CN114292607B - Adhesive and preparation method and application thereof - Google Patents
Adhesive and preparation method and application thereof Download PDFInfo
- Publication number
- CN114292607B CN114292607B CN202210012395.1A CN202210012395A CN114292607B CN 114292607 B CN114292607 B CN 114292607B CN 202210012395 A CN202210012395 A CN 202210012395A CN 114292607 B CN114292607 B CN 114292607B
- Authority
- CN
- China
- Prior art keywords
- adhesive
- parts
- polybutadiene
- epoxy resin
- modified polyolefin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 40
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 40
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 229920005672 polyolefin resin Polymers 0.000 claims abstract description 29
- 229920002943 EPDM rubber Polymers 0.000 claims abstract description 28
- 239000003822 epoxy resin Substances 0.000 claims abstract description 24
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 24
- 229920013636 polyphenyl ether polymer Polymers 0.000 claims abstract description 23
- 239000005062 Polybutadiene Chemical group 0.000 claims abstract description 14
- 229920002857 polybutadiene Chemical group 0.000 claims abstract description 14
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 10
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical group O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000002994 raw material Substances 0.000 claims abstract description 7
- 229920001577 copolymer Polymers 0.000 claims abstract description 6
- 229930195734 saturated hydrocarbon Natural products 0.000 claims abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 10
- 239000012452 mother liquor Substances 0.000 claims description 10
- 239000010413 mother solution Substances 0.000 claims description 10
- 239000000945 filler Substances 0.000 claims description 9
- 239000000377 silicon dioxide Substances 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 7
- 238000001035 drying Methods 0.000 claims description 6
- 239000003999 initiator Substances 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims 1
- 238000003892 spreading Methods 0.000 claims 1
- 239000002313 adhesive film Substances 0.000 abstract description 9
- 238000004132 cross linking Methods 0.000 abstract description 6
- 239000003292 glue Substances 0.000 abstract description 3
- 239000004593 Epoxy Substances 0.000 abstract description 2
- 239000004721 Polyphenylene oxide Substances 0.000 abstract 1
- 229920006380 polyphenylene oxide Polymers 0.000 abstract 1
- 230000009257 reactivity Effects 0.000 abstract 1
- 238000003756 stirring Methods 0.000 description 25
- 230000000052 comparative effect Effects 0.000 description 10
- 239000004576 sand Substances 0.000 description 10
- 239000002904 solvent Substances 0.000 description 7
- 230000008054 signal transmission Effects 0.000 description 6
- 235000012239 silicon dioxide Nutrition 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 229920000459 Nitrile rubber Polymers 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 230000018109 developmental process Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 229920001955 polyphenylene ether Polymers 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 229920002121 Hydroxyl-terminated polybutadiene Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- -1 accelerators Substances 0.000 description 1
- 239000002671 adjuvant Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 239000012745 toughening agent Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses an adhesive, a preparation method and application thereof, wherein the adhesive comprises the following raw materials: a modified polyolefin resin, ethylene propylene diene monomer, polyphenylene oxide and an epoxy resin, the modified polyolefin resin comprising at least one of a polybutadiene-styrene copolymer modified with maleic anhydride, polybutadiene, a butadiene-styrene copolymer and polybutadiene; the ethylene propylene diene monomer main chain is saturated hydrocarbon; the polyphenyl ether is double-end hydroxyl polyphenyl ether; the modified polyolefin resin added by the epoxy resin which is the epoxy polybutadiene with the hydroxyl groups has extremely low dielectric constant, higher reactivity and compatibility, less polar groups of the epoxy resin and smaller dielectric property, and can effectively reduce Dk and Df in a glue system and improve the crosslinking density of the epoxy resin, so that the pure adhesive film has low dielectric constant and low dielectric loss.
Description
Technical Field
The invention belongs to the technical field of electronic circuit boards, and particularly relates to an adhesive and a preparation method and application thereof.
Background
The 21 st century is a highly informative society. An important technical basis for the development of informatization is high-speed, high-frequency and high-capacity signal transmission. Current advances in information and communication technology have led electronic information products to move into the gigahertz (GHz) era. Among the most prominent are digital video products, which enable the integrated transmission of synchronous transmission of voice, video signals and data. On the other hand, the widespread networking has advanced the development of increasing the capacity of information.
In a high frequency line, the relation between the signal transmission speed V and the dielectric constant er (Dk) of the material is: v=k×c/(er) 1/2; the relation between the signal transmission attenuation α and the material dielectric loss tangent tan δ (Df) is: α=k (f/C) ×tan δ (er) 1/2, where K is a constant, C is the speed of light, and f is the signal transmission frequency. It can be seen that the lower the dielectric constant (Dk) of the material, the faster the signal transmission speed; the smaller the dielectric constant (Dk) and dielectric loss tangent (Df) of the material, the less distortion the signal transmission will be. In recent years, with rapid development of electronic industry, information processing and information transmission are accelerated, requirements on high-frequency characteristics of materials are higher and higher, and with continuous development of 5G technology, requirements on dielectric constants and dielectric losses of materials inside circuit boards are lower and lower, so that requirements on low dielectric constants and low losses are also provided for materials inside circuit boards.
In view of the above, it is an urgent need to provide a plastic film with low dielectric constant and low dielectric loss.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems in the prior art described above. Therefore, the adhesive provided by the invention can effectively reduce Dk and Df of a glue system and improve the crosslinking density through the combination of the components, so that the pure adhesive film prepared from the adhesive has low dielectric constant and low dielectric loss.
The invention also provides a preparation method of the adhesive.
The invention also provides a pure adhesive film prepared from the adhesive.
The invention also provides a preparation method of the pure adhesive film.
The invention also provides application of the pure adhesive film in preparing a circuit board material.
The first aspect of the invention provides an adhesive, which is prepared from the following raw materials: modified polyolefin resin, ethylene propylene diene monomer, polyphenyl ether and epoxy resin;
the modified polyolefin resin includes at least one of a maleic anhydride modified polybutadiene-styrene copolymer, a polybutadiene, a butadiene-styrene copolymer, and a polybutadiene;
the ethylene propylene diene monomer main chain is saturated hydrocarbon;
the polyphenyl ether is double-end hydroxyl polyphenyl ether;
the epoxy resin is an epoxidized polybutadiene having a terminal hydroxyl group.
The adhesive provided by the invention has at least the following beneficial effects:
1. the polybutadiene chain segment in the modified polyolefin resin is nonpolar and has poor compatibility with polar solvents, and the compatibility of the polybutadiene chain segment grafted with polar group maleic anhydride can be improved; and maleic anhydride participates in the reaction to form a three-dimensional reticular structure; meanwhile, the maleic anhydride modified polyolefin resin is selected to have extremely low dielectric constant, the dielectric constant is related to polarity, the more polar groups are, the larger dielectric constant is, the smaller the dielectric constant is, the maleic anhydride reacts with hydroxyl in polyphenyl ether and epoxy groups in epoxy resin to form a three-dimensional network polymer, and meanwhile, double bonds on a polyolefin chain segment in the modified polyolefin resin and double bonds in ethylene propylene diene monomer rubber can also form the three-dimensional network polymer, so that the performances of heat resistance, strength, glass transition temperature and the like of the modified polyolefin resin can be improved.
2. The ethylene propylene diene monomer mainly plays a role in toughening, the main chains of the ethylene propylene diene monomer are all saturated bonds, only unsaturated double bonds possibly exist on side chains, and the ethylene propylene diene monomer has excellent ageing resistance such as ozone resistance, heat resistance and weather resistance. While the unsaturated double bonds on the side chains can be ring-opened crosslinked.
3. The polyphenyl ether has a relatively symmetrical structure, fewer polar groups and very low dielectric loss and dielectric constant, and hydroxyl groups in the polyphenyl ether can react with maleic anhydride in the modified polyolefin resin to form a polymer.
4. Conventional epoxy resins carry, in addition to the epoxide groups, other polar groups, e.g. -CH 3 The epoxy hydroxyl-terminated polybutadiene selected by the invention has no other polar groups except epoxy groups and hydroxyl groups at two ends, so that the dielectric properties of the epoxy-terminated polybutadiene are smaller, dk and Df in a glue system can be effectively reduced, and the crosslinking density of the epoxy-terminated polybutadiene is improved.
In some embodiments of the present invention, the modified polyolefin resin is 20 to 50 parts by weight, the ethylene propylene diene monomer is 20 to 40 parts by weight, the polyphenylene ether is 5 to 20 parts by weight, and the epoxy resin is 5 to 20 parts by weight.
In some embodiments of the invention, the preparation of the feedstock further comprises: a filler and an initiator.
In some embodiments of the invention, the filler is 10 to 40 parts by weight and the initiator is 1 to 10 parts by weight.
In some embodiments of the invention, the filler comprises silica.
In some embodiments of the invention, the initiator comprises at least one of dibenzoyl peroxide and azobisisobutyronitrile.
In some embodiments of the present invention, the adhesive is prepared from the following raw materials in parts by weight: 20-50 parts of modified polyolefin resin, 20-40 parts of ethylene propylene diene monomer rubber, 5-20 parts of polyphenyl ether, 5-20 parts of epoxy resin and 10-40 parts of filler.
In some embodiments of the present invention, adjuvants such as silane coupling agents, flame retardants, accelerators, antioxidants, and the like may be added as needed.
The second aspect of the invention provides a preparation method of an adhesive, comprising the following steps:
a1: dispersing and mixing the polyphenyl ether and the ethylene propylene diene monomer to obtain mother liquor;
a2: and C, dispersing the mother solution obtained in the step A1, and mixing the modified polyolefin resin and the epoxy resin to obtain the modified polyolefin resin.
In some preferred embodiments of the present invention, a method for preparing an adhesive includes the steps of:
a1: sequentially adding and mixing polyphenyl ether resin, ethylene propylene diene monomer, filler and solvent to obtain mother solution;
a2: and (C) mixing the mother liquor obtained in the step (A1), the modified polyolefin resin, the epoxidized polyolefin and the initiator to obtain the modified polyolefin resin.
In some embodiments of the invention, in step A1, the solvent comprises at least one of toluene and xylene.
In some embodiments of the present invention, in step A1, the polyphenylene ether resin, the ethylene propylene diene monomer, the filler and the solvent are sequentially added into a stirring kettle, mixed and stirred, and then sanded with a sand mill for 2-3 times to prepare a mother solution.
In some embodiments of the invention, the mother liquor has a particle size of no more than 10 μm.
In some embodiments of the invention, in step A2, the mixing is for a period of 2 to 4 hours.
The third aspect of the invention provides an adhesive pure film, wherein the preparation raw materials of the pure film comprise the adhesive.
The fourth aspect of the invention provides a method for preparing the pure film, comprising the following steps:
b1: and coating the adhesive on the release film, and drying to obtain the compound.
B2: and B1, pressing the compound obtained in the step B1 with the release paper to prepare a pure adhesive film.
In some embodiments of the invention, the drying time is 100 to 150 seconds.
In some embodiments of the invention, the drying temperature is 120 to 180 ℃.
In some embodiments of the invention, the temperature of the press-fit is 50-100 ℃.
The fifth aspect of the invention provides an application of the pure adhesive film in preparing a circuit board material.
Drawings
The invention is further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a molecular formula of a modified polyolefin resin;
FIG. 2 is a schematic representation of ethylene propylene diene monomer molecular formula;
FIG. 3 is a molecular formula of polyphenylene ether;
FIG. 4 is a molecular formula of an epoxy resin;
Detailed Description
The conception and the technical effects produced by the present invention will be clearly and completely described in conjunction with the embodiments below to fully understand the objects, features and effects of the present invention. It is apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments, and that other embodiments obtained by those skilled in the art without inventive effort are within the scope of the present invention based on the embodiments of the present invention.
Example 1
The embodiment prepares an adhesive, which comprises the following specific processes:
a1: 10 parts of polyphenyl ether (the molecular formula of the polyphenyl ether is shown as figure 3), 30 parts of ethylene propylene diene monomer (the molecular formula of the ethylene propylene diene monomer is shown as figure 2), 25 parts of silicon dioxide and a solvent are sequentially added into a stirring kettle, mixed and stirred at 25 ℃ at 300r/min, and then a sand mill is used for sand milling for 3 times to prepare mother liquor.
A2: 25 parts of mother solution and modified polyolefin resin (the molecular formula of the modified polyolefin resin is shown in figure 1, wherein the values of x, y and z are 10-30); 10 parts of epoxy resin (the molecular formula of the epoxy resin is shown in figure 4); adding into a stirring kettle, continuously stirring, and stirring for 3 hours to mix uniformly to prepare the adhesive.
Example 2
The embodiment prepares an adhesive, which comprises the following specific processes:
a1: 7 parts of polyphenyl ether, 50 parts of ethylene propylene diene monomer and 18 parts of silicon dioxide as well as solvent are sequentially added into a stirring kettle, mixed and stirred at 25 ℃ for 300r/min, and then sand ground for 3 times by a sand mill to prepare mother liquor.
A2: adding 18 parts of mother solution, 18 parts of modified polyolefin resin and 7 parts of epoxy resin into a stirring kettle, continuously stirring, and stirring for 3 hours to uniformly mix to prepare the adhesive.
Example 3
The embodiment prepares a pure adhesive film, which comprises the following specific processes:
b1: and coating the adhesive on the release film, and drying at 150 ℃ for 300 seconds to obtain the compound.
B2: and (3) pressing the compound obtained in the step (B1) and the release paper at the temperature of 75 ℃ to prepare a pure adhesive film.
Comparative example 1
The adhesive is prepared according to the comparative example, and ethylene propylene diene monomer is not added in the comparative example, and the specific process is as follows:
a1: 14 parts of polyphenyl ether, 36 parts of silicon dioxide and a solvent are sequentially added into a stirring kettle, mixed and stirred at 25 ℃ for 300r/min, and then sanded for 3 times by a sand mill to prepare mother liquor.
A2: and adding 36 parts of mother solution, 36 parts of modified polyolefin resin and 14 parts of epoxy resin into a stirring kettle, continuously stirring, and stirring for 3 hours to uniformly mix to prepare the adhesive.
Comparative example 2
The comparative example is an adhesive which is different from the example 1 in that ethylene propylene diene monomer rubber is replaced by nitrile rubber with the same toughening effect, and the specific process is as follows:
a1: 10 parts of polyphenyl ether, 30 parts of nitrile rubber and 25 parts of silicon dioxide are sequentially added into a stirring kettle, mixed and stirred at 25 ℃ for 300r/min, and then sanded for 3 times by a sand mill to prepare mother liquor.
A2: adding 25 parts of mother solution, 25 parts of modified polyolefin resin and 10 parts of epoxy resin into a stirring kettle, continuously stirring, and stirring for 3 hours to uniformly mix to prepare the adhesive.
Comparative example 3
The adhesive prepared in this example is different from that in example 1 in that ethylene propylene diene monomer is changed into polyimide solution, and the specific process is as follows:
a1: 10 parts of polyphenyl ether, 30 parts of polyimide solution and 25 parts of silicon dioxide are sequentially added into a stirring kettle, mixed and stirred at 25 ℃ for 300r/min, and then sanded for 3 times by a sand mill to prepare mother liquor.
A2: adding 25 parts of mother solution, 25 parts of modified polyolefin resin and 10 parts of epoxy resin into a stirring kettle, continuously stirring, and stirring for 3 hours to uniformly mix to prepare the adhesive.
Comparative example 4
This example produced an adhesive differing from example 2 in the specific procedure of adding a polyolefin resin containing no maleic anhydride:
a1: 7 parts of polyphenyl ether, 50 parts of ethylene propylene diene monomer and 18 parts of silicon dioxide as well as solvent are sequentially added into a stirring kettle, mixed and stirred at 25 ℃ for 300r/min, and then sand ground for 3 times by a sand mill to prepare mother liquor.
A2: adding 18 parts of mother solution, 18 parts of polybutadiene resin and 7 parts of epoxy resin into a stirring kettle, continuously stirring, and stirring for 3 hours to uniformly mix to prepare the adhesive.
Test examples
The performance of the adhesives prepared in the examples and comparative examples was tested in this test example. The results are recorded in table 1 below.
TABLE 1 Properties of the adhesive
The ethylene propylene diene monomer rubber is not included in the comparative example 1, the ethylene propylene diene monomer rubber is replaced by the nitrile rubber with the same toughening effect in the comparative example 2, the heat resistance NG is caused by the fact that the heat resistance of soldering tin is related to the crosslinking density, too low crosslinking density is caused by too many polar groups, dk and Df are increased due to the fact that the crosslinking density is too high, the flexibility is generally used for making the rubber not too brittle, and the currently used toughening agent is generally carboxyl-terminated nitrile rubber. The excessive carboxyl group thereof increases Dk, df, and the ethylene propylene diene monomer is converted into a polyimide solution in comparison with example 3, and the addition of the polyimide solution results in an increase in dielectric constant, and the polyolefin resin excluding maleic anhydride, which is a polar group capable of participating in the reaction, reacts with hydroxyl groups in polyphenylene ether and epoxy groups in epoxy resin to form a three-dimensional network polymer in comparison with example 1, thereby improving heat resistance and strength.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present invention. Furthermore, embodiments of the invention and features of the embodiments may be combined with each other without conflict.
Claims (9)
1. The adhesive is characterized by comprising the following preparation raw materials: modified polyolefin resin, ethylene propylene diene monomer, polyphenyl ether and epoxy resin;
the modified polyolefin resin includes at least one of a maleic anhydride modified polybutadiene-styrene copolymer, a polybutadiene, a butadiene-styrene copolymer, and a polybutadiene;
the ethylene propylene diene monomer main chain is saturated hydrocarbon;
the polyphenyl ether is double-end hydroxyl polyphenyl ether;
the epoxy resin is epoxidized polybutadiene with terminal hydroxyl groups;
20-50 parts of modified polyolefin resin, 20-40 parts of ethylene propylene diene monomer rubber, 5-20 parts of polyphenyl ether and 5-20 parts of epoxy resin.
2. The adhesive according to claim 1, wherein the adhesive is prepared from the following raw materials: a filler and an initiator.
3. The adhesive according to claim 2, wherein the filler is 10 to 40 parts by weight and the initiator is 1 to 10 parts by weight.
4. The adhesive of claim 3, wherein the filler comprises silica.
5. A method of preparing the adhesive of claim 1, comprising the steps of:
a1: dispersing and mixing the polyphenyl ether and the ethylene propylene diene monomer to obtain mother liquor;
a2: and C, dispersing and mixing the mother solution obtained in the step A1 and the modified polyolefin resin, thereby obtaining the epoxy resin.
6. A pellicle characterized in that the raw material for preparing the pellicle comprises the adhesive according to any one of claims 1 to 4.
7. A method for preparing a pellicle according to claim 6, comprising spreading, drying, and laminating the adhesive.
8. The method of claim 7, wherein the drying temperature is 120-180 ℃.
9. Use of a pure film prepared by the preparation method according to claim 7 or 8 for preparing a circuit board material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210012395.1A CN114292607B (en) | 2022-01-06 | 2022-01-06 | Adhesive and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210012395.1A CN114292607B (en) | 2022-01-06 | 2022-01-06 | Adhesive and preparation method and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114292607A CN114292607A (en) | 2022-04-08 |
| CN114292607B true CN114292607B (en) | 2023-06-06 |
Family
ID=80975367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210012395.1A Active CN114292607B (en) | 2022-01-06 | 2022-01-06 | Adhesive and preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114292607B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116162431B (en) * | 2022-12-30 | 2024-06-14 | 烟台德邦科技股份有限公司 | Hybrid curing damp-heat resistant adhesive and preparation method thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6973411B2 (en) * | 2016-12-22 | 2021-11-24 | 東亞合成株式会社 | Adhesive composition and coverlay film using it, bonding sheet, copper-clad laminate and electromagnetic wave shielding material |
| TWI637405B (en) * | 2017-03-15 | 2018-10-01 | 臻鼎科技股份有限公司 | Low dielectric resin composition, film and circuit board using the same |
| CN110317541B (en) * | 2019-06-19 | 2021-07-13 | 南亚新材料科技股份有限公司 | Bonding sheet and preparation method of high-speed copper-clad plate |
| CN111393724A (en) * | 2020-03-30 | 2020-07-10 | 广东生益科技股份有限公司 | Resin composition, and prepreg and circuit material using same |
| CN113234242B (en) * | 2021-06-29 | 2022-05-24 | 四川大学 | Double-bond-terminated polyphenyl ether and epoxidized polybutadiene resin co-crosslinked polymer capable of being used for 5G high-speed high-frequency communication and preparation method thereof |
-
2022
- 2022-01-06 CN CN202210012395.1A patent/CN114292607B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN114292607A (en) | 2022-04-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102807658B (en) | Polyphenyl ether resin composite and prepreg and copper clad laminate made of polyphenyl ether resin composite | |
| CN102161823B (en) | Composite material, high-frequency circuit substrate therefrom and manufacture method thereof | |
| CN104774476A (en) | Phosphorus-containing flame retardant composition, and phosphorus-containing polyphenyl ether resin composition, prepreg and laminated board using the same | |
| CN112592554B (en) | Circuit material and printed circuit board | |
| CN112724640A (en) | Thermosetting resin composition, prepreg using same and copper-clad laminate | |
| EP3889209A1 (en) | A resin composition, and prepreg and circuit material using the same | |
| CN114292607B (en) | Adhesive and preparation method and application thereof | |
| TWI412564B (en) | Dielectric material formula and circuit board utilizing the same | |
| CN114149678A (en) | Thermosetting resin composition, reinforcing material, metal-clad laminate and use thereof | |
| CN114989418B (en) | Method for modifying polyphenylene ether resin, laminate film composite, laminate film, and substrate | |
| CN113969122B (en) | Low-dielectric thermosetting adhesive composition, preparation method thereof and flexible copper-clad plate | |
| JPH09291148A (en) | Production of modified polyphenylene oxide, epoxy resin composition containing modified polyphenylene oxioe produced by the process, prepreg made using the composition, and laminate made using the prepreg | |
| TWI774559B (en) | Polyphenylene ether resin modified by bismaleimide, manufacturing method thereof, and substrate material of circuit board | |
| CN111605267B (en) | Flame-retardant olefin substrate and preparation method thereof | |
| CN117511233B (en) | Polyphenyl ether modified hydrocarbon resin composition and application thereof in copper-clad plate | |
| CN108410128A (en) | A kind of high-speed high frequency resin combination, prepreg and laminate used for printed circuit board | |
| CN109370497B (en) | Preparation method of glue for producing high-speed copper-clad plate and product thereof | |
| CN113861929A (en) | Adhesive, preparation method thereof, low dielectric loss pure adhesive film applying adhesive and manufacturing process thereof | |
| CN113736215B (en) | Thermosetting resin composition for low dielectric loss flexible copper-clad plate and preparation method thereof | |
| CN114230794B (en) | Modified bismaleimide prepolymer, resin composition and application | |
| CN116640527A (en) | Double-component ultraviolet light curing acrylic acid-epoxy resin adhesive film, preparation method and application | |
| CN115537012A (en) | Resin composition, prepreg, circuit board and printed circuit board | |
| WO2021026987A1 (en) | Resin composition, prepreg, and related substrate | |
| CN113105622A (en) | Modified polyphenyl ether, thermosetting polyphenyl ether composition and application thereof | |
| JPH09235349A (en) | Epoxy resin composition, prepreg using the same, and laminate using the prepreg |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |