CN114245622B - Online compression fittings of high strength multilayer circuit board - Google Patents

Abstract

The invention relates to an on-line lamination device for a high-strength multilayer circuit board, which comprises a frame, a lamination assembly, a driver, a plurality of support columns, a plurality of rubber blocks and a plurality of elastic pieces, wherein the frame is provided with a plurality of support columns; the driver is arranged on the frame; the pressing assembly comprises a pressing plate and a base plate, a driver is in driving connection with the pressing plate, the base plate is arranged opposite to the pressing plate, the base plate is connected with the frame, the driver is used for driving the pressing plate to be close to or far away from the base plate, and the pressing plate is a first rubber plate; each support column is protruding to be set up in the base plate towards the one side of clamp plate, and each support column is the matrix arrangement, and flexible chamber has been seted up to the one end of each support column, and each rubber piece arch is provided with connecting portion, and each elastic component sets up in a flexible intracavity, and each connecting portion inserts and locates a flexible intracavity, and elastic component one end is connected with connecting portion, and the other end and the bottom in flexible chamber of elastic component are connected for each rubber piece forms independent subregion on the base plate, can adapt to the multilayer circuit board of different specifications and fix a position, thereby has improved compression fittings's suitability.

Description

Online compression fittings of high strength multilayer circuit board

Technical Field

The invention relates to the technical field of circuit board production, in particular to an online laminating device for a high-strength multilayer circuit board.

Background

The multilayer circuit board is a product of electronic technology which is developed to high speed, multifunction, large capacity and small volume. With the continuous development of electronic technology, especially the wide application of large-scale and ultra-large-scale integrated circuits, multilayer circuit boards are rapidly developed to high density, high precision and high layer number, and technologies such as micro lines, small aperture penetration, blind hole embedding, high plate thickness aperture ratio and the like are developed to meet the market demands.

In the production and processing process of the multilayer circuit board, a plurality of circuit boards and a plurality of insulating layers are required to be stacked and fixed on a pressing machine in a spacing mode, and then pressing operation is carried out to obtain the multilayer circuit board.

In order to ensure that the multilayer circuit board can be well pressed on the insulating layer, the stability between the circuit board and the insulating layer can be achieved by applying larger force, so that the pressing plate is easy to sideslip with the contact surface of the circuit board under larger pressure, the surface of the circuit board is easy to generate marks, the smoothness and the flatness of the surface of the multilayer circuit board are reduced, however, for the multilayer circuit board with higher precision requirements, the flatness of the multilayer circuit board in the subsequent copper plating process can be directly influenced by the marks on the surface, and the production required standard is not met.

Therefore, how to make the laminating device not only ensure the laminating quality of the multilayer circuit board, but also ensure the smoothness and flatness of the surface of the multilayer circuit board is a problem to be solved in the present technology.

Disclosure of Invention

Based on this, it is necessary to provide a die laser welding apparatus.

The technical scheme for solving the technical problems is as follows:

an on-line laminating device for a high-strength multilayer circuit board comprises a frame, a laminating assembly, a driver, a plurality of support columns, a plurality of rubber blocks and a plurality of elastic pieces;

the driver is arranged on the rack;

the pressing assembly comprises a pressing plate and a base plate, the driver is in driving connection with the pressing plate, the base plate is arranged opposite to the pressing plate, the base plate is connected with the frame, the driver is used for driving the pressing plate to be close to or far away from the base plate, and the pressing plate is a first rubber plate;

each supporting column bulge is arranged on one surface of the substrate, which faces the pressing plate, each supporting column is in matrix arrangement, a telescopic cavity is formed in one end of each supporting column, each rubber block bulge is provided with a connecting part, each elastic piece is arranged in one telescopic cavity, each connecting part is inserted into one telescopic cavity, one end of each elastic piece is connected with the connecting part, and the other end of each elastic piece is connected with the bottom of each telescopic cavity.

In one embodiment, the rubber blocks are spaced apart by 0.2cm to 0.8cm.

In one embodiment, the clamping assembly further comprises a plurality of clamping assemblies, wherein the clamping assemblies are made of rubber, each clamping assembly comprises a first clamping block, a second clamping block, a third clamping block and a fourth clamping block, the first clamping blocks, the second clamping blocks, the third clamping blocks and the fourth clamping blocks are respectively arranged on the outer sides of the rubber blocks, and the first clamping blocks, the second clamping blocks, the third clamping blocks and the fourth clamping blocks are used for fixing workpieces.

In one embodiment, the first clamping block and the second clamping block are respectively provided with a first arc-shaped portion and a second arc-shaped portion, and the first clamping block and the second clamping block are relatively parallel.

In one embodiment, the third clamping block and the fourth clamping block are respectively provided with a third arc-shaped portion and a fourth arc-shaped portion, and the third clamping block and the fourth clamping block are relatively parallel.

In one embodiment, the shape of each of the rubber blocks includes any one of square, rectangular and hemispherical.

In one embodiment, the device further comprises a guide assembly, the guide assembly comprises a first guide column and a second guide column, the first guide column and the second guide column are arranged on the frame at intervals, and the pressing plate is movably arranged on the first guide column and the second guide column.

In one embodiment, the device further comprises a connecting plate, the driver is in driving connection with the connecting plate, and the pressing plate is detachably connected with the connecting plate.

In one embodiment, the device further comprises a nut, the pressing plate is provided with a bolt, the connecting plate is provided with a through hole, and one end of the bolt penetrates through the through hole and is in threaded connection with the nut.

In one embodiment, the device further comprises a pressure sensor disposed on the substrate, the pressure sensor for detecting a pressure between the platen and the substrate.

Compared with the prior art, the invention has at least the following advantages:

1. the driver is connected with the clamp plate drive for the clamp plate can be with multilayer circuit board pressfitting on the base plate under the driver drive, in order to ensure the pressfitting quality of compression fittings to multilayer circuit board, need increase the pressfitting power of clamp plate to multilayer circuit board, because the clamp plate is first rubber slab, first rubber slab has good elasticity, wet skid resistance and wearability, make the clamp plate can take place deformation under the effect of great pressure, and be difficult to take place sideslip phenomenon production trace with multilayer circuit board, ensured the smooth roughness of multilayer circuit board surface, thereby satisfy the production demand of high accuracy multilayer circuit board.

2. Each support column is protruding to be set up in the base plate towards the one side of clamp plate, and each support column is the matrix arrangement at the base plate, make each support column can realize independent subregion on the base plate, flexible chamber has been seted up to each support column, so that the elastic component can be arranged in flexible intracavity, each rubber piece arch is provided with connecting portion, make connecting portion of each rubber piece can insert and establish in the flexible intracavity that corresponds, so that each elastic component can take place compression deformation under the pressfitting effect of clamp plate, when the multilayer circuit board is placed and is pressed on partial rubber piece through the manipulator, a plurality of rubber pieces that contact with the multilayer circuit board can take place to be sunken under the effect of pressure, and the height of the rubber piece that does not contact with the multilayer circuit board then can not change, thereby make a plurality of rubber pieces that take place to be sunken can form a holding tank with the rubber piece that does not take place sunken, make the multilayer circuit board can block in the holding tank well, the phenomenon that the multilayer circuit board has avoided the multilayer circuit board to appear shifting in the pressfitting process, the effect of sideslip has been ensured.

3. Each rubber block and the pressing plate are made of rubber, so that the multi-layer circuit board can be comprehensively protected by the rubber in the pressing process, scratches on the surface of the multi-layer circuit board are avoided, and the multi-layer circuit board can meet the production requirement of high precision.

4. Through being connected each rubber piece with each support column one-to-one to make each rubber piece be the matrix arrangement on the base plate, and form independent subregion on the base plate, can adapt to the multilayer circuit board of different specifications and fix a position, avoided among the traditional compression fittings to the phenomenon that the multilayer circuit board of multiple different specifications needs frequently to change different anchor clamps, thereby improved compression fittings's suitability.

Drawings

In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a high-strength multi-layer circuit board on-line laminating device according to an embodiment of the invention;

fig. 2 is a schematic structural diagram of an on-line lamination device for a high-strength multi-layer circuit board according to another embodiment of the present invention;

fig. 3 is a schematic diagram of a connection structure between a rubber block and a support column of an on-line laminating device for a high-strength multi-layer circuit board according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of connection between each rubber block, each support column and each clamping assembly of the on-line laminating device for the high-strength multi-layer circuit board in fig. 1 and a substrate according to an embodiment of the present invention;

fig. 5 is a schematic diagram of a connection structure of a rubber block, a support column and a clamping assembly of the high-strength multi-layer circuit board on-line lamination device according to an embodiment of the invention;

FIG. 6 is a schematic view of the partial structure of A in FIG. 1;

fig. 7 is a schematic view of the partial structure of B in fig. 4.

In the drawings, 10, a pressing device; 100. a frame; 110. a mounting part; 200. a pressing assembly; 210. a pressing plate; 211. a bolt; 220. a substrate; 300. a driver; 400. a support column; 410. a telescopic chamber; 420. an external thread; 500. a rubber block; 510. a connection part; 600. an elastic member; 700. a clamping assembly; 710. a first clamping block; 711. a first arc-shaped portion; 720. a second clamping block; 721. a second arc-shaped portion; 730. a third clamping block; 731. a third arc-shaped portion; 740. a fourth clamping block; 741. a fourth arc-shaped portion; 800. a guide assembly; 810. a first guide post; 820. a second guide post; 900. a connecting plate; 910. an anti-collision block; 911. a first impact block; 912. a second impact block; 920. a pressure sensor; 930. and (3) a nut.

Detailed Description

In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

In one embodiment, as shown in fig. 1 to 7, a high-strength multi-layered circuit board in-line bonding apparatus 10 includes a frame 100, a bonding assembly 200, a driver 300, a plurality of support columns 400, a plurality of rubber blocks 500, and a plurality of elastic members 600; the driver 300 is disposed on the frame 100; the pressing assembly 200 includes a pressing plate 210 and a substrate 220, the driver 300 is in driving connection with the pressing plate 210, the substrate 220 is disposed opposite to the pressing plate 210, the substrate 220 is connected with the frame 100, the driver 300 is used for driving the pressing plate 210 to approach or depart from the substrate 220, and the pressing plate 210 is a first rubber plate; each support column 400 is arranged on one surface of the substrate 220 facing the pressure plate 210 in a protruding manner, each support column 400 is arranged in a matrix manner, a telescopic cavity 410 is formed at one end of each support column 400, each rubber block 500 is provided with a connecting portion 510 in a protruding manner, each elastic member 600 is arranged in one telescopic cavity 410, each connecting portion 510 is inserted into one telescopic cavity 410, one end of each elastic member 600 is connected with the connecting portion 510, and the other end of each elastic member 600 is connected with the bottom of each telescopic cavity 410.

In this embodiment, the frame 100 not only can provide support for each part, but also the frame 100 is provided with a mounting groove, so that the pressing assembly 200, the plurality of support columns 400, the plurality of rubber blocks 500 and the plurality of elastic members 600 can be placed in the mounting groove, so that each part is not exposed out of the mounting groove, the uniformity of the peripheral edges of the pressing device 10 is ensured, and the phenomena of personnel scratching or falling caused by exposed parts are avoided.

In this embodiment, the driver 300 is in driving connection with the platen 210, specifically, the mounting portion 110 is provided on the protrusion of the frame 100, the movable cavity is provided on the mounting portion 110, the platen 210 is provided with a movable rod, the movable rod is disposed in the movable cavity in a penetrating manner, and the power output end of the driver 300 penetrates into the movable cavity, so that the driver 300 can be in driving connection with the movable rod, in this embodiment, the driver 300 includes a hydraulic cylinder, and by setting the driver 300 as the hydraulic cylinder, a power source can be provided, so that the driver 300 can drive the platen 210 to move, and further, the platen 210 is driven. In other embodiments, the driver 300 may also be a motor.

In the embodiment, the substrate 220 and the pressing plate 210 are disposed opposite to each other, so that a pressing structure can be formed between the substrate 220 and the pressing plate 210, and the pressing plate 210 can press the multi-layer circuit board on the substrate 220 under the driving of the driver 300, thereby realizing the pressing operation of the multi-layer circuit board.

It should be noted that, in order to ensure the lamination quality of the lamination device 10 on the multilayer circuit board, the lamination force of the pressing plate 210 on the multilayer circuit board needs to be increased, and since the pressing plate 210 is a first rubber plate, the first rubber plate has good elasticity, wet-slip resistance and wear resistance, so that the pressing plate 210 can deform under the action of a larger pressure, and is not easy to sideslip with the multilayer circuit board to generate marks, thereby ensuring the smooth flatness of the surface of the multilayer circuit board and meeting the production requirement of the high-precision multilayer circuit board.

It can be understood that each support column 400 is protruding to be set up in the base plate 220 towards the one side of clamp plate 210, and each support column 400 is the matrix arrangement at base plate 220, make each support column 400 can realize independent subregion on base plate 220, flexible chamber 410 has been seted up to the one end of each support column 400, so that elastic component 600 can be placed in flexible chamber 410, each rubber piece 500 arch is provided with connecting portion 510, make connecting portion 510 of each rubber piece 500 can insert and establish in corresponding flexible chamber 410, so that each elastic component 600 can take place compression deformation in flexible chamber 410 under the pressfitting effect of clamp plate 210, when the multilayer circuit board is placed and is pressed on partial rubber piece 500 through the manipulator, a plurality of rubber pieces 500 that contact with the multilayer circuit board can take place to be sunken under the effect of pressure, and the height of the rubber piece 500 that does not contact with the multilayer circuit board can not take place to change, thereby make a plurality of rubber pieces 500 that take place to sunken can form a accommodation groove with the rubber piece 500, make the multilayer circuit board can take place the block in accommodation groove well, the pressfitting effect of shifting in the multilayer circuit board has avoided the pressfitting effect to take place the multilayer circuit board to take place the displacement in the course.

It can be appreciated that the pressing plate 210 is a first rubber plate, so that each rubber block 500 and the pressing plate 210 are made of rubber, and the rubber can comprehensively protect the multilayer circuit board in the pressing process, so that scratches on the surface of the multilayer circuit board are avoided, and the multilayer circuit board can meet the production requirement of high precision.

It should be further noted that, as shown in fig. 1, fig. 4, fig. 6 and fig. 7, each rubber block 500 is connected with each support column 400 in a one-to-one correspondence manner, so that each rubber block 500 can be arranged in a matrix on the substrate 220, and independent partitions are formed on the substrate 220, so that the positioning of the multi-layer circuit boards with different specifications can be adapted, the phenomenon that the multi-layer circuit boards with different specifications in the conventional lamination device 10 need to frequently replace different clamps is avoided, and the applicability of the lamination device 10 is improved.

In this embodiment, the elastic member 600 is a spring. It can be understood that by arranging the elastic member 600 as a spring, the elastic member 600 has good elasticity and can be compressively deformed in the expansion cavity 410 under the pressing action, so that each rubber block 500 can be sunken, and when the pressing force applied to each rubber block 500 is eliminated, each elastic member 600 returns to the original height, so that each rubber block 500 returns to the pressing operation of the next round.

To ensure that the platen 210 is better able to press the multi-layered circuit board, in one embodiment, the first rubber sheet includes any one of an ethylene propylene diene monomer rubber sheet, a silicone rubber sheet, and a fluorine rubber sheet. It can be appreciated that by setting the first rubber plate as one of the epdm rubber plate, the silicone rubber plate or the fluororubber plate, the epdm rubber plate, the silicone rubber plate or the fluororubber plate not only has better hardness, elasticity, wet skid resistance and lower abrasion resistance, so that the friction force between the pressing plate 210 and the multilayer circuit board in the pressing process is very small, and the multilayer circuit board can be well protected.

To ensure that the platen 210 is better able to press the multi-layer circuit board without scratching the surface of the multi-layer circuit board. In one embodiment, the first rubber plate comprises the following components in parts by weight: 80-90 parts of ethylene propylene diene monomer rubber plate, 30-40 parts of carbon black, 40-50 parts of walnut shell abrasive, 4-5 parts of chromium powder, 4-5 parts of zinc oxide, 1-1.5 parts of stearic acid, 0.8-1.5 parts of anti-aging agent, 1.5-2 parts of vulcanizing agent, 1-1.2 parts of accelerator and 6-8 parts of silane coupling agent. It can be appreciated that the added epdm board has higher hardness and certain elasticity, the walnut shell abrasive is a roll finishing material, and the walnut shell abrasive is added into the epdm board, and the first rubber board made of other auxiliary materials has better hardness, elasticity, wet skid resistance and lower abrasion resistance, thereby ensuring that the pressing plate 210 can better press the multilayer circuit board and can not scratch the surface of the multilayer circuit board.

In order to enable each of the rubber blocks 500 to be well deformed, the material of the rubber block 500 includes any one of butadiene rubber and styrene butadiene rubber. It can be appreciated that since the butadiene rubber and the styrene-butadiene rubber have a certain hardness and have good elasticity, each rubber block 500 made of the butadiene rubber and the styrene-butadiene rubber can be well deformed under the action of external force when the pressing plate 210 presses the multi-layer circuit board, so that the multi-layer circuit board can be well protected.

To ensure that each rubber block 500 is well deformed and does not scratch the surface of the multi-layered circuit board. In one embodiment, the rubber block comprises the following components in parts by weight: 90-95 parts of styrene-butadiene rubber, 30-40 parts of carbon black, 20-25 parts of walnut abrasive, 3-5 parts of zinc oxide, 1.2-1.5 parts of stearic acid, 1-1.5 parts of anti-aging agent, 1.8-2.5 parts of vulcanizing agent, 1.5-1.8 parts of accelerator and 3-7 parts of silane coupling agent. It can be appreciated that the added styrene-butadiene rubber has higher elasticity, the walnut shell abrasive is a roll finishing material, the styrene-butadiene rubber is added with the walnut shell abrasive, and rubber blocks made of other auxiliary materials have higher elasticity, wet skid resistance and lower abrasion resistance, so that each rubber block 500 can be well deformed and the surfaces of the multilayer circuit boards can not be scratched.

Further, it should be noted that, the material of the pressing plate 210 adopts any one of the ethylene propylene diene monomer rubber plate, the silicone rubber plate and the fluororubber plate, and the material of the rubber block 500 adopts any one of the butadiene rubber and the styrene butadiene rubber, so that the hardness of the pressing plate 210 is higher than that of each rubber block 500, and the elasticity of each rubber block 500 is higher than that of the pressing plate 210, so that the pressing plate 210 can well press the multilayer circuit board, thereby ensuring the lamination effect of the multilayer circuit board.

In order to enable the rubber blocks 500 to be well fixed to the multilayer wiring board, in one embodiment, the rubber blocks 500 are spaced apart by 0.2cm to 0.8cm. It can be understood that by setting the pitch of each rubber block 500 to 0.2cm to 0.8cm, the gap between adjacent rubber blocks 500 is made smaller, so that the distance between the rubber block 500 where no dent occurs and the outside of the multilayer wiring board is made closer, so that the rubber block 500 where no dent occurs can better fix the peripheral edge of the multilayer wiring board.

In order to enable the plurality of rubber blocks 500 to form a matrix partition with small gaps and regular regularity on the substrate 220, in one embodiment, the shape of each of the rubber blocks 500 includes any one of square, rectangular and hemispherical. It can be understood that, by arranging the shape of each rubber block 500 with square, rectangle and hemisphere, the shape of each rubber block 500 is regular and tidy, and the rubber blocks 500 and countless regular rubber blocks 500 form a matrix partition with smaller gaps and regular and tidy, so that each rubber block 500 can be neatly arranged on the substrate 220 and form independent partitions, on one hand, the positioning device can adapt to positioning of multi-layer circuit boards with different specifications, and avoids the phenomenon that the multi-layer circuit boards with different specifications need to be frequently replaced in the traditional laminating device 10, thereby improving the applicability of the laminating device 10, and on the other hand, the rubber blocks 500 with concave shapes and the rubber blocks 500 without concave shapes also have regular and tidy containing grooves without edges and corners, so that not only can the multi-layer circuit boards be better positioned, but also the phenomenon of sideslip can be effectively avoided, and the surface of the multi-layer circuit board can be effectively protected.

In order to fix the outer sides of the multilayer circuit board well, in one embodiment, as shown in fig. 4 and 5, the multilayer circuit board further comprises a plurality of clamping assemblies 700, wherein the clamping assemblies 700 are made of rubber, the clamping assemblies 700 comprise a first clamping block 710, a second clamping block 720, a third clamping block 730 and a fourth clamping block 740, the first clamping block 710, the second clamping block 720, the third clamping block 730 and the fourth clamping block 740 are respectively arranged on the outer sides of the rubber blocks 500, and the first clamping block 710, the second clamping block 720, the third clamping block 730 and the fourth clamping block 740 are used for fixing workpieces.

It can be appreciated that, by arranging the first clamping block 710 on the first side wall, the second clamping block 720 on the second side wall, and the third clamping block 730 and the fourth clamping block 740 on the third side wall of each rubber block 500, when each rubber block 500 is recessed, the first clamping block 710, the second clamping block 720 and the fourth clamping block 740 can be driven to displace towards one end close to the support column 400, so that the first clamping block 710, the second clamping block 720 and the fourth clamping block 740 on the rubber block 500 which is not recessed can be arranged on the side wall of the accommodating groove in a protruding manner, and thus the first clamping block 710, the second clamping block 720 and the fourth clamping block 740 can form a limiting block in the accommodating groove, and the first clamping block 710, the second clamping block 720 and the fourth clamping block 740 can well fix the outer sides of the multilayer circuit board.

Further, in order to achieve better fixing of the multilayer circuit board, in one embodiment, as shown in fig. 5, the first clamping block 710 and the second clamping block 720 are respectively provided with a first arc-shaped portion 711 and a second arc-shaped portion 721, and the first clamping block 710 and the second clamping block 720 are relatively parallel to each other. It can be appreciated that, by providing the first arc portion 711 and the second arc portion 721 on the first clamping block 710 and the second clamping block 720 respectively, the first arc portion 711 and the second arc portion 721 are relatively parallel to each other, so that the first arc portion 711 and the second arc portion 721 can be uniformly distributed on two sides of the rubber block 500, so that the first arc portion 711 and the second arc portion 721 are in arc contact with the multilayer circuit board, friction force between the multilayer circuit board can be effectively reduced, and when the pressing plate 210 performs pressing operation on the multilayer circuit board, the first arc portion 711 and the second arc portion 721 on the rubber block 500 which do not generate the recess can form a containing groove with the rubber block 500 which generates the recess, and a plurality of first arc portions 711 and a plurality of second arc portions 721 are distributed on two sides of a groove wall of the containing groove, so that in the pressing operation, the plurality of first arc portions 711 and the plurality of second arc portions 721 can be quickly deformed under the extrusion of external force, and the multilayer circuit board can be well limited on the outer side of the multilayer circuit board, and the multilayer circuit board can be well protected.

Further, in one embodiment, as shown in fig. 5, the first arc 711 and the second arc 721 are concave. It is understood that by setting the first arc-shaped portion 711 and the second arc-shaped portion 721 to be concave, it is understood that the concave shape is a shape formed by recessing the center of the first clamping block 710 or the second clamping block 720 away from the surface of the rubber block 500 toward the end close to the rubber block 500, so that the concave first arc-shaped portion 711 and second arc-shaped portion 721 can be deformed more rapidly, thereby better protecting the outer surface of the multilayer circuit board from scratch, and satisfying the production requirements of the high-precision multilayer circuit board.

Further, in order to achieve better fixation of the multilayer circuit board, in one embodiment, the third clamping block 730 and the fourth clamping block 740 are respectively provided with a third arc-shaped portion 731 and a fourth arc-shaped portion 741, and the third clamping block 730 and the fourth clamping block 740 are relatively parallel to each other. It can be understood that, by providing the third arc portion 731 and the fourth arc portion 741 on the third clamping block 730 and the fourth clamping block 740 respectively, so that the first arc portion 711, the second arc portion 721, the third arc portion 731 and the fourth arc portion 741 are in arc contact with the multilayer circuit board, friction force between the multilayer circuit board can be effectively reduced, and when the pressing plate 210 performs pressing operation on the multilayer circuit board, the first arc portion 711, the second arc portion 721, the third arc portion 731 and the fourth arc portion 741 on the rubber block 500 which is not recessed can form a containing groove with the rubber block 500 which is recessed, and four sides of the groove wall of the containing groove can be distributed with the plurality of first arc portions 711, the plurality of second arc portions 721, the plurality of third arc portions 721 and the plurality of fourth arc portions 741, so that in the pressing operation, the plurality of first arc portions 711, the plurality of second arc portions 721, the plurality of third arc portions 731 and the plurality of fourth arc portions 741 can only press the multilayer circuit board to the multilayer circuit board, and the multilayer circuit board can not be well deformed, and the multilayer circuit board can not be well protected under the pressing operation.

In this embodiment, the widths of the first clamping block 710, the second clamping block 720, the third clamping block 730 and the fourth clamping block 740 are equal to 0.2cm to 0.8cm. It can be appreciated that, by setting the widths of the first clamping block 710, the second clamping block 720, the third clamping block 730 and the fourth clamping block 740 to be 0.2cm-0.8cm, the first clamping block 710, the second clamping block 720, the third clamping block 730 and the fourth clamping block 740 can just fill in each gap of each rubber block 500, the distance between each clamping assembly 700 and each rubber block 500 is reduced, and the two clamping assemblies can be more embedded and distributed on the substrate 220, so that when the pressing plate 210 performs pressing operation on the multilayer circuit board, since the first clamping block 710, the second clamping block 720, the third clamping block 730 and the fourth clamping block 740 are all made of rubber materials, the first clamping block 710, the second clamping block 720, the third clamping block 730 and the fourth clamping block 740 have certain softness and better elasticity, so that each rubber block 500 can not only be more smoothly compressed and deformed on each support column 400, but also the first clamping block 710, the second clamping block 720, the third clamping block 730 and the fourth clamping block 740 on the side wall of the accommodating groove can be better positioned on the outer side of the multilayer circuit board.

It should be noted that, the user may calculate the matrix distribution condition of each rubber block 500 and each clamping assembly 700 according to the area of the actually produced multilayer circuit board, in order to improve the accurate positioning of the multilayer circuit board, the size of each rubber block 500 and the size of each clamping assembly 700 may be set smaller, for example, the size of each rubber block 500 may be 1cm by 1cm, the size of the first clamping block 710 may be 0.2cm by 1cm, the size of the second clamping block 720 may be 0.2cm by 1cm, the size of the third clamping block 730 may be 0.2cm by 1cm, the size of the fourth clamping block 740 may be 0.2cm by 1cm, and each rubber block 500, each first clamping block 710, each second clamping block 720, each third clamping block 730 and each fourth clamping block 740 may be uniformly and densely arranged on the substrate 220 in matrix, so that each rubber block 710 and each clamping assembly 700 may be more accurately positioned on the multilayer circuit board 700, and thus the multilayer circuit board can be more accurately positioned.

In order to prevent the platen 210 from being offset during the movement, in one embodiment, the guide assembly 800 further includes a guide assembly 800, where the guide assembly 800 includes a first guide post 810 and a second guide post 820, the first guide post 810 and the second guide post 820 are disposed on the frame 100 at intervals, and the platen 210 is movably disposed on the first guide post 810 and the second guide post 820.

It can be appreciated that, by providing the first guide post 810 and the second guide post 820 on the frame 100, the mounting holes are correspondingly provided on the pressing plate 210, so that the first guide post 810 and the second guide post 820 can be respectively inserted into the mounting holes of the pressing plate 210, so that the pressing plate 210 can be movably provided on the first guide post 810 and the second guide post 820, and thus, the pressing plate 210 can reciprocate along the first guide post 810 and the second guide post 820 under the driving of the driver 300, so that the pressing plate 210 cannot deviate in the moving process, and the multilayer circuit board can be well pressed on each rubber plate.

To facilitate the user's installation and removal of the platen 210, in one embodiment, as shown in fig. 1 and 2, a connection plate 900 is further included, the driver 300 is drivingly connected to the connection plate 900, and the platen 210 is detachably connected to the connection plate 900. It will be appreciated that by providing the platen 210 and the connection plate 900 in a detachable connection, so that a user can install and detach the platen 210, not only can the damaged platen 210 be quickly replaced, but also maintenance time can be saved.

In this embodiment, the rack 100 is provided with a mounting portion 110 in a protruding manner, the mounting portion 110 is provided with a movable cavity, one end of the connecting plate 900 is provided with a connecting rod, the connecting rod is inserted into the movable cavity, and the power output end of the driver 300 penetrates into the movable cavity, so that the driver 300 can be in driving connection with the connecting rod, and when the driver 300 can drive the connecting plate 900 to move, the pressing plate 210 connected with the connecting plate 900 is driven to move together, and further, the driving of the pressing plate 210 is realized.

In order to detachably connect the pressing plate 210 with the connection plate 900, in one embodiment, as shown in fig. 1 and 2, a nut 930 is further included, the pressing plate 210 is provided with a bolt 211, the connection plate 900 is provided with a through hole, and one end of the bolt 211 passes through the through hole and is screwed with the nut 930. It will be appreciated that by providing the bolts 211 on the pressing plate 210, when the user needs to disassemble the pressing plate 210, the nuts 930 may be loosened, and then the pressing plate 210 may be removed from the connection plate 900 to complete the disassembly operation, and when the user needs to install the pressing plate 210, one end of the bolts 211 of the pressing plate 210 may be passed through the through holes, and then the nuts 930 may be tightened on the bolts 211 to complete the installation operation. By using such a connection manner, the operation is simple and convenient, so that the user can select the pressing plates 210 with different specifications according to actual production requirements, thereby improving the applicability of the pressing device 10.

In order to make the connection plate 900 more stable in connection with the pressing plate 210, in one embodiment, the number of the nuts 930 is plural, and the number of the bolts 211 is plural. It can be appreciated that by increasing the number of nuts 930 and bolts 211, the connection between the connection plate 900 and the platen 210 can be further improved to be more stable, thereby ensuring the stability of the platen 210 during the pressing process.

In order to better control the pressure on the multi-layer circuit board, in one embodiment, as shown in fig. 1, a pressure sensor 920 is further included, the pressure sensor 920 is disposed on the substrate 220, and the pressure sensor 920 is used to detect the pressure between the platen 210 and the substrate 220. Specifically, by providing the pressure sensor 920 on the substrate 220, the user can know the pressure applied by the pressing plate to the multilayer circuit board through the pressure sensor 920, so that the user can better control the pressing effect of the pressing plate 210 on the multilayer circuit board, and the pressing quality of the product is ensured.

To facilitate the replacement of the damaged rubber block 500 by the user, in one embodiment, as shown in fig. 3 and 5, the other end of each support column 400 is provided with an external thread 420, the base plate 220 is correspondingly provided with a threaded hole, the other end of each support column 400 is inserted into one threaded hole, and the external thread 420 of each support column 400 is in threaded connection with the side wall of one threaded hole. It will be appreciated that by providing the external screw thread 420 at the other end of each support column 400, and correspondingly providing the threaded hole on the base plate 220, the detachable connection between each support column 400 and the base plate 220 can be realized, and when the rubber block 500 is partially damaged, the user can manually unscrew the support column 400 corresponding to the damaged rubber block 500 due to the connection between each support column 400 and each rubber block 500, thereby taking out the damaged rubber block 500 from the base plate 220, then aligning the support column 400 on the good rubber block 500 with the threaded hole on the base plate 220, and manually screwing the support column 400 again, thereby realizing the replacement of the damaged rubber block 500.

In one embodiment, the anti-collision block 910 further includes an anti-collision block 910, as shown in fig. 2, where the anti-collision block 910 includes a first anti-collision block 911 and a second anti-collision block 912, the first anti-collision block 911 is disposed on an end of the first guide post 810 away from the substrate 220, the second anti-collision block 912 is disposed on an end of the second guide post 820 away from the substrate 220, and the first anti-collision block 911 and the second anti-collision block 912 are both connected with the frame 100. It can be appreciated that by adding the first anti-collision block 911 and the second anti-collision block 912, an anti-collision effect can be effectively achieved on the platen 210 and the driver 300, thereby ensuring the service lives of the platen 210 and the driver 300.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above embodiments represent only a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the invention. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.

Claims (8)

1. The high-strength multilayer circuit board on-line lamination device is characterized by comprising a frame, a lamination assembly, a driver, a plurality of support columns, a plurality of rubber blocks and a plurality of elastic pieces;

the driver is arranged on the rack;

the pressing assembly comprises a pressing plate and a base plate, the driver is in driving connection with the pressing plate, the base plate is arranged opposite to the pressing plate, the base plate is connected with the frame, the driver is used for driving the pressing plate to be close to or far away from the base plate, and the pressing plate is a first rubber plate;

the support columns are arranged on one surface of the substrate, which faces the pressing plate, in a protruding mode, the support columns are arranged in a matrix mode, a telescopic cavity is formed in one end of each support column, the rubber block is provided with a connecting portion in a protruding mode, each elastic piece is arranged in one telescopic cavity, each connecting portion is inserted into one telescopic cavity, one end of each elastic piece is connected with the connecting portion, and the other end of each elastic piece is connected with the bottom of each telescopic cavity;

still include a plurality of clamping components, clamping components's material is rubber, clamping components includes first grip block, second grip block, third grip block and fourth grip block, first grip block the second grip block the third grip block with the fourth grip block set up respectively in the outside of rubber block, first grip block the second grip block the third grip block with the fourth grip block is used for the fixed to the work piece, first grip block with the second grip block is provided with first arc portion and second arc portion respectively, first grip block with the relative parallel arrangement of second grip block.

2. The high-strength multi-layer circuit board on-line bonding apparatus according to claim 1, wherein the distance between the rubber blocks is 0.2cm to 0.8cm.

3. The on-line laminating device for high-strength multilayer circuit boards according to claim 1, wherein the third clamping block and the fourth clamping block are respectively provided with a third arc-shaped portion and a fourth arc-shaped portion, and the third clamping block and the fourth clamping block are relatively arranged in parallel.

4. The high-strength multi-layered circuit board in-line bonding apparatus according to claim 1, wherein the shape of each of the rubber blocks comprises any one of square, rectangular and hemispherical.

5. The high-strength multi-layer circuit board on-line laminating device according to claim 1, further comprising a guide assembly, wherein the guide assembly comprises a first guide post and a second guide post, the first guide post and the second guide post are arranged on the frame at intervals, and the pressing plate is movably arranged on the first guide post and the second guide post.

6. The high-strength multi-layer circuit board on-line laminating device according to claim 1, further comprising a connecting plate, wherein the driver is in driving connection with the connecting plate, and wherein the pressing plate is detachably connected with the connecting plate.

7. The high-strength multi-layer circuit board on-line pressing device according to claim 6, further comprising a nut, wherein the pressing plate is provided with a bolt, the connecting plate is provided with a through hole, and one end of the bolt passes through the through hole and is in threaded connection with the nut.

8. The high-strength multi-layer board on-line bonding apparatus according to any one of claims 1 to 7, further comprising a pressure sensor provided on the substrate for detecting a pressure between the platen and the substrate.