may be set to fill the gap W in the substrate 10, so that the sealing performance of the package structure may be ensured to be better, and the package structure may be prevented from leaking gas at the gap W of the substrate 10.

Fig. 3 is another schematic structural diagram of the package structure in the embodiment of the present application, as shown in fig. 3, in other embodiments of the present application, a gap may not be provided in the substrate 10, and the sealing performance of the package structure is better. For example, the substrate 10 may be a Printed Circuit Board (PCB) or a carrier.

As shown in fig. 1 and 3, in the embodiment of the present application, the plastic package structure 13 may be disposed to wrap the side wall of the substrate 10, so that the sealing performance of the package structure may be further improved, and the bonding area between the plastic package structure 13 and the substrate 10 is relatively large, so that the bonding between the plastic package structure 13 and the substrate 10 is firmer, and the reliability of the package structure may be further improved. Optionally, a surface of the substrate 10 on a side away from the first device 11 may be set to be flush with a surface of the plastic package structure 13, so that a bottom surface of the plastic package structure of the first device 11 is relatively flat.

In fig. 1, the package structure is illustrated as including one first device 11, and in practical applications, the package structure may also include two, three, or more first devices 11, where the number of the first devices 11 is not limited herein. Fig. 4 is another schematic structural diagram of the package structure in the embodiment of the present application, and as shown in fig. 4, the plastic package structure may include two first devices 11, and a cavity Q may be respectively disposed at a position of each first device 11. In addition, the plastic package structure may further include a second device 17, the cavity Q is not provided at the position of the second device 17, and the second device 17 may also be surrounded by a structure formed by the plastic package structure 13 and the substrate 10. The second device 17 may also be various active devices or passive devices, for example, the second device 17 may be a bare chip, a stand-alone component, a packaged component, or the like. For example, in fig. 4, the cavities Q are provided at positions of the two first devices 11 on the left side and the right side, respectively, and the cavities Q are not provided at positions of the second device 17 at the intermediate position. For example, the two first devices 11 near the left side and the right side in fig. 4 may be bare chips with a radio frequency power amplification function, and the second device 17 at the middle position may be a device without a radio frequency function, so that the plastic package material may be prevented from affecting the function of the bare chips with the radio frequency power amplification function, and the device without the radio frequency function is less affected by the plastic package material, so that the cavity Q is not disposed at the position of the second device 17 at the middle position, and the performance of the second device 17 at the middle position may not be affected.

In some embodiments of the present application, the connection line may electrically connect two components, as shown in fig. 4, the surface of the substrate 10 may be provided with a pad 15, and the first device 11 may be electrically connected to the pad 15 on the surface of the substrate 10 through the connection line 12, for example, the first devices 11 on the left side and the right side in fig. 4 are electrically connected to the pad 15 through the connection line 12; alternatively, the different first devices 11 may be electrically connected to each other through the connection line 12, and the first device 11 and the second device 12 may be electrically connected to each other through the connection line 12, for example, the first device 11 on the left side in fig. 4 is electrically connected to the second device 17 at the middle position through the connection line 12; alternatively, different components on the first surface S of the same first device 12 may be electrically connected by the connection line 12, for example, two components on the first surface S of the left first device 12 in fig. 4 are electrically connected by the connection line 12.

In a specific implementation, as shown in fig. 1, the plastic package structure 13 may include: the plastic package part 131, and a top cover 132 located on a side of the plastic package part 131 away from the substrate 10. One side of the plastic package part 131 close to the top cover 132 is provided with at least one groove U, and the groove U in the plastic package part 131 and the top cover 132 form a cavity Q. In the embodiment of the present application, the plastic package structure 13 is configured to include the plastic package portion 131 and the top cover 132, so that a cavity can be more easily formed in the plastic package structure 13, and in the manufacturing process, the groove U may be formed in the plastic package portion 131 first, and then the top cover 132 is placed on the plastic package portion 131, so that the groove U in the plastic package portion 131 and the top cover 132 form the cavity Q.

Optionally, with continued reference to fig. 1, the plastic package structure 13 may further include: the adhesive layer 133 located between the plastic package portion 131 and the top cover 132 bonds the plastic package portion 131 and the top cover 132 through the adhesive layer 133, so that the sealing performance of the plastic package structure 13 can be improved. In addition, the bonding area between the plastic sealing part 131 and the top cap 132 is large, so that the sealing performance and reliability of the plastic sealing structure can be improved.

In the embodiment of the present application, the material of the plastic package portion 131 may be the same as that of the top cover 132, so that the thermal expansion coefficients of the plastic package portion 131 and the top cover 132 may be more matched, and the package structure may be prevented from being warped due to the mismatch of the thermal expansion coefficients. Of course, the material of the mold part 131 and the top cover 132 may be different, as long as the thermal expansion coefficients of the mold part 131 and the top cover 132 can be matched, and for example, the top cover 132 may be made of a material such as plastic or glass. Alternatively, the material of the plastic package portion 131 may be epoxy resin, liquid crystal polymer, or the like, or other plastic package materials may be used for the plastic package portion 131, which is not limited herein.

In a possible implementation manner, as shown in fig. 1, the connection line 12 is an arc-shaped structure that is bent in a direction away from the substrate 10, an end portion of the connection line 12 on a side away from the substrate 10 is located in the plastic package structure 13, for example, an end portion of the connection line 12 on a side away from the substrate 10 may be located in the plastic package portion 131, so that an end portion of the connection line 12 on a side away from the substrate 10 is protected by the plastic package portion 131, the connection line 12 may be prevented from being damaged in a manufacturing process, and a majority of the connection line 12 is wrapped by the plastic package portion 131, so that a position of the connection line 12 can be firmly fixed. In the embodiment of the present application, the connection line 12 is taken as an example for explanation, and in practical applications, the connection line 12 may also have other shapes, which is not limited herein.

In some embodiments of the present application, as shown in fig. 1, the first device 11 is fixed on the substrate 10 by the die attach material 14, and the molding structure 13 is connected to a sidewall of the first device 11. Electrons in the die attach material 14 may be transmitted to the first surface S of the first device 11 through the sidewall of the first device 11, and by connecting the plastic package structure 13 to the sidewall of the first device 11, an electron transfer channel may be blocked, so that the electrons in the die attach material 14 are prevented from being transmitted to the first surface S of the first device 11, and the performance of the first device 11 is not affected.

In other embodiments of the present application, sidewalls of the first device may also be exposed within the corresponding cavity. Fig. 5 is another structural diagram of the package structure in the embodiment of the present application, as shown in fig. 5, the sidewalls of the first device 11 are exposed in the corresponding cavity Q, in addition, the sidewalls of the die attach material 14 may also be exposed in the cavity Q, and a partial region of the surface of the substrate 10 surrounding the first device 11 may also be exposed in the cavity Q. In fig. 5, the cavity Q is illustrated as corresponding to one first device 11, and in a specific implementation, the position of the cavity Q may correspond to two or more first devices 11. Fig. 6 is another structural diagram of the package structure in the embodiment of the present application, as shown in fig. 6, the cavity Q may correspond to three first devices 11, sidewalls of each first device 11 corresponding to the cavity Q may be exposed in the cavity Q, sidewalls of each die attach material 14 corresponding to the cavity Q may also be exposed in the cavity Q, a partial region of the surface of the substrate 10 surrounding each first device 11, and a gap between adjacent first devices 11 may also be exposed in the cavity Q.

In practical applications, the shape of the cavity may have various implementations, as shown in fig. 1, the opening area of the cavity Q at the end away from the substrate 10 is smaller than the opening area of the cavity Q at the end close to the substrate 10, where the opening area of the cavity Q at the end away from the substrate 10 may refer to: the cross-sectional area of the top of the cavity Q in the direction parallel to the substrate 10, and the opening area of the cavity Q near one end of the substrate 10 may refer to: the cross-sectional area of the bottom of the cavity Q in the direction parallel to the substrate 10. For example, the shape of the cross section of the cavity Q in the direction perpendicular to the substrate 10 may be a regular trapezoid, an inverted "V" shape, or the like. Fig. 7 is another structural diagram of the package structure in the embodiment of the present application, and as shown in fig. 7, an opening area of an end of the cavity Q facing away from the substrate 10 may be approximately equal to an opening area of an end of the cavity Q close to the substrate 10, that is, the cavity Q may have a cylindrical shape, for example, the cavity Q may have a cylindrical or prismatic shape. Fig. 8 is another structural diagram of the package structure in the embodiment of the present application, as shown in fig. 8, an opening area of an end of the cavity Q facing away from the base plate 10 may be larger than an opening area of an end of the cavity Q near the base plate 10, for example, a cross section of the cavity Q in a direction perpendicular to the substrate 10 may have a shape of an inverted trapezoid or a "V" shape.

In specific implementation, the protective structure can be made of hydrosol materials, the protective structure can be placed in aqueous solution, the protective structure can be removed, and the process for removing the protective structure is simple. In practice, during the process of removing the protection structure, an aqueous adhesive material inevitably remains, and referring to fig. 1, at least one of the inner wall of the cavity Q, the first surface of the first device 11, and the surface of the portion of the connection line 12 located in the cavity Q has the aqueous adhesive material.

Based on the same technical concept, an embodiment of the present application further provides a board-level architecture, fig. 9 is a schematic structural diagram of the board-level architecture provided in the embodiment of the present application, and as shown in fig. 9, the board-level architecture may include: a circuit board 200, and at least one package structure 100 as described above, each package structure 100 being electrically connected to the circuit board 200. Since the package structure 100 in the embodiment of the present application has a good package effect, the plastic package material of the package structure 100 does not affect the performance of the first device 11, and the performance of the first device 11 is good, the board-level architecture including the plastic package structure 100 also has a good performance. In some embodiments of the present application, the board-level architecture may further include a molding compound, such that the board-level architecture forms a system-in-package. The plastic package body at least wraps the packaging structure in the board level framework. In some application scenes, the plastic package body can also wrap the circuit board and can be arranged according to actual needs.

Based on the same technical concept, an embodiment of the present application further provides an electronic device, fig. 10 is a schematic structural diagram of the electronic device provided in the embodiment of the present application, and as shown in fig. 10, the electronic device may include: any of the board-level structures 31 described above, and the housing 32, the board-level structure 31 may be located inside the housing 32. The electronic equipment can be a smart phone, a smart television, a notebook computer, wearable equipment and the like.

Based on the same technical concept, an embodiment of the present application further provides a manufacturing method of a package structure, fig. 11 is a flowchart of the manufacturing method of the package structure provided in the embodiment of the present application, and fig. 12 to 16 are schematic structural diagrams corresponding to steps in the manufacturing method in the embodiment of the present application. As shown in fig. 11, the method for manufacturing the package structure may include:

s201, referring to fig. 12, at least one first device 11 is mounted on the surface of the substrate 10, for example, the first device 11 may be fixed on the surface of the substrate 10 by the die bond material 14. The first device 11 may be various active devices or passive devices, for example, the first device may be a bare chip, a stand-alone component, a packaged component, or the like. Alternatively, the substrate 10 may be a Printed Circuit Board (PCB), a carrier board, or a Quad Flat No-lead Package (QFN) substrate.

Bonding one end of the connection line 12 to the first surface S of the first device 11; the first surface S is a surface of the first device 11 facing away from the substrate 10. Alternatively, the connecting wires 12 may be thin metal wires, for example, the connecting wires 12 may be gold wires having a diameter of about 1.5 mils. In the actual process, one end of the connection line 12 may be bonded to the first surface S of the first device 11 by applying heat, pressure, ultrasonic waves, or the like. The other end of the connecting wire 12 can be bonded on a pad 15 on the surface of the substrate 10; alternatively, the other end of the connection line 12 may be bonded to another first device 11; alternatively, the other end of the connection line 12 is also bonded to the same first device 11. In particular, for the convenience of packaging, the distance between the end of the connecting wire 12 facing away from the substrate 10 and the surface of the substrate 10 is not too large, and during the bonding process, the distance between the end of the connecting wire 12 facing away from the substrate 10 and the surface of the substrate 10 can be controlled by controlling the length of the connecting wire 12 and the curvature of the connecting wire 12.

S202, referring to fig. 13, at the position of at least one first device 11, a protection structure 16 is formed to cover at least a portion of the first surface S and to wrap a portion of the connection line 12.

For example, the protective structure 16 may be formed on the surface of the at least one first device 11 by a dispensing process, a spraying process, or the like, using a hydrosol material, and then the formed protective structure 16 is cured. The protective structure 16 is formed by adopting the hydrosol material, the manufacturing process is simple, the protective structure 16 can be removed by placing the protective structure 16 in the aqueous solution, and the process for removing the protective structure 16 is also simple.

Alternatively, the shape of the protection structure 16 may have various implementations corresponding to the shape of the cavity Q, and referring to fig. 13, the opening area of the cavity Q at the end away from the substrate 10 is smaller than the opening area of the cavity Q at the end close to the substrate 10. Of course, the opening area of the cavity Q at the end away from the substrate 10 may be equal to or larger than the opening area of the cavity Q at the end close to the substrate 10. In the actual process, various shapes of protective structures can be formed in a mode of combining a plurality of times of dispensing processes and a plurality of times of curing processes.

Of course, other materials may be used to fabricate the protection structure 16, for example, an organic material may be used to fabricate the protection structure 16, and the protection structure 16 may be removed by laser irradiation, which is not limited to the material of the protection structure 16.

S203, referring to fig. 14, a plastic package portion 131 is formed to wrap at least a portion of the protection structure 16 and to wrap the connection line 12 outside the protection structure 16.

S204, referring to fig. 15, the protection structure is removed to form a groove U on the surface of the plastic package portion 131, and expose the first surface S of the first device 11 and a portion of the connection line 12 close to the first device 11. In an actual process, taking the material of the protective structure as an example of hydrosol, the substrate 10 may be placed in an aqueous solution to remove the protective structure. In specific implementation, the hydrosol may be a normal temperature cleaning hydrosol, and the substrate 10 may be placed in a normal temperature clean water to remove the protection structure. Alternatively, the hydrosol may be a warm water cleaning hydrosol, and the substrate 10 may be placed in warm water at 40 to 80 ℃ to remove the protective structure. Alternatively, the hydrosol may be an ultrasonic cleaning hydrosol, and the substrate 10 may be placed in an aqueous solution to which ultrasonic waves are applied to remove the protective structure.

S205, referring to fig. 1, a top cap 132 is formed on the plastic package portion 131, and the groove U in the plastic package portion 131 and the top cap 132 form a cavity Q. Alternatively, the plastic package part 131 and the top cover 132 may be bonded by using an adhesive layer 133. In practical applications, moisture remaining during the process of removing the protective structure needs to be removed before forming the cap 132, so as to prevent the moisture from affecting the performance of the first device 11.

In step S203, referring to fig. 14, the molding section 131 may wrap all of the protection structures 16, and after step S203 and before step S204, the method may further include:

As shown in fig. 16, in step S203, the mold part 131 may wrap a portion of the protection structure 16, that is, the mold part 131 is formed not to completely cover the protection structure 16, and the protection structure 16 may be exposed from the surface of the mold part 131, so that the above-mentioned grooving or grinding operation may be omitted.

In particular, referring to fig. 4, when at least two first devices 11 are disposed on the substrate 10, the heights of the first devices 11 on the substrate 10 may be different, for example, in fig. 4, the height of the first device 11 on the left side is different from the height of the first device 11 on the right side. In the step S202, a dispensing process may be adopted to form the protection structures 16 on the first surfaces S of the first devices 11 with different heights, and then the cavities Q may be formed on the first surfaces S of the first devices 11 with different heights. Thus, the manufacturing method in the embodiment of the present application is not limited by the height of the first device 11, and can be applied to various types of package structures. Here, the height of the first device 11 may be understood as a distance between the first surface S of the first device 11 and a surface of the substrate 10 on a side close to the first device 11.

In implementation, during the process of removing the protection structure, an aqueous adhesive material inevitably remains, and referring to fig. 1, at least one of the inner wall of the cavity Q, the first surface of the first device 11, and the surface S of the portion of the connection line 12 located in the cavity Q has the aqueous adhesive material.

In the embodiment of the present application, referring to fig. 13 and 14, by forming the protection structure 16 at the position of the first device 11, the protection structure 16 may protect the first surface S of the first device 11 and a portion of the connection line 12 from being wrapped by the mold part 131. Referring to fig. 15 and 1, after the protective structure is subsequently removed and the cap 132 is formed, a cavity Q may be formed at the location of the first device 11. Thus, the shape of the cavity formed substantially conforms to the shape of the protective structure. Moreover, because the protection structure is made of the hydrosol material which is colloidal, the surface of the protection structure formed after the hydrosol material is solidified is smooth, namely, edges and corners are not easy to form, and therefore, the inner wall of the formed cavity is also a smooth surface.

While the preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all alterations and modifications as fall within the scope of the application.

It will be apparent to those skilled in the art that various changes and modifications may be made in the embodiments of the present application without departing from the spirit and scope of the embodiments of the present application. Thus, if such modifications and variations of the embodiments of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to encompass such modifications and variations.

Claims

1. A package structure, comprising: the circuit comprises a substrate, at least one first device and at least one connecting line which are positioned on the substrate, and a plastic package structure;

the structure formed by the plastic package structure and the substrate surrounds all the first devices on the substrate;

the first surface of the first device is connected with one end of the connecting wire, and the first surface is the surface of the first device on the side away from the substrate;

at least one cavity is arranged in the plastic package structure, the cavity is positioned on one side of the first device, which is far away from the substrate, and the position of each cavity corresponds to at least one first device; a first surface of the first device corresponding to the cavity is at least partially exposed in the cavity; the connecting wire connected with the first device is at least partially positioned in the cavity.

2. The package structure of claim 1, wherein the plastic encapsulation structure comprises: the plastic packaging part and the top cover are positioned on one side of the plastic packaging part, which is far away from the substrate;

one side of the plastic package part, which is close to the top cover, is provided with at least one groove, and the groove in the plastic package part and the top cover form the cavity.

3. The package structure of claim 2, wherein the plastic encapsulation structure further comprises: and the bonding layer is positioned between the plastic packaging part and the top cover.

4. The package structure according to claim 2, wherein a material of the plastic molding part is the same as a material of the top cap.

5. The package structure according to any one of claims 1 to 4, wherein the connection line is an arc-shaped structure that is bent in a direction away from the substrate, and an end of the connection line on a side away from the substrate is located in the plastic package structure.

6. The package structure of claim 1, wherein the first device is secured to the substrate by a die attach material;

the plastic package structure is connected with the side wall of the first device.

7. The package structure of claim 1, further comprising: a pad over the substrate;

one end of at least one connecting wire is connected with the first surface of the first device, and the other end of the connecting wire is connected with the bonding pad;

the substrate is provided with a gap between the first device and the bonding pad, and the gap is filled with the plastic package structure.

8. The package structure according to any one of claims 1 to 7, wherein the plastic encapsulation structure wraps the side wall of the substrate.

9. The package structure according to any one of claims 1 to 8, wherein an opening area of an end of the cavity facing away from the substrate is smaller than an opening area of an end of the cavity adjacent to the substrate.

10. The package structure according to any one of claims 1 to 9, wherein an inner wall of the cavity is a smooth surface.

11. The package structure according to any one of claims 1 to 10, wherein at least one of an inner wall of the cavity, the first surface of the first device, and a surface of a portion of the connection line located in the cavity has an aqueous adhesive material.

12. A board level architecture, comprising: a circuit board and at least one package structure according to any one of claims 1 to 11; each of the package structures is electrically connected with the circuit board.

13. An electronic device, comprising: the board level architecture of claim 12, and a housing; the board-level architecture is located inside the housing.

14. A method for manufacturing a package structure includes:

mounting at least one first device on the surface of a substrate, and bonding one end of a connecting wire on the first surface of the first device; wherein the first surface is a surface of the first device facing away from the substrate;

forming a protective structure covering at least part of the first surface and wrapping part of the connecting line of the first device at the position of at least one first device;

removing the protection structure to form a groove on the surface of the plastic package part and expose the first surface of the first device and a part of the connecting wire close to the first device;

and forming a top cover on the plastic packaging part, and enabling the groove in the plastic packaging part and the top cover to form a cavity.

15. The manufacturing method according to claim 14, wherein the plastic package part wraps all of the protection structures;

after forming at least part of parcel protection structure and parcel the protection structure is outer the plastic envelope portion of connecting wire, get rid of protection structure to in the surface of plastic envelope portion forms the recess, and expose first device the first surface with be close to first device the part before the connecting wire, still include:

and grooving the position of the plastic package part corresponding to the protection structure, or grinding the surface of the plastic package part to expose the protection structure.

16. The method of manufacturing according to claim 14 or 15, wherein the forming of the protection structure covering the first surface and wrapping a portion of the connection line of the first device on the first surface of at least one of the first devices comprises:

and forming the protection structure on the surface of at least one first device by adopting a water soluble adhesive material through a dispensing process.